Wiring structure, chip, and electronic device

Abstract

The application discloses a wiring structure, a chip and an electronic device, and belongs to the technical field of circuits. The wiring structure comprises a plurality of layer-changing structures arranged in a wiring direction and staggered in a direction perpendicular to the wiring direction. The layer-changing structure comprises a first signal line and a third signal line located at a first wiring layer, and a second signal line and a fourth signal line located at a second wiring layer. The projection of the first signal line and the second signal line on the same wiring layer satisfies a spacing condition, and the projection of the third signal line and the fourth signal line on the same wiring layer also satisfies the spacing condition. The spacing condition is that the spacing of the projection of the signal line in the direction perpendicular to the wiring direction is less than a spacing threshold. The first signal line is connected with the fourth signal line, and the second signal line is connected with the third signal line. On the basis of realizing replacement of the wiring layer where the signal is located, the application reduces the space occupied by the layer-changing of the signal line.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of circuit, in particular to a wiring structure, a chip and an electronic device. BACKGROUND

[0002] In the field of circuit technology, different devices are connected to form a circuit through signal lines, and the circuit is used for transmitting electrical signals and the like. In the layout process of the signal lines, based on the consideration of saving wiring space, there is a situation that the signal lines of adjacent layers are overlapped and run in parallel, that is, the projection positions of the signal lines of adjacent layers are overlapped.

[0003] However, in some scenarios, the signal lines in the two adjacent wiring layers need to be connected to each other, so as to transmit the signals in the signal lines of one wiring layer to the signal lines of the adjacent other wiring layer, so as to realize the corresponding function. For example, the signals in the signal lines of the two adjacent wiring layers may need to be transmitted to one wiring layer of the two adjacent wiring layers to connect the devices. Therefore, there is an urgent need for a wiring structure, so that the signals in the wiring structure can change the wiring layer through the mutual connection between the signal lines of adjacent layers. SUMMARY

[0004] Embodiments of the present application provide a wiring structure, a chip and an electronic device, and the signals in the wiring structure can change the wiring layer through the mutual connection between the signal lines of adjacent layers. The technical solution is as follows:

[0005] On the one hand, a wiring structure is provided, which comprises: a plurality of layer changing structures arranged along a first direction, the plurality of layer changing structures arranged along the first direction are distributed in a second direction in turn and adjacent two layer changing structures are staggered, the first direction is a wiring direction of the wiring structure, and the second direction is perpendicular to the first direction;

[0006] The layer changing structure comprises a first signal line and a third signal line located in a first wiring layer, and a second signal line and a fourth signal line located in a second wiring layer, and the first wiring layer and the second wiring layer are adjacent;

[0007] The interval between the first projection of the first signal line on a reference wiring layer and the second projection of the second signal line on the reference wiring layer in the second direction is less than an interval threshold, and the interval between the third projection of the third signal line on the reference wiring layer and the fourth projection of the fourth signal line on the reference wiring layer in the second direction is less than the interval threshold, and the reference wiring layer is any wiring layer in the wiring structure;

[0008] The first signal line and the fourth signal line are connected, and the second signal line and the third signal line are connected.

[0009] In a possible implementation, the wiring structure further includes a first wiring substructure and a second wiring substructure;

[0010] The first wiring substructure includes a first extension line of the first signal line and a second extension line of the second signal line, the first extension line being configured to transmit a first electrical signal in the first wiring substructure, and the second extension line being configured to transmit a second electrical signal in the first wiring substructure;

[0011] The second wiring substructure includes a third extension line of the third signal line and a fourth extension line of the fourth signal line, the third extension line being configured to transmit the second electrical signal in the second wiring substructure, and the fourth extension line being configured to transmit the first electrical signal in the second wiring substructure.

[0012] In a possible implementation, the layer-changing structure further includes a first via and a second via, the first signal line being connected to the fourth signal line through the first via, and the second signal line being connected to the third signal line through the second via.

[0013] In a possible implementation, the first signal line is connected to a first connection line located at the first wiring layer, the first connection line being connected to the fourth signal line through the first via, and the second signal line being connected to a second connection line located at the first wiring layer, the second connection line being connected to the third signal line;

[0014] Alternatively, the first signal line is connected to a third connection line located at the second wiring layer through the first via, the third connection line being connected to the fourth signal line, and the second signal line being connected to a fourth connection line located at the second wiring layer, the fourth connection line being connected to the third signal line through the second via.

