Automatic cleaning system and method for isolator chip production

Abstract

The invention relates to the technical field of semiconductor device processing, in particular to an automatic cleaning system and method for isolator chip production. The automatic cleaning system for isolator chip production comprises a mounting table, a soaking box, an ultrasonic cleaning box, an air drying box, a conveying assembly, an air cylinder seat, an air cylinder, a mounting seat, two telescopic rods, two first clamping jaws, a first driving assembly, two second clamping jaws and a second driving assembly. Under the driving of the conveying assembly and the air cylinder, the chip can be driven to sequentially pass through the soaking box, the ultrasonic cleaning box and the air drying box; in the soaking box, the ultrasonic cleaning box and the air drying box, the two first clamping jaws and the two second clamping jaws alternately clamp the chip, so that the parts, attached to the chip, of the two first clamping jaws can be cleaned, the parts, attached to the chip, of the two second clamping jaws can also be cleaned, cleaning dead corners do not exist, and the cleaning efficiency is improved. Therefore, the isolator chip can be cleaned completely.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device processing, and in particular to an automatic cleaning system and method for producing isolator chips. Background Art

[0002] During the production process, isolator chips are easily contaminated by particulate matter, metal ions and organic impurities, causing short circuit or open circuit failure, so they need to be cleaned.

[0003] The prior art (CN108511329A) discloses a chip cleaning device, including an operating table, on which a conveyor belt for conveying chips is arranged, the width of the conveyor belt is less than or equal to the spacing between the pins on both sides of the chip, and the thickness of the conveyor belt is greater than or equal to the height of the pins of the chip; a limit block is arranged above the conveyor belt; and a cleaning device is arranged on the rotating path of the conveyor belt. By arranging the limit block, the chip can be stably placed on the conveyor belt and sent into the cleaning device without sliding during the cleaning process; at the same time, due to the support of the conveyor belt body, the pins are prevented from bending due to force.

[0004] However, in the above method, the part where the chip and the conveyor belt are in contact cannot be cleaned by the cleaning device, which affects the cleaning effect of the chip. Summary of the invention

[0005] The object of the present invention is to provide an automated cleaning system and method for isolator chip production, which can completely clean the isolator chip.

[0006] To achieve the above-mentioned object, in a first aspect, the present invention provides an automated cleaning system for isolator chip production, comprising a mounting table, a soaking box, an ultrasonic cleaning box, an air drying box, a conveying assembly, a cylinder seat, a cylinder, a mounting seat, two telescopic rods, two first clamping jaws, a first driving assembly, two second clamping jaws, and a second driving assembly;

[0007] The immersion box is fixedly connected to the mounting platform and is located on the top of the mounting platform; the ultrasonic cleaning box is fixedly connected to the mounting platform and is located on the top of the mounting platform; the air drying box is fixedly connected to the mounting platform and is located on the top of the mounting platform; the conveying assembly is arranged on the top of the mounting platform; the cylinder seat is arranged on one side of the conveying assembly; the cylinder is fixedly connected to the cylinder seat and is located at the bottom of the cylinder seat; the mounting seat is fixedly connected to the output end of the cylinder and is located at the bottom of the cylinder; the two telescopic rods are respectively fixedly connected to the cylinder seat, and are respectively fixedly connected to the mounting seat, and are respectively located on the sides of the cylinder; the two first clamps are respectively slidably connected to the mounting seat, and are respectively located on one side of the mounting seat; the first drive assembly is arranged on one side of the mounting seat; the two second clamps are respectively slidably connected to the mounting seat, and are respectively located on one side of the mounting seat; the second drive assembly is arranged on one side of the mounting seat.

[0008] Among them, the conveying assembly includes a guide rail, a slider, a driving screw and a first motor; the guide rail is fixedly connected to the mounting platform and is located on the top of the mounting platform; the slider is slidably connected to the guide rail, fixedly connected to the cylinder seat, and located on one side of the guide rail; the driving screw is rotatably connected to the guide rail, threadedly connected to the slider, and passes through the slider; the first motor is fixedly connected to the guide rail and is located on one side of the guide rail; the output end of the first motor is fixedly connected to the driving screw.

[0009] Wherein, the telescopic rod includes a sleeve and a sliding rod; the sleeve is fixedly connected to the cylinder seat and is located at the bottom of the cylinder seat; the sliding rod is fixedly connected to the mounting seat, slidably connected to the sleeve, and is located in the sleeve.

