Display panel, display module and preparation method thereof

Abstract

The invention provides a display panel, a display module and a preparation method thereof. The display panel includes: a substrate; the first binding pin is located on one side of the substrate and located in the binding area; the second binding pin and the first binding pin are located on the same side of the substrate, the second binding pin is located in the binding area, and an interval area is formed between the first binding pin and the second binding pin; the supporting structure is located in the interval area, the supporting structure comprises an enclosure frame and filling glue, and the filling glue is located in the enclosure frame. The filling glue is arranged in the enclosure frame, the formed supporting structure is relatively stable, and when a chip is bound in the display panel by using a COP technology, the filling glue in the supporting structure does not wriggle and accumulate under the limiting action of the enclosure frame and is high in extrusion resistance, so that deformation of the display panel is avoided, the problems of bright lines, poor reliability and the like are avoided, and the service life of the display panel is prolonged. And the yield of the display module is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display module and a method for preparing the same. Background Art

[0002] In current display modules, when binding driver chips, the chip on PI (COP) technology is generally used on the substrate of the flexible display panel to further reduce the border and achieve a nearly borderless effect. However, due to the limitations of related technologies, the current COP technology still cannot meet the requirements, for example, there will be problems such as bright lines and poor reliability. Summary of the invention

[0003] In view of this, an embodiment of the present application provides a display panel and a display module and a method for manufacturing the same.

[0004] In a first aspect, the present application provides a display panel, the display panel including a binding area, and the display panel including:

[0005] substrate;

[0006] A first binding pin is located on one side of the substrate and in the binding area;

[0007] The second binding pin is located on the same side of the substrate as the first binding pin and is located in the binding area, and there is a spacing area between the first binding pin and the second binding pin;

[0008] The supporting structure is located in the spacing area. The supporting structure includes a surrounding frame and a filling glue. The filling glue is located in the surrounding frame.

[0009] In one embodiment, along a direction perpendicular to the substrate, the thickness of the support structure is greater than or equal to the thickness of the first binding pin, and / or the thickness of the support structure is greater than or equal to the thickness of the second binding pin;

[0010] Preferably, the substrate comprises a first flexible substrate, an adhesive and a second flexible substrate which are stacked, and the first flexible substrate is located on a side of the second flexible substrate away from the supporting structure;

[0011] Preferably, the first flexible substrate comprises polyethylene terephthalate, the adhesive comprises a pressure-sensitive adhesive, and the second flexible substrate comprises polyimide.

[0012] In one embodiment, the first binding pin includes a plurality of first sub-binding pins that are spaced apart and sequentially arranged along a first direction, and the support structure extends along the first direction;

[0013] Preferably, the orthographic projection of the support structure on the substrate is a complete graphic on the entire surface; or,

[0014] The number of the supporting structures is multiple, and the multiple supporting structures are arranged at intervals, and the interval between adjacent supporting structures is 100 μm to 500 μm;

[0015] Preferably, a through hole is provided in the support structure;

[0016] Preferably, the through hole is surrounded by a frame.

[0017] A second aspect of the present application provides a display module, the display module includes a binding area, and the display module includes: a display panel and a chip;

[0018] The display panel includes:

[0019] substrate;

[0020] A first binding pin is located on one side of the substrate and in the binding area;

[0021] The second binding pin is located on the same side of the substrate as the first binding pin and is located in the binding area, and there is a spacing area between the first binding pin and the second binding pin;

[0022] A support structure is located in the spacing area, the support structure includes a surrounding frame and a filling glue, and the filling glue is located in the surrounding frame;

[0023] The chip includes: a chip body, a third binding pin and a fourth binding pin;

[0024] The third binding pin is located between the first binding pin and the chip body;

[0025] The fourth binding pin is located between the second binding pin and the chip body;

[0026] Along a direction perpendicular to the substrate, the thickness of the support structure is greater than or equal to the thickness of the first binding pin and less than the distance between the surface of the chip body close to the substrate and the substrate; and / or,

[0027] The thickness of the support structure is greater than or equal to the thickness of the second binding pin, and is less than the distance between the surface of the chip body close to the substrate and the substrate.

