Chip capacitor testing method
Through the design of the introduction plate and the guide box, combined with the electrical connection between the conductive plate and the elastic parts, the lossless testing and recycling of the chip capacitor is realized, solving the problem of difficulty in recycling after the chip capacitor test, saving resources and improving testing efficiency .
Patent Information
- Application Number
- CN202411372434.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-01-03
AI Technical Summary
The chip capacitor is difficult to recycle after testing, resulting in the problem of waste of resources.
Provide a test method, using the introduction plate and the guide box to introduce and export the patch capacitor through the introduction hole, combine the conductive plate and the elastic parts to achieve electrical connection, avoid the welding process, and realize the lossless testing and recycling of the patch capacitor.
This method simplifies the testing process of chip capacitors, saves manpower and material resources, realizes lossless recycling of chip capacitors, reduces resource waste, and improves testing efficiency.
Smart Images
Figure CN119247019A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of capacitor production and manufacturing, and in particular to a method for testing chip capacitors. Background Art
[0002] Multilayer ceramic capacitors (MLCC), also known as chip capacitors, are known as the "rice of the electronics industry" and are widely used in automotive electronics, electrical control, power grid frequency modulation, instrumentation, aerospace and other fields. MLCC has the advantages of high capacitance, small size, low cost, and high reliability. As the passive electronic component with the largest market share, it has become the focus of breakthroughs in key technologies required for technological innovation.
[0003] In order to ensure the reliability of the quality of multilayer ceramic capacitors and meet industry standards and specifications, it is often necessary to conduct reliability tests on multilayer ceramic capacitors. Reliability tests include HALT tests (Highly Accelerated Life Testing), high temperature tests, high humidity tests, high voltage tests, hot and cold shock tests, etc. In the above test items, the MLCC patches need to be soldered on the PCB board through a reflow oven. After the MLCC is tested, the MLCCs with poor performance can be screened out and the MLCCs with better performance can be retained. However, the MLCCs that meet the performance test requirements are difficult to remove due to the end welding, so they are difficult to recycle, which will cause a lot of waste. Summary of the invention
[0004] The present application provides a method for testing chip capacitors to solve the technical problem that chip capacitors are difficult to recycle after testing.
[0005] In the first aspect, the embodiment of the present application provides a test method for a chip capacitor, the test method comprising: providing an import plate, the import plate comprising a first surface and a second surface arranged opposite to each other, the import plate being provided with a first import hole penetrating the first surface and the second surface. Providing a PCB board, the PCB being arranged on the first surface, the PCB board comprising a third surface facing the import plate, the third surface being provided with a plurality of conductive circuits, and along the thickness direction of the import plate, the first import hole at least partially overlaps with the conductive circuit. Providing a guide box, the guide box being arranged on the second surface, the bottom plate of the guide box being provided with a first hole, the first hole being connected to the first import hole. Providing a chip capacitor, the chip capacitor being arranged in the guide box, shaking the guide box so that the chip capacitor falls from the first hole into the first import hole, removing the guide box, and exposing the second surface. A conductive plate is provided, which is arranged on the second surface and electrically connected to the plurality of conductive circuits. The conductive plate includes a main board, a conductive member and an elastic member. One end of the conductive member is elastically electrically connected to the main board through the elastic member, and the other end partially extends to the first introduction hole and abuts against the chip capacitor to test the chip capacitor.
[0006] In some embodiments, the testing method further includes: after the chip capacitor test is completed, removing the conductive plate, sucking out the chip capacitor that failed the test through a magnet, and pouring out the chip capacitor that passed the test by tipping over the introduction plate.
[0007] In some embodiments, removing the guide box includes: tilting the guide box, gathering the chip capacitors that have not fallen into the first introduction holes, and taking out the guide box.
[0008] In some embodiments, the PCB board further includes a first positioning column, which is disposed on the third surface and electrically connected to the conductive circuit. The lead-in plate further includes a first positioning hole that passes through the first surface and the second surface, and the bottom plate includes a second positioning hole. The step of arranging the guide box on the second surface includes: sequentially arranging the first positioning column and locking it in the first positioning hole and the second positioning hole, so that the guide box is fixed to the second surface.
[0009] In some embodiments, the test method further includes: providing a clamping portion, the clamping portion including a first clamping plate and a second clamping plate, the first clamping plate being disposed on a surface of the PCB board away from the lead-in plate, and the second clamping plate being disposed on a surface of the conductive plate away from the lead-in plate. Both ends of the first clamping plate include a first connecting member and a second connecting member, the first connecting member is hinged to a first end of the second clamping plate, and the second connecting member is detachably connected to the other end of the second clamping plate.
