Water-based thermal insulation coating

Abstract

The invention relates to a water-based thermal insulation coating. The invention discloses a water-based thermal insulation coating composition which comprises water-based resin, a coalescing agent and a thermal insulation agent. The water-based resin is selected from at least one of material groups consisting of acrylic resin, polyurethane resin and epoxy resin. The aqueous resin has a minimum film formation temperature of not less than 5 DEG C. The coalescing agent is selected from at least one of a material group consisting of a plasticizer, an alcohol ether solvent, an alcohol ester solvent, a mixed solvent of ethylene glycol monobutyl ether and dipropylene glycol butyl ether, and an aprotic solvent. And the heat insulation agent is hydrated silicon dioxide. Therefore, the water-based heat insulation coating has the technical effect of reducing carbon emission, can replace the traditional solvent type coating, and has a heat insulation function.

Description

Technical Field

[0001] The invention relates to a coating, in particular to a water-based heat-insulating coating. Background Art

[0002] In the prior art, most of the coatings on traditional color steel plates and automobile paints are solvent-based coatings, and the coatings are dried through a high-temperature baking process. However, during the high-temperature baking process, solvent-based coatings often have the problem of excessive volatilization of solvents, thereby causing environmental pollution.

[0003] Although the existing technology also uses water-based paint on color steel plates and automobile paint to improve the problem of excessive solvent volatilization, the existing water-based paint will form a coating film too early during the high-temperature film formation process (such as 250°C), so the coating surface often has problems such as pinholes, bubbles, cracks, and poor adhesion. Summary of the invention

[0004] In order to match the equipment of traditional color steel plants, one of the purposes of the present invention is to provide an improved water-based thermal insulation coating, which can replace the existing solvent-based coating without changing the existing process equipment and process conditions, thereby effectively improving the problem of excessive solvent volatilization. Since the water-based thermal insulation coating provided by the present invention has an excellent thermal insulation effect, it can achieve the effect of energy saving and carbon reduction.

[0005] In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a water-based thermal insulation coating, which includes: a water-based resin, the water-based resin is selected from at least one of the material groups consisting of acrylic resin, polyurethane resin, and epoxy resin, and the water-based resin has a minimum film-forming temperature of not less than 5°C; a film-forming aid, the film-forming aid is selected from at least one of the material groups consisting of plasticizers, alcohol ether solvents, alcohol ester solvents, a mixed solvent of ethylene glycol monobutyl ether and dipropylene glycol butyl ether, and aprotic solvents; and a thermal insulation agent, the thermal insulation agent is hydrated silica.

[0006] Preferably, the water-based resin is prepared by emulsion polymerization of a water-based resin composition; the water-based resin composition comprises: water, a mixed monomer, and an emulsifier; and the mixed monomer further comprises: a first monomer, a second monomer, a third monomer, and a fourth monomer; wherein the first monomer is an acrylate monomer, the second monomer is an alkyl-containing methacrylate monomer, the third monomer is a styrene-containing monomer, and the fourth monomer is a carboxyl-containing monomer.

[0007] Preferably, the weight ratio of water: the first monomer: the second monomer: the third monomer: the fourth monomer: the emulsifier is between 110-150: 20-50: 5-30: 15-40: 10-35: 1-5.

[0008] Preferably, the weight ratio of water: the first monomer: the second monomer: the third monomer: the fourth monomer: the emulsifier is between 120-140: 30-45: 8-25: 20-35: 15-30: 2-5.

[0009] Preferably, the aqueous resin has the minimum film-forming temperature of not less than 25°C.

[0010] Preferably, the aqueous resin has the minimum film-forming temperature of 25°C to 45°C.

[0011] Preferably, the film-forming aid has a boiling point between 200°C and 400°C; and the film-forming aid has the following volatilization rate: (1) based on the volatilization rate of butyl acetate being 100, the film-forming aid has a relative volatilization rate between 0.005 and 5; or (2) the volatilization rate of the film-forming aid at 100°C is between 0.1 and 1.0 g / 1000 cm 2 / h.

[0012] Preferably, the hydrated silicon dioxide is prepared by a sol-gel method and is anionic particles; wherein the anionic particles have a particle size between 30.1 and 100 m 2 / g specific surface area.

