Display module and display device

By designing the display panel, bent portion and binding portion in the display module, combining the protective layer of the flexible circuit board and the back plate adhesive layer to form a sealing structure, the maternal board utilization rate and waterproofness in the prior art are solved. The problem has significantly improved the waterproof, salt spray and sweat resistance of the display module, and improved reliability.

CN119252144AActive Publication Date: 2025-01-03WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD

Patent Information

Application Number
CN202411355437.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-26
Publication Date
2025-01-03
Estimated Expiration
2044-09-26

AI Technical Summary

Technical Problem

While improving the utilization rate of the motherboard, it is difficult to improve the ability of waterproof, salt spray and sweatproof at the same time, resulting in low reliability.

Method used

By designing the display panel, bent portion and binding portion in the display module, combining the protective layer of the flexible circuit board and the back plate adhesive layer, a sealing structure is formed, avoiding the use of back glue and using the conductive adhesive layer to fill the gap, improving sealing ability .

Benefits of technology

On the basis of ensuring the utilization rate of the motherboard, the waterproof, salt spray and sweat resistance of the display module is significantly improved, thereby improving the reliability of the display module.

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Abstract

The invention relates to a display module and a display device, in the display module, a protective layer on a first part of a flexible circuit board is in lap joint with a binding part of a display panel, so that back glue does not need to be arranged at the joint of the first part and the binding part, and therefore, when a mother board of the display panel is cut, a linear cutting process does not need to be adopted, and the production efficiency is improved. The utilization rate of the mother board is improved; meanwhile, the first adhesive layer between the first back plate and the binding part is expanded outwards; the end part of the first adhesive layer exceeds the end part of the binding part and is connected with the protective layer of the flexible circuit board, so that the joint of the binding part and the first part is sealed; therefore, the waterproof, salt mist-proof and sweat-proof capabilities of the display module can be improved, so that the reliability of the display module is improved.
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Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the widespread application of various display devices, users have higher and higher performance requirements for display devices. Take mobile phones and tablets as an example. As electronic devices used by users in daily life, mobile phones and tablets are usually used for a long time and in different scenarios. This places high requirements on the waterproof, salt spray and sweat resistance of the display modules of mobile phones and tablets. In the existing display modules, there are usually two designs for the area where the FPC (Full English Name: Flexible Printed Circuit, Chinese abbreviation: Flexible Circuit Board) is directly attached to the display panel (Panel): one is that the insulating film of the FPC does not overlap with the panel, only the binding pins are overlapped, and a backing glue is set at the joint of the Panel and the FPC, and the Panel Line Cut (straight line cutting) process is adopted when the Panel motherboard is cut. Although this can improve the waterproof / salt spray / sweat proof capabilities of the panel, it will reduce the utilization rate of the motherboard; the other is that the insulating film of the FPC overlaps with the panel, and there is no need to set a backing glue at the joint of the Panel and the FPC, and there is no need to adopt the Panel Line Cut (straight line cutting) process when the Panel motherboard is cut. Although this can improve the utilization rate of the motherboard, the waterproof / salt spray / sweat proof capabilities of the panel are relatively poor. Summary of the invention

[0003] The embodiments of the present application provide a display module and a display device, which can improve the waterproof, salt spray and sweat resistance of the display module while ensuring the utilization rate of the motherboard of the display module, thereby improving the reliability of the display module.

[0004] In order to achieve the above object, according to a first aspect of the present application, a display module is provided, comprising:

[0005] The display panel comprises a display portion, a bending portion and a binding portion, wherein the binding portion is located at the back side of the display portion, the bending portion connects the display portion and the binding portion, and the binding portion comprises a first binding terminal;

[0006] A first back plate is disposed on a side of the binding portion facing the display portion, the first back plate being connected to the binding portion via a first adhesive layer; and

[0007] a flexible circuit board, located at a side of the binding portion away from the first back plate, the flexible circuit board comprising a first part and a second part which are integrally arranged, the first part being provided with a protective layer on a side facing the binding portion, the first part partially overlapping with the binding portion, and the protective layer at the overlapping position being in contact with the binding portion, the projection of the second part on the binding portion being within the range of the binding portion, the thickness of the second part being less than the thickness of the first part, and an accommodation gap being formed between the second part and the binding portion, the second part being provided with a second binding terminal, the second binding terminal being within the accommodation gap and corresponding to the position of the first binding terminal, and the second binding terminal being bound and connected to the first binding terminal;

[0008] Wherein, in the direction in which the bending portion points to the binding portion:

[0009] The end of the first adhesive layer exceeds the end of the binding portion and is connected to the protection layer.

