Turnover equipment and turnover method

Abstract

The invention relates to turnover equipment, which comprises a movable carrier plate frame, a turnover mechanism, a turnover mechanism, a turnover mechanism and a turnover mechanism, wherein the movable carrier plate frame is provided with carrier plates and is in a vertical state; the bracket is fixed on the horizontal plane and is rotatably connected with the movable carrier plate frame; one end of the driving assembly is connected to the movable plate carrying frame, the other end of the driving assembly is connected to the support, and the driving assembly drives the movable plate carrying frame to overturn around the support. In addition, the invention also relates to a method for overturning by using the overturning equipment. According to the invention, the support plate is directly overturned to the horizontal state and then the sheet is placed, the support plate is overturned to the vertical state after the sheet is placed, the sheet does not need to be overturned, the action time of placing the sheet into the support plate is short, and the sheet is placed in the horizontal state and does not move up and down in the sheet clamp, so that the production efficiency is improved. According to the invention, the sheets can be completely placed into the carrier plate more quickly and stably without generating fragments, so that the fragment rate of the sheets is greatly reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of vertical coating equipment, and more specifically, relates to a flipping device and a flipping method used when a thin sheet is loaded on a carrier in a vertical state for coating. Background Art

[0002] Vertical coating equipment is a device that loads thin sheets on a vertical carrier for coating. Usually, a robot and a thin sheet fixture are used to flip the thin sheet in a horizontal state 90° to a vertical state, and then load the thin sheet in the vertical state into the carrier in the vertical state. However, the process path of flipping the thin sheet from a horizontal state 90° to a vertical state is complex, the action time is long, and the rhythm is slow. In addition, during the flipping process, the thin sheet is easy to break away from the bottom of the thin sheet fixture and move up and down, thereby colliding in the fixture to produce cracks, and the yield rate drops sharply during the thin sheet loading and unloading process. In addition, when the thin sheet is placed in the vertical state and the carrier moves horizontally, the thin sheet cannot remain vertical in the fixture, and the thin sheet is not completely attached to the bottom of the fixture, which makes it difficult for the robot to put all the thin sheets into the carrier. The fragmentation rate is high and the yield rate is low during the thin sheet loading and unloading process.

[0003] Therefore, the prior art needs to be improved, and it is urgent to design a flipping device that flips the carrier instead of the sheet. Summary of the invention

[0004] In view of the deficiencies of the prior art, the purpose of the present invention is to load the thin slices into the vertical carrier faster and more stably. The present invention does not flip the thin slices but flips the carrier. During the thin slice loading process, the carrier is flipped 90° from the vertical state to the horizontal state. Thus, when the carrier is in the horizontal state, the path for the thin slices to be placed into the carrier only has two actions, namely, up and down and translation. The action time to complete the placement of the thin slices into the carrier is short. Moreover, the thin slices do not move up and down in the horizontal thin slice clamp, and the thin slices will not produce cracks due to up and down collisions. Moreover, in the present invention, all the thin slices are attached to the bottom of the fingers of the horizontal thin slice clamp and are in the same plane. The thin slices can be placed into the carrier faster and more stably without generating fragments, which greatly reduces the fragmentation rate of the thin slices, improves the yield rate and the economy of the vertical coating equipment. After the thin slices are stably and safely placed into the carrier, the carrier is flipped 90° from the horizontal state to the vertical state.

[0005] In order to solve the above technical problems or achieve the above objectives, the present invention adopts the following technical solutions:

[0006] According to one aspect of the present invention, there is provided a flipping device, comprising:

[0007] A movable plate carrier, in which a plate carrier is installed and is in a vertical state;

[0008] A bracket, which is fixed on a horizontal plane and rotatably connected to the movable plate carrier;

[0009] A driving assembly, one end of which is connected to the movable plate carrier and the other end of which is connected to the bracket, and the driving assembly drives the movable plate carrier to flip around the bracket.

[0010] In one embodiment of the present invention, the flipping device further comprises:

[0011] A first limiting component, which is arranged on the bracket and detects the position where the movable carrier rack is flipped to a horizontal state;

[0012] The second limiting assembly is arranged at the lower part of the movable plate carrier and detects the position where the movable plate carrier is flipped to a vertical state.

[0013] In one embodiment of the present invention, the movable plate carrier adopts a double movable plate carrier that is arranged in parallel and spaced apart.

