Low-G-value cushion packaging device for AI server

Abstract

The invention discloses an AI server low G value cushion packaging device which comprises a base arranged on the lower portion and a supporting plate arranged in the base, the supporting plate is embedded in the base, a first containing groove used for limiting an AI server is formed in the supporting plate, and an upper cover used for covering the AI server is arranged on the upper portion of the base; a plurality of first supporting blocks are arranged on the two sides of the base and penetrate through the upper cover and the supporting plate to be inserted into the base, and the side edges of the AI server are pressed and fixed. Second supporting blocks are arranged on the other two sides of the base and penetrate through the upper cover and the supporting plate to be inserted into the base, and a handle on the AI server is pressed and fixed. The packaging device provided by the invention is simple in structure and few in parts; the AI server can be thoroughly fixed and prevented from moving, collision and falling damage in the transportation process are effectively prevented, and the transportation quality of products is guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of packaging products, and in particular to a low-G value buffer packaging device for an AI server. Background Art

[0002] With the rapid development of intelligent computing, the demand for AI servers is growing. Specifically, AI servers widely use special chips such as GPU or TPU to significantly improve the operating efficiency of AI algorithms such as deep learning. With higher computing power, these servers can easily handle complex data and algorithm tasks. In order to meet the growing demand for complex computing, AI servers are often equipped with a large number of GPU cards, and even need to build a large AI server cluster. Therefore, AI servers not only have significant technical value, but also high economic value.

[0003] AI servers have many dedicated chips inside and several heat dissipation components installed outside. Their structure is very fragile, and their G value (i.e., brittleness value) is only 50G (G value is a quantitative indicator used to indicate the strength of a product when it is subjected to vibration and impact. It is usually expressed in multiples of the acceleration of gravity, G, reflecting the maximum acceleration that the product can withstand when subjected to external force impact). It is generally believed that a product's G value of less than 50G is considered a low G value. In order to perfectly protect the AI ​​server, the protective effect of its protection and cushioning packaging device needs to be less than 50G, so that the force on the AI ​​server in the packaging device is less than 50G, thereby ensuring the integrity of the AI ​​server.

[0004] During transportation, it is very easy to deform due to collision, falling, etc., which often leads to the phenomenon that the product cannot be used when it is delivered to the customer. You can refer to the background technology part of Chinese patent CN108287498A. The product needs to be strictly protected during transportation. Therefore, it is usually packaged before transportation to reduce collision deformation. Due to the low G value of the product, a softer and more elastic cushioning material is needed to provide sufficient protection.

[0005] In the prior art, most packaging devices for AI servers use multiple cushioning materials to splice or assemble, and package the AI ​​servers for transportation. However, the packaging devices are unable to completely fix and package the low-G-value AI servers. During transportation, due to factors such as bumps, shaking, and inversion, the packaging devices will squeeze the AI ​​servers, causing the AI ​​servers to deform, making it impossible to guarantee the integrity of the product and making it impossible to pass the transportation acceptance. Summary of the invention

[0006] The purpose of the present invention is to overcome the defects of the prior art that the number of packaging parts is large and the AI ​​server cannot be completely fixed, and to provide a low-G value buffer packaging device for an AI server with a simple structure and a small number of parts. The low-G value AI server can be completely fixed to prevent it from moving, effectively preventing collision and falling damage during transportation, and ensuring the transportation quality of the product.

[0007] To achieve the above-mentioned objectives, the present invention provides a low-G value buffer packaging device for an AI server, comprising a base installed at the bottom and a support plate installed inside the base, the support plate being embedded in the base, the support plate being provided with a first accommodating groove for limiting the position of the AI ​​server, and an upper cover for covering the AI ​​server being provided on the upper part of the base; a plurality of first support blocks are installed on both sides of the base, the first support blocks are inserted into the base through the upper cover and the support plate, and the sides of the AI ​​server are pressed and fixed; second support blocks are installed on the other two sides of the base, the second support blocks are inserted into the base through the upper cover and the support plate, and the handles on the AI ​​server are pressed and fixed.

