Camera substrate structure capable of being specially bent

By designing multiple electrically connected FPC parts in the vehicle camera substrate, including flexibility and bending parts, the problem of FPC being easily broken when bending is solved, the bending performance and service life are improved, and the assembly process is simplified to achieve High-speed data transmission.

CN222339644UActive Publication Date: 2025-01-10JIANGXI SHENGTAI PRECISION OPTICS CO LTD
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Patent Information

Application Number
CN202323624243.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-28
Publication Date
2025-01-10
Estimated Expiration
2033-12-28

AI Technical Summary

Technical Problem

The existing vehicle-mounted camera substrate FPC is prone to break when bent, resulting in short circuits in the line, affecting service life, and the thickness is not conducive to bending, so the angle cannot be adjusted according to the use situation.

Method used

A FPC component including a flexible part and a bent part is designed. The bent part is provided with only one covering film to reduce thickness and copper foil layer. The flexible part meets impedance requirements and simplifies assembly through positioning holes. Multiple bending tests were performed during the test.

Benefits of technology

It improves bending performance, extends service life, can withstand 30,000 bends, simplifies the assembly process, ensures test accuracy, and supports high-speed video data transmission.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the field of flexible circuit boards, and discloses a camera substrate structure capable of being specially bent, which is characterized in that the camera substrate structure comprises a plurality of electrically connected FPC parts, each FPC part comprises an FPC board main body, a connecting end and a chip end, the connecting end and the chip end are respectively connected with two ends of the FPC board main body, the FPC board main body comprises a flexible part and a bending part, and the bending part is connected with the FPC board main body. The flexible part comprises a base material and covering films attached to the front face and the back face of the base material, the bent part comprises a base material and a covering film attached to one surface of the base material, and the base material comprises a PI layer and a first copper foil layer. The utility model provides the substrate structure which can be used for the vehicle-mounted camera and can be bent for multiple times.
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Description

Technical Field

[0001] The utility model relates to the field of flexible circuit boards, in particular to a camera substrate structure which can be specially bent. Background Art

[0002] FPC boards are characterized by light weight, dense wiring and resistance to bending, and are widely used in electronic products such as mobile phones and computers. FPC boards have various shapes. Due to the differentiation of circuits, FPCs will bend or even fold to a large extent during use. When bending, external forces will break the FPC, causing a short circuit in the circuit, affecting the service life and even directly causing the FPC to be abandoned. At present, the FPC part of the vehicle camera substrate on the market is relatively thick, 0.1mm or more, which is not conducive to bending. If the vehicle camera can withstand bending, the angle of the vehicle camera can be adjusted according to the usage situation, which is suitable for more usage conditions. Therefore, it is necessary to provide a camera substrate structure that can be bent multiple times for vehicle cameras. Utility Model Content

[0003] The utility model aims to provide a camera substrate structure that can be specially bent, so as to provide a substrate structure that can be bent multiple times and can be used for a vehicle-mounted camera.

[0004] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a camera substrate structure that can be specially bent, including multiple electrically connected FPC parts, the FPC parts include an FPC board main body and a connecting end and a chip end respectively connected to the two ends of the FPC board main body, the FPC board main body includes a flexible part and a bending part, the flexible part includes a substrate and a covering film attached to the front and back surfaces of the substrate, the bending part includes a substrate and a covering film attached to one surface of the substrate, and the substrate includes a PI layer and a first copper foil layer.

[0005] The beneficial effects of this program are:

[0006] In the technical solution, the bending part is only provided with a covering film, thereby reducing the thickness of the covering film and the thickness of the glue attachment. At the same time, the base material layer reduces a copper foil layer compared with other base material layers. The overall bending part is reduced by at least 0.04mm in thickness compared with the ordinary PFC structure, which improves the bending performance. At the same time, when the bending part of the FPC body is bent, the bending part will not be subjected to the double shear force of the covering films on both sides at the same position, making it difficult to tear at this place. Therefore, the bending part can withstand more bending times, correspondingly extending the service life of the FPC circuit board. At the same time, the technical solution is also provided with a flexible part, which can meet the differential impedance specification requirements of the FPC board body and can simultaneously meet the performance requirements of the FPC component impedance and anti-bending.

[0007] The inventor folded the FPC component on a jig with a chamfer radius of R=0.5mm, aligned the bent part with the chamfer of the jig, applied an extrusion force of 2.5 kg, moved the jig at a speed of 70 mm / min, and squeezed the bending area every 3 seconds. Every thousand times, the whole machine was connected to check whether the function was normal, and the appearance was observed. Through the above tests, it was found that the camera substrate structure in the present technical solution can withstand 30,000 bending requirements, ensuring the reliability of the structure.

[0008] Preferably, as an improvement, a positioning hole is provided at the connection between the flexible portion and the bending portion.

[0009] The beneficial effects are as follows: since the substrate structure in the present technical solution is assembled from a plurality of FPC parts, by setting positioning holes, the positioning holes can be used as guide points in the assembly process to ensure the accurate positions of the flexible portion and the bending portion during assembly, thereby simplifying the assembly process, reducing the adjustment and troubleshooting time during the assembly process, and improving production efficiency. At the same time, when testing the working performance, it can be positioned quickly on the jig and ensure that the bending portion is aligned with the chamfer of the jig, thereby ensuring the accuracy of the test results.

[0010] Preferably, as an improvement, the back sides of the connection end and the chip end are both provided with a copper exposed area.

[0011] The beneficial effect is: setting the exposed copper area to ground.

[0012] Preferably, as an improvement, the surface of the FPC body is silk-screened with product and production information.