[0013] Preferably, the water-based thermal insulation coating further includes: inorganic powder, which is selected from at least one of the material group consisting of titanium dioxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, calcium phosphate, calcium sulfate, aluminum oxide, zirconium dioxide, zinc oxide, talc, kaolin, muscovite, expanded perlite, and inorganic pigments.

[0014] Preferably, based on the total weight of the water-based thermal insulation coating being 100wt%, the content of the water-based resin is between 55wt% and 85wt%, the content of the film-forming aid is between 2wt% and 20wt%, and the content of the thermal insulation agent is between 1wt% and 10wt%.

[0015] The beneficial effect of the present invention is that the water-based thermal insulation coating provided by the present invention has the technical effect of reducing carbon emissions, can replace traditional solvent-based coatings, and can have a heat insulation function. In addition, the water-based thermal insulation coating provided by the present invention is particularly suitable for high-temperature drying processes. The present invention uses water-based resins and film-forming aids to replace traditional solvent-based coatings that were originally not suitable for high-temperature drying processes without changing process equipment and process conditions. DETAILED DESCRIPTION

[0016] The following is an explanation of the embodiments disclosed in the present invention through specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0017] It should be understood that although the terms "first", "second", "third", etc. may be used in this article to describe various materials or parameters, these materials or parameters should not be limited by these terms. These terms are mainly used to distinguish one material from another material, or one parameter from another parameter.

[0018] [Water-based thermal insulation coating]

[0019] The embodiment of the present invention provides a water-based thermal insulation coating, and the water-based thermal insulation coating can replace the traditional solvent-based coating without changing the existing process equipment and process conditions. The water-based thermal insulation coating comprises: a water-based resin, a film forming aid, a heat insulating agent, and inorganic powders.

[0020] <Water-based resin>

[0021] The water-based resin may be, for example, at least one selected from a material group consisting of acrylic resin, polyurethane resin, and epoxy resin.

[0022] Furthermore, the water-based resin preferably has a minimum film forming temperature (MFFT). The minimum film forming temperature is not less than 5°C, preferably not less than 25°C, and particularly preferably between 25°C and 45°C.

[0023] It should be noted that the minimum film forming temperature (MFFT) referred to in the present embodiment is the minimum temperature at which the resin is uniformly agglomerated when the resin is coated on the substrate. In this embodiment, the minimum film forming temperature is measured using the ISO 2115 test method.

[0024] In some embodiments of the present invention, the water-based resin is an acrylic resin, and the minimum film forming temperature (MFFT) of the water-based resin can be adjusted by adjusting the formula of the monomers. For example, the water-based resin is formed by emulsion polymerization of a water-based resin composition. The water-based resin composition comprises: water, a mixed monomer, and an emulsifier. The mixed monomer further comprises: a first monomer, a second monomer, a third monomer, and a fourth monomer.

[0025] Wherein, the first monomer is an acrylic monomer, the second monomer is an alkyl-containing methacrylate monomer, the third monomer is a styryl-containing monomer, and the fourth monomer is a carboxyl-containing monomer.

[0026] In a specific embodiment of the present invention, the first monomer is butyl acrylate (BA), the second monomer is methyl (meth)acrylate (MMA), the third monomer is styrene monomer (SM), and the fourth monomer is methacrylic acid (MAA).

[0027] Furthermore, the emulsifier may be, for example, at least one selected from the group consisting of reactive emulsifiers, anionic emulsifiers, and cationic emulsifiers. Preferably, the emulsifier is a reactive emulsifier (eg, SR-10), but the present invention is not limited thereto.

[0028] In terms of the dosage range, the weight ratio of water: first monomer (acrylate monomer, such as BA): second monomer (alkyl-containing methacrylate monomer, such as MMA): third monomer (styrene-containing monomer, such as SM): fourth monomer (carboxyl-containing monomer, such as MAA): emulsifier can be, for example, 110-150 (water): 20-50 (first monomer): 5-30 (second monomer): 15-40 (third monomer): 10-35 (fourth monomer): 1-5 (emulsifier). Preferably, the weight ratio can be, for example, 120-140 (water): 30-45 (first monomer): 8-25 (second monomer): 20-35 (third monomer): 15-30 (fourth monomer): 2-5 (emulsifier). Particularly preferably, the weight ratio may be, for example, 125-135 (water): 33-40 (first monomer): 10-20 (second monomer): 25-30 (third monomer): 20-25 (fourth monomer): 3-5 (emulsifier).

