Sensor circuit and seed counter

Abstract

The invention provides a sensor circuit and a seed counter, and the sensor circuit comprises an infrared emitting diode which is used for emitting infrared light; the input end of the driving sub-circuit is used for being connected to a first pin of the micro-control unit, and the output end of the driving sub-circuit is connected to one end of the infrared emitting diode; the infrared photoelectric transistor is arranged opposite to the infrared emitting diode so as to sense the infrared light emitted by the infrared emitting diode and generate an output signal; the input end of the signal processing sub-circuit is connected to one end of the infrared photoelectric transistor, the output end of the signal processing sub-circuit is used for being connected to a second pin of the micro-control unit, and the signal processing sub-circuit is used for processing an output signal generated by the infrared photoelectric transistor and transmitting the output signal to the micro-control unit; wherein the micro-control unit generates a control signal according to the output signal processed by the signal processing sub-circuit, so as to adjust the luminous intensity of the infrared emitting diode through the driving sub-circuit.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to a sensor circuit and a seed counter. Background Art

[0002] In precision seeding operations, the application of seed sensors enables real-time monitoring of the seeding process, creating a more refined agricultural management strategy tailored for farmers. This technology allows farmers to accurately grasp the growth dynamics of crops, effectively avoid yield losses caused by missed seeding, ensure the maximum utilization of agricultural resources, and significantly improve the yield and quality of crops.

[0003] However, the seed sensor signal acquisition circuits currently on the market are sensitive to dust interference in the external environment and are usually unable to effectively compensate for interference from subtle factors such as dust. Summary of the invention

[0004] In view of this, an object of the present application is to provide a sensor circuit and a seed counter to overcome at least one of the above-mentioned defects.

[0005] In a first aspect, the present application provides a sensor circuit, which includes: an infrared emitting diode for emitting infrared light; a driving subcircuit, wherein the input end of the driving subcircuit is used to be connected to a first pin of a microcontroller unit, and the output end of the driving subcircuit is connected to one end of the infrared emitting diode; an infrared phototransistor, which is arranged opposite to the infrared emitting diode to sense the infrared light emitted by the infrared emitting diode and generate an output signal; a signal processing subcircuit, wherein the input end of the signal processing subcircuit is connected to one end of the infrared phototransistor, and the output end of the signal processing subcircuit is used to be connected to a second pin of the microcontroller unit, and is used to process the output signal generated by the infrared phototransistor and transmit it to the microcontroller unit; wherein the microcontroller unit generates a control signal based on the output signal processed by the signal processing subcircuit, so as to adjust the luminous intensity of the infrared emitting diode via the driving subcircuit.

[0006] In a possible implementation, the driving subcircuit includes: a first operational amplifier, the in-phase input terminal of the first operational amplifier is used as the input terminal of the driving subcircuit to be connected to the first pin of the microcontroller unit; a transistor, the base of the transistor is connected to the output terminal of the first operational amplifier, the collector of the transistor is connected to one end of the infrared emitting diode as the output terminal of the driving subcircuit, the other end of the infrared emitting diode is connected to a first power supply, and the emitter of the transistor is grounded and connected to the reverse input terminal of the first operational amplifier.

[0007] In a possible implementation, the driving subcircuit further includes: a first resistor, arranged between the first pin of the microcontroller unit and the in-phase input terminal of the first operational amplifier; a second resistor, one end of the second resistor is connected between the first resistor and the non-inverting input terminal of the first operational amplifier, and the other end of the second resistor is grounded; and a first capacitor is arranged in parallel with the second resistor.

[0008] In a possible implementation, the driving subcircuit further includes: a third resistor, one end of the third resistor is connected to the emitter of the transistor, and the other end of the third resistor is grounded; a second capacitor, one end of the second capacitor is connected to the second power supply, and the other end of the second capacitor is grounded; wherein the positive power supply terminal of the first operational amplifier is connected to the second power supply, and the negative power supply terminal of the first operational amplifier is grounded.

[0009] In a possible implementation manner, the infrared phototransistor includes a plurality of infrared phototransistors, and one end of each infrared phototransistor is connected in parallel to an input end of the signal processing subcircuit.

