Divergent uniform liquid cooling device and server

Abstract

The invention discloses a divergent uniform liquid cooling device and a server, the divergent uniform liquid cooling device comprises a first liquid cooling layer, a second liquid cooling layer, a liquid inlet part and a liquid outlet part, the first liquid cooling layer is provided with a plurality of first direct current channels, and the first direct current channels are used for conveying, so that the flowing pressure drop can be reduced, and the conveying energy consumption of cooling liquid is reduced; the second liquid cooling layer is provided with at least one rotational flow cooling channel, at least part of the first direct flow channel is communicated with the rotational flow cooling channel, a plurality of rotatable flow deflectors are arranged in the rotational flow cooling channel, cooling liquid is diffused to the periphery under the action of the flow deflectors, and heat dissipation can be enhanced. The rotational flow cooling channel is arranged in the area of high-power components such as a chip to strengthen heat transfer, the first direct current channel is adopted in the area of other low-power components on the mainboard to convey cooling liquid in a low-resistance mode, the advantages of heat dissipation strengthening of the rotational flow cooling channel and low-resistance conveying of the first direct current channel can be brought into play, refined efficient heat dissipation and rapid conveying heat dissipation are achieved, and heat dissipation efficiency is improved. Therefore, high-efficiency low-resistance heat dissipation of the high-power server is promoted.

Description

Technical Field

[0001] The present application relates to the technical field of heat exchangers, and in particular to a divergent uniform liquid cooling device and a server. Background Art

[0002] With the rapid development of modern information technologies such as AI and big data, the computing power and scale (energy consumption) of data centers have increased dramatically at an average annual rate of 15-20%. While increasing computing power, reducing the energy consumption of data centers, maximizing the utilization of energy in data centers, and improving the computing efficiency of data centers will be the new direction for the construction and operation of green data centers in the future. In the total energy consumption of data centers, 90% of the energy consumption, except for IT equipment, comes from the preparation, storage and transportation of heat dissipation cooling media. As the CPU size becomes smaller and the power becomes larger, the power (heat flow) density becomes larger, and the temperature distribution of servers in data centers is extremely uneven, showing the phenomenon of high center temperature and low edge temperature, and the center temperature control is difficult. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a divergent uniform liquid cooling device that can achieve refined and efficient heat dissipation and rapid heat dissipation, and achieve efficient and low-resistance heat dissipation.

[0004] The present application also proposes a server using the above-mentioned divergent uniform liquid cooling device.

[0005] According to the first aspect of the present application, the divergent uniform liquid cooling device comprises:

[0006] a first liquid cooling layer, the first liquid cooling layer being used to cool the first power component, the first liquid cooling layer being provided with a plurality of first direct current channels;

[0007] a second liquid cooling layer, the second liquid cooling layer being used to cool the second power component, the second liquid cooling layer being provided with at least one swirl cooling channel, at least part of the first direct flow channel being connected to the swirl cooling channel, and a plurality of rotatable guide vanes being provided in the swirl cooling channel;

[0008] a liquid inlet portion, the liquid inlet portion being connected to the direct current channel;

[0009] A liquid outlet portion is connected to the straight flow channel and the swirl cooling channel.

[0010] According to the divergent uniform liquid cooling device of the first aspect of the present application, there are at least the following beneficial effects: the divergent uniform liquid cooling device of the present application comprises a first liquid cooling layer, a second liquid cooling layer, a liquid inlet and a liquid outlet, the first liquid cooling layer is provided with a plurality of first direct current channels, and the flow pressure drop can be reduced by transporting through the first direct current channels, thereby reducing the transport energy consumption of the coolant. The second liquid cooling layer is provided with at least one swirl cooling channel, at least part of the first direct current channels are connected to the swirl cooling channel, and a plurality of rotatable guide vanes are provided in the swirl cooling channel, and the coolant is diverged to the surroundings under the action of the guide vanes, which can enhance the heat dissipation. The first liquid cooling layer is used to cool the low-power first power component, and the second liquid cooling layer is used to cool the high-power second power component. The swirl cooling channel is provided in the area of ​​the high-power components such as the chip to enhance the heat transfer, and the first direct current channel is used in the area of ​​other low-power components on the mainboard to transport the coolant with low resistance, which can give full play to the advantages of the swirl cooling channel in enhancing the heat dissipation and the first direct current channel in low-resistance transport, and realize the refined and efficient heat dissipation and the rapid transport heat dissipation, thereby promoting the efficient and low-resistance heat dissipation of the high-power server.