[0028] In one embodiment, the display module further includes: a conductive adhesive located between the chip body and the substrate and covering the first binding pin, the second binding pin, the third binding pin, the fourth binding pin and the supporting structure.

[0029] In one embodiment, along the direction in which the first binding pin or the second binding pin extends, the length of the chip is greater than or equal to the length of the supporting structure.

[0030] A third aspect of the present application provides a method for preparing a display panel, wherein the display panel includes a binding area, and the preparation method includes:

[0031] preparing a first bonding pin in a bonding area on one side of the substrate;

[0032] A second binding pin is prepared on the same side of the substrate and the first binding pin; the second binding pin is located in the binding area, and there is a spacing area between the first binding pin and the second binding pin;

[0033] A supporting structure is prepared in the spacing area; the supporting structure includes a surrounding frame and a filling glue, and the filling glue is located in the surrounding frame.

[0034] In one embodiment, preparing the support structure in the spaced region comprises:

[0035] preparing a layer of framing material in the spaced-apart area;

[0036] Performing patterning on the frame material layer to obtain a frame;

[0037] Filling glue is prepared in the surrounding frame to obtain a supporting structure.

[0038] A fourth aspect of the present application provides a method for preparing a display module, wherein the display module includes a binding area, and the preparation method includes:

[0039] preparing a first bonding pin in a bonding area on one side of the substrate;

[0040] A second binding pin is prepared on the same side of the substrate and the first binding pin; the second binding pin is located in the binding area, and there is a spacing area between the first binding pin and the second binding pin;

[0041] Prepare a support structure in the spacing area; the support structure includes a surrounding frame and a filling glue, and the filling glue is located in the surrounding frame;

[0042] Conductive glue is prepared on the first binding pin and the second binding pin on a side away from the substrate;

[0043] Bond the chip on the side of the conductive adhesive away from the substrate;

[0044] The conductive adhesive is heated and pressure is applied to the chip toward the substrate.

[0045] In a fifth aspect, the present application provides a display device, which includes the above-mentioned display panel, or includes the above-mentioned display module, or includes the display panel prepared by the above-mentioned preparation method, or includes the display module prepared by the above-mentioned preparation method.

[0046] In the display panel of the embodiment of the present application, the filling glue is arranged in the frame, and the formed support structure can support the spacing area to prevent the partial film layer (for example, the organic film layer) on the side of the support structure close to the substrate from breaking due to extrusion in a direction perpendicular to the plane where the substrate is located; and the support structure is relatively stable. When the chip is bound in the display panel using the COP technology, the filling glue in the support structure will not creep and accumulate under the limiting effect of the frame, and has strong anti-extrusion ability, so as not to cause deformation of the display panel, and then there will be no problems such as bright lines and poor reliability, thereby improving the yield of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 The figure is a schematic diagram of a top view of the structure of a display panel in one embodiment of the present application.

[0048] Figure 2 It is a schematic diagram of the side structure of a display panel in one embodiment of the present application.

[0049] Figure 3 This is a schematic diagram of a top view of the structure of a display panel in another embodiment of the present application.

[0050] Figure 4 This is a schematic diagram of a top view of the structure of a display panel in another embodiment of the present application.

[0051] Figure 5 It is a schematic diagram of the side structure of a display module in one embodiment of the present application.

[0052] Figure 6 This is a side view structural diagram of a display module in another embodiment of the present application.

[0053] Figure 7 The figure is a schematic flow chart of a method for preparing a display panel in one embodiment of the present application.

[0054] Figure 8 This is a schematic diagram of the process for preparing a support structure in one embodiment of the present application.