[0010] Optionally, in the direction in which the bending portion points to the binding portion, the end of the first back plate is arranged beyond the end of the binding portion, or the end of the first back plate is arranged flush with the end of the binding portion;

[0011] The end of the first adhesive layer extends from the end of the first back plate to be connected to the protection layer.

[0012] Optionally, the end of the first back plate is arranged beyond the end of the binding portion, and the distance between the end of the first back plate and the end of the binding portion is set to H1, wherein 0mm

[0013] Optionally, the flexible circuit board further includes a conductive adhesive layer, the conductive adhesive layer is located in the accommodating gap, and the conductive adhesive layer electrically connects the second binding terminal and the first binding terminal;

[0014] In the direction from the bent portion to the binding portion, the end of the conductive adhesive layer at least extends to be between the protective layer and the binding portion.

[0015] Optionally, in the direction where the bending portion points to the binding portion, the end of the conductive adhesive layer extends to be arranged beyond the end of the binding portion.

[0016] Optionally, an end of the first adhesive layer overlaps an end of the conductive adhesive layer.

[0017] Optionally, in the direction from the bending portion to the binding portion, the distance between the end of the conductive adhesive layer and the end of the binding portion is set to H2, wherein H2>0.2 mm. ​

[0018] Optionally, the first back plate has a first side edge arranged opposite to the bent portion, and the first back plate further has a second side edge connected to the first side edge;

[0019] The first side edge exceeds the edge of the binding portion, and at a position corresponding to the first side edge, an end of the first adhesive layer extends from the first side edge to connect with the protective layer;

[0020] The second side is arranged beyond the periphery of the second binding terminal, and at a position corresponding to the second side, an end of the first adhesive layer exceeds the periphery of the second binding terminal.

[0021] Optionally, the second side is arranged beyond an edge of the flexible circuit board.

[0022] According to a second aspect of the present application, a display device is provided, comprising the above-mentioned display module.

[0023] In the display device of the embodiment of the present application, the protective layer on the first part of the flexible circuit board overlaps the binding part of the display panel, so there is no need to set a backing glue at the joint between the first part and the binding part, so that when the motherboard of the display panel is cut, there is no need to use the Panel Line Cut process, thereby improving the utilization rate of the motherboard; at the same time, the first adhesive layer between the first back panel and the binding part can be expanded outward so that the end of the first adhesive layer exceeds the end of the binding part and is connected to the first part, thereby sealing the joint between the binding part and the protective layer; in this way, the waterproof, salt spray and sweat proof capabilities of the display module can be improved, thereby improving the reliability of the display module.

[0024] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0026] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0027] Figure 1 A first film layer diagram of a display module provided in an embodiment of the present application;

[0028] Figure 2 for Figure 1 The film layer diagram of the display module (before bending);

[0029] Figure 3 for Figure 2 An enlarged schematic diagram of a local A in FIG.

[0030] Figure 4 A second film layer diagram of a display module provided in an embodiment of the present application;

[0031] Figure 5 for Figure 4 The film layer diagram of the display module (before bending);

[0032] Figure 6 for Figure 5 An enlarged schematic diagram of a local C in FIG.

[0033] Figure 7 A top view of a display module (before bending) provided in an embodiment of the present application. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0035] The embodiments of the present application provide an array substrate and a display module. The display module may be a display module of a mobile phone, a computer, a tablet, a display screen, etc., and is not limited here.