[0010] Among them, the first driving assembly includes a first double-threaded screw and a second motor; the first double-threaded screw is rotatably connected to the mounting seat, and is respectively threadedly connected to the two first clamping jaws, and respectively passes through the two first clamping jaws; the second motor is fixedly connected to the mounting seat and is located on one side of the mounting seat; the output end of the second motor is fixedly connected to the first double-threaded screw.

[0011] Among them, the second driving assembly includes a second double-threaded screw and a third motor; the second double-threaded screw is rotatably connected to the mounting base, and is respectively threadedly connected to the two second clamping jaws, and respectively passes through the two second clamping jaws; the third motor is fixedly connected to the mounting base and is located on one side of the mounting base; the output end of the third motor is fixedly connected to the second double-threaded screw.

[0012] Among them, the isolator chip production automated cleaning system also includes a first valve, a first tube, a second valve, a second tube and a drain pipe; the first valve is connected to the immersion tank and is located on one side of the immersion tank; the first tube is connected to the first valve and is located on one side of the first valve; the second valve is connected to the ultrasonic cleaning tank and is located on one side of the ultrasonic cleaning tank; the second tube is connected to the second valve and is located on one side of the second valve; the drain pipe is connected to the first tube and the second tube, and is located on one side of the first tube and the second tube.

[0013] In a second aspect, the present invention also provides an automated cleaning method for isolator chip production, the specific steps of which include:

[0014] Align the chip and place it between the two first clamps, start the first driving assembly, and the two first clamps clamp the chip;

[0015] Driven by the conveying assembly and the cylinder, the chip is moved into the immersion box. After immersion and cleaning for a period of time, the second driving assembly drives the two second clamps to clamp the chip, and then the first driving assembly drives the two first clamps to release, and then immersion and cleaning for a period of time;

[0016] Driven by the conveying assembly and the cylinder, the chip is taken out of the immersion box and moved into the ultrasonic cleaning box. After cleaning for a period of time, the first driving assembly drives the two first clamps to clamp the chip, and then the second driving assembly drives the two second clamps to release, and then clean for a period of time;

[0017] Driven by the conveying assembly and the cylinder, the chip is taken out of the ultrasonic cleaning box and moved into the air drying box. After air drying for a period of time, the second driving assembly drives the two second clamps to clamp the chip, and then the first driving assembly drives the two first clamps to release, and then air dry for a period of time;

[0018] Driven by the conveying assembly and the cylinder, the chip is taken out of the air drying box.

[0019] The present invention provides an automated cleaning system and method for producing isolator chips, wherein the immersion box is filled with a special cleaning liquid, the ultrasonic cleaning box is filled with deionized water, and the air drying box is used to air dry the chips; the conveying assembly is used to drive the cylinder seat to move, the cylinder is installed on the cylinder seat, and the cylinder cooperates with the two telescopic rods to drive the mounting seat to rise and fall, thereby driving the first clamp and the second clamp to rise and fall, the first driving assembly is used to drive the two first clamps to move in opposite directions, and the second driving assembly is used to drive the two second clamps to move in opposite directions, and the first clamp and the second clamp are controlled separately, so the chip can be clamped alternately; when cleaning, the chip is aligned and placed between the two first clamps, the first driving assembly is started, and the two first clamps clamp the chip; driven by the conveying assembly and the cylinder, the chip is moved to the immersion box, and after immersion and cleaning for a period of time, the second driving assembly drives the two second clamps to clamp the chip, and then the first driving assembly drives the two first clamps to release, and then the immersion and cleaning is continued for a period of time. period of time; driven by the conveying component and the cylinder, the chip is taken out from the immersion box and moved into the ultrasonic cleaning box. After cleaning for a period of time, the first driving component drives the two first clamps to clamp the chip, and then the second driving component drives the two second clamps to loosen, and then cleaning for a period of time; driven by the conveying component and the cylinder, the chip is taken out from the ultrasonic cleaning box and moved into the air-drying box. After air-drying for a period of time, the second driving component drives the two second clamps to clamp the chip, and then the first driving component drives the two first clamps to loosen, and then air-drying for a period of time; driven by the conveying component and the cylinder, the chip is taken out from the air-drying box; using the above method, when in the immersion box, the ultrasonic cleaning box and the air-drying box, the two first clamps and the two second clamps alternately clamp the chip, so the parts where the two first clamps are attached to the chip can be cleaned, and the parts where the two second clamps are attached to the chip can also be cleaned, without cleaning dead corners, so that the isolator chip can be completely cleaned. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0021] Figure 1 It is a schematic structural diagram of the first embodiment of the present invention.