[0055] Fig. 9 It is a schematic diagram of the process of preparing a display module in one embodiment of the present application. DETAILED DESCRIPTION

[0056] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0057] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods and means well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0058] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0059] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0060] The present application provides a display panel according to a first aspect. Figure 1 The structural schematic diagram of the display panel shown in the figure, the display panel includes a binding area 10, and the display panel includes: a substrate 100; a first binding pin 200, located on one side of the substrate 100 and located in the binding area 10; a second binding pin 300, located on the same side of the substrate 100 as the first binding pin 200, and located in the binding area 10, with a spacing area 110 between the first binding pin 200 and the second binding pin 300; a supporting structure 400, located in the spacing area 110, the supporting structure 400 includes a surrounding frame 410 and a filling glue 420, and the filling glue 420 is located in the surrounding frame 410.

[0061] In the display panel of the embodiment of the present application, the filling glue is arranged in the frame, and the formed support structure can support the spacing area to prevent the partial film layer (for example, the organic film layer) on the side of the support structure close to the substrate from breaking due to extrusion in a direction perpendicular to the plane where the substrate is located; and the support structure is relatively stable. When the chip is bound in the display panel using the COP technology, the filling glue in the support structure will not creep and accumulate under the limiting effect of the frame, and has strong anti-extrusion ability, so as not to cause deformation of the display panel, and then there will be no problems such as bright lines and poor reliability, thereby improving the yield of the display module.

[0062] It can be understood that the first binding pin 200 can be an input binding pin (input bump), and the second binding pin 300 can be an output binding pin (output bump); or, the first binding pin 200 can be an output binding pin, and the second binding pin 300 can be an input binding pin.

[0063] It is understandable that after the chip is bound to the display panel using the COP technology, the substrate in the display panel is bent, and the chip is bent to the backlight side of the display panel, which is conducive to reducing the frame of the display panel. The substrate in the display panel needs to use a flexible substrate. In one embodiment, refer to Figure 2 As shown in the structural diagram of the display panel, the substrate 100 includes a first flexible substrate 101 , an adhesive 102 , and a second flexible substrate 103 which are stacked. The first flexible substrate 101 is located on a side of the second flexible substrate 103 away from the support structure 400 .

[0064] In one embodiment, the first flexible substrate includes polyethylene terephthalate (PET), the adhesive includes pressure sensitive adhesive (PSA), and the second flexible substrate includes polyimide (PI). Thus, the obtained substrate has excellent flexibility and excellent bending performance.

[0065] In one embodiment, along a direction perpendicular to the substrate, the thickness of the support structure is greater than or equal to the thickness of the first binding pin, and / or the thickness of the support structure is greater than or equal to the thickness of the second binding pin. Thus, the thickness of the support structure is greater than the thickness of the first binding pin or the second binding pin, which is conducive to playing a good supporting role when binding the chip.

[0066] It can be understood that when pressure-sensitive adhesive is used in the substrate, the existence of the supporting structure prevents the pressure-sensitive adhesive corresponding to the spacing area from stacking and deforming when heated, thereby ensuring that the display panel does not deform; at the same time, the supporting structure can also block the heat transfer to the pressure-sensitive adhesive, further reducing the risk of deformation of the pressure-sensitive adhesive and improving the pressure resistance of the display panel.

[0067] In one embodiment, referring to Figure 1 In the structural schematic diagram of the display panel shown, the first binding pin 200 includes a plurality of first sub-binding pins 210 that are spaced apart and sequentially arranged along a first direction, and the supporting structure 400 extends along the first direction.

[0068] It is understandable that a plurality of first sub-binding pins 210 arranged at intervals and arranged in sequence along the first direction constitute a first sub-binding pin group, the number of the first sub-binding pin group may be one or more, and when the number of the first sub-binding pin group is more than one, the multiple first sub-binding pin groups are arranged along the second direction. It is understandable that the second binding pin 300 includes a plurality of second sub-binding pins 310 arranged at intervals and arranged in sequence along the first direction, the plurality of second sub-binding pins 310 arranged at intervals and arranged in sequence along the first direction constitute a second sub-binding pin group, the number of the second sub-binding pin group may be one or more, and when the number of the second sub-binding pin group is more than one, the multiple second sub-binding pin groups are arranged along the second direction. The first direction intersects with the second direction, and the angle between the first direction and the second direction may be an acute angle, an obtuse angle, or a right angle.

