Electromagnetic shielding cover

Abstract

The invention discloses an electromagnetic shielding cover which comprises an insulating layer, and a shaping piece is arranged in the insulating layer and used for maintaining the shape of the electromagnetic shielding cover when the electromagnetic shielding cover is pressed on a circuit board. According to the invention, the embedding performance of the electromagnetic shielding case in a tiny gap is improved, the conformal capability of the electromagnetic shielding case and the circuit board is improved, and the shielding effect of the electromagnetic shielding case is enhanced.

Description

Technical Field

[0001] The present invention relates to the technical field of electromagnetic shielding, and in particular to an electromagnetic shielding cover. Background Art

[0002] An electromagnetic shielding cover is a metal shell used for electromagnetic shielding. It is mainly used in circuit boards to reduce electromagnetic interference (EMI) and electromagnetic radiation (EMR). Its main function is to block or suppress electromagnetic waves within a specific spatial range to achieve the purpose of shielding interference and protecting electronic equipment and communications.

[0003] Existing metal shell-type shielding covers cannot be used in flexible circuit boards due to their high hardness and inability to be bent. In addition, current mobile terminals or other electronic devices are becoming thinner and lighter, and there is no space to install electromagnetic shielding covers. Compared with metal shell-type shielding covers, traditional flexible shielding covers are less hard, but they are more elastic and cannot be embedded in the smaller gaps between components on the circuit board, causing the electromagnetic waves between components to interfere with each other, resulting in poor shielding effect. Summary of the invention

[0004] The present invention provides an electromagnetic shielding cover, which improves the embedding performance of the electromagnetic shielding cover in a small gap and enhances the conformal effect of the electromagnetic shielding cover.

[0005] According to one aspect of the present invention, an embodiment of the present invention provides an electromagnetic shielding cover, comprising:

[0006] The insulating layer has a shaping piece disposed inside the insulating layer, and the shaping piece is used to maintain the shape of the electromagnetic shielding cover when the electromagnetic shielding cover is pressed onto the circuit board.

[0007] Optionally, the resilience of the electromagnetic shielding cover is greater than or equal to 5 gf and less than or equal to 30 gf; and / or,

[0008] The resilience of the insulating layer is greater than or equal to 2 gf and less than or equal to 20 gf.

[0009] Optionally, the yield strength of the insulating layer is greater than or equal to 0.4kgf / mm 2 , and less than or equal to 1.4kgf / mm 2 .

[0010] Optionally, the ratio of the maximum thickness of the shaping piece to the thickness of the insulating layer is greater than or equal to 10% and less than or equal to 80%.

[0011] Optionally, the shaping piece is a metal piece, and the ratio of the thickness of the shaping piece to the thickness of the insulating layer is greater than or equal to 10% and less than or equal to 30%.

[0012] Optionally, in a slicing state, a dimension of the shaped piece along a direction perpendicular to the thickness direction of the insulating layer is greater than or equal to 5 microns and less than or equal to 100 microns.

[0013] Optionally, along the thickness direction of the electromagnetic shielding cover, the vertical projection of the shaped piece includes at least one of a sheet, a strip, a wire and a mesh; and / or,

[0014] The shaping piece has at least two layers, and the two layers of shaping pieces are arranged at intervals along the thickness direction of the electromagnetic shielding cover.

[0015] Optionally, the electromagnetic shielding cover further includes a shielding layer, which is disposed on one side of the insulating layer, and the shielding layer is used to be grounded to the circuit board.

[0016] Optionally, the shielding layer includes a first shielding layer and a first connecting layer, the first shielding layer is arranged on one side of the insulating layer, and the first connecting layer is arranged on a side of the first shielding layer away from the insulating layer.

[0017] Optionally, the shielding layer further includes a second shielding layer and a second connecting layer, the second shielding layer is arranged on a side of the first connecting layer away from the first shielding layer, and the second connecting layer is located on a side of the second shielding layer away from the first shielding layer.

[0018] Optionally, the first connection layer and the second connection layer are conductive adhesive layers, or,

[0019] The first shielding layer has a first protrusion on a surface adjacent to the first connection layer, the first protrusion passes through the first connection layer to contact the second shielding layer, the second shielding layer has a second protrusion on a surface adjacent to the second connection layer, the second protrusion passes through the second connection layer to connect to the ground layer of the circuit board.

