Wafer production device carrier and its working method

Abstract

The present invention belongs to the technical field of semiconductor devices, and particularly relates to a carrier for a wafer production device and its working method. A carrier for a wafer production device includes: a plurality of pairs of support pieces located on both inner walls of the box body and forming a plurality of layers of wafer placement positions, and the support pieces are slidably arranged up and down between the inner wall of the box body; a plurality of adjustment and limit components corresponding to the respective wafer placement positions, and each adjustment and limit component includes: a wafer insertion part and a linkage mechanism for the support pieces on both sides of the wafer insertion part; wherein, when a wafer is inserted into or pulled out from the wafer placement position, the wafer insertion part moves backward or forward, triggering the linkage mechanism to drive the support piece above the wafer placement position to adjust the layer gap, so as to avoid contamination of adjacent wafers when picking and placing wafers; through the setting of the adjustment and limit components, when the wafer is placed into the box body, the wafer can be pulled to move into the box body, and when the wafer is taken out, the support piece can be pushed to move upward, avoiding contamination of adjacent wafers.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor devices, and particularly relates to a device for processing semiconductor devices, and more particularly to a carrier for a wafer production device and its working method. Background Art

[0002] A wafer cassette mainly functions to place and transport wafers in semiconductor production. To simplify transportation and minimize the risk of contamination as much as possible, chip manufacturers use wafer cassettes to handle and store wafers.

[0003] To increase the loading capacity, the partitions on the inner wall of the wafer cassette are arranged relatively closely. When wafers are stacked in the wafer cassette in sequence, when any wafer is picked up or placed from the middle of the wafer cassette, the clamping device will touch other adjacent wafers above and below, which may cause contamination to other wafers.

[0004] Therefore, how to avoid contaminating other wafers when picking up and placing wafers in the wafer cassette is a technical problem that urgently needs to be solved in this field.

[0005] It should be noted that the above information disclosed in this background art section is only used to understand the background art of the concept of this application. Therefore, it is not considered that the above description constitutes information on the prior art. Summary of the Invention

[0006] The embodiments of the present disclosure at least provide a carrier for a wafer production device and its working method.

[0007] In a first aspect, the embodiments of the present disclosure provide a carrier for a wafer production device, including:

[0008] A cassette body;

[0009] A plurality of pairs of support pieces, located on both inner walls of the cassette body and forming a plurality of layers of wafer placement positions, and the support pieces are slidably arranged up and down between the inner wall of the cassette body;

[0010] A plurality of adjustment and limit components, corresponding to the respective wafer placement positions respectively, and including: a wafer insertion member, and a linkage mechanism for the support pieces on both sides of the wafer insertion member;

[0011] Wherein, when a wafer is inserted into or removed from a wafer placement position, the wafer insertion member moves backward or forward, triggering the linkage mechanism to drive the support piece above the wafer placement position to adjust the layer gap, so as to avoid contaminating adjacent wafers when picking up and placing wafers.

[0012] In an optional implementation manner, the adjustment and limit component includes: a positioning plate, which is horizontally arranged in the cassette body and vertically fixed to the inner plate side wall of the cassette body;

[0013] The wafer insertion member is slidably arranged on the positioning plate;

[0014] The two linkage mechanisms are respectively slidably arranged on both sides of the positioning plate, and the linkage mechanisms are linked with the wafer connector;

[0015] Wherein, when the wafer connector moves away from the inner plate, it is adapted to push the two linkage mechanisms to move away from each other.

[0016] In an alternative embodiment, two parallel grooves are formed in the bottom wall of the positioning plate, one linkage mechanism corresponds to one parallel groove, and the linkage mechanism is slidably arranged in the parallel groove.

[0017] In an alternative embodiment, the linkage mechanism includes: a limiting strip, which is slidably arranged in the parallel groove;

[0018] A positioning block, which is fixed to the outer end of the limiting strip;

[0019] A lifting member, which is fixed to the upper end of the positioning block, and the lifting member is parallel to the limiting strip;

[0020] A connecting rod, the two ends of which are respectively hinged to the lifting member and the wafer connector.