[0014] In one embodiment of the present invention, the flipping device further comprises:

[0015] A protection component, which is arranged on the upper part of the movable plate carrier and detects the position between the two movable plate carriers when the movable plate carriers are in a vertical state;

[0016] A labor-saving component is connected between the movable plate carrier and the bracket.

[0017] In one embodiment of the present invention, each movable plate carrier in the double movable plate carrier is turned over individually; or the two movable plate carriers in the double movable plate carrier are turned over simultaneously.

[0018] In one embodiment of the present invention, a first adsorption mechanism is provided on the carrier, and a first electromagnet is provided in the movable carrier frame, and the first electromagnet absorbs the first adsorption mechanism to level the carrier; and a second adsorption mechanism is provided on the carrier, and a second electromagnet is provided in the bracket, and the second electromagnet absorbs the second adsorption mechanism to level the carrier when the movable carrier frame is flipped to a horizontal state.

[0019] In one embodiment of the present invention, the labor-saving component includes any one of a torsion spring, a nitrogen spring and a counterweight or a combination thereof; the driving component includes any one of a motor, a cylinder and an oil cylinder or a combination thereof.

[0020] In one embodiment of the present invention, the movable carrier frame is rotatably connected to the bracket at the bottom through a movable hinge arranged at the center; or the movable carrier frame is rotatably connected to the bracket at the bottom through movable hinges arranged at both sides.

[0021] According to another aspect of the present invention, a flipping method is provided, which is implemented using the flipping device as described above, and the flipping method comprises the following steps:

[0022] S1: Leveling the carrier in the movable carrier frame in a vertical state;

[0023] S2: driving the movable plate carrier through the driving assembly so that the movable plate carrier flips from a vertical state to a horizontal state;

[0024] S3: Leveling the carrier in the movable carrier rack in a horizontal state;

[0025] S4: Load the sheet stably and safely on the carrier;

[0026] S5: driving the movable plate carrier again through the driving assembly, so that the movable plate carrier is flipped from the horizontal state to the vertical state.

[0027] In one embodiment of the present invention, step S1 includes:

[0028] The carrier plate is leveled by sucking a first adsorption mechanism provided on the carrier plate by a first electromagnet provided in the movable carrier plate frame;

[0029] Step S2 includes:

[0030] The first limit component detects the position of the movable plate carrier being flipped to a horizontal state, and feeds back to the drive component, and the drive component controls the movement of the movable plate carrier to stop;

[0031] Step S3 includes:

[0032] The carrier plate is leveled by sucking a second adsorption mechanism provided on the carrier plate by a second electromagnet provided in the bracket;

[0033] Step S5 includes:

[0034] The second limit assembly detects the position of the movable plate carrier frame flipping to the vertical state and feeds back to the driving assembly, and the driving assembly controls the movement of the movable plate carrier frame to stop.

[0035] The technical solution provided by the present invention has the following advantages compared with the prior art:

[0036] The present invention directly flips the carrier plate to a horizontal state and then places the thin slice, and then flips the carrier plate to a vertical state after the thin slice is placed. The present invention does not need to flip the thin slice, and the action time to complete the thin slice into the carrier plate is short. Moreover, the thin slice is placed in a horizontal state, and the thin slice does not move up and down in the thin slice fixture, and the thin slice will not produce cracks due to up and down collisions. Therefore, the present invention allows the thin slice to be placed in the carrier plate faster and more stably without generating fragments, which greatly reduces the fragmentation rate of the thin slice, improves the yield rate and the economy of the vertical coating equipment. That is, the fragmentation rate of the thin slice in the process of loading and unloading the thin slice in the present invention is low, and the speed of loading and unloading the thin slice in the present invention is fast and the production capacity is high. In addition, the equipment of the present invention is simple to debug, and the cost of the whole equipment is low; the present invention can be used in coating equipment industries, such as the photovoltaic industry, the pan-semiconductor industry, and the new energy industry, etc., to load the thin slice into the carrier plate more conveniently. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings required for use in the description of the embodiments or the prior art are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0039] Figure 1 A schematic diagram showing the structure of a flipping device provided in an embodiment of the present invention when the carrier plate is in a vertical state;

[0040] Figure 2 A schematic diagram showing the structure of a flipping device provided in an embodiment of the present invention when the carrier plate is in a horizontal state;

[0041] Figure 3 A schematic diagram of the three-dimensional structure of a flip device provided by an embodiment of the present invention is shown;

[0042] Figure 4 A schematic diagram of the three-dimensional structure of a flip device provided by another embodiment of the present invention is shown;

[0043] Figure 5 A schematic diagram of the three-dimensional structure of a flip device provided by another embodiment of the present invention is shown;

[0044] Figure 6 A schematic diagram of the three-dimensional structure of a flip device provided by another embodiment of the present invention is shown;

[0045] Figure 7A schematic diagram of the three-dimensional structure of a flip device provided by another embodiment of the present invention is shown;

[0046] Figure 8 A schematic diagram of the three-dimensional structure of a flip device provided by another embodiment of the present invention is shown;

[0047] Fig. 9 A schematic flow chart of a flipping method provided in an embodiment of the present invention is shown.

