Device for reducing fragment rate of manual wafer taking after wafer metallization

Abstract

The utility model relates to a device for reducing the fragment rate of a metalized wafer taken manually, and belongs to the technical field of integrated circuit or discrete device chip manufacturing. Comprising a base, and base grooves are symmetrically formed in the bottom of an inner cavity of the base; a buffer piece arranged in the width direction of the base is arranged at the bottom of an inner cavity of the base, the buffer piece is arranged between the two base grooves, and the buffer piece exceeds the bottom of the rack. And the buffer piece is a hollow hose. And the length of the buffer piece is matched with the width of the base. And the distance between the two base grooves is matched with the rack, so that the rack is arranged in the two base grooves. The structure is simple and ingenious, the bottom of the wafer makes contact with the hollow hose, and hard contact between the wafer and the wafer rack is solved; the wafer fragmentation rate is reduced, and the cost loss is reduced.

Description

Technical Field

[0001] The utility model relates to a device for reducing the fragmentation rate of manually taking wafers after wafer metallization, and belongs to the technical field of integrated circuit or discrete device chip manufacturing. Background Art

[0002] The metallization process is a key step in the manufacturing process of discrete devices, including front metallization and back metallization. Evaporation coating is one of the commonly used metallization methods. After the wafer evaporation coating operation is completed, the metallized wafer needs to be removed from the plating pot and placed in the wafer rack to flow to the next process. During the wafer removal operation, if the wafer is placed and collides with the wafer rack to produce hard contact, it will directly cause the wafer to break and cause the product to be scrapped. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a device for reducing the fragmentation rate of manual wafer removal after wafer metallization in accordance with the above-mentioned prior art. The device has a simple and ingenious structure and can effectively reduce the hard contact caused by the collision between the wafer and the wafer rack during the wafer placement process, thereby reducing the wafer fragmentation rate and reducing production costs.

[0004] The technical solution adopted by the utility model to solve the above-mentioned problem is: a device for reducing the fragmentation rate of manual wafer removal after wafer metallization, comprising a base, and base grooves are symmetrically arranged at the bottom of the base inner cavity; a buffer member arranged along the width direction of the base is provided at the bottom of the base inner cavity, and the buffer member is arranged between two base grooves, and the buffer member exceeds the bottom of the wafer rack.

[0005] The buffer is a hollow hose.

[0006] The length of the buffer element matches the width of the base.

[0007] The distance between the two base grooves matches the sheet frame, so that the sheet frame is arranged in the two base grooves.

[0008] Compared with the prior art, the utility model has the advantages of: a device for reducing the fragmentation rate of manual wafer removal after wafer metallization, with a simple and ingenious structure, the bottom of the wafer contacts the hollow hose, which solves the hard contact between the wafer and the wafer rack; reduces the wafer fragmentation rate and reduces cost losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a schematic diagram of a device for reducing the fragmentation rate of manually removing wafers after wafer metallization according to an embodiment of the utility model;

[0010] Figure 2 This is a schematic diagram of placing wafers in a device for reducing the fragmentation rate of manually taking out wafers after wafer metallization according to an embodiment of the utility model;

[0011] In the figure, 1 is a base, 2 is a base groove, 3 is a hollow hose, 4 is a wafer rack, and 5 is a wafer. DETAILED DESCRIPTION

[0012] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0013] like Figure 1 , 2 As shown, in this embodiment, a device for reducing the fragmentation rate of manually taking out wafers after metallization comprises a base 1, and base grooves 2 are symmetrically provided at the bottom of the inner cavity of the base 1, and the spacing between the two base grooves 2 corresponds to the size of the wafer rack, so that the wafer rack 4 is arranged in the two base grooves 2. A buffer arranged along the width direction of the base is provided at the bottom of the inner cavity of the base 1, and the buffer is provided between the two base grooves 2, and the buffer exceeds the bottom of the wafer rack 4. During the wafer taking operation, the wafer rack 4 is placed in the base groove 2, and the wafer 5 is placed in the wafer rack 4, and the bottom of the wafer 5 contacts the buffer, thereby avoiding hard contact between the wafer and the wafer rack and reducing the wafer fragmentation rate.

[0014] The buffer member is a hollow hose 3, which is made of PVC and is soft.

[0015] The length of the buffer member matches the width of the base.

[0016] The base of the present application has two base grooves matching the wafer rack, ensuring that the wafer rack can be placed in the base stably and without falling over. A hollow hose with a length consistent with the width of the base is fixed in the base. The taken-out wafer is placed in the wafer rack, and the bottom of the wafer contacts the hollow hose, which solves the problem of hard contact between the wafer and the wafer rack. The present application has a simple and ingenious structure, reduces the wafer fragmentation rate, and reduces cost losses.

[0017] In addition to the above embodiments, the present invention also includes other implementation modes. Any technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.

Claims

1. A device for reducing the fragmentation rate of manually removing wafers after wafer metallization, characterized in that: The invention comprises a base, wherein base grooves are symmetrically provided at the bottom of the inner cavity of the base; a buffer member arranged along the width direction of the base is provided at the bottom of the inner cavity of the base, wherein the buffer member is provided between two base grooves and exceeds the bottom of the sheet frame.

2. The device for reducing the chip fragmentation rate of wafers manually removed after metallization according to claim 1, characterized in that: The buffer is a hollow hose.

3. The device for reducing the wafer fragmentation rate when manually removing wafers after metallization according to claim 1, characterized in that: The length of the buffer element matches the width of the base.

4. The device for reducing the wafer fragmentation rate when manually removing wafers after metallization according to claim 1, characterized in that: The distance between the two base grooves matches the sheet frame, so that the sheet frame is arranged in the two base grooves.

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