Optical signal switching assembly with loss type waveguide and optical signal switching system

Abstract

The invention relates to the technical field of communication, and discloses an optical signal switching assembly with a loss-type waveguide, a connecting core, a connecting structure, a switching structure, an optical signal switching system and electronic equipment. The optical signal switching assembly comprises a connecting core, an adapter, a first conductive layer and a second conductive layer. Wherein the connecting core is made of a plastic material, and the plastic base material of the adapter is doped with a conductive filler and / or a magnetic filler. The adapter is provided with a slot, the connecting core is inserted into the slot, the first conductive layer is located between the connecting core and the adapter and arranged around the connecting core in a surrounding mode, and the second conductive layer is arranged around the adapter in a surrounding mode. The waveguide structure in the optical signal switching assembly can change the transmission path of the electromagnetic wave, so that the transmission path of the electromagnetic wave falls into the area where the adapter is located as much as possible, and the loss of the adapter to the electromagnetic wave is improved. Therefore, the loss of electromagnetic waves can be improved, and the shielding effect is improved.

Description

Technical Field

[0001] The present application relates to the field of communications, and in particular to an optical signal switching component with a lossy waveguide, a connecting core, a connecting structure, a switching structure, an optical signal switching system and an electronic device. Background Art

[0002] With the advent of the big data era, optical signal switching systems have been widely used as an important means of big data transmission. Among them, the optical signal switching system realizes signal transmission between two optical fibers through optical signal switching components. In addition, the electronic products in the optical signal switching system will generate electromagnetic noise (EMN). Electromagnetic noise refers to the random changes in electrical signals caused by thermal vibration of circuit components or other factors. It is an electromagnetic wave that can interfere with or interrupt the normal operation of electronic equipment. Electromagnetic noise will interfere with other electronic products around it. In order to ensure the performance of each electronic product in the electronic system, electronic products need to pass electromagnetic compatibility (EMC) certification and other related tests before they can be put on the market. Electromagnetic compatibility refers to the ability of electronic equipment to be non-interfering and compatible with each other under different working conditions.

[0003] With the development of communication technology, the working speed of chips in electronic products has been increasing, which has expanded the electromagnetic radiation test frequency band of electronic product EMC certification from 30MHz to 1GHz to 30MHz to 6GHz. Among them, the US FCC standard (federal communications commission) requires the electromagnetic radiation test frequency band of electronic product certification to be expanded to 30MHz to 40GHz. The electromagnetic waves generated by the electromagnetic radiation source in electronic products propagate through space and leak directly from the optical signal switching components, causing the products to fail to meet the market access certification requirements. Summary of the invention

[0004] In view of this, the embodiment of the present application provides an optical signal switching component, a connecting core, a connecting structure, a switching structure and an optical signal switching system with a lossy waveguide. Among them, the optical signal switching component includes a connecting core, an adapter, a first conductive layer and a second conductive layer. Among them, the connecting core is made of plastic material, and the plastic base material of the adapter is doped with conductive fillers and / or magnetic fillers. A slot is provided on the adapter, the connecting core is inserted into the slot, the first conductive layer is located between the connecting core and the adapter, and is arranged around the connecting core, and the second conductive layer is arranged around the adapter. The second conductive layer, the adapter, the first conductive layer and the connector form a "U"-shaped waveguide structure, and the medium in the "U"-shaped waveguide structure is a plastic material filled with conductive fillers and / or magnetic fillers. The waveguide structure in the above-mentioned optical signal switching component can change the transmission path of the electromagnetic wave, so that the transmission path of the electromagnetic wave falls into the area where the adapter is located as much as possible, thereby increasing the loss of the electromagnetic wave by the adapter. Based on this, the loss of electromagnetic waves can be increased and the shielding effect can be improved.

[0005] The first aspect of the present application provides an optical signal adapter component, which is used to connect a first optical module to a second optical module to realize the transmission of an optical signal from the first optical module to the second optical module. The optical signal adapter component includes a connecting core, a first conductive layer, an adapter, and a second conductive layer. The connecting core is used to connect to the optical module. The first conductive layer is arranged around the connecting core around a transmission axis, wherein the transmission axis is parallel to the transmission direction of the optical signal. The material of the adapter includes conductive fillers and / or magnetic fillers, and the adapter is arranged around the first conductive layer around the transmission axis. The second conductive layer is arranged around the adapter around the transmission axis.

[0006] The optical module includes but is not limited to an optical fiber and an optical module. The connecting core can be a plug in a connector or an optical device adapted to an optical module, which is not specifically limited in this application. The transmission axis can extend along the plugging direction of the connecting core into the adapter.

[0007] That is, in the implementation of the present application, along the transmission axis, a first conductive layer is provided on the outer circumferential surface of the connecting core, an adapter is provided on the outer circumferential surface of the first conductor layer, and a second conductive layer is provided on the outer circumferential surface of the adapter. Based on this, the first conductive layer and the second conductive layer form a "U"-shaped waveguide structure extending along the transmission axis. That is, the "U"-shaped waveguide structure includes a connecting core, a first conductive layer, an adapter and a second conductive layer in sequence from the inside to the outside along the radial direction. Among them, the radial direction is perpendicular to the transmission axis. The above-mentioned optical signal adapter assembly can effectively limit the transmission path of electromagnetic waves in the optical signal adapter assembly. At the same time, since the material of the adapter includes conductive material and / or magnetic filler, the two layers of metal walls in the "U"-shaped waveguide structure are lossy media, which increases the loss of electromagnetic waves by the adapter. Based on this, the waveguide structure in the above-mentioned optical signal adapter assembly can increase the loss of electromagnetic waves and enhance the shielding effect.

[0008] In some possible implementations of the first aspect above, in the above-mentioned optical signal adapter assembly, the first conductive layer is formed on one of the two surfaces of the connecting core and the adapter that are opposite to each other. That is, in the implementation of the present application, when the optical signal adapter assembly is in an assembled state, the first conductive layer is located between the connecting core and the adapter, which reduces the number of components in the optical signal adapter assembly in the present application and reduces the difficulty of assembling or assembling the optical signal adapter assembly. The present application does not specifically limit the formation of the first conductive layer on the connecting core or the adapter. In addition, the conductive layer forming method in the present application will be described in detail below and will not be expanded here.

[0009] In some possible implementations of the first aspect above, in the above-mentioned optical signal adapter, the mass doping ratio of the conductive filler and / or the magnetic filler ranges from 0.5% to 40%. The mass doping ratio of the conductive filler and / or the magnetic filler refers to the ratio of the cumulative weight of the conductive filler and / or the magnetic filler to the total mass of the adapter. The total weight of the adapter refers to the sum of the mass of the conductive filler and / or the magnetic filler and the plastic base material. The above-mentioned optical signal adapter can effectively improve the loss effect on electromagnetic waves by reasonably designing the mass doping ratio of the conductive filler and / or the magnetic filler, thereby effectively improving the shielding effect of the optical signal adapter.

[0010] In some possible implementations of the first aspect above, in the above-mentioned optical signal switching component, the first conductive layer is a film-like structure that rotates around the transmission axis. And / or, the second conductive layer is a film-like structure that rotates around the transmission axis. In the above-mentioned optical signal switching component, the first conductive layer and the second conductive layer are thin film structures that rotate around the transmission axis, which have little impact on the size of the existing structure, and are convenient for expanding the scope of application of the technical solution of the present application. For example, the thickness range of the first conductive layer is 1μm to 500μm. And / or, the thickness range of the second conductive layer is 1μm to 500μm.

[0011] In some possible implementations of the first aspect, in the optical signal switching assembly, the first conductive layer includes a first sub-conductive layer and a second sub-conductive layer, and the first sub-conductive layer and the second sub-conductive layer cooperate to surround the transmission axis and are arranged around the connecting core. The first sub-conductive layer is formed on the surface of the connecting core facing the adapter, and the second sub-conductive layer is formed on the surface of the adapter facing the connecting core.

[0012] That is, in the implementation of the present application, the first conductive layer includes two parts, a first sub-conductive layer and a second sub-conductive layer. In addition, the first sub-conductive layer is disposed on the surface of the connecting core facing the adapter, and the second sub-conductive layer is disposed on the surface of the adapter facing the adapter. In the present application, the first sub-conductive layer and the second sub-conductive layer can be integrated to surround the transmission axis around the connecting core, and the shapes of the first sub-conductive layer and the second sub-conductive layer are not specifically limited. In the above-mentioned optical signal switching assembly, the first conductive layer can also be a split structure respectively formed on the connecting core and the adapter, which expands the implementation method of the first conductive layer and reduces the design difficulty and molding difficulty of the first conductive layer.

[0013] In some possible implementations of the first aspect described above, the second conductive layer is formed on the surface of the adapter that is away from the connecting core. That is, in the implementation of the present application, the second conductive layer is formed on the outer surface of the adapter. The above-mentioned optical signal adapter assembly, on the one hand, does not need to set the second conductive layer as a separate component, which reduces the number of components in the optical signal adapter assembly, reduces the difficulty of assembly, and facilitates the improvement of overall accuracy. On the other hand, the second conductive layer is formed on the outer surface of the adapter, which reduces the difficulty of molding, facilitates the reduction of production costs, and improves the economic benefits of the optical signal adapter assembly.

[0014] In some possible implementations of the first aspect above, the optical signal adapter assembly further includes a conductive shell, and the connecting core, the first conductive layer and the adapter are located in the conductive shell, and the conductive shell serves as a second conductive layer. For example, the thickness of the conductive shell is greater than 1 μm. That is, in the implementation of the present application, the second conductive layer is a separately provided component, and other components in the optical signal adapter assembly can be accommodated in the component. The above-mentioned optical signal adapter assembly is provided with a conductive shell, and the conductive shell is used as the second conductive layer, which facilitates the sealing design of the optical signal adapter assembly and can improve the stability of the system.

[0015] In some possible implementations of the first aspect described above, the optical signal switching assembly includes a conductive shell, and at the switching position, the connecting core, the first conductive layer, the adapter, and the second conductive layer are located in the conductive shell. The second conductive layer includes a third sub-conductive layer and a fourth sub-conductive layer, and the third sub-conductive layer and the fourth sub-conductive layer cooperate to surround the adapter around the transmission axis. The third sub-conductive layer is formed on the surface of the adapter, and the fourth sub-conductive layer is formed on the surface of the conductive shell. The above optical signal switching assembly further expands the scope of application.

[0016] In some possible implementations of the first aspect, the conductive filler includes but is not limited to at least one of carbon fiber, nickel carbon fiber, metal conductive particles, metal conductive fibers, carbon black, graphite, and carbon nanotubes. The optical signal switching assembly can effectively improve the loss effect of electromagnetic waves by reasonably designing the type of conductive filler, thereby effectively improving the shielding effect of the optical signal switching assembly.

[0017] In some possible implementations of the first aspect, the magnetic filler includes but is not limited to at least one of ferrite, iron powder, nickel iron powder, nickel zinc ferrite, hydroxy iron and magnetic ceramics. The optical signal switching assembly can effectively improve the loss effect of electromagnetic waves by reasonably designing the type of magnetic filler, thereby effectively improving the shielding effect of the optical signal switching assembly.