[0021] In an alternative embodiment, the lifting member includes: a jacking block and a linkage plate, the jacking block is fixed to the upper end of the positioning block, and a slope is arranged on one side of the jacking block close to the support piece;

[0022] The linkage plate is fixed to the other side of the jacking block, and the inside of the linkage plate is hollow;

[0023] Wherein, when the wafer connector moves horizontally towards the inner plate, it is adapted to drive the two linkage plates to move towards each other until the two relatively arranged linkage plates are inserted into each other.

[0024] In an alternative embodiment, a plurality of air holes are formed in the linkage plate, and a desiccant is placed inside the linkage plate.

[0025] In an alternative embodiment, a limiting groove is formed on one side of the wafer connector close to the wafer, and the wafer is adapted to be inserted into the limiting groove;

[0026] Wherein, after the wafer is horizontally inserted into the limiting groove, the wafer connector moves horizontally towards the inner plate to pull the wafer towards the inside of the box body.

[0027] In an alternative embodiment, an arc surface is arranged on one side of the positioning block close to the wafer, and the arc surface is adapted to be attached to the outer wall of the wafer.

[0028] In an alternative embodiment, a cassette body is provided, which is hollow inside and has an opening on one side. A wafer is adapted to be inserted into the cassette body through the opening.

[0029] Supporting sheets are vertically arranged on the inner walls of both sides of the cassette body, and every two of the supporting sheets are arranged opposite to each other.

[0030] Adjusting and limiting components are horizontally fixed on the side wall of the inner plate of the cassette body. One adjusting and limiting component corresponds to two supporting sheets, and the adjusting and limiting components are linked with the two supporting sheets.

[0031] When a wafer is placed, the wafer is horizontally inserted into the cassette body until it is limited by the wafer insertion part of the adjusting and limiting components.

[0032] The wafer insertion part moves horizontally towards the inner plate to pull the wafer to slide horizontally into the cassette body.

[0033] When the wafer is taken out, the wafer insertion part moves outwards, and the linkage mechanism of the adjusting and limiting components moves horizontally towards the side wall of the cassette body to push a pair of supporting sheets located above to move upwards.

[0034] In an alternative embodiment, the adjusting and limiting components include: a positioning plate, which is horizontally arranged inside the cassette body and is vertically fixed on the side wall of the inner plate of the cassette body;

[0035] A wafer insertion part is slidably arranged on the positioning plate;

[0036] Two of the linkage mechanisms are respectively slidably arranged on both sides of the positioning plate, and the linkage mechanisms are linked with the wafer insertion part;

[0037] When the wafer insertion part moves in a direction away from the inner plate, it is adapted to push the two linkage mechanisms to move away from each other.

[0038] In an alternative embodiment, the linkage mechanism includes: a limiting strip, which is slidably arranged on the bottom surface of the positioning plate;

[0039] A positioning block is fixed at the outer end of the limiting strip;

[0040] A pushing and lifting part is fixed at the upper end of the positioning block, and the pushing and lifting part is parallel to the limiting strip;

[0041] A connecting rod, the two ends of which are respectively hinged to the pushing and lifting part and the wafer insertion part.

[0042] Second aspect, the embodiments of the present disclosure further provide a working method of a carrier of a wafer production device, including:

[0043] When a wafer is placed, the wafer is horizontally inserted into the cassette body until it is limited by the wafer insertion part of the adjusting and limiting components.

[0044] The wafer connector moves horizontally towards the inner plate to pull the wafer horizontally into the cassette body until the wafer abuts against the positioning block;

[0045] When removing the wafer, the wafer connector moves outwards, and the linkage mechanism of the adjusting limit component moves horizontally towards the side wall of the cassette body to push a pair of supporting pieces located above upwards.