[0008] Preferably, the base is a foamed bead hot-melt molded component; the support plate is an injection molded material component, the base and the support plate are integrally molded in a mold, and the bottom and sides of the support plate are wrapped by the base; the PCB board at the bottom of the AI ​​server is placed inside the first accommodating groove, and the first accommodating groove limits the horizontal movement of the AI ​​server.

[0009] Preferably, a cross reinforcement bar is installed at the bottom of the support plate, and through holes are arranged around the support plate. After the base and the support plate are formed, the cross reinforcement bar is in close contact with the base, the base fills the through hole, and a reinforcement column is formed inside the through hole, so that the base and the support plate are fixed as a whole.

[0010] Preferably, the base is provided with a third accommodating groove for accommodating the lower part of the AI ​​server, the upper cover is provided with a fourth accommodating groove for accommodating the upper part of the AI ​​server, and space support blocks are installed on the sides of the base and the upper cover so that the fourth accommodating groove does not contact the upper part of the AI ​​server.

[0011] Preferably, the base and the support plate are both provided with a fifth accommodating groove, the first support block is T-shaped, and the first support block includes a first insertion portion inserted into the fifth accommodating groove and a first pressing portion for fixing the side of the PCB board on the AI ​​server; the upper cover is provided with a sixth accommodating groove for accommodating the upper part of the first support block.

[0012] Preferably, the length of the first pressing portion pressing the side of the PCB board is 10 mm.

[0013] Preferably, the base and the support plate are both provided with a seventh accommodating groove, the second support block includes a second insertion portion inserted into the seventh accommodating groove and a second accommodating groove for being mounted on the upper end of the handle on the AI ​​server; the upper cover is provided with an eighth accommodating groove for accommodating the upper part of the second support block; the second accommodating groove is provided with a guard edge on one side of the handle, and the guard edge cooperates with the second accommodating groove to limit the handle, thereby limiting the up and down movement of the AI ​​server.

[0014] Preferably, a spring snap mechanism is installed in the middle of the second insertion part, and the spring snap mechanism includes a rotating shaft part installed on the second insertion part, a return spring sleeved on the rotating shaft part, a second pressing part installed on the upper part of the rotating shaft part, and a third insertion part installed on the lower part of the rotating shaft part; the third insertion part is inserted into the ninth accommodating groove inside the base, and the ninth accommodating groove is located at the lower part of the support plate.

[0015] Preferably, the base and the upper cover are provided with a subtractive structure, and the base, AI server and upper cover are placed inside the packaging box.

[0016] Preferably, the first support block, the second support block, the base and the upper cover are formed by hot-melt molding of EPP, EPE and EPOP foam beads; preferably, EPOP foam beads are formed by hot-melt molding, and the foaming density of the first support block and the second support block is 40-50 kg / m3; the foaming density of the base and the upper cover is 20-30 kg / m3.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The present invention first places the AI ​​server inside the first accommodating groove of the support plate. The support plate has a large area and is installed on a foamed buffer bottom plate, so the buffering force is good. The first accommodating groove limits the AI ​​server on all sides, so that the AI ​​server cannot move horizontally; secondly, the first support block is inserted into the base through the upper cover and the support plate, and the side of the AI ​​server is pressed and fixed; finally, the second support block is inserted into the base through the upper cover and the support plate, and the handle on the AI ​​server is pressed and fixed; thereby the AI ​​server is completely fixed to prevent it from moving, effectively preventing collision and falling damage during transportation, and ensuring the transportation quality of the product; further, the present invention only uses the base, support plate, upper cover, first support block and second support block to fix the AI ​​server, and the weak parts of the AI ​​server are left empty and non-contact with the packaging device. The first support block and the second support block are foamed parts, pressing the edge and handle of the AI ​​server, and have good buffering performance; the packaging device adopts polyolefin plastic foamed bead material with high bending modulus, high elongation at break, high elastic recovery rate and high toughness and folding resistance. The packaging device has the advantages of high compression strength and good elastic recovery performance, and meets the low G value requirements of the product. The packaging device has a simple structure, a small number of parts, low cost, and can be recycled and recycled. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a structural diagram of the AI ​​server provided by the present invention;