[0036] In a first aspect, an embodiment of the present application provides a display module 100. Figure 1 , Figure 4 as well as Figure 7The display module 100 includes a display panel 1, a first backplane 2 and a flexible circuit board 4; the display panel 1 includes a display portion 11, a bending portion 12 and a binding portion 13, the binding portion 13 is located on the back side of the display portion 11, the bending portion 12 connects the display portion 11 and the binding portion 13, and the binding portion 13 includes a first binding terminal 131; the first backplane 2 is arranged on a side of the binding portion 13 facing the display portion 11, and the first backplane 2 is connected to the binding portion 13 through a first adhesive layer 3; the flexible circuit board 4 is located on a side of the binding portion 13 away from the first backplane 2, and the flexible circuit board 4 includes a first part 41 and a second part 42 that are integrally arranged, the first part 41 is provided with a protective layer 45 on a side facing the binding portion 13, and the first part 41 partially overlaps with the binding part 13, and the protective layer 45 at the overlapping position is in contact with the binding part 13, the projection of the second part 42 on the binding part 13 is within the range of the binding part 13, the thickness of the second part 42 is less than the thickness of the first part 41, and an accommodating gap a is formed between the second part 42 and the binding part 13, the second part 42 is provided with a second binding terminal 43, the second binding terminal 43 is in the accommodating gap a, and corresponds to the position of the first binding terminal 131, and the second binding terminal 43 is bound and connected to the first binding terminal 131; wherein, in the direction in which the bending part 12 points to the binding part 13: the end of the first adhesive layer 3 is set beyond the end of the binding part 13 and is connected to the protective layer 45.

[0037] It can be known that in the prior art, the flexible circuit board 4 includes a substrate, a metal layer and a protective layer, the substrate includes an integral first part and a second part, the metal layer includes a routing line arranged on the first part, and a binding segment arranged on the second part; the protective layer is arranged on the substrate and covers the routing line; there is a step difference between the first part and the second part, so that the first part and the second part form a step structure. The first part partially overlaps with the display panel 1, and the protective layer at the overlapping position is attached to the display panel 1, so that the second part completely falls into the display panel; the binding terminal on the second part is arranged opposite to the binding terminal on the binding part of the display panel 1, and is bound by a conductive adhesive layer 44. Since the protective layer is attached to the display panel 1, it is not necessary to set a back glue at the attachment point of the flexible circuit board 4 and the display panel 1, so that when the motherboard of the display panel 1 is cut, it is not necessary to use the Panel Line Cut process, thereby improving the utilization rate of the motherboard.

[0038] At the same time, by expanding the first adhesive layer 3 between the first back panel 2 and the binding part 13, the end of the first adhesive layer 3 exceeds the end of the binding part 13 and is connected to the protective layer 45, thereby sealing the joint between the binding part 13 and the protective layer 45; this can improve the waterproof, salt fog and sweat resistance of the display module 100, thereby improving the reliability of the display module 100.

[0039] In the present application, the first back panel 2 has a first side 21 arranged opposite to the bending portion 12, and a second side 22 connected to the first side 21; the first side 21 extends along a first direction F1; the second side 22 extends along a second direction F2; that is, the direction in which the bending portion 12 points to the binding portion 13 is set as the second direction F2.

[0040] See also Figures 1 to 3 In the first embodiment of the present application, in the direction F2 where the bending portion 12 points to the binding portion 13, the end of the first back panel 2 is arranged beyond the end of the binding portion 13, or the end of the first back panel 2 is arranged flush with the end of the binding portion 13; the end of the first adhesive layer 3 extends from the end of the first back panel 2 at least to the connection with the protective layer 45.

[0041] In this embodiment, the first backplane 2 is expanded outward, and in the direction F2 where the bending portion 12 points to the binding portion 13, the end of the first backplane 2 is set beyond the end of the binding portion 13, or the end of the first backplane 2 is set flush with the end of the binding portion 13; because in the actual process, the first adhesive layer 3 is flush with the edge of the first backplane 2 before pressing, after the first backplane 2 is expanded outward, when the first backplane 2 is pressed onto the binding portion 13, the first adhesive layer 3 will overflow, so that the first adhesive layer 3 can be connected to the protective layer 45; the overflowed first adhesive layer 3 seals the fitting between the binding portion 13 and the protective layer 45; in this way, the waterproof, salt fog and sweat proof capabilities of the display module 100 can be improved, thereby improving the reliability of the display module 100.