[0046] The beneficial effect of the present invention is that for the carrier of the wafer production device and its working method of the present invention, through the setting of the adjusting limit component, the wafer is placed into the cassette body until it is limited by the wafer connector, and the wafer connector moves inwards to be suitable for pulling the wafer into the cassette body. This avoids the traditional method of using a clamping device or manually pushing the wafer into the cassette body. When taking out the wafer, the wafer connector moves outwards, and the linkage mechanism of the adjusting limit component moves horizontally towards the side wall of the cassette body to push a pair of supporting pieces located above upwards, so as to avoid contaminating other adjacent wafers when using a clamping device or manually clamping the wafer.

[0047] Other features and advantages of the present invention will be described in the following description, and in part, will become apparent from the description, or will be understood by implementing the present invention. The objectives and other advantages of the present invention are achieved and obtained by the structures specifically pointed out in the description, claims, and drawings.

[0048] To make the above objectives, features, and advantages of the present invention more obvious and understandable, specific preferred embodiments are hereby given, and in conjunction with the accompanying drawings, the following detailed description is provided. Description of the Drawings

[0049] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0050] Figure 1 A three-dimensional view of the carrier of the wafer production device provided by an embodiment of the present disclosure;

[0051] Figure 2 A three-dimensional view of the adjusting limit component in the cassette body provided by an embodiment of the present disclosure;

[0052] Figure 3 A partial three-dimensional view of the adjusting limit component provided by an embodiment of the present disclosure;

[0053] Figure 4 A top view of the cassette body and the adjusting limit component provided by an embodiment of the present disclosure;

[0054] Figure 5 The front view of the cartridge body and the adjustment and limiting assembly provided by the embodiments of the present disclosure;

[0055] Figure 6 The schematic diagram of the state of placing a wafer provided by the embodiments of the present disclosure;

[0056] Figure 7 The schematic diagram of the state of taking out a wafer provided by the embodiments of the present disclosure;

[0057] Figure 8 The schematic diagram of the state where two linkage plates are inserted into each other provided by the embodiments of the present disclosure.

[0058] In the figure:

[0059] 1. Cartridge body; 10. Inner plate; 11. Link;

[0060] 2. Support piece;

[0061] 3. Adjustment and limiting assembly; 31. Positioning plate; 310. Parallel groove; 32. Wafer insert; 320. Limiting groove; 33. Linkage mechanism; 34. Limiting strip; 35. Positioning block; 36. Lifting piece; 37. Connecting rod; 38. Jacking block; 39. Linkage plate. Detailed implementation manners

[0062] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0063] In this article, when it is mentioned that the first component is located on the second component, this may mean that the first component can be directly formed on the second component, or a third component can be inserted between the first component and the second component. In addition, in the drawings, for the effective description of the technical content, the thickness of the components may be exaggerated or reduced.

[0064] In this document, when an element or layer is referred to as being "on," "joined to," "connected to," "attached to," or "coupled to" another element or layer, it can be directly on, joined, connected, attached, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on another element or layer," "directly joined to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0065] In this document, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0066] The terms used herein are only for describing specific exemplary configurations and are not intended to be limiting. As used herein, the singular articles "a," "an," and "the" may also be intended to include the plural forms, unless clearly stated otherwise herein. The terms "comprises," "comprising," and "having" are inclusive and thus specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as necessarily requiring them to be performed in the particular order discussed or shown, unless specifically identified as an order of performance. Additional or alternative steps may be employed.

[0067] As used herein, phrases such as "in one embodiment," "according to one embodiment," "in some embodiments," etc. generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," etc. are used "as an example, instance, or illustration." Any embodiment, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other embodiments, aspects, or designs. Instead, the use of the terms "example," "exemplary," etc. is intended to present concepts in a concrete manner.