[0021] Figure 2 It is a structural schematic diagram of a low-G value buffer packaging device for an AI server provided by the present invention;

[0022] Figure 3 It is a structural schematic diagram of the support plate and the AI ​​server provided by the present invention installed together;

[0023] Figure 4 yes Figure 3 The enlarged schematic diagram of point A in the middle;

[0024] Figure 5 It is a structural schematic diagram of the base provided by the present invention;

[0025] Figure 6 It is a structural schematic diagram of the upper cover provided by the present invention;

[0026] Figure 7 is a structural schematic diagram of a second supporting block provided by the present invention;

[0027] Figure 8 is a schematic diagram of the bottom structure of the second support block provided by the present invention;

[0028] Fig. 9 It is a cross-sectional view of a low-G value buffer packaging device for an AI server provided by the present invention;

[0029] Fig.10 yes Fig. 9 The enlarged schematic diagram of point B in the middle;

[0030] Fig.11 It is a front structural schematic diagram of the support plate provided by the present invention;

[0031] Fig.12 is a schematic diagram of the back structure of the support plate provided by the present invention;

[0032] Fig.13 is an exploded schematic diagram of the AI ​​server and the base provided by the present invention;

[0033] Fig.14 It is an exploded schematic diagram of the AI ​​server, support plate and base provided by the present invention;

[0034] Fig.15 It is a schematic diagram of the test parts of the packaging device for the drop test.

[0035] Included in the figure are:

[0036] 1. Base; 2. Support plate; 3. AI server; 21. First accommodating groove; 4. Upper cover; 5. First support block; 6. Second support block; 31. PCB board; 22. Cross reinforcement strip; 23. Through hole; 11. Third accommodating groove; 12. Fourth accommodating groove; 13. Space support block; 91. Fifth accommodating groove; 51. First insertion portion; 52. First pressing portion; 41. Sixth accommodating groove; 92. Seventh accommodating groove; 61. Second insertion portion; 62. Second accommodating groove; 44. Eighth accommodating groove; 63. Retaining edge; 8. Spring buckle mechanism; 81. Rotating shaft portion; 82. Second pressing portion; 83. Third insertion portion; 14. Ninth accommodating groove; 71. Subtractive structure; 72. Packing box; 32. Handle. DETAILED DESCRIPTION

[0037] The technical scheme in this embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in this embodiment of the present invention. Obviously, the described embodiment is one embodiment of the present invention, not all embodiments of the present invention. Based on this embodiment of the present invention, all other embodiments of the present invention obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Please refer to Figures 1 to 14 The present invention provides a low-G value buffer packaging device for an AI server.

[0039] First, the structure of the AI ​​server 3 is introduced in detail to better understand the difficulties in packaging and transporting the AI ​​server 3; specifically, Figure 1 As shown, the AI ​​server 3 includes a PCB board 31 installed at the bottom, various special chips installed on the PCB board 31, and a heat dissipation system installed on the special chips; for easy transportation, the AI ​​server 3 also includes handles 32 installed on both sides of the PCB board 31; the handles 32 are vertically fixed on the PCB board 31. The AI ​​server 3 is heavy, but the entire AI server 3 can still be lifted by the handles 32 on both sides. When transporting, generally two people are required to use the handles 32 to lift and place the entire AI server 3 vertically at the same time; because the AI ​​server 3 is relatively precise, except for a small part of the side where no components are installed, which can be pressed and fixed, other parts cannot be pressed or squeezed, thereby ensuring the integrity of the transportation process.