[0020] Optionally, the first shielding layer includes a first supporting layer and a first metal layer, the first supporting layer is provided with a first hollow portion, and the first metal layer is arranged on at least one side surface of the first supporting layer and an inner wall of the first hollow portion; and / or,

[0021] The second shielding layer includes a second supporting layer and a second metal layer. The second shielding layer is provided with a second hollow portion. The second metal layer is arranged on at least one side surface of the second supporting layer and an inner wall of the second hollow portion.

[0022] Optionally, the insulating layer includes a base layer and a filling layer, the shaping piece is located in the filling layer, and the base layer is arranged on a side of the filling layer that is away from the shielding layer.

[0023] In an embodiment of the present invention, the electromagnetic shielding cover includes an insulating layer, in which a forming piece is arranged, and the forming piece is used to maintain the shape of the electromagnetic shielding cover when the electromagnetic shielding cover is pressed onto the circuit board, that is, when the electromagnetic shielding cover is pressed onto the circuit board, the forming piece undergoes plastic deformation, thereby guiding the deformation of the insulating layer, and then causing the entire electromagnetic shielding cover to undergo plastic deformation, and the elasticity of the electromagnetic shielding cover is resisted by the plastic deformation characteristics of the forming piece, thereby improving the bending performance of the electromagnetic shielding cover and the overall fracture resistance performance of the electromagnetic shielding cover, so that the electromagnetic shielding cover can be pressed onto the circuit board to fit the surface of the components and be embedded in the gaps between the components, thereby ensuring the shielding effect of the components, improving the conformal capability of the electromagnetic shielding cover, and enhancing the shielding effect of the electromagnetic shielding cover.

[0024] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 It is a schematic diagram of the structure of a metal shell type electromagnetic shielding cover;

[0027] Figure 2 It is a schematic diagram of the structure of a flexible electromagnetic shielding cover;

[0028] Figure 3 It is a schematic diagram of a slice structure after another flexible electromagnetic shielding cover covers the components;

[0029] Figure 4 is a schematic structural diagram of an electromagnetic shielding cover provided by an embodiment of the present invention;

[0030] Figure 5 is a schematic structural diagram of another electromagnetic shielding cover provided by an embodiment of the present invention;

[0031] Figure 6 is a schematic structural diagram of another electromagnetic shielding cover provided by an embodiment of the present invention;

[0032] Figure 7 It is a schematic structural diagram of another electromagnetic shielding cover provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0034] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, any variation of the terms "including" and "having" is intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0035] Figure 1 It is a structural schematic diagram of a metal shell type electromagnetic shielding cover. Figure 2 It is a structural schematic diagram of a flexible electromagnetic shielding cover. Figure 3 This is another schematic diagram of the sliced ​​structure of a flexible electromagnetic shielding cover covering the components, see Figure 1 , a plurality of components are mounted on the circuit board 6, and a metal shell type electromagnetic shielding cover 4 is placed on the circuit board 6 to achieve electromagnetic shielding. However, the metal shell type shielding cover 4 is hard and cannot be bent, so it is only suitable for hard boards. In addition, the current mobile terminals or other electronic devices are becoming thinner and lighter, so there is no space for installing the metal shell type electromagnetic shielding cover 4. Figure 2 The conventional flexible electromagnetic shielding cover 7 is placed on the circuit board. Due to the different heights of the components 5 on the circuit board 6, the circuit board 6 has a relatively high step difference. In addition, the conventional flexible electromagnetic shielding cover 7 has a lower hardness than the metal shell type shielding cover, but the conventional flexible shielding cover has a relatively large overall resilience, so that the conventional flexible shielding cover cannot extend into the gap between the components 5. The electromagnetic waves between the components 5 interfere with each other, and the shielding effect is relatively poor. Figure 3 The rectangular component in the middle is the chip 5. When the traditional flexible electromagnetic shielding cover 7 is placed on the chip, the left and right sides may not fit together. If the two components 5 are placed close to each other, there will be gaps on both sides, and the shielding cover will be suspended in the air. The connection position will not be able to contact the circuit board, resulting in a poor shielding effect of the electromagnetic shielding cover 7.