[0018] In some possible implementations of the first aspect above, the surfaces of the connecting core and the first conductive layer relative to each other are sealed and fitted, and the connecting core is made of a conductive material. That is, in the present application, the optical module is an optical module, the connecting core is an optical device connected to the optical module, and the optical device is made of a conductive material. The above-mentioned optical signal switching assembly and the conductive material of the optical device can prevent electromagnetic waves from radiating directly from the connecting core. Based on this, the above-mentioned structure can further optimize the transmission path of the electromagnetic waves, allowing as many electromagnetic waves as possible to fall into the area where the adapter is located, and further improve the adapter's loss of electromagnetic waves. Based on this, the above-mentioned waveguide structure can further improve the loss of electromagnetic waves, and thus can further enhance the shielding effect of the optical signal switching assembly.

[0019] In some possible implementations of the first aspect above, the optical signal switching assembly further includes a third conductive layer, which is disposed on the connecting core and extends along the intersection direction of the transmission axis to seal and fit with the surface of the first conductive layer. That is, in the present application, the optical module is an optical fiber, and the connecting core is a plug connected to the optical fiber. In the above optical signal switching assembly, a third conductive layer is disposed on the plug, and the third conductive layer is used to block the cylindrical channel formed by the first conductive layer, which can prevent electromagnetic waves from radiating directly from the plug (ie, the connecting core). Based on this, the above structure can further optimize the transmission path of the electromagnetic wave, allowing as many electromagnetic waves as possible to fall into the area where the adapter is located, and further improve the loss of electromagnetic waves by the adapter. Based on this, the above waveguide structure can further improve the loss of electromagnetic waves, and thus can further improve the shielding effect of the optical signal switching assembly.

[0020] It can be understood that in some other implementations of the present application, the location of the third conductive layer on the ferrule is not specifically limited in the present application, and any form that can prevent electromagnetic waves from directly radiating and leaking from the ferrule is within the protection scope of the present application.

[0021] In some possible implementations of the first aspect, in the optical signal switching assembly, the third conductive layer is a film-like structure perpendicular to the transmission axis. For example, the thickness of the third conductive layer ranges from 1 μm to 500 μm. In the optical signal switching assembly, the third conductive layer is a film-like structure that rotates around the transmission axis, which has little effect on the size of the existing structure, and is convenient for expanding the scope of application of the technical solution of the present application.

[0022] The second aspect of the present application provides a connection structure, which includes a connection core and a fourth conductive layer. The connection core is used to connect to the optical module. The fourth conductive layer is at least partially arranged around the connection core around the transmission axis, wherein the transmission axis is parallel to the transmission direction. It can be understood that the fourth conductive layer is the first conductive layer formed on the connection core, and the connection structure is the connector on which the conductive layer is provided, which will not be described in detail here. In the above-mentioned connection structure, the fourth conductive layer is formed on the connection core, which corresponds to the technical solution of the aforementioned first conductive layer being formed on the connection core, which is convenient for reducing the number of components in the optical signal switching component and reducing the difficulty of assembly and assembly of the optical signal switching component.

[0023] In some possible implementations of the second aspect described above, the connection structure includes but is not limited to at least one of a multi-purpose push-pull connector, a square connector, a standard connector, and an active optical cable connector.

[0024] The third aspect of the present application provides a switching structure, which includes a fifth conductive layer and an adapter. The fifth conductive layer is arranged in a ring around the transmission axis. The material of the adapter includes conductive fillers and / or magnetic fillers, and the adapter is arranged around the fifth conductive layer around the transmission axis. It can be understood that the fifth conductive layer is the first conductive layer formed on the adapter, and the switching structure is the adapter on which the conductive layer is provided, which will not be described in detail here. The above-mentioned switching structure corresponds to the technical solution of the aforementioned first conductive layer being formed on the adapter, which is convenient for reducing the number of components in the optical signal switching component and reducing the difficulty of assembling and assembling the optical signal switching component.

[0025] In some possible implementations of the third aspect, the conductive filler includes but is not limited to at least one of carbon fiber, nickel carbon fiber, metal conductive particles, metal conductive fiber, carbon black, graphite, and carbon nanotubes. The optical signal switching assembly can effectively improve the loss effect of electromagnetic waves by reasonably designing the type of conductive filler, thereby effectively improving the shielding effect of the optical signal switching assembly.

[0026] In some possible implementations of the third aspect, the magnetic filler includes but is not limited to at least one of ferrite, iron powder, nickel iron powder, nickel zinc ferrite, hydroxy iron and magnetic ceramics. The optical signal switching assembly can effectively improve the loss effect of electromagnetic waves by reasonably designing the type of magnetic filler, thereby effectively improving the shielding effect of the optical signal switching assembly.

[0027] The fourth aspect of the present application provides a switching structure, which includes an adapter and a sixth conductive layer. The adapter includes a conductive filler and / or a magnetic filler, and a slot for plugging in a connecting core is provided on the adapter, and the slot extends along the transmission direction. The sixth conductive layer is at least partially arranged around the transmission axis around the adapter, wherein the transmission axis is parallel to the transmission direction. It can be understood that the sixth conductive layer is the second conductive layer formed on the adapter, and the switching structure is the adapter on which the conductive layer is provided, which will not be described in detail here. The above-mentioned switching structure corresponds to the technical solution in which the second conductive layer is formed on the adapter, which is convenient for reducing the number of components in the optical signal switching component and reducing the difficulty of assembling and assembling the optical signal switching component.

[0028] In some possible implementations of the fourth aspect, the conductive filler includes but is not limited to at least one of carbon fiber, nickel carbon fiber, metal conductive particles, metal conductive fibers, carbon black, graphite, and carbon nanotubes. The optical signal switching assembly can effectively improve the loss effect of electromagnetic waves by reasonably designing the type of conductive filler, thereby effectively improving the shielding effect of the optical signal switching assembly.

[0029] In some possible implementations of the fourth aspect, the magnetic filler includes but is not limited to at least one of ferrite, iron powder, nickel iron powder, nickel zinc ferrite, hydroxy iron and magnetic ceramics. The optical signal switching assembly can effectively improve the loss effect of electromagnetic waves by reasonably designing the type of magnetic filler, thereby effectively improving the shielding effect of the optical signal switching assembly.

[0030] The fifth aspect of the present application provides a switching structure, which includes a fifth conductive layer, a switch and a sixth conductive layer. The switching structure corresponds to the technical solution in which the first conductive layer and the second conductive layer are both formed on the switch, which is convenient for reducing the number of components in the optical signal switching component and reducing the difficulty of assembling and assembling the optical signal switching component.

[0031] The sixth aspect of the present application provides an optical signal switching system, which includes the optical signal switching component of the above-mentioned first aspect and any one of the possible implementation methods of the first aspect and two optical modules, wherein the two optical modules implement optical signal switching through the optical switching component.

[0032] A seventh aspect of the present application provides an electronic device, which includes any one of the optical signal switching systems in the sixth aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] FIG1( a ) shows a schematic diagram of an optical signal switching system S1 in some application scenarios of the present application;

[0034] FIG. 1( b ) shows a side view of an optical device 100 a in some embodiments of the present application;

[0035] FIG1( c ) shows a cross-sectional view along the MM section in FIG1( b );

[0036] FIG. 1( d ) shows a cross-sectional view of the optical device 100 a and the optical module 1 a in an assembled state along the cross-sectional plane in FIG. 1( b );

[0037] FIG. 1( e ) shows a side view of a fiber optic connector 100 b in some embodiments of the present application;

[0038] FIG1( f ) shows a cross-sectional view along the NN section in FIG1( e );

[0039] FIG. 1( g ) shows a cross-sectional view of the optical fiber connector 100 b and the optical fiber 1 b in an assembled state along the NN section in FIG. 1( e );

[0040] FIG. 1( h ) shows a cross-sectional view of an optical module 1 a , an optical device 100 a , an optical fiber 1 b , an optical fiber connector 100 b , and an adapter 200 along the NN section in FIG. 1( e ) in some embodiments of the present application;

[0041] FIG1( i ) shows a schematic diagram of an optical signal switching system S2 in some application scenarios of the present application;

[0042] Figure 2 An exploded view of an optical signal switching assembly 2 in some embodiments of the present application is shown;

[0043] FIG. 3( a ) shows a perspective view of the adapter 200 at another angle in some embodiments of the present application;

[0044] FIG. 3( b ) shows a perspective view of the connection module 100 and the adapter 200 after being assembled in some embodiments of the present application;

[0045] FIG. 3( c ) shows a stereoscopic view of the connection module 100 , the adapter 200 , and the housing 300 after being assembled in some embodiments of the present application;

[0046] FIG. 4( a ) shows a cross-sectional view of the optical signal switching assembly 2 along the AA section in FIG. 3( c ) in some embodiments of the present application;

[0047] FIG. 4( b ) shows a cross-sectional view of the optical signal switching assembly 2 along the cross section BB in FIG. 3( c ) in some embodiments of the present application;

[0048] Figure 5 A partial enlarged view of the S1 region in FIG. 4( b ) in some embodiments of the present application is shown, which illustrates the transmission path of the electromagnetic wave of the electronic device in the waveguide structure in the optical signal switching component 2 ;

[0049] Figure 6 A partial enlarged view of the S1 region in FIG. 4( b ) in some other embodiments of the present application is shown, which illustrates the transmission path of the electromagnetic wave in the waveguide structure in the optical signal switching component 2 ;

[0050] FIG. 7( a ) shows a cross-sectional view of the optical signal switching assembly 2 along the AA section in FIG. 3( c ) in some other embodiments of the present application;

[0051] FIG. 7( b ) shows a partial enlarged view of the S1 region in FIG. 4( b ) in some other embodiments of the present application, which illustrates the transmission path of the electromagnetic wave in the waveguide structure;

[0052] Figure 8 A diagram showing the shielding effect of an optical signal transfer scheme applicable to an MPO connector in some embodiments of the present application is shown;

[0053] Fig. 9 A partial enlarged view of the S1 region in FIG. 4( b ) in some further embodiments of the present application is shown;

[0054] FIG. 10( a ) shows an exploded view of an optical signal switching system S2 in some embodiments of the present application;

[0055] FIG. 10( b ) shows a perspective view of the optical signal switching system S2 in FIG. 10( a );

[0056] FIG. 11( a ) shows a cross-sectional view of the optical signal switching assembly 2 along the CC section in FIG. 10( b ) in some embodiments of the present application;

[0057] FIG. 11( b ) shows a cross-sectional view of the optical signal switching assembly 2 along the cross section DD in FIG. 10( b ) in some embodiments of the present application;

[0058] FIG. 11( c ) shows a partial enlarged view of the S2 region in FIG. 11( b ) in some embodiments of the present application, which illustrates the transmission path of the electromagnetic wave in the waveguide structure;

[0059] Fig.12 A schematic diagram of a housing 300 in some embodiments of the present application is shown;