[0010] In a possible implementation, the signal processing subcircuit includes: a common-phase input unit, wherein the input end of the common-phase input unit is connected to one end of each infrared phototransistor as the input end of the signal processing subcircuit; a second operational amplifier, wherein the common-phase input end of the second operational amplifier is connected to the output end of the common-phase input unit, and the output end of the second operational amplifier is used as the output end of the signal processing subcircuit for connecting to the second pin of the microcontroller unit; and an inverting input unit, wherein one end of the inverting input unit is connected to the inverting input end of the second operational amplifier, and the other end of the inverting input unit is connected to the output end of the second operational amplifier.

[0011] In a possible implementation, the in-phase input unit includes: a fourth resistor, one end of the fourth resistor being connected to one end of each infrared phototransistor as the input end of the in-phase input unit, and the other end of the fourth resistor being connected to the in-phase input end of the second operational amplifier as the output end of the in-phase input unit; a third capacitor, one end of the third capacitor being connected to one end of the fourth resistor, and the other end of the third capacitor being grounded; a fifth resistor, one end of the fifth resistor being connected to the other end of the fourth resistor, and the other end of the fifth resistor being grounded; and a fourth capacitor, one end of the fourth capacitor being connected to the in-phase input end of the second operational amplifier, and the other end of the fourth capacitor being grounded.

[0012] In a possible implementation, the inverting input unit includes: a sixth resistor, one end of the sixth resistor being connected to the inverting input terminal of the second operational amplifier as one end of the inverting input unit, and the other end of the sixth resistor being connected to the output terminal of the second operational amplifier as the other end of the inverting input unit; a seventh resistor, the seventh resistor being arranged between the inverting input terminal of the second operational amplifier and ground; a fifth capacitor being arranged in parallel with the sixth resistor; and a sixth capacitor, one end of the sixth capacitor being connected to the positive power supply terminal of the second operational amplifier, the positive power supply terminal of the second operational amplifier being connected to the first power supply, the negative power supply terminal of the second operational amplifier being grounded, and the other end of the sixth capacitor being grounded.

[0013] In a possible implementation, the signal processing subcircuit also includes: an eighth resistor, one end of the eighth resistor is connected to the other end of the sixth resistor, and the other end of the eighth resistor is used to connect to the second pin of the micro control unit; a seventh capacitor, one end of the seventh capacitor is connected between the other end of the eighth resistor and the second pin, and the other end of the seventh capacitor is grounded.

[0014] In a second aspect, the present application provides a seed counter, which includes: an infrared emitting diode, which is arranged on one side of the inner wall of the seed guide tube and is used to emit infrared light; an infrared phototransistor, which is arranged on the other side of the inner wall of the seed guide tube and is opposite to the infrared emitting diode, and is used to sense the infrared light emitted by the infrared emitting diode and generate an output signal; a processor, the processor including a driving subcircuit, a signal processing subcircuit and a microcontroller unit, wherein the driving subcircuit is arranged between the first pin of the microcontroller unit and the infrared emitting diode, the signal processing subcircuit is arranged between the infrared phototransistor and the second pin of the microcontroller unit, and the microcontroller unit identifies the seed signal and the dust signal according to the output signal processed by the signal processing subcircuit, so as to count the seeds transported in the seed guide tube according to the seed signal, and generate a control signal according to the dust signal, so as to adjust the luminous intensity of the infrared emitting diode via the driving subcircuit.

[0015] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of the structure of a sensor circuit provided in an embodiment of the present application;

[0018] Figure 2 A schematic diagram of the structure of a driving sub-circuit provided in an embodiment of the present application;

[0019] Figure 3 A schematic diagram of the structure of the signal processing sub-circuit provided in an embodiment of the present application. DETAILED DESCRIPTION

[0020] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application usually described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, each other embodiment obtained by those skilled in the art without making creative work belongs to the scope of protection of the present application.