[0015] In a possible implementation, the first via includes a first sub-via and a second sub-via, the first sub-via and the second sub-via being configured to connect the first signal line and the fourth signal line;

[0016] The second via includes a third sub-via and a fourth sub-via, the third sub-via and the fourth sub-via being configured to connect the second signal line and the third signal line.

[0017] In a possible implementation, the second wiring substructure comprises a folding region, the third extension line and the fourth extension line in the folding region are folded by the reference distance, so that a fifth projected extension line and a sixth projected extension line in the second direction have a spacing less than the spacing threshold, the fifth projected extension line is a projection of the first extension line on the reference wiring layer, and the sixth projected extension line is a projection of the folded third extension line or the folded fourth extension line on the reference wiring layer.

[0018] In a possible implementation, the folding region comprises a first sub-folding region and a second sub-folding region, the third extension line is folded by the reference distance in the first sub-folding region, and the fourth extension line is folded by the reference distance in the second sub-folding region.

[0019] In a possible implementation, one layer-changing structure corresponds to one folding region, and a plurality of folding regions arranged along the first direction are sequentially distributed in the second direction and staggered between two adjacent folding regions.

[0020] In a possible implementation, the reference distance is a sum of a distance between two adjacent first signal lines and a width of the first signal line.

[0021] In another aspect, a chip is provided, and the chip comprises the wiring structure described above.

[0022] In another aspect, an electronic device is provided, and the electronic device comprises the chip described above.

[0023] The technical solutions provided in the embodiments of the present application at least bring the following beneficial effects:

[0024] The technical solutions provided in the present application arrange a plurality of layer-changing structures along the first direction in sequence, reasonably utilize the assembly space of the wiring structure in the first direction, and on this basis, stagger the plurality of layer-changing structures in the second direction, so that the size of a combined structure formed by any two adjacent layer-changing structures in the second direction is less than the sum of the sizes of the two layer-changing structures in the second direction, thereby realizing compact projection layout and staggered layer design. Through the compact projection layout and the staggered layer design, the total height required by the wiring is effectively reduced, the occupied space can be reduced on the basis of changing the wiring layer where the signal is located, and the space utilization rate of the wiring structure is improved. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description only represent some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0026] Figure 1 is a schematic diagram of a layer switching structure in the related art;

[0027] Figure 2 is an application scenario of a layer switching structure in the related art;

[0028] Figure 3 is a schematic diagram of a wiring structure provided by an embodiment of the present application;

[0029] Figure 4 is a schematic diagram of another wiring structure provided by an embodiment of the present application;

[0030] Figure 5 is a schematic diagram of another wiring structure provided by an embodiment of the present application;

[0031] Figure 6 is a schematic diagram of another wiring structure provided by an embodiment of the present application;

[0032] Figure 7 is a schematic diagram of another wiring structure provided by an embodiment of the present application;

[0033] Figure 8 is a schematic diagram of another wiring structure provided by an embodiment of the present application. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0035] It should be noted that the terms "first", "second", etc. in the specification of the present application are used to distinguish similar objects, and do not necessarily mean a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are only examples of devices and methods consistent with some aspects of the present application.

[0036] In the field of circuit technology, various components in a circuit are connected by wires (or signal lines) to form a complete circuit path, thereby realizing the transmission of electrical signals. Due to the limited space inside the circuit board or chip, it is necessary to reasonably layout the wires to save the layout space. For example, a wire layout method of adjacent layer signal lines overlapping and walking in parallel is adopted, that is, the circuit board or chip includes multiple wire layers, and the signal lines are laid out on different wire layers. The vertical projections of the signal lines laid out on different wire layers overlap on the same wire layer, but do not actually physically contact, thereby increasing the density of the signal lines without increasing the additional space occupation, thereby saving the space occupied by the signal lines.

[0037] However, in some cases, simply relying on the overlapping and parallel walking of adjacent layer signal lines cannot meet the design requirements. For example, when two originally located on different layers signal lines need to be connected to the same wire layer, it is necessary to exchange the wire layers of the signal lines on different wire layers. Thus, the signal lines originally on one wire layer are laid out on another wire layer in a certain region.