[0010] In some embodiments, the PCB board further includes a second positioning column, and the second positioning column is disposed on the third surface. The introduction plate further has a third positioning hole that passes through the first surface and the second surface, and the bottom plate has a fourth positioning hole. The step of arranging the guide box on the second surface includes: sequentially arranging the second positioning column through and locking it in the third positioning hole and the fourth positioning hole, so that the guide box is arranged on the second surface.
[0011] In some embodiments, the clamping portion further comprises a plurality of first insulating supports, which are arranged on the side of the second clamping plate facing the conductive plate. A first spacing space is arranged between two adjacent first insulating supports, and the conductive member is arranged in the first spacing space.
[0012] In some embodiments, the conductive plate further comprises a plurality of second insulating supports, which are disposed on the surface of the main board facing the introduction plate. A second spacing space is disposed between two adjacent second insulating supports, and the first introduction hole is disposed in the second spacing space.
[0013] In some embodiments, the elastic member includes a spring, and the spring is sleeved on the conductive member. The mainboard is provided with a second introduction hole, and the spring is partially arranged in the second introduction hole. The conductive member has a first end away from the mainboard, and the elastic member abuts between the first end and the mainboard, and the first end abuts against the chip capacitor.
[0014] In some embodiments, a first receiving groove is formed at the end of the second clamping plate, a first buckle is arranged in the first receiving groove, and along the direction from the conductive plate to the introduction plate, the first connecting member has a third end and a fourth end which are arranged opposite to each other, the fourth end is connected to the first clamping plate, a first clamping hole is formed at the third end, the third end portion is received in the first receiving groove, and the first buckle is clamped in the first clamping hole.
[0015] Different from the situation of the related art, the present application provides a test method for patch capacitors. The method includes providing an import plate, the import plate is provided with a first import hole, the bottom of the guide box is provided with a first hole, the first hole is communicated with the first import hole, the patch capacitor is arranged in the guide box, and the patch capacitor is made to fall into the first import hole from the first hole by shaking. The above operation process is simple and convenient, time-saving and labor-saving, and the patch capacitor can be imported into the first import hole in batches. Compared with the traditional method of soldering the patch capacitor on the PCB board, the PCB board can be reused, and the patch capacitor can be recycled, saving a lot of manpower, material resources and time. After removing the guide box, the conductive plate is arranged on the second surface of the import plate and electrically connected to the conductive circuit, one end of the conductive member is elastically electrically connected to the mainboard through the elastic member, and the other end part extends to the first import hole and abuts against the patch capacitor, and the patch capacitor is electrically connected to the conductive circuit again, so that the patch capacitor realizes current conduction between the mainboard and the PCB board to achieve the purpose of testing the patch capacitor. Through the above test method, the chip capacitor that meets the performance requirements can be directly taken out from the first introduction hole for recovery, thereby achieving the purpose of non-destructive testing. The elastic member can provide appropriate contact pressure between the conductive member and the chip capacitor, reducing the poor contact phenomenon caused by external forces such as vibration and movement. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.
[0017] Figure 1 It is a flowchart of some chip capacitor testing methods provided in the embodiments of the present application;
[0018] Figure 2 It is a schematic diagram of the structure of some introduction plates provided in the embodiments of the present application;
[0019] Figure 3 It is a schematic diagram of the structure of some test devices provided in the embodiments of the present application;
[0020] Figure 4 It is a schematic diagram of the structure of some PCB boards provided in the embodiments of the present application;
[0021] Figure 5 are exploded views of some test devices provided in embodiments of the present application;
[0022] Figure 6 It is a schematic diagram of the structure of some guide boxes provided in the embodiments of the present application;
[0023] Figure 7 It is a schematic diagram of the structure of some base plates provided in the embodiments of the present application;
[0024] Figure 8 It is a schematic diagram of the structure of some guide boxes for placing chip capacitors provided in the embodiments of the present application;
[0025] Fig. 9 It is a schematic diagram of the structure of some conductive plates provided in the embodiments of the present application;
[0026] Fig.10 is a schematic diagram of the cross-sectional structure of some test devices provided in the embodiments of the present application;
[0027] Fig.11 The embodiment of this application provides Fig.10 The enlarged schematic diagram of point A in the middle;
[0028] Fig.12 It is a schematic diagram of a structure in which some elastic members provided in an embodiment of the present application are sleeved on a conductive member;
[0029] Fig.13 It is a schematic diagram of the structure of some test devices provided in the embodiments of the present application;
[0030] Fig.14 It is a schematic diagram of the structure of some clamping parts provided in the embodiments of the present application;
[0031] Fig.15 is a schematic diagram of the structure of some second splints provided in the embodiments of the present application;
[0032] Fig.16 It is a schematic diagram of the structure of some first splints and first connecting members provided in the embodiments of the present application;
[0033] Fig.17 It is a schematic diagram of the structure of some second connecting members provided in the embodiments of the present application.
