Adhesive resin as well as preparation method and application thereof

Abstract

The invention provides adhesive resin as well as a preparation method and application thereof. The preparation method comprises the following steps: providing a first mixed monomer containing hydroxyethyl acrylate and octyl acrylate, and a second mixed monomer containing methacrylate, isobornyl acrylate, acrylic acid, hydroxyethyl acrylate and octyl acrylate; performing a first polymerization reaction on a first reaction system containing the first mixed monomer and an initiator in an inert atmosphere to obtain an intermediate product; and performing a second polymerization reaction on a second reaction system containing the intermediate product, a second mixed monomer and an initiator in an inert atmosphere to obtain the adhesive resin. The adhesive resin provided by the invention has good buffer performance and impact and drop resistance, is suitable for being applied to impact and drop resistance scenes, and can still keep stable performance under harsh conditions such as high temperature and high humidity, low temperature, cold and hot impact and the like.

Description

Technical Field

[0001] The invention belongs to the technical field of adhesives, and in particular relates to an adhesive resin and a preparation method and application thereof. Background Art

[0002] With the rapid development of science and technology, the electronics industry is changing with each passing day, and the functional upgrade and iteration time of electronic equipment has become shorter, which makes people buy new electronic products more frequently. For example, mobile phones, headphones, and music players will have a strong demand for updates every 1 to 2 years. These electronic devices use a large number of pressure-sensitive tape products, and the raw materials for the preparation of adhesives for traditional tape products are basically derived from the extraction of fossil materials, which will produce a large amount of carbon emissions during the production process. The conventional pressure-sensitive adhesives currently used in large quantities are usually derived from non-renewable resources such as petroleum. Since the formation of such substances takes hundreds of millions of years and cannot be regenerated in the short term, their large-scale use will accelerate the depletion of earth resources, which is inconsistent with the needs of environmental protection and low-carbon economy.

[0003] In recent years, some electronic product manufacturers have proposed the demand for biomass-based adhesive products based on the government's environmental protection requirements and social responsibility. Some adhesive manufacturers have also developed related bio-based adhesives. However, due to the limitation of monomer types from bio-based sources and the low overall demand for bio-based products, the development focus is still on bio-based content. No further expansion has been made in performance, and there is no performance diversity of traditional adhesives. The current bio-based adhesives have insufficient buffering capacity, which results in poor drop and impact resistance. Summary of the invention

[0004] In order to solve all or part of the above technical problems, the present invention provides the following technical solutions:

[0005] One of the objects of the present invention is to provide a method for preparing an adhesive resin, comprising:

[0006] Providing a first mixed monomer containing hydroxyethyl acrylate and octyl acrylate, and a second mixed monomer containing methacrylate, acrylic acid, hydroxyethyl acrylate and octyl acrylate;

[0007] In an inert atmosphere, subjecting a first reaction system containing the first mixed monomer and an initiator to a first polymerization reaction to obtain an intermediate product;

[0008] In an inert atmosphere, a second reaction system containing the intermediate product, a second mixed monomer and an initiator is subjected to a second polymerization reaction to obtain an adhesive resin.

[0009] Compared to conventional one-step polymerization, the present invention divides the polymerization of resin into two steps, which can achieve wider different molecular chain distribution and multi-structural performance complementarity. Wherein the first polymerization reaction uses a soft monomer with a low Tg point, which is polymerized into a long-chain main resin with a larger molecular weight (molecular weight Mn> 1 million), and this structure gives the polymer a lower Tg, and has good molecular chain viscoelasticity and cohesion, and can quickly achieve the elastic response of the molecular weight when impacted to absorb impact energy. The second polymerization reaction introduces a polar monomer, which provides a polar bond while ensuring cross-linking to achieve further improvement in adhesion. The resin obtained has a good buffering effect, is very adaptable to application scenarios with an anti-drop effect, and can be applied to electronic components such as mobile phone back shells, battery fixing, camera module pasting, and speaker bonding.

[0010] In some embodiments, the temperature of the first polymerization reaction is 63-67° C., and the time is 2.0-3.5 h.

[0011] In some embodiments, the second polymerization reaction includes: first reacting the second reaction system at 63-67°C for 2.0-3.5 hours, then raising the temperature to 78-81°C and keeping it warm for 2-3 hours to obtain the adhesive. Under the temperature condition of 63-67°C, the monomers are gradually and gently polymerized, and the degree of polymerization reaches more than 90% (which can be measured by the solid content method). Under the reaction condition of 78-81°C, the reaction activity is further improved due to the increase in temperature, which can make the residual monomers in the 63-67°C reaction stage further react, reduce the small molecule residues in the system, and further improve the cohesion.