[0038] Referring to Figure 1 A layer exchange structure in the related art is shown in the figure. The signal line A is in the wire layer N-1, and the signal line B is in the wire layer N, N is a positive integer greater than 2. The wire layers are numbered in the order from the bottom layer to the top layer. The N-layer wire layer represents the upper layer relative to the N-1-layer wire layer, and the N-layer wire layer and the N-1-layer wire layer are two adjacent wire layers. The signal line B on the left side and the signal line A on the right side of the layer exchange region A are connected by a via, and the signal B from the left side signal line B can be transmitted to the right side signal line A through the via. That is, in the layer exchange region A, the signal B is transmitted from the wire layer N to the wire layer N-1. The signal line A on the left side and the signal line B on the right side of the layer exchange region B are connected by a via, and the signal A from the left side signal line A can be transmitted to the right side signal line B through the via. That is, in the layer exchange region B, the signal A is transmitted from the wire layer N-1 to the wire layer N.

[0039] Referring to Figure 2 An application scenario of a layer exchange structure in the related art is shown in the figure. The Figure 2 That is Figure 1 An application scenario of the wire layer exchange structure is shown in the figure. The signal line C is in the wire layer N-2. In the layer exchange region C, the signal A is transmitted from the left side signal line A to the left side signal line C through the via between the wire layer N-1 and the wire layer N-2. In the layer exchange region D, the signal B is transmitted from the right side signal line A to the right side signal line C through the via between the wire layer N-1 and the wire layer N-2. Thus, the signal A and the signal B can both be transmitted to the signal line C, and the signal line C can be connected to an external device.

[0040] Wherein, signal A can be sent by element A, transmitted through left signal line A, transmitted through via between trace layer N-1 and trace layer N-2 in layer changing area C to left signal line C, and transmitted through left signal line C to external device. In addition, signal A can also be transmitted through left signal line A, transmitted from left signal line A to right signal line B in layer changing area B, and transmitted to other device connected to right signal line B (not shown in FIG. 1). Figure 2 Exemplarily, element A can be a temperature sensor, and signal A (i.e. temperature signal) is transmitted to external device (which can be a temperature adjusting device, such as a fan) to realize temperature adjustment.

[0041] Signal B can be sent by element B, transmitted through left signal line B, transmitted from left signal line B to right signal line A in layer changing area A, transmitted through via between trace layer N-1 and trace layer N-2 in layer changing area D to right signal line C, and transmitted through right signal line C to external device. In addition, signal B can also be transmitted to other device connected to right signal line A (not shown in FIG. 1) after being transmitted to right signal line A. Figure 2 Exemplarily, element B can be a light intensity sensor, and signal B (e.g. light intensity signal) is transmitted to external device (which can be a steering motor) to realize steering, and the light intensity received is increased by steering to a certain angle, thereby increasing the intensity of received light.

[0042] However, in related art shown in Figure 1 and Figure 2 , layer changing area A occupies a large space, which affects the layout of other signal lines, possibly increases the difficulty of layout of remaining signal lines, or causes waste of space for trace layout.

[0043] Embodiments of the present application provide a wiring structure, which can reduce the space occupied by signal line layer changing on the basis of changing the trace layer where the signal is located, and improve the space utilization of the wiring structure. Please refer to Figure 3 , Figure 3 which is a schematic diagram of a wiring structure provided by embodiments of the present application. Figure 3 The wiring structure shown in comprises layer changing structure 301, which realizes the interconnection of signal lines between adjacent two trace layers, thereby changing the trace layer where the signal is located. On the basis of Figure 3 , please refer to another wiring structure shown in Figure 4 , Figure 4 which is a partial enlarged schematic diagram of Figure 3 .

[0044] Figure 4The wiring structure shown includes: a plurality of layer switching structures 301 arranged in a first direction; and the plurality of layer switching structures 301 arranged in the first direction are sequentially distributed in a second direction, and two adjacent layer switching structures 301 are staggered, the first direction is the trace direction of the wiring structure, and the second direction is perpendicular to the first direction.

[0045] The layer switching structure 301 includes a first signal line 3011, a second signal line 3012, a third signal line 3013, and a fourth signal line 3014. The first signal line 3011 and the third signal line 3013 are located on a first trace layer, the second signal line 3012 and the fourth signal line 3014 are located on a second trace layer, and the first trace layer and the second trace layer are adjacent. The interval between the first projection of the first signal line 3011 on the reference trace layer and the second projection of the second signal line 3012 on the reference trace layer in the second direction is less than an interval threshold, and the interval between the third projection of the third signal line 3013 on the reference trace layer and the fourth projection of the fourth signal line 3014 on the reference trace layer in the second direction is less than the interval threshold. The reference trace layer is any layer in the wiring structure. The first signal line 3011 and the fourth signal line 3014 are connected, and the second signal line 3012 and the third signal line 3013 are connected.