[0068] When wafers are stacked in a wafer cassette in sequence, when picking and placing any wafer from the middle of the wafer cassette, the clamping device will touch other adjacent wafers above and below, which will cause contamination to other wafers.

[0069] When placing wafers, when the clamping device of the traditional method or manual labor pushes the wafers into the cassette body, it will contaminate other adjacent wafers; when taking out wafers, the distance between adjacent support pieces in the cassette body is relatively small, which is not conducive to the clamping device or manual insertion.

[0070] Regarding the defects existing in the above solutions, they are all the results obtained by the inventor after practice and careful research. Therefore, the process of discovering the above problems and the solutions proposed by the present disclosure in this article for the above problems should be the contributions made by the inventor to the present disclosure during the process of the present disclosure.

[0071] It should be noted that: similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0072] The following will describe in detail some embodiments of the present invention with reference to the drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0073] Such as Figures 1 to 7As shown, in some embodiments, a carrier for a wafer production device is provided, including: a box body 1; its interior is hollow; an opening is provided on one side of the box body 1, and the wafer is adapted to be inserted into the box body 1 through the opening. An inner plate 10 is fixed on the side of the box body 1 away from the opening. A plurality of through slots are provided on the inner plate 10. A connecting rod 11 adapted to cooperate with the adjusting and limiting component 3 is slidably arranged in each through slot. The connecting rod 11 is adapted to drive the wafer inserting member 32 to move horizontally in the box body 1. A plurality of pairs of supporting pieces 2 are located on the inner walls of both sides of the box body 1 and form a plurality of layers of wafer placement positions. The supporting pieces 2 are slidably arranged up and down between the inner wall of the box body 1 and the inner wall of the box body 1. A plurality of vertical slots are symmetrically provided on the side wall of the box body 1 in the vertical direction. Each vertical slot corresponds to a supporting piece 2. A convex block adapted to cooperate with the vertical slot is fixed on the side wall of the supporting piece 2. The convex block is adapted to move in the vertical slot. A plurality of adjusting and limiting components 3 respectively correspond to the corresponding wafer placement positions and include: a wafer inserting member 32, and a linkage mechanism 33 for the supporting pieces 2 located on both sides of the wafer inserting member 32. Among them, when the wafer is inserted into or pulled out from the wafer placement position, the wafer inserting member 32 moves backward or forward, triggering the linkage mechanism 33 to drive the supporting piece 2 above the wafer placement position to adjust the layer gap to avoid contamination of adjacent wafers when picking and placing wafers. Through the setting of the adjusting and limiting component 3, when the wafer is placed in the box body 1 and is limited by the wafer inserting member 32, the inward movement of the wafer inserting member 32 is adapted to pull the wafer into the box body 1. It avoids the traditional method of using a clamping device or manually pushing the wafer into the box body 1. When picking up the wafer, the wafer inserting member 32 moves outward, and the linkage mechanism 33 of the adjusting and limiting component 3 moves horizontally toward the side wall of the box body 1 to push a pair of supporting pieces 2 located above upward to avoid contamination of other adjacent wafers when picking up the wafer by a clamping device or manually.

[0074] Refer to the attached Figure 2 , the adjusting and limiting component 3 includes: a positioning plate 31 which is horizontally arranged in the box body 1 and is vertically fixed on the side wall of the inner plate 10 of the box body 1; the wafer inserting member 32 is slidably arranged on the positioning plate 31; the wafer inserting member 32 is adapted to move horizontally along the length direction of the positioning plate 31 to approach or move away from the inner plate 10. One end of the connecting rod 11 is fixed on the side wall of the wafer inserting member 32. The connecting rod 11 is adapted to drive the wafer inserting member 32 to move horizontally. The two linkage mechanisms 33 are respectively slidably arranged on both sides of the positioning plate 31, and the linkage mechanism 33 is linked with the wafer inserting member 32. Among them,

[0075] when the wafer inserting member 32 is located closest to the side wall of the inner plate 10, the two linkage mechanisms 33 abut against each other. The desiccant inside the mutually abutting linkage mechanism 33 is squeezed.

