Electroplating process for electronic product

By using overall gold plating and etching processes, the problem of gold peeling during the gold plating process on both sides of electronic components was solved, and the adhesion was improved.

CN119265650APending Publication Date: 2025-01-07CHANGDE KUNTENG ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202411743235.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-01-07

AI Technical Summary

Technical Problem

During the gold plating process on both sides of electronic components in mobile phones and computers, prolonged immersion of the plating area on the reverse side in the plating solution can cause the gold to peel off, resulting in poor adhesion.

Method used

The process involves overall gold plating of both thick and thin layers, and etching of the thin gold layer on the substrate surface using an etching solution to leave the gold plating layer at the required location.

Benefits of technology

By using thick and thin overall gold plating and etching processes, the problem of gold peeling was solved, and the adhesion between the gold plating on the front and back sides was improved.

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Abstract

The invention belongs to the technical field of material treatment, and particularly relates to an electronic product electroplating process which comprises the following steps: step 1, cleaning with an alkali cleaning solution, and activating the surface with 8% dilute sulphuric acid; 2, the product is subjected to overall gold plating, and the ratio of the thickness of a gold-plated layer at the position needing gold plating to the thickness of a gold-plated layer at the position not needing gold plating is 1.5: 1-2: 1; and step 3, etching the thin gold layer on the surface of the substrate by using the etchant. Compared with the prior art, the method provided by the invention has the following advantages: the thin gold layer on the surface of the substrate is etched by using the etchant by using a thickness integral gold plating mode, and a gold plating layer at a required position is left.
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Description

Technical Field

[0001] The invention belongs to the technical field of material processing, and in particular relates to an electroplating process for electronic products. Background Art

[0002] Some electronic components in mobile phones and computers use gold plating technology. The front and back sides of the product need to be gold-plated at different positions. The general gold plating process is to perform spot plating on the front and back sides in turn. However, the problem here is that after the front plating area is electroplated, the back plating area is always immersed in the plating solution, which will produce displacement gold. If the back side continues to be spot-plated, gold peeling will occur, resulting in poor bonding problems. Summary of the invention

[0003] In view of the above-mentioned technical problems, the purpose of the present invention is to solve the technical problems of gold peeling and poor bonding force in gold plating on both sides.

[0004] The technical solution of the present invention is achieved as follows: an electronic product electroplating process comprises the following steps: Step 1: Clean with an alkaline cleaning solution and activate the surface with 8% dilute sulfuric acid.

[0005] Step 2: Gold-plate the entire product. The ratio of the thickness of the gold-plated layer where gold-plating is required to the thickness of the gold-plated layer where gold-plating is not required is 1.5:1-2:1. Step 3: Etch the thin gold layer on the surface of the substrate using an etching solution.

[0006] Compared with the prior art, the present invention has the following advantages: the method of overall thick and thin gold plating is used, and then the thin gold layer on the surface of the substrate is etched by etching liquid to leave the gold plating layer at the required position. DETAILED DESCRIPTION Embodiment 1

[0007] An electronic product electroplating process comprises the following steps: Step 1: Clean with an alkaline cleaning solution and activate the surface with 8% dilute sulfuric acid.

[0008] Step 2: Gold-plate the entire product. The ratio of the thickness of the gold-plated layer where gold-plating is required to the thickness of the gold-plated layer where gold-plating is not required is 1.5:1. Step 3: Etch the thin gold layer on the surface of the substrate using an etching solution. Embodiment 2

[0009] An electronic product electroplating process comprises the following steps: Step 1: Clean with an alkaline cleaning solution and activate the surface with 8% dilute sulfuric acid.

[0010] Step 2: Gold-plate the entire product. The ratio of the thickness of the gold-plated layer in the areas that need to be gold-plated to the thickness of the gold-plated layer in the areas that do not need to be gold-plated is 2:1. Step 3: Etch the thin gold layer on the surface of the substrate using an etching solution. Embodiment 3

[0011] An electronic product electroplating process comprises the following steps: Step 1: Clean with an alkaline cleaning solution and activate the surface with 8% dilute sulfuric acid.

[0012] Step 2: Gold-plate the entire product. The ratio of the thickness of the gold-plated layer where gold-plating is required to the thickness of the gold-plated layer where gold-plating is not required is 1.8:1. Step 3: Etch the thin gold layer on the surface of the substrate using an etching solution. Embodiment 4

[0013] An electronic product electroplating process comprises the following steps: Step 1: Clean with an alkaline cleaning solution and activate the surface with 8% dilute sulfuric acid.

[0014] Step 2: Gold-plate the entire product. The ratio of the thickness of the gold-plated layer where gold-plating is required to the thickness of the gold-plated layer where gold-plating is not required is 1.9:1. Step 3: Etch the thin gold layer on the surface of the substrate using an etching solution.

Claims

1. An electronic product electroplating process, characterized in that: The steps include: Step 1: Clean with an alkaline cleaning solution and activate the surface with 8% dilute sulfuric acid; Step 2: Gold-plate the entire product. The ratio of the thickness of the gold-plated layer where gold-plating is required to the thickness of the gold-plated layer where gold-plating is not required is 1.5:1-2:

1. Step 3: Etch the thin gold layer on the surface of the substrate using an etching solution.

2. The electronic product electroplating process according to claim 1, characterized in that: The steps include: Step 1: Clean with an alkaline cleaning solution and activate the surface with 8% dilute sulfuric acid; Step 2: Gold-plate the entire product. The ratio of the thickness of the gold-plated layer where gold-plating is required to the thickness of the gold-plated layer where gold-plating is not required is 1.5:

1. Step 3: Etch the thin gold layer on the surface of the substrate using an etching solution.

3. The electronic product electroplating process according to claim 1, characterized in that: The steps include: Step 1: Clean with an alkaline cleaning solution and activate the surface with 8% dilute sulfuric acid; Step 2: Gold-plate the entire product. The ratio of the thickness of the gold-plated layer in the areas that need to be gold-plated to the thickness of the gold-plated layer in the areas that do not need to be gold-plated is 2:

1. Step 3: Etch the thin gold layer on the surface of the substrate using an etching solution.

4. The electronic product electroplating process according to claim 1, characterized in that: The steps include: Step 1: Clean with an alkaline cleaning solution and activate the surface with 8% dilute sulfuric acid; Step 2: Gold-plate the entire product. The ratio of the thickness of the gold-plated layer where gold-plating is required to the thickness of the gold-plated layer where gold-plating is not required is 1.8:

1. Step 3: Etch the thin gold layer on the surface of the substrate using an etching solution.

5. The electronic product electroplating process according to claim 1, characterized in that: The steps include: Step 1: Clean with an alkaline cleaning solution and activate the surface with 8% dilute sulfuric acid; Step 2: Gold-plate the entire product. The ratio of the thickness of the gold-plated layer where gold-plating is required to the thickness of the gold-plated layer where gold-plating is not required is 1.9:

1. Step 3: Etch the thin gold layer on the surface of the substrate using an etching solution.