[0060] Fig.13 A schematic diagram showing a conductive layer 400 formed on a first ferrule 110c in some embodiments of the present application is shown;

[0061] Fig.14 A schematic diagram showing a conductive layer 400 formed on an adapter 200 in some embodiments of the present application is shown;

[0062] Fig.15 A cross-sectional view of the optical signal switching assembly 2 along the CC section in FIG. 10( b ) in some other embodiments of the present application is shown;

[0063] FIG. 16( a ) shows a schematic diagram of a first sub-conductive layer 410 formed on a core insert 110 c in some other embodiments of the present application;

[0064] FIG. 16( b ) shows a schematic diagram of forming the second sub-conductive layer 420 on the adapter 200 in some other embodiments of the present application;

[0065] Fig.17 The cross-sectional view of the optical signal switching assembly 2 along the CC section in FIG. 10( b ) in some other embodiments of the present application is shown;

[0066] FIG. 18( a ) shows a schematic diagram of a first sub-conductive layer 410 formed on a core insert 110 c in some other embodiments of the present application;

[0067] FIG. 18( b ) shows a schematic diagram of forming the second sub-conductive layer 420 on the adapter 200 in some other embodiments of the present application;

[0068] Fig.19A cross-sectional view of the optical signal switching assembly 2 in some embodiments of the present application is shown along the DD section in FIG. 10( b ), wherein the first ferrule 110 c is not shown;

[0069] FIG. 20( a ) shows a partial enlarged view of the S2 region in FIG. 11( b ) in some embodiments of the present application, which illustrates the transmission paths of electromagnetic waves W1 and W2 in the waveguide structure;

[0070] FIG. 20( b ) shows a partial enlarged view of the S2 region in FIG. 11( b ) in some other embodiments of the present application, which illustrates the transmission paths of the electromagnetic waves W1 and W2 in the waveguide structure;

[0071] FIG. 20( c ) shows a partial enlarged view of the S2 region in FIG. 11( b ) in some other embodiments of the present application, which illustrates the transmission paths of the electromagnetic waves W1 and W2 in the waveguide structure;

[0072] Fig.21 A cross-sectional view of the optical signal switching assembly 2' along the CC section in FIG. 10(b) is shown in some embodiments of the present application;

[0073] Fig. 22 A schematic diagram showing a conductive layer 600 formed on an adapter 200 in an optical signal switching system 2' in some embodiments of the present application is shown;

[0074] Fig.23 A cross-sectional view of an optical signal switching assembly 2" along the CC section in FIG. 10(b) is shown in some embodiments of the present application;

[0075] FIG. 24( a ) shows a schematic diagram of a housing 300 in an optical signal switching assembly 2 ″ in some embodiments of the present application;

[0076] FIG. 24( b ) shows a schematic diagram of a conductive layer 600 formed on an adapter 200 in an optical signal adapter assembly 2 ″ in some embodiments of the present application;

[0077] Fig.25 A three-dimensional diagram of an optical signal switching system S1 in some embodiments of the present application is shown;

[0078] Fig.26 It shows that the optical signal switching system S1 in some embodiments of the present application is connected along Fig.25 Cross-sectional view of the EE section;

[0079] Fig. 27 Shows Fig.26 A local enlarged view of the S3 region. DETAILED DESCRIPTION

[0080] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0081] The optical signal switching scheme provided in the present application can be applied to an optical signal switching system for optical signal switching. The optical signal switching system includes a first optical module, a second optical module and an optical signal switching assembly. The first optical module and the second optical module can be at least one of an optical fiber and an optical module. The optical signal switching assembly includes a first connection module, a second connection module and an adapter. The first connection module is used to fix the first optical module, and the second connection module is used to fix the second optical module. And the first connection core in the first connection module and the second connection core in the second connection module are respectively matched with the switching interface on the adapter to realize the connection between the first optical module corresponding to the first connection module and the second optical module corresponding to the second connection module (for example, to realize the connection between the core of the first optical fiber and the core of the second optical fiber), thereby realizing the switching of the optical signal on the first optical module and the second optical module. In addition, the optical signal switching scheme provided in the present application is also applicable to optical signal switching assemblies, connection cores, connection modules and adapters, and the present application does not make specific limitations on this.

[0082] The optical signal switching scheme provided in the present application can be applied to application scenarios with optical fiber and optical module docking. It will be briefly described below in conjunction with the accompanying drawings. In the field of optical communications, the fixation and docking of optical modules and optical fibers are generally completed by the cooperation of optical devices, adapters and optical fiber connectors. Figure 1 (a) shows a schematic diagram of an optical signal switching system S1 in some application scenarios of the present application. As shown in Figure 1 (a), the optical signal switching system S1 includes an optical module 1a, an optical fiber 1b and an optical signal switching component 2. The optical module 1a and the optical fiber 1b are switched through the optical signal switching component 2, thereby realizing the transmission of optical signals between the optical module 1a and the optical fiber 1b. Among them, the optical signal switching component 2 includes an optical device 100a, an optical fiber connector 100b, an adapter 200 and a housing 300. The optical device 100a is connected to the optical module 1a and is arranged in the housing 300. Among them, the optical module 1a includes a circuit board (not shown) and a photoelectric conversion module (not shown), and the photoelectric conversion module is electrically connected to the circuit board and the optical device 100a respectively. The circuit board is used to receive and send instructions, and the photoelectric conversion module is used to convert the received electrical signal into an optical signal and send the converted optical signal to the optical device 100a. The optical fiber connector 100b is connected to the optical fiber 1b. The optical device 100a and the optical fiber connector 100b are respectively connected to the adapter 200 to achieve mutual connection between the optical module 1a and the optical fiber 1b, thereby achieving optical signal switching between the optical module 1a and the optical fiber 1b.

[0083] The mechanical connection and signal connection method between the optical module 1a and the optical device 100a in the present application will be described in detail below with reference to the accompanying drawings.

[0084] FIG1(b) shows a side view of an optical device 100a in some embodiments of the present application, and FIG1(c) shows a cross-sectional view along the MM cross-sectional plane in FIG1(b). In combination with FIG1(b) and FIG1(c), it can be seen that in some embodiments of the present application, the optical device 100a includes an optical device substrate 110a, and the optical device substrate 110a has a first optical device end face 111a and a second optical device end face 112a that are arranged opposite to each other. An optical fiber hole 120a is provided on the optical device 100a, and the optical fiber hole 120a is connected to the first optical device end face 111a and the second optical device end face 112a, and the optical fiber hole 120a is used to plug the core of the optical fiber in the optical module 1a.

[0085] FIG1(d) shows a cross-sectional view of the optical device 100a and the optical module 1a in the assembled state along the cross-sectional plane in FIG1(b). As shown in FIG1(d), the optical module 1a includes a signal-connected processing module 11a and an optical fiber 12a, and the optical fiber 12a is signal-connected to the processing module 11a. Combining FIG1(c) and FIG1(d), it is not difficult to find that the core 13a of the optical fiber 12a is plugged into the optical fiber hole 120a. And the end face of the core 13a is flush with the end face 111a of the first optical device. It can be understood that in the application scenario of the optical module 1a and the optical device 100a, the optical fiber 12a is an intermediate component used to realize the mechanical and electrical connection between the processing module 11a and the optical device 100a.

[0086] Continue reading Figure 1(b) to Figure 1(d) In some embodiments of the present application, the optical device 100a further includes a positioning post 130a, and the positioning post 130a is disposed on the first optical device end surface 111a of the optical device substrate 110a. In the assembled state, the positioning post 130a can be plugged into the positioning hole in the adapter 200. Based on this, the above structure can realize the positioning of the optical device 100a and the optical module 1a relative to the adapter 200. Among them, the positioning post 130a and the optical device substrate 110a can be made of the same material, and the positioning post 130a can be integrally formed with the optical device substrate 110a, and this application does not make specific limitations on this.

[0087] In some implementations, the processing module 11a may be a chip or a circuit board with an integrated chip, which is not specifically limited in the present application.

[0088] In some implementations, the optical device 100a is made of metal. For example, the optical device 100a may be made of stainless steel, aluminum alloy, etc., which is not specifically limited in the present application.

[0089] The mechanical connection and signal connection method between the optical fiber 1b and the optical fiber connector 100b in the present application will be described in detail below with reference to the accompanying drawings.

[0090] FIG. 1(e) shows a side view of the optical fiber connector 100b in some embodiments of the present application, and FIG. 1(f) shows a cross-sectional view along the NN cross-sectional plane in FIG. 1(e). In combination with FIG. 1(e) and FIG. 1(f), it can be seen that in some embodiments of the present application, the optical fiber connector 100b includes a ferrule 110b, and the ferrule 110b has a first ferrule end face 111b and a second ferrule end face 112b that are arranged oppositely. A fiber hole 120b is provided on the ferrule 110b, and the fiber hole 120b is connected to the first ferrule end face 111b and the second ferrule end face 112b, and the fiber hole 120b is used to plug the core of the optical fiber 1b. In addition, the optical fiber connector 100b also includes a protective component 130b, and the protective component 130b has a first protective end face 131b and a second protective end face 132b that are arranged oppositely. The first protective end face 131b of the protective component 130b is connected to the second ferrule end face 112b of the ferrule 110b. The protection component 130b is further provided with a protection hole 140b, and the protection hole 140b is connected to the first protection end surface 131b and the second protection end surface 132b. The protection hole 140b can clamp the protection jacket layer of the optical fiber 1b to improve the stable connection of the optical fiber connector 100b to the optical fiber 1b.

[0091] FIG1(g) shows a cross-sectional view of the fiber optic connector 100b and the optical fiber 1b in the assembled state along the NN section plane in FIG1(e). As shown in FIG1(g), the optical fiber 1b includes an optical fiber body 11b and a fiber core 12b, and the fiber core 12b extends from the fiber core in the optical fiber body 11b. Combining FIG1(f) and FIG1(g), it is not difficult to find that the optical fiber body 11b is installed in the protective hole 140b in the protective component 130b, and the fiber core 12b is plugged into the optical fiber hole 120b in the ferrule 110b. The end face of the fiber core 12b is flush with the first ferrule end face 111b of the ferrule 110b.

[0092] It can be understood that, in the assembled state, the outer peripheral surface of the ferrule 110 b can be used as a limiting feature to match the mounting hole in the adapter 200 .

[0093] In some implementations, the ferrule 110b may be made of plastic. For example, the ferrule 110b may be made of polyethylene, polypropylene, polyvinyl chloride, polystyrene, etc., which is not specifically limited in the present application.

[0094] After describing the mechanical connection and signal connection method between the optical module 1a and the optical device 100a, and the mechanical connection and signal connection method between the optical fiber 1b and the optical fiber connector 100b, the mechanical connection and signal connection method of the optical module 1a, the optical device 100a, the optical fiber 1b, the optical fiber connector 100b and the adapter 200 in the present application will be described in detail with reference to the accompanying drawings.

[0095] FIG1(h) shows a cross-sectional view of an optical module 1a, an optical device 100a, an optical fiber 1b, an optical fiber connector 100b, and an adapter 200 along the NN section in FIG1(e) in some embodiments of the present application.