[0036] Figure 4 is a schematic diagram of the structure of an electromagnetic shielding cover provided according to an embodiment of the present invention, see Figure 4 The electromagnetic shielding cover comprises: an insulating layer 1, in which a shaping member 10 is arranged. The shaping member 10 is used to maintain the shape of the electromagnetic shielding cover when the electromagnetic shielding cover is pressed onto the circuit board.

[0037] Among them, the insulating layer 1 is used to insulate the various components on the circuit board. The material used for the shaping piece 10 may include at least one element of Au, Cd, Ag, Cu, Zn, Al, Sn, Si, Ga, In, Ti, Ni, Fe, Pt, Pd, Nb, Mn and U. The material used for the shaping piece 10 may also include at least one of polyethylene (Poly-Vinyl-Chloride, PVC), polypropylene (Poly-Propylene, PP) and polyvinyl chloride (Poly-Vinyl-Chloride, PVC) and carbon fiber composite materials.

[0038] Exemplarily, the material of the shaping member 10 includes at least one of the following: Au-Cd, Ag-Cd, Cu-Zn, Cu-Zn-Al, Cu-Zn-Sn, Cu-Zn-Si, Cu-Sn, Cu-Zn-Ga, In-Ti, Au-Cu-Zn, NiAl, Fe-Pt, Ti-Ni, Ti-Ni-Pd, Ti-Nb, U-Nb and Fe-Mn-Si. The material of the shaping member 10 may also include aluminum alloy, brass, titanium alloy, copper, low carbon steel, nickel alloy, manganese steel, stainless steel and memory metal.

[0039] Optionally, along the thickness direction of the electromagnetic shielding cover, the vertical projection shape of the shaping member 10 includes at least one of a sheet shape, a strip shape, a wire shape and a mesh shape.

[0040] Furthermore, the shaping member 10 is a structure of at least two layers, and the materials used for each layer can be the same or different. The shape of the shaping member 10 and the selection of the materials for each layer are selected by those skilled in the art according to actual needs.

[0041] In an embodiment of the present invention, the electromagnetic shielding cover includes an insulating layer, and a forming member 10 is arranged in the insulating layer 1. The forming member 10 is used to maintain the shape of the electromagnetic shielding cover when the electromagnetic shielding cover is pressed onto the circuit board, that is, when the electromagnetic shielding cover is pressed onto the circuit board, the forming member 10 undergoes plastic deformation, thereby guiding the insulating layer 1 to deform, and then causing the entire electromagnetic shielding cover to undergo plastic deformation. The elasticity of the electromagnetic shielding cover is resisted by the plastic deformation characteristics of the forming member 10, thereby improving the bending performance of the electromagnetic shielding cover and the overall fracture resistance performance of the electromagnetic shielding cover, so that the electromagnetic shielding cover can be attached to the surface of the components and can be embedded in the gaps between the components, thereby ensuring the shielding effect of the components, improving the conformal capability of the electromagnetic shielding cover, and enhancing the shielding effect of the electromagnetic shielding cover.

[0042] See also Figure 4 Optionally, based on the above embodiments, the resilience of the electromagnetic shielding cover is greater than or equal to 5 gf and less than or equal to 30 gf; and / or the resilience of the insulating layer 1 is greater than or equal to 2 gf and less than or equal to 20 gf.

[0043] The resilience refers to the force required for the electromagnetic shielding cover to recover to its original shape after being compressed or stretched. The resilience of the electromagnetic shielding cover and the resilience of the insulating layer 1 are both tested by a resilience tester.

[0044] When the electromagnetic shielding cover is pressed on the circuit board, the insulating layer 1 is bent by the external force, and the resilience of the insulating layer 1 will resist the external force on the insulating layer 1. If the resilience of the insulating layer 1 is too large, the insulating layer 1 will return to its original state after being compressed, so that the degree of bending of the insulating layer 1 is small, so that the electromagnetic shielding cover cannot be attached to the surface of the component, and a gap appears between the electromagnetic shielding cover and the component, affecting the grounding resistance. If the resilience of the insulating layer 1 is too small, the insulating layer 1 may be easily broken during the pressing process due to excessive external force. By setting the resilience of the insulating layer 1 to be greater than or equal to 2gf and less than or equal to 20gf, the bending performance of the insulating layer 1 is better, so that the electromagnetic shielding cover can be better fitted in the component, reducing the grounding resistance, and at the same time, it can avoid the insulation layer 1 from breaking during the pressing process, which not only reduces the grounding resistance, but also avoids the insulation layer 1 from breaking during the pressing process.