[0021] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0022] In order to enable those skilled in the art to use the contents of this application, the following implementation is given in combination with the specific application scenario "sensor". For those skilled in the art, the general principles defined here can be applied to other embodiments and application scenarios without departing from the spirit and scope of this application.

[0023] In precision seeding operations, the application of seed sensors enables real-time monitoring of the seeding process, creating a more refined agricultural management strategy tailored for farmers. This technology not only allows farmers to accurately grasp the growth dynamics of crops, but also responds quickly and flexibly adjusts management plans, effectively avoiding yield losses caused by missed seeding, ensuring the maximum utilization of agricultural resources, and significantly improving the yield and quality of crops.

[0024] However, the seed sensor signal acquisition circuits currently on the market face two major challenges: first, their designs mostly focus on counting large-grain seeds, such as corn, and there is still a lack of mature market-based hardware solutions for the accurate counting of small-grain seeds; second, the signal acquisition circuits are highly sensitive to noise interference in the external environment, especially subtle factors such as dust, which often leads to deviations in the counting results, affecting the accuracy and reliability of the data.

[0025] Based on this, the embodiments of the present application provide a sensor circuit and a seed counter, which are intended to improve the sensitivity to tiny signals, improve the anti-interference ability to dust, and amplify tiny seed drop signals.

[0026] See also Figure 1 , Figure 1 This is a schematic diagram of the structure of a sensor circuit provided in an embodiment of the present application. The sensor circuit comprises: an infrared emitting diode LED1, a driving subcircuit, an infrared phototransistor and a signal processing subcircuit.

[0027] In an embodiment of the present application, the infrared emitting diode LED1 is used to emit infrared light, the input end of the driving subcircuit is used to connect to the first pin DAC (digital-to-analog converter) of the microcontroller unit, and the output end of the driving subcircuit is connected to one end of the infrared emitting diode.

[0028] The infrared phototransistor is arranged opposite to the infrared emitting diode LED1 to sense the infrared light emitted by the infrared emitting diode LED1 and generate an output signal.

[0029] The input end of the signal processing subcircuit is connected to one end of the infrared phototransistor, and the output end of the signal processing subcircuit is used to connect to the second pin ADC (analog-to-digital converter) of the microcontroller unit to process the output signal generated by the infrared phototransistor and transmit it to the microcontroller unit.

[0030] The micro control unit generates a control signal according to the output signal processed by the signal processing sub-circuit, so as to adjust the light intensity of the infrared emitting diode LED1 via the driving sub-circuit.

[0031] In an embodiment of the present application, the infrared phototransistor includes a plurality of infrared phototransistors, one end of each infrared phototransistor is connected in parallel to the input end of the signal processing subcircuit. After the plurality of infrared phototransistors are connected in parallel, the weak currents generated by each of them will be added together, thereby enhancing the strength of the overall output signal. This makes it easier for the subsequent signal processing subcircuit to identify and process these signals.

[0032] In addition, a constant current source circuit can be added to the driving sub-circuit to provide a stable current to the infrared emitting diode LED1. The luminous intensity of the infrared emitting diode LED1 is closely related to the current passing through it. By using a constant current source, it can be ensured that the infrared emitting diode LED1 can obtain a stable current under different working conditions, and the impact of power supply voltage fluctuations or load changes on the luminous intensity of the infrared emitting diode LED1 can also be reduced.

[0033] See also Figure 2 , Figure 2 This is a schematic diagram of the structure of a driving sub-circuit provided in an embodiment of the present application, wherein the driving sub-circuit includes: a first operational amplifier U1 and a transistor Q1.

[0034] Specifically, the non-inverting input terminal of the first operational amplifier U1 is used as the input terminal of the driving sub-circuit to be connected to the first pin DAC of the micro control unit. The base of the transistor Q1 is connected to the output terminal of the first operational amplifier U1, the collector of the transistor Q1 is connected to one end of the infrared emitting diode LED1 as the output terminal of the driving sub-circuit, the other end of the infrared emitting diode LED1 is connected to the first power supply of 5V, and the emitter of the transistor Q1 is grounded and connected to the reverse input terminal of the first operational amplifier U1.