[0040] like Figure 2 and Fig. 9 As shown, the packaging device includes a base 1 installed at the bottom and an upper cover 4 installed at the top, and the base 1 and the upper cover 4 package and fix the AI ​​server 3 inside, thereby achieving the fixation and packaging of the AI ​​server 3; further, the base 1, the AI ​​server 3 and the upper cover 4 are all placed inside the packaging box 72, and the packaging box 72 can be loaded on a vehicle for transportation.

[0041] Furthermore, the packaging device includes a base 1 and a support plate 2 installed inside the base 1. The support plate 2 is embedded in the base 1 and contacts the PCB board 31 of the AI ​​server 3. The support plate 2 is provided with a first accommodating groove 21 for limiting the AI ​​server 3. The PCB board 31 is placed inside the first accommodating groove 21. The first accommodating groove 21 limits the four sides and the bottom of the PCB board 31, so that the AI ​​server 3 cannot move horizontally. The support plate 2 supports the whole of the AI ​​server 3 to realize a suspended cushioning packaging. While ensuring the cushioning effect of the naked AI server 3, it also achieves the purpose of energy saving and plastic reduction, and can be recycled and reused.

[0042] An upper cover 4 for covering the AI ​​server 3 is installed on the upper part of the base 1; the upper cover 4 protects the upper part of the AI ​​server 3. The upper part of the AI ​​server 3 is a heat dissipation system, which is easily deformed by contact, so the upper cover 4 does not contact the upper part of the AI ​​server 3.

[0043] Furthermore, in order to press and fix the AI ​​server 3, a plurality of first support blocks 5 are installed on both sides of the base 1, and the first support blocks 5 are inserted into the base 1 through the upper cover 4 and the support plate 2 to press and fix the sides of the AI ​​server 3; second support blocks 6 are installed on the other two sides of the base 1, and the second support blocks 6 are inserted into the base 1 through the upper cover 4 and the support plate 2 to press and fix the handle 32 on the AI ​​server 3; the first support blocks 5 and the second support blocks 6 fix the AI ​​server 3 in the vertical direction, and cooperate with the first accommodating groove 21 to completely fix the AI ​​server 3 to prevent it from moving, effectively prevent collision and falling damage during transportation, and ensure the transportation quality of the product.

[0044] In this embodiment, the AI ​​server 3 is fixed only by using the base 1, the support plate 2, the upper cover 4, the first support block 5 and the second support block 6, which has a simple structure, a small number of parts and a low cost; further, in the embodiment, the base 1, the support plate 2, the upper cover 4, the first support block 5 and the second support block 6 can be made of the same or similar material components, so that they can be easily recycled and reused.

[0045] The following is a detailed introduction to each part.

[0046] like Fig.13 As shown, the base 1 is an EPOP foamed bead hot-melt molded component; the support plate 2 is an injection molding material component. Furthermore, the support plate 2 adopts a non-foamed PP plate, and the base 1 is preferably EPOP foamed bead hot-melt molded, with a foaming density of 20-30 kg / cubic meter, and EPOP-polyolefin plastic foam beads are used; see patent application number: CN202310204438.0; the hardness of the support plate 2 is greater than that of the base 1, so that the PCB board 31 at the bottom of the AI ​​server 3 can be stably limited. During transportation, due to the strong hardness of the support plate 2, the PCB board 31 is not easy to damage the support plate 2, and the PCB board 31 is also difficult to move.

[0047] The base 1 wraps the bottom and side of the support plate 2 and is integrally formed in a mold to form a whole; specifically, the side of the base 1 is 30 mm wider than the side of the support plate 2, and the support plate 2 is pre-buried 17 mm inside the base 1.

[0048] The PCB board 31 at the bottom of the AI ​​server 3 is placed inside the first accommodating groove 21, and the first accommodating groove 21 limits the horizontal movement of the AI ​​server 3; the support plate 2 has limiting hardness, and the base 1 has strong buffering capacity; the two are combined to form a whole, and the advantages of the two are combined, so that it has a strong limiting function and retains a strong buffering capacity.