[0046] In the embodiments of the present application, the first signal line 3011 and the third signal line 3013 are both located on the first trace layer, and are used to transmit different signals or serve different circuit functions. The second signal line 3012 and the fourth signal line 3014 are located on the second trace layer adjacent to the first trace layer. The signal lines between the two adjacent trace layers of the first trace layer and the second trace layer can be switched. The embodiments of the present application do not limit the type of signal line. For example, it can be a bus (BUS), which is a common communication trunk for transmitting information between various functional components, and is a transmission line bundle composed of wires. According to the type of information transmitted by the computer, the bus can be divided into a data bus, an address bus, and a control bus, which are used to transmit data, data address, and control signal respectively.

[0047] In the embodiments of the present application, the interval threshold is the interval value of the two signal lines that cannot be switched at the same time according to the demand. Taking the first signal line 3011 and the second signal line 3012 as an example, an interval less than the interval threshold is used to indicate that the first signal line 3011 and the second signal line 3012 are substantially without interval in the second direction, i.e., perpendicular to the trace direction, in the perspective of a top view. That is, if the first signal line 3011 and the second signal line 3012 want to be switched at the same time, they cannot be switched under the condition that the interval between them in the second direction is less than the interval threshold. Alternatively, the interval between them in the second direction can be 0, i.e., no interval.

[0048] In the second direction, the interval between the projection of the first signal line 3011 on the reference routing layer and the projection of the second signal line 3012 on the reference routing layer is less than the interval threshold, that is, from the top view of the wiring structure, the interval between the first signal line 3011 and the second signal line 3012 in the direction perpendicular to the extension direction of the signal line (that is, the second direction) is less than the interval threshold, but they are located in different routing layers. The projection object of the embodiment of the present application is any routing layer. The interval between the projection of the third signal line 3013 on the reference routing layer and the projection of the fourth signal line 3014 on the reference routing layer is also less than the interval threshold.

[0049] Wherein, the third projection of the third signal line 3013 and the first projection of the first signal line 3011 are spaced apart by a reference distance in the second direction, which is also the distance increased after the entire wiring structure is laid out without the layer exchange structure. For example, in combination with the wiring structure shown in Figure 3 , and the wiring structure provided by the related art shown in Figure 1 or Figure 2 , the reference distance is less than the sum of the widths of the plurality of signal lines and the spacing of the plurality of signal lines. That is, the reference distance is less than the height of the layer exchange region A shown in Figure 1 or Figure 2 .

[0050] As described above, the wiring structure, the plurality of layer exchange structures are arranged in sequence along the first direction, and the assembly space of the wiring structure in the first direction is reasonably utilized, and on this basis, the plurality of layer exchange structures are staggered arranged in the second direction, and the size of the combined structure formed by any two adjacent layer exchange structures in the second direction is less than the sum of the sizes of the two layer exchange structures in the second direction, so that the compact projection layout and the staggered layer exchange design are realized. Through the compact projection layout and the staggered layer exchange design, the total height required for routing is effectively reduced, the occupied space can be reduced on the basis of changing the routing layer of the signal, and the space utilization of the wiring structure is improved. In particular, in a multi-layer metal wiring environment, the reduced height is more obvious. In addition, the use of vias ensures the continuous transmission of signals between different metal layers without interruption. The embodiment of the present application reduces the space occupied by layer exchange, can flexibly arrange a plurality of signal lines in a limited space, and at the same time maintains the clarity of the signal path.

[0051] In a possible implementation, the wiring structure further includes: a first wiring substructure 302 and a second wiring substructure 303. The first wiring substructure 302 includes a first extension line 3021 of the first signal line 3011 and a second extension line 3022 of the second signal line 3012, the first extension line 3021 being used for transmitting the first electrical signal in the first wiring substructure 302, and the second extension line 3022 being used for transmitting the second electrical signal in the first wiring substructure 302; and the second wiring substructure 303 includes a third extension line 3033 of the third signal line 3013 and a fourth extension line 3034 of the fourth signal line 3014, the third extension line 3033 being used for transmitting the second electrical signal in the second wiring substructure 303, and the fourth extension line 3034 being used for transmitting the first electrical signal in the second wiring substructure 303.