[0012] In some embodiments, the method specifically includes: after the first polymerization reaction is completed, adding the second mixed monomer to the product of the first polymerization reaction in batches, the second mixed monomer is added in batches within 20 to 40 minutes, and the initiator is added to obtain the second reaction system.

[0013] In some embodiments, the method specifically includes: after the first polymerization reaction is completed, adding the second mixed monomer to the product of the first polymerization reaction in batches, and completing the addition in batches within 20 to 40 minutes, then adding 0.06 to 0.15 wt% of the initiator, and reacting at 63 to 67°C for 2.5 hours; then raising the temperature to 78 to 81°C, adding 0.1 to 0.3 wt% of the initiator, and maintaining the temperature for 2 hours.

[0014] In some embodiments, when the reaction temperature is 63-67°C, an inert gas is continuously introduced into the reaction system at a flow rate of 400-600 ml / min. After the reaction temperature is raised to 78-81°C, the inert gas introduction rate is adjusted to 200-400 ml / min.

[0015] In some embodiments, the first mixed monomer includes 1 to 3 parts of hydroxyethyl acrylate and 32 to 48 parts of octyl acrylate, and the second mixed monomer includes 1 to 5 parts of methacrylate, 1.5 to 9 parts of acrylic acid, 1 to 3 parts of hydroxyethyl acrylate and 40 to 63 parts of octyl acrylate.

[0016] In some embodiments, the second mixed monomer further comprises 0.8 to 4 parts by weight of isobornyl acrylate. By adding isobornyl acrylate containing a cyclic group, the rigidity of the entire molecular chain can be increased, the internal stress and shrinkage rate of the adhesive during curing can be reduced, the cohesion and impact resistance can be further improved, and the adhesion to inorganic plates such as metal and glass can be improved.

[0017] In some preferred embodiments, the first mixed monomer includes 1 to 2 parts of hydroxyethyl acrylate and 32 to 48 parts of octyl acrylate, and the second mixed monomer includes 1 to 3 parts of methacrylate, 0 to 2 parts of isobornyl acrylate, 3 to 7 parts of acrylic acid, 1 to 2 parts of hydroxyethyl acrylate and 40 to 63 parts of octyl acrylate.

[0018] In some embodiments, the first reaction system and the second reaction system further include 140 to 260 parts of a solvent.

[0019] In some embodiments, the solvent includes one or more of ethyl acetate, toluene, butanone, xylene, and butyl acetate, and the solvent preferably includes ethyl acetate. Compared with other solvents, ethyl acetate has low toxicity and is more operator-friendly. At the same time, chain transfer absorption has better matching properties for acrylic acid polymerization and better molecular weight control.

[0020] In some embodiments, the concentration of the initiator in the first reaction system is 0.06-0.15 wt %, and the concentration of the initiator in the second reaction system is 0.1-0.3 wt %.

[0021] In some embodiments, the initiator includes one or a combination of azobisisobutyronitrile, azobisisoheptanenitrile or azobisisovaleronitrile.

[0022] In some embodiments, the method further comprises: adding a solvent to the prepared adhesive resin for dilution, thereby obtaining a resin with a solid content of 28-32%.

[0023] In a typical embodiment, the method for preparing the adhesive resin comprises the following steps:

[0024] (1) providing a first mixed monomer containing 1 to 3 parts of hydroxyethyl acrylate and 32 to 48 parts of octyl acrylate in a uniform mixture; providing a second mixed monomer containing 1 to 5 parts of methyl methacrylate, 1.5 to 9 parts of acrylic acid, 1 to 3 parts of hydroxyethyl acrylate and 40 to 63 parts of octyl acrylate in a uniform mixture;

[0025] (2) mixing the first mixed monomer with 140 to 260 parts of solvent, and continuously introducing nitrogen for more than 30 minutes before the polymerization reaction, and heating to 63 to 67° C., and then adding 0.06 to 0.15 wt % of initiator to start the reaction, and the reaction lasts for 2.5 hours;