[0076] Refer to the attached Figure 6, the wafer connector 32 gradually moves away from the inner plate 10 until the connecting rod 37 and the wafer connector 32 are perpendicular to each other. The wafer connector 32 pushes the two linkage mechanisms 33 to move to both sides, and the distance between the two linkage mechanisms 33 reaches the maximum value. At this time, the lifting member 36 is adapted to push up one of the supporting pieces 2 located above it. Attached Figure 6 In the figure, the wafer connector 32 with solid lines is the state where the wafer connector 32 and the connecting rod 37 are perpendicular to each other.

[0077] Refer to attached Figure 6 , when the wafer connector 32 continues to move away from the inner plate 10 until the distance between the wafer connector 32 and the inner plate 10 reaches the maximum distance; the wafer connector 32 is adapted to drive the two linkage mechanisms 33 to gradually move towards each other. In this state, the wafer is horizontally placed into the box body 1 until the wafer is inserted into the limiting groove 320. The wafer connector 32 is adapted to clamp the wafer. After the wafer is limited by the wafer connector 32, the connecting rod 11 is pulled to make the wafer connector 32 horizontally move towards the inner plate 10. The wafer connector 32 is adapted to pull the wafer to horizontally move into the box body 1 until the wafer abuts against the positioning block 35. At this time, the positioning block 35 is adapted to limit the wafer to prevent it from continuing to move towards the inner plate 10. As the wafer connector 32 continues to move towards the inner plate 10, the wafer detaches from the wafer connector 32. Among them, when the wafer connector 32 moves away from the inner plate 10, it is adapted to push the two linkage mechanisms 33 to move away from each other. Attached Figure 6 In the figure, the wafer connector 32 with dashed lines is the state where the wafer connector 32 is at the farthest distance from the inner plate.

[0078] Optionally, two parallel grooves 310 are formed in the bottom wall of the positioning plate 31, and one linkage mechanism 33 corresponds to one parallel groove 310. The linkage mechanism 33 is slidably disposed in the parallel groove 310. The linkage mechanism 33 horizontally moves along the width direction of the positioning plate 31, and the wafer connector 32 horizontally moves along the length direction of the positioning plate 31.

[0079] Refer to attached Figure 3 , the linkage mechanism 33 includes: a limiting strip 34, which is slidably disposed in the parallel groove 310; the two limiting strips 34 are parallel to each other and are offset from each other. A positioning block 35, the positioning block 35 is fixed to the outer end of the limiting strip 34; a lifting member 36, the lifting member 36 is fixed to the upper end of the positioning block 35, and the lifting member 36 is parallel to the limiting strip 34; the lifting member 36 is disposed below the corresponding supporting piece 2; a connecting rod 37, both ends of the connecting rod 37 are respectively hinged to the lifting member 36 and the wafer connector 32.

[0080] Further, the lifting member 36 includes a lifting block 38 and a linkage plate 39. The lifting block 38 is fixed to the upper end of the positioning block 35, and a slope is provided on one side of the lifting block 38 close to the support piece 2. When the positioning block 35 moves horizontally towards the support piece 2, the slope is adapted to push the support piece 2 to move it upward. The linkage plate 39 is fixed to the other side of the lifting block 38, and the interior of the linkage plate 39 is hollow. When the wafer connector 32 moves horizontally towards the inner plate 10, it is adapted to drive the two linkage plates 39 to move towards each other until the two relatively arranged linkage plates 39 are inserted into each other. Further, the width of one linkage block 39 is smaller than that of the other linkage plate 39, that is, when the two linkage plates 39 move towards each other, one linkage plate 39 is adapted to be inserted into the interior of the other linkage plate 39.