[0045] If the rebound force of the electromagnetic shielding cover is too large, the electromagnetic shielding cover will bend less when pressed on the circuit board, so that the electromagnetic shielding cover cannot be attached to the surface of the component, affecting the grounding resistance. If the rebound force of the electromagnetic shielding cover is too small, the electromagnetic shielding cover is easily damaged during pressing and use, and loses its protective and insulating properties. By setting the rebound force of the electromagnetic shielding cover to be greater than or equal to 5gf and less than or equal to 30gf, the folding performance of the electromagnetic shielding cover is better, so that the electromagnetic shielding cover can be better attached to the surface of the component, reducing the grounding resistance, and also avoiding the insulation layer 1 from breaking during the pressing process.

[0046] See also Figure 4 Optionally, based on the above embodiment, the yield strength of the insulating layer 1 is greater than or equal to 0.4 kgf / mm 2 , and less than or equal to 1.4kgf / mm 2 .

[0047] The yield strength refers to the stress value at which the insulating layer 1 undergoes permanent plastic deformation when an external force acts on the insulating layer 1. The insulating layer 1 undergoes permanent deformation when its yield strength exceeds the value, and will not return to its original shape after the external force is removed. If the yield strength of the insulating layer 1 is too large, the electromagnetic shielding cover requires a large external force during the pressing process, which may cause the electromagnetic shielding cover to break while undergoing plastic deformation due to the large external force. If the yield strength of the insulating layer 1 is too small, the insulating layer will break even under a relatively small external force. By setting the yield strength of the insulating layer 1 to be greater than or equal to 0.4kgf / mm 2 , and less than or equal to 1.4kgf / mm 2 ,This setting can avoid the electromagnetic shielding cover from breaking.

[0048] See also Figure 4 Optionally, based on the above embodiment, the ratio of the maximum thickness of the shaping member 10 to the thickness of the insulating layer 1 is greater than or equal to 10% and less than or equal to 80%.

[0049] Among them, if the material used for the shaping piece 10 is one of polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC) and carbon fiber composite material, the ratio of the maximum thickness of the shaping piece 10 to the thickness of the insulating layer 1 is greater than or equal to 10% and less than or equal to 80%.

[0050] If the ratio of the maximum thickness of the shaping piece 10 to the thickness of the insulating layer 1 is less than 10%, the shaping piece 10 is easily broken under the action of external force, affecting the plastic deformation of the insulating layer 1. If the ratio of the maximum thickness of the shaping piece 10 to the thickness of the insulating layer 1 is greater than 80%, the insulating performance of the insulating layer 1 is affected. By setting the ratio of the maximum thickness of the shaping piece 10 to the thickness of the insulating layer 1 to be greater than or equal to 10% and less than or equal to 80%, the insulating layer 1 can withstand plastic deformation without breaking under specific external force conditions, and at the same time, the insulating layer 1 has better insulating performance.

[0051] See also Figure 4 Optionally, based on the above embodiment, the shaping member 10 is a metal member, and the ratio of the thickness of the shaping member 10 to the thickness of the insulating layer 1 is greater than or equal to 10% and less than or equal to 30%.

[0052] Specifically, when the shaping piece 10 is made of metal material, the thickness of the shaping piece 10 cannot be too low. When the thickness of the shaping piece 10 is too low, the shaping piece 10 may break due to external force concentration, defects or other factors before reaching the yield strength, thereby failing to achieve the shaping effect. When the thickness of the shaping piece 10 is too high, the insulating layer 1 will be metallized to a certain extent, affecting the insulating performance of the insulating layer 1. Therefore, by setting the ratio of the thickness of the shaping piece 10 to the thickness of the insulating layer 1 to be greater than or equal to 10% and less than or equal to 30%, it is ensured that the insulating layer 1 will not break while undergoing plastic deformation, and that the insulating layer 1 has good insulating performance.

[0053] See also Figure 4 Optionally, based on the above embodiment, in the sliced ​​state, the dimension of the shaping piece 10 along the direction perpendicular to the thickness direction of the insulating layer 1 is greater than or equal to 5 microns and less than or equal to 100 microns.