[0048] Among them, 1. bracket; 2. movable carrier frame; 3. driving assembly; 4. first limit assembly; 5. second limit assembly; 6. protection assembly; 7. labor-saving assembly; 8. movable hinge; 9. carrier. DETAILED DESCRIPTION

[0049] In order to more clearly understand the above-mentioned purposes, features and advantages of the present disclosure, the embodiments of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0050] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0051] Figure 1 and 2 A brief structural schematic diagram of a flipping device when the carrier plate is in a vertical state and a brief structural schematic diagram of a flipping device when the carrier plate is in a horizontal state provided in an embodiment of the present invention are respectively shown.

[0052] like Figure 1 As shown, a flipping device includes: a bracket 1, a movable carrier frame 2, a driving assembly 3, a first limiting assembly 4, a second limiting assembly 5 and a protection assembly 6. The movable carrier frame 2 is provided with a carrier 9 and is in a vertical state, the bracket 1 is fixed on a horizontal plane and is rotatably connected to the movable carrier frame 2, the movable carrier frame 2 can rotate around the bracket 1, the driving assembly 3 is connected between the movable carrier frame 2 and the bracket 1 at the bottom, the driving assembly 3 drives the movable carrier frame 2 to rotate around the bracket 1, the first limiting assembly 4 and the second limiting assembly 5 detect the rotation position of the movable carrier frame 2, the first limiting assembly 4 is located on the horizontally arranged bracket 1, and detects the position of the movable carrier frame 2 rotating to the horizontal state, the second limiting assembly 5 is arranged at the lower part of the movable carrier frame 2, and detects the position of the movable carrier frame 2 rotating to the vertical state, and the protection assembly 6 is arranged at the upper part of the movable carrier frame 2 and detects the position between the two movable carrier frames 2 when the movable carrier frame 2 is in a vertical state.

[0053] In this embodiment, the movable plate carrier 2 is a double movable plate carrier arranged in parallel and spaced apart, and when the movable plate carrier 2 moves, the force of the bracket 1 is stabilized. Each movable plate carrier 2 in the double movable plate carrier can move independently, or both movable plate carriers 2 can move simultaneously.

[0054] In this embodiment, in order to ensure the stability of the movable carrier rack 2 during the flipping process, preferably, a first electromagnet is provided in the movable carrier rack 2, and a first adsorption mechanism is provided on the carrier plate 9. At this time, the first electromagnet can be used to absorb the first adsorption mechanism to level the carrier plate 9, thereby ensuring the stability of the movable carrier rack 2 during the flipping process.

[0055] In this embodiment, the first limiting assembly 4 and the second limiting assembly 5 detect the position of the movable plate carrier 2 around the bracket 1, and when reaching the detection position, the driving assembly 3 is notified, and the driving assembly 3 controls the movement of the movable plate carrier 2 around the bracket 1. In this embodiment, in order to further ensure positioning accuracy and safety, the position between the two movable plate carriers 2 can also be detected by the protection assembly 6.

[0056] In this embodiment, a second electromagnet is provided in the bracket 1, and a second adsorption mechanism is also provided on the carrier 9. When the movable carrier frame 2 is flipped to a horizontal state, the second electromagnet in the bracket 1 attracts the second adsorption mechanism on the carrier 9 to level the carrier 9. The second electromagnet attracts the second adsorption mechanism to level the carrier 9, thereby ensuring the flatness of the carrier 9 in a horizontal state and reducing the fragmentation rate of the sheet during loading and unloading.

[0057] like Figure 2 As shown, Figure 2 Shows Figure 1 The present invention is a structural diagram of a movable carrier frame 2 after being flipped 90° from a vertical state to a horizontal state. In this embodiment, the movable carrier frame 2 is rotatably connected to the bracket 1 at the bottom through movable hinges 8 arranged on both sides. At the same time, a labor-saving component 7 is arranged between the movable carrier frame 2 and the bracket 1. The labor-saving component 7 can save energy for the driving component 3 when the driving component 3 is driven, and reduce the load of the driving component 3.