[0026] (3) After the reaction of step (2) is completed, the second mixed monomer is added dropwise to the reaction product of the above step (2), the total addition time of the second mixed monomer is 20 to 40 minutes, and the reaction temperature fluctuation is controlled within the range of ±1°C during the addition process. After the addition is completed, a 0.1wt% concentration of initiator is added to start the reaction, and the reaction lasts for 2.0 to 3.5 hours; then the temperature is raised to 78 to 81°C within 30 minutes, and a 0.2wt% concentration of initiator is added again, and the reaction is kept warm for 2 to 3 hours;

[0027] (4) After the reaction time is reached, the heating is stopped, the inert atmosphere is turned off, and then 50 to 120 parts of solvent is added for dilution. After cooling to room temperature, the material is discharged to obtain an adhesive resin.

[0028] A second object of the present invention is to provide an adhesive resin prepared by the method described in any one of the above technical solutions.

[0029] The third object of the present invention is to provide an adhesive coating, which comprises, by mass, 100 parts of a main resin, 3.5 to 6.4 parts of a tackifying resin, 0.18 to 0.32 parts of a curing agent and 10 to 60 parts of a solvent, wherein the main resin comprises the adhesive resin.

[0030] In some embodiments, the tackifying resin includes terpene phenolic resin. Terpene phenolic resin has a relatively large polarity and can improve adhesion, and has a relatively high tg point, which can increase the use temperature range of the coating.

[0031] In some embodiments, the solvent of the adhesive coating includes one or more of ethyl acetate, toluene, butanone, xylene, and butyl acetate, preferably ethyl acetate.

[0032] In some embodiments, the curing agent includes an isocyanate curing agent.

[0033] The adhesive coating can be used to prepare a single-layer or double-layer pressure-sensitive adhesive.

[0034] A fourth object of the present invention is to provide an adhesive structure, comprising: a substrate and an adhesive layer formed on the substrate, wherein the adhesive layer comprises the adhesive coating.

[0035] In some embodiments, the adhesive structure specifically includes: a substrate; an adhesive layer coated on two opposite surfaces of the substrate; and a release film layer coated on the adhesive layer.

[0036] In some embodiments, the thickness of the adhesive layer is 42-46 μm.

[0037] A fifth object of the present invention is to provide an application of the adhesive resin, adhesive coating or adhesive structure in adhering electronic components to the main structure of an electronic product, wherein the electronic components include a housing of the electronic product (such as a mobile phone back cover), a battery, a camera module or a speaker.

[0038] Compared with the prior art, the present invention has at least the following beneficial effects:

[0039] (1) The present invention adopts a two-step polymerization method to prepare an adhesive resin with excellent buffering effect, wherein the first polymerization reaction uses a soft monomer with a low Tg point to polymerize it into a long-chain main resin with a large molecular weight (molecular weight Mn>1 million). This structure gives the polymer a low Tg and good molecular chain viscoelasticity and cohesion. When impacted, it can quickly achieve elastic response of the molecular weight to absorb impact energy; the second polymerization reaction introduces a polar monomer to provide polar bonds while ensuring cross-linking to further improve adhesion. The obtained resin has a good buffering effect and is suitable for use in impact resistance and drop resistance scenarios, especially for bonding mobile phone back shells, battery fixation, camera module pasting, speakers and other electronic components.

[0040] (2) The adhesive resin provided by the present invention also has relatively high adhesion and high cohesion; it can maintain stable performance under harsh conditions such as high temperature and high humidity, low temperature, and thermal shock, thereby solving the problem that conventional bio-based pressure-sensitive adhesives cannot achieve balanced performance under harsh environmental conditions; the content of bio-based monomers in the monomers used in the present invention is greater than 65%, which meets environmental protection requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 11 is a schematic diagram of a reaction process for preparing an adhesive resin in one embodiment of the present invention;

[0043] Figure 2 is a schematic diagram of the adhesive tape being attached to an aluminum plate when testing the drop performance of the adhesive tape in the present invention;

[0044] Figure 3 The present invention is a schematic diagram of the adhesive tape being attached between an aluminum plate and an iron block when testing the drop performance of the adhesive tape. DETAILED DESCRIPTION

[0045] The technical solution of the present invention is described in detail below in conjunction with specific embodiments so that those skilled in the art can better understand and implement the technical solution of the present invention. The specific functional details disclosed herein should not be interpreted as limiting, but only as the basis for the claims and as a representative basis for teaching those skilled in the art to adopt the present invention in different ways in any appropriate detailed embodiment.