[0054] The slicing state refers to the state after the electromagnetic shielding cover is cut along the thickness direction of the insulating layer 1. Specifically, when the dimension of the shaping piece 10 along the direction perpendicular to the thickness direction of the insulating layer 1 is too small, the plastic deformation performance of the insulating layer 1 will be affected and the shaping effect will not be achieved. When the dimension of the shaping piece 10 along the direction perpendicular to the thickness direction of the insulating layer 1 is too large, the insulation performance of the insulating layer 1 will be affected. Such a setting ensures the plastic deformation performance of the insulating layer 1, and also ensures the insulation performance of the insulating layer 1.

[0055] Exemplarily, the dimension along the direction perpendicular to the thickness direction of the insulating layer 1 is 10-30 microns, so that the insulating layer 1 has a better bending degree and also optimizes the insulating performance of the insulating layer 1.

[0056] See also Figure 4Optionally, based on the above embodiments, along the thickness direction of the electromagnetic shielding cover, the vertical projection shape of the shaping piece 10 includes at least one of sheet, strip, wire and mesh; and / or, the shaping piece 10 is at least two layers, and the two layers of shaping pieces 10 are spaced apart along the thickness direction of the electromagnetic shielding cover.

[0057] Among them, along the thickness direction of the electromagnetic shielding cover, the vertical projection shape of the shaped member 10 is sheet-like, strip-like, filament-like or mesh-like, or a composite shape composed of two or three of sheet-like, strip-like, filament-like and mesh-like.

[0058] The shaping member can be two layers, three layers or more than three layers, and the two layers of shaping members 10 are arranged at intervals along the thickness direction of the electromagnetic shielding cover, and further, the two layers of shaping members 10 are arranged in an up-down staggered manner along the thickness direction of the electromagnetic shielding cover 7. Furthermore, the two layers of shaping members 10 are arranged discontinuously along the direction perpendicular to the thickness direction of the insulating layer 1, and the three layers or more shaping members can be arranged at intervals along the thickness direction of the electromagnetic shielding cover, or can be arranged at intervals along the width direction of the insulating layer, so that the setting can enhance the effect of the insulating layer 1 to offset the elasticity, and also reduce the yield strength of the insulating layer 1.

[0059] See also Figure 4 Optionally, based on the above embodiment, the electromagnetic shielding cover further includes a shielding layer 2, which is disposed on one side of the insulating layer 1, and the shielding layer 2 is used to be grounded to the circuit board.

[0060] The shielding layer 2 plays the role of electromagnetic shielding. The shielding layer 2 conducts the electromagnetic interference signal through grounding to prevent interference from the electromagnetic signal.

[0061] Figure 5 is a schematic diagram of the structure of another electromagnetic shielding cover provided according to an embodiment of the present invention, see Figure 5 Optionally, based on the above embodiment, the shielding layer 2 includes a first shielding layer 20 and a first connecting layer 21, the first shielding layer 20 is arranged on one side of the insulating layer 1, and the first connecting layer 21 is arranged on a side of the first shielding layer 20 away from the insulating layer 1.

[0062] Among them, the material used for the first shielding layer 20 is a non-woven fabric sputtered with a metal layer. The metal layer is sputtered on the non-woven fabric so that the entire non-woven fabric is charged, and the first shielding layer 20 uses a non-woven fabric with a metal layer so that the first shielding layer 20 has the performance of stretching and bending resistance. The first protrusion 24 may be set on the surface of the first shielding layer 20 close to the first connecting layer 21, or the first protrusion 24 may not be set. The first connecting layer 21 may be a conductive adhesive layer or a common adhesive layer. The first connecting layer 21 is used to play a connecting role.

[0063] When the first connection layer 21 is a conductive adhesive layer, the first protrusion 24 may not be provided on the surface of the first shielding layer 20 close to the first connection layer 21 . When the first connection layer 21 is a common adhesive layer, the first protrusion 24 is provided on the surface of the first shielding layer 20 close to the first connection layer 21 .

[0064] See also Figure 5 Optionally, based on the above embodiment, the shielding layer 2 also includes a second shielding layer 22 and a second connecting layer 23, the second shielding layer 22 is arranged on the side of the first connecting layer 21 away from the first shielding layer 20, and the second connecting layer 23 is located on the side of the second shielding layer 22 away from the first shielding layer 20.