[0058] In this embodiment, the labor-saving component 7 may include any one of a torsion spring, a nitrogen spring and a counterweight or a combination thereof. Preferably, the labor-saving component 7 is a torsion spring.

[0059] In this embodiment, the driving component 3 may include any one of a motor, a pneumatic cylinder and a hydraulic cylinder or a combination thereof. Preferably, the driving component 3 is a pneumatic cylinder.

[0060] When the structure shown in the above embodiment is used, when the movable carrier frame 2 is flipped (moving from the vertical state to the horizontal state), before the driving component 3 drives the movable carrier frame 2, the first electromagnet in the movable carrier frame 2 attracts the first adsorption mechanism on the carrier plate 9 to level the carrier plate 9, thereby ensuring the stability of the carrier plate 9 during the flipping process of the movable carrier frame 2, and then the driving component 3 is started. With the assistance of the labor-saving component 7, the driving component 3 drives the movable carrier frame 2 to flip to the horizontal state with a very small force. After the first limit component 4 detects that the movable carrier frame 2 is in place, it feeds back to the driving component 3, and the driving component 3 controls the movement of the movable carrier frame 2 to stop. At this time, the second electromagnet in the bracket 1 attracts the second adsorption mechanism on the carrier plate 9 to level the carrier plate 9, thereby ensuring the flatness of the carrier plate 9 in the horizontal state and ensuring the smooth loading and unloading of the thin sheets. Then, the thin sheet is placed stably and safely on the carrier 9, and the driving component 3 is enabled again to drive the movable carrier frame 2 to flip the carrier 9 from the horizontal state by 90° to the vertical state. After the second limiting component 5 detects that the movable carrier frame 2 is in place, it feeds back to the driving component 3, and the driving component 3 controls the movement of the movable carrier frame 2 to stop. When the movable carrier frame 2 is a double movable carrier frame, in order to further ensure the positioning accuracy and safety, the protection component 6 can be enabled to detect the position between the double movable carrier frames, thereby ensuring that the movable carrier frame is flipped back to the vertical position.

[0061] Figure 3 FIG. 2 shows a schematic diagram of a three-dimensional structure of a flip device provided by an embodiment of the present invention. Figure 3 As shown, the flipping device uses two sets of parallel and spaced movable carriers 2 and their corresponding related structures. Figure 3 As shown, the two sets of structures are arranged symmetrically on the left and right. The flip device is provided with a movable carrier frame 2 in a vertical state, and a carrier 9 is installed in the movable carrier frame 2. The bracket 1 is arranged horizontally. The bracket 1 and the movable carrier frame 2 are rotatably connected through movable hinges 8 on both sides. The movable carrier frame 2 rotates around the bracket 1 through the movable hinges 8. The driving component 3 (a cylinder in this embodiment) is arranged as a whole on the bracket 1. One end of the driving component 3 is fixedly connected to the bracket 1 and the other end is fixedly connected to the movable carrier frame 2. The driving component 3 can drive the movable carrier frame 2 to rotate around the bracket 1. A labor-saving component 7 (a torsion spring in this embodiment) connecting the bracket 1 and the movable carrier frame 2 is also arranged between the two movable hinges 8, and a first limiting component 4 is also arranged on both sides of the bracket 1. The first limiting component 4 detects the position of the movable carrier frame 2 on the horizontal plane when the movable carrier frame 2 is flipped to a horizontal state. A second limiting component 5 is arranged at the lower part of the movable carrier frame 2 and a protective component 6 is arranged at the upper part. The second limiting component 5 is used to detect the position of the movable carrier frame 2 in the vertical direction when the movable carrier frame 2 is flipped to a vertical state. The protective component 6 is used to position the movable carrier frame 2 in the vertical direction more accurately and safely.

