Chip Memory

Abstract

The present disclosure relates to the field of semiconductor manufacturing, and provides a chip storage device. The chip storage device includes a warehouse body, a first handling device, and a second handling device. The warehouse body is provided with a storage warehouse, a first window, and a second window. A plurality of carriers are provided in the storage warehouse, and the plurality of carriers are used to carry a chip box. The chip box is sent into or out of the storage warehouse through the first window. The chip box is used to store chips, and the chips are sent into or out of the storage warehouse through the second window. The first handling device is provided in the storage warehouse, and is used to carry the chip box between the plurality of carriers. The second handling device is provided in the storage warehouse, and is used to take the chip out of the chip box and send the chip out of the storage warehouse through the second window, and is used to receive the chip outside the storage warehouse and send the chip into the chip box in the storage warehouse through the second window. The present disclosure sets a handling device for carrying the chip inside the chip storage device, which improves the space utilization inside the chip storage device and reduces the space occupied by the process area outside the chip storage device.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor manufacturing, and more particularly, to a chip memory. Background Art

[0002] In the semiconductor industry, the chip storage device is an automated storage device that realizes the flow of chips between different processes by working in collaboration with the automated material handling system. The chip storage device is equipped with a storage bin, which is used to store chip boxes, and the chip boxes are used to store chips. The storage bin is equipped with a handling device for handling chip boxes. There is a window on the bin wall of the chip storage device, through which the chips can be sent out to the process area for processing. The processed chips can be sent from the process area to the storage bin through the window. The delivery of chips is completed by the handling device set up in the process area, but the handling device is usually large in size, resulting in more space occupied by the process area. Summary of the invention

[0003] In view of this, the present disclosure provides a chip storage device to improve the problem that the conventional process area transport device occupies more space.

[0004] The wafer storage device includes a warehouse body, a first handling device, and a second handling device. The warehouse body is provided with a storage warehouse, a first window, and a second window. A plurality of carriers are provided in the storage warehouse, and the plurality of carriers are used to carry wafer boxes. The wafer boxes are sent into or out of the storage warehouse through the first window. The wafer boxes are used to store wafers. The wafers are sent into or out of the storage warehouse through the second window. The first handling device is provided in the storage warehouse, and is used to carry the wafer boxes between the plurality of carriers. The second handling device is provided in the storage warehouse, and is used to take the wafers out of the wafer boxes and send the wafers out of the storage warehouse through the second window, and is used to receive the wafers outside the storage warehouse and send the wafers into the wafer boxes in the storage warehouse through the second window.

[0005] As a possible implementation, a calibration device is provided in the storage bin, and the calibration device is used to perform calibration processing on the wafers sent out of or into the storage bin.

[0006] As a possible implementation, the wafer storage device further includes a moving platform that moves in an up-and-down direction, and the second transport device and the calibration device are supported on the moving platform so as to be lifted and lowered together.

[0007] As a possible implementation, the multiple carriers include a first carrier, the second handling device is used to take the wafer out or put the wafer into the wafer box on the first carrier, and the first carrier is supported on a movable platform to be lifted and lowered together with the second handling device and the calibration device.

[0008] As a possible implementation, the warehouse body includes a first warehouse wall and a second warehouse wall, the first warehouse wall and the second warehouse wall are perpendicular to a first direction and spaced along the first direction, and the first direction is perpendicular to the up-down direction. The first warehouse wall is provided with a first window, the second warehouse wall is provided with a second window, and the second warehouse wall is closer to the moving platform than the first warehouse wall.

[0009] As a possible implementation method, the warehouse body includes a third warehouse wall and a fourth warehouse wall, the third warehouse wall and the fourth warehouse wall are perpendicular to the second direction and spaced along the second direction, the first direction, the second direction and the up and down directions are perpendicular to each other, the first platform is located between the third warehouse wall and the second transport device in the second direction, and the calibration device is located between the fourth warehouse wall and the second transport device in the second direction.

[0010] As a possible implementation manner, the first carrier is located at a corner formed by the second warehouse wall and the third warehouse wall.

[0011] As a possible implementation, the multiple carriers further include a second carrier, the second handling device is used to place defective wafers and / or sample wafers into a wafer box on the second carrier, and the second carrier is located at a corner of the second warehouse wall and the fourth warehouse wall.

[0012] As a possible implementation, the second stage is fixed to the warehouse body and is located above the calibration device. When the mobile platform is located at a position where the second handling device can deliver a wafer in or out through the second window, the wafer on the calibration device is higher than the lower edge of the second window, the wafer box on the first stage is higher than the calibration device, the wafer box on the second stage is higher than the wafer box on the first stage, and the upper edge of the second window is higher than the wafer box on the second stage.

[0013] As a possible implementation, the first carrier is provided with a first in-place sensor, wherein the first in-place sensor is triggered in response to a wafer in a wafer box on the first carrier not being in place; and / or the second carrier is provided with a second in-place sensor, wherein the second in-place sensor is triggered in response to a wafer in a wafer box on the second carrier not being in place.

[0014] As a possible implementation manner, the multiple platforms include multiple third platforms, and the multiple third platforms are supported on the first warehouse wall.

[0015] As a possible implementation, the wafer storage device further includes a mobile platform that moves in an up-down direction. The first handling device includes a first fixing mechanism, and the first fixing mechanism is used to releasably fix the wafer box. The second handling device includes a second fixing mechanism, and the second fixing mechanism is used to releasably fix the wafer. The first handling device and the second handling device include an arm mechanism shared with each other, one end of the arm mechanism is supported on the mobile platform, and the other end of the arm mechanism is connected to the first fixing mechanism and the second fixing mechanism.

[0016] As a possible implementation, the first fixing mechanism and the second fixing mechanism are assembled together to form a fixing mechanism. The fixing mechanism is rotatably connected to the other end of the arm mechanism around a rotation axis, and the first fixing mechanism and the second fixing mechanism are arranged in a straight line and both face away from each other.

[0017] As a possible implementation, the warehouse body includes a first warehouse wall and a second warehouse wall. The first warehouse wall and the second warehouse wall are perpendicular to a first direction and spaced apart along the first direction, the first direction is perpendicular to the up-down direction, the first warehouse wall is provided with a first window, and the second warehouse wall is provided with a second window. In a plane view perpendicular to the first direction, the second window is higher than the first window; in a plane view perpendicular to the up-down direction, a reference straight line extending along the first direction and intersecting the main axis of the arm mechanism passes through the first window and the second window.