[0065] Among them, the second shielding layer 22 plays the role of electromagnetic shielding. The second shielding layer 22 can be a non-woven fabric with a metal layer, or it can be a conductive metal layer. The second shielding layer 22 can be provided with a second protrusion 25 on the surface close to the second connecting layer 23, or the second shielding layer 22 may not be provided with the second protrusion 25. The second connecting layer 23 can be a conductive adhesive layer or a common adhesive layer.

[0066] When the second connection layer 23 is a conductive adhesive layer, the second shielding layer 22 is not provided with the second protrusion 25 on the surface close to the second connection layer 22 ; when the second connection layer 23 is a common adhesive layer, the second shielding layer 20 is provided with the second protrusion 25 on the surface close to the second connection layer 23 .

[0067] Figure 6 is a schematic diagram of the structure of another electromagnetic shielding cover provided according to an embodiment of the present invention, see Figure 6 Optionally, based on the above embodiments, the first connection layer 21 and the second connection layer 23 are conductive adhesive layers, or the surface of the first shielding layer 20 adjacent to the first connection layer 21 has a first protrusion 24, the first protrusion 24 passes through the first connection layer 21 and contacts the second shielding layer 22, and the surface of the second shielding layer 22 adjacent to the second connection layer 23 has a second protrusion 25, the second protrusion 25 passes through the second connection layer 23 and is connected to the ground layer of the circuit board.

[0068] Among them, the first connection layer 21 is used to connect the first shielding layer 20 and the second shielding layer 22. The second connection layer 23 is used to connect the second shielding layer 22 and the grounding layer. The first connection layer 21 and the second connection layer 23 can be conductive adhesive layers, and the first connection layer 21 and the second connection layer 23 can be ordinary adhesive layers. When the first connection layer 21 is an ordinary adhesive layer, a first protrusion 24 is provided on the surface of the first shielding layer 20 adjacent to the first connection layer 21, and the first protrusion 24 passes through the first connection layer 21 and contacts the second shielding layer 22. At the same time, a second protrusion 25 is provided on the surface of the second shielding layer 22 adjacent to the second connection layer 23, and the second protrusion 25 passes through the second connection layer 23 and is connected to the grounding layer of the circuit board, so that the electromagnetic interference signals on the first shielding layer 20 and the second shielding layer 22 are derived, and the shielding effect of the first shielding layer 20 and the second shielding layer 22 on various components on the circuit board is realized.

[0069] Figure 7 FIG. 7 is a schematic diagram of the structure of another electromagnetic shielding cover 7 provided in an embodiment of the present invention. Figure 7 Optionally, on the basis of the above embodiments, the first shielding layer 20 includes a first supporting layer 202 and a first metal layer 201, the first supporting layer 202 is provided with a first hollow portion 203, and the first metal layer 201 is arranged on at least one side of the first supporting layer 202 and the inner wall of the first hollow portion 203; and / or, the second shielding layer 22 includes a second supporting layer 222 and a second metal layer 221, the second shielding layer 22 is provided with a second hollow portion 223, and the second metal layer 221 is arranged on at least one side of the second supporting layer 222 and the inner wall of the second hollow portion 223.

[0070] Among them, the material used for the first support layer 202 and the second support layer 222 is non-woven fabric, and a first hollow portion 203 is opened in the first support layer 202 and a second hollow portion 223 is opened in the second shielding layer 22, so that the first support layer 202 and the second support layer 222 are easy to bend, ensuring the flexibility of the first support layer 202 and the second support layer 222, the first metal layer 201 is arranged on at least one side of the first support layer 202 and the inner wall of the first hollow portion 203, and the second metal layer 221 is arranged on at least one side of the second support layer 222 and the inner wall of the second hollow portion 203, so that the first support layer 202 and the second support layer 222 have shielding properties.

[0071] Through such an arrangement, the flexibility and shielding properties of the first shielding layer 20 and the second shielding layer 22 are ensured, so that the first shielding layer 20 and the second shielding layer 22 are easier to bend.

[0072] See also Figure 6 and Figure 7Optionally, based on the above embodiment, the insulating layer 1 includes a base layer 11 and a filling layer 12 , the shaping member 10 is located in the filling layer 12 , and the base layer 11 is arranged on a side of the filling layer 12 facing away from the shielding layer 2 .

[0073] The base layer 11 is made of polyimide, which makes the surface of the base layer 11 smooth and easy to peel off. The base layer 11 is used to support the filling layer 12. The filling layer 10 is made of epoxy resin, which makes the filling layer 12 have good insulation. The shaping piece 10 is located in the filling layer 12, which makes the filling layer 12 have good bending performance.