[0046] Unless otherwise specified, the raw materials and reagents used in the specific embodiments of the present invention are all commercially available; the "parts" involved are parts by mass.

[0047] Example 1

[0048] This embodiment provides an adhesive resin and a preparation method thereof. Figure 1 Schematic diagram of the reaction process for preparing adhesive resin, which specifically includes the following steps:

[0049] Step 1: By weight, 1.8 parts of hydroxyethyl acrylate (HEA) and 40 parts of octyl acrylate (2-OA) are mixed and stirred at room temperature to obtain a first mixed monomer; by weight, 2.5 parts of methacrylate (6105NS), 1 part of isobornyl acrylate (5102NS), 6 parts of acrylic acid (AA), 1.2 parts of hydroxyethyl acrylate (HEA) and 47.5 parts of octyl acrylate (2-OA) are mixed and stirred to obtain a second mixed monomer;

[0050] Step 2: Add the first mixed monomer into a four-necked flask, then add 160 parts of ethyl acetate (EtAc), heat in a water bath, set the temperature to 64°C (±1°C), and introduce nitrogen at the same time (nitrogen introduction time 50min, nitrogen rate 500ml / min), after reaching the set temperature, add 0.1wt% of azobisisobutyronitrile (AIBN), define the start of heat release as the start time of the reaction, and then control the reaction temperature within the set range, and last for 2.5h;

[0051] Step 3: Use a dropping funnel to drop the second mixed monomer into the reaction product of step 2, control the second mixed monomer to be added within 30 minutes, then add 0.1wt% AIBN, and continue the reaction for 2.5 hours; then raise the temperature to 78°C within 30 minutes, then add 0.2wt% AIBN, and continue the reaction for 2 hours;

[0052] Step 4: Stop heating and nitrogen flow, add 70 parts of ethyl acetate to dilute the solvent, cool to room temperature and discharge to obtain an adhesive resin.

[0053] This embodiment also provides a method for preparing an adhesive tape using the adhesive resin prepared above as a main resin, as follows:

[0054] Take 100 g of the adhesive resin prepared above, add 50 g of ethyl acetate, 0.24 g of isocyanate curing agent L-75 (purchased from Soken Chemical Co., Ltd.) and 4.5 g of terpene phenolic resin T-803L (purchased from Arakawa Chemical), then stir evenly to obtain an adhesive coating, and let it stand for use;

[0055] The prepared adhesive coating was coated on one side of a 12μm PET polyester film substrate, and baked in a 110°C oven for 3 minutes. The coated adhesive layer was 44μm thick. A 75μm PET polyester film silicone-based release film was attached to the adhesive surface. Then, a 44μm adhesive layer was coated on the other side of the 12μm PET polyester film substrate according to the above steps, and a 25μm PET polyester film silicone-based release film was attached to obtain a double-sided tape with a total thickness of 100μm. The obtained double-sided tape was placed in a 40°C oven, aged for 48h, and taken out for testing.

[0056] Embodiments 2 to 9

[0057] Examples 2 to 7 are substantially the same as Example 1, except that the monomer content of the adhesive resin is changed as shown in Table 1, and the content of each component in the adhesive coating is changed.

[0058] Comparative Example 1

[0059] Comparative Example 1 provides a method for preparing an adhesive resin by a one-step polymerization method, and a coating using the adhesive resin as a main resin, specifically comprising:

[0060] By weight, 1.8 parts of hydroxyethyl acrylate and 40 parts of octyl acrylate were mixed and stirred at room temperature to obtain a first mixed monomer; by weight, 2.5 parts of methacrylate, 1 part of isobornyl acrylate, 6 parts of acrylic acid, 1.2 parts of hydroxyethyl acrylate and 47.5 parts of octyl acrylate were mixed and stirred to obtain a second mixed monomer;

[0061] The first mixed monomer and the second mixed monomer are added together into a four-necked flask, and then 160 parts of ethyl acetate (EtAc) are added, and the temperature is heated in a water bath, and the temperature is set to 64°C (±1°C), and nitrogen is introduced at the same time (time 50min, nitrogen rate 500ml / min), and then 0.2wt% of azobisisobutyronitrile (AIBN) is added, and the start of heat release is defined as the start time of the reaction, and then the reaction temperature is controlled within the set range, and the duration is 3h;

[0062] After the reaction was completed, heating and nitrogen flow were stopped, 70 parts of ethyl acetate was added to dilute the solvent, and the mixture was cooled to room temperature and discharged to obtain a resin.