[0034] Description of reference numerals:
[0035] 100. Testing device;
[0036] 10. introduction plate; 11. first surface; 12. second surface; 13. first introduction hole; 14. first positioning hole; 15. third positioning hole;
[0037] 20. PCB board; 21. third surface; 211. conductive circuit; 22. first positioning column; 23. second positioning column;
[0038] 30. Conductive plate; 31. Main board; 311. Second introduction hole; 32. Conductive member; 321. First end; 322. Second end; 323. First abutting member; 324. Second abutting member; 33. Elastic member; 34. Fifth positioning hole; 35. Sixth positioning hole; 36. Second insulating support member; 37. Second spacing space;
[0039] 40. Clamping portion; 41. First clamping plate; 411. First fixing platform; 4111. First fixing hole; 412. Second fixing platform; 4121. Second fixing hole; 42. Second clamping plate; 421. First receiving groove; 422. First buckle; 423. First mounting hole; 43. First connecting member; 431. Third end; 4311. First clamping hole; 432. Fourth end; 44. Second connecting member; 441. Bolt; 442. Nut; 443. First fixing member; 444. Second fixing member; 45. First insulating support member; 46. First spacing space;
[0040] 50, guide box; 51, bottom plate; 511, first hole; 512, first part; 513, second part; 514, second positioning hole; 515, fourth positioning hole; 52, first plate; 53, second plate; 54, third plate; 55, fourth plate; 56, receiving space; 561, area with holes; 562, area without holes;
[0041] 200. Chip capacitors. DETAILED DESCRIPTION
[0042] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0043] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "several" and "multiple" is more than two, unless otherwise clearly and specifically defined.
[0044] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. In addition, the technical features involved in the different embodiments of the present application described below may be combined with each other as long as they do not conflict with each other.
[0045] In the first aspect, the present application embodiment provides a method for testing a patch capacitor, please refer to Figure 1 , Figure 1 : is a flow chart of some chip capacitor testing methods provided in the embodiments of the present application, and the testing method comprises the following steps:
[0046] Step S1: Provide an introduction plate 10, please refer to Figure 2 The introduction plate 10 includes a first surface 11 and a second surface 12 that are opposite to each other, and the introduction plate 10 is provided with a first introduction hole 13 that passes through the first surface 11 and the second surface 12 .
[0047] Please refer to Figure 3 The introduction board is a part of the testing device 100 . The testing method in the embodiment of the present application is implemented by the testing device 100 . The testing device 100 also includes a PCB board 20 and a conductive plate 30 .
[0048] The introduction plate can be made of insulating materials, such as acrylic, glass fiber, rubber, etc., so that the introduction plate 10 has good insulation performance. Along the thickness direction of the introduction plate 10, the introduction plate 10 has a first surface 11 and a second surface 12 that are relatively arranged. Among them, a plurality of first introduction holes 13 can be opened, and a plurality of first introduction holes 13 can be evenly arranged on the introduction plate 10. The first introduction hole 13 is used to accommodate the chip capacitor 200. The inner diameter of the first introduction hole 13 is greater than the length of the diagonal line at the top of the chip capacitor 200 or greater than the maximum width of the top of the chip capacitor 200. The chip capacitor 200 can easily enter the first introduction hole 13 and is convenient to be taken out for recycling.
[0049] Step S2: Provide a PCB board 20, please refer to Figure 3 and Figure 4 , the PCB is arranged on the first surface 11, the PCB board 20 includes a third surface 21 facing the introduction board 10, the third surface 21 is provided with a plurality of conductive circuits 211, and the plurality of first introduction holes 13 can also be arranged correspondingly according to the shape of the conductive circuits 211. Along the thickness direction of the introduction board 10, the first introduction holes 13 and the conductive circuits 211 at least partially overlap.
[0050] The printed circuit board (PCB) is a support for electronic components and a provider of electrical connections. A plurality of conductive lines 211 are provided on the PCB 20, and the conductive lines 211 can connect different electronic components so that current can flow in the circuit. The first lead-in hole 13 accommodates the chip capacitor 200, and the first lead-in hole 13 at least partially overlaps with the conductive line 211, so that the current in the conductive line 211 is introduced into the chip capacitor 200.
[0051] Step S3: Provide a guide box 50, please refer to Figure 5 and Figure 6 The guide box 50 is disposed on the second surface 12 . The bottom plate 51 of the guide box 50 is provided with a first hole 511 . The first hole 511 is communicated with the first introduction hole 13 .