[0011] According to some embodiments of the present application, the swirl cooling channel includes a swirl chamber and a second direct current channel arranged on one side of the swirl chamber, and a plurality of the guide vanes are rotatably installed in the swirl chamber.

[0012] According to some embodiments of the present application, a connecting pipe is provided between the first liquid cooling layer and the second liquid cooling layer, and the connecting pipe is provided in the middle of the cyclone chamber.

[0013] According to some embodiments of the present application, the first liquid cooling layer and the second liquid cooling layer are stacked.

[0014] According to some embodiments of the present application, a vapor chamber is further included, wherein the vapor chamber is provided with a receiving cavity for wrapping the second power component, and the second liquid cooling layer is arranged on the vapor chamber.

[0015] According to some embodiments of the present application, the liquid inlet portion includes a liquid inlet main pipe and a plurality of liquid inlet branch pipes, and the liquid inlet branch pipes are connected to the direct current channel.

[0016] According to some embodiments of the present application, the liquid outlet portion includes a liquid outlet main pipe and a plurality of liquid outlet branch pipes, and the liquid outlet branch pipes are connected to the first direct current channel and the second direct current channel.

[0017] According to some embodiments of the present application, a heat exchange component is further included, wherein the heat exchange component includes a seawater exchange component for conveying seawater and a cooling liquid exchange component for conveying cooling liquid, and the cooling liquid exchange component is connected to the liquid inlet and the liquid outlet.

[0018] According to some embodiments of the present application, the seawater exchange component includes a seawater inlet and a seawater outlet that are connected.

[0019] The server according to the second aspect of the present application includes the divergent uniform liquid cooling device of the first aspect.

[0020] The server according to the embodiment of the second aspect of the present application has at least the following beneficial effects: the server of the present application comprises the divergent uniform liquid cooling device of the embodiment of the first aspect, the divergent uniform liquid cooling device comprises a first liquid cooling layer, a second liquid cooling layer, a liquid inlet and a liquid outlet, the first liquid cooling layer is provided with a plurality of first direct current channels, the second liquid cooling layer is provided with at least one swirl cooling channel, at least some of the first direct current channels are connected to the swirl cooling channel, heat transfer is enhanced by providing swirl cooling channels in the areas of high-power components such as chips, and the first direct current channels are used in the areas of other low-power components on the motherboard to transport coolant with low resistance, which can give play to the advantages of enhanced heat dissipation of the swirl cooling channel and low-resistance transport of the first direct current channel, realize refined and efficient heat dissipation and rapid heat dissipation, thereby promoting efficient and low-resistance heat dissipation of high-power servers.

[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 It is a structural schematic diagram of a divergent uniform liquid cooling device according to an embodiment of the present application;

[0024] Figure 2 is a schematic structural diagram of a first liquid cooling layer and a second liquid cooling layer according to an embodiment of the present application;

[0025] Figure 3 yes Figure 1 A schematic structural diagram of a swirl cooling channel is shown. DETAILED DESCRIPTION

[0026] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0027] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, inside, outside, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In the description of this application, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0029] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, assembling, and matching should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0030] Refer to the following Figures 1 to 3 The diffuse uniform liquid cooling device according to the embodiment of the present application is described.