[0096] As shown in Fig. 1(h), in some embodiments of the present application, the adapter 200 includes an adapter body 210, and the adapter body 210 includes a first adapter surface 211 and a second adapter surface 212 that are arranged opposite to each other. In the adapter body 210, a first adapter hole 220 is formed on the first adapter surface 211, a second adapter hole 230 is formed on the second adapter surface 212, and the first adapter hole 220 and the second adapter hole 230 are connected.

[0097] Combination Figure 1(b) to Figure 1(h) It can be seen that in the assembled state, in some embodiments of the present application, the optical device substrate 110a is inserted into the first transfer hole 220 in the transfer body 210, and the ferrule 110b is inserted into the second transfer hole 230 in the transfer body 210. In addition, the first optical device end face 111a of the optical device substrate 110a is in contact with the first ferrule end face 111b of the ferrule 110b, and the end face of the fiber core 13a is in contact with the end face of the fiber core 12b.

[0098] In some implementations, the central axis of the fiber core 13a coincides with the central axis of the fiber core 12b.

[0099] In some application scenarios, the optical signal is transmitted from the optical module 1a to the optical fiber 1b. For the convenience of description, the extension direction of the fiber core 13a and the opposite direction of the extension direction of the fiber core 12b are defined as the transmission direction F T , and the central axis of the core 13a and the central axis of the core 12b are defined as the transmission axis A T .

[0100] It is understandable that in some other application scenarios, the optical signal can also be transmitted from the optical fiber 1b to the optical module 1a. The principle of the device is similar to the aforementioned application scenario and will not be described in detail here.

[0101] The optical signal switching solution provided in the present application can also be applied to application scenarios where optical fibers are connected to each other. The following will be briefly described in conjunction with the accompanying drawings. In the field of optical communications, the fixation and connection of two optical fibers are generally completed by the cooperation of optical fiber connectors and optical fiber adapters. Figure 1(i) shows a schematic diagram of an optical signal switching system S2 in some application scenarios of the present application. As shown in Figure 1(i), the optical signal switching system S2 includes a first optical fiber 1c, a second optical fiber 1d, and an optical signal switching assembly 2. The first optical fiber 1c and the second optical fiber 1d are switched through the optical signal switching assembly 2, thereby realizing the transmission of optical signals between the first optical fiber 1c and the second optical fiber 1d. Among them, the optical signal switching assembly 2 includes an optical fiber connector 100c, an optical fiber connector 100d, an adapter 200, and a housing 300. The optical fiber connector 100c is connected to the first optical fiber 1c, and the optical fiber connector 100d is connected to the second optical fiber 1d. The optical fiber connector 100c and the optical fiber connector 100d are respectively connected to the adapter 200 to achieve mutual connection between the first optical fiber 1c and the second optical fiber 1d, thereby achieving optical signal switching between the first optical fiber 1c and the second optical fiber 1d.

[0102] It can be understood that the mechanical connection mode and electrical connection mode between the first optical fiber 1c and the optical fiber connector 100c in FIG. 1(i), and the mechanical connection mode and electrical connection mode between the second optical fiber 1d and the optical fiber connector 100d, can be specifically referred to Figure 1(a) to Figure 1(h) The mechanical connection method and the electrical connection method between the optical fiber 1b and the optical fiber connector 100b will not be re-described here.

[0103] In some embodiments of the present application, the connectors in the present application are various. The connector in the present application may be at least one of a multipurpose push-on / pull-off (MPO) connector, a lucent connector (LC), a standard connector (SC), and an active optical cable connector (AOC). The present application does not specifically limit this. The adapter in the present application is an adapter module adapted to the connector. Correspondingly, the adapter may be at least one of an MPO adapter, an LC adapter, an SC adapter, and an AOC adapter. In some of the implementations, the adapter may be an adapter, and the adapter is an adapter with different types of corresponding connectors on both sides. In some other replaceable implementations, the adapter may also be a coupler, and the coupler is an adapter with the same type of corresponding connectors on both sides. For example, the first adapter module is a male MPO connector, the second adapter module is a female MPO connector, and the adapter module is a corresponding MPO adapter. The male MPO connector and the female MPO connector complete the docking of the cores of the two optical fibers through the MPO adapter.

[0104] The optical signal switching solution in the present application will be described in detail below with reference to the accompanying drawings, taking one side of the aforementioned optical switching system as an example.

[0105] Figure 2 The exploded view of the optical signal switching assembly 2 in some embodiments of the present application is shown. It can be understood that Figure 2 The optical signal adapter 2 is used to connect the first optical module to the second optical module to achieve optical signal transmission between the first optical module (e.g., the optical module 1a in FIG. 1(a)) and the second optical module (e.g., the optical fiber 1b in FIG. 1(a)). The first optical module can be an optical fiber or an optical module, and the second optical module can be an optical fiber or an optical module, which is not specifically limited in this application. Figure 2 As shown, the optical signal adapter component 2 includes a connection module 100, an adapter 200 and a housing 300, and the connection module 100 includes a connection core 110. The connection core 110 is used to connect to the optical signal of the first optical module. The optical signal connection between the connection core 110 and the first optical module can be understood as the connection core 110 being able to transmit the optical signal in the first optical module. For example, an optical signal structure capable of transmitting optical signals is provided in the connection core 110, and the connection core 110 can transmit optical signals using the optical signal structure. For another example, a channel for the first optical module to extend out is provided in the connection core 110, and the first optical module passing through the connection core 110 transmits the optical signal out. This application does not make any specific limitation to this.

[0106] FIG. 3(a) shows a stereoscopic view of the adapter 200 from another angle in some embodiments of the present application. FIG. 3(b) shows a perspective view of the connection module 100 and the adapter 200 after assembly in some embodiments of the present application. FIG. 3(c) shows a stereoscopic view of the connection module 100, the adapter 200 and the housing 300 after assembly in some embodiments of the present application. FIG. 3(c) shows the AA section and the BB section passing through the connection module 100, the adapter 200 and the housing 300.

[0107] Combination Figure 2 to Figure 3(c) It can be seen that the adapter 200 is provided with a slot C1 for plugging the connecting core 110. In the assembled state, the connecting core 110 in the connection module 100 is inserted into the slot C1 in the adapter 200 along the plugging direction F, wherein the plugging direction refers to the direction in which the connecting core 110 is inserted into the slot C1 on the adapter 200. The housing 300 is formed with an installation channel C2, and the connector 100 and the adapter 200 are installed in the installation channel C2.

[0108] In some implementations, the optical module may be an optical module, the connection module 100 may be an optical device, and the connection core 110 is a metal structure in the connection module 100 for connecting optical signals with other structures in the optical module.

[0109] In some other alternative implementations, the optical module may be an optical fiber, the connection module 100 may be a connector, and the connection core 110 is a plug in the connection module 100 for connecting with an optical fiber optical signal. The plug is provided with an optical fiber hole (not shown), which extends along the plugging direction F and penetrates the plug. The optical fiber is installed in the optical fiber hole and extends out of the optical fiber hole in the opposite direction of the plugging direction F.

[0110] FIG4(a) shows a cross-sectional view of the optical signal switching component 2 along the AA section in FIG3(c) in some embodiments of the present application. FIG4(b) shows a cross-sectional view of the optical signal switching component 2 along the BB section in FIG3(c) in some embodiments of the present application. In combination with FIG4(a) and FIG4(b), it can be seen that for the convenience of the following description, the structure composed of the connection module 100, the adapter 200 and the housing 300 is defined as the waveguide structure in the optical signal switching component 2 (corresponding to the S1 area in FIG4(b)), wherein the S1 area can also be referred to as the plug-in area, and the end of the waveguide structure close to the optical module is defined as the first end E1, and the end of the waveguide structure away from the optical device is defined as the second end E2.

[0111] In some embodiments of the present application, the connecting core 110 is made of plastic material, the adapter 200 is also made of plastic material, and the housing 300 is made of conductive material. Figure 5 A partial enlarged view of the S1 area in FIG. 4(b) in some embodiments of the present application is shown, which illustrates the transmission path of the electronic device electromagnetic wave in the waveguide structure in the optical signal switching component 2. In the present application, the electronic device electromagnetic wave is an electromagnetic wave that can generate electromagnetic interference to other devices. The electromagnetic waves in the present application may come from other electronic components in the electronic device (such as a chip or circuit board in the electronic device), and the present application does not specifically limit this.

[0112] In some embodiments of the present application, Figure 5 As shown in FIG. 1 , since the connecting core 110 and the adapter 200 are made of plastic material, and the housing 300 is made of conductive material, the waveguide structure is similar to a rectangular waveguide. Furthermore, when the electromagnetic wave enters from the end face of the adapter 200 in the first end E1 of the waveguide structure, the electromagnetic wave travels in the rectangular waveguide along Figure 5 The waveguide is totally reflected in the direction of the arrow and transmitted to the second end E2 of the waveguide structure.

[0113] Combination Figure 5It is not difficult to find that in the above-mentioned optical signal switching component 2, although the optical signal switching between the two optical modules can be achieved by reasonably designing the structure and material of the connecting core 110, the adapter 200 and the shell 300, since the connecting core 110 and the adapter 200 are made of plastic, the electromagnetic wave has a small loss when passing through the waveguide structure, which makes the electromagnetic wave radiated by the electronic device to the outside stronger and does not meet the regulatory limit line requirements.

[0114] In order to solve the above problems, in some technical solutions, the structural size of the adapter 200 can be reduced, so as to reduce the electromagnetic radiation leakage path by reducing the size of the opening of the optical path of the adapter 200, thereby reducing the external electromagnetic interference of the optical signal adapter component 2 and improving the electromagnetic compatibility of the optical signal adapter component 2. Among them, the optical path of the adapter 200 refers to the outer contour of the cross section of the adapter 200 perpendicular to the plug-in direction F. The opening size of the optical path of the adapter 200 refers to the area enclosed by the outer contour of the cross section.

[0115] In the above optical signal adapter assembly 2, by reducing the size of the opening of the optical port of the adapter 200, the cross-sectional size of the rectangular waveguide formed by the waveguide structure can be reduced, that is, the size of the electromagnetic radiation leakage gap can be reduced, and the loss of high-frequency electromagnetic waves in the adapter 200 can be increased, thereby reducing the external electromagnetic interference of electronic equipment and improving the electromagnetic compatibility of electronic equipment. However, due to the limitations of optical fiber performance or standard requirements, the size of the opening of the optical port of the adapter 200 in the above optical signal adapter assembly 2 cannot be fully reduced, which ultimately results in the failure of this solution to achieve a good shielding effect.