[0062] exist Figure 3 When the three-dimensional structure shown is in use, the two sets of symmetrical devices are operated simultaneously, the first electromagnet in the movable carrier frame 2 attracts the first adsorption mechanism on the carrier plate 9 to level the carrier plate 9, and then the driving component 3 drives the movable carrier frame 2 to flip to a horizontal state with a very small force with the assistance of the labor-saving component 7, and after the first limit component 4 detects that the movable carrier frame 2 is in place, it feeds back to the driving component 3, and the driving component 3 controls the movement of the movable carrier frame 2 to stop. At this time, the second electromagnet in the bracket 1 attracts the second adsorption mechanism on the carrier plate 9 to level the carrier plate 9, ensuring the flatness of the carrier plate 9 in the horizontal state and ensuring the smooth loading and unloading of the thin sheets. Then, the thin sheet is stably and safely placed on the carrier 9, and the driving component 3 is activated again to drive the movable carrier frame 2 to flip the carrier 9 from the horizontal state by 90° to the vertical state. After the second limit component 5 detects that the movable carrier frame 2 is in place and the protection component 6 detects that the two movable carrier frames are in a suitable position, feedback is given to the driving component 3, and the driving component 3 controls the movement of the movable carrier frame 2 to stop, and the movable carrier frame 2 flips back to the vertical state, thereby placing the thin sheet after flipping the carrier 9 by 90° to the horizontal state, and after the thin sheet is placed, flipping the carrier 9 by 90° to the vertical state again, so that the thin sheet is stably and safely loaded on the carrier 9 in the vertical state. Of course, alternatively, Figure 3 Each of the two symmetrical structures shown can also be operated independently.

[0063] Figure 4 FIG. 2 shows a schematic diagram of a three-dimensional structure of a flip device provided by another embodiment of the present invention. Figure 4 As shown, the structure of this embodiment is Figure 3 The structure shown is similar, except that one first limiting assembly 4 can be provided and located in the middle of the front portion of the bracket 1 .

[0064] Figure 5 FIG. 2 shows a three-dimensional structural diagram of a flip device provided by another embodiment of the present invention. Figure 5 As shown, the structure of this embodiment is Figure 3 The structure shown is similar, except that at least three first limit assemblies 4 can be provided, for example, at least one is provided on the front of the bracket 1, and at least one is provided on each side of the bracket 1. Figure 5 As shown, three first position-limiting components 4 are arranged on the bracket 1, with one first position-limiting component 4 being arranged on each of the two sides and one first position-limiting component 4 being arranged in the middle of the front part.

[0065] Figure 6 FIG. 2 shows a three-dimensional structural diagram of a flip device provided by another embodiment of the present invention. Figure 6 As shown, the structure of this embodiment is Figure 3 The structure shown is similar, except that a movable hinge 8 can be provided and located in the middle of the bracket 1 and the movable carrier frame 2 so that the rotation of the movable carrier frame 2 is centered.

[0066] Figure 7 FIG. 2 shows a three-dimensional structural diagram of a flip device provided by another embodiment of the present invention. Figure 7 As shown, the structure of this embodiment is Figure 3 The structure shown is similar, except that the movable hinge 8 can also be arranged in a layout with one in the middle and multiple symmetrical hinges on both sides. For example, one is symmetrically arranged on each side, and a total of three movable hinges 8 are arranged.

[0067] Figure 8 FIG. 2 shows a three-dimensional structural diagram of a flip device provided by another embodiment of the present invention. Figure 8 As shown, the structure of this embodiment is Figure 3 The structures shown are similar, except that multiple second limit assemblies 5 can be designed, multiple protection assemblies 6 can be set, and the positions of the second limit assemblies 5 and the protection assemblies 6 can also be changed, etc.

[0068] also, Fig. 9 FIG. 2 shows a schematic flow chart of a flipping method provided in an embodiment of the present invention. Fig. 9 As shown, an embodiment of the present invention provides a method for flipping using the above flipping device, and the flipping method includes the following steps:

[0069] S1: Leveling the carrier plate 9 in the movable carrier plate rack 2 in a vertical state;

[0070] S2: driving the movable plate carrier 2 by the driving assembly 3 so that the movable plate carrier 2 is flipped from a vertical state to a horizontal state;

[0071] S3: Leveling the carrier plate 9 in the movable carrier plate rack 2 in a horizontal state;

[0072] S4: Load the sheet stably and safely on the carrier plate 9;

[0073] S5: The movable plate carrier 2 is driven again by the driving assembly 3 so that the movable plate carrier 2 is flipped from the horizontal state to the vertical state.

[0074] In the method of this embodiment, step S1 includes: sucking the first adsorption mechanism provided on the carrier 9 by the first electromagnet provided in the movable carrier frame 2 to level the carrier 9; step S2 includes: detecting the position of the movable carrier frame 2 flipping to a horizontal state by the first limiting component 4, and feeding back to the driving component 3, and controlling the movement of the movable carrier frame 2 to stop by the driving component 3; step S3 includes: sucking the second adsorption mechanism provided on the carrier 9 by the second electromagnet provided in the bracket 1 to level the carrier 9; step S5 includes: detecting the position of the movable carrier frame 2 flipping to a vertical state by the second limiting component 5, and feeding back to the driving component 3, and controlling the movement of the movable carrier frame 2 to stop by the driving component 3.