[0081] Preferably, the interior of the linkage plate 39 is hollow and a plurality of air holes are provided on the outer wall. A desiccant is placed inside the linkage plate 39. A left extrusion strip is provided inside the left linkage plate 39, and a right extrusion strip is provided inside the right linkage plate 39. The left extrusion strip and the right extrusion strip are mutually offset. When the two linkage plates 39 move towards each other until they are inserted into each other, the left extrusion strip is adapted to be inserted into the right linkage plate 39, and the right extrusion strip is adapted to be inserted into the left linkage plate 39 to squeeze the desiccant located inside the linkage plate 39, and the desiccant is crushed by the extrusion, which can increase the surface area of the desiccant, thereby improving the drying effect.

[0082] Refer to the appendix Figure 3 As shown, a limiting groove 320 is provided on one side of the wafer connector 32 close to the wafer. The wafer is adapted to be inserted into the limiting groove 320. After the wafer is inserted into the limiting groove 320, the wafer connector 32 is adapted to limit the wafer. When the wafer connector 32 moves in the direction of the inner plate 10, it is adapted to pull the wafer to insert it into the box body 1. Among them, after the wafer is horizontally inserted into the limiting groove 320, the wafer connector 32 moves horizontally in the direction of the inner plate 10 to pull the wafer into the box body 1.

[0083] Optionally, an arc surface is provided on one side of the positioning block 35 close to the wafer. The arc surface is adapted to fit with the outer wall of the wafer. The provision of the arc surface increases the contact area between the positioning block 35 and the wafer, changing the contact between the wafer and the positioning block 35 from line contact to surface contact, avoiding damage to the wafer when it abuts against the positioning block 35.

[0084] Some embodiments provide a carrier for a wafer production device, including:

[0085] The cassette body 1 is hollow inside and has an opening on one side. The wafer is adapted to be inserted into the cassette body 1 through the opening. The support pieces 2 are arranged to be lifted and lowered on the inner side walls of both sides of the cassette body 1, and every two of the support pieces 2 are arranged opposite to each other. The adjustment and limit assembly 3 is horizontally fixed on the side wall of the inner plate 10 of the cassette body 1. One adjustment and limit assembly 3 corresponds to two support pieces 2, and the adjustment and limit assembly 3 is linked with the two support pieces 2. When the wafer is placed, the wafer is horizontally inserted into the cassette body 1 until it is limited by the wafer insertion part 32 of the adjustment and limit assembly 3. The wafer insertion part 32 moves horizontally towards the inner plate 10 to pull the wafer to slide horizontally into the cassette body 1. When the wafer is taken out, the wafer insertion part 32 moves outwards, and the linkage mechanism 33 of the adjustment and limit assembly 3 moves horizontally towards the side wall of the cassette body 1 to push a pair of support pieces 2 located above to move upwards.

[0086] Further, the adjustment and limit assembly 3 includes: a positioning plate 31 which is horizontally arranged inside the cassette body 1 and is vertically fixed on the side wall of the inner plate 10 of the cassette body 1; a wafer insertion part 32 which is slidably arranged on the positioning plate 31; two linkage mechanisms 33 which are respectively slidably arranged on both sides of the positioning plate 31, and the linkage mechanism 33 is linked with the wafer insertion part 32. When the wafer insertion part 32 moves in a direction away from the inner plate 10, it is adapted to push the two linkage mechanisms 33 to move away from each other.

[0087] Further, the linkage mechanism 33 includes: a limit bar 34 which is slidably arranged on the lower bottom surface of the positioning plate 31; a positioning block 35 which is fixed at the outer end of the limit bar 34; a pushing and lifting part 36 which is fixed at the upper end of the positioning block 35, and the pushing and lifting part 36 is parallel to the limit bar 34; a connecting rod 37 whose two ends are respectively hinged to the pushing and lifting part 36 and the wafer insertion part 32.

[0088] Some embodiments provide a working method of a carrier of a wafer production device, including:

[0089] When the wafer is placed, the wafer is horizontally inserted into the cassette body 1 until it is limited by the wafer insertion part 32 of the adjustment and limit assembly 3.