[0018] The present invention sets a wafer transport device inside the wafer storage device, and does not need to set a wafer transport device in the process area outside the wafer storage device, thereby improving the space utilization inside the wafer storage device and reducing the space occupied by the process area. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and should not be viewed as limiting the scope.

[0020] It should be understood that the same or similar reference numerals are used in the drawings to indicate the same or similar elements.

[0021] It should be understood that the drawings are merely schematic and that the sizes and proportions of elements in the drawings are not necessarily accurate.

[0022] Figure 1a FIG. 4 is a schematic diagram of a chip memory according to an embodiment of the present disclosure.

[0023] Figure 1b for Figure 1a Schematic diagram of another perspective of the chip memory.

[0024] Figure 2 To show the top view Figure 1a A schematic diagram of the positions of a first transport device and a second transport device of an embodiment of a chip storage device in FIG.

[0025] Figure 3 To show the side view Figure 1a A schematic diagram of the positions of the first transport device and the second transport device of another embodiment of the chip storage device in FIG.

[0026] Figure 4 To show the side view Figure 1aSchematic diagram of the positions of the first transport device, the second transport device, the first mobile platform and the second mobile platform of the wafer storage device.

[0027] Figure 5 To show the top view Figure 1a Schematic diagram of the structure of the first transport device and the second transport device of the chip storage device.

[0028] Figure 6 for Figure 1a A schematic structural diagram of a first transport device, a second transport device and a mobile platform for a wafer storage device in FIG.

[0029] Figure 7a for Figure 1a A schematic diagram of the structure of the first window and the second window of the chip memory in FIG.

[0030] Figure 7b To show the top view Figure 1a A schematic diagram of the positions of the first handling device, the second handling device, the first window and the second window of the wafer storage device in FIG.

[0031] Figure 8 To show the top view Figure 1a Schematic diagram of the structure of the calibration device of the chip memory.

[0032] Fig. 9 for Figure 1a A schematic structural diagram of a first transport device, a second transport device, a mobile platform and a calibration device for a wafer storage device in FIG.

[0033] Fig.10 for Figure 1a A schematic structural diagram of a first transport device, a second transport device, a mobile platform, a calibration device and a first carrier of a wafer storage device in FIG.

[0034] Fig.11 To show the top view Figure 1a Schematic diagram of the structure of the mobile platform, calibration device and first carrier of the chip storage device.

[0035] Fig.12 To show the top view Figure 1a Schematic diagram of the position of the second carrier of the chip storage device.

[0036] Fig.13 for Figure 1a Schematic diagram of the positions of the calibration device, the first stage and the second stage when the second transport device of the chip storage device is located at a position where the chip can be delivered in or out.

[0037] Fig.14 for Figure 1aSchematic diagram of the structure of the shaft rod inside the main body of the chip storage.

[0038] Fig.15 for Figure 1a Schematic diagram of the structure of the first in-place sensor of the chip storage device.

[0039] Fig.16 for Figure 1a Schematic diagram of the position of the third carrier of the chip storage device.

[0040] Figures 1a to 16 Description of reference numerals:

[0041] 10-warehouse, 100-storage warehouse, 101-bottom wall, 102-top wall, 103-side wall, 11-first warehouse wall, 111-first window, 12-second warehouse wall, 121-second window, 13-third warehouse wall, 14-fourth warehouse wall, 20-first handling device, 201-first main body, 202-first arm mechanism, 203-first fixing mechanism, 21-main body, 211-shaft rod, 22-arm mechanism, 221-main axis, 30-second handling device, 301-second main body, 302-second arm mechanism, 3 03-the second fixing mechanism, 40-the carrier, 41-the first carrier, 42-the second carrier, 43-the third carrier, 50-the wafer box, 60-the moving platform, 61-the first moving platform, 62-the second moving platform, 601-the motor, 602-the guide rail, 603-the slider, 604-the first platform, 605-the frame, 606-the second platform, 607-the third platform, 70-the calibration device, 80-the first in-position sensor, 81-the transmitter, 82-the receiver, 83-the light beam, y-the first direction, x-the second direction. DETAILED DESCRIPTION

[0042] Numerous specific details will be listed below to provide an understanding of the structure, function, and use of the embodiments described in the specification and shown in the drawings. It is understood that the embodiments described and shown herein are non-limiting examples, so that it can be recognized that the specific structural and functional details disclosed herein may be representative and exemplary. Modifications and changes may be made to these embodiments without departing from the scope of the claims.

[0043] In the semiconductor industry, the chip storage device is an automated storage device that realizes the flow of chips between different processes through the coordinated operation with the automated material handling system. The chip storage device is equipped with a storage bin inside, which is used to store chip boxes, and the chip boxes are used to store chips. The storage bin is equipped with a handling device for handling chip boxes. There is a window on the wall of the chip storage bin, through which the chips can be sent to the process area for processing. The processed chips can be sent from the process area to the storage bin through the window.

[0044] The inventors have found that in the past, the delivery and import of wafers were completed by a handling device set up in the process area, but the handling device is usually large in size, resulting in more space occupied by the process area. At the same time, there is a lot of space in the wafer storage that is not utilized. For example, the space around the wall of the wafer storage bin; the space occupied by the handling device for carrying the wafer box during the transportation process. In response to the above problems, the present disclosure sets the handling device for carrying wafers in the wafer storage, utilizing the space that was previously wasted in the wafer storage, improving the space utilization rate inside the wafer storage without increasing the volume of the wafer storage. Since there is no need to set a handling device for carrying wafers in the process area outside the wafer storage, the space occupied by the process area is reduced.

[0045] The following is a more detailed introduction to the chip memory provided by the present disclosure.