[0116] In order to solve the above problems, in some other embodiments of the present application, in the optical signal adapter component 2, the plastic base material of the adapter 200 is doped with conductive fillers and / or magnetic fillers to increase the signal shielding effect of the adapter 200 against external electromagnetic waves. Figure 6 4(b) shows a partial enlarged view of the S1 region in some other embodiments of the present application, which illustrates the transmission path of the electromagnetic wave in the waveguide structure in the optical signal switching component 2. In some embodiments of the present application, such as Figure 6 As shown in FIG. 1 , since the connecting core 110 is made of plastic, the adapter 200 is made of plastic doped with conductive fillers and / or magnetic fillers, and the housing 300 is made of conductive material, the waveguide structure is similar to a rectangular waveguide. Furthermore, when the external electromagnetic wave enters from the end face of the adapter 200 in the first end E1 of the waveguide structure, the external electromagnetic wave travels along the rectangular waveguide. Figure 6 The total reflection is transmitted to the second end E2 of the waveguide structure in the direction of the arrow. At the same time, since the conductive particles and / or magnetic particles are added to the adapter 200, the dielectric loss and magnetic loss of the adapter 200 are increased, thereby improving the electromagnetic shielding performance and anti-interference performance of the waveguide structure.

[0117] Combination Figure 6 It is not difficult to find that in the above-mentioned optical signal adapter component 2, by reasonably designing the structure and material of the connecting core 110, the adapter 200 and the housing 300 in the connecting module 100, the signal shielding effect of the adapter 200 against external electromagnetic waves can be increased. However, doping the adapter 200 with conductive fillers and / or magnetic fillers will reduce the mechanical properties of the adapter 200. In addition, the doping ratio of the conductive fillers and / or magnetic fillers is limited, resulting in limited improvement in the shielding effect of the adapter 200, which is difficult to meet the current user's application requirements for electromagnetic shielding of the optical signal adapter component 2.

[0118] In order to solve the above problems, in some other embodiments of the present application, in the optical signal adapter 2, the connection core 110 is made of plastic material, the plastic base material of the adapter 200 is doped with conductive fillers and / or magnetic fillers, the shell 300 is made of conductive material, and a conductive layer 400 is added between the connection core 110 and the adapter 200 to fully isolate the connection core 110 from the adapter 200. The adapter 200, the conductive layer 400 and the shell 300 form a "U"-shaped waveguide structure, and the medium in the "U"-shaped waveguide structure is a plastic material filled with conductive fillers and / or magnetic fillers.

[0119] Combination Figure 6 It can be seen that the conductive layer 400 is around the transmission axis A T The adapter 200 surrounds the connecting core 110. T The outer shell 300 surrounds the transmission axis A. T The conductive layer 400 is arranged around the adapter 200. The conductive layer 400 is used as the first conductive layer, the adapter 200 is used as the dielectric layer, and the housing 300 is used as the second conductive layer to form a U-shaped waveguide structure. In other words, the U-shaped waveguide structure includes the connecting core 110, the conductive layer 400, the adapter 200 and the housing 300 in sequence from the inside to the outside along the radial direction. The radial direction is perpendicular to the transmission axis.

[0120] Based on this, the waveguide structure is a lossy waveguide structure, which changes the transmission path of the electromagnetic wave through the housing 300 and the conductive layer 400, so that the transmission path of the electromagnetic wave falls as much as possible into the area where the adapter 200 is located. In addition, by optimizing the material of the adapter 200, the loss of electromagnetic waves by the adapter 200 is increased. Based on this, the waveguide structure can increase the loss of electromagnetic waves and enhance the shielding effect.

[0121] In some embodiments of the present application, the conductive layer 400 is a film-like structure that rotates around the transmission axis. In some of the implementations, the thickness of the conductive layer 400 ranges from 1 μm to 500 μm. Among them, the thickness of the conductive layer 400 is the size of the conductive layer 400 in a direction perpendicular to the transmission axis. That is, on one side of the transmission axis, the distance between the surface of the conductive film layer 400 facing the connecting core 110 and the surface facing the adapter 200. For example, the thickness of the conductive layer 400 is any one of 1 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm and 500 μm.

[0122] In some embodiments of the present application, the thickness of the housing 300 is greater than 1 μm. The thickness of the housing 300 is the dimension of the housing 300 in a direction perpendicular to the transmission axis, that is, the distance from the outer side of the housing 300 to the surface facing the adapter 200 on one side of the transmission axis.

[0123] FIG. 7(a) shows a cross-sectional view of the optical signal adapter component 2 along the AA section in FIG. 3(c) in some other embodiments of the present application. FIG. 7(b) shows a partial enlarged view of the S1 area in FIG. 4(b) in some other embodiments of the present application, which illustrates the transmission path of the electromagnetic wave in the waveguide structure. In some embodiments of the present application, it can be seen from FIG. 7(a) and FIG. 7(b) that since the connecting core 110 is made of plastic material, the adapter 200 is made of plastic material doped with conductive fillers and / or magnetic fillers, the housing 300 is made of conductive material, and a conductive layer 400 is provided between the connecting core 110 and the adapter 200. The waveguide structure in the optical signal adapter component in this embodiment is similar to a "U"-shaped waveguide. In addition, when the external electromagnetic wave enters from the end face of the adapter 200 in the first end of the waveguide structure, the external electromagnetic wave is totally reflected in the rectangular waveguide along the direction of the arrow in FIG. 4 and transmitted to the second end of the waveguide structure. On the one hand, the electromagnetic radiation leakage gap size of the U-shaped waveguide is small, for example, d3 in Figure 7(a) and Figure 7(b) is smaller than Figure 5 In d1 and Figure 6 On the other hand, since conductive particles and / or magnetic conductive particles are added to the adapter 200, the conductivity and / or magnetic conductivity of the adapter 200 can be increased, thereby improving the electromagnetic shielding performance and anti-interference performance of the waveguide structure.

[0124] 7(a) and 7(b), it is not difficult to find that in the above-mentioned optical signal adapter component 2, the adapter 200 is designed as a composite material with electrical loss and / or magnetic loss functions, and is combined with the outer shell 300 and the conductive layer 400 to form a "U"-shaped high-loss composite waveguide structure, thereby reducing the leakage of external electromagnetic waves from the optical path of the optical signal adapter component 2, and the shielding effect is improved by more than 5dB.

[0125] The shielding performance of the optical signal switching assembly 2 corresponding to FIG. 7( a ) and FIG. 7( b ) will be described below in conjunction with the shielding effect. Figure 8 The figure shows the shielding effect of the optical signal switching scheme when it is applied to the MPO connector in some embodiments of the present application. The vertical axis represents the shielding effect percentage, 1# represents the optical signal switching scheme in which the material applicable to the MPO adapter includes conductive fillers and / or magnetic fillers, but does not include the conductive layer 400, and 2# represents the optical signal switching scheme in which the material applicable to the MPO adapter includes conductive fillers and / or magnetic fillers, and includes the conductive layer 400. Figure 8 As shown, the shielding effect of the optical signal switching solution corresponding to the 2# structure is improved by more than 50% compared with the optical signal switching solution corresponding to the 1# structure. The shielding effect of the optical signal switching solution of the "U"-shaped lossy waveguide structure in the present application is better. Based on this, the optical signal switching solution of the present application has obvious noise reduction compared with other optical signal switching solutions, which makes it easier to ensure that the optical signal switching component 2 meets the detection standards and reduces the design difficulty of the optical signal switching component 2.

[0126] In order to further improve the shielding effect of the optical signal adapter assembly 2 , conductive layers are added at both ends of the connecting core 110 to further adjust the transmission path of the electromagnetic wave in the optical signal adapter assembly 2 . Fig. 9 A partial enlarged view of the S1 region in FIG. 4( b ) is shown in some other embodiments of the present application. Fig. 9 As shown, in some other embodiments of the present application, in the optical signal adapter assembly 2, the connecting core 110 is made of plastic material, and the connecting core 110 has a first connecting end connected to the optical module and a second connecting end away from the first connecting end. A conductive layer 500 is added to the first connecting end and / or the second connecting end of the connecting core 110. The adapter 200 is made of plastic material doped with conductive fillers and / or magnetic fillers, the housing 300 is made of conductive material, and a conductive layer 400 is added between the connecting core 110 and the adapter 200.

[0127] In the above optical signal adapter 2, by adding a conductive layer 500 on the first connection end and / or the second connection end of the connection core 110, it is possible to prevent electromagnetic waves from being radiated directly from the connection core 110. Based on this, the above waveguide structure can further optimize the transmission path of the electromagnetic wave, allowing as many electromagnetic waves as possible to fall into the area where the adapter 200 is located, and further improve the loss of electromagnetic waves by the adapter 200. Based on this, the above waveguide structure can further improve the loss of electromagnetic waves, and thus can further improve the shielding effect of the optical signal adapter 2.

[0128] In some embodiments of the present application, the conductive layer 500 is a film-like structure perpendicular to the transmission axis. In some implementations, the thickness of the conductive layer 500 ranges from 1 μm to 500 μm. The thickness of the conductive layer 500 is the size of the conductive layer 500 along the transmission axis. For example, the thickness of the conductive layer 400 is any one of 1 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm and 500 μm.

[0129] The optical signal switching solution in this application will be described in detail below in conjunction with specific scenarios.

[0130] Application Scenario 1

[0131] The optical signal switching between the first optical fiber 1c and the second optical fiber 1d will be taken as an example below to describe in detail the optical signal switching solution in the present application in conjunction with the accompanying drawings.

[0132] Fig. 10(a) shows an exploded view of the optical signal switching system S2 in some embodiments of the present application. Fig. 10(b) shows a stereoscopic view of the optical signal switching system S2 in Fig. 10(a).

[0133] In combination with FIG. 10(a) and FIG. 10(b), it can be seen that in some embodiments of the present application, the optical signal switching system S2 includes a first optical fiber 1c, a second optical fiber 1d, and an optical signal switching component 2, and the optical signal switching component 2 is used to achieve the switching of optical signals between the first optical fiber 1c and the second optical fiber 1d. The optical signal switching component 2 includes a first connector 100c, a second connector 100d, an adapter 200, and a housing 300.

[0134] The first connector 100c includes a first ferrule 110c, and a first fiber hole (not shown) is provided on the first ferrule 110c. The first fiber hole extends along a first plugging direction F3 of the first ferrule 110c and penetrates the first ferrule 110c. The first plugging direction F3 refers to the direction in which the first ferrule 110c is plugged into the adapter 200. The first optical fiber 1c is installed in the first fiber hole, and the first optical fiber 1c extends out of the first fiber hole from the first ferrule 110c in the opposite direction of the first plugging direction F3.

[0135] Similarly, the second connector 100d includes a second ferrule 110d, and a second fiber hole (not shown) is provided on the second ferrule 110d. The second fiber hole extends along the second plugging direction F4 of the second ferrule 110d and penetrates the second ferrule 110d. The second plugging direction F4 refers to the direction in which the second ferrule 110d is plugged into the adapter 200. The second optical fiber 1d is installed in the second fiber hole, and the second optical fiber 1d extends from the second ferrule 110d to the second fiber hole in the opposite direction of the second plugging direction F4.

[0136] The adapter 200 is provided with a first slot (not marked) for inserting the first ferrule 110 c and a second slot (not marked) for inserting the second ferrule 110 d , and the first inserting slot is communicated with the second inserting slot.