[0052] Please refer to Figure 6The guide box 50 includes a first plate 52, a second plate 53, a third plate 54 and a fourth plate 55, which are connected end to end to form a receiving space 56. The first plate 52, the second plate 53, the third plate 54 and the fourth plate 55 are all connected to the bottom plate 51. Figure 7 The bottom plate 51 includes a first portion 512 and a second portion 513. The first portion 512 is disposed on the second surface 12 of the introduction plate 10 and is provided with a plurality of first holes 511. The first holes 511 are disposed corresponding to the first introduction holes 13. One first introduction hole 13 may correspond to one first hole 511. When the guide box 50 is mounted on the second surface 12, the first holes 511 may communicate with the first introduction holes 13. The second portion 513 is connected to the first portion 512 and exceeds the introduction plate 10 in the width or length direction of the introduction plate 10. The receiving space 56 may be divided into a porous area 561 and a non-porous area 562 by the first portion 512 and the second portion 513.
[0053] Step S4: Please refer to Figure 5 and Figure 8 , provide a chip capacitor 200, set the chip capacitor 200 in the guide box 50, shake the guide box 50 so that the chip capacitor 200 falls into the first introduction hole 13 from the first hole 511, remove the guide box 50, and expose the second surface 12.
[0054] Please refer to Figure 5 , Figure 6 and Figure 8 , the PCB board 20, the introduction plate 10 and the guide box 50 are fixedly arranged to ensure that there is no relative movement between the PCB board 20, the introduction plate 10 and the guide box 50. A large number of chip capacitors 200 can be placed in the non-porous area 562 of the guide box 50 first, and the guide box 50 or the whole can be shaken manually or electrically to move the chip capacitor 200 from the non-porous area 562 to the porous area 561. After the chip capacitor 200 moves to the porous area 561, it can fall from the first hole 511 into the first introduction hole 13, so that one end of the chip capacitor 200 can contact the conductive line 211. The above process is simple and convenient, saving time and effort, and the chip capacitors 200 can be introduced into the first introduction hole 13 in batches. Compared with the traditional method of soldering the chip capacitors 200 on the PCB board 20, a lot of manpower, material resources and time are saved. In addition, no chip mounter is required in the above process, and the PCB board 20 can be reused.
[0055] In one embodiment, removing the guide box 50 includes tilting the guide box 50 , gathering the chip capacitors 200 that have not fallen into the first introduction holes 13 , and then taking out the guide box 50 .
[0056] Specifically, after observing that each first introduction hole 13 contains a patch capacitor 200, or after a predetermined portion of the first introduction holes 13 contains a patch capacitor 200, the guide box 50 can be tilted so that the patch capacitor 200 that does not fall into the first introduction hole 13 slides from the hole area 561 to the non-hole area 562, and the patch capacitor 200 gathers in the non-hole area 562. After the guide box 50 is taken out, the gathered patch capacitors 200 can be collected. Among them, each first introduction hole 13 can only contain one patch capacitor 200, so as to avoid the situation where one first introduction hole 13 contains more than two patch capacitors.
[0057] Step S5: Please refer to Figures 9 to 11 , provide a conductive plate 30, set the conductive plate 30 on the second surface 12 and electrically connected to a plurality of conductive circuits 211, the conductive plate 30 includes a main board 31, a conductive member 32 and an elastic member 33, one end of the conductive member 32 is elastically electrically connected to the main board 31 through the elastic member 33, and the other end partially extends to the first introduction hole 13 and abuts against the chip capacitor 200, which can provide an elastic force toward the conductive circuit 211 to the chip capacitor 200, thereby electrically connecting the chip capacitor 200 to the above-mentioned conductive circuit 211, so as to realize testing of the chip capacitor 200.
[0058] After the chip capacitor 200 is introduced into the first introduction hole 13 and the conductive plate 30 is installed, the testing device 100 as a whole can be installed in a reliability testing device as a common circuit board for testing or screening.
[0059] Please refer to Figures 9 to 11 The main board 31 is the main body of the conductive plate 30, and is made of conductive metal materials, such as tin, aluminum, silver, copper and the like. The conductive member 32 can be extended into or out of the first introduction hole 13 according to the size of the patch capacitor 200. One end of the conductive member 32 is elastically electrically connected to the main board 31 through the elastic member 33, and the other end is partially extended in the first introduction hole 13 and abuts against the patch capacitor 200, so as to achieve line connectivity between the patch capacitor 200, the PCB board 20, and the conductive plate 30. For example, when the length of the patch capacitor 200 is greater than the thickness of the introduction board 10, after the patch capacitor 200 enters the first introduction hole 13, a small part of the patch capacitor 200 will be exposed from the first introduction hole 13, and the conductive member 32 can abut against the patch capacitor 200 outside the first introduction hole 13. When the length of the patch capacitor 200 is less than the thickness of the introduction board 10, the patch capacitor 200 is completely disposed in the first introduction hole 13, and the conductive member 32 partially extends in the first introduction hole 13 and abuts against the patch capacitor 200.