[0031] The divergent uniform liquid cooling device of the embodiment of the present application is as follows Figures 1 to 3As shown, it includes a first liquid cooling layer 100, a second liquid cooling layer 200, a liquid inlet and a liquid outlet. The first liquid cooling layer 100 is provided with a plurality of first direct current channels 110, and the second liquid cooling layer 200 is provided with at least one swirl cooling channel 210. At least part of the first direct current channels 110 is connected to the swirl cooling channel 210. A plurality of rotatable guide vanes 213 are provided in the swirl cooling channel 210. Transporting through the first direct current channel 110 can reduce the flow pressure drop, thereby reducing the transport energy consumption of the coolant. The second liquid cooling layer 200 is provided with at least one swirl cooling channel 210. At least part of the first direct current channels 110 is connected to the swirl cooling channel 210. A plurality of rotatable guide vanes 213 are provided in the swirl cooling channel 210. The coolant is dispersed to the surroundings under the action of the guide vanes 213, which can enhance heat dissipation. The first liquid cooling layer 100 is used to cool the low-power first power component, and the second liquid cooling layer 200 is used to cool the high-power second power component 510. A swirl cooling channel 210 is set in the area of ​​high-power components such as chips to enhance heat transfer. The first direct current channel 110 is used to transport the coolant with low resistance in the area of ​​other low-power components on the mainboard. The advantages of the swirl cooling channel 210 in enhancing heat dissipation and the first direct current channel 110 in low-resistance transportation can be brought into play, and refined and efficient heat dissipation and rapid heat dissipation can be achieved, thereby promoting efficient and low-resistance heat dissipation of high-power servers. The liquid inlet and the liquid outlet are used to transport the coolant. The working process of the divergent uniform liquid cooling device in this application is introduced with a specific embodiment below. The coolant flows into the first cooling layer from the liquid inlet, the first liquid cooling layer 100 is provided with a plurality of first direct current channels 110, the second liquid cooling layer 200 is provided with at least one swirl cooling channel 210, at least part of the first direct current channels 110 is connected with the swirl cooling channel 210, specifically, the swirl cooling channel 210 is provided at the high-power second power component 510, part of the coolant flows from the first direct current channel 110 to the swirl cooling channel 210 of the second liquid cooling layer 200, the guide vane 213 in the swirl cooling channel 210 drives the coolant to diverge around, which can improve the heat dissipation effect at the second power component 510 and realize enhanced heat dissipation. After the remaining coolant flows into the first liquid cooling layer 100 from the liquid inlet, it flows through the first direct current channel 110 and then flows out from the liquid outlet, realizing low-resistance transportation of the coolant in the area of ​​other low-power components on the mainboard. By setting the first liquid cooling layer 100 and the second liquid cooling layer 200, different cooling channels can be set according to the heat dissipation power, and the advantages of the swirl cooling channel 210 for enhanced heat dissipation and the first DC channel 110 for low-resistance transmission can be brought into play, so as to achieve refined and efficient heat dissipation and rapid heat dissipation, promote efficient and low-resistance heat dissipation of high-power servers, reduce the energy consumption of cooling medium transmission, and achieve green and low-carbon development of data centers. It should be noted that in some embodiments of the present application, the second power component 510 includes a chip, and the heat dissipation power of the chip is high, and it is necessary to use the swirl cooling channel 210 to enhance heat dissipation and improve heat dissipation efficiency.It is understandable that in some other embodiments, the second power component 510 includes other high-power components such as power supply or memory, which can also be enhanced to dissipate heat through the swirl cooling channel 210. In some embodiments, the first power component includes a low-power motherboard, and the first DC channel 110 is provided on the motherboard to achieve low-resistance and efficient delivery of the coolant and auxiliary cooling of other components.

[0032] According to some embodiments of the present application, the swirl cooling channel 210 includes a swirl chamber 211 and a second direct current channel 212 arranged on one side of the swirl chamber 211, and a plurality of guide vanes 213 are rotatably installed in the swirl chamber 211. The swirl cooling channel 210 includes a swirl chamber 211 and a second direct current channel 212, and the coolant flows into the swirl chamber 211 from the first direct current channel 110 of the first cooling layer, and a plurality of guide vanes 213 are arranged in the swirl chamber 211. The guide vanes 213 rotate in the swirl chamber 211, and can drive the coolant to diverge around, thereby improving the heat dissipation effect at the first power component. The diverged coolant flows out through the second direct current channel 212, and finally flows out from the liquid outlet, so that the coolant can be recycled.

[0033] According to some embodiments of the present application, a connecting pipe 214 is provided between the first liquid cooling layer 100 and the second liquid cooling layer 200, and the connecting pipe 214 is provided in the middle of the swirl chamber 211. The first liquid cooling layer 100 is provided with a plurality of first direct current channels 110, and the second liquid cooling layer 200 is provided with at least one swirl cooling channel 210, and at least part of the first direct current channels 110 is connected with the swirl cooling channel 210. Specifically, a connecting pipe 214 is provided between the first liquid cooling layer 100 and the second liquid cooling layer 200, and a connecting pipe 214 is provided between the first direct current channel 110 and the first liquid cooling layer 100 and the second liquid cooling layer 200. The connecting pipe 214 is connected, and the coolant can be transported from the first direct current channel 110 of the first liquid cooling layer 100 to the swirl cooling channel 210 of the second liquid cooling layer 200. Specifically, the connecting pipe 214 is arranged in the middle of the vortex chamber 211, and the coolant flows from the middle of the vortex chamber 211 to the surroundings, and diverges to the surroundings under the action of the guide plate 213, and the diverged coolant realizes enhanced heat dissipation at the second power component 510.

