Needle cleaning abrasive paper, needle cleaning device and testing equipment

Abstract

The invention provides needle cleaning abrasive paper, a needle cleaning device and testing equipment. The needle cleaning abrasive paper comprises a buffer layer, a grinding layer and a plastic needle layer which are sequentially arranged from bottom to top. According to the technical scheme, the buffer layer, the grinding layer and the plastic needle layer are sequentially arranged from bottom to top, and the buffer layer is used for buffering contact force; the grinding layer is used for grinding and cleaning the tip of the probe; the plastic needle layer is used for cleaning and grinding the two sides of the tip of the probe and reducing the diameter of the tip; the needle is molded in the test production process, so that the loss of the needle in the additional maintenance process is reduced, and the service life of the needle card is prolonged; meanwhile, needle molding and cleaning are integrated, needle cleaning abrasive paper does not need to be replaced frequently in the production process, and the output and production efficiency is improved.

Description

Background Art

[0002] The probe card is mainly composed of PCB, probes and functional components. Depending on the situation, there will be a demand for electronic components, stiffeners, etc. The probe card is the interface between the chip under test and the tester in the wafer test. It is mainly used to conduct preliminary tests on the electrical properties of the chip before chip packaging and screen out defective chips. Probe cards are divided into cantilever needle cards, vertical needle cards, thin-film needle cards and MEMS needle cards according to the structural type. The cantilever needle card is named because its shape after bending the needle is like a "hanging arm". Common needle materials of cantilever needle cards include rhenium tungsten, beryllium copper, AH NP, etc. PCB is a carrier that carries probes, rings, and functional components, and realizes signal transmission between the needle tip and the tester. Its shape and size are restricted by the interface mode, and the material is restricted by the test environment. The corresponding shape is generally square and round. The wear of the probe card, especially the wear of the cantilever needle, is mainly due to the wear of the probe card during the contact test and the wear during the maintenance process. The life of a probe card is mainly measured by the number of touch downs. The industry usually uses tens of thousands of touch downs as the standard for the life of a probe card. However, in reality, the life of a probe card reaches its limit because the tip of the probe wears out to the limit. For example, the cantilever needle scrapping standard is generally set at 6 mil. This wear is mainly caused by two aspects:

[0003] One is the wear during the contact test: the probe card will wear out in the process of constantly contacting each chip. This is caused by the friction loss between the probe and the chip's Pad (usually aluminum) during the test.

[0004] The second is the wear and tear during maintenance: The main wear and tear comes from the maintenance of the probe. When the service provider performs maintenance, they will use metal tweezers to adjust the needle position, use a needle grinder to grind the needle and etch the needle tip. At this time, the needle length will be lost to a certain extent. This is because the needle grinding operation itself will cause additional wear and tear on the probe, thus affecting the life of the probe card.

[0005] Therefore, in order to extend the life of the probe card, in addition to controlling the number of contacts, attention should also be paid to the maintenance and care of the probes, and unnecessary grinding operations should be reduced to reduce the wear rate of the probes.

[0006] There are two main types of sandpaper in the industry, one is the shaping type and the other is the grinding type. The shaping type sandpaper is mainly used to shape the needle tip diameter. The structure of this sandpaper is mainly honeycomb type, which has a poor grinding effect on the needle tip. It mainly plays a shaping role on the needle tip, but the disadvantage is that the top of the needle tip is not cleaned well. After grinding the needle, it is easy to cause poor contact between the needle tip and the wafer, resulting in test problems. The grinding type is mainly used to grind and clean the needle tip. The grinding type mainly plays a grinding role on the needle tip, and has a poor shaping effect on the needle tip. The structure of this sandpaper is mainly wavy, and the grinding particles are small, so the shaping effect of the needle tip is not good.