[0074] Specifically, the electromagnetic shielding cover is pressed onto the circuit board through the surface of the shielding layer 2 facing away from the filling layer 12. After the electromagnetic shielding cover is pressed onto the circuit board, the base layer 11 is peeled off, and the filling layer 12 and the shielding layer 2 pressed onto the circuit board form an electromagnetic shielding cover. The electromagnetic shielding cover is pressed onto the circuit board to shield electromagnetic signals.

[0075] In an embodiment of the present invention, the electromagnetic shielding cover is pressed onto the circuit board through the base layer 11, and the shaping member 10 is located in the filling layer 12, so that the filling layer 12 undergoes plastic deformation during the pressing process, and the filling layer can fit the surface of each component, thereby improving the shielding effect of the electromagnetic shielding cover and reducing the grounding resistance.

[0076] Example 1

[0077] An electromagnetic shielding cover comprises an insulating layer and a shielding layer, wherein a shaping piece is arranged in the insulating layer, the thickness of the shaping piece accounts for 20% of the thickness of the insulating layer, the resilience of the insulating layer is 6gf, and the yield strength of the insulating layer is 0.9kgf / mm 2 After the electromagnetic shielding cover is pressed onto the circuit board, the shielding effectiveness of the electromagnetic shielding cover is 78dB at 5GHz, 5cm 2 Under the grounding area, the grounding resistance is 233 milliohms.

[0078] Example 2

[0079] An electromagnetic shielding cover, which is different from Example 1 in that the thickness of the shaped piece accounts for 46% of the thickness of the insulating layer, the resilience of the insulating layer is 9gf, and the yield strength of the insulating layer is 0.8kgf / mm 2 After the electromagnetic shielding cover is pressed on the circuit board, the shielding effectiveness of the electromagnetic shielding cover is 81dB at 5GHz, 5cm 2 Under the grounding area, the grounding resistance is 260 milliohms.

[0080] Example 3

[0081] An electromagnetic shielding cover, which is different from Example 2 in that the thickness of the shaped piece accounts for 32% of the thickness of the insulating layer, the resilience of the insulating layer is 14gf, and the yield strength of the insulating layer is 1.0kgf / mm 2 After the electromagnetic shielding cover is pressed on the circuit board, the shielding effectiveness of the electromagnetic shielding cover is 74dB, 5cm 2 Under the grounding area, the grounding resistance is 390 milliohms.

[0082] Example 4

[0083] An electromagnetic shielding cover comprises an insulating layer, a first shielding layer, a first connecting layer, a second shielding layer and a second connecting layer, wherein the first connecting layer and the second connecting layer are conductive adhesive layers, the thickness of the shaping piece accounts for 60% of the thickness of the insulating layer, the resilience of the insulating layer is 11gf, and the yield strength of the insulating layer is 0.8kgf / mm 2 The resilience of the electromagnetic shielding cover is 10gf. After the electromagnetic shielding cover is pressed on the circuit board, the shielding effectiveness of the electromagnetic shielding cover is 71dB at 5GHz, 5cm 2 Under the grounding area, the grounding resistance is 490 milliohms.

[0084] Comparative Example 1

[0085] The difference from Example 1 is that no shaped piece is provided in the insulating layer. After the electromagnetic shielding cover is pressed onto the circuit board, the shielding efficiency of the electromagnetic shielding cover is 57dB, 5cm 2 Under the grounding area, the grounding resistance is 780 milliohms.

[0086] Comparative Example 2

[0087] Different from Example 1, the thickness of the shaping piece and the thickness of the insulating layer account for 5%, the resilience of the insulating layer is 3gf, and the yield strength of the insulating layer is 0.2kgf / mm 2 After the electromagnetic shielding cover is pressed on the circuit board, the shielding effectiveness of the electromagnetic shielding cover is 52dB, 5cm 2 Under the grounding area, the grounding resistance is 1320 milliohms.

[0088] The metal foils of the above embodiments and comparative examples were used to conduct experiments and design a test board with a grounding window area of ​​5 cm 2 , chips with maximum heights of 5 mm and 3 mm are set on the circuit board, the gap between the two chips is 3 mm, the shielding cover is pressed on the circuit board, and the total pore lengths at the left and right ends of the pressed contact position between the shielding cover and the two chips are observed in the sliced ​​state, and the results are shown in Table 1. The data show that Examples 1 to 4 can reduce the total pore length and improve the embedding ability of the micro gap.