[0060] The elastic force of the elastic member 33 can be selected and adjusted according to the design requirements, so as to provide a suitable contact pressure between the conductive member 32 and the patch capacitor 200, which can ensure good electrical contact without damaging the patch capacitor 200 due to excessive voltage. The elastic force of the elastic member 33 can also keep the end of the conductive member 32 in contact with the patch capacitor 200, effectively reducing the phenomenon of poor contact caused by vibration, movement or other external factors. If there are manufacturing or installation errors in the conductive member 32 or the patch capacitor 200, the elastic deformation ability of the elastic member 33 can also compensate for these errors to a certain extent, so that the two always maintain good contact and ensure stable transmission of current.
[0061] In some embodiments, please refer to Fig. 9 , Fig.11 and Fig.12 , the elastic member 33 includes a spring, and the spring is sleeved on the conductive member 32. The main board 31 is provided with a second introduction hole 311, and the spring is partially arranged in the second introduction hole 311, or the spring abuts against the surface of the main board 31 facing the introduction plate 10, and the conductive member 32 and the spring can move up and down in the second introduction hole 311. The conductive member 32 has a first end 321 away from the main board 31, and the elastic member 33 abuts between the first end 321 and the main board 31, which can provide the conductive member 32 with an elastic force toward the introduction plate 10, so that the first end 321 can abut against the chip capacitor 200. Among them, along the thickness direction of the conductive plate 30, the projection of the second introduction hole 311 and the projection of the first introduction hole 13 are distributed on the conductive line 211, so as to realize the electrical connection between the main board 31, the conductive member 32, the chip capacitor 200 and the conductive line 211. The spring sleeve is arranged on the conductive member 32, and can provide appropriate contact pressure between the conductive member 32 and the chip capacitor 200, thereby ensuring good electrical contact and reducing the phenomenon of poor contact caused by external factors such as vibration and movement.
[0062] For further information, please refer to Fig.11 and Fig.12 The conductive member 32 further includes a first abutting member 323, which is disposed at the first end 321 and abuts against the chip capacitor 200. The conductive member 32 further includes a second end 322 disposed opposite to the first end 321 and a second abutting member 324, which is disposed at the second end 322 and abuts against the mainboard 31. The first abutting member 323 and the second abutting member 324 can ensure close contact between the conductive member 32 and the mainboard 31 and the chip capacitor 200, reduce poor contact caused by vibration, temperature change and other factors, and ensure stable transmission of current. By increasing the contact area and pressure, the electrical connectivity between the first abutting member 323 and the chip capacitor 200, and the electrical connectivity between the second abutting member 324 and the mainboard 31 is improved.
[0063] When the chip capacitor 200 is placed in the first introduction hole 13, one end of the chip capacitor 200 is electrically connected to the conductive circuit 211, and the other end is electrically connected to the conductive member 32. Since the conductive plate 30 is electrically connected to the conductive circuit 211 on the PCB board 20, and the conductive member 32 is elastically electrically connected to the mainboard 31, the chip capacitor 200 is electrically conductive in the test device 100. Compared with the traditional method of testing the chip capacitor 200, there is no need to solder the chip capacitor 200 on the PCB board 20 through a reflow oven, that is, the chip capacitor 200 will not be damaged, and the purpose of non-destructive testing is achieved. After the test, for the chip capacitor 200 that meets the performance requirements, the chip capacitor 200 can be directly taken out from the first introduction hole 13 and recycled.
[0064] The embodiment of the present application provides a method for testing a chip capacitor. The method includes providing an introduction plate 10, the introduction plate 10 is provided with a first introduction hole 13, the bottom of the guide box 50 is provided with a first hole 511, the first hole 511 is connected to the first introduction hole 13, and the chip capacitor 200 is arranged in the guide box 50, and the chip capacitor 200 falls from the first hole 511 into the first introduction hole 13 by shaking. The above operation process is simple and convenient, saving time and labor, and the chip capacitor 200 can be introduced into the first introduction hole 13 in batches. Compared with the traditional method of soldering the chip capacitor 200 on the PCB board 20, the PCB board 20 can be reused, and the chip capacitor 200 can be recycled, saving a lot of manpower, material resources and time. After removing the guide box 50, the conductive plate 30 is set on the second surface 12 of the introduction plate 10 and electrically connected to the conductive circuit 211. One end of the conductive member 32 is elastically electrically connected to the main board 31 through the elastic member 33, and the other end is partially extended to the first introduction hole 13 to abut against the patch capacitor 200. The patch capacitor 200 is electrically connected to the conductive circuit 211, so that the patch capacitor 200 can achieve current conduction between the main board 31 and the PCB board 20 to achieve the purpose of testing the patch capacitor 200. Through the above-mentioned test method, the patch capacitor 200 that meets the performance requirements can be directly taken out and recycled from the first introduction hole 13 to achieve the purpose of non-destructive testing. The elastic member 33 can provide a suitable contact pressure between the conductive member 32 and the patch capacitor 200, reducing the poor contact phenomenon caused by external forces such as vibration and movement.