[0046] like Figure 1a , Figure 1b , Figure 2 As shown, the wafer storage device includes a warehouse body 10, a first handling device 20, and a second handling device 30. The warehouse body 10 is provided with a storage warehouse 100, and the warehouse body 10 can be a hollow rectangular cube, and the internal accommodation space is used as the storage warehouse 100. A plurality of carriers 40 are provided in the storage warehouse 100, and the plurality of carriers 40 are used to carry a wafer box 50, and the wafer box 50 is used to store wafers. The plurality of carriers 40 can be fixedly arranged on the warehouse body 10 in a stacked arrangement in the height direction, or can be supported on a frame 605 inside the storage warehouse 100 without contacting the warehouse body 10. Each carrier 40 can be used to carry wafer boxes 50 of multiple sizes, such as 6-inch and 8-inch wafer boxes 50. A first window 111 and a second window 121 are also provided on the warehouse body 10. The present disclosure does not limit the position, shape, and size of the first window 111 and the second window 121. As long as the wafer box 50 can be sent into and out of the storage bin 100 through the first window 111, the wafer can be sent into and out of the storage bin 100 through the second window 121. The first handling device 20 is disposed in the storage bin 100, and is used to carry the wafer box 50 between the plurality of carriers 40. The second handling device 30 is disposed in the storage bin 100, and is used to take the wafer out of the wafer box 50 and send the wafer out of the storage bin 100 through the second window 121, and is used to receive the wafer outside the storage bin 100 and send the wafer into the wafer box 50 in the storage bin 100 through the second window 121.

[0047] In some embodiments, the tank body 10 includes a plurality of tank walls, such as Figure 2 As shown, the first handling device 20 and the second handling device 30 can be arranged on the same warehouse wall. Figure 3As shown, they can also be arranged on different warehouse walls respectively. Specifically, the warehouse wall includes a bottom wall 101, a top wall 102 and a side wall 103, and the first handling device 20 and the second handling device 30 are arranged on the bottom wall 101 and the top wall 102 respectively. The first handling device 20 includes a first main body 201 with a power source arranged inside, and the first main body 201 is fixed to the bottom wall 101. A first arm mechanism 202 supported above the first main body 201, the first arm mechanism 202 includes a plurality of connecting rods and a plurality of joints, wherein the joints can be universal joints. One end of the first arm mechanism 202 can be rotatably connected to the first main body 201, and the other end can be rotatably connected to the first fixing mechanism 203. For example, the first arm mechanism 202, the first main body 201, and the first fixing mechanism 203 can be connected by a universal joint. The power source inside the first main body 201 can drive the first arm mechanism 202 to rotate, move and retract, thereby driving the first fixing mechanism 203 to reach a specified position. The first fixing mechanism 203 is used to releasably fix the wafer box 50, that is, the wafer box 50 can be grasped and placed, so as to realize the transportation of the wafer box 50 between different carriers 40. The second transport device 30 includes a second body 301 with a power source disposed inside, and the second body 301 is fixed to the top wall 102. A second arm mechanism 302 is disposed below the second body 301, and the second arm mechanism 302 includes a plurality of connecting rods and a plurality of joints, wherein the joints can be universal joints. One end of the second arm mechanism 302 can be rotatably connected to the second body 301, and the other end can be rotatably connected to the second fixing mechanism 303. For example, the second arm mechanism 302, the second body 301, and the second fixing mechanism 303 can be connected by a universal joint. The power source inside the second body 301 can drive the second arm mechanism 302 to rotate, move, and retract, thereby driving the second fixing mechanism 303 to reach a specified position. The second fixing mechanism 303 is used to releasably fix the wafer, that is, it can grab and place the wafer, so as to take the wafer out of the wafer box 50 and send the wafer out of the storage bin 100 through the second window 121, and receive the wafer outside the storage bin 100 and send the wafer into the wafer box 50 in the storage bin 100 through the second window 121. In the above embodiment, in order to avoid the first handling device 20 and the second handling device 30 from colliding and interfering with each other, when the first handling device 20 carries the wafer box 50, the second handling device 30 can be restored to its initial state. The second handling device 30 restored to its initial state is located outside the range of motion of the first handling device 20. Similarly, when the second handling device 30 is working, the first handling device 20 can be restored to its initial state, and the motion path of the first arm mechanism 202 and the second arm mechanism 302 can be designed and planned by programming to avoid collision and interference. Since the first handling device 20 and the second handling device 30 are respectively arranged on different bin walls, the space near different bin walls is utilized, thereby improving the space utilization rate in the wafer storage.

[0048] However, in the above embodiment, the first arm mechanism 202 and the second arm mechanism 302 are usually longer in length to support the first fixing mechanism 203 and the second fixing mechanism 303 to grab and place the wafer box 50 and the wafer at a distance. Figure 4 As shown, in some embodiments, a first moving platform 61 may be provided between the first transport device 20 and the warehouse wall. A second moving platform 62 may be provided between the second transport device 30 and the warehouse wall. Specifically, when the first transport device 20 is provided on the bottom wall 101, the first moving platform 61 provided between the first body 201 and the side wall 103 may support the first transport device 20 to rise and fall in the height direction. The first moving platform 61 may include a motor (not shown in the figure), a guide rail 602, and a slider 603. The guide rail 602 is provided on the side wall 103, and one end of the slider 603 on the guide rail 602 is connected to the screw in the guide rail 602, and the other end is connected to the first transport device 20. The motor 601 drives the screw in the guide rail 602 to rotate, and the rotating screw drives the slider 603 to move along the guide rail 602, thereby driving the first transport device 20 to rise and fall in the height direction. Similarly, the second mobile platform 62 can adopt the same structure as the first mobile platform 61, and can be arranged on different side walls 103 or on the same side wall 103 to support the second handling device 30 to rise and fall in the height direction. In some embodiments, the first mobile platform 61 can also be arranged between the first handling device 20 and the bottom wall 101, and the mobile platform 60 can include a telescopic rod. The upper end surface of the telescopic rod is fixedly connected to the bottom of the first handling device 20, and the lower end surface of the telescopic rod is connected to the bottom wall 101. The telescopic rod is telescoped by hydraulic means. The present disclosure does not limit the specific structure of the first mobile platform 61 and the second mobile platform 62, as long as the first handling device 20 and the second handling device 30 can be raised and lowered in the height direction. Similarly, in order to avoid collision and interference between the first handling device 20 and the second handling device 30, when the first handling device 20 carries the wafer box 50, the second handling device 30 can be restored to its initial state. The second handling device 30 restored to its initial state is located outside the range of motion of the first handling device 20. Similarly, when the second handling device 30 is working, the first handling device 20 can be restored to its initial state. In the above embodiment, the first mobile platform 61 and the second mobile platform 62 are provided so that the first transport device 20 and the second transport device 30 can be raised and lowered in the height direction, thereby reducing the length of the first arm mechanism 202 and the second arm mechanism 302 and reducing the space occupied by the first transport device 20 and the second transport device 30.