[0069] In one embodiment, referring to Figure 1 In the structural diagram of the display panel shown in FIG. 1 , the orthographic projection of the support structure 400 on the substrate 100 is a complete figure, and along the first direction, the length of the support structure 400 can be equal to the length of the first sub-binding pin 210 extending along the first direction. As a result, the support effect of the support structure 400 is excellent, and when the chip is bound, the substrate 100 corresponding to the spacing area 110 is basically not deformed, so that the yield of the display panel is high.

[0070] It should be noted that the orthographic projection of the support structure 400 on the substrate 100 is a complete figure, which means that the orthographic projection of the support structure 400 on the substrate 100 is a continuous figure without any gaps or holes, or in other words, the orthographic projection of the support structure 400 on the substrate 100 is a solid figure.

[0071] In another embodiment, referring to Figure 3 In the structural schematic diagram of the display panel shown, there are multiple support structures 400, and the multiple support structures 400 are arranged at intervals. The interval between adjacent support structures 400 is 100μm to 500μm, for example, it can be 100μm, 150μm, 200μm, 250μm, 300μm, 350μm, 400μm, 450μm or 500μm, etc. Therefore, the spacing between the support structures 400 is small, the support effect of the support structure 400 is excellent, and when the chip is bound, the substrate 100 corresponding to the spacing area 110 will basically not be deformed, so that the yield of the display panel is high.

[0072] It can be understood that the display panel of the embodiment of the present application is suitable for binding chips with smaller sizes, and has better effects when binding chips with larger sizes.

[0073] In one embodiment, referring to Figure 4In the structural diagram of the display panel shown in the figure, a through hole 430 is provided in the support structure 400. Therefore, when the chip is bound, the substrate or the colloid can enter the through hole to buffer part of the pressure, play a better protective role, avoid the occurrence of large-area deformation in the display panel, and thus improve the yield of the display panel.

[0074] Exemplarily, the substrate also includes an electrostatic discharge (ESD) circuit and an array test (AT) circuit. The above circuits can be routed through the through holes in the support structure to ensure the normal operation of the display panel.

[0075] In one embodiment, referring to Figure 4 In the structural diagram of the display panel shown in the figure, the frame 410 is surrounded by a through hole 430. Therefore, the frame 410 has a better protection effect on the filling glue 420, and the through hole 430 has a better effect of buffering pressure, which is more conducive to improving the yield of the display panel.

[0076] The second aspect of the present application provides a display module, referring to Figure 5 The structural schematic diagram of the display panel shown in the figure, the display module includes a binding area 10, and the display module includes: a display panel 1 and a chip 2; the display panel 1 includes: a substrate 100; a first binding pin 200, which is located on one side of the substrate 100 and is located in the binding area 10; a second binding pin 300, which is located on the same side of the substrate 100 as the first binding pin 200, and is located in the binding area 10, and there is a spacing area 110 between the first binding pin 200 and the second binding pin 300; a support structure 400, which is located in the spacing area 110, and the support structure 400 includes a surrounding frame 410 and a filling glue 420, and the filling glue 420 is located in the surrounding frame 410; the chip 2 includes: a chip The chip body 500, the third binding pin 600 and the fourth binding pin 700; the third binding pin 600 is located between the first binding pin 200 and the chip body 500; the fourth binding pin 700 is located between the second binding pin 300 and the chip body 500; along the direction perpendicular to the substrate 100, the thickness of the support structure 400 is greater than or equal to the thickness of the first binding pin 200, and is less than the distance between the surface of the chip body 500 close to the substrate 100 and the substrate 100; and / or, the thickness of the support structure 400 is greater than or equal to the thickness of the second binding pin 300, and is less than the distance between the surface of the chip body 500 close to the substrate 100 and the substrate 100. As a result, the support structure 400 has an excellent support effect, effectively avoiding deformation of the display panel when the chip is bound, avoiding the breakage of the film layer on the side of the substrate close to the chip, avoiding bright lines and other problems, and improving the yield of the display module.