[0065] In some embodiments, the testing method further includes: after the chip capacitor 200 is tested, removing the conductive plate 30, sucking out the chip capacitor 200 that failed the test by a magnet, and pouring out the chip capacitor 200 that passed the test by pouring out the introduction board 10.
[0066] When performing reliability testing on chip capacitors 200, the equipment commonly used is high temperature, high pressure or high humidity equipment. If the temperature, humidity or voltage is adjusted to a certain level, the chip capacitors 200 with poor performance can be screened out, and the chip capacitors 200 with better performance can be retained. In the traditional testing method, the chip capacitors 200 need to be soldered on the PCB board 20. The chip capacitors 200 with better performance cannot be removed because the ends are soldered on the PCB board 20, so the chip capacitors 200 with qualified performance cannot be recycled, and the PCB board 20 cannot be used again, which will cause serious waste.
[0067] For some test items with large inspection volume and little damage to the chip capacitor 200, the performance of the chip capacitor 200 after the test still meets the requirements. Unqualified chip capacitors 200 are screened out by magnets, and qualified chip capacitors 200 are poured out and collected. These qualified chip capacitors 200 can be reused after recycling, reducing the waste of chip capacitors 200.
[0068] In some embodiments, please refer to Figure 4 The PCB board 20 further includes a first positioning column 22, which is disposed on the third surface 21 and electrically connected to the conductive circuit 211. The first positioning column 22 is a conductive metal, such as copper, iron, aluminum, etc. Figure 2 and Figure 6 The lead-in plate 10 is also provided with a first positioning hole 14 that passes through the first surface 11 and the second surface 12, and the bottom plate 51 is provided with a second positioning hole 514. The guide box 50 is arranged on the second surface 12, including the first positioning column 22 being sequentially passed through and locked in the first positioning hole 14 and the second positioning hole 514, so that the guide box 50 is fixed to the second surface 12. The first positioning column 22, the first positioning hole 14 and the second positioning hole 514 cooperate with each other, and the PCB board 20, the lead-in plate 10 and the guide box 50 can be accurately positioned, so that each component can be quickly and accurately installed in the correct position, reducing the situation of installation misalignment or offset.
[0069] For further information, please refer to Figure 4 The PCB board 20 further includes a second positioning column 23, and the second positioning column 23 is disposed on the third surface 21. Figure 2 and Figure 6, the introduction plate 10 is also provided with a third positioning hole 15 penetrating the first surface 11 and the second surface 12, and the bottom plate 51 is provided with a fourth positioning hole 515. The guide box 50 is arranged on the second surface 12, including: the second positioning column 23 is sequentially arranged and locked in the third positioning hole 15 and the fourth positioning hole 515, so that the guide box 50 is arranged on the second surface 12. The second positioning column 23 can further play a precise positioning role in the assembly process of the PCB board 20, the introduction plate 10 and the guide box 50. And the guide box 50, the introduction plate 10 and the PCB board 20 are locked by the first positioning column 22 and the second positioning column 23, so that the relative movement between the guide box 50, the introduction plate 10 and the PCB board 20 is reduced, making the whole more stable. Wherein, a plurality of second positioning columns 23 can be provided, and the second positioning columns 23 can be distributed around the PCB board 20 to reduce interference with the conductive circuit 211. Wherein, the number of the fourth positioning holes 515 can be set according to the number of the second positioning columns 23.
[0070] In some embodiments, the testing method further includes providing a clamping portion 40, see Fig.13 and Fig.14 The clamping part 40 includes a first clamping plate 41 and a second clamping plate 42. The first clamping plate 41 is arranged on the surface of the PCB board 20 away from the introduction plate 10, and the second clamping plate 42 is arranged on the surface of the conductive plate 30 away from the introduction plate 10. The two ends of the first clamping plate 41 include a first connecting member 43 and a second connecting member 44. The first connecting member 43 is hinged to the first end of the second clamping plate 42, and the second connecting member 44 is detachably connected to the other end of the second clamping plate 42. During the test, the clamping part 40 can maintain the precise positional relationship between the PCB board 20 and the conductive plate 30, and the relative movement and misalignment between the PCB board 20 and the conductive plate 30 are reduced through the fixing effect of the first clamping plate 41 and the second clamping plate 42.