[0049] However, in the above embodiment, the second body 301 and the second arm mechanism 302 of the second transport device 30 still occupy a lot of space. Therefore, in some embodiments, the first transport device 20 and the second transport device 30 include an arm mechanism 22 that is shared with each other. One end of the arm mechanism 22 is supported on the mobile platform 60, and the other end of the arm mechanism 22 is connected to the first fixing mechanism 203 and the second fixing mechanism 303. In some embodiments, as Figure 5 As shown, the first handling device 20 and the second handling device 30 may also include a main body 21 shared with each other. One end of the arm mechanism 22 is supported on the main body 21, and the main body 21 is supported on the mobile platform 60. The first handling device 20 includes a first fixing mechanism 203, which is used to releasably fix the wafer box 50, that is, the wafer box 50 can be grasped and placed. The first fixing mechanism 203 includes a pair of clamping claws, and grooves extending in the height direction are arranged inside the two clamping claws. When grasping the wafer box 50, the two clamping claws are driven to approach each other, and the flange extending in the height direction on the wafer box 50 is clamped into the groove, thereby clamping the wafer box 50. When placing the wafer box 50, the two clamping claws are driven to move away from each other, thereby releasing the wafer box 50. The second handling device 30 includes a second fixing mechanism 303, which is used to releasably fix the wafer, that is, the wafer can be grasped and placed. The second fixing mechanism 303 includes a tooth fork, and an air hole is arranged at each of the two fork heads of the tooth fork. When grabbing a wafer, the air hole takes in air, and the wafer is adsorbed on the fork. When placing the wafer, the air hole stops taking in air, and the wafer is released. The arm mechanism 22 may include a plurality of connecting rods and joints. The wafer storage may also include a moving platform 60 that moves in the up and down directions, wherein the moving platform 60 may be the first moving platform 61 or the second moving platform 62 mentioned above. Specifically, as Figure 6 As shown, one end of the arm mechanism 22 is supported on the main body 21, and the arm mechanism 22 and the main body 21 can rotate relative to each other around an axis. The main body 21 is supported on the mobile platform 60. One end of the arm mechanism 22 can be the lower end surface of the arm mechanism 22, or a top portion of the arm mechanism 22. The other end of the arm mechanism 22 is rotatably connected to the first fixing mechanism 203 and the second fixing mechanism 303 around an axis. The other end of the arm mechanism 22 can be the upper end surface of the arm mechanism 22, or another top portion of the arm mechanism 22. In the above embodiment, the first fixing mechanism 203 and the second fixing mechanism 303 are arranged on the same arm mechanism 22. Under the support of the mobile platform 60 and the arm mechanism 22, the first fixing mechanism 203 and the second fixing mechanism 303 can both reach the designated position to carry the wafer box 50 and the wafer, which greatly reduces the manufacturing cost and reduces the space occupied by the two carrying devices.

[0050] In some embodiments, Figure 5As shown, the first fixing mechanism 203 and the second fixing mechanism 303 are assembled together to form a fixing mechanism, which can grab and place the chip box 50, and can also grab and place the chip. The fixing mechanism is rotatably connected to the other end of the arm mechanism 22 around a rotation axis. This means that after the fixing mechanism places a chip box 50, when you want to take out the chip from the chip box 50, you first move the fixing mechanism a certain distance away from the chip box 50 to avoid collision with the chip box 50 when the fixing mechanism rotates, and then you only need to rotate the fixing mechanism around the rotation axis by a certain angle to align the second fixing mechanism 303 with the chip. In this process, the arm mechanism 22 does not need to be involved when aligning the second fixing mechanism 303 with the chip, which simplifies the control procedure. The first fixing mechanism 203 and the second fixing mechanism 303 are arranged in a straight line and are both facing away from each other. In other words, as Figure 5 As shown, in a top view, the central axis of the first fixing mechanism 203 coincides with the central axis of the second fixing mechanism 303. For example, when the first fixing mechanism 203 is a clamping claw and the second fixing mechanism 303 is a tooth fork, the opening directions of the clamping claw and the tooth fork are opposite. This means that the wafer box 50 and the wafer can be fixed on the fixing mechanism at the same time without interference. When working, the influence between the first fixing mechanism 203 and the second fixing mechanism 303 is minimal.

[0051] In some embodiments, Figure 7a As shown in FIG. 7b, the warehouse body 10 includes a first warehouse wall 11 and a second warehouse wall 12, the first warehouse wall 11 and the second warehouse wall 12 are perpendicular to the first direction y and spaced apart along the first direction y, and the first direction y is perpendicular to the up-down direction. The first warehouse wall 11 is provided with a first window 111, and the second warehouse wall 12 is provided with a second window 121. In a plane view perpendicular to the first direction y, the second window 121 is higher than the first window 111. As described above, the wafer box 50 can be sent into and out of the storage warehouse 100 from the external environment through the first window 111. During the process of sending in and out, dust from the external environment inevitably enters the storage warehouse 100. In order to prevent the dust in the storage warehouse 100 from entering the process area through the second window 121, the height of the second window 121 can be made higher than the first window 111, so that dust is difficult to float into the process area from the second window 121. Optionally, the air in the storage bin 100 may also flow downward, for example, by arranging a fan above the wafer storage to blow air toward the bottom of the wafer storage to further prevent dust from drifting into the process area from the second window 121. Figure 7bAs shown, in a plane view perpendicular to the up-down direction, a reference straight line L1 extending along the first direction y and intersecting the main axis 221 of the arm mechanism 22 passes through the first window 111 and the second window 121. The main axis 221 of the arm mechanism 22 can be the centroid of the positive projection of the arm mechanism 22 on the horizontal plane, or the axis center of the connecting axis with the main body 21. In other words, the first window 111, the arm mechanism 22, and the second window 121 are aligned in the first direction y. Since the fixing mechanism can interact with the first window 111 to grab the wafer box 50, and can interact with the second window 121 to grab the wafer. Therefore, when the arm mechanism 22 is aligned with the first window 111 and the second window 121 in the first direction y, the distance of the interactive travel between the arm mechanism 22 and the first window 111 and the second window 121 is the shortest, which can improve the handling efficiency.