[0007] With the development of modern science and technology, the development of chips is becoming more and more rapid, and the requirements for chip testing are becoming higher and higher. Circuits also need to be designed under the chip PAD, and the requirements for needle pressure during testing are also becoming higher and higher. To avoid puncturing the circuit layer under the chip PAD, a special material cantilever card is derived. The usual cantilever needle material is rhenium tungsten; we call the probe material AH / NP / P7 a special material needle. Compared with rhenium tungsten, the special material needle usually has good contact impedance and less force (that is, under a certain needle pressure, the pressure on the wafer pad is generally half of that of the rhenium tungsten needle), which can meet the needs of modern high-precision testing. However, special materials also have a defect. As the number of test TDs increases, the diameter of the needle tip will increase, and the needle tip diameter cannot be reduced by etching the needle tip (rhenium tungsten can be etched), so the needle tip diameter can only be processed by plastic needle sandpaper. After plastic needle, it is necessary to polish the needle tip with abrasive sandpaper to avoid quality problems caused by contact with the wafer Pad frame due to the increase in needle tip diameter. Therefore, the special material needles need to frequently replace the needle cleaning sandpaper during the production process (using plastic needle sandpaper will reduce the needle tip diameter, and using abrasive sandpaper to grind and clean the needle tip), which seriously affects the production efficiency. Summary of the invention

[0008] The present application provides a needle cleaning sandpaper, a needle cleaning device and a testing device, which are used to solve the problem that the probe of the probe card becomes dirty and the needle tip diameter becomes larger during the testing process.

[0009] In a first aspect, a needle cleaning sandpaper is provided, comprising: a buffer layer, a grinding layer and a needle plastic layer arranged in sequence from bottom to top.

[0010] In the above technical scheme, a buffer layer, a grinding layer and a plastic needle layer are arranged in sequence from bottom to top, the buffer layer is used to buffer the contact force; the grinding layer is used to grind and clean the probe needle tip; the plastic needle layer is used to clean and grind both sides of the probe tip to reduce the needle tip diameter; plastic needles are used during the test production process to reduce the loss of needle length during additional maintenance, thereby increasing the service life of the needle card; at the same time, the plastic needle is cleaned in one piece, and there is no need to frequently replace the needle cleaning sandpaper during the production process, thereby improving output and production efficiency.

[0011] In a specific embodiment,

[0012] The buffer layer is used to buffer the contact force;

[0013] The grinding layer is used to grind and clean the probe tip;

[0014] The plastic needle layer is used to clean and grind both sides of the probe tip to reduce the diameter of the needle tip.

[0015] In a specific embodiment, the buffer layer includes a foamed layer.

[0016] In a specific embodiment, the polishing layer includes a passivation layer.

[0017] In a specific embodiment, the plastic needle layer includes a sand particle layer.

[0018] In a specific implementation manner, the buffer layer has a thickness of 100 um to 500 um.

[0019] In a specific embodiment, the thickness of the grinding layer is 5um-50um.

[0020] In a specific implementation manner, the thickness of the plastic needle layer is 10um-100um.

[0021] In a second aspect, a needle cleaning device is provided, comprising any one of the needle cleaning sandpapers.

[0022] In the above technical scheme, a buffer layer, a grinding layer and a plastic needle layer are arranged in sequence from bottom to top, the buffer layer is used to buffer the contact force; the grinding layer is used to grind and clean the probe needle tip; the plastic needle layer is used to clean and grind both sides of the probe tip to reduce the needle tip diameter; plastic needles are used during the test production process to reduce the loss of needle length during additional maintenance, thereby increasing the service life of the needle card; at the same time, the plastic needle is cleaned in one piece, and there is no need to frequently replace the needle cleaning sandpaper during the production process, thereby improving output and production efficiency.

[0023] In a third aspect, a testing device is provided, comprising the needle cleaning device.