[0035] In a preferred example, the driving sub-circuit further includes: a first resistor R1, a second resistor R2, a third resistor R3, a first capacitor C1 and a second capacitor C2.

[0036] In one possible implementation, a first resistor R1 is arranged between a first pin DAC of a microcontroller unit and a non-inverting input terminal of a first operational amplifier U1, one end of a second resistor R2 is connected between the first resistor R1 and a non-inverting input terminal of the first operational amplifier U1, the other end of the second resistor R2 is grounded, a first capacitor C1 is arranged in parallel with the second resistor R2, one end of a third resistor R3 is connected to an emitter of a transistor Q1, and the other end is grounded, one end of a second capacitor C2 is connected to a second power supply of 3.3V, and the other end is grounded, wherein the positive power supply terminal of the first operational amplifier U1 is connected to a second power supply of 3.3V, and the negative power supply terminal of the first operational amplifier U1 is grounded.

[0037] Specifically, the analog voltage signal output by the DAC is first input to the non-inverting input terminal of the first operational amplifier U1. At the input terminal of the first operational amplifier U1, the voltage signal of the first pin DAC is transmitted to the input terminal of the first operational amplifier U1 through the first resistor R1, and the second resistor R2, the first capacitor C1 and other components play a role in filtering and stabilizing the input signal, reducing the noise and fluctuation of the signal. Among them, the first capacitor C1 can smooth the transient changes in the input signal through the charging and discharging effect, and the second resistor R2 limits the size of the input current, protecting the first operational amplifier U1 from the impact of excessive current.

[0038] The emitter of the transistor Q1 and one end of the third resistor R3 are connected to the inverting input terminal of the first operational amplifier U1. The inverting input terminal is connected to the output terminal through a feedback network (composed of the third resistor R3 and the transistor Q1), forming a negative feedback structure of the first operational amplifier U1. When the voltage signal input by the first pin DAC changes, the first operational amplifier U1 will adjust the voltage output to the base of the transistor Q1 according to the voltage difference between the in-phase and inverting input terminals, thereby controlling the collector current of the transistor Q1, and further affecting the current flowing through the infrared emitting diode LED1.

[0039] In the embodiment of the present application, the transistor Q1 is an NPN transistor, which is used here as a switch or current regulator. Its collector is connected to the cathode of the infrared emitting diode LED1, and the anode of the infrared emitting diode LED1 is connected to a 5V regulated power supply. When the transistor Q1 is turned on, the transistor Q1 allows currents of different sizes to flow through the infrared emitting diode LED1 according to the base voltage, thereby changing the luminous intensity of the infrared emitting diode LED1. This change in luminous intensity is indirectly controlled by the microcontroller unit through the output voltage of the first pin DAC to achieve regulation of the infrared light.

[0040] The second capacitor C2 is connected between the power input terminal of the first operational amplifier U1 and the ground. Its main function is to stabilize the power supply voltage of the first operational amplifier U1, filter out high-frequency noise and ripple in the power supply, and ensure that the first operational amplifier U1 can work stably.

[0041] See also Figure 3 , Figure 3 This is a schematic diagram of the structure of a signal processing subcircuit provided in an embodiment of the present application, wherein the signal processing subcircuit includes: a non-inverting input unit, a second operational amplifier U2 and an inverting input unit.

[0042] In an embodiment of the present application, the input end of the in-phase input unit is connected to one end of each infrared phototransistor as the input end of the signal processing sub-circuit, the in-phase input end of the second operational amplifier U2 is connected to the output end of the in-phase input unit, the output end of the second operational amplifier U2 is used as the output end of the signal processing sub-circuit for connecting to the second pin ADC of the microcontroller unit, one end of the inverting input unit is connected to the inverting input end of the second operational amplifier U2, and the other end of the inverting input unit is connected to the output end of the second operational amplifier U2.

[0043] In a preferred example, the in-phase input unit includes: a fourth resistor R4, a fifth resistor R5, a third capacitor C3 and a fourth capacitor C4.