[0137] The housing 300 is formed with an installation channel (not shown), and the first connector 100c, the second connector 100d and the adapter 200 are installed in the installation channel, and the first optical fiber 1c extends from the first connector 100c to the outside of the housing 300 along the installation channel, and the second optical fiber 1d extends from the second connector 100d to the outside of the housing 300 along the installation channel.

[0138] In some embodiments of the present application, as shown in FIG. 10( a) and FIG. 10( b), the housing 300 may include a first housing 310 and a second housing 320. The first housing 310 and the second housing 320 together form an installation channel. In the above-mentioned optical signal switching system S2, the housing 100 is a split design, which is convenient for installation in the inner cavity components, reducing the design difficulty and assembly difficulty of the optical signal switching system S2. In some other embodiments of the present application, the housing 300 may also be an integrally formed structure, and the installation channel runs through the housing 300. In the above-mentioned optical signal switching system S2, the number of housings 300 is only one, which reduces the number of components in the system and improves the mechanical performance. For ease of understanding, the following description will be taken as an example in which the housing 300 includes a first housing 310 and a second housing 320.

[0139] Since the optical signal switching scheme between the adapter 200 and the first connector 100c is similar in principle to the optical signal switching scheme between the adapter 200 and the second connector 100d, the optical signal switching scheme between the adapter 200 and the first connector 100c will be described as an example.

[0140] Figure 11(a) shows a cross-sectional view of the optical signal switching assembly 2 along the CC section in Figure 10(b) in some embodiments of the present application. Figure 11(b) shows a cross-sectional view of the optical signal switching assembly 2 along the DD section in Figure 10(b) in some embodiments of the present application.

[0141] In combination with Figure 11(a) and Figure 11(b), it can be seen that in some embodiments of the present application, the optical signal adapter component 2 also includes a conductive layer 400. A first optical fiber hole extending along the first plug-in direction F3 is provided on the first connecting core 110c, and the first optical fiber 1c is inserted into the first optical fiber hole. The conductive layer 400 is arranged around the first connecting core 110c around the first axis, wherein the first axis is parallel to the first plug-in direction F3. The material of the adapter 200 includes conductive fillers and / or magnetic fillers, and the adapter 200 is arranged around the conductive layer 400 around the first axis. The housing 300 is arranged around the adapter 200 around the first axis. The housing 300 is made of a conductive material, such as a metal material.

[0142] In some embodiments of the present application, there is no gap between the housing 300 and the adapter 200, between the adapter 200 and the conductive layer 400, and between the conductive layer 400 and the first connecting core 110c, that is, the relative surfaces of these components abut or connect to each other, and the present application does not make any specific limitation on this.

[0143] In some other embodiments of the present application, a gap is formed between at least one of the relative positions of the housing 300 and the adapter 200, the relative positions of the adapter 200 and the conductive layer 400, and the relative positions of the conductive layer 400 and the first connecting core 110c. It can be understood that under the condition that the housing 300, the adapter 200, the conductive layer 400 and the first connecting core 110c are relatively fixed, any form of assembly scheme of the housing 300, the adapter 200, the conductive layer 400 and the first connecting core 110c is within the protection scope of the present application, and the present application does not make any specific limitation on this.

[0144] It is understood that Figures 11(a) and 11(b) are only schematic diagrams of the outlines of the components in the optical signal switching system S2 of the present application, and do not represent the actual outlines of the components in the optical signal switching system S2. Other outlines of the components designed according to design requirements are also within the scope of protection of the present application, and the present application does not make specific limitations on this.

[0145] FIG. 11(c) shows a partial enlarged view of the S2 region in FIG. 11(b) in some embodiments of the present application, which illustrates the transmission path of the electromagnetic wave in the waveguide structure. In some embodiments of the present application, as shown in FIG. 11(c), since the first connecting core 110c in the first connector 100c is made of plastic material, the adapter 200 is made of plastic material doped with conductive fillers and / or magnetic fillers, the housing 300 is made of conductive material, and a conductive layer 400 is provided between the first connecting core 110c in the first connector 100c and the first adapter 200. The waveguide structure in the optical signal adapter assembly 2 in this embodiment is similar to forming a "U"-shaped waveguide. Moreover, when the external electromagnetic wave enters from the end face of the adapter 200 in the first end E1 of the waveguide structure, the external electromagnetic wave is totally reflected in the rectangular waveguide along the direction of the arrow in FIG. 4 and transmitted to the second end E2 of the waveguide structure. On the one hand, the electromagnetic radiation leakage gap size of the "U"-shaped waveguide is small. On the other hand, since conductive particles and / or magnetic particles are added to the adapter 200, the conductivity and / or magnetic conductivity of the adapter 200 can be increased, thereby improving the electromagnetic shielding performance and anti-interference performance of the waveguide structure, that is, improving the electromagnetic shielding performance and anti-interference performance of the optical signal switching system S2.

[0146] The material of the adapter 200 will be briefly introduced below.

[0147] In some embodiments of the present application, the conductive filler includes but is not limited to at least one of carbon fiber, nickel carbon fiber, metal conductive particles, metal conductive fibers, carbon black, graphite and carbon nanotubes.

[0148] In some embodiments of the present application, the magnetic conductive filler includes but is not limited to at least one of ferrite, iron powder, nickel iron powder, nickel zinc ferrite, hydroxy iron and magnetic ceramics.

[0149] In some embodiments of the present application, the mass doping ratio of the conductive filler and / or the magnetic filler is in the range of 0.5% to 40%. It can be understood that in the present application, the mass doping ratio of the conductive filler and / or the magnetic filler refers to the ratio of the cumulative weight of the conductive filler and / or the magnetic filler to the total mass of the adapter 200. Among them, the total weight of the adapter 200 refers to the sum of the mass of the conductive filler and / or the magnetic filler and the plastic base material.

[0150] In some of the implementations, in the adapter 200, the mass doping ratio of the conductive filler and / or the magnetic filler can range from 0.5%, 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 12.5%, 15%, 17.5%, 20%, 22.5%, 25%, 27.5%, 30%, 32.5%, 35%, 37.5% and 40%.

[0151] It is understood that the mass doping ratio of the conductive filler and / or magnetic filler in the above adapter 200 only shows part of the implementation. The mass doping ratio of the conductive filler and / or magnetic filler in a specific application scenario needs to be determined according to the actual situation, and this application does not make specific restrictions on this.

[0152] In some embodiments of the present application, both conductive fillers and magnetic fillers can be used as additives to improve the electromagnetic properties of plastics. The doping methods of conductive fillers and magnetic fillers in plastic base materials are basically the same, and the doping method of conductive fillers in plastic base materials will be described below as an example.

[0153] In some of the implementations, the conductive filler and the plastic base material are directly mixed according to a preset mass doping ratio.

[0154] In some other alternative implementations, the conductive filler and the plastic base material are mixed by a surface treatment method according to a preset mass doping ratio. For example, the conductive filler includes electronic grade fillers, such as nanosilver, carbon nanotubes, etc. The surface of the conductive filler is subjected to surface modification treatment (such as carboxylation, silanization, etc.), and then the surface-modified conductive filler and the plastic base material are mixed according to a preset mass doping ratio. The above doping method makes the conductive filler more compatible with the plastic base material and enhances the dispersion performance of the conductive filler in the plastic base material.

[0155] It is worth noting that different filler doping methods are suitable for different filler types and electromagnetic performance indicators to be achieved, and adaptive selection is required. In addition, strict control of the mixing ratio and process parameters during doping can ensure that the final composite material meets the specified electromagnetic performance requirements.

[0156] After describing the material of the adapter 200 , the specific implementation of the housing 300 will be briefly introduced below.

[0157] Fig.12 Schematic diagram of the housing 300 in some embodiments of the present application is shown. Fig.12 As shown, the housing 300 is formed with a mounting channel C2 that penetrates the housing along the plugging direction.

[0158] After describing the specific implementation scheme of the housing 300 in the optical signal switching system S2, several layout schemes of the conductive layer 400 will be described in detail with reference to the accompanying drawings.

[0159] In some embodiments of the present application, the conductive layer 400 is formed on one of the two surfaces of the first ferrule 110 c and the adapter 200 that are opposite to each other. Fig.13 FIG. 4 is a schematic diagram showing a conductive layer 400 formed on the first ferrule 110c in some embodiments of the present application. Fig.13As shown, the conductive layer 400 is formed on the surface of the first ferrule 110 c facing the adapter 200 . Fig.14 FIG. 4 is a schematic diagram showing a conductive layer 400 formed on an adapter 200 in some embodiments of the present application. Fig.14 As shown, the conductive layer 400 is formed on the surface of the adapter 200 facing the first ferrule 110 c.

[0160] In some embodiments of the present application, the conductive layer 400 includes a first sub-conductive layer 410 and a second sub-conductive layer 420. In addition, the first sub-conductive layer 410 and the second sub-conductive layer 420 cooperate with each other to surround the first ferrule 110c around the first axis.

[0161] Fig.15 FIG16( a ) shows a schematic diagram of a first sub-conductive layer 410 formed on a ferrule 110 c in some other embodiments of the present application. FIG16( b ) shows a schematic diagram of a second sub-conductive layer 420 formed on an adapter 200 in some other embodiments of the present application. Figure 15 to Figure 16(b) It can be seen that the first sub-conductive layer 410 and the second sub-conductive layer 420 cooperate to surround the first axis and are arranged around the first core 110c. The first sub-conductive layer 410 is formed on the surface of the first core 110c facing the adapter 200, and the second sub-conductive layer 420 is formed on the surface of the adapter 200 facing the first core 110c. The orthographic projections of the first sub-conductive layer 410 and the second conductive layer 420 on the surface of the first core 110c facing the adapter 200 at least partially do not overlap. Among them, the orthographic projection refers to a projection of a part along the normal direction of the projection surface. It is worth noting that when the projection surfaces are not in the same plane, the normal direction of the projection surfaces that are not in the same plane changes. This will not be elaborated below.

[0162] It can be understood that the structures of the first sub-conductive layer 410 and the second sub-conductive layer 420 in the above Figures 16(a) and 16(b) are only partial examples of the implementation methods of the present application. Other forms of the first sub-conductive layer 410 and the second sub-conductive layer 420 are also within the scope of protection of the present application and will not be described one by one here.

[0163] Fig.17 FIG18(a) shows a schematic diagram of a first sub-conductive layer 410 formed on a ferrule 110c in some other embodiments of the present application. FIG18(b) shows a schematic diagram of a second sub-conductive layer 420 formed on an adapter 200 in some other embodiments of the present application. Figure 17 to Figure 18(b)It can be seen that the first sub-conductive layer 410 is formed on the surface of the first ferrule 110c facing the adapter 200, and the second sub-conductive layer 420 is formed on the surface of the adapter 200 facing the first ferrule 110c. The orthographic projections of the first sub-conductive layer 410 and the second conductive layer 420 on the surface of the first ferrule 110c facing the adapter 200 at least partially overlap.