[0024] In the above technical scheme, a buffer layer, a grinding layer and a plastic needle layer are arranged in sequence from bottom to top, the buffer layer is used to buffer the contact force; the grinding layer is used to grind and clean the probe needle tip; the plastic needle layer is used to clean and grind both sides of the probe tip to reduce the needle tip diameter; plastic needles are used during the test production process to reduce the loss of needle length during additional maintenance, thereby increasing the service life of the needle card; at the same time, the plastic needle is cleaned in one piece, and there is no need to frequently replace the needle cleaning sandpaper during the production process, thereby improving output and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the structure of the needle cleaning sandpaper provided in an embodiment of the present application.

[0026] Among them, 1-buffer layer, 2-grinding layer, 3-plastic needle layer. DETAILED DESCRIPTION

[0027] The present application is further described in detail below through the accompanying drawings and embodiments. Through these descriptions, the characteristics and advantages of the present application will become clearer and more specific.

[0028] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. Although various aspects of the embodiments are shown in the drawings, the drawings are not necessarily drawn to scale unless otherwise noted.

[0029] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0030] To facilitate understanding of the needle cleaning sandpaper, needle cleaning device and test equipment provided in the embodiments of the present application, the application scenarios are first explained. The needle cleaning sandpaper, needle cleaning device and test equipment provided in the embodiments of the present application are used to solve the problem that the probe becomes dirty and the needle tip diameter becomes larger during the test of the probe card. With the development of modern science and technology, the development of chips is more and more rapid, and the requirements for chip testing are getting higher and higher. Circuits also need to be designed under the chip PAD, and the requirements for needle pressure during the test are also getting higher and higher. In order to avoid puncturing the circuit layer under the chip PAD, a special material cantilever card is derived. The usual cantilever needle material is rhenium tungsten; we call the probe material AH / NP / P7 a special material needle. The special material needle usually has good contact impedance and less force relative to rhenium tungsten (that is, under a certain needle pressure, the pressure generated on the wafer pad is generally half of the rhenium tungsten needle), which can meet modern high-precision testing needs. However, the special material also has a defect. As the number of tested TDs increases, the needle tip diameter will increase, and the needle tip diameter cannot be reduced by etching the needle tip (rhenium tungsten can be etched), so the needle tip diameter can only be processed by plastic needle sandpaper. After the needle is molded, the needle tip needs to be polished with abrasive sandpaper to avoid quality problems caused by contact with the wafer Pad frame due to the increase in the needle tip diameter. Therefore, the special material needle frequently replaces the needle cleaning sandpaper during the production process (using plastic needle sandpaper will reduce the needle tip diameter, and using abrasive sandpaper to polish and clean the needle tip), which seriously affects the production efficiency. For this reason, the embodiment of the present application provides a needle cleaning sandpaper, a needle cleaning device and a test equipment to solve the problem of the probe becoming dirty and the needle tip diameter becoming larger during the test of the probe card. The following is a detailed description of the embodiment in conjunction with specific drawings.

[0031] refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of the needle cleaning sandpaper provided in an embodiment of the present application.

[0032] exist Figure 1 In the embodiment of the present application, there is provided a needle cleaning sandpaper, comprising: a buffer layer 1, a grinding layer 2 and a needle plastic layer 3 arranged in sequence from bottom to top.

[0033] In the above technical scheme, a buffer layer, a grinding layer and a plastic needle layer are arranged in sequence from bottom to top, the buffer layer is used to buffer the contact force; the grinding layer is used to grind and clean the probe needle tip; the plastic needle layer is used to clean and grind both sides of the probe tip to reduce the needle tip diameter; plastic needles are used during the test production process to reduce the loss of needle length during additional maintenance, thereby increasing the service life of the needle card; at the same time, the plastic needle is cleaned in one piece, and there is no need to frequently replace the needle cleaning sandpaper during the production process, thereby improving output and production efficiency.

[0034] In a specific embodiment,

[0035] The buffer layer is used to buffer the contact force;

[0036] The grinding layer is used to grind and clean the probe tip;

[0037] The plastic needle layer is used to clean and grind both sides of the probe tip to reduce the diameter of the needle tip.

