Wafer processing equipment

Abstract

The invention relates to the technical field of semiconductor device manufacturing, and particularly discloses wafer processing equipment which comprises a main body mechanism, a workbench, a processing mechanism, a bearing mechanism, a winding mechanism and a UV film, the main body mechanism comprises a machine body, the upper portion of the machine body is connected with a machine cover through a hinge, and a charging barrel mechanism used for being connected with a film in a sleeving mode is installed on the upper portion of the machine body. Through mutual cooperation of the main body mechanism, the film pasting table disc, the workbench, the charging barrel mechanism, the machine cover, the processing mechanism and the bearing mechanism, when machining is needed, a driving hand lever is held by hand and pushed, then a circle cutting assembly is rotated so that a bottom circle cutting knife can conduct circle cutting on a UV film, then the circle cutting assembly can be reset, and a bearing block can be pulled out; therefore, the operation is more convenient and quicker, the time is saved, the processing efficiency is improved, the waste film can be rolled for later use, the operation of unfolding the UV film can be simplified, and the operation is further simplified.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor device manufacturing, and in particular relates to wafer processing equipment. Background Art

[0002] Wafer processing equipment includes but is not limited to photolithography machines, etching machines, wafer thinning machines, wafer dicing machines, wafer bonding machines and wafer film bonding machines. Wafer film bonding machines are equipment used to bond films to the surface of wafers during wafer processing. Their main function is to bond thin film materials (such as blue films, UV films, PET substrate films, etc.) to the surface of wafers to protect the wafers from contamination, oxidation or other damage. These films can cover the wafers and fit closely to them, providing a protective barrier.

[0003] In the Chinese patent with publication number CN115588642A, a manual wafer film mounting machine is mentioned, comprising a housing, wherein a first cover is movably connected to the middle position of the housing in the length direction, and a second cover is movably connected to the rear side of the housing, and a working table mechanism and a film mounting plate mechanism located below the first cover, a roller mechanism located between the first cover and the second cover, and a barrel mechanism located below the second cover are arranged on the inner side of the housing, and a circular cutting knife mechanism located above the working table mechanism and the film mounting plate mechanism is installed on the first cover; the beneficial effects of the present invention are as follows: the film mounting plate mechanism is used to place wafers of different sizes, the roller mechanism can not only firmly attach the film to the wafer, but also cut the film in the horizontal direction, the barrel mechanism is used to roll up the new film and the release film, and can separate the release film on the new film, and the circular cutting knife mechanism can cut the film in the circumferential direction, so that the manual wafer film mounting machine is convenient for the staff to operate and improves the working efficiency of film mounting;

[0004] The above-mentioned comparative documents and the existing manual wafer laminating machines, when used, all require opening the protective cover, placing the wafer on top of the suction cup, and starting to adsorb the wafer, then pulling one end of the film to the top of the wafer and covering it, and then rolling the film to fit tightly to the surface of the wafer, and then closing the protective cover, and rotating the rotating handle on the protective cover so that the circular cutting mechanism in the protective cover cuts the film, and finally the cross-cutting mechanism of the laminating machine cuts off the coated part, and then the protective cover is opened to remove the waste film, completing the laminating of the wafer; therefore, repeatedly closing the protective cover during operation will not only cause the quality of laminating to deteriorate due to environmental factors, but also has certain complexity in operation, which increases a certain amount of time cost. In addition, since the waste film is removed manually, the waste film cannot be collected in a centralized manner, which is inconvenient for later use. Summary of the invention

[0005] The purpose of the present invention is to provide a wafer processing equipment to solve the problems existing in the prior art.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A wafer processing equipment comprises a main mechanism, a workbench, a processing mechanism, a receiving mechanism, a winding mechanism and a UV film, wherein the main mechanism comprises a machine body, a cover is connected to the machine body through a hinge, a barrel mechanism for sleeve film is installed on the machine body, the processing mechanism is installed inside the cover, and a film sticking table for positioning wafers is installed in an embedded manner on the workbench; the processing mechanism comprises a side plate, a linkage assembly, a rolling assembly, a limiting assembly, and a circular cutting assembly, wherein the side plate is used to guide the linkage assembly and the rolling assembly, the limiting assembly is used to guide the circular cutting assembly, the linkage assembly is used to connect the rolling assembly and the circular cutting assembly, the rolling assembly is used to roll UV film, and the circular cutting assembly is used to cut UV film; the receiving mechanism comprises a receiving block and a second rack, wherein the receiving block is used to receive the workbench and the film sticking table, and the second rack is used to drive the winding mechanism; the winding mechanism comprises a supporting plate and