[0164] It can be understood that the structures of the first sub-conductive layer 410 and the second sub-conductive layer 420 in the above Figures 18(a) and 18(b) are only partial examples of the implementation methods of the present application. Other forms of the first sub-conductive layer 410 and the second sub-conductive layer 420 are also within the scope of protection of the present application and will not be described one by one here.

[0165] After describing the layout of the conductive layer 400 , the specific forming method of the conductive layer 400 will be briefly introduced below.

[0166] In some embodiments of the present application, the conductive layer 400 may include a metal film layer. The metal film layer may include at least one of an aluminum film layer, an iron film layer, a copper film layer, and a gold film layer. In the above optical signal switching system S2, the conductive layer 400 is a metal film layer, which has good conductivity, stability, and anti-oxidation performance, and is suitable for electronic components, optical devices, and other fields.

[0167] In some embodiments of the present application, when the conductive layer 400 is a metal film layer, the metal film layer can be formed by electroplating the metal film layer on the surface of the adapter or the connecting core. The electroplating process of the metal film layer can include the following steps:

[0168] Substrate pretreatment: The substrate can be an adapter or a connecting core. First, the substrate surface is polished, cleaned, pickled, etc. to remove surface oxides, grease and other impurities.

[0169] Electroplating activation / pretreatment: In some of these implementations, the substrate is subjected to electroplating activation / pretreatment to improve the adhesion between the substrate surface and the metal material.

[0170] Electroplating: Place the pretreated substrate into the electroplating tank, put the anode of the metal material and the cathode of the substrate together, and through electrolysis, the metal ions are deposited into a film on the surface of the substrate.

[0171] Deionized water rinse. After electroplating is completed, the substrate is rinsed with deionized water to remove the electrolyte and other impurities remaining on the substrate surface during the electroplating process.

[0172] Drying: Dry the rinsed substrate to remove moisture.

[0173] The above-mentioned forming method of the metal film layer is only one of the implementation modes, and the process conditions of different electroplating materials may be different. In addition, the surface of the metal film layer exposed to the outside may also be subjected to anodizing, spraying and other processes, which are not specifically limited in this application.

[0174] In some other embodiments of the present application, when the conductive layer 400 is a metal film layer, the metal film layer can also be formed by first forming a metal sheet, bending the metal sheet, and attaching the bent metal sheet to the surface of the adapter or the connecting core. For example, the bent metal sheet is attached to the surface of the adapter or the connecting core by a conductive tape.

[0175] In some other embodiments of the present application, when the conductive layer 400 is a metal film layer, the forming method of the metal film layer can also be to first form a metal sheet, bend the metal sheet to form a specific shape, and clamp the metal sheet of the specific shape to the surface of the adapter 200 or the first core 110c.

[0176] In some other embodiments of the present application, the conductive layer 400 may include an inorganic oxide film layer with good conductivity. For example, the conductive layer 400 may include at least one of an indium tin oxide film layer and a zinc oxide film layer.

[0177] In some other embodiments of the present application, the conductive layer 400 may include a conductive polymer film layer. The conductive polymer film layer may include a polyethylene terephthalate (PEDOT) film layer and / or a polyaniline (PANI) film layer. In the above optical signal switching system S2, the conductive polymer film layer has shape plasticity, which reduces the difficulty of forming the conductive layer 400.

[0178] In some other embodiments of the present application, the conductive layer 400 may include a graphene film layer. In the above optical signal switching system S2, the conductive layer 400 is a graphene film layer, which has good electrical conductivity, strength and thermal conductivity, and is suitable for high-performance electronic components, sensors and other fields.

[0179] It is understandable that the conductive layers at other positions in the present application may also be formed using the aforementioned forming scheme of the conductive layer 400 , which will not be described repeatedly below.

[0180] After describing the specific forming method of the conductive layer 400 , several layout schemes of the conductive layer 500 will be described in detail with reference to the accompanying drawings.

[0181] Fig.19A cross-sectional view of the optical signal switching assembly 2 in some embodiments of the present application along the DD section in FIG. 10( b ) is shown, wherein the first ferrule 110 c is not shown. In some implementations, the DD section in FIG. 10( b ) passes through the conductive layer 500 , and in some other alternative implementations, the DD section in FIG. 10( b ) does not pass through the conductive layer 500 .

[0182] FIG20(a) shows a partial enlarged view of the S2 region in FIG11(b) in some embodiments of the present application, which illustrates the transmission path of electromagnetic waves W1 and W2 in the waveguide structure. As shown in FIG20(a), the optical signal adapter assembly 2 includes a conductive layer 500, and the conductive layer 500 is disposed at the first end of the first ferrule 110c. According to FIG20(a), it is not difficult to find that the conductive layer 500 blocks the passage of the electromagnetic wave W2 into the first ferrule 110c, so that the electromagnetic wave W2 needs to bypass the conductive layer 500 to enter the adapter 200 between the conductive layer 400 and the housing 300.

[0183] Based on this, in the above-mentioned optical signal switching system S2, the optical signal switching component 2 can further optimize the transmission path of the electromagnetic wave, increase the number of electromagnetic waves entering the adapter 200, further improve the loss of electromagnetic waves by the optical signal switching component 2, and further improve the shielding effect of the optical signal switching component 2 on electromagnetic waves.

[0184] In some embodiments of the present application, the conductor layer 500 extends along the second direction to seal and fit with the surface of the conductive layer, so that the first end of the connecting core 110 in the waveguide structure is isolated from the second end, so as to block the transmission path of the electromagnetic wave from the first end to the second end of the connecting core 110. The second direction intersects with the plugging direction.

[0185] FIG20(b) shows a partial enlarged view of the S2 region in FIG11(b) in some other embodiments of the present application, which illustrates the transmission path of the electromagnetic waves W1 and W2 in the waveguide structure. As shown in FIG20(b), the optical signal adapter component 2 includes a conductive layer 500, and the conductive layer 500 is disposed at the second end of the first ferrule 110c. According to FIG20(b), it is not difficult to find that after the electromagnetic wave W2 enters the first ferrule 110c, the conductive layer 500 blocks the passage of the electromagnetic wave W2 passing through the ferrule 110c, so that the electromagnetic wave W2 needs to bypass the conductive layer 500 and the conductive layer 400 and enter the adapter 200 between the conductive layer 400 and the housing 300.

[0186] FIG20(c) shows a partial enlarged view of the S2 region in FIG11(b) in some other embodiments of the present application, which illustrates the transmission path of the electromagnetic waves W1 and W2 in the waveguide structure. As shown in FIG20(c), the optical signal switching component 2 includes a conductive layer 500, and the conductive layer 500 includes a third sub-conductive layer 510 and a fourth sub-conductive layer 520. The third sub-conductive layer 510 is provided at the first end of the first ferrule 110c, and the fourth sub-conductive layer 520 is provided at the second end of the first ferrule 110c.

[0187] It can be understood that Figures 20(a), 20(b) and 20(c) show the layout schemes of the conductive layer in some implementation methods of the present application. Other technical solutions of the conductive layer 500 that can block the electromagnetic wave W2 are also within the scope of protection of the present application and will not be described one by one here.

[0188] The present application also provides a core plug, which is provided with a fiber hole extending along a first plugging direction, and the optical fiber can be inserted into the fiber hole along the first direction. In addition, a conductive layer is formed on the outer surface of the core plug.

[0189] In some embodiments of the present application, in the present application, the conductive layer on the outer surface of the insert is at least partially arranged around the insert around the first axis, wherein the first axis is parallel to the first plugging direction.

[0190] The present application also provides a connection structure, which includes any one of the above-mentioned plugs, and a conductive layer is formed on the outer surface of the plug, which will not be described in detail here.

[0191] In some embodiments of the present application, the connection structure corresponds to at least one of a multi-purpose push-pull connector, a square connector, a standard connector, and an active optical cable connector.

[0192] The present application also provides a switching structure, which includes any of the above-mentioned adapters and a conductive layer. The material of the adapter includes conductive fillers and / or magnetic fillers, and the adapter is arranged around the conductive layer around the first axis. In some implementations, the conductive layer is arranged in a ring around the first axis.

[0193] In some embodiments of the present application, the adapter structure includes an adapter adapted to at least one of a multi-purpose push-pull connector, a square connector, a standard connector, and an active optical cable connector.

[0194] In some embodiments of the present application, in the transition structure, the conductive filler includes but is not limited to at least one of carbon fiber, nickel carbon fiber, metal conductive particles, metal conductive fibers, carbon black, graphite, and carbon nanotubes.

[0195] In some embodiments of the present application, in the transition structure, the magnetic conductive filler includes but is not limited to at least one of ferrite, iron powder, nickel-iron powder, nickel-zinc ferrite, hydroxy iron and magnetic ceramics.

[0196] The present application also provides a connection structure, the adapter structure includes any one of the above adapters and a conductive layer. The material includes conductive fillers and / or magnetic fillers, and the adapter is provided with a slot extending along a direction, and the slot is used for the core to adapt. The conductive layer is at least partially arranged around the adapter around a first axis, wherein the first axis is parallel to the first direction. In some implementations, the conductive layer is arranged in a ring around the first axis.

[0197] In some embodiments of the present application, in the transition structure, the conductive filler includes but is not limited to at least one of carbon fiber, nickel carbon fiber, metal conductive particles, metal conductive fibers, carbon black, graphite, and carbon nanotubes.

[0198] In some embodiments of the present application, in the transition structure, the magnetic conductive filler includes but is not limited to at least one of ferrite, iron powder, nickel-iron powder, nickel-zinc ferrite, hydroxy iron and magnetic ceramics.

[0199] The present application also provides an optical signal switching system S2, which includes at least one of the above-mentioned optical signal switching components 2 and two optical modules, wherein the two optical modules implement optical signal switching through the optical switching component 2.

[0200] The present application also provides an electronic device, which includes any of the above-mentioned optical signal switching systems S2. It can be understood that the electronic device can be an optical switch, an optical terminal, an optical router, an optical fiber transceiver, an optical transmission network and other types of optical communication equipment.

[0201] Application Scenario 2

[0202] Fig.21 FIG. 10( b ) shows a cross-sectional view of an optical signal switching assembly 2 ′ along the CC cross section in some embodiments of the present application. Fig.21 Compared with FIG. 11( a ), it can be seen that the optical signal adapter assembly 2 ′ in application scenario 2 is different from the optical signal adapter assembly 2 in application scenario 1 in that the optical signal adapter assembly 2 ′ does not include a housing 300, but a conductive layer 600 is added to the surface of the side of the adapter 200 facing away from the first ferrule 110 c. The conductive layer 400 is used as the first conductive layer, the adapter 200 is used as the dielectric layer, and the conductive layer 600 is used as the second conductive layer to form a U-shaped waveguide structure.

[0203] In some embodiments of the present application, the conductive layer 600 is a film-like structure that rotates around the transmission axis. In some of the implementations, the thickness of the conductive layer 600 ranges from 1 μm to 500 μm. Among them, the thickness of the conductive layer 600 is the size of the conductive layer 600 in the direction perpendicular to the transmission axis. That is, on one side of the transmission axis, the distance between the surface of the conductive film layer 600 facing the adapter 200 and the surface facing away from the connector 200. For example, the thickness of the conductive layer 600 is any one of 1 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm and 500 μm.