[0090] The wafer insertion part 32 moves horizontally towards the inner plate 10 to pull the wafer to slide horizontally into the cassette body 1 until the wafer abuts against the positioning block 35.

[0091] When the wafer is taken out, the wafer insertion part 32 moves outwards, and the linkage mechanism 33 of the adjustment and limit assembly 3 moves horizontally towards the side wall of the cassette body 1 to push a pair of support pieces 2 located above to move upwards.

[0092] In the description of the embodiments of the present invention, unless otherwise clearly defined and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0093] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, terms such as "first", "second" and other numerical terms used herein do not imply an order or sequence unless clearly indicated in the text. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer or section discussed above can be referred to as the second element, component, region, layer or section.

[0094] Spatially relative terms, such as "inner", "outer", "below", "beneath", "under", "above", "upper", etc., may be used herein to facilitate describing the relationship of one element or feature to another element or feature as illustrated in the figures. In addition to the orientation depicted in the figures, spatially relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is turned over, an element described as "below" or "beneath" another element or feature will then be oriented "above" the other element or feature. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0095] In the above discussion, unless otherwise specified, when used to describe a numerical value, the terms "about", "approximately", "substantially", etc. mean a variation of + / −10% of that value.

[0096] Based on the inspiration of the ideal embodiments of the present invention as described above, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of this invention. The technical scope of this invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A carrier for a wafer production device, characterized in that, Comprising: A cassette body (1); A plurality of pairs of support pieces (2), located on the inner walls of both sides of the cassette body (1), and forming a plurality of layers of wafer placement positions. The support pieces (2) are slidably arranged up and down between the inner wall of the cassette body (1); A plurality of adjustment and limit components (3), corresponding to respective wafer placement positions respectively, and comprising: a wafer insertion member (32), and linkage mechanisms (33) on both sides of the wafer insertion member (32); Wherein, when a wafer is inserted into or pulled out from a wafer placement position, the wafer insertion member (32) moves backward or forward, triggering the linkage mechanism (33) to drive the support piece (2) above the wafer placement position to adjust the layer gap, so as to avoid contamination of adjacent wafers when picking and placing wafers; The adjustment and limit component (3) comprises: a positioning plate (31), which is horizontally arranged in the cassette body (1) and vertically fixed on the side wall of the inner plate (10) of the cassette body (1); The wafer insertion member (32) is slidably arranged on the positioning plate (31); The two linkage mechanisms (33) are respectively slidably arranged on both sides of the positioning plate (31), and the linkage mechanism (33) is linked with the wafer insertion member (32); Wherein, when the wafer insertion member (32) moves in a direction away from the inner plate (10), it is adapted to push the two linkage mechanisms (33) to move away from each other.

2. The carrier of the wafer production device according to claim 1, wherein Two parallel grooves (310) are formed on the bottom wall of the positioning plate (31), and one linkage mechanism (33) corresponds to one parallel groove (310). The linkage mechanism (33) is slidably arranged in the parallel groove (310).

3. The carrier of the wafer production device according to claim 2, wherein The linkage mechanism (33) comprises: a limit strip (34), which is slidably arranged in the parallel groove (310); A positioning block (35), and the positioning block (35) is fixed at the outer end of the limit strip (34); A lifting member (36), and the lifting member (36) is fixed at the upper end of the positioning block (35), and the lifting member (36) is parallel to the limit strip (34); A connecting rod (37), and both ends of the connecting rod (37) are respectively hinged to the lifting member (36) and the wafer insertion member (32).