[0029] According to the above configuration, the aqueous resin has a minimum film-forming temperature of not less than 5°C, preferably not less than 25°C, and particularly preferably between 25°C and 45°C.

[0030] It is worth mentioning that in the above-mentioned mixed monomers, the first monomer (acrylic ester monomer) is a monomer that provides the polymer with a low glass transition temperature (low Tg) characteristic, which can make the resin coating have excellent adhesion (closeness). The second monomer ((meth)acrylic ester monomer) is a monomer that provides the polymer with a high glass transition temperature (high Tg) characteristic, which can increase the minimum film-forming temperature of the water-based resin. The third monomer (styrene-containing monomer) is a hydrophobic monomer, which has a polarity difference with water molecules, and can make the resin coating have excellent water-immersion scratch resistance.

[0031] The molecular chain of the fourth monomer (carboxyl-containing monomer) carries a negative charge after dissociation in an aqueous environment, which can be combined with the positive charge of the inorganic powder (such as TiO2), so that the inorganic powder can be dispersed and stabilized in the resin coating, so that the resin coating has excellent scratch resistance and is not easy to fall off. In addition, the molecular structure of the fourth monomer has a carboxyl group. The carboxyl group of the fourth monomer can react with the water-based resin crosslinking agent (bridging agent) to enable the resin coating to form a network structure, thereby improving the mechanical strength of the resin coating.

[0032] In addition, it is worth mentioning that the minimum film-forming temperature of the water-based resin is controlled within the above range so that the water-based thermal insulation coating will not be formed too early in the high-temperature drying process. The water and additives in the water-based thermal insulation coating can still escape at high temperatures to make the surface of the resin coating smooth, thereby effectively improving the problems of pinholes, bubbles, cracks, and poor adhesion on the coating surface in the prior art.

[0033] <Film-forming aid>

[0034] The film-forming aid can help improve the film-forming property of the water-based thermal insulation coating, and can help prevent cracking and breakage of the water-based thermal insulation coating when the coating is drying.

[0035] In some embodiments of the present invention, the film-forming aid is at least one selected from the group consisting of a plasticizer, an alcohol ether solvent, an alcohol ester solvent, a mixed solvent of ethylene glycol monobutyl ether and dipropylene glycol butyl ether, and an aprotic solvent.

[0036] It is worth mentioning that the film-forming aid has a boiling point between 200°C and 400°C, and preferably between 225°C and 375°C. In addition, based on the evaporation rate of butyl acetate being 100, the film-forming aid has a relative evaporation rate between 0.005 and 5, and preferably between 0.01 and 3. Alternatively, the evaporation rate of the film-forming aid at 100°C is between 0.1 and 1.0 g / 1000 cm 2 / h, and preferably between 0.5 and 0.8 g / 1000 cm 2 / h.

[0037] For example, the film-forming aid may be 2,2,4-trimethyl-1,3-pentanediol diisobutyrate (TXIB) TM ), which is a plasticizer, has a boiling point of 281°C and a carbonyl group-containing compound of 0.674 (g / 1000cm at 100°C. 2 ) / h volatilization rate.

[0038] In one embodiment, the film-forming aid may be dioctylterephthalate (DOTP), which is a plasticizer having a boiling point of 375° C. and a relative volatility of 0.01 (based on the volatility of butyl acetate being 100).

[0039] In one embodiment, the film-forming aid may be diethylene glycol monohexyl ether (DEGME), which is an alcohol ether solvent having a boiling point of 259° C. and a relative volatility of 1 (based on the volatility of butyl acetate being 100).

[0040] In one embodiment, the film-forming aid may be triethylene glycol monobutyl ether (TEGME), which is an alcohol ether solvent having a boiling point of 275° C. and a relative volatility of 0.06 (based on the volatility of butyl acetate being 100).

[0041] In one embodiment, the film-forming aid may be Texanol TM Alcohol ester, which is an alcohol ester solvent, has a boiling point of 254° C. and a relative volatility of 0.2 (based on the volatility of butyl acetate being 100).