[0204] Fig. 22 FIG. 2 shows a schematic diagram of a conductive layer 600 formed on an adapter 200 in an optical signal switching system 2' in some embodiments of the present application. Fig. 22 As shown, the conductive layer 500 is formed on the surface of the adapter 200 facing away from the first ferrule 110 c .

[0205] The present application also provides a core insert, please refer to the core insert in application scenario 1 for details, which will not be described in detail here.

[0206] The present application also provides a connection structure, please refer to the connection structure in application scenario 1 for details, which will not be described here.

[0207] The present application also provides a switching structure. Please refer to the switching structure in application scenario 1 for details, which will not be described in detail here.

[0208] The present application also provides an optical signal switching system. Please refer to the optical signal switching system in application scenario 1 for details, which will not be described in detail here.

[0209] The present application also provides an electronic device, please refer to the electronic device in application scenario 1 for details, which will not be described in detail here.

[0210] Application Scenario 3

[0211] Fig.23 FIG. 10( a ) and FIG. 11( b ) show a cross-sectional view of an optical signal switching assembly 2 ″ along the CC cross section in some embodiments of the present application. Fig.23 By comparing them respectively, it can be known that the optical signal adapter component 2 ″ in application scenario 3 is a fusion of the optical signal adapter component 2 in application scenario 1 and the optical signal adapter component 2 ′ in application scenario 2. That is, the optical signal adapter component 2 ″ includes both the housing 300 and the conductive layer 600 .

[0212] Figure 24(a) shows a schematic diagram of the housing 300 in the optical signal adapter component 2" in some embodiments of the present application. As shown in Figure 24(a), the housing 300 is formed with a mounting channel C2 that penetrates the housing along the plug-in direction. Figure 24(b) shows a schematic diagram of the conductive layer 600 formed on the adapter 200 in the optical signal adapter component 2" in some embodiments of the present application. As shown in Figure 24(b), the conductive layer 500 is formed on the surface of the adapter 200 on the side facing away from the first connecting core 110c.

[0213] The present application also provides a core insert, please refer to the core insert in application scenario 1 for details, which will not be described in detail here.

[0214] The present application also provides a connection structure, please refer to the connection structure in application scenario 1 for details, which will not be described here.

[0215] The present application also provides a switching structure. Please refer to the switching structure in application scenario 1 for details, which will not be described in detail here.

[0216] The present application also provides an optical signal switching system. Please refer to the optical signal switching system in application scenario 1 for details, which will not be described in detail here.

[0217] The present application also provides an electronic device, please refer to the electronic device in application scenario 1 for details, which will not be described in detail here.

[0218] Application Scenario 4

[0219] Fig.25 A stereoscopic diagram of an optical signal switching system S1 in some embodiments of the present application is shown. Fig.26 It shows that the optical signal switching system S1 in some embodiments of the present application is connected along Fig.25 Cross-sectional view of section EE in FIG. Fig. 27 Shows Fig.26 A partial enlarged view of the S3 region. Fig. 27 As can be seen from the comparison with FIG. 20( a ), FIG. 20 ( b ) and FIG. 20 ( c ), the optical signal switching system S1 in the application scenario 4 corresponds to an optical signal switching solution between the optical module 1 a and the optical fiber (not shown).

[0220] The difference from application scenario 1, application scenario 2 and application scenario 3 is that the scheme of the conductive layer 500 in application scenario 4 can be adjusted. For example, in the optical signal switching system S1, the optical device 100a in the optical signal switching component 2 is made of a conductor material, that is, the optical device 100a is a conductive structure 700, and the surfaces opposite to the conductive layer 400 are closely attached to each other. It can be understood that the conductive structure 700 can be used as a conductive layer 500 to achieve a blocking effect on the electromagnetic wave W2. According to Fig. 27It is not difficult to find that after the electromagnetic wave W2 enters the first core 110c, the conductive structure 700 blocks the channel for the electromagnetic wave W2 to pass through the optical device 100a, so that the electromagnetic wave W2 needs to bypass the conductive structure 700 and the conductive layer 400 and enter the adapter 200 between the conductive layer 400 and the shell 300.

[0221] It is understood that in some embodiments of the present application, when the optical signal switching assembly 2 includes the conductive structure 700, the conductor layer 400 may not be provided, and the conductive structure 700 can achieve the function of the conductor layer 400. This will not be described in detail here.

[0222] The present application also provides an optical device, wherein the optical device is made of a conductive material.

[0223] The present application also provides a connection structure, comprising any one of the aforementioned optical devices.

[0224] The present application also provides a switching structure. Please refer to the switching structure in application scenario 1 for details, which will not be described in detail here.

[0225] The present application also provides an optical signal switching system. Please refer to the optical signal switching system in application scenario 1 for details, which will not be described in detail here.

[0226] The present application also provides an electronic device, please refer to the electronic device in application scenario 1 for details, which will not be described in detail here.

[0227] It should be noted that, in this specification, similar numbers and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0228] The above is a description of the implementation mode of the present application by specific specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation mode. On the contrary, the purpose of introducing the application in conjunction with the implementation mode is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, the following description will include many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0229] In the description of the present application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "outside", "inside", "circumferential", "radial", "axial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0230] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "setting", "installation", "connection" and "fitting" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0231] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. An optical signal switching component, characterized in that: The optical signal adapter assembly is used to connect the first optical module to the second optical module to realize the transmission of the optical signal from the first optical module to the second optical module. The optical signal adapter assembly includes: A connecting core, the connecting core being used to connect with the first optical module; A first conductive layer, wherein the first conductive layer is disposed around the connecting core around a transmission axis, wherein the transmission axis is parallel to a transmission direction of the optical signal; An adapter, wherein the material of the adapter includes conductive filler and / or magnetic filler, and the adapter is arranged around the first conductive layer around the transmission axis; A second conductive layer is disposed around the adapter around the transmission axis.

2. The optical signal switching assembly according to claim 1, characterized in that: The first conductive layer is formed on one of two surfaces of the connecting core and the adapter that are opposite to each other.

3. The optical signal switching assembly according to claim 1 or 2, characterized in that: The mass doping ratio of the conductive filler and / or the magnetic conductive filler is in the range of 0.5% to 40%.

4. The optical signal switching assembly according to any one of claims 1 to 3, characterized in that: The first conductive layer is a film-like structure rotating around the transmission axis; and / or the second conductive layer is a film-like structure rotating around the transmission axis.

5. The optical signal switching assembly according to claim 1, characterized in that: The first conductive layer includes a first sub-conductive layer and a second sub-conductive layer, and the first sub-conductive layer and the second sub-conductive layer cooperate with each other to surround the transmission axis and surround the connecting core; The first sub-conductive layer is formed on a surface of the connecting core facing the adapter, and the second sub-conductive layer is formed on a surface of the adapter facing the connecting core.

6. The optical signal switching assembly according to any one of claims 1 to 5, characterized in that: The second conductive layer is formed on a surface of the adapter facing away from the connecting core.

7. The optical signal switching assembly according to any one of claims 1 to 5, characterized in that: The optical signal switching assembly further includes a conductive shell, and the conductive shell is the second conductive layer.

8. The optical signal switching assembly according to any one of claims 1 to 5, characterized in that: The optical signal adapter assembly comprises a conductive housing, wherein the connecting core, the first conductive layer, the adapter and the second conductive layer are located in the conductive housing; The second conductive layer includes a third sub-conductive layer and a fourth sub-conductive layer, and the third sub-conductive layer and the fourth sub-conductive layer cooperate with each other to surround the transmission axis and surround the adapter; The third sub-conductive layer is formed on the surface of the adapter, and the fourth sub-conductive layer is formed on the surface of the conductive shell.

9. The optical signal switching assembly according to any one of claims 1 to 8, characterized in that: The conductive filler includes at least one of carbon fiber, nickel carbon fiber, metal conductive particles, metal conductive fiber, carbon black, graphite, and carbon nanotubes.

10. The optical signal switching assembly according to any one of claims 1 to 9, characterized in that: The magnetic conductive filler includes at least one of ferrite, iron powder, nickel iron powder, nickel zinc ferrite, hydroxy iron and magnetic ceramics.

11. The optical signal switching assembly according to any one of claims 1 to 10, characterized in that: Two surfaces of the connecting core and the first conductive layer facing each other are sealed and adhered to each other, and the connecting core is made of conductive material.

12. The optical signal switching assembly according to any one of claims 1 to 10, characterized in that: The optical signal switching assembly further includes a third conductive layer, which is disposed on the connecting core and extends along the intersection direction of the transmission axis to be sealed and fitted with the surface of the first conductive layer.

13. A connection structure, characterized in that: The connection structure comprises: A connecting core, the connecting core being used to connect with the optical module; A fourth conductive layer is at least partially disposed around the connecting core around a transmission axis, wherein the transmission axis is parallel to a transmission direction of the optical signal.

14. The connection structure according to claim 13, characterized in that: The connection structure includes at least one of a multi-purpose push-pull connector, a square connector, a standard connector, and an active optical cable connector.

15. A switching structure, characterized in that: The switching structure comprises: a fifth conductive layer, the fifth conductive layer being arranged in a ring around a transmission axis, wherein the transmission axis is parallel to a transmission direction of the optical signal; The adapter is made of conductive filler and / or magnetic filler, and is disposed around the first axis and around the fifth conductive layer.

16. The switching structure according to claim 15, characterized in that: The conductive filler includes at least one of carbon fiber, nickel carbon fiber, metal conductive particles, metal conductive fiber, carbon black, graphite, and carbon nanotubes.

17. The switching structure according to claim 15 or 16, characterized in that: The magnetic conductive filler includes at least one of ferrite, iron powder, nickel iron powder, nickel zinc ferrite, hydroxy iron and magnetic ceramics.

18. A switching structure, characterized in that: The switching structure comprises: An adapter, the adapter comprising a conductive filler and / or a magnetic filler, the adapter being provided with a slot for plugging in a connecting core, and the slot extending along a transmission direction of an optical signal; A sixth conductive layer is at least partially disposed around the adapter around a transmission axis, wherein the transmission axis is parallel to a transmission direction of the optical signal.

19. The switching structure according to claim 18, characterized in that: The conductive filler includes at least one of carbon fiber, nickel carbon fiber, metal conductive particles, metal conductive fiber, carbon black, graphite, and carbon nanotubes.

20. The switching structure according to claim 18 or 19, characterized in that: The magnetic conductive filler includes at least one of ferrite, iron powder, nickel iron powder, nickel zinc ferrite, hydroxy iron and magnetic ceramics.

21. An optical signal switching system, characterized in that: The optical signal switching system comprises the optical signal switching assembly according to any one of claims 1 to 12, a first optical module and a second optical module, wherein the first optical module and the optical module implement optical signal switching through the optical switching assembly.

22. An electronic device, characterized in that: The electronic device comprises the optical signal switching system according to claim 20.

Images