[0049] like Fig.11 As shown, the support plate 2 can be provided with a variety of positioning structures adapted to the PCB board 31, so that the PCB board 31 can be smoothly and stably placed inside the first accommodating groove 21; the support plate 2 can also be provided with left and right markings, so that the AI ​​server 3 can be placed more conveniently.

[0050] Further, such as Fig.12 As shown, in order to enhance the tightness of the connection between the support plate 2 and the base 1, a cross reinforcement strip 22 is installed at the bottom of the support plate 2, and a through hole 23 is arranged around the support plate 2. After the base 1 and the support plate 2 are formed, the cross reinforcement strip 22 is in close contact with the base 1, the base 1 fills the through hole 23, and a reinforcement column is formed inside the through hole 23, so that the base 1 and the support plate 2 are fixed to form a whole; in this way, after the integral molding in the mold, the base 1 and the support plate 2 cannot be separated without being destroyed.

[0051] like Fig. 9 As shown, in order to accommodate the larger AI server 3, the base 1 is provided with a third accommodating groove 11 for accommodating the lower part of the AI ​​server 3, and the upper cover 4 is provided with a fourth accommodating groove 12 for accommodating the upper part of the AI ​​server 3. The sides of the base 1 and the upper cover 4 are both provided with space support blocks 13, so that the fourth accommodating groove 12 does not contact the upper part of the AI ​​server 3; specifically, there is a gap of 15 mm between the fourth accommodating groove 12 and the AI ​​server 3; further, in order to reduce the weight and material of the packaging device, in this embodiment, the base 1 and the upper cover 4 are provided with a subtractive structure 71, which reduces the weight as much as possible while ensuring the strength and buffering capacity, so as to make the weight lighter and the cost lower.

[0052] like Figure 3As shown, in order to vertically press the PCB board 31, the number of the first support blocks 5 is 4, two are installed on each side, the first support block 5 is T-shaped, the base 1 and the support plate 2 are provided with a fifth accommodating groove 91, the first support block 5 includes a first insertion portion 51 inserted into the fifth accommodating groove 91 and a first pressing portion 52 for fixing the side of the PCB board 31 on the AI ​​server 3; the upper cover 4 is provided with a sixth accommodating groove 41 for accommodating the upper part of the first support block 5. Furthermore, the length of the first pressing portion 52 pressing the side of the PCB board 31 is 10mm; it can be seen that the pressing width of the first pressing portion 52 is small, although it can press the PCB board 31 and the entire AI server 3, the pressing and fixing force may not be strong enough, and the installation is not stable enough; it also shows that the packaging of the AI ​​server 3 is difficult.

[0053] In order to further press the AI ​​server 3 vertically so that the fixation of the AI ​​server 3 is more stable, the base 1 and the support plate 2 are both provided with a seventh accommodating groove 92, and the second support block 6 includes two parts, namely: a second insertion portion 61 inserted into the seventh accommodating groove 92 and a second accommodating groove 62 for sleeved on the upper end of the handle 32 on the AI ​​server 3; the upper cover 4 is provided with an eighth accommodating groove 44 for accommodating the upper part of the second support block 6; the second accommodating groove 62 is sleeved on the upper end of the handle 32 on the AI ​​server 3, and the upper end of the handle 32 is sleeved. The end is vertically limited, and the handle 32 is also pressed vertically downward, so that the entire AI server 3 is vertically pressed; further, the second accommodating groove 62 is provided with a guard edge 63 on one side of the handle 32, and the guard edge 63 limits the handle 32, and the guard edge 63 cooperates with the second accommodating groove 62 to limit the handle 32, thereby limiting the up and down movement of the AI ​​server 3; further, the guard edge 63 can form a U-shape with the second accommodating groove 62, and can completely buckle the handle 32, so that the positioning and limiting are more precise, and the vertical pressing is more stable.