[0022] Figure 2It is a structural schematic diagram of a mounting base, two first clamping jaws, a first driving assembly, two second clamping jaws and a second driving assembly according to a first embodiment of the present invention.

[0023] Figure 3 It is another structural schematic diagram of the mounting base, two first clamping jaws, a first driving assembly, two second clamping jaws and a second driving assembly according to the first embodiment of the present invention.

[0024] Figure 4 It is a schematic structural diagram of the second embodiment of the present invention.

[0025] Figure 5 It is a schematic structural diagram of the third embodiment of the present invention.

[0026] Figure 6 yes Figure 5 A partial enlargement of detail A.

[0027] Figure 7 is a flow chart of the fourth embodiment of the present invention.

[0028] 101-mounting table, 102-immersion box, 103-ultrasonic cleaning box, 104-air drying box, 105-conveying assembly, 106-cylinder seat, 107-cylinder, 108-mounting seat, 109-telescopic rod, 110-first clamping jaw, 111-first driving assembly, 112-second clamping jaw, 113-second driving assembly, 114-guide rail, 115-slider, 116-driving screw, 117-first motor, 118-sleeve , 119-sliding rod, 120-first double-threaded screw, 121-second motor, 122-second double-threaded screw, 123-third motor, 201-first valve, 202-first pipe, 203-second valve, 204-second pipe, 205-drain pipe, 301-positioning placement component, 302-mounting frame, 303-boss, 304-positioning block, 305-positioning plate, 306-third double-threaded screw, 307-fourth motor. DETAILED DESCRIPTION

[0029] The first embodiment of the present application is:

[0030] See also Figure 1-Figure 3 ,in, Figure 1 It is a schematic structural diagram of the first embodiment of the present invention. Figure 2 It is a structural schematic diagram of a mounting base, two first clamping jaws, a first driving assembly, two second clamping jaws and a second driving assembly according to a first embodiment of the present invention. Figure 3 It is another structural schematic diagram of the mounting base, two first clamping jaws, a first driving assembly, two second clamping jaws and a second driving assembly according to the first embodiment of the present invention.

[0031] The present invention provides an automated cleaning system for isolator chip production: comprising a mounting table 101, an immersion box 102, an ultrasonic cleaning box 103, an air drying box 104, a conveying assembly 105, a cylinder seat 106, a cylinder 107, a mounting seat 108, two telescopic rods 109, two first clamps 110, a first drive assembly 111, two second clamps 112 and a second drive assembly 113; the conveying assembly 105 comprises a guide rail 114, a slider 115, a drive screw 116 and a first motor 117; the telescopic rod 109 comprises a sleeve 118 and a slide rod 119; the first drive assembly 111 comprises a first double-threaded screw 120 and a second motor 121; the second drive assembly 113 comprises a second double-threaded screw 122 and a third motor 123; the isolator chip can be completely cleaned by the above scheme.