[0071] The first connecting member 43 is hinged to one end of the second clamping plate 42, so that the clamping portion 40 is convenient to open and close during installation. Fig.15 and Fig.16 A first receiving groove 421 is formed at the end of the second clamping plate 42, and a first buckle 422 is arranged in the first receiving groove 421. Along the direction from the conductive plate 30 to the introduction plate 10, the first connecting member 43 has a third end 431 and a fourth end 432 which are arranged opposite to each other. The fourth end 432 is connected to the first clamping plate 41, and a first clamping hole 4311 is formed at the third end 431. The third end 431 is partially received in the first receiving groove 421, and the first buckle 422 is clamped in the first clamping hole 4311.
[0072] When the PCB board 20 and the conductive plate 30 need to be replaced or repaired, or the chip capacitor 200 needs to be placed in the first lead-in hole 13, the second connector 44 is detachably connected to the other end of the second clamping plate 42, which facilitates the removal of the clamping part 40, thereby improving the efficiency of the test device 100 during the test and saving time. Fig.16 and Fig.17 The second connecting member 44 includes a bolt 441 and a nut 442. The bolt 441 is connected to the surface of the first clamping plate 41 facing the second clamping plate 42. Specifically, the bolt 441 is connected to one end of the first clamping plate 41 and has a first fixing member 443 and a second fixing member 444. The first clamping plate 41 is installed with a first fixing platform 411 and a second fixing platform 412. Along the width direction of the first clamping plate 41, the first fixing platform 411 is provided with a first fixing hole 4111, and the second fixing platform 412 is provided with a second fixing hole 4121. The first fixing member 443 can be inserted into the first fixing hole 4111 to connect with the first fixing platform 411, and the second fixing member 444 can be inserted into the second fixing hole 4121 to connect with the second fixing platform 412. Combined with Fig.15 The second clamping plate 42 is provided with a first mounting hole 423, and a bolt 441 is passed through the first mounting hole 423 and is threadedly connected with a nut 442, so that the bolt 441 is firmly connected to the first clamping plate 41, and the installation and disassembly between the first clamping plate 41 and the bolt 441 are convenient. The nut 442 can be a hexagonal nut, a square nut, a round nut, a wing nut, etc.
[0073] For further information, please refer to Fig.13 and Fig.14 The clamping portion 40 also includes a plurality of first insulating support members 45, which may be made of non-conductive rubber material. The plurality of first insulating support members 45 are fitted on the side of the second clamping plate 42 facing the conductive plate 30. The plurality of first insulating support members 45 can separate the conductive plate 30 from the second clamping plate 42, thereby reducing the risk of short circuit that may be caused by direct contact between the second clamping plate 42 and the conductive plate 30. A first spacing space 46 is provided between two adjacent first insulating support members 45, and the conductive member 32 is provided in the first spacing space 46. The provision of the first spacing space 46 can reduce the squeezing of the conductive member 32 by the second clamping plate 42, so that the conductive member 32 can move up and down flexibly in the first spacing space 46. The chip capacitor 200 may generate heat when being tested, and the first spacing space 46 allows air to flow around the conductive member 32, taking away some of the heat and maintaining the normal progress of the test process.
[0074] In some embodiments, please refer to Figure 3 , Figure 4 and Fig. 9The conductive plate 30 is also provided with a fifth positioning hole 34. When the conductive plate 30 is installed, the first positioning column 22 can be sequentially passed through the first positioning hole 14 and the fifth positioning hole 34 to be electrically connected to the main board 31. The first positioning column 22 is electrically connected to the conductive line 211 and then to the main board 31, so that the transmission of current and signal can be realized, and the overall conductive performance of the test device 100 is improved.
[0075] For further information, please refer to Figure 3 , Figure 4 and Fig. 9 , the conductive plate 30 is provided with a sixth positioning hole 35, along the direction from the conductive plate 30 to the lead-in plate 10, the projection of the third positioning hole 15 coincides with the projection of the sixth positioning hole 35, the second positioning column 23 is sequentially penetrated through the third positioning hole 15 and the sixth positioning hole 35, and the second positioning column 23 extends out of the sixth positioning hole 35. The second positioning column 23 can further play a precise positioning role in the assembly process of the PCB board 20, the lead-in plate 10 and the conductive plate 30. Among them, a plurality of sixth positioning holes 35 can be set according to the second positioning column 23.
[0076] In some embodiments, please refer to Fig. 9 and Fig.10 The conductive plate 30 further includes a plurality of second insulating supports 36, which are disposed on the surface of the main board 31 facing the introduction plate 10. The second insulating supports 36 may be made of rubber. The second insulating supports 36 have a certain elasticity to resist external pressure and stress, reduce deformation of the main board 31 and the introduction plate 10, and the second insulating supports 36 may provide a certain rigid support to maintain the shape and position of the main board 31. A second spacing space 37 is disposed between two adjacent second insulating supports 36, and the first introduction hole 13 is disposed in the second spacing space 37. The second spacing space 37 provides space for the conductive member 32 to move up and down, and the second spacing space 37 may promote air flow between the main board 31 and the introduction plate 10, which is helpful for heat dissipation.