[0042] In order to ensure the sealing effect of the first adhesive layer 3, in one embodiment, the end of the first back plate 2 is arranged beyond the end of the binding portion 13, and the distance between the end of the first back plate 2 and the end of the binding portion 13 is set to H1, wherein 0mm

[0043] ​See also Figures 4 to 6 In the second embodiment of the present application, the flexible circuit board 4 also includes a conductive adhesive layer 44, which is located in the accommodating gap a, and the conductive adhesive layer 44 is electrically connected to the second binding terminal 43 and the first binding terminal 131; in the direction F2 from the bending portion 12 to the binding portion 13, the end of the conductive adhesive layer 44 extends to between the protective layer 45 of the first part 41 and the binding portion 13.

[0044] In this embodiment, based on the first embodiment, please refer to Figure 3 , the conductive adhesive layer 44 is expanded outward, and in the direction F2 where the bending portion 12 points to the binding portion 13, the end of the conductive adhesive layer 44 at least extends to between the protective layer 45 and the binding portion 13; at this time, not only the end of the first adhesive layer 3 can seal the fitting portion between the binding portion 13 and the protective layer 45, but also the conductive adhesive layer 44 can fill the fitting gap a between the binding portion 13 and the protective layer 45, so that the waterproof, salt fog and sweat proof capabilities of the display module 100 can be further improved, thereby improving the reliability of the display module 100.

[0045] Furthermore, in the direction F2 from the bent portion 12 to the binding portion 13, the end of the conductive adhesive layer 44 extends beyond the end of the binding portion 13. In this way, the conductive adhesive layer 44 is expanded outward, and the conductive adhesive layer 44 can completely fill the fitting gap a between the binding portion 13 and the protective layer 45, so that the waterproof, salt fog and sweat resistance of the display module 100 can be further improved, thereby improving the reliability of the display module 100.

[0046] The present application does not specifically limit the type of the conductive adhesive layer 44. Generally, the conductive adhesive layer 44 is configured as an anisotropic conductive adhesive.

[0047] The present application does not impose any specific restrictions on the outward expansion distance of the conductive adhesive layer 44. In order to ensure that the conductive adhesive layer 44 fills the gap between the binding portion 13 and the protective layer 45, so that the conductive adhesive layer 44 can block the invasion of water vapor and foreign matter, the end of the conductive adhesive layer 44 exceeds the end of the binding portion 13, and the distance between the end of the conductive adhesive layer 44 and the end of the binding portion 13 is set to H2, where H2>0.2mm.

[0048] Based on the above, the conductive adhesive layer 44 is expanded outward, and in the direction F2 from the bending portion 12 to the binding portion 13, the end of the conductive adhesive layer 44 is set beyond the end of the binding portion 13; at this time, the conductive adhesive layer 44 can completely fill the fitting gap between the binding portion 13 and the protective layer 45; at the same time, the first adhesive layer 3 is expanded outward, so that the end of the first adhesive layer 3 exceeds the end of the binding portion 13 and is connected to the protective layer 45, thereby sealing the fitting between the binding portion 13 and the protective layer 45; and, when the first adhesive layer 3 is connected to the protective layer 45, it will be connected to the conductive adhesive layer 44 extending to the protective layer 45, further improving the waterproof, salt fog and sweat proof capabilities of the display module 100, thereby improving the reliability of the display module 100.

[0049] It can be known that the first backplane 2 can also be expanded outward simultaneously, and in the direction in which the bending portion 12 points to the binding portion 13, the end of the first backplane 2 is set beyond the end of the binding portion 13; because in the actual manufacturing process, the first adhesive layer 3 before pressing is flush with the edge of the first backplane 2, so after the first backplane 2 is expanded outward, when the first backplane 2 is pressed onto the binding portion 13, the first adhesive layer 3 will overflow, and at this time, the end of the conductive adhesive layer 44 exceeds the end of the binding portion 13, and the overflowed first adhesive layer 3 will directly contact the conductive adhesive layer 44, and together with the conductive adhesive layer 44, seal the joint between the binding portion 13 and the protective layer 45; in this way, the waterproof, salt fog and sweat proof capabilities of the display module 100 can be further improved, thereby improving the reliability of the display module 100.