[0044] In a possible implementation, one end of the fourth resistor R4 is connected to one end of each infrared phototransistor as the input end of the in-phase input unit, the other end of the fourth resistor R4 is connected to the in-phase input end of the second operational amplifier U2 as the output end of the in-phase input unit, one end of the third capacitor C5 is connected to one end of the fourth resistor R4, the other end of the third capacitor C3 is grounded, one end of the fifth resistor R5 is connected to the other end of the fourth resistor R4, the other end of the fifth resistor R5 is grounded, one end of the fourth capacitor C4 is connected to the in-phase input end of the second operational amplifier U2, and the other end of the fourth capacitor C4 is grounded.

[0045] Specifically, after multiple infrared phototransistors are connected in parallel, one end thereof is grounded, and the other end is connected to one end of a fourth resistor R4 and one end of a grounded third capacitor C3. The fourth resistor R4 and the third capacitor C3 together form an RC filtering network to filter out noise and interference in the signal, and convert the filtered optical signal into an electrical signal, which is transmitted to the second operational amplifier U2. The other end of the fourth resistor R4 is further connected to one end of a fifth resistor R5, one end of a fourth capacitor C4, and the in-phase input end of the second operational amplifier U2. The inverting input end of the second operational amplifier U2 is connected to a reverse input unit and outputs the amplified signal to the second pin ADC of the micro control unit for further signal processing and counting.

[0046] In a preferred example, the inverting input unit includes: a sixth resistor R6, a seventh resistor R7, a fifth capacitor C5 and a sixth capacitor C6.

[0047] In a possible implementation, one end of the sixth resistor R6 is connected to the inverting input terminal of the second operational amplifier U2 as one end of the inverting input unit, the other end of the sixth resistor R6 is connected to the output terminal of the second operational amplifier U2 as the other end of the inverting input unit, the seventh resistor R7 is arranged between the inverting input terminal of the second operational amplifier U2 and the ground, the fifth capacitor C5 is arranged in parallel with the sixth resistor R6, one end of the sixth capacitor C4 is connected to the positive power supply terminal of the second operational amplifier U2, the positive power supply terminal of the second operational amplifier U2 is connected to the first power supply of 5V, the negative power supply terminal of the second operational amplifier U2 is grounded, and the other end of the sixth capacitor C6 is grounded.

[0048] Specifically, one end of the seventh resistor R7 is connected to the inverting input terminal of U2, and the other end is connected in series with the sixth resistor R6 and the fifth capacitor C5. The sixth resistor R6 and the fifth capacitor C5 are connected in parallel to the output terminal of U2, and this combination forms a basic RC low-pass filter for filtering high-frequency noise and improving signal stability and clarity. At the same time, the sixth capacitor C6 is connected between the power pin of U2 and the ground as a decoupling capacitor to stabilize the first power supply voltage and reduce the influence of power supply noise on signal processing.

[0049] In a preferred example, the signal input subcircuit further includes: an eighth resistor R8 and a seventh capacitor C7.

[0050] In a possible implementation, one end of the eighth resistor R7 is connected to the other end of the sixth resistor R6, the other end of the eighth resistor R8 is used to connect to the second pin ADC of the micro control unit, one end of the seventh capacitor C7 is connected between the other end of the eighth resistor R8 and the second pin ADC, and the other end of the seventh capacitor C7 is grounded.

[0051] Specifically, one end of the eighth resistor R8 is connected to the output end of the second operational amplifier U2, and the other end is connected to the second pin ADC of the micro control unit. It is also connected to one end of the seventh capacitor C7, and the other end of the seventh capacitor C7 is grounded. This connection method forms a simple RC network, which bypasses high-frequency noise through the seventh capacitor C7, thereby ensuring the quality of the signal.

[0052] This embodiment further provides a seed counter, which includes:

[0053] The infrared emitting diode is arranged on one side of the inner wall of the seed guide tube and is used for emitting infrared light.

[0054] The infrared phototransistor is arranged on the other side of the inner wall of the seed guide tube and is opposite to the infrared emitting diode. It is used for sensing the infrared light emitted by the infrared emitting diode and generating an output signal.