4. The carrier of the wafer production device according to claim 3, wherein The lifting member (36) comprises: a jacking block (38) and a linkage plate (39). The jacking block (38) is fixed at the upper end of the positioning block (35), and a slope is arranged on one side of the jacking block (38) close to the support piece (2); The linkage plate (39) is fixed on the other side of the jacking block (38), and the inside of the linkage plate (39) is hollow; Wherein, when the wafer insertion member (32) moves horizontally towards the inner plate (10), it is adapted to drive the two linkage plates (39) to move towards each other until the two relatively arranged linkage plates (39) are inserted into each other.

5. The carrier of the wafer production device according to claim 4, wherein The inside of the linkage plate (39) is hollow and a plurality of air holes are formed on the outer wall. A desiccant is placed inside the linkage plate (39).

6. The carrier of the wafer production device according to claim 1, wherein: A limiting groove (320) is formed on one side of the wafer connector (32) close to the wafer, and the wafer is adapted to be inserted into the limiting groove (320); Wherein, after the wafer is horizontally inserted into the limiting groove (320), the wafer connector (32) horizontally moves towards the inner plate (10) to pull the wafer into the box body (1).

7. The carrier of the wafer production device according to claim 3, wherein: An arc surface is provided on one side of the positioning block (35) close to the wafer, and the arc surface is adapted to fit the outer wall of the wafer.

8. A carrier for a wafer production device, characterized in that, Comprising: A box body (1), which is hollow and has an opening on one side, and the wafer is adapted to pass through the opening and be inserted into the box body (1); Supporting sheets (2), which are arranged to be lifted and lowered on the inner side walls of both sides of the box body (1), and every two of the supporting sheets (2) are arranged oppositely; An adjusting and limiting assembly (3), which is horizontally fixed on the side wall of the inner plate (10) of the box body (1), one adjusting and limiting assembly (3) corresponds to two supporting sheets (2), and the adjusting and limiting assembly (3) is linked with the two supporting sheets (2); Wherein, when the wafer is placed, the wafer is horizontally inserted into the box body (1) until it is limited by the wafer connector (32) of the adjusting and limiting assembly (3); The wafer connector (32) horizontally moves towards the inner plate (10) to pull the wafer to slide horizontally into the box body (1); When the wafer is taken out, the wafer connector (32) moves outwards, and the linkage mechanism (33) of the adjusting and limiting assembly (3) horizontally moves towards the side wall of the box body (1) to push the pair of supporting sheets (2) located above to move upwards; The adjusting and limiting assembly (3) includes: a positioning plate (31), which is horizontally arranged in the box body (1) and is vertically fixed on the side wall of the inner plate (10) of the box body (1); A wafer connector (32), which is slidably arranged on the positioning plate (31); Two of the linkage mechanisms (33) are respectively slidably arranged on both sides of the positioning plate (31), and the linkage mechanism (33) is linked with the wafer connector (32); Wherein, when the wafer connector (32) moves in a direction away from the inner plate (10), it is adapted to push the two linkage mechanisms to move away from each other.

9. The carrier of the wafer production device according to claim 8, wherein: The linkage mechanism (33) includes: a limiting strip (34), which is slidably arranged on the lower bottom surface of the positioning plate (31); A positioning block (35), which is fixed at the outer end of the limiting strip (34); A lifting member (36), which is fixed at the upper end of the positioning block (35), and the lifting member (36) is parallel to the limiting strip (34); A connecting rod (37), the two ends of which are respectively hinged on the lifting member (36) and the wafer connector (32).

10. A working method of a carrier for a wafer production device, using the carrier for a wafer production device according to any one of claims 1-9, characterized in that, Comprising: When the wafer is placed, the wafer is horizontally inserted into the box body (1) until it is limited by the wafer connector (32) of the adjusting and limiting assembly (3); The wafer connector (32) moves horizontally towards the inner plate (10) to pull the wafer horizontally into the box body (1) until the wafer abuts against the positioning block (35). When removing the wafer, the wafer connector (32) moves outwards, and the linkage mechanism (33) of the limit component (3) moves horizontally towards the side wall of the box body (1) to push a pair of supporting pieces (2) located above upwards.

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