[0077] It should be noted that the display panel is consistent with the previous description and will not be elaborated here.

[0078] It should be noted that this embodiment can be combined with the previous embodiments in part or in whole, and will not be described in detail here.

[0079] It can be understood that the third binding pin is set corresponding to the first binding pin, for example, the first binding pin includes a plurality of first sub-binding pins, the third binding pin includes a plurality of third sub-binding pins, the number of the first sub-binding pins is the same as the number of the third sub-binding pins, and the orthographic projection of the first sub-binding pin on the substrate overlaps or completely coincides with the orthographic projection of the third sub-binding pin on the substrate. The second binding pin is set corresponding to the fourth binding pin, and the manner in which the second binding pin is set corresponding to the fourth binding pin refers to the manner in which the third binding pin is set corresponding to the first binding pin, and no further elaboration is given here.

[0080] It is understandable that, along the direction perpendicular to the substrate 100, the thickness of the first binding pin 200 is substantially the same as the thickness of the second binding pin 300, and the thickness of the support structure 400 is greater than or equal to the thickness of the first binding pin 200 or the thickness of the second binding pin 300. Exemplarily, the thickness of the support structure 400 is greater than the thickness of the first binding pin 200 and the second binding pin 300. At this time, there is almost no height difference in the entire binding area, and when the chip is bound, there will be no obvious deformation caused by the stacking of glue in the substrate and between the chip and the substrate, thereby improving the manufacturing yield of the display module.

[0081] It is understandable that in a display module, the number of chips can be one or more. As long as the requirements can be met, those skilled in the art can flexibly select according to actual conditions.

[0082] In one embodiment, referring to Figure 6 In the structural diagram of the display panel shown in FIG. 1 , the display module further includes: a conductive adhesive 800, which is located between the chip body 500 and the substrate 100 and covers the first binding pin 200, the second binding pin 300, the third binding pin 600, the fourth binding pin 700 and the support structure 400. Thus, the conductive adhesive 800 can combine the first binding pin 200, the second binding pin 300, the third binding pin 600 and the fourth binding pin 700 together and can achieve a conductive effect.

[0083] Exemplarily, the conductive adhesive is anisotropic conductive adhesive (Anisotropically Conductive Film, referred to as ACF).

[0084] In one embodiment, along the direction in which the first binding pin 200 or the second binding pin 300 extends, the length of the chip 2 is greater than or equal to the length of the support structure 400. Exemplarily, the first binding pin 200 includes a plurality of first sub-binding pins 210 arranged at intervals, and the first sub-binding pins 210 are arranged in sequence along the first direction, and in the first direction, the length of the chip 2 is greater than or equal to the length of the support structure 400. Thus, the length of the chip 2 is longer, and the conductive adhesive can completely cover the support structure 400, avoiding exposure of the support structure 400, thereby avoiding aging of the support structure 400, ensuring that the support structure 400 can maintain a relatively excellent support effect for a long time, and further improving the reliability of the display module.

[0085] A third aspect of the present application provides a method for preparing a display panel, wherein the display panel includes a binding area, and a Figure 7 The schematic flow chart of the method for preparing a display panel is shown, and the method for preparing a display panel includes the following steps.

[0086] S110: preparing a first binding pin in a binding area on one side of the substrate.

[0087] It can be understood that the substrate and the first binding pin are consistent with the above description and will not be described in detail here.

[0088] S120: preparing a second binding pin on the same side of the substrate and the first binding pin.

[0089] It should be noted that the second binding pin is located in the binding area, and there is a spacing area between the first binding pin and the second binding pin.

[0090] It is understandable that the second binding pin is consistent with the previous description and will not be described in detail here.

[0091] S130: Preparing a support structure in the spacing area.

[0092] It can be understood that the supporting structure is consistent with the above description and will not be elaborated here.

[0093] Exemplarily, the supporting structure includes a surrounding frame and a filling glue, and the filling glue is located in the surrounding frame.