[0052] In some embodiments, Figure 8 As shown, a calibration device 70 is provided in the storage bin 100, and the calibration device 70 is used to calibrate the wafers sent out or sent into the storage bin 100. Specifically, the second handling device 30 and the first handling device 20 include an arm mechanism 22 and a main body 21 that are shared with each other, the first handling device 20 includes a first fixing mechanism 203 for releasably fixing the wafer box 50, and the second handling device 30 includes a second fixing mechanism 303 for releasably fixing the wafer. The second handling device 30 can take out the wafer from the wafer box 50 on the carrier 40, and then place the wafer on the calibration device 70. After the calibration device 70 calibrates the wafer, the second handling device 30 then sends the wafer to the wafer boat in the process area through the second window 121. The calibration device 70 detects the edge of the wafer through optical technology, determines the position and direction of the wafer, so as to achieve accurate alignment and docking of the wafer and the wafer boat.

[0053] In some embodiments, the wafer storage device further includes a moving platform 60 that moves in an up-down direction, and the second handling device 30 and the calibration device 70 are supported on the moving platform 60 so as to be lifted and lowered together. The present disclosure does not limit the position and height of the second handling device 30 and the calibration device 70 on the moving platform 60, as long as the second handling device 30 can place the wafer on the calibration device 70 and can take it out from the calibration device 70. For example, Fig. 9As shown, the second handling device 30 and the first handling device 20 include an arm mechanism 22 and a main body 21 that are shared with each other. The first handling device 20 includes a first fixing mechanism 203 for releasably fixing the wafer box 50, and the second handling device 30 includes a second fixing mechanism 303 for releasably fixing the wafer. The mobile platform 60 includes a motor 601, a guide rail 602, a slider 603, and a first platform 604. The guide rail 602 is fixedly arranged on the second warehouse wall 12, and one end of the slider 603 on the guide rail 602 is connected to the screw in the guide rail 602, and the other end is connected to the first platform 604. The main body 21 is supported on the first platform 604. One end of the arm mechanism 22 can be rotatably connected to the main body 21 around an axis, and the other end can be rotatably connected to the first fixing mechanism 203 and the second fixing mechanism 303 around an axis. The arm mechanism 22 includes a plurality of connecting rods and a plurality of joints, and two connecting rods connected to the same joint can rotate relative to each other on a horizontal plane. The mobile platform 60 also includes a frame 605, which is supported on the first platform 604. A second platform 606 is arranged above the frame 605, and the calibration device 70 is supported on the second platform 606. The second platform 606 is higher than the first platform 604, so that the calibration device 70 and the second fixing mechanism 303 are basically at the same height. The power source inside the main body 21 can drive the arm mechanism 22 to rotate, move and extend, and then drive the second fixing mechanism 303 to reach a specified position. The second fixing mechanism 303 is used to releasably fix the wafer, that is, it can grasp and place the wafer, so as to take the wafer out of the wafer box 50 and place the wafer on the calibration device 70, and then send it out of the storage warehouse 100 through the second window 121, and receive the wafer outside the storage warehouse 100 and send the wafer into the wafer box 50 in the storage warehouse 100 through the second window 121. The motor 601 in the mobile platform 60 drives the screw in the guide rail 602 to rotate, and the rotating screw drives the slider 603 to move along the guide rail 602, so that the second handling device 30 and the calibration device 70 are lifted and lowered together under the support of the first platform 604. In the previous wafer storage, the wafer box 50, the calibration device 70 and the second window 121 may not be at the same height. After the second handling device 30 takes out the wafer from the wafer box 50, it needs to be lifted and lowered to the height of the calibration device 70, and after the wafer is calibrated, it is lifted and lowered to the height of the second window 121. During the lifting process, the second handling device 30 cannot perform other operations. However, in the above embodiment, when the wafer box 50 and the second window 121 are not at the same height, the second handling device 30 can be directly placed on the calibration device 70 after taking out the wafer from the wafer box 50. Since the calibration device 70 and the second handling device 30 can be lifted and lowered together, the calibration device 70 can calibrate the wafer during the process of the second handling device 30 being lifted and lowered to the second window 121, which saves a lot of time and improves the handling efficiency of the wafer. At the same time, the space occupied by the mobile platform 60 during the lifting process is effectively utilized.

[0054] However, in the above embodiment, when the wafer box 50 and the second window 121 are not at the same height, the second transport device 30 still needs to be lifted and lowered between the wafer box 50 and the second window 121, which takes a long time. Therefore, in some embodiments, the plurality of carriers 40 include a first carrier 41, and the second transport device 30 is used to take the wafer out of or put the wafer into the wafer box 50 on the first carrier 41. The first carrier 41 is supported on the mobile platform 60 so as to be lifted and lowered together with the second transport device 30 and the calibration device 70. The present disclosure does not limit the position and height of the first carrier 41, the second transport device 30 and the calibration device 70 on the mobile platform 60, as long as the second transport device 30 can transport the wafer between the first carrier 41 and the calibration device 70. For example, Fig.10 As shown, a third platform 607 is provided on the frame 605, and the third platform 607 and the second platform 606 are located on both sides of the second handling device 30 and have the same height. The first carrier 41 is supported above the third platform 607. The first carrier 41, the second fixing mechanism 303, and the calibration device 70 are basically at the same height. In the above embodiment, after the first handling device 20 can carry the wafer box 50 on other carriers 40 to the first carrier 41, the mobile platform 60 can raise the first carrier 41, the second handling device 30, and the calibration device 70 to the height of the second window 121. The second handling device 30 can take out the wafer from the wafer box 50 on the first carrier 41, place it on the calibration device 70, and send the wafer out through the second window 121 after the calibration is completed. In the process of taking out, calibrating and sending out the wafer, the second handling device 30 does not need to be raised or lowered, which further saves a lot of time. At the same time, the space occupied by the mobile platform 60 during the lifting process is effectively utilized. When it is necessary to transport the chip box 50 on the first carrier 41 to other carriers 40, or to place the chip box 50 on other carriers 40 on the first carrier 41, the first transport device 20 can take out or place the chip box 50 on the first carrier 41 while lifting and lowering, further saving a lot of time.