[0032] According to this specific embodiment, the immersion box 102 is fixedly connected to the mounting platform 101 and is located at the top of the mounting platform 101; the ultrasonic cleaning box 103 is fixedly connected to the mounting platform 101 and is located at the top of the mounting platform 101; the air drying box 104 is fixedly connected to the mounting platform 101 and is located at the top of the mounting platform 101; the conveying component 105 is arranged on the top of the mounting platform 101; the cylinder seat 106 is arranged on one side of the conveying component 105; the cylinder 107 is fixedly connected to the cylinder seat 106 and is located at the bottom of the cylinder seat 106; the mounting seat 108 is fixedly connected to the cylinder 1 07 is fixedly connected to the output end and is located at the bottom of the cylinder 107; the two telescopic rods 109 are respectively fixedly connected to the cylinder seat 106, and are respectively fixedly connected to the mounting seat 108, and are respectively located on the sides of the cylinder 107; the two first clamping jaws 110 are respectively slidably connected to the mounting seat 108, and are respectively located on one side of the mounting seat 108; the first driving component 111 is arranged on one side of the mounting seat 108; the two second clamping jaws 112 are respectively slidably connected to the mounting seat 108, and are respectively located on one side of the mounting seat 108; the second driving component 113 is arranged on one side of the mounting seat 108.The immersion box 102 is filled with a special cleaning liquid, the ultrasonic cleaning box 103 is filled with deionized water, and the air drying box 104 is used to air dry the chip; the conveying assembly 105 is used to drive the cylinder seat 106 to move, and the cylinder 107 is installed on the cylinder seat 106. The cylinder 107 cooperates with the two telescopic rods 109 to drive the mounting seat 108 to rise and fall, thereby driving the first clamping jaw 110 and the second clamping jaw 112 to rise and fall, the first driving assembly 111 is used to drive the two first clamping jaws 110 to move in opposite directions, and the second driving assembly 113 is used to drive the two second clamping jaws 112 to move in opposite directions. The first clamping jaw 110 and the second clamping jaw 112 are controlled separately, so the chip can be clamped alternately. When clamping the chip, it is clamped from both ends of the chip without pins; when cleaning, the chip is aligned and placed between the two first clamping jaws 110, and the first driving component 111 is started, and the two first clamping jaws 110 clamp the chip; driven by the conveying component 105 and the cylinder 107, the chip is moved to the immersion box 102, and after immersion and cleaning for a period of time, the second driving component 113 drives the two second clamping jaws 112 to clamp the chip, and then the first driving component 111 drives the two first clamping jaws 110 to loosen, and then the chip is immersed in the immersion box 102. Bubble cleaning for a period of time; driven by the conveying component 105 and the cylinder 107, the chip is taken out from the immersion box 102 and moved to the ultrasonic cleaning box 103. After cleaning for a period of time, the first driving component 111 drives the two first clamps 110 to clamp the chip, and then the second driving component 113 drives the two second clamps 112 to loosen, and then cleaning for a period of time; driven by the conveying component 105 and the cylinder 107, the chip is taken out from the ultrasonic cleaning box 103 and moved to the air drying box 104. After air drying for a period of time, the second driving component 113 drives the two second clamps 112 to clamp the chip, and then The first driving component 111 drives the two first clamps 110 to loosen and then air-dry for a period of time; driven by the conveying component 105 and the cylinder 107, the chip is taken out of the air-drying box 104; using the above method, when in the immersion box 102, the ultrasonic cleaning box 103 and the air-drying box 104, the two first clamps 110 and the two second clamps 112 alternately clamp the chip, so the parts where the two first clamps 110 and the chip are attached can be cleaned, and the parts where the two second clamps 112 and the chip are attached can also be cleaned, without cleaning dead corners, so that the isolator chip can be completely cleaned.

[0033] The guide rail 114 is fixedly connected to the mounting platform 101 and is located at the top of the mounting platform 101; the slider 115 is slidably connected to the guide rail 114, and is fixedly connected to the cylinder seat 106, and is located at one side of the guide rail 114; the drive screw 116 is rotatably connected to the guide rail 114, and is threadedly connected to the slider 115, and passes through the slider 115; the first motor 117 is fixedly connected to the guide rail 114 and is located at one side of the guide rail 114; the output end of the first motor 117 is fixedly connected to the drive screw 116. The guide rail 114 is used to install the slider 115, the first motor 117 is used to drive the drive screw 116 to rotate, the drive screw 116 drives the slider 115 to slide, and the slider 115 drives the cylinder seat 106 to move.

[0034] Secondly, the sleeve 118 is fixedly connected to the cylinder seat 106 and is located at the bottom of the cylinder seat 106; the slide bar 119 is fixedly connected to the mounting seat 108, and is slidably connected to the sleeve 118 and is located in the sleeve 118. When the mounting seat 108 is raised or lowered, the slide bar 119 slides in the sleeve 118 to guide the mounting seat 108 and prevent the mounting seat 108 from tilting.

[0035] At the same time, the first double-threaded screw 120 is rotatably connected to the mounting seat 108, and is respectively threadedly connected to the two first clamping jaws 110, and respectively passes through the two first clamping jaws 110; the second motor 121 is fixedly connected to the mounting seat 108 and is located on one side of the mounting seat 108; the output end of the second motor 121 is fixedly connected to the first double-threaded screw 120. The first double-threaded screw 120 has opposite threads on the left and right sides, so it can drive the two first clamping jaws 110 to move in opposite directions, and the second motor 121 is used to drive the first double-threaded screw 120 to rotate.