[0042] In one embodiment, the film-forming aid may be Optifilm TM Enhancer 300 (Optifilm TM enhancer 300, OE300), has a boiling point of 281°C and a relative volatility of 0.04 (based on the volatility of butyl acetate being 100).

[0043] In one embodiment, the film-forming aid may be 1,3-dimethyl-2-imidazolidinone (DMI), which is an aprotic solvent with a boiling point of 225° C. and a relative volatility of 3 (based on the volatility of butyl acetate being 100).

[0044] Alternatively, the film-forming aid may be selected from Texanol according to the requirements. TM At least one of ester alcohol, ethylene glycol monobutyl ether (BCS), and di(2-ethylhexyl)terephthalate (DEHT).

[0045] It is worth mentioning that in a preferred embodiment of the present invention, the above-mentioned film-forming aid can be, for example, a composite aid of two or more additives selected at the same time. For example, the film-forming aid can be, for example, a composite aid of TXIB and DOTP selected at the same time; or a composite aid of DEGME and OE300 selected at the same time. In addition, the volume ratio between the two solvents can be, for example, in the range of 30-70:30-70, and preferably 40-60:40-60, but the present invention is not limited thereto.

[0046] In addition, it is worth mentioning that the content of the film-forming aid in the water-based thermal insulation coating is between 2wt% and 20wt%, so that the water-based thermal insulation coating has a better film-forming effect. If the content of the film-forming aid is lower than 2wt%, the water-based thermal insulation coating cannot achieve a film-forming effect. If the content of the film-forming aid is higher than 20wt%, the water-based thermal insulation coating is prone to stratification or gelation.

[0047] Furthermore, the film-forming aid has a relatively high boiling point and a relatively low volatilization rate. Therefore, the film-forming aid will not completely volatilize under the high-temperature drying process and can still escape at high temperatures, making the surface of the resin coating smooth, thereby helping to improve the problems in the prior art that the coating surface is prone to pinholes, bubbles, cracks, and poor adhesion.

[0048] <Heat insulation agent>

[0049] The heat shielding agent is silicon dioxide prepared by a sol-gel method, and is preferably hydrated silica.

[0050] In some embodiments of the present invention, the silicon dioxide prepared by the sol-gel method is anionic particles. The anionic particles have a diameter between 30.1 and 100 m 2 / g specific surface area.

[0051] In addition, the anionic particles can be suspended in a sodium ion solution or an ammonium ion solution, and the pH value of the solution is preferably controlled between pH 9 and pH 10 to maintain the stability of the solution and the dispersibility of the particles.

[0052] According to the above configuration, introducing the thermal insulation agent into the water-based thermal insulation coating can effectively improve the thermal insulation performance of the water-based thermal insulation coating.

[0053] <Inorganic powder>

[0054] The inorganic powder can be, for example, selected from titanium dioxide (TiO2), aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), calcium phosphate (Ca3(PO4)2), calcium sulfate (CaSO4), aluminum oxide (Al2O3), zirconium dioxide (ZrO2), zinc oxide (ZnO), talc (Mg3Si4O 10 (OH)2), kaolin (Al2Si2O5(OH)4), muscovite (MICA), expanded perlite, and other inorganic pigments, at least one of the group of materials.

[0055] In some embodiments of the present invention, a particle size of the inorganic powder is between 0.08 microns and 3 microns, and preferably between 0.1 microns and 0.3 microns. If the particle size of the inorganic powder is too large, the inorganic powder cannot be evenly dispersed by stirring. If the particle size of the inorganic powder is too small, the thixotropy is too high, resulting in uneven stirring.

[0056] <Content Range of Each Component>

[0057] Taking the total weight of the water-based thermal insulation coating as 100wt%, the content of the water-based resin is between 55wt% and 85wt%, preferably between 60wt% and 80wt%, and particularly preferably between 62wt% and 75wt%. The content of the film-forming aid is between 2wt% and 20wt%, preferably between 3wt% and 15wt%, and particularly preferably between 5wt% and 15wt%.

[0058] The content of the heat-insulating agent is between 1wt% and 10wt%, preferably between 2wt% and 8wt%, and particularly preferably between 3wt% and 6wt%. The content of the inorganic powder is between 5wt% and 25wt%, preferably between 10wt% and 20wt%, and particularly preferably between 13wt% and 17wt%.