[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Under the concept of the present application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes in different aspects of the present application as described above, which are not provided in detail for the sake of simplicity. Although the present application has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A method for testing chip capacitors, characterized in that: include: Providing an introduction plate, the introduction plate comprising a first surface and a second surface arranged opposite to each other, the introduction plate being provided with a first introduction hole penetrating through the first surface and the second surface; Providing a PCB board, and setting the PCB board on the first surface, the PCB board includes a third surface facing the introduction board, the third surface is provided with a plurality of conductive circuits, and along the thickness direction of the introduction board, the first introduction hole and the conductive circuit at least partially overlap; Providing a guide box, and placing the guide box on the second surface, wherein a first hole is formed on a bottom plate of the guide box, and the first hole is communicated with the first introduction hole; Providing a chip capacitor, placing the chip capacitor in the guide box, shaking the guide box so that the chip capacitor falls from the first hole into the first introduction hole, and removing the guide box to expose the second surface; A conductive plate is provided, which is arranged on the second surface and electrically connected to the plurality of conductive circuits. The conductive plate includes a main board, a conductive member and an elastic member. One end of the conductive member is elastically electrically connected to the main board through the elastic member, and the other end partially extends to the first introduction hole and abuts against the chip capacitor to test the chip capacitor.
2. The testing method according to claim 1, characterized in that: The test method also includes: After the chip capacitor test is completed, the conductive plate is removed, the chip capacitor that fails the test is sucked out by a magnet, and the chip capacitor that passes the test is poured out by tipping the introduction plate.
3. The testing method according to claim 1, characterized in that: The removing the guide box includes: tilting the guide box, gathering the chip capacitors that have not fallen into the first introduction holes, and taking out the guide box.
4. The testing method according to claim 1, characterized in that: The PCB board further includes a first positioning column, which is disposed on the third surface and electrically connected to the conductive circuit; The introduction plate is further provided with a first positioning hole penetrating through the first surface and the second surface, and the bottom plate is provided with a second positioning hole; The step of arranging the guide box on the second surface includes: sequentially passing the first positioning column through and locking the first positioning hole and the second positioning hole, so that the guide box is fixed on the second surface.
5. The testing method according to claim 1, characterized in that: The testing method further includes: providing a clamping portion, the clamping portion including a first clamping plate and a second clamping plate, the first clamping plate being arranged on a surface of the PCB board away from the introduction plate, and the second clamping plate being arranged on a surface of the conductive plate away from the introduction plate; The two ends of the first clamping plate include a first connecting member and a second connecting member, the first connecting member is hinged to the first end of the second clamping plate, and the second connecting member is detachably connected to the other end of the second clamping plate.
6. The testing method according to claim 4, characterized in that: The PCB board further includes a second positioning column, and the second positioning column is arranged on the third surface; The introduction plate is further provided with a third positioning hole penetrating through the first surface and the second surface, and the bottom plate is provided with a fourth positioning hole; The step of arranging the guide box on the second surface includes: sequentially passing the second positioning column through and locking it in the third positioning hole and the fourth positioning hole, so that the guide box is arranged on the second surface.
7. The testing method according to claim 5, characterized in that: The clamping portion further comprises a plurality of first insulating support members, and the plurality of first insulating support members are arranged on a side of the second clamping plate facing the conductive plate; A first spacing space is arranged between two adjacent first insulating support members, and the conductive member is arranged in the first spacing space.
8. The testing method according to claim 1, characterized in that: The conductive plate further comprises a plurality of second insulating support members, and the plurality of second insulating support members are arranged on a surface of the main board facing the introduction board; A second spacing space is arranged between two adjacent second insulating support members, and the first introduction hole is arranged in the second spacing space.
9. The testing method according to claim 1, characterized in that: The elastic member comprises a spring, and the spring is sleeved on the conductive member; The mainboard is provided with a second introduction hole, the spring portion is arranged in the second introduction hole, the conductive member has a first end away from the mainboard, the elastic member abuts between the first end and the mainboard, and the first end abuts against the chip capacitor.
10. The testing method according to claim 5, characterized in that: A first receiving groove is formed at the end of the second clamping plate, and a first buckle is arranged in the first receiving groove. Along the direction from the conductive plate to the introduction plate, the first connecting member has a third end and a fourth end that are relatively arranged, and the fourth end is connected to the first clamping plate. A first clamping hole is formed at the third end, and the third end portion is partially received in the first receiving groove, and the first buckle is clamped in the first clamping hole.