[0075] It can be seen that the present invention directly flips the carrier plate to a horizontal state and then places the thin film, and then flips the carrier plate to a vertical state after the thin film is placed. The present invention does not need to flip the thin film, and the time required to complete the action of placing the thin film into the carrier plate is short. Moreover, the thin film is placed in a horizontal state, and the thin film does not move up and down in the thin film clamp, and the thin film will not produce cracks due to up and down collisions. Therefore, the present invention allows the thin film to be placed in the carrier plate faster and more steadily without generating fragments, which greatly reduces the fragmentation rate of the thin film, improves the yield rate and the economy of the vertical coating equipment.

[0076] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusions, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to the process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including a..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0077] The above is only an embodiment of the present application, and the embodiment enables those skilled in the art to understand and implement the present application. Various modifications to the embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and features disclosed herein.

Claims

1. A turning device, characterized in that: include: A movable plate carrier, in which a plate carrier is installed and is in a vertical state; A bracket, the bracket is fixed on a horizontal plane and is rotatably connected to the movable plate carrier; A driving assembly, one end of which is connected to the movable plate carrier and the other end of which is connected to the bracket, and the driving assembly drives the movable plate carrier to flip around the bracket.

2. The flipping device according to claim 1, characterized in that: Also includes: a first limiting component, which is disposed on the bracket and detects the position where the movable plate carrier is flipped to a horizontal state; A second limiting assembly is provided at the lower part of the movable plate carrier and detects the position where the movable plate carrier is flipped to a vertical state.

3. The flipping device according to claim 1, characterized in that: The movable plate carriers are double movable plate carriers which are arranged in parallel and at intervals.

4. The turning device according to claim 3, characterized in that: Also includes: A protection component, which is disposed on the upper portion of the movable plate carrier and detects the position between the two movable plate carriers when the movable plate carrier is in a vertical state; A labor-saving component is connected between the movable carrier frame and the bracket.

5. The turning device according to claim 3, characterized in that: Each movable plate carrier in the double movable plate carrier is turned over separately; or the two movable plate carriers in the double movable plate carrier are turned over simultaneously.

6. The turning device according to claim 1, characterized in that: A first adsorption mechanism is arranged on the carrier, and a first electromagnet is arranged in the movable carrier frame, and the first electromagnet attracts the first adsorption mechanism to level the carrier; and a second adsorption mechanism is arranged on the carrier, and a second electromagnet is arranged in the bracket, and the second electromagnet attracts the second adsorption mechanism to level the carrier when the movable carrier frame is flipped to a horizontal state.

7. The turning device according to claim 4, characterized in that: The labor-saving component includes any one of a torsion spring, a nitrogen spring and a counterweight or a combination thereof; the driving component includes any one of a motor, a cylinder and an oil cylinder or a combination thereof.

8. The flipping device according to claim 1, characterized in that: The movable plate carrier is rotatably connected to the bracket at the bottom through a movable hinge arranged at the center; or the movable plate carrier is rotatably connected to the bracket at the bottom through movable hinges arranged at both sides.

9. A flipping method, characterized in that: The flipping method is implemented using the flipping device described in any one of claims 1 to 8, and comprises the following steps: S1: Leveling the carrier in the movable carrier frame in a vertical state; S2: driving the movable plate carrier through the driving assembly so that the movable plate carrier is flipped from a vertical state to a horizontal state; S3: Leveling the carrier in the movable carrier rack in a horizontal state; S4: Load the sheet stably and safely on the carrier; S5: driving the movable plate carrier again through the driving assembly, so that the movable plate carrier is flipped from the horizontal state to the vertical state.

10. The flipping method according to claim 9, characterized in that: Step S1 includes: The carrier plate is leveled by sucking a first adsorption mechanism provided on the carrier plate by a first electromagnet provided in the movable carrier plate frame; Step S2 includes: The first limit component detects the position of the movable plate carrier being flipped to a horizontal state, and feeds back to the drive component, and the drive component controls the movement of the movable plate carrier to stop; Step S3 includes: The carrier plate is leveled by sucking a second adsorption mechanism provided on the carrier plate by a second electromagnet provided in the bracket; Step S5 includes: The second limit assembly detects the position of the movable plate carrier frame flipping to the vertical state and feeds back to the driving assembly, and the driving assembly controls the movement of the movable plate carrier frame to stop.

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