[0059] The beneficial effect of the present invention is that the water-based thermal insulation coating of the embodiment of the present invention has the technical effect of reducing carbon emissions, can replace traditional solvent-based coatings, and can have a heat insulation function. The water-based thermal insulation coating is particularly suitable for high-temperature drying processes (250°C). The embodiment of the present invention uses water-based resins and film-forming aids to replace traditional solvent-based coatings that were originally not suitable for high-temperature drying processes without changing process equipment and process conditions.

[0060] [Experimental data and test results]

[0061] Hereinafter, the content of the present invention will be described in detail with reference to the following experimental data and test results. However, the following examples are only used to help understand the present invention, and the scope of the present invention is not limited to these examples. Among them, Examples 1 to 3 are groups that can prove the technical effect of the present invention, and Comparative Example 1 is a group with poor test results. Among them, the following first prepares water-based resins with different minimum film forming temperatures MFFT according to Water-based Resin Examples 1 to 3, and uses these resins in Examples 1 to 3 respectively.

[0062] <Water-based resin example 1> Referring to the formula of water-based resin example 1 in Table 1, 130 parts by weight of pure water, 40 parts by weight of butyl acrylate (BA), 10 parts by weight of methyl (meth)acrylate (MMA), 30 parts by weight of styrene (SM), 20 parts by weight of methacrylic acid (MAA), and 4 parts by weight of emulsifier (reactive emulsifier SR-10) were uniformly mixed using a stirrer to form a pre-emulsion; the pre-emulsion was then added to a reaction tank for emulsification reaction, and finally a water-based resin with a minimum film forming temperature MFFT of 25°C was prepared. The definition of the minimum film forming temperature has been described above and will not be repeated here.

[0063] <Aqueous resin example 2> Referring to the formulation of aqueous resin example 2 in Table 1, 130 parts by weight of pure water, 35 parts by weight of butyl acrylate (BA), 20 parts by weight of methyl (meth)acrylate (MMA), 25 parts by weight of styrene (SM), 20 parts by weight of methacrylic acid (MAA), and 4 parts by weight of an emulsifier (reactive emulsifier SR-10) were uniformly mixed using a stirrer to form a pre-emulsion; the pre-emulsion was then added to a reaction tank for emulsification reaction, and finally an aqueous resin having a minimum film forming temperature MFFT of 30°C was prepared.

[0064] <Aqueous resin example 3> Referring to the formulation of aqueous resin example 3 in Table 1, 130 parts by weight of pure water, 33 parts by weight of butyl acrylate (BA), 16 parts by weight of methyl (meth)acrylate (MMA), 26 parts by weight of styrene (SM), 25 parts by weight of methacrylic acid (MAA), and 4 parts by weight of an emulsifier (reactive emulsifier SR-10) were uniformly mixed using a stirrer to form a pre-emulsion; the pre-emulsion was then added to a reaction tank for emulsification reaction, and finally an aqueous resin having a minimum film forming temperature MFFT of 40°C was prepared.

[0065] [Table 1- Water-based resin formula and resin properties]

[0066]

[0067] <Example 1> The water-based resin used in Example 1 is the water-based resin with a minimum film-forming temperature MFFT of 25°C prepared in Example 1 of the water-based resin. Example 1 Referring to the water-based thermal insulation coating formula in Table 2, a water-based thermal insulation coating is prepared, which comprises: 72wt% of water-based resin, 5wt% of film-forming aid, 5wt% of thermal insulation agent, 17wt% of inorganic powder, and 1wt% of other additives (dispersant, cross-linking agent). Then, the water-based thermal insulation coating is applied to a 150μm PET film and a steel plate with a 250μm coating rod, and dried at room temperature for 24 hours to form a water-based thermal insulation coating, and then various physical properties are evaluated.

[0068] <Example 2> The water-based resin used in Example 2 is the water-based resin with a minimum film-forming temperature MFFT of 30°C prepared in Example 2 of the water-based resin. Example 2 Referring to Table 2, the water-based thermal insulation coating formula is prepared to prepare a water-based thermal insulation coating, which comprises: 75wt% of water-based resin, 8wt% of film-forming aid, 3wt% of thermal insulation agent, 13wt% of inorganic powder, and 1wt% of other additives (dispersant, cross-linking agent). Then, the water-based thermal insulation coating is applied to the PET film and the steel plate in the above manner, and the coating is dried and the physical properties are evaluated.