[0052] The first wiring substructure 302 is composed of the first extension line 3021 of the first signal line 3011 and the second extension line 3022 of the second signal line 3012. The two extension lines are extended from the signal lines in the wiring structure, and it can be understood that the first extension line 3021 and the first signal line 3011 are the same signal line, and the second extension line 3022 and the second signal line 3012 are the same signal line. Among them, Figure 4 The reference number of the overlapping part only indicates one signal line, for example, 3022 only indicates the extension line extended from the signal line in the second wiring layer.

[0053] Based on the above structure, the path of the first electrical signal can be sequentially through the first extension line 3021, the first signal line 3011, the fourth signal line 3014, and the third extension line 3034. The path of the second electrical signal can be sequentially through the second extension line 3022, the second signal line 3012, the third signal line 3013, and the third extension line 3033.

[0054] Optionally, the wiring structure further includes a third wiring layer adjacent to the second wiring layer, the second extension line 3022 is used for connecting the first device through a third via hole between the second wiring layer and the third wiring layer in the first wiring substructure 302, and the second wiring layer and the third wiring layer are adjacent; and the fourth extension line 3034 is used for connecting the second device through a fourth via hole between the second wiring layer and the third wiring layer in the second wiring substructure 303.

[0055] The second extension line 3022 can be connected with the first device within the first wiring substructure 302 through a third via hole between the second wiring layer and the third wiring layer. The second wiring layer and the third wiring layer are adjacent wiring layers, and the via hole between the adjacent wiring layers allows the signal line to be transmitted vertically between different layers. This design enables the signal to flexibly span multiple metal layers and be connected to devices located on different layers. Among them, the first device and the second device described above can be flexibly adjusted according to the application scenario, and the first device and the second device connected by the present embodiment are not limited.

[0056] In addition, the second wiring substructure 303 is similar to the first wiring substructure 302, and the second wiring substructure 303 is composed of a third extension line 3033 of the third signal line 3013 and a fourth extension line 3034 of the fourth signal line 3014. It can also be understood that the third extension line 3033 and the third signal line 3013 are the same signal line, and the fourth extension line 3034 and the fourth signal line 3014 are the same signal line. The fourth extension line 3034 can be connected with the second device within the second wiring substructure 303 through a fourth via hole between the second wiring layer and the third wiring layer.

[0057] The design of the second wiring substructure 303 corresponds to the first wiring substructure 302, so that the signal line can span the metal layer as needed and be connected to the device located on the different wiring layers, thereby supporting more complex and diversified circuit design.

[0058] In a possible implementation, the wiring structure includes a plurality of layer-changing structures 301 arranged in a first direction, and the plurality of layer-changing structures 301 are sequentially distributed in a second direction and adjacent two layer-changing structures 301 are staggered. Figure 3 As shown in the figure, the layer-changing structure 301 is arranged in a stepped manner in the direction perpendicular to the extension direction of the signal line, that is, each layer-changing structure 301 can be offset relative to its adjacent layer-changing structure in the direction perpendicular to the first direction (i.e., the second direction), forming a stepped hierarchical structure. In the application scenario of the wiring structure, for example, a highly integrated chip, the wiring demand is often very complex, and the stepped arrangement provides more layout options and flexibility.

[0059] In a possible implementation, the first signal line 3011 is connected with the fourth signal line 3014 through the first via hole 3015, and the second signal line 3012 is connected with the third signal line 3013 through the second via hole 3016, comprising: the first signal line 3011 is connected with the first connecting line located in the first wiring layer, the first connecting line is connected with the fourth signal line 3014 through the first via hole 3015, and the second signal line 3012 is connected with the second connecting line located in the first wiring layer through the second via hole 3016. The second connecting line is connected with the third signal line 3013.

[0060] That is, the first signal line 3011 is first connected to a first connection line located in the first routing layer, and the first connection line is connected to the fourth signal line 3014 by a first via 3015 vertically passing through the routing layer. The second signal line 3012 is connected to a second connection line located in the first routing layer by a second via 3016, and the second connection line is connected to the third signal line 3013 in the same routing layer.

[0061] The use of connection lines as intermediaries provides greater flexibility. In some cases, direct connection of signal lines can be restricted by space limitations or wiring rules. By using connection lines, space can be used more efficiently, avoiding wiring conflicts. In some manufacturing processes, direct via connection between different layers can increase difficulty and cost. By using connection lines, the manufacturing process can be simplified and production costs can be reduced. The width, length and shape of the connection lines in the embodiments of the present application need to be designed according to the specific wiring requirements and process limitations, so that the connection lines can carry the required current and signals.