[0034] According to some embodiments of the present application, the first liquid cooling layer 100 is stacked with the second liquid cooling layer 200. The first liquid cooling layer 100 and the second liquid cooling layer 200 are stacked on the server. Specifically, the first liquid cooling layer 100 is used to cool the low-power first power component, and the second liquid cooling layer 200 is used to cool the high-power second power component 510. The second liquid cooling layer 200 is arranged close to the second power component 510. The first liquid cooling layer 100 is stacked on the second liquid cooling layer 200. The first direct current channel 110 is arranged parallel to the swirl cooling channel 210 in the length direction. The first direct current channel 110 connected to the swirl cooling channel 210 can flow into the swirl cooling channel 210 of the lower layer through the pipe and the hole position, and finally complete the enhanced heat dissipation at the second power component 510. It can be understood that in some other embodiments, the first liquid cooling layer 100 and the second liquid cooling layer 200 are arranged on the same plane. At this time, the first direct current channel 110 of the first liquid cooling layer 100 is connected to the swirl cooling channel 210 through a branch pipeline, and at least part of the first direct current channel 110 can also be connected to the swirl cooling channel 210, thereby achieving the effect of enhanced heat dissipation of the swirl cooling channel 210 and low-resistance transportation of the first direct current channel 110.

[0035] According to some embodiments of the present application, a vapor chamber 500 is further included, and the vapor chamber 500 is provided with a receiving cavity for wrapping the second power component 510, and the second liquid cooling layer 200 is arranged on the vapor chamber 500. The vapor chamber 500 is provided with a receiving cavity, and the chip is placed in the receiving cavity. The vapor chamber 500 can be close to the chip and wrap the chip in three dimensions. The second liquid cooling layer 200 covers the vapor chamber 500, and the heat exchange between the second liquid cooling layer 200 and the vapor chamber 500 can enhance the heat dissipation effect of the chip.

[0036] According to some embodiments of the present application, the liquid inlet portion includes a liquid inlet main pipe 310 and a plurality of liquid inlet branch pipes 320, and the liquid inlet branch pipes 320 are connected to the direct current channel. The liquid inlet portion is used to transport the cooling liquid, and the liquid inlet portion includes a liquid inlet main pipe 310 and a plurality of liquid inlet branch pipes 320, and each liquid inlet branch pipe 320 is connected to the liquid inlet main pipe 310. The first liquid cooling layer 100 is provided with a plurality of first direct current channels 110, and the number of the liquid inlet branch pipes 320 corresponds to the number of the first direct current channels 110. The cooling liquid flows from the liquid inlet main pipe 310 and is diverted to each first direct current channel 110 through the liquid inlet branch pipes 320, so as to realize the diversion and transportation of the cooling liquid.

[0037] According to some embodiments of the present application, the liquid outlet portion includes a liquid outlet main pipe 410 and a plurality of liquid outlet branch pipes 420, and the liquid outlet branch pipes 420 are connected to the first direct current channel 110 and the second direct current channel 212. The liquid outlet portion is used to transport cooling liquid, and the liquid outlet portion includes a liquid outlet main pipe 410 and a plurality of liquid outlet branch pipes 420 connected to the liquid outlet main pipe 410. The swirl cooling channel 210 includes a swirl chamber 211 and a second direct current channel 212 arranged on one side of the swirl chamber 211. Part of the first direct current channel 110 is connected to the swirl cooling channel 210. Specifically, the cooling liquid is transported from the liquid inlet portion into the first direct current channel 110, and part of the cooling liquid directly flows out from the liquid outlet branch pipe 420 of the liquid outlet portion through the first direct current channel 110; the rest of the cooling liquid flows into the swirl chamber 211 of the swirl cooling channel 210 through the first direct current channel 110 and flows out from the second direct current channel 212 on one side of the swirl chamber 211. The second direct current channel 212 is connected to the liquid outlet branch pipe 420, and the liquid outlet branch pipe 420 can collect the coolant in the first direct current channel 110 and the second direct current channel 212 to the liquid outlet main pipe 410 for discharge, thereby completing the circulation of the coolant.