[0055] Specifically, the infrared phototransistor is installed on the other side of the inner wall of the seed guide tube, opposite to the infrared emitting diode. When infrared light shines on the phototransistor, it triggers the photoelectric effect inside it, thereby generating an electrical signal, namely the output signal. The output signal is related to the intensity of the received infrared light.

[0056] The processor includes a driving subcircuit, a signal processing subcircuit and a microcontroller unit, wherein the driving subcircuit is arranged between a first pin DAC of the microcontroller unit and an infrared emitting diode, the signal processing subcircuit is arranged between an infrared phototransistor and a second pin ADC of the microcontroller unit, and the microcontroller unit identifies a seed signal and a dust signal according to an output signal processed by the signal processing subcircuit, so as to count seeds transported in a seed guide tube according to the seed signal, and to generate a control signal according to the dust signal, so as to adjust the luminous intensity of the infrared emitting diode via the driving subcircuit.

[0057] Specifically, the driving subcircuit is connected between the first pin DAC of the microcontroller unit and the infrared emitting diode, and is responsible for adjusting the luminous intensity of the infrared emitting diode according to the control signal of the microcontroller unit, so as to maintain the best detection effect under different environmental conditions (such as changes in seed density, dust accumulation, etc.).

[0058] The signal processing subcircuit receives the output signal from the infrared phototransistor and performs pre-processing such as amplification and filtering. The processed signal is sent to the second pin ADC of the microcontroller unit.

[0059] The microcontroller unit receives the processed signal and identifies the seed signal and the dust signal according to the characteristics of the signal. For example, the seed signal usually appears as a large, regular pulse, while the dust signal appears as a small, irregular pulse or noise. For the seed signal, the microcontroller unit counts to count the number of seeds passing through the seed guide tube. For the dust signal, the microcontroller unit generates a control signal and adjusts the luminous intensity of the infrared emitting diode through the driver subcircuit, which helps to reduce the impact of dust on the detection accuracy, for example, by increasing the luminous intensity to penetrate a light dust layer, or reducing the luminous intensity to prevent misjudgment caused by excessive light.

[0060] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0061] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the above-mentioned embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-mentioned embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A sensor circuit, characterized in that: The sensor circuit comprises: Infrared emitting diode, used for emitting infrared light; A driving subcircuit, wherein the input end of the driving subcircuit is used to be connected to the first pin of the micro control unit, and the output end of the driving subcircuit is connected to one end of the infrared emitting diode; an infrared phototransistor, arranged opposite to the infrared emitting diode, to sense the infrared light emitted by the infrared emitting diode and generate an output signal; A signal processing subcircuit, wherein the input end of the signal processing subcircuit is connected to one end of the infrared phototransistor, and the output end of the signal processing subcircuit is used to be connected to the second pin of the micro control unit, and is used to process the output signal generated by the infrared phototransistor and transmit it to the micro control unit; Wherein, the micro control unit generates a control signal according to the output signal processed by the signal processing sub-circuit, so as to adjust the light emission intensity of the infrared emitting diode via the driving sub-circuit.

2. The sensor circuit according to claim 1, characterized in that: The driving subcircuit comprises: A first operational amplifier, wherein a non-inverting input terminal of the first operational amplifier is used as an input terminal of the driving sub-circuit for connecting to a first pin of the micro control unit; A transistor, the base of the transistor is connected to the output end of the first operational amplifier, the collector of the transistor is connected to one end of the infrared emitting diode as the output end of the driving sub-circuit, the other end of the infrared emitting diode is connected to a first power supply, and the emitter of the transistor is grounded and connected to the reverse input end of the first operational amplifier.

3. The sensor circuit according to claim 2, characterized in that: The driving sub-circuit further includes: A first resistor is arranged between the first pin of the micro control unit and the non-inverting input terminal of the first operational amplifier; a second resistor, one end of the second resistor being connected between the first resistor and the non-inverting input terminal of the first operational amplifier, and the other end of the second resistor being grounded; The first capacitor is connected in parallel with the second resistor.