[0069] <Example 3> The water-based resin used in Example 3 is the water-based resin with a minimum film-forming temperature MFFT of 40°C prepared in Example 3 of the water-based resin. Example 3 Referring to the water-based thermal insulation coating formula in Table 2, a water-based thermal insulation coating is prepared, which comprises: 62wt% of water-based resin, 15wt% of film-forming aid, 6wt% of thermal insulation agent, 16wt% of inorganic powder, and 1wt% of other additives (dispersant, cross-linking agent). Then, the water-based thermal insulation coating is applied to the PET film and the steel plate in the above manner, and the coating is evaluated for physical properties after drying.

[0070] <Comparative Example 1> The water-based resin used in Comparative Example 1 is a commercially available acrylic water-based resin (P-60 manufactured by Sankyo Co., Ltd., MFFT is 0°C). Comparative Example 1 refers to the water-based thermal insulation coating formula in Table 2 to prepare the water-based thermal insulation coating. Then, the water-based thermal insulation coating is applied to the PET film and the steel plate in the above manner, and the coating is dried and various physical properties are evaluated.

[0071] The items and test methods for physical property evaluation are described below.

[0072] <Coating Appearance> The coating samples that had been dried at room temperature for 24 hours were observed for appearance to evaluate whether the appearance was smooth or uneven.

[0073] <Appearance after drying at 280°C> Since the water-based heat-insulating coating is applied to industrial products, and the coating is applied on the production line at high temperature and high speed. After the water-based heat-insulating coating is coated on the steel plate and the coated sample is dried at room temperature for 24 hours, it is further placed in an oven and dried at a high temperature of 280°C for 1 minute, and then its appearance is evaluated to see if it is normal or if there are any abnormalities such as blistering, cracking, or peeling.

[0074] <Heat-insulating temperature difference (°C)> According to the standard method of JG / T 235-2014, the heat-insulating temperature difference (°C) of the above-mentioned coated sample dried at 280°C is tested.

[0075] <200g falling ball test> Using a falling ball impact testing machine, a 200-gram steel ball is freely dropped from a predetermined falling height (such as 100 cm) onto the above-mentioned coated sample dried at 280°C to observe whether there is any peeling of the coating film.

[0076] <MEK wiping 100 times> Soak the gauze with MEK (methyl ethyl ketone), and use a friction testing machine to wipe the above-mentioned coated sample dried at 280°C back and forth 100 times, and then observe whether there is any peeling of the coating film.

[0077] [Table 2 - Formulation of water-based heat-insulating coating and test results of the coating]

[0078]

[0079]

[0080] [Discussion on test results]

[0081] It can be known from the above test results that the water-based heat-insulating coatings prepared in Examples 1 to 3 are dried at a high temperature of 280°C for 1 minute, and the surface appearance of the coatings is normal, without any abnormalities such as blistering, cracking, or peeling. When the water-based heat-insulating coatings dried at high temperature are tested for heat-insulating temperature difference, a heat-insulating temperature difference of 8 - 10°C can be obtained. When the above water-based heat-insulating coatings are subjected to the 200g falling ball test, the test results show that the coating films are normal and there is no peeling of the coating film. When the above water-based heat-insulating coatings are wiped 100 times with MEK, the test results show that the coating films are normal and there is no peeling of the coating film. That is to say, the water-based heat-insulating coatings prepared in Examples 1 to 3 can be dried at high temperature and have excellent heat insulation, impact resistance, and solvent resistance. This result shows that using a water-based resin within a specific minimum film-forming temperature range can effectively improve the abnormal appearance state after being made by high-temperature drying and can maintain good physical properties.

[0082] The water-based thermal insulation coating prepared in Comparative Example 1 was dried at a high temperature of 280°C for 1 minute, and the surface of the coating partially bubbled, indicating an abnormal condition. The water-based thermal insulation coating dried at high temperature was subjected to a thermal insulation temperature difference test, and a thermal insulation temperature difference of 5°C was obtained. The thermal insulation effect is worse than that of Examples 1 to 3. The above-mentioned water-based thermal insulation coating was subjected to a 200g drop ball test, and the test result was that the coating film fell off. The above-mentioned water-based thermal insulation coating was wiped with MEK 100 times, and the test results were all that the coating film fell off. In other words, the water-based thermal insulation coating prepared in Comparative Example 1 is not resistant to high-temperature drying, and the results of related physical properties are not ideal.