[0038] According to some embodiments of the present application, a heat exchange component 600 is also included, and the heat exchange component 600 includes a seawater exchange component for conveying seawater and a coolant exchange component for conveying coolant, and the coolant exchange component is connected to the liquid inlet and the liquid outlet. The coolant exchanges heat in the heat exchange component 600. Specifically, the heat exchange component 600 includes a seawater exchange component and a coolant exchange component. The seawater exchange component is used to convey seawater to the heat exchange component 600. The coolant exchange component is connected to the liquid inlet and the liquid outlet, and is used to convey coolant to the heat exchange component 600. By using seawater as a natural cold source to replace the traditional artificial cold source, efficient cooling and green development of high-power servers can be achieved. Specifically, in some embodiments, the seawater exchange component includes a connected seawater inlet 610 and a seawater outlet 620. The seawater conveying direction of the seawater exchange component is opposite to the coolant conveying direction of the coolant exchange component, and countercurrent heat exchange is performed on the circulating coolant to improve the heat exchange effect.

[0039] According to the server of the embodiment of the present application, it includes the divergent uniform liquid cooling device of the above embodiment. The server of the present application includes the divergent uniform liquid cooling device of the embodiment of the first aspect, the divergent uniform liquid cooling device includes a first liquid cooling layer 100, a second liquid cooling layer 200, a liquid inlet and a liquid outlet, the first liquid cooling layer 100 is provided with a plurality of first direct current channels 110, the second liquid cooling layer 200 is provided with at least one swirl cooling channel 210, at least part of the first direct current channels 110 is connected with the swirl cooling channel 210, the swirl cooling channel 210 is provided in the area of ​​high-power components such as chips to enhance heat transfer, and the first direct current channel 110 is used in the area of ​​other low-power components on the motherboard to transport coolant with low resistance, which can give play to the advantages of the swirl cooling channel 210 to enhance heat dissipation and the first direct current channel 110 to transport with low resistance, so as to achieve refined and efficient heat dissipation and rapid heat dissipation, thereby promoting efficient and low-resistance heat dissipation of high-power servers.

[0040] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present application.

Claims

1. A divergent uniform liquid cooling device, used for liquid cooling of servers, characterized in that: include: a first liquid cooling layer, the first liquid cooling layer being used to cool the first power component, the first liquid cooling layer being provided with a plurality of first direct current channels; a second liquid cooling layer, the second liquid cooling layer being used to cool the second power component, the second liquid cooling layer being provided with at least one swirl cooling channel, at least part of the first direct flow channel being connected to the swirl cooling channel, and a plurality of rotatable guide vanes being provided in the swirl cooling channel; a liquid inlet portion, the liquid inlet portion being connected to the direct current channel; A liquid outlet portion is connected to the straight flow channel and the swirl cooling channel.

2. The divergent uniform liquid cooling device according to claim 1, characterized in that: The swirl cooling channel includes a swirl chamber and a second straight flow channel arranged on one side of the swirl chamber, and a plurality of guide vanes are rotatably installed in the swirl chamber.

3. The divergent uniform liquid cooling device according to claim 2, characterized in that: A connecting pipe is provided between the first liquid cooling layer and the second liquid cooling layer, and the connecting pipe is provided in the middle of the cyclone chamber.

4. The divergent uniform liquid cooling device according to claim 1, characterized in that: The first liquid cooling layer and the second liquid cooling layer are stacked.

5. The divergent uniform liquid cooling device according to claim 1, characterized in that: It also includes a heat spreader, which is provided with a receiving cavity for wrapping the second power component, and the second liquid cooling layer is arranged on the heat spreader.

6. The divergent uniform liquid cooling device according to claim 1, characterized in that: The liquid inlet part includes a liquid inlet main pipe and a plurality of liquid inlet branch pipes, and the liquid inlet branch pipes are connected with the direct current channel.

7. The divergent uniform liquid cooling device according to claim 2, characterized in that: The liquid outlet portion includes a liquid outlet main pipe and a plurality of liquid outlet branch pipes, and the liquid outlet branch pipes are connected with the first direct current channel and the second direct current channel.

8. The divergent uniform liquid cooling device according to claim 1, characterized in that: It also includes a heat exchange component, which includes a seawater exchange component for conveying seawater and a cooling liquid exchange component for conveying cooling liquid. The cooling liquid exchange component is connected with the liquid inlet and the liquid outlet.

9. The divergent uniform liquid cooling device according to claim 8, characterized in that: The seawater exchange component comprises a seawater inlet and a seawater outlet which are connected to each other.

10. A server, characterized in that It comprises the divergent uniform liquid cooling device as described in any one of claims 1 to 9.

Images