[0094] In one embodiment, referring to Figure 8 The schematic flow chart of the method for preparing a support structure is shown, and preparing the support structure in the spacing area includes the following steps.

[0095] S131: preparing a frame material layer in the spacing area.

[0096] Exemplarily, the material of the frame material layer includes but is not limited to photoresist and the like.

[0097] S132: performing patterning on the frame material layer to obtain a frame.

[0098] Exemplarily, patterning the frame material layer includes: sequentially exposing, developing, and etching the frame material layer to obtain a frame with a specific pattern.

[0099] In one embodiment, the support structure has a through hole, which is formed by a frame. Specifically, during the preparation of the frame, when the frame material layer is patterned, the corresponding frame outline is etched, and a portion of the frame outline is used to enclose a through hole structure.

[0100] S133: Prepare filling glue in the surrounding frame to obtain a supporting structure.

[0101] Exemplarily, the surrounding frame is filled with high modulus heat-insulating organic glue by inkjet printing, and the filling glue is obtained after curing.

[0102] Exemplarily, the frame encloses a through hole, and no filling glue is prepared at the position of the through hole.

[0103] A fourth aspect of the present application provides a method for preparing a display module, wherein the display module includes a binding area, and a Fig. 9 The manufacturing method of the display module shown is a flow chart of the manufacturing method of the display module, and the manufacturing method of the display module includes the following steps.

[0104] S210: preparing a first binding pin in a binding area on one side of the substrate.

[0105] It can be understood that the substrate and the first binding pin are consistent with the above description and will not be described in detail here.

[0106] S220: preparing a second binding pin on the same side of the substrate and the first binding pin.

[0107] It should be noted that the second binding pin is located in the binding area, and there is a spacing area between the first binding pin and the second binding pin.

[0108] It is understandable that the second binding pin is consistent with the previous description and will not be described in detail here.

[0109] S230: Preparing a support structure in the spacing area.

[0110] It can be understood that the supporting structure is consistent with the above description and will not be elaborated here.

[0111] Exemplarily, the supporting structure includes a surrounding frame and a filling glue, and the filling glue is located in the surrounding frame.

[0112] S240: preparing a conductive adhesive on a side of the first binding pin and the second binding pin away from the substrate.

[0113] It is understandable that the conductive adhesive is consistent with the above description and will not be described in detail here.

[0114] Exemplarily, the conductive adhesive may be attached to the surface of the first binding pin and the second binding pin away from the substrate, and the conductive adhesive covers the support structure.

[0115] S250: Bond the chip on the side of the conductive adhesive away from the substrate.

[0116] It is understandable that the chip is consistent with the previous description and will not be described in detail here.

[0117] S260: The conductive adhesive is heated and pressure is applied to the chip toward the substrate.

[0118] It is understandable that the heating treatment will soften the conductive adhesive and fill the gap between the chip and the substrate under the action of pressure, thereby improving the chip binding yield. Under the support of the support structure, the pressure is evenly applied to the entire chip surface, preventing the film layer in the substrate from being squeezed and deformed, which in turn causes the film layer to break, resulting in a higher production yield of the display module.

[0119] In a fifth aspect, the present application provides a display device, which includes the above-mentioned display panel, or includes the above-mentioned display module, or includes the display panel prepared by the above-mentioned preparation method, or includes the display module prepared by the above-mentioned preparation method.

[0120] It is understandable that the display device of this embodiment may include, in addition to the above-mentioned display panel or display module, structures that a conventional display device should have, such as a light-emitting device, a packaging layer, etc., which will not be elaborated herein.

[0121] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0122] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A display panel, characterized in that: The display panel includes a binding area, and the display panel includes: substrate; A first binding pin is located at one side of the substrate and in the binding area; a second binding pin, located on the same side of the substrate as the first binding pin and located in the binding area, with a spacing area between the first binding pin and the second binding pin; A supporting structure is located in the spacing area, and the supporting structure includes a surrounding frame and a filling glue, and the filling glue is located in the surrounding frame.