[0054] In this embodiment, the first support block 5, the second support block 6, the base 1 and the upper cover 4 are formed by hot-melt molding of EPP, EPE and EPOP foam beads; preferably, EPOP foam beads are formed by hot-melt molding, and the upper cover 4 is the same as the base 1, with a foaming density of 20-30 kg / m3, so that the hardness of the base 1 and the upper cover 4 is the same, both have a smaller hardness and a stronger buffering capacity; the first support block 5 and the second support block 6 need to have a supporting capacity, and also need to limit the PCB board 31. The first support block 5 and the second support block 6 are the same, with a foaming density of 40-50 kg / m3, which has a certain hardness and a certain buffering capacity; finally, the hardness of the support plate 2 is greater than that of the first support block 5 and the second support block 6, and the hardness of the first support block 5 and the second support block 6 is greater than that of the base 1 and the upper cover 4.

[0055] In one embodiment, the number of the second insertion portion 61 is one, which is inserted into the seventh receiving groove 92; Figure 7 As shown, there are two second insertion parts 61, which are respectively located on both sides of the second support block 6; in order to further enhance the vertical pressing and limiting capabilities of the second support block 6; a spring snap mechanism 8 is installed in the middle of the second insertion part 61, and the spring snap mechanism 8 includes a rotating shaft part 81 installed on the second insertion part 61, a return spring sleeved on the rotating shaft part 81, a second pressing part 82 installed on the upper part of the rotating shaft part 81 and a third insertion part 83 installed on the lower part of the rotating shaft part 81; the third insertion part 83 is inserted into the ninth accommodating groove 14 inside the base 1, and the ninth accommodating groove 14 is located at the lower part of the support plate 2.

[0056] After the assembly is completed, the third insertion portion 83 is inserted into the base 1, so that the second support block 6 and the base 1 are connected together through the spring snap mechanism 8, achieving a tight connection that is not easy to separate. During transportation, they can be firmly connected together, thereby reducing damage during transportation; at the same time, the connection between the spring snap mechanism 8 and the base 1 also realizes the second accommodating groove 62 being sleeved on the upper end of the handle 32 on the AI ​​server 3, and the upper end of the handle 32 is vertically limited.

[0057] The third insertion portion 83 is clamped at the lower part of the support plate 2. Since the support plate 2 has a strong hardness, the clamping is also stable, thereby achieving a stable connection.

[0058] When assembling the second support block 6, manually press the second pressing portion 82 to overcome the elastic force of the return spring so that the third insertion portion 83 is outward; insert the second support block 6 vertically, at this time, the second insertion portion 61 is inserted into the seventh accommodating groove 92, and the second accommodating groove 62 is sleeved on the upper end of the handle 32 on the AI ​​server 3, and the retaining edge 63 limits the handle 32; after releasing the second pressing portion 82, the return spring drives the third insertion portion 83 to be inserted into the ninth accommodating groove 14 inside the base 1 to achieve assembly and connection.

[0059] During disassembly, manually press the second pressing portion 82 to overcome the elastic force of the return spring, so that the third insertion portion 83 is pulled outward, and the second support block 6 is also pulled out vertically. At this time, the second insertion portion 61 is pulled out vertically from the inside of the seventh accommodating groove 92, and the second accommodating groove 62 is pulled out vertically from the upper end of the handle 32.

[0060] In the above structure, the limiting structure of the AI ​​server 3 during transportation when it is placed vertically is introduced as a whole. The above structure can completely fix the AI ​​server 3 vertically to prevent it from moving, and effectively prevent collision during transportation; further, when the AI ​​server 3 flips over, the present embodiment can also stably support the AI ​​server 3 without damaging the AI ​​server 3, thereby ensuring the transportation quality of the product.

[0061] Specifically, if the AI ​​server 3 is inverted, first, the first pressing portion 52 will support the side of the PCB board 31, and the support width is as small as 10 mm, but the number of support points is as large as 4; secondly, the second accommodating groove 62 supports the bottom of the handle 32, and the retaining edge 63 limits the handle 32, so that the AI ​​server 3 will not deviate when it is inverted, and stable support is achieved, and other parts will not squeeze and damage the AI ​​server 3; finally, when the AI ​​server 3 is inverted, due to the presence of the spring buckle mechanism 8, the second support block 6 and the base 1 can be connected together to achieve a tight connection and cannot be separated, thereby achieving stable support of the AI ​​server 3 by the second support block 6; specifically, the third insertion portion 83 is inserted into the ninth accommodating groove 14 of the base 1 to achieve the connection between the base 1 and the spring buckle mechanism 8, and the shaft portion 81 is connected to the second insertion portion 61 to achieve the connection between the spring buckle mechanism 8 and the second support block 6; thereby achieving a stable connection between the second support block 6 and the base 1.