[0036] In addition, the second double-threaded screw 122 is rotatably connected to the mounting seat 108, and is respectively threadedly connected to the two second clamping jaws 112, and passes through the two second clamping jaws 112 respectively; the third motor 123 is fixedly connected to the mounting seat 108 and is located on one side of the mounting seat 108; the output end of the third motor 123 is fixedly connected to the second double-threaded screw 122. The second double-threaded screw 122 has opposite threads on the left and right sides, so it can drive the two second clamping jaws 112 to move in opposite directions, and the third motor 123 is used to drive the first double-threaded screw 120 to rotate.

[0037] The present embodiment describes an automated cleaning system for producing isolator chips. During cleaning, the chip is aligned and placed between the two first clamps 110, and the first drive component 111 is started, so that the two first clamps 110 clamp the chip; driven by the conveying component 105 and the cylinder 107, the chip is moved into the immersion tank 102, and after a period of immersion and cleaning, the second drive component 113 drives the two second clamps 112 to clamp the chip, and then the first drive component 111 drives the two first clamps 110 to release, and then the chip is immersed and cleaned for a period of time; driven by the conveying component 105 and the cylinder 107, the chip is taken out of the immersion tank 102 and moved into the ultrasonic cleaning tank 103, and after a period of cleaning, the first drive component 111 drives the two first clamps 110 to clamp the chip, and then the second drive component 113 drives the two second clamps 112 to release, and then the chip is cleaned for a period of time. ; driven by the conveying component 105 and the cylinder 107, the chip is taken out from the ultrasonic cleaning box 103 and moved to the air drying box 104. After air drying for a period of time, the second driving component 113 drives the two second clamps 112 to clamp the chip, and then the first driving component 111 drives the two first clamps 110 to loosen, and then air dry for a period of time; driven by the conveying component 105 and the cylinder 107, the chip is taken out from the air drying box 104; using the above method, when in the immersion box 102, the ultrasonic cleaning box 103 and the air drying box 104, the two first clamps 110 and the two second clamps 112 alternately clamp the chip, so that the parts where the two first clamps 110 are attached to the chip can be cleaned, and the parts where the two second clamps 112 are attached to the chip can also be cleaned, without cleaning dead corners, so that the isolator chip can be completely cleaned.

[0038] The second embodiment of the present application is:

[0039] Based on the first embodiment, please refer to Figure 4 ,in, Figure 4 It is a schematic structural diagram of the second embodiment of the present invention.

[0040] An automated cleaning system for producing isolator chips provided by the present invention further includes a first valve 201 , a first pipe 202 , a second valve 203 , a second pipe 204 and a sewage pipe 205 .

[0041] According to the present specific embodiment, the first valve 201 is connected to the immersion tank 102 and is located at one side of the immersion tank 102; the first pipe 202 is connected to the first valve 201 and is located at one side of the first valve 201; the second valve 203 is connected to the ultrasonic cleaning tank 103 and is located at one side of the ultrasonic cleaning tank 103; the second pipe 204 is connected to the second valve 203 and is located at one side of the second valve 203; the sewage pipe 205 is connected to the first pipe 202 and the second pipe 204 and is located at one side of the first pipe 202 and the second pipe 204. After a period of use, the first valve 201 is opened to discharge and replace the cleaning liquid in the immersion tank 102 from the first pipe 202, and the second valve 203 is opened to discharge and replace the deionized water in the ultrasonic cleaning tank 103 from the second pipe 204, and the deionized water is discharged through the sewage pipe 205.

[0042] The automated cleaning system for producing isolator chips described in this embodiment is used for a period of time. The first valve 201 is opened to discharge and replace the cleaning liquid in the immersion tank 102 from the first tube 202. The second valve 203 is opened to discharge and replace the deionized water in the ultrasonic cleaning tank 103 from the second tube 204, and the deionized water is discharged through the drain pipe 205.

[0043] The third embodiment of the present application is:

[0044] Based on the second embodiment, please refer to Figure 5-Figure 6 ,in, Figure 5 It is a schematic structural diagram of the third embodiment of the present invention. Figure 6 yes Figure 5 A partial enlargement of detail A.

[0045] An isolator chip production automated cleaning system provided by the present invention also includes a positioning and placement component 301; the positioning and placement component 301 includes a mounting frame 302, a boss 303, two positioning blocks 304, two positioning plates 305, a third double-threaded screw 306 and a fourth motor 307.