[0062] Alternatively, referring to Figure 5 Another wiring structure diagram is shown in FIG. 3B, in which the first signal line 3011 is connected to the fourth signal line 3014 through the first via 3015 and a third connection line located in the second routing layer, the second signal line 3012 is connected to the third signal line 3013 through the second via 3016 and a fourth connection line located in the second routing layer.

[0063] The first signal line 3011 vertically passes through the second routing layer through the first via 3015. In the second routing layer, the first signal line 3011 is connected to the third connection line, and the third connection line is connected to the fourth signal line 3014 in the second routing layer. The second signal line 3012 is connected to a fourth connection line located in the second routing layer, and the fourth connection line vertically passes through the routing layer where the third signal line 3013 is located through the second via 3016. In the routing layer where the third signal line 3013 is located, the fourth connection line or the extension of the fourth connection line after the second via is connected to the third signal line 3013.

[0064] In one possible implementation, the reference distance is the sum of the distance between two adjacent first signal lines 3011 and the width of the first signal line 3011. The distance between two adjacent first signal lines 3011 refers to the distance between any two adjacent first signal lines 3011 in the second direction in a multi-layer wiring or circuit board layout. Exemplarily, the distance between two adjacent first signal lines 3011 is the distance between the lower edge of one first signal line 3011 and the upper edge of the adjacent first signal line 3011. As shown in FIG. 3A, the distance between two adjacent first signal lines 3011 is the distance between the lower edge of the first signal line 3011 and the upper edge of the adjacent first signal line 3011. Figure 3The vertical distance between two adjacent first signal lines 3011 can be b in Figure 3 The distance between two adjacent first signal lines 3011 needs to ensure that the signal lines do not interfere with each other or short circuit. Each first signal line 3011 has a certain width, which determines the current and signal quality that the signal line can carry. The reference distance provides a standardized way of measuring, which can more easily compare the spacing and width of signal lines in different design schemes, so as to make reasonable layout decisions.

[0065] By controlling the reference distance, it can be ensured that the interference between adjacent signal lines is kept within an acceptable range, thereby protecting the integrity of the signal and the stability of the system. In a multi-layer wiring design, space is a very valuable resource. By accurately calculating the reference distance, space can be used more efficiently, unnecessary waste can be avoided, and complex wiring requirements can be met. See Figure 3 The distance between two adjacent first signal lines 3011 is b in Figure 3 The width of the first signal line 3011 is a in Figure 3 In Figure 3 , the width of the first signal line 3011 is equal to the width of the first extension line.

[0066] In one possible implementation, the first via 3015 includes a first sub-via 30151 and a second sub-via 30152, both of which are used to connect the first signal line 3011 and the fourth signal line 3014, and the second via 3016 includes a third sub-via 30161 and a fourth sub-via 30162, both of which are used to connect the second signal line 3012 and the third signal line 3013.

[0067] The first via 3015 is used to connect signal lines between different layers, etc. The first via 3015 is subdivided into two sub-vias, namely the first sub-via 30151 and the second sub-via 30152. The two sub-vias can be arranged side by side or in other ways, depending on design requirements. The second via 3016 is similar to the first via 3015 and is subdivided into two sub-vias, namely the third sub-via 30161 and the fourth sub-via 30162.

[0068] By using two sub-vias instead of a single via, the number of connection points can be increased, thereby improving the reliability of the connection. Even if one of the sub-vias fails, the other sub-via can still maintain the connection, reducing the risk of connection failure.

[0069] For example, see another wiring structure diagram shown in Figure 6 , the distance between two adjacent first signal lines 3011 is b in Figure 6The first via hole 3015 and the second via hole 3016 only have one sub-via hole, and the embodiments of the present application do not limit the number of sub-via holes included in one via hole.

[0070] In a possible implementation, referring to Figure 7 In another wiring structure diagram shown in FIG. 3B, the second wiring substructure 303 includes a folding region 304, and the third extension line 3033 and the fourth extension line 3034 in the folding region 304 are folded by a reference distance, so that the interval between a fifth projection and a sixth projection in the second direction is less than an interval threshold, the fifth projection being a projection of the first extension line 3021 on a reference wiring layer, and the sixth projection being a projection of the folded third extension line 3033 or the folded fourth extension line 3034 on the reference wiring layer.