[0055] In some embodiments, Fig.11As shown, the warehouse body 10 includes a first warehouse wall 11 and a second warehouse wall 12, the first warehouse wall 11 and the second warehouse wall 12 are perpendicular to the first direction y and spaced along the first direction y, and the first direction y is perpendicular to the up-down direction. The first warehouse wall 11 is provided with a first window 111, and the second warehouse wall 12 is provided with a second window 121. The second warehouse wall 12 is closer to the mobile platform 60 than the first warehouse wall 11. In other words, the distance from the first warehouse wall 11 to the mobile platform 60 is greater than the distance from the second warehouse wall 12 to the mobile platform 60. There is more space between the first warehouse wall 11 and the mobile platform 60 to set the carrier 40 and place the wafer box 50. The proximity of the mobile platform 60 to the second warehouse wall 12 means that the second handling device 30 on the mobile platform 60 is close to the second warehouse wall 12, and the second handling device 30 needs to travel less distance when sending the wafer out of the wafer storage through the second window 121. At the same time, the arm mechanism 22 does not need to have a long length to extend the wafer out of the second window 121, which can reduce the space occupied by the second handling device 30.

[0056] In some embodiments, Fig.11 As shown, the warehouse body 10 includes a third warehouse wall 13 and a fourth warehouse wall 14. The third warehouse wall 13 and the fourth warehouse wall 14 are perpendicular to the second direction x and spaced apart along the second direction x. The first direction y, the second direction x and the up-down direction are perpendicular to each other. The first carrier 41 is located between the third warehouse wall 13 and the second handling device 30 in the second direction x, and the calibration device 70 is located between the fourth warehouse wall 14 and the second handling device 30 in the second direction x. The first handling device 20 and the second handling device 30 need to interact with the first window 111 and the second window 121 in the first direction y, so the first carrier 41 and the calibration device 70 are arranged on both sides of the second handling device 30 in the second direction x. In other words, the first carrier 41 is close to the third warehouse wall 13, and the calibration device 70 is close to the fourth warehouse wall 14, which will not hinder the interaction between the handling device and the window.

[0057] In some embodiments, Fig.11As shown, the first carrier 41 is located at the corner formed by the second warehouse wall 12 and the third warehouse wall 13. The box opening of the wafer box 50 on the first carrier 41 is directly opposite to the second handling device 30. When the second handling device 30 takes the wafer out of the wafer box 50 on the first carrier 41, it is necessary to move the wafer from the box opening of the wafer box 50 toward the second handling device 30 by a certain distance until the projections of the wafer and the wafer box 50 on the horizontal plane do not overlap. In other words, the wafer needs to move a certain distance between the second handling device 30 and the wafer box 50 on the first carrier 41. Therefore, the distance between the second handling device 30 and the wafer box 50 on the first carrier 41 is at least greater than the diameter of the wafer. The distance between the second handling device 30 and the wafer box 50 on the first carrier 41 is the vertical distance from the axis of the connecting shaft between the main body 21 and the arm mechanism 22 to the end face of the box opening of the wafer box 50 on the first carrier 41. Under the premise that the warehouse body 10 is rectangular, when the first carrier 41 is set at the corner formed by the second warehouse wall 12 and the third warehouse wall 13, the distance between the second handling device 30 and the wafer box 50 on the first carrier 41 is the largest, and the wafers in the wafer box 50 can be taken out.

[0058] In some embodiments, Fig.12 As shown, the plurality of carriers 40 further include a second carrier 42, and the second handling device 30 is used to place defective wafers and / or sample wafers into a wafer box 50 on the second carrier 42, and the second carrier 42 is located at the corner of the second warehouse wall 12 and the fourth warehouse wall 14. Specifically, the second carrier 42 can be fixed on the second warehouse wall 12, or on the fourth warehouse wall 14, or can be set on the moving platform 60. As long as the distance between the wafer box 50 on the second carrier 42 and the second handling device 30 is at least greater than the diameter of the wafer, the wafer in the wafer box 50 on the second carrier 42 can be taken out. When the second carrier 42 is located at the corner of the second warehouse wall 12 and the fourth warehouse wall 14, there is enough space between the second handling device 30 and the wafer box 50 on the second carrier 42 to take out and put in the wafer. At the same time, the defective and / or sample wafers retrieved from the second window 121 only need to travel a short distance to be placed in the wafer box 50 on the second carrier 42.

[0059] In some embodiments, Fig.12 and Fig.13As shown, the second stage 42 is fixed to the warehouse body 10 and is located above the calibration device 70. The orthographic projection of the second stage 42 on the horizontal plane may partially overlap with the orthographic projection of the calibration device 70 on the horizontal plane, or may not overlap. When the mobile platform 60 is located at a position where the second handling device 30 can deliver or deliver wafers through the second window 121, the wafer on the calibration device 70 is higher than the lower edge of the second window 121, the wafer box 50 on the first stage 41 is higher than the calibration device 70, the wafer box 50 on the second stage 42 is higher than the wafer box 50 on the first stage 41, and the upper edge of the second window 121 is higher than the wafer box 50 on the second stage 42. The wafer box 50 on the first stage 41, the calibration device 70, and the wafer box 50 on the second stage 42 form an upper and lower interval and a left-right alternation. Under such an arrangement, the second handling device 30 has sufficient operating space when carrying wafers between the three, and the arm mechanism 22 can move between any two of the three. In some embodiments, the arm mechanism 22 can be raised and lowered relative to the main body 21 to enable the second handling device 30 to carry wafers between the wafer box 50 on the first stage 41, the calibration device 70 and the wafer box 50 on the second stage 42. Fig.14 As shown, a shaft 211 may be disposed inside the main body 21, and one end of the shaft 211 is rotatably connected to the arm mechanism 22. The shaft 211 may be driven to rise and fall relative to the main body 21, thereby driving the arm mechanism 22 and the relative moving platform 60 to rise and fall. The manner of driving the shaft 211 to rise and fall includes, but is not limited to, electric drive and hydraulic drive.