[0046] According to this specific embodiment, the positioning and placing component 301 is arranged on the top of the mounting table 101. When cleaning, the chip needs to be aligned and placed between the two first clamps 110, which is troublesome, so the positioning and placing component 301 is arranged to assist in positioning and placing for the first clamps 110 to clamp.

[0047] Among them, the mounting frame 302 is fixedly connected to the mounting platform 101 and is located at the top of the mounting platform 101; the boss 303 is fixedly connected to the mounting frame 302 and is located at the top of the mounting frame 302; the two positioning blocks 304 are respectively slidably connected to the mounting frame 302 and are respectively located on the inner sides of the mounting frame 302; the two positioning plates 305 are respectively fixedly connected to the two positioning blocks 304 and respectively pass through the mounting frame 302; the third double-threaded screw 306 is rotatably connected to the mounting frame 302, and is respectively threadedly connected to the two positioning blocks 304, and respectively passes through the two positioning blocks 304; the fourth motor 307 is fixedly connected to the mounting frame 302 and is located on one side of the mounting frame 302; the output end of the fourth motor 307 is fixedly connected to the third double-threaded screw 306. The width of the boss 303 is adapted to the spacing between the pins on both sides of the chip, and the center of the boss 303 is opposite to the center of the line connecting the two first clamps 110. The chip is placed on the boss 303, and the pins on both sides are suspended on the front and rear sides of the boss 303. Then the fourth motor 307 is started to drive the third double-threaded screw 306 to drive the two positioning blocks 304 to move closer to each other, so that the two positioning plates 305 move closer to each other, and push the chip so that the center of the chip coincides with the center of the boss 303, that is, it is opposite to the center of the line connecting the two first clamps 110. Then the two positioning plates 305 are reset, and the two first clamps 110 can move down to clamp the chip from both sides of the chip.

[0048] The automated cleaning system for producing isolator chips described in this embodiment places the chip on the boss 303, with the pins on both sides suspended on the front and rear sides of the boss 303, and then starts the fourth motor 307 to drive the third double-threaded screw 306, driving the two positioning blocks 304 to move closer to each other, so that the two positioning plates 305 move closer to each other, and push the chip so that the center of the chip coincides with the center of the boss 303, that is, directly opposite the center of the line connecting the two first clamps 110, and then the two positioning plates 305 are reset, and the two first clamps 110 can move down to clamp the chip from both sides of the chip.

[0049] The fourth embodiment of the present application is:

[0050] See also Figure 7 , Figure 7 is a flow chart of the fourth embodiment of the present invention.

[0051] The present invention provides an automated cleaning method for isolator chip production, the specific steps of which include:

[0052] S1: align the chip and place it between the two first clamps 110, start the first driving assembly 111, and the two first clamps 110 clamp the chip;

[0053] S2, driven by the conveying assembly 105 and the cylinder 107, moves the chip into the immersion box 102. After immersion and cleaning for a period of time, the second driving assembly 113 drives the two second clamping jaws 112 to clamp the chip, and then the first driving assembly 111 drives the two first clamping jaws 110 to release, and then immerse and clean for a period of time;

[0054] S3, driven by the conveying assembly 105 and the cylinder 107, takes the chip out of the immersion tank 102 and moves it into the ultrasonic cleaning tank 103. After cleaning for a period of time, the first driving assembly 111 drives the two first clamps 110 to clamp the chip, and then the second driving assembly 113 drives the two second clamps 112 to release, and then cleans for a period of time;

[0055] S4, driven by the conveying assembly 105 and the cylinder 107, the chip is taken out from the ultrasonic cleaning box 103 and moved to the air drying box 104. After air drying for a period of time, the second driving assembly 113 drives the two second clamping jaws 112 to clamp the chip, and then the first driving assembly 111 drives the two first clamping jaws 110 to release, and then air dry for a period of time;

[0056] S5, driven by the conveying assembly 105 and the cylinder 107, the chip is taken out from the air drying box 104.