[0083] [Beneficial Effects of Embodiments]

[0084] The beneficial effect of the present invention is that the water-based thermal insulation coating provided by the embodiment of the present invention has the technical effect of reducing carbon emissions, can replace traditional solvent-based coatings, and can have a thermal insulation function.

[0085] In addition, the water-based thermal insulation coating provided by the embodiment of the present invention is particularly suitable for high-temperature drying process (250°C). The embodiment of the present invention uses water-based resin and film-forming aid to replace the traditional solvent-based coating, which is not suitable for high-temperature drying process, without changing the process equipment and process conditions.

[0086] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification are included in the scope of the present invention.

Claims

1. A water-based thermal insulation coating, characterized in that: The water-based thermal insulation coating comprises: A water-based resin, wherein the water-based resin is selected from at least one of the material group consisting of acrylic resin, polyurethane resin, and epoxy resin, and the water-based resin has a minimum film-forming temperature of not less than 5° C.; A film-forming aid, wherein the film-forming aid is selected from at least one of the material group consisting of a plasticizer, an alcohol ether solvent, an alcohol ester solvent, a mixed solvent of ethylene glycol monobutyl ether and dipropylene glycol butyl ether, and an aprotic solvent; and The heat insulating agent is hydrated silicon dioxide.

2. The water-based thermal insulation coating according to claim 1, characterized in that: The water-based resin is prepared by emulsion polymerization of a water-based resin composition; the water-based resin composition comprises: water, a mixed monomer, and an emulsifier; and the mixed monomer further comprises: a first monomer, a second monomer, a third monomer, and a fourth monomer; wherein the first monomer is an acrylate monomer, the second monomer is an alkyl-containing methacrylate monomer, the third monomer is a styrene-containing monomer, and the fourth monomer is a carboxyl-containing monomer.

3. The water-based thermal insulation coating according to claim 2, characterized in that: The weight ratio of water: the first monomer: the second monomer: the third monomer: the fourth monomer: the emulsifier is between 110-150: 20-50: 5-30: 15-40: 10-35: 1-5.

4. The water-based thermal insulation coating according to claim 3, characterized in that: The weight ratio of water: the first monomer: the second monomer: the third monomer: the fourth monomer: the emulsifier is between 120-140: 30-45: 8-25: 20-35: 15-30: 2-5.

5. The water-based thermal insulation coating according to claim 4, characterized in that: The aqueous resin has the minimum film-forming temperature of not less than 25°C.

6. The water-based thermal insulation coating according to claim 5, characterized in that: The water-based resin has the minimum film-forming temperature between 25°C and 45°C.

7. The water-based thermal insulation coating according to claim 1, characterized in that: The film-forming aid has a boiling point between 200° C. and 400° C.; and the film-forming aid has a volatilization rate as follows: (1) based on the volatilization rate of butyl acetate being 100, the film-forming aid has a relative volatilization rate between 0.005 and 5; or (2) the volatilization rate of the film-forming aid at 100° C. is between 0.1 and 1.0 g / 1000 cm 2 / h.

8. The water-based thermal insulation coating according to claim 1, characterized in that: The hydrated silicon dioxide is prepared by a sol-gel method and is an anionic particle; wherein the anionic particle has a particle size between 30.1 and 100 m 2 / g specific surface area.

9. The water-based thermal insulation coating according to claim 1, characterized in that: The water-based thermal insulation coating further includes: inorganic powder, which is selected from at least one of the material group consisting of titanium dioxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, calcium phosphate, calcium sulfate, aluminum oxide, zirconium dioxide, zinc oxide, talc, kaolin, muscovite, expanded perlite, and inorganic pigments.

10. The water-based thermal insulation coating according to any one of claims 1 to 9, characterized in that: Based on the total weight of the water-based thermal insulation coating being 100wt%, the content of the water-based resin is between 55wt% and 85wt%, the content of the film-forming aid is between 2wt% and 20wt%, and the content of the thermal insulation agent is between 1wt% and 10wt%.

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