[0038] In a specific embodiment, the buffer layer includes a foamed layer.

[0039] In a specific embodiment, the polishing layer includes a passivation layer.

[0040] In a specific embodiment, the plastic needle layer includes a sand particle layer.

[0041] In a specific embodiment, the thickness of the buffer layer is 100um-500um. Preferably, the thickness of the buffer layer is 100um, 110um, 120um, 130um, 140um, 150um, 160um, 170um, 180um, 190um, 200um, 210um, 220um, 230um, 240um, 250um, 260um, 270um, 280um, 290um, 300um, 310um, 320um, 330um, 340um, 350um, 360um, 370um, 380um, 390um, 400um, 410um, 420um, 430um, 440um, 450um, 460um, 470um, 480um, 490um, 500um. In this embodiment, the thickness of the buffer layer is 260 um.

[0042] In a specific embodiment, the thickness of the grinding layer is 5um-50um. Preferably, the thickness of the grinding layer is 5um, 6um, 7um, 8um, 9um, 10um, 11um, 12um, 13um, 14um, 15um, 16um, 17um, 18um, 19um, 20um, 21um, 22um, 23um, 24um, 25um, 26um, 27um, 28um, 29um, 30um, 31um, 32um, 33um, 34um, 35um, 36um, 37um, 38um, 39um, 40um, 41um, 42um, 43um, 44um, 45um, 46um, 47um, 48um, 49um, 50um. In this embodiment, the thickness of the grinding layer is 25um.

[0043] In a specific embodiment, the thickness of the plastic needle layer is 10um-100um. Preferably, the thickness of the plastic needle layer is 10um, 11um, 12um, 13um, 14um, 15um, 16um, 17um, 18um, 19um, 20um, 21um, 22um, 23um, 24um, 25um, 26um, 27um, 28um, 29um, 30um, 31um, 32um, 33um, 34um, 35um, 36um, 37um, 38um, 39um, 40um, 41um, 42um, 43um, 44um, 45um, 46um, 47um, 48um, 49um, 50um, 51um, 52um, 53um, 54um 4um, 55um, 56um, 57um, 58um, 59um, 60um, 61um, 62um, 63um, 64um, 65um, 66um, 67um, 68um, 69um, 70um, 71um, 72um, 73um, 74um, 75um, 76um, 77um, 78um, 79um, 80um, 81um, 82um, 83um, 84um, 85um, 86um, 87um, 88um, 89um, 90um, 99um, 92um, 93um, 94um, 95um, 96um, 97um, 98um, 99um, 100um. In this embodiment, the thickness of the plastic needle layer is 45um.

[0044] Specifically, the needle cleaning sandpaper has been greatly improved in production efficiency and probe card wear. The needle cleaning sandpaper has 3 layers, from top to bottom: the first layer is the 3M sand plastic needle layer, with a thickness of 30um, which is mainly used to clean and grind the two sides of the probe tip to reduce the diameter of the needle tip; the second layer is the 3M passivation layer, with a thickness of 15um, which is mainly used to grind and clean the probe tip; the third layer is the foaming layer, with a thickness of 310um, which plays a buffering role when cleaning the needle to avoid deformation of the needle tip due to contact force.

[0045] In the above technical scheme, a buffer layer, a grinding layer and a plastic needle layer are arranged in sequence from bottom to top, the buffer layer is used to buffer the contact force; the grinding layer is used to grind and clean the probe needle tip; the plastic needle layer is used to clean and grind both sides of the probe tip to reduce the needle tip diameter; plastic needles are used during the test production process to reduce the loss of needle length during additional maintenance, thereby increasing the service life of the needle card; at the same time, the plastic needle is cleaned in one piece, and there is no need to frequently replace the needle cleaning sandpaper during the production process, thereby improving output and production efficiency.