[0057] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. An automated cleaning system for isolator chip production, characterized in that: It includes a mounting table, a soaking box, an ultrasonic cleaning box, an air drying box, a conveying assembly, a cylinder seat, a cylinder, a mounting seat, two telescopic rods, two first clamping jaws, a first driving assembly, two second clamping jaws and a second driving assembly; The immersion box is fixedly connected to the mounting platform and is located on the top of the mounting platform; the ultrasonic cleaning box is fixedly connected to the mounting platform and is located on the top of the mounting platform; the air drying box is fixedly connected to the mounting platform and is located on the top of the mounting platform; the conveying assembly is arranged on the top of the mounting platform; the cylinder seat is arranged on one side of the conveying assembly; the cylinder is fixedly connected to the cylinder seat and is located at the bottom of the cylinder seat; the mounting seat is fixedly connected to the output end of the cylinder and is located at the bottom of the cylinder; the two telescopic rods are respectively fixedly connected to the cylinder seat, and are respectively fixedly connected to the mounting seat, and are respectively located on the sides of the cylinder; the two first clamps are respectively slidably connected to the mounting seat, and are respectively located on one side of the mounting seat; the first drive assembly is arranged on one side of the mounting seat; the two second clamps are respectively slidably connected to the mounting seat, and are respectively located on one side of the mounting seat; the second drive assembly is arranged on one side of the mounting seat.

2. An automatic cleaning system for isolator chip production as claimed in claim 1, characterized in that: The conveying assembly includes a guide rail, a slider, a driving screw and a first motor; the guide rail is fixedly connected to the mounting platform and is located on the top of the mounting platform; the slider is slidably connected to the guide rail, fixedly connected to the cylinder seat, and located on one side of the guide rail; the driving screw is rotatably connected to the guide rail, threadably connected to the slider, and passes through the slider; the first motor is fixedly connected to the guide rail and is located on one side of the guide rail; the output end of the first motor is fixedly connected to the driving screw.

3. An automatic cleaning system for isolator chip production as claimed in claim 2, characterized in that: The telescopic rod comprises a sleeve and a sliding rod; the sleeve is fixedly connected to the cylinder seat and is located at the bottom of the cylinder seat; the sliding rod is fixedly connected to the mounting seat, slidably connected to the sleeve, and is located in the sleeve.

4. An automated cleaning system for isolator chip production as claimed in claim 3, characterized in that: The first driving assembly includes a first double-threaded screw and a second motor; the first double-threaded screw is rotatably connected to the mounting base, and is respectively threadedly connected to the two first clamping jaws, and respectively passes through the two first clamping jaws; the second motor is fixedly connected to the mounting base and is located on one side of the mounting base; the output end of the second motor is fixedly connected to the first double-threaded screw.

5. An automated cleaning system for isolator chip production as claimed in claim 4, characterized in that: The second driving assembly includes a second double-threaded screw and a third motor; the second double-threaded screw is rotatably connected to the mounting base, and is respectively threadedly connected to the two second clamping jaws, and respectively passes through the two second clamping jaws; the third motor is fixedly connected to the mounting base and is located on one side of the mounting base; the output end of the third motor is fixedly connected to the second double-threaded screw.

6. An automated cleaning system for isolator chip production as claimed in claim 5, characterized in that: The isolator chip production automated cleaning system also includes a first valve, a first pipe, a second valve, a second pipe and a drain pipe; the first valve is connected to the immersion tank and is located on one side of the immersion tank; the first pipe is connected to the first valve and is located on one side of the first valve; the second valve is connected to the ultrasonic cleaning tank and is located on one side of the ultrasonic cleaning tank; the second pipe is connected to the second valve and is located on one side of the second valve; the drain pipe is connected to the first pipe and the second pipe, and is located on one side of the first pipe and the second pipe.

7. An automated cleaning method for isolator chip production, applied to an automated cleaning system for isolator chip production as claimed in any one of claims 1 to 6, characterized in that: The specific steps include: Align the chip and place it between the two first clamps, start the first driving assembly, and the two first clamps clamp the chip; Driven by the conveying assembly and the cylinder, the chip is moved into the immersion box. After immersion and cleaning for a period of time, the second driving assembly drives the two second clamps to clamp the chip, and then the first driving assembly drives the two first clamps to release, and then immersion and cleaning for a period of time; Driven by the conveying assembly and the cylinder, the chip is taken out of the immersion box and moved into the ultrasonic cleaning box. After cleaning for a period of time, the first driving assembly drives the two first clamps to clamp the chip, and then the second driving assembly drives the two second clamps to release, and then clean for a period of time; Driven by the conveying assembly and the cylinder, the chip is taken out of the ultrasonic cleaning box and moved into the air drying box. After air drying for a period of time, the second driving assembly drives the two second clamps to clamp the chip, and then the first driving assembly drives the two first clamps to release, and then air dry for a period of time; Driven by the conveying assembly and the cylinder, the chip is taken out of the air drying box.

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