[0013] The beneficial effects are: by printing product information on the FPC, such as product model, serial number, etc., each specific product can be easily identified and marked, which helps to track and control the production quality of the product, especially when problems arise, it can be used to locate and solve quality problems.

[0014] Preferably, as an improvement, the substrate structure includes two rows of electrically connected FPC components, each row including 11 FPC components.

[0015] The beneficial effects are: multiple electrical connection channels can support parallel transmission, improve data transmission rate, and facilitate high-speed video data transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a front schematic diagram of an embodiment of the utility model;

[0017] Figure 2 It is a schematic diagram of the reverse side of an embodiment of the utility model;

[0018] Figure 3 It is a schematic diagram of a substrate structure according to an embodiment of the present utility model. DETAILED DESCRIPTION

[0019] The following is further described in detail through specific implementation methods:

[0020] The reference numerals in the drawings of the specification include: FPC component 1, connection terminal 2, chip terminal 3, flexible portion 4, bending portion 5, positioning hole 6, and copper exposed area 7.

[0021] Example

[0022] The embodiment is basically as follows Figure 1-Figure 3 As shown, Figure 3 A camera substrate structure that can be specially bent as shown in FIG. Figure 1 and Figure 2 The multiple electrically connected FPC parts 1 shown, the substrate structure in this embodiment includes two rows of electrically connected FPC parts 1, each row includes 11 FPC parts 1, multiple electrical connection channels can support parallel transmission, improve data transmission rate, and facilitate high-speed video data transmission. The FPC part 1 includes an FPC board body and a connection end 2 and a chip end 3 respectively connected to the two ends of the FPC board body. The FPC board body includes a flexible portion 4 and a bending portion 5. The length ratio of the flexible portion 4 and the bending portion 5 is 1:5. The flexible portion 4 includes a substrate and a covering film attached to the front and back sides of the substrate. The bending portion 5 includes a substrate and a covering film attached to one surface of the substrate. The substrate includes a PI layer and a first copper foil layer. The backs of the connection end 2 and the chip end 3 are both provided with an exposed copper area 7 for grounding. The surface of the FPC body is silk-screened with product and production information.

[0023] A positioning hole 6 is provided at the connection between the flexible portion 4 and the bending portion 5. Since the substrate structure in the present technical solution is assembled from a plurality of FPC parts 1, by providing the positioning hole 6, the positioning hole 6 can be used as a guide point in the assembly process to ensure the accurate position of the flexible portion 4 and the bending portion 5 during assembly, which can simplify the assembly process, reduce the adjustment and troubleshooting time during the assembly process, and improve production efficiency. At the same time, when testing the working performance, it can be positioned quickly on the jig, and ensure that the bending portion 5 is aligned with the chamfer of the jig, which can ensure the accuracy of the test results.

[0024] The specific implementation process is as follows:

[0025] In the present technical solution, the bending portion 5 is only provided with a covering film, thereby reducing the thickness of the covering film and the thickness of the glue attachment. At the same time, the base material layer reduces a copper foil layer compared to other base material layers. The overall bending portion 5 is reduced by at least 0.04mm in thickness compared to the ordinary PFC structure, thereby improving the bending performance. At the same time, when the bending portion 5 of the FPC body is bent, the bending portion 5 will not be subjected to the double shear force of the covering films on both sides at the same position, making it less likely to tear at this location. Therefore, the bending portion 5 can withstand more bending times, correspondingly extending the service life of the FPC circuit board. At the same time, the present technical solution is also provided with a flexible portion 4, which can simultaneously meet the differential impedance specification requirements of the FPC board body, and can simultaneously meet the performance requirements of the FPC component 1 in terms of impedance and anti-bending.

[0026] The inventor folded the FPC component 1 on a jig with a chamfer radius of R=0.5mm, aligned the bent portion 5 with the chamfer of the jig, applied an extrusion force of 2.5 kg, moved the jig at a moving speed of 70 mm / min, and squeezed the bending area every 3 seconds. Every thousand times, the whole machine was connected to check whether the function was normal, and the appearance was observed. Through the above tests, it was found that the camera substrate structure in the present technical solution can withstand 30,000 bending requirements, ensuring the reliability of the structure.

[0027] The above is only an embodiment of the utility model, and the common knowledge such as the known specific technical solutions and / or characteristics in the solution is not described in detail here. It should be pointed out that for those skilled in the art, without departing from the technical solution of the utility model, several deformations and improvements can be made, which should also be regarded as the protection scope of the utility model, and these will not affect the effect of the implementation of the utility model and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A camera substrate structure that can be specially bent, characterized in that: The invention comprises a plurality of electrically connected FPC components, wherein the FPC components comprise an FPC board main body and a connection end and a chip end respectively connected to two ends of the FPC board main body, the FPC board main body comprises a flexible portion and a bending portion, the flexible portion comprises a substrate and a covering film attached to the front and back surfaces of the substrate, the bending portion comprises a substrate and a covering film attached to one surface of the substrate, and the substrate comprises a PI layer and a first copper foil layer.

2. The camera substrate structure capable of special bending according to claim 1, characterized in that: A positioning hole is formed at the connection between the flexible portion and the bending portion.

3. The camera substrate structure capable of special bending according to claim 2, characterized in that: There are exposed copper areas on the back side of the connection end and the chip end.

4. The camera substrate structure capable of special bending according to claim 3, characterized in that: The product and production information is printed on the surface of the FPC body.

5. The camera substrate structure capable of special bending according to claim 4, characterized in that: The substrate structure includes two rows of electrically connected FPC components, each row including 11 FPC components.