[0071] The folding region 304 is a part of the second wiring substructure 303, in which the third extension line 3033 and the fourth extension line 3034 are folded. The folding means that the third extension line 3033 and the fourth extension line 3034 are bent or folded in space, so as to reduce the space occupied by the third extension line 3033 and the fourth extension line 3034 in the second direction.

[0072] The folding operation is based on the reference distance, and determines the position and shape that the third extension line 3033 and the fourth extension line 3034 should reach after being folded. The interval between the projection of the folded third extension line 3033 and the fourth extension line 3034 on the reference wiring layer and the projection of the first extension line 3021 on the reference wiring layer in the second direction is less than the interval threshold. By folding the third extension line 3033 and the fourth extension line 3034, the third extension line 3033 and the fourth extension line 3034 can be kept parallel to the first extension line 3021 in a specific direction without increasing the additional space occupation, thereby saving space and improving the wiring density.

[0073] In a possible implementation, referring to Figure 8 In another wiring structure diagram shown in FIG. 3B, the folding region 304 includes a first sub-folding region 3041 and a second sub-folding region 3042, the third extension line 3033 is folded by a reference distance in the first sub-folding region 3041, and the fourth extension line 3034 is folded by a reference distance in the second sub-folding region 3042.

[0074] The folding region 304 can be subdivided into two sub-regions, the first sub-folding region 3041 and the second sub-folding region 3042. Different folding regions can be determined based on the arrangement of signal lines in the wiring structure, and the embodiments of the present application do not limit this.

[0075] In a possible implementation, the wiring structure includes a plurality of layer-changing structures 301 arranged along a first direction, one layer-changing structure 301 corresponding to one folding area 304, and the plurality of folding areas 304 arranged along the first direction are sequentially distributed along a second direction and adjacent two folding areas 304 are staggered.

[0076] When the plurality of folding areas 304 are distributed along the second direction, the plurality of folding areas 304 present a shape similar to a ladder. Each segment of the third extension line 3033 corresponds to one folding area 304, and the third extension line is folded in the folding area. In the ladder-shaped arrangement, different folding areas 304 are located at different positions along the second direction. The folding areas are not located on the same horizontal line, but present a staggered state. This helps to optimize the wiring space, so that more wires can be accommodated in a limited area. In addition, the ladder-shaped arrangement can help to reduce the crossing and interference between different wires, and improve the reliability and stability of signal transmission.

[0077] When designing the ladder-shaped arrangement, the positions and sizes of the folding areas 304 need to be planned. This includes determining the relative height difference, spacing, and overall layout shape and size between the folding areas 304. The overall layout of the circuit board, the requirements of signal transmission, and the limitations of manufacturing process should be fully considered during the design.

[0078] In summary, the wiring structure provided by the embodiments of the present application optimizes the connection of signal lines and the utilization of space in the multi-layer circuit board by arranging the positional relationship of the signal lines, i.e., the staggered layout of the third signal lines and the first signal lines. The third signal lines and the first signal lines are staggered at a certain reference distance along the second direction, which makes flexible connection of the signal lines possible. Due to the staggering of the third signal lines and the first signal lines, the signal lines located in different wiring layers (such as the third signal lines in the first wiring layer and the second signal lines in the second wiring layer) can be directly connected through the via, without the need for complex winding layout, thereby simplifying the wiring complexity. Compared with the situation in the related art that the signal lines need to be wound a lot to avoid interference, the staggering layout design of the present application reduces the space occupied by the connection lines.

[0079] The embodiments of the present application provide a chip, which includes any of the wiring structures described above, and the wiring structure is used to connect at least two electronic devices. The wiring structure has a low space occupancy rate, thereby reducing the design and manufacturing cost of the chip.

[0080] Optionally, the chip provided by the embodiments of the present application can be applied to an electronic device, and the electronic device provided by the embodiments of the present application includes the wiring structure provided by any of the embodiments described above.

[0081] The embodiments of the present application do not limit the type of electronic device, for example, the electronic device can be a terminal or a server. The terminal can be a PC (Personal Computer), a mobile phone, a smart phone, a PDA (Personal Digital Assistant), a wearable device, a PPC (Pocket PC), a tablet computer, a smart car machine, a smart television, a smart speaker, etc. The server can be a server or a server cluster composed of multiple servers, or a cloud computing service center.