[0063] The method for preparing the adhesive tape of Comparative Example 1 is the same as that of Example 1, except that the main resin of Example 1 is replaced by the resin prepared in Comparative Example 1.

[0064] Comparative Example 2

[0065] Step 1: Mix 1.8 parts of hydroxyethyl acrylate (HEA) and 40 parts of octyl acrylate (2-OA) by weight at room temperature and stir evenly to obtain a first mixed monomer;

[0066] Step 2: Add the first mixed monomer into a four-necked flask, then add 160 parts of ethyl acetate (EtAc), heat in a water bath, set the temperature to 64°C (±1°C), and introduce nitrogen at the same time (nitrogen introduction time 50 min, nitrogen rate 500 ml / min). After reaching the set temperature, add 0.1 wt% of azobisisobutyronitrile (AIBN), define the start of heat release as the start time of the reaction, and then control the reaction temperature within the set range, lasting 2.5 hours to obtain the resin.

[0067] The method for preparing the adhesive tape of Comparative Example 2 is the same as that of Example 1, except that the main resin of Example 1 is replaced by the resin prepared in Comparative Example 1.

[0068] The present invention conducts relevant performance tests on the double-sided adhesive tapes prepared in the above embodiments and comparative examples, and the results are shown in Table 1 and Table 2.

[0069] Comparative Examples 3-9

[0070] The difference between Comparative Examples 3-9 and Example 1 is that the monomer content of the adhesive resin is changed as shown in Table 2, or the content of each component in the adhesive coating is changed, and the rest is the same as Example 1.

[0071] Table 1 Test results of relevant embodiments of the present invention

[0072]

[0073] Table 2 Test results of the comparative examples of the present invention

[0074]

[0075]

[0076] In Table 1 and Table 2, 2-OA is BASF octyl acrylate; 6105NS is Sarbio series methacrylate; 5102NS is Sarbio series isobornyl methacrylate; AA: acrylic acid; HEA: hydroxyethyl acrylate; AIBN: azobisisobutyronitrile; EtAc: ethyl acetate.

[0077] The test method for adhesion is: test the SUS / AL / PC board with a sample width of 25mm, attach it in an environment of 23℃×50%RH, roll it back and forth 3 times with a 2Kg roller, leave it for 20 minutes, and then perform a peel test at 300mm / min and 180℃, and record the test results.

[0078] The holding force test method is as follows: the SUS plate is tested with a pasting area of ​​25mm×25mm, a 2Kg roller is rolled back and forth 10 times, placed in an 85°C oven for 20 minutes, and then a 1Kg weight is loaded at 180° for 24 hours, and the moving distance is recorded.

[0079] Drop test: Cut the tape into 50mm*10mm strips and attach them between the SUS block and the aluminum plate (attachment method is as follows Figure 2 , Figure 3 As shown), the SUS weighs 200g, the length and width are 75mm*60mm, the length and width of the aluminum plate are 90mm*70mm, and 3 tape strips are pasted in parallel with a spacing of 10mm. After pasting, they are pressed with a pressure of 5kg for 10s, and then placed for 48 hours. Then, they are randomly dropped in the drum drop device, the detachment is observed, and the number of drops is recorded.

[0080] In summary, the adhesive resin containing bio-based monomers with buffering effect provided by the present invention adopts the synthesis mechanism of solvent-based free radical polymerization, and can achieve balanced performance through reasonable formula design and special polymerization process route design. In terms of performance, it not only has the basic requirements of pressure-sensitive adhesives such as high adhesion and high cohesion, but also has good impact resistance, and can maintain excellent performance under harsh conditions such as high temperature and humidity, low temperature, and hot and cold shock. The initial adhesion of the tape is above 16N / 25mm, and it can be kept for more than 24 hours without falling at 85℃ and 1kg load. The drop performance does not fall off when the number of drops is more than 100 times under the test conditions of a special drop fixture.

[0081] In addition, the resin prepared by the present invention has a bio-based content greater than 65%, and the main bio-based monomer components are sourced from renewable resources such as vegetable oils and resins. Such sources are all renewable and will not produce excess carbon emissions. The planting and growth of the source plants will also play a carbon fixation role, and large-scale use will not destroy the existing natural ecological balance.