4. The sensor circuit according to claim 3, characterized in that: The driving sub-circuit further includes: a third resistor, one end of the third resistor being connected to the emitter of the transistor, and the other end of the third resistor being grounded; A second capacitor, one end of the second capacitor is connected to a second power supply, and the other end of the second capacitor is grounded; The positive power supply terminal of the first operational amplifier is connected to the second power supply, and the negative power supply terminal of the first operational amplifier is grounded.

5. The sensor circuit according to claim 1, characterized in that: The infrared phototransistor comprises a plurality of infrared phototransistors, and one end of each infrared phototransistor is connected to the input end of the signal processing subcircuit in parallel.

6. The sensor circuit according to claim 5, characterized in that: The signal processing subcircuit comprises: A common-phase input unit, wherein an input end of the common-phase input unit is connected to one end of each infrared phototransistor as an input end of the signal processing subcircuit; A second operational amplifier, wherein a non-inverting input terminal of the second operational amplifier is connected to an output terminal of the non-inverting input unit, and an output terminal of the second operational amplifier is used as an output terminal of the signal processing sub-circuit for connecting to a second pin of the micro control unit; An inverting input unit, one end of which is connected to the inverting input end of the second operational amplifier, and the other end of which is connected to the output end of the second operational amplifier.

7. The sensor circuit according to claim 6, characterized in that: The in-phase input unit comprises: a fourth resistor, one end of the fourth resistor being connected to one end of each infrared phototransistor as an input end of the in-phase input unit, and the other end of the fourth resistor being connected to the in-phase input end of the second operational amplifier as an output end of the in-phase input unit; a third capacitor, one end of the third capacitor being connected to one end of the fourth resistor, and the other end of the third capacitor being grounded; a fifth resistor, one end of the fifth resistor being connected to the other end of the fourth resistor, and the other end of the fifth resistor being grounded; A fourth capacitor, one end of the fourth capacitor is connected to the non-inverting input terminal of the second operational amplifier, and the other end of the fourth capacitor is grounded.

8. The sensor circuit according to claim 7, characterized in that: The inverting input unit comprises: a sixth resistor, one end of the sixth resistor being connected to the inverting input terminal of the second operational amplifier as one end of the inverting input unit, and the other end of the sixth resistor being connected to the output terminal of the second operational amplifier as the other end of the inverting input unit; a seventh resistor, wherein the seventh resistor is arranged between the inverting input terminal of the second operational amplifier and ground; a fifth capacitor, arranged in parallel with the sixth resistor; A sixth capacitor, one end of the sixth capacitor is connected to the positive power supply terminal of the second operational amplifier, the positive power supply terminal of the second operational amplifier is connected to the first power supply, the negative power supply terminal of the second operational amplifier is grounded, and the other end of the sixth capacitor is grounded.

9. The sensor circuit according to claim 8, characterized in that: The signal processing subcircuit also includes: an eighth resistor, one end of the eighth resistor being connected to the other end of the sixth resistor, and the other end of the eighth resistor being connected to the second pin of the micro control unit; A seventh capacitor, one end of the seventh capacitor is connected between the other end of the eighth resistor and the second pin, and the other end of the seventh capacitor is grounded.

10. A seed counter, characterized in that: The seed counter comprises: An infrared emitting diode is arranged on one side of the inner wall of the seed guide tube and is used to emit infrared light; An infrared phototransistor, arranged on the other side of the inner wall of the seed guide tube and opposite to the infrared emitting diode, is used to sense the infrared light emitted by the infrared emitting diode and generate an output signal; A processor, the processor comprising a driving subcircuit, a signal processing subcircuit and a microcontroller unit, wherein the driving subcircuit is arranged between a first pin of the microcontroller unit and the infrared emitting diode, the signal processing subcircuit is arranged between the infrared phototransistor and the second pin of the microcontroller unit, and the microcontroller unit identifies a seed signal and a dust signal according to an output signal processed by the signal processing subcircuit, so as to count the seeds transported in the seed guide tube according to the seed signal, and to generate a control signal according to the dust signal, so as to adjust the luminous intensity of the infrared emitting diode via the driving subcircuit.

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