[0082] Those skilled in the art should understand that the above-mentioned terminal and server are examples, and other existing or future terminals and servers, such as those applicable to the present application, should also be included in the protection scope of the present application and are hereby incorporated by reference.

[0083] It should be understood that "multiple" referred to herein means two or more. The "and / or" describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. The character " / " generally represents a "or" relationship between the associated objects before and after it.

[0084] The above only describes exemplary embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application should be included in the protection scope of the present application.

Claims

1. A wiring structure, characterized by, The wiring structure comprises: a plurality of layer-changing structures arranged along a first direction, the plurality of layer-changing structures arranged along the first direction are sequentially distributed in a second direction, and adjacent two layer-changing structures are staggered, the first direction is a trace direction of the wiring structure, and the second direction is perpendicular to the first direction; The layer-changing structure comprises a first signal line and a third signal line located at a first trace layer, and a second signal line and a fourth signal line located at a second trace layer, the first trace layer and the second trace layer are adjacent; The interval between the first projection of the first signal line on a reference trace layer and the second projection of the second signal line on the reference trace layer in the second direction is less than an interval threshold, and the interval between the third projection of the third signal line on the reference trace layer and the fourth projection of the fourth signal line on the reference trace layer in the second direction is less than the interval threshold, the reference trace layer being any trace layer in the wiring structure; The first signal line and the fourth signal line are connected, and the second signal line and the third signal line are connected.

2. The wiring structure according to claim 1, wherein The wiring structure further comprises: a first wiring substructure and a second wiring substructure; The first wiring substructure comprises a first extension line of the first signal line and a second extension line of the second signal line, the first extension line being used for transmitting a first electrical signal in the first wiring substructure, and the second extension line being used for transmitting a second electrical signal in the first wiring substructure; The second wiring substructure comprises a third extension line of the third signal line and a fourth extension line of the fourth signal line, the third extension line being used for transmitting the second electrical signal in the second wiring substructure, and the fourth extension line being used for transmitting the first electrical signal in the second wiring substructure.

3. The wiring structure according to claim 1 or 2, wherein The layer-changing structure further comprises a first via and a second via, the first signal line is connected through the first via and the fourth signal line, and the second signal line is connected through the second via and the third signal line.

4. The wiring structure according to claim 3, wherein The first signal line is connected with a first connection line located at the first trace layer, the first connection line is connected with the fourth signal line through the first via, the second signal line is connected with a second connection line located at the first trace layer through the second via, and the second connection line is connected with the third signal line; Alternatively, the first signal line is connected with a third connection line located at the second trace layer through the first via, the third connection line is connected with the fourth signal line, the second signal line is connected with a fourth connection line located at the second trace layer, and the fourth connection line is connected with the third signal line through the second via.

5. The wiring structure according to claim 3, wherein The first via comprises a first sub-via and a second sub-via, and the first sub-via and the second sub-via are both used for connecting the first signal line and the fourth signal line; The second via comprises a third sub-via and a fourth sub-via, and the third sub-via and the fourth sub-via are both used for connecting the second signal line and the third signal line.

6. The wiring structure according to claim 2, wherein The second wiring substructure comprises a folding region, the third extension line and the fourth extension line in the folding region are folded by a reference distance, so that a fifth projected extension line and a sixth projected extension line in the second direction have a spacing less than the spacing threshold, the fifth projected extension line being a projection of the first extension line on the reference wiring layer, and the sixth projected extension line being a projection of the folded third extension line or the folded fourth extension line on the reference wiring layer.

7. The wiring structure according to claim 6, wherein The folding region comprises a first sub-folding region and a second sub-folding region, the third extension line is folded by the reference distance in the first sub-folding region, and the fourth extension line is folded by the reference distance in the second sub-folding region.

8. The wiring structure according to claim 6 or 7, wherein One folding region corresponds to one layer-changing structure, and a plurality of folding regions arranged along the first direction are sequentially distributed in the second direction and staggered between two adjacent folding regions.

9. The wiring structure according to claim 6 or 7, wherein The reference distance is the sum of the distance between two adjacent first signal lines and the width of the first signal line.

10. A chip, characterized by The chip comprises the wiring structure according to any one of claims 1-9, and the wiring structure is used for connecting at least two electronic devices.

11. An electronic device, comprising: The electronic device comprises the chip according to claim 10.

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