[0089] Table 1

[0090] type Shielding effectiveness / dB Ground resistance / mΩ Total pore length / mm Example 1 78 233 0.53 Example 2 81 260 0.61 Example 3 74 390 0.55 Example 4 71 490 0.62 Comparative Example 1 57 780 1.89 Comparative Example 2 52 1320 1.88

[0091] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0092] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An electromagnetic shielding cover, characterized in that: include: The insulating layer has a shaping piece disposed therein, and the shaping piece is used to maintain the shape of the electromagnetic shielding cover when the electromagnetic shielding cover is pressed onto the circuit board.

2. The electromagnetic shielding cover according to claim 1, characterized in that: The resilience of the electromagnetic shielding cover is greater than or equal to 5 gf and less than or equal to 30 gf; and / or, The resilience of the insulating layer is greater than or equal to 2 gf and less than or equal to 20 gf.

3. The electromagnetic shielding cover according to claim 1, characterized in that: The yield strength of the insulating layer is greater than or equal to 0.4 kgf / mm 2 , and less than or equal to 1.4kgf / mm 2 .

4. The electromagnetic shielding cover according to claim 1, characterized in that: The ratio of the maximum thickness of the shaping member to the thickness of the insulating layer is greater than or equal to 10% and less than or equal to 80%.

5. The electromagnetic shielding cover according to claim 4, characterized in that: The shaping piece is a metal piece, and the ratio of the thickness of the shaping piece to the thickness of the insulating layer is greater than or equal to 10% and less than or equal to 30%.

6. The electromagnetic shielding cover according to claim 1, characterized in that: In the sliced ​​state, the dimension of the shaped piece along the direction perpendicular to the thickness direction of the insulating layer is greater than or equal to 5 microns and less than or equal to 100 microns.

7. The electromagnetic shielding cover according to claim 1, characterized in that: Along the thickness direction of the electromagnetic shielding cover, the vertical projection of the shaped piece includes at least one of a sheet, a strip, a wire and a mesh; and / or, The shaping member has at least two layers, and the two layers of the shaping member are arranged at intervals along the thickness direction of the electromagnetic shielding cover.

8. The electromagnetic shielding cover according to claim 1, characterized in that: The electromagnetic shielding cover further comprises a shielding layer, which is arranged on one side of the insulating layer and is used for grounding with a circuit board.

9. The electromagnetic shielding cover according to claim 8, characterized in that: The shielding layer includes a first shielding layer and a first connecting layer. The first shielding layer is arranged on a side surface of the insulating layer, and the first connecting layer is arranged on a side surface of the first shielding layer away from the insulating layer.

10. The electromagnetic shielding cover according to claim 9, characterized in that: The shielding layer further includes a second shielding layer and a second connecting layer. The second shielding layer is arranged on a side of the first connecting layer away from the first shielding layer, and the second connecting layer is located on a side of the second shielding layer away from the first shielding layer.

11. The electromagnetic shielding cover according to claim 10, characterized in that: The first connection layer and the second connection layer are conductive adhesive layers, or, The first shielding layer has a first protrusion on a surface adjacent to the first connecting layer, and the first protrusion passes through the first connecting layer to contact the second shielding layer. The second shielding layer has a second protrusion on a surface adjacent to the second connecting layer, and the second protrusion passes through the second connecting layer to connect to the ground layer of the circuit board.

12. The electromagnetic shielding cover according to claim 10, characterized in that: The first shielding layer includes a first supporting layer and a first metal layer, the first supporting layer is provided with a first hollow portion, and the first metal layer is arranged on at least one side surface of the first supporting layer and an inner wall of the first hollow portion; and / or, The second shielding layer includes a second supporting layer and a second metal layer. The second shielding layer is provided with a second hollow portion. The second metal layer is arranged on at least one side surface of the second supporting layer and an inner wall of the second hollow portion.

13. The electromagnetic shielding cover according to claim 8, characterized in that: The insulating layer comprises a base layer and a filling layer, the shaping piece is located in the filling layer, and the base layer is arranged on a side of the filling layer facing away from the shielding layer.

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