[0062] The assembly steps of the packaging device are as follows:

[0063] Step S1: embedding the support plate 2 inside the base 1, wherein the base 1 wraps the bottom and side surfaces of the support plate 2 and is integrally formed in a mold to form a whole;

[0064] Step S2: placing the above-mentioned whole inside the packaging box 72 to prepare for the subsequent placement of the AI ​​server 3;

[0065] Step S3: Place the AI ​​server 3 in the first receiving groove 21 stably and stably by using the handles 32 on both sides; the first receiving groove 21 is adapted to the PCB board 31 at the bottom of the AI ​​server 3;

[0066] Step S4: plugging the first support block 5, specifically, the first inserting portion 51 is inserted into the fifth accommodating groove 91, and the first pressing portion 52 fixes the side of the PCB board 31 on the AI ​​server 3;

[0067] Step S5: plug the second support block 6. Specifically, manually press the second pressing portion 82 to overcome the elastic force of the return spring so that the third insertion portion 83 is outward; the second insertion portion 61 is inserted into the seventh accommodating groove 92, and the second accommodating groove 62 is sleeved on the upper end of the handle 32 on the AI ​​server 3, and the retaining edge 63 limits the handle 32; after releasing the second pressing portion 82, the return spring drives the third insertion portion 83 to be inserted into the ninth accommodating groove 14 inside the base 1 to achieve stable plugging;

[0068] Step S6: Place the upper cover 4 on the upper part of the AI ​​server 3, insert the upper part of the first support block 5 into the sixth accommodating groove 41, and insert the upper part of the second support block 6 into the eighth accommodating groove 44; and seal and pack the packaging box 72.

[0069] Experimental measurement data of the packaging device:

[0070] In order to meet the requirements of relevant national standards, it is necessary to conduct a drop test on the packaging device to evaluate the impact resistance of the packaging device when subjected to vertical impact and the packaging device's ability to protect the product, thereby ensuring the safety of the product.

[0071] 1. Packing weight: 38kg;

[0072] 2. Drop height: 51CM;

[0073] 3. Drop hardware: Lansmont drop test machine;

[0074] 4. Software: Lansmont Test Partner3.

[0075] like Fig.15 As shown, the G value measurement table of the packaging device made of EPOP material:

[0076]

[0077] From the measurement table of the G value of the packaging device, it can be seen that the measured value is ≤50G. The packaging device has the advantages of high compression strength and good elastic recovery performance, which meets the low G value requirements of the product.

[0078] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

Claims

1. A low-G value buffer packaging device for an AI server, characterized in that: The invention comprises a base (1) installed at the bottom and a support plate (2) installed inside the base (1), wherein the support plate (2) is embedded inside the base (1), and a first accommodating groove (21) for limiting the position of the AI ​​server (3) is provided on the support plate (2), and an upper cover (4) for covering the AI ​​server (3) is installed on the upper part of the base (1); a plurality of first support blocks (5) are installed on both sides of the base (1), and the first support blocks (5) pass through the upper cover (4) and the support plate (2) and are inserted into the base (1) to press and fix the side of the AI ​​server (3); and second support blocks (6) are installed on the other two sides of the base (1), and the second support blocks (6) pass through the upper cover (4) and the support plate (2) and are inserted into the base (1) to press and fix the handle (32) on the AI ​​server (3).