[0082] The various aspects, embodiments, features and examples of the present invention should be considered as illustrative in all aspects and are not intended to limit the present invention, the scope of the present invention is defined only by the claims. Other embodiments, modifications and uses will be apparent to those skilled in the art without departing from the spirit and scope of the claimed invention.

[0083] In addition, the inventors of this case also referred to the aforementioned embodiments and conducted experiments with other raw materials, process operations, and process conditions described in this specification, and obtained relatively ideal results.

[0084] Although the present invention has been described with reference to illustrative embodiments, it will be appreciated by those skilled in the art that various other changes, omissions and / or additions may be made without departing from the spirit and scope of the present invention and that the elements of the embodiments may be replaced by substantial equivalents. In addition, many modifications may be made without departing from the scope of the present invention to adapt specific circumstances or materials to the teachings of the present invention. Therefore, it is not intended herein to limit the present invention to the disclosed specific embodiments for performing the present invention, but it is intended that the present invention will include all embodiments within the scope of the appended claims. In addition, unless specifically stated, any use of the terms first, second, etc. does not indicate any order or importance, but rather uses the terms first, second, etc. to distinguish one element from another.

Claims

1. A method for preparing an adhesive resin, characterized in that: include: Providing a first mixed monomer containing hydroxyethyl acrylate and octyl acrylate, and a second mixed monomer containing methacrylate, acrylic acid, hydroxyethyl acrylate and octyl acrylate; In an inert atmosphere, subjecting a first reaction system containing the first mixed monomer and an initiator to a first polymerization reaction to obtain an intermediate product; In an inert atmosphere, a second reaction system containing the intermediate product, a second mixed monomer and an initiator is subjected to a second polymerization reaction to obtain an adhesive resin.

2. The preparation method according to claim 1, characterized in that: The temperature of the first polymerization reaction is 63-67° C. and the time is 2.0-3.5 h; And / or, the second polymerization reaction includes: firstly reacting the second reaction system at 63-67° C. for 2.0-3.5 hours, and then raising the temperature to 78-81° C. and keeping the temperature for 2-3 hours to obtain the adhesive.

3. The preparation method according to claim 1, characterized in that: Specifically include: After the first polymerization reaction is completed, the second mixed monomer is added in batches to the product of the first polymerization reaction, and the second mixed monomer is added in batches within 20-40 minutes, and the initiator is added to obtain the second reaction system.

4. The preparation method according to any one of claims 1 to 3, characterized in that: In parts by mass, the first mixed monomer includes 1-3 parts of hydroxyethyl acrylate and 32-48 parts of octyl acrylate; the second mixed monomer includes 1-5 parts of methacrylate, 1.5-9 parts of acrylic acid, 1-3 parts of hydroxyethyl acrylate and 40-63 parts of octyl acrylate; and / or, the second mixed monomer further comprises 0.8 to 4 parts of isobornyl acrylate; And / or, the first reaction system and the second reaction system further include 140 to 260 parts of solvent.

5. The preparation method according to claim 4, characterized in that: The solvent includes one or a combination of ethyl acetate, toluene, butanone, xylene, and butyl acetate.

6. The preparation method according to claim 1, characterized in that: The concentration of the initiator in the first reaction system is 0.06-0.15 wt %, and the concentration of the initiator in the second reaction system is 0.1-0.3 wt %; And / or, the initiator includes one or a combination of azobisisobutyronitrile, azobisisoheptanenitrile or azobisisovaleronitrile.

7. An adhesive resin, characterized in that: The method is prepared by the method described in any one of claims 1 to 6.

8. An adhesive coating, characterized in that: The composition comprises, by weight: 100 parts of a main resin, 3.5-6.4 parts of a tackifying resin, 0.18-0.32 parts of a curing agent, and 10-60 parts of a solvent, wherein the main resin comprises the adhesive resin according to claim 7; Preferably, the tackifying resin comprises a terpene phenolic resin; Preferably, the curing agent includes an isocyanate curing agent.

9. An adhesive structure, characterized in that: include: A substrate and an adhesive layer formed on the substrate, wherein the adhesive layer comprises the adhesive coating according to claim 8.

10. Use of the adhesive resin according to claim 7, the adhesive coating according to claim 8 or the adhesive structure according to claim 9 in adhering electronic components to the main structure of electronic products, wherein the electronic components include a housing, a battery, a camera module or a speaker of the electronic product.

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