2. The display panel according to claim 1, characterized in that: Along a direction perpendicular to the substrate, the thickness of the support structure is greater than or equal to the thickness of the first binding pin, and / or the thickness of the support structure is greater than or equal to the thickness of the second binding pin; Preferably, the substrate comprises a first flexible substrate, an adhesive and a second flexible substrate which are stacked, and the first flexible substrate is located on a side of the second flexible substrate away from the supporting structure; Preferably, the first flexible substrate comprises polyethylene terephthalate, the adhesive comprises a pressure-sensitive adhesive, and the second flexible substrate comprises polyimide.

3. The display panel according to claim 1, characterized in that: The first binding pin includes a plurality of first sub-binding pins that are spaced apart and sequentially arranged along a first direction, and the supporting structure extends along the first direction; Preferably, the orthographic projection of the support structure on the substrate is a whole-surface complete graphic; or, The number of the supporting structures is multiple, the multiple supporting structures are arranged at intervals, and the interval between adjacent supporting structures is 100 μm to 500 μm; Preferably, a through hole is provided in the support structure; Preferably, the frame encloses the through hole.

4. A display module, characterized in that: The display module includes a binding area, and the display module includes: a display panel and a chip; The display panel comprises: substrate; A first binding pin is located at one side of the substrate and in the binding area; a second binding pin, located on the same side of the substrate as the first binding pin and located in the binding area, with a spacing area between the first binding pin and the second binding pin; A support structure is located in the spacing area, the support structure includes a surrounding frame and a filling glue, and the filling glue is located in the surrounding frame; The chip comprises: a chip body, a third binding pin and a fourth binding pin; The third binding pin is located between the first binding pin and the chip body; The fourth binding pin is located between the second binding pin and the chip body; Along a direction perpendicular to the substrate, the thickness of the support structure is greater than or equal to the thickness of the first binding pin and less than the distance between the surface of the chip body close to the substrate and the substrate; and / or, The thickness of the support structure is greater than or equal to the thickness of the second binding pin, and is less than the distance between the surface of the chip body close to the substrate and the substrate.

5. The display module according to claim 4, characterized in that: Also includes: The conductive adhesive is located between the chip body and the substrate and covers the first binding pin, the second binding pin, the third binding pin, the fourth binding pin and the supporting structure.

6. The display module according to claim 4, characterized in that: Along a direction in which the first binding pin or the second binding pin extends, a length of the chip is greater than or equal to a length of the supporting structure.

7. A method for preparing a display panel, characterized in that: The display panel includes a binding area, and the preparation method includes: preparing a first binding pin in the binding area on one side of the substrate; A second binding pin is prepared on the same side of the substrate and the first binding pin; the second binding pin is located in the binding area, and there is a spacing area between the first binding pin and the second binding pin; A support structure is prepared in the spacing area; the support structure includes a surrounding frame and a filling glue, and the filling glue is located in the surrounding frame.

8. The preparation method according to claim 7, characterized in that: Preparing a support structure in the spaced region comprises: preparing a layer of framing material in the spacing area; Performing patterning on the frame material layer to obtain the frame; Filling glue is prepared in the surrounding frame to obtain the supporting structure.

9. A method for preparing a display module, characterized in that: The display module includes a binding area, and the preparation method includes: preparing a first binding pin in the binding area on one side of the substrate; A second binding pin is prepared on the same side of the substrate and the first binding pin; the second binding pin is located in the binding area, and there is a spacing area between the first binding pin and the second binding pin; A support structure is prepared in the spacing area; the support structure comprises a surrounding frame and a filling glue, and the filling glue is located in the surrounding frame; Prepare a conductive adhesive on a side of the first binding pin and the second binding pin away from the substrate; Binding a chip on a side of the conductive adhesive away from the substrate; The conductive adhesive is heated, and pressure is applied to the chip toward the substrate.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 3, or a display module comprising any one of claims 4 to 6, or a display panel prepared by the preparation method of any one of claims 7 to 8, or a display module prepared by the preparation method of claim 9.

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