[0046] An embodiment of the present application also provides a needle cleaning device, comprising any one of the needle cleaning sandpapers described.

[0047] In the above technical scheme, a buffer layer, a grinding layer and a plastic needle layer are arranged in sequence from bottom to top, the buffer layer is used to buffer the contact force; the grinding layer is used to grind and clean the probe needle tip; the plastic needle layer is used to clean and grind both sides of the probe tip to reduce the needle tip diameter; plastic needles are used during the test production process to reduce the loss of needle length during additional maintenance, thereby increasing the service life of the needle card; at the same time, the plastic needle is cleaned in one piece, and there is no need to frequently replace the needle cleaning sandpaper during the production process, thereby improving output and production efficiency.

[0048] An embodiment of the present application also provides a testing device, including the needle cleaning device.

[0049] In the above technical scheme, a buffer layer, a grinding layer and a plastic needle layer are arranged in sequence from bottom to top, the buffer layer is used to buffer the contact force; the grinding layer is used to grind and clean the probe needle tip; the plastic needle layer is used to clean and grind both sides of the probe tip to reduce the needle tip diameter; plastic needles are used during the test production process to reduce the loss of needle length during additional maintenance, thereby increasing the service life of the needle card; at the same time, the plastic needle is cleaned in one piece, and there is no need to frequently replace the needle cleaning sandpaper during the production process, thereby improving output and production efficiency.

[0050] Those skilled in the art will appreciate that the present application may be implemented as a system, method or computer program product.

[0051] Therefore, the present disclosure may be specifically implemented in the following forms, namely: it may be completely hardware, it may be completely software (including firmware, resident software, microcode, etc.), or it may be a combination of hardware and software, generally referred to herein as a "circuit", "module" or "system". In addition, in some embodiments, the present application may also be implemented in the form of a computer program product in one or more computer-readable media, and the computer-readable medium may contain computer-readable program code.

[0052] Any combination of one or more computer-readable media can be used. Computer-readable media can be computer-readable signal media or computer-readable storage media. Computer-readable storage media can be, for example, but not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or devices, or any combination of the above. More specific examples (non-exhaustive list) of computer-readable storage media include: electrical connections with one or more wires, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above. In this document, computer-readable storage media can be any tangible medium containing or storing a program, which can be used by an instruction execution system, device or device or used in combination with it.

[0053] Although the embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and cannot be understood as limiting the present application. A person of ordinary skill in the art can change, modify, replace and modify the above embodiments within the scope of the present application. On this basis, a variety of replacements and improvements can be made to the present application, all of which fall within the scope of protection of the present application.

Claims

1. A needle cleaning sandpaper, characterized in that: include: The buffer layer, the grinding layer and the plastic needle layer are arranged in sequence from bottom to top.

2. The needle cleaning sandpaper according to claim 1, characterized in that: The buffer layer is used to buffer the contact force; The grinding layer is used to grind and clean the probe tip; The plastic needle layer is used to clean and grind both sides of the probe tip to reduce the diameter of the needle tip.

3. The needle cleaning sandpaper according to claim 2, characterized in that: The buffer layer includes a foamed layer.

4. The needle cleaning sandpaper according to claim 3, characterized in that: The grinding layer includes a passivation layer.

5. The needle cleaning sandpaper according to claim 4, characterized in that: The plastic needle layer includes a sand particle layer.

6. The needle cleaning sandpaper according to claim 5, characterized in that: The thickness of the buffer layer is 100um-500um.

7. The needle cleaning sandpaper according to claim 6, characterized in that: The thickness of the grinding layer is 5um-50um.

8. The needle cleaning sandpaper according to claim 7, characterized in that: The thickness of the plastic needle layer is 10um-100um.

9. A needle cleaning device, characterized in that: The invention comprises the needle cleaning sandpaper as described in any one of claims 1 to 8.

10. A testing device, characterized in that: Comprising the needle cleaning device as described in claim 9.

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