[0050] See also Figure 7 In one embodiment of the present application, the first back plate 2 has a first side 21 disposed opposite to the bending portion 12, and a second side 22 connected to the first side 21; the first side 21 extends along a first direction F1; the second side 22 extends along a second direction F2. The first side 21 exceeds the end of the binding portion 13, and at a position corresponding to the first side 21, the end of the first adhesive layer 3 extends from the end of the first back plate 2 to connect with the protective layer 45; the second side 22 is disposed beyond the periphery of the second binding terminal 43, and at a position corresponding to the second side 22, the end of the first adhesive layer 3 exceeds the periphery of the second binding terminal 43.

[0051] The first side edge 21 extends beyond the end of the binding portion 13. In an actual manufacturing process, the first adhesive layer 3 is flush with the first side edge 21 before lamination. After the first back panel 2 is laminarized, the first adhesive layer 3 will overflow and connect with the protective layer 45. The second side edge 22 is set to extend beyond the edge of the second binding terminal 43, so that the first adhesive layer 3 can seal the surrounding side of the second binding terminal 43, further improving the waterproof, salt fog and sweat proof capabilities of the display module 100, thereby improving the reliability of the display module 100.

[0052] In order to further improve the sealing performance of the first adhesive layer 3 to the second binding terminal 43, the distance of the second side edge 22 beyond the edge of the second binding terminal 43 is set to H3, where H3>0.2mm. In other words, the second side edge 22 exceeds the edge of the second binding terminal 43 by more than 0.2mm, which can further improve the sealing effect of the first adhesive layer 3.

[0053] The present application does not impose any specific restrictions on the positional relationship between the second side edge 22 and the flexible circuit board 4. The second side edge 22 may exceed the edge of the flexible circuit board 4, or the second side edge 22 may be set inward compared to the edge of the flexible circuit board 4. As long as the second side edge 22 exceeds the edge of the second binding terminal 43, it is sufficient. In addition, the distance between the second side edge 22 and the edge of the flexible circuit board 4 is ±0.3 mm.

[0054] In one embodiment, the second side edge 22 is disposed beyond the edge of the flexible circuit board 4 ; thus, the distance of the second side edge 22 beyond the edge of the second binding terminal 43 can be further increased, thereby ensuring the sealing effect of the first adhesive layer 3 .

[0055] The present application does not specifically limit the type of the display module. The display module can be a DF (Full name in English: Dynamic Foldable, Chinese abbreviation: Dynamic Foldable) module, or a SF (Full name in English: Fixed Curvature, Chinese abbreviation: Fixed Curvature) module.

[0056] Take the display module as the DF module as an example for explanation. Figure 1The display module 100 also includes a backplane supporting structure 5, a heat dissipation adhesive layer 6 and a third adhesive layer 7; the backplane supporting structure 5 includes a second backplane 51, a buffer layer 53 and a support layer 54, the second backplane 51 is arranged on the back side of the display unit 11, the second backplane 51 is connected to the display unit 11 through a second adhesive layer 52, the buffer layer 53 is arranged on the side of the second backplane 51 away from the display unit 11, and the support layer 54 is arranged on the side of the buffer layer 53 away from the second backplane 51; the heat dissipation adhesive layer 6 is arranged on the side of the first backplane 2 facing the display unit 11, and the heat dissipation adhesive layer 6 is connected to the support layer 54; the third adhesive layer 7 is arranged on the side of the first part 41 facing the display unit 11, and the third adhesive layer 7 is connected to the support layer 54.

[0057] The display module 100 also includes a cover plate 82, a first optical adhesive layer 81, a protective layer 84 and a second optical adhesive layer 83. The cover plate 82 is arranged on the display side of the display unit 11, and the cover plate 82 is connected to the display unit 11 through the first optical adhesive layer 81; the protective layer 84 is arranged on the side of the cover plate 82 away from the display unit 11, and the protective layer 84 is connected to the cover plate 82 through the second optical adhesive layer 83.