[0060] In some embodiments, Fig.15 As shown, the first stage 41 is provided with a first in-position sensor 80, wherein the first in-position sensor 80 is triggered in response to the wafer in the wafer box 50 on the first stage 41 not being in place. The first in-position sensor 80 can be set at the box mouth of the wafer box 50. The first in-position sensor 80 can include a transmitter 81 and a receiver 82. The transmitter 81 is used to emit a light beam 83 to the receiver 82, and the receiver is used to receive the light beam 83 emitted by the transmitter 81. After the wafer is placed in the wafer box 50, the wafer will not block the light beam 83 when the wafer is in place. If the wafer is not in place, for example, the wafer protrudes a little, it will block the light beam 83, and the receiver 82 cannot receive the light beam 83, the first in-position sensor 80 is triggered, and the control device can know that the wafer is not in place. In some embodiments, the second stage 42 is provided with a second in-position sensor, wherein the second in-position sensor is triggered in response to the wafer in the wafer box 50 on the second stage 42 not being in place. The second in-position sensor can adopt the same structure as the first in-position sensor 80.

[0061] In some embodiments, Fig.16As shown, the plurality of carriers 40 include a plurality of third carriers 43, and the plurality of third carriers 43 are supported on the first warehouse wall 11. The third carriers 43 may include a temporary storage platform and a storage platform. The positive projection of the temporary storage platform on the first warehouse wall 11 falls into the first window 111. The storage platform may be arranged above the temporary storage platform in a stacked manner in the height direction. The wafer box 50 sent from the external environment to the storage warehouse 100 through the first window 111 may be placed on the temporary storage platform first. The first handling device 20 may carry the wafer box 50 between the plurality of third carriers 43.

[0062] The present disclosure is described in more detail below in conjunction with specific examples. It should be noted that this example is only to help those skilled in the art understand the present disclosure, rather than to limit the present disclosure to the specific numerical values ​​or specific scenarios illustrated. Those skilled in the art can obviously make various equivalent modifications or changes based on the examples given below, and such modifications or changes also fall within the scope of the present disclosure.

[0063] In some embodiments, Figure 1a-Figure 16As shown, the wafer storage device includes a warehouse body 10, a first handling device 20, and a second handling device 30. The warehouse body 10 is a hollow rectangular cube. The storage space inside the warehouse body 10 is used as a storage warehouse 100. A plurality of carriers 40 are arranged in the storage warehouse 100. The plurality of carriers 40 are used to carry a wafer box 50. The wafer box 50 is used to store wafers. The warehouse body 10 includes a first warehouse wall 11, a second warehouse wall 12, a third warehouse wall 13, and a fourth warehouse wall 14. The first warehouse wall 11 and the second warehouse wall 12 are spaced along a first direction y, and the third warehouse wall 13 and the fourth warehouse wall 14 are spaced along a second direction x. A first window 111 is arranged on the first warehouse wall 11, and the wafer box 50 is sent into or out of the storage warehouse 100 through the first window 111. A plurality of third carriers 43 are also arranged on the first warehouse wall 11, wherein the third carriers 43 include a temporary storage table and a storage table. The orthographic projection of the temporary storage table on the first warehouse wall 11 falls into the first window 111. The storage table can be arranged above the temporary storage table in a stacked manner in the height direction. A second window 121 is arranged on the second warehouse wall 12, and the wafer is sent into or out of the storage warehouse 100 through the second window 121. The first handling device 20 and the second handling device 30 are arranged in the storage warehouse 100. The first handling device 20 is used to carry the wafer box 50 between the multiple carriers 40. The second handling device 30 is used to take the wafer out of the wafer box 50 and send the wafer out of the storage warehouse 100 through the second window 121, and to receive the wafer outside the storage warehouse 100 and send the wafer into the wafer box 50 in the storage warehouse 100 through the second window 121. The first handling device 20 and the second handling device 30 include an arm mechanism 22 and a main body 21 shared with each other. The arm mechanism 22 includes a plurality of connecting rods and joints. The first handling device 20 also includes a clamp for releasably fixing the wafer box 50, and the second handling device 30 also includes a tooth fork for releasably fixing the wafer. The clamping claw and the tooth fork are assembled together to form a fixing mechanism, and the two are arranged in a straight line and are facing away from each other. The fixing mechanism is connected to one end of the arm mechanism 22, and the main body 21 is connected to the other end of the arm mechanism 22. The main body 21 can drive the arm mechanism 22 to rotate, move and retract, thereby driving the fixing mechanism to reach a specified position. The chip storage device also includes a mobile platform 60 that can be lifted and lowered in the up and down directions. The first handling device 20 and the second handling device 30 are supported on the mobile platform 60. The mobile platform 60 includes a motor 601, a guide rail 602, and a slider 603. The guide rail 602 is arranged on the second warehouse wall 12, and the height of the guide rail 602 is lower than the second window 121. One end of the slider 603 on the guide rail 602 is connected to the screw in the guide rail 602, and the other end is connected to the first platform 604. The main body 21 is supported on the first platform 604. The motor 601 drives the screw in the guide rail 602 to rotate, and the rotating screw drives the slider 603 to move along the guide rail 602, thereby driving the first transport device 20 and the second transport device 30 on the first platform 604 to rise and fall in the height direction.The mobile platform 60 further includes a frame 605 supported on the first platform 604 and a second platform 606 and a third platform 607 located above the frame 605. The second platform 606 and the third platform 607 are higher than the first platform 604 and are located on both sides of the second handling device 30. A calibration device 70 and a first carrier 41 are also provided in the storage bin 100. The calibration device 70 is supported on the second platform 606. The first carrier 41 is supported on the third platform 607. The calibration device 70, the first carrier 41, the second handling device 30, and the second handling device 30 can be raised and lowered together on the mobile platform 60. The calibration device 70 is used to calibrate the wafers sent out or sent into the storage bin 100. A second carrier 42 is also provided in the storage bin 100, and the second handling device 30 is used to place defective wafers and / or sample wafers into the wafer box 50 on the second carrier 42. The second carrier 42 is fixed on the fourth bin wall 14 and is located above the calibrator. In a top view, the first stage 41 is located at a corner formed by the second warehouse wall 12 and the third warehouse wall 13, and the second stage 42 is located at a corner formed by the second warehouse wall 12 and the fourth warehouse wall 14. When the mobile platform 60 is located at a position where the second transport device 30 can deliver or deliver wafers through the second window 121, the wafers on the calibration device 70 are higher than the lower edge of the second window 121, the wafer box 50 on the first stage 41 is higher than the calibration device 70, the wafer box 50 on the second stage 42 is higher than the wafer box 50 on the first stage 41, and the upper edge of the second window 121 is higher than the wafer box 50 on the second stage 42. The first stage 41 is provided with a first in-position sensor 80, which is triggered in response to the wafers in the wafer box 50 on the first stage 41 not being in position. The second stage 42 is provided with a second in-position sensor, which is triggered in response to the wafers in the wafer box 50 on the second stage 42 not being in position. In the above embodiment, without increasing the volume of the wafer storage, a second transport device 30 for transporting wafers is provided inside the wafer storage, and the second transport device 30 and the first transport device 20 share the arm mechanism 22 and the main body 21, so there is no need to separately provide a transport device for transporting wafers in the process area outside the wafer storage. The first carrier 41 and the calibration device 70 are provided on the mobile platform 60, so that the first transport device 20, the second transport device 30, the first carrier 41 and the calibration device 70 are lifted and lowered together, thereby improving the space utilization inside the wafer storage and improving the transport efficiency of the wafer box 50 and the wafers.