2. The low-G value cushioning packaging device for an AI server according to claim 1, characterized in that: The base (1) is a foamed bead hot-melt molded component; the support plate (2) is an injection molded component, the base (1) and the support plate (2) are integrally molded in a mold, and the bottom and side surfaces of the support plate (2) are wrapped by the base (1); the PCB board (31) at the bottom of the AI ​​server (3) is placed inside the first accommodating groove (21), and the first accommodating groove (21) limits the horizontal movement of the AI ​​server (3).

3. The low-G value cushioning packaging device for an AI server according to claim 2, characterized in that: A cross reinforcing strip (22) is installed at the bottom of the support plate (2), and a through hole (23) is arranged around the support plate (2). After the base (1) and the support plate (2) are formed, the cross reinforcing strip (22) is in close contact with the base (1), the base (1) fills the through hole (23), and a reinforcing column is formed inside the through hole (23), so that the base (1) and the support plate (2) are fixed to form a whole.

4. The low-G value cushioning packaging device for an AI server according to claim 1, characterized in that: The base (1) is provided with a third accommodating groove (11) for accommodating the lower part of the AI ​​server (3), and the upper cover (4) is provided with a fourth accommodating groove (12) for accommodating the upper part of the AI ​​server (3). The sides of the base (1) and the upper cover (4) are both provided with space support blocks (13) so that the fourth accommodating groove (12) does not contact the upper part of the AI ​​server (3).

5. The low-G value cushioning packaging device for an AI server according to claim 1, characterized in that: The base (1) and the support plate (2) are both provided with a fifth accommodating groove (91); the first support block (5) is T-shaped; the first support block (5) comprises a first insertion portion (51) inserted into the fifth accommodating groove (91) and a first pressing portion (52) for fixing the side of the PCB board (31) on the AI ​​server (3); and the upper cover (4) is provided with a sixth accommodating groove (41) for accommodating the upper part of the first support block (5).

6. The low-G value cushioning packaging device for an AI server according to claim 5, characterized in that: The length of the first pressing portion (52) pressing the side of the PCB board (31) is 10 mm.

7. The low-G value cushioning packaging device for an AI server according to claim 1, characterized in that: The base (1) and the support plate (2) are both provided with a seventh accommodating groove (92); the second support block (6) comprises a second insertion portion (61) inserted into the seventh accommodating groove (92) and a second accommodating groove (62) for being sleeved on the upper end of the handle (32) on the AI ​​server (3); the upper cover (4) is provided with an eighth accommodating groove (44) for accommodating the upper part of the second support block (6); the second accommodating groove (62) is provided with a retaining edge (63) on one side of the handle (32); the retaining edge (63) cooperates with the second accommodating groove (62) to limit the handle (32) and restrict the up and down movement of the AI ​​server (3).

8. The low-G value cushioning packaging device for an AI server according to claim 7, characterized in that: A spring snap mechanism (8) is installed in the middle of the second insertion portion (61), and the spring snap mechanism (8) comprises a rotating shaft portion (81) installed on the second insertion portion (61), a return spring sleeved on the rotating shaft portion (81), a second pressing portion (82) installed on the upper part of the rotating shaft portion (81) and a third insertion portion (83) installed on the lower part of the rotating shaft portion (81); the third insertion portion (83) is inserted into a ninth accommodating groove (14) inside the base (1), and the ninth accommodating groove (14) is located at the lower part of the support plate (2).

9. The low-G value cushioning packaging device for an AI server according to claim 1, characterized in that: The base (1) and the upper cover (4) are both provided with a material reduction structure (71), and the base (1), the AI ​​server (3) and the upper cover (4) are all placed inside a packaging box (72).

10. The low-G value cushioning packaging device for an AI server according to claim 2, characterized in that: The first support block (5), the second support block (6), the base (1) and the upper cover (4) are formed by hot-melt molding of EPP, EPE and EPOP foam beads; preferably, they are formed by hot-melt molding of EPOP foam beads. The foaming density of the first support block (5) and the second support block (6) is 40-50 kg / m3; the foaming density of the base (1) and the upper cover (4) is 20-30 kg / m3.

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