[0058] The cover plate 82 can be set to UTG (Ultra-Thin Glass in English, abbreviated in Chinese as ultra-thin glass); the protective layer 84 can be set to PW (full name in English: protect window, abbreviated in Chinese as cover plate material protective film), and the material of the cover plate material protective film includes but is not limited to one of PET (full name in English: polyethylene glycolterephthalate, abbreviated in Chinese as polyethylene terephthalate) and CPI (full name in English: ColorlessPolyimide, abbreviated in Chinese as transparent polyimide).

[0059] In a second aspect, the embodiments of the present application further provide a display device. The display device includes a display module 100. It should be noted that the display module 100 is configured as the above-mentioned display module 100, that is, the display module 100 includes all the technical features of the above-mentioned display module 100, and the display device includes all the embodiments of the above-mentioned display module 100, and also has all the technical effects of the above-mentioned embodiments, which will not be repeated here one by one.

[0060] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0061] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0062] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0063] The above are only preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display module, characterized in that: include: The display panel comprises a display portion, a bending portion and a binding portion, wherein the binding portion is located at the back side of the display portion, the bending portion connects the display portion and the binding portion, and the binding portion comprises a first binding terminal; A first back plate, disposed on a side of the binding portion facing the display portion, the first back plate being connected to the binding portion via a first adhesive layer; as well as, a flexible circuit board, located at a side of the binding portion away from the first back plate, the flexible circuit board comprising a first part and a second part which are integrally arranged, the first part being provided with a protective layer on a side facing the binding portion, the first part partially overlapping with the binding portion, and the protective layer at the overlapping position being in contact with the binding portion, the projection of the second part on the binding portion being within the range of the binding portion, the thickness of the second part being less than the thickness of the first part, and an accommodation gap being formed between the second part and the binding portion, the second part being provided with a second binding terminal, the second binding terminal being within the accommodation gap and corresponding to the position of the first binding terminal, and the second binding terminal being bound and connected to the first binding terminal; Wherein, in the direction in which the bending portion points to the binding portion: The end of the first adhesive layer exceeds the end of the binding portion and is connected to the protection layer.

2. The display module according to claim 1, characterized in that: In the direction from the bent portion to the binding portion, the end of the first back plate is arranged beyond the end of the binding portion, or the end of the first back plate is arranged flush with the end of the binding portion; The end of the first adhesive layer extends from the end of the first back plate to be connected to the protection layer.

3. The display module according to claim 2, characterized in that: The end of the first back plate is arranged beyond the end of the binding portion, and the distance between the end of the first back plate and the end of the binding portion is set to H1, wherein 0mm<H1≤1mm.

4. The display module according to claim 1, characterized in that: The flexible circuit board further includes a conductive adhesive layer, the conductive adhesive layer is located in the accommodating gap, and the conductive adhesive layer electrically connects the second binding terminal and the first binding terminal; In the direction from the bent portion to the binding portion, the end of the conductive adhesive layer at least extends to be between the protective layer and the binding portion.

5. The display module according to claim 4, characterized in that: In the direction from the bent portion to the binding portion, the end of the conductive adhesive layer extends to an end portion beyond the binding portion.

6. The display module according to claim 5, characterized in that: The end of the first adhesive layer overlaps the end of the conductive adhesive layer.

7. The display module according to claim 5, characterized in that: In the direction from the bent portion to the binding portion, the distance between the end of the conductive adhesive layer and the end of the binding portion is set to H2, wherein H2>0.2 mm.

8. The display module according to claim 1, characterized in that: The first back plate has a first side edge arranged opposite to the bending portion, and the first back plate also has a second side edge connected to the first side edge; The first side edge exceeds the edge of the binding portion, and at a position corresponding to the first side edge, an end of the first adhesive layer extends from the first side edge to connect with the protective layer; The second side is arranged beyond the periphery of the second binding terminal, and at a position corresponding to the second side, an end of the first adhesive layer exceeds the periphery of the second binding terminal.

9. The display module according to claim 8, characterized in that: The second side is arranged beyond the edge of the flexible circuit board.

10. A display device, characterized in that: A display module comprising any one of claims 1-9.

Citation Information

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