[0064] It should be noted that the various elements described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0065] It should be understood that multiple components and / or parts can be provided by a single integrated component or part. Alternatively, a single integrated component or part can be divided into separate multiple components and / or parts. The disclosure "one" or "an" used to describe a component or part is not intended to exclude other components or parts.

[0066] It should be understood that although the terms "first" or "second" etc. may be used in the present disclosure to describe various elements (such as a first carrier and a second carrier), these elements are not defined by these terms, and these terms are only used to distinguish one element from another.

[0067] The basic principles of the present disclosure are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present disclosure are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present disclosure. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, and are not limitations. The above details do not limit the present disclosure to the necessity of adopting the above specific details to be implemented.

[0068] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A chip memory, characterized in that: include: A warehouse body is provided with a storage warehouse, a first window and a second window. The storage warehouse is provided with a plurality of carriers in the warehouse body. The plurality of carriers are used to carry wafer boxes. The wafer boxes are sent into or out of the storage warehouse through the first window. The wafer boxes are used to store wafers. The wafers are sent into or out of the storage warehouse through the second window. A first transport device, disposed in the storage bin, for transporting wafer boxes between the plurality of carriers; as well as The second handling device is arranged in the storage bin, and is used for taking out the wafer from the wafer box and sending the wafer through the second window to the process area outside the wafer storage device, and is used for receiving the wafer in the process area outside the wafer storage device and sending the wafer into the wafer box in the storage bin through the second window.

2. The chip memory according to claim 1, characterized in that: A calibration device is provided in the storage bin, and the calibration device is used to perform calibration processing on the wafers sent out of or into the storage bin.

3. The chip memory according to claim 2, characterized in that: It also includes a moving platform that moves in the up and down directions, and the second transport device and the calibration device are supported on the moving platform to be lifted and lowered together.

4. The chip memory according to claim 3, characterized in that: The plurality of carriers include a first carrier, the second transport device is used to take out or put a wafer into a wafer box on the first carrier, and the first carrier is supported on the moving platform to be lifted and lowered together with the second transport device and the calibration device.

5. The chip memory according to claim 4, characterized in that: The warehouse body includes a first warehouse wall and a second warehouse wall, the first warehouse wall and the second warehouse wall are perpendicular to a first direction and spaced along the first direction, the first direction is perpendicular to the up and down direction, the first warehouse wall is provided with the first window, the second warehouse wall is provided with the second window, and the second warehouse wall is closer to the mobile platform than the first warehouse wall.

6. The chip memory according to claim 5, characterized in that: The warehouse body includes a third warehouse wall and a fourth warehouse wall, the third warehouse wall and the fourth warehouse wall are perpendicular to the second direction and spaced along the second direction, the first direction, the second direction and the up and down directions are perpendicular to each other, the first platform is located between the third warehouse wall and the second transport device in the second direction, and the calibration device is located between the fourth warehouse wall and the second transport device in the second direction.

7. The chip memory according to claim 6, characterized in that: The first carrier is located at a corner formed by the second warehouse wall and the third warehouse wall.

8. The chip memory according to claim 7, characterized in that: The plurality of carriers further include a second carrier, the second transport device is used to place defective wafers and / or sample wafers into a wafer box on the second carrier, and the second carrier is located at a corner of the second warehouse wall and the fourth warehouse wall.

9. The chip memory according to claim 8, characterized in that: The second carrier is fixed to the warehouse body and is located above the calibration device; when the mobile platform is located at a position where the second transport device can deliver wafers into or out through the second window, the wafer on the calibration device is higher than the lower edge of the second window, the wafer box on the first carrier is higher than the calibration device, the wafer box on the second carrier is higher than the wafer box on the first carrier, and the upper edge of the second window is higher than the wafer box on the second carrier.

10. The chip memory according to claim 8, characterized in that: The first stage is provided with a first in-position sensor, wherein the first in-position sensor is triggered in response to a wafer in a wafer box on the first stage not being in position; and / or the second stage is provided with a second in-position sensor, wherein the second in-position sensor is triggered in response to a wafer in a wafer box on the second stage not being in position.

11. The chip memory according to claim 5, characterized in that: The plurality of carriers include a plurality of third carriers supported on the first warehouse wall.

12. The chip memory according to claim 1, characterized in that: It also includes a mobile platform that moves in the up and down directions, the first transport device includes a first fixing mechanism, the first fixing mechanism is used to releasably fix the chip box, the second transport device includes a second fixing mechanism, the second fixing mechanism is used to releasably fix the chip, the first transport device and the second transport device include an arm mechanism that is shared with each other, one end of the arm mechanism is supported on the mobile platform, and the other end of the arm mechanism is connected to the first fixing mechanism and the second fixing mechanism.

13. The chip memory according to claim 12, characterized in that: The first fixing mechanism and the second fixing mechanism are assembled together to form a fixing mechanism, and the fixing mechanism is rotatably connected to the other end of the arm mechanism around a rotation axis. The first fixing mechanism and the second fixing mechanism are arranged along a straight line and both face away from each other.

14. The chip memory according to claim 12, characterized in that: The warehouse body includes a first warehouse wall and a second warehouse wall, the first warehouse wall and the second warehouse wall are perpendicular to a first direction and spaced along the first direction, the first direction is perpendicular to the up-down direction, the first warehouse wall is provided with the first window, and the second warehouse wall is provided with the second window; in a plane view perpendicular to the first direction, the second window is higher than the first window; in a plane view perpendicular to the up-down direction, a reference straight line extending along the first direction and intersecting the main axis of the arm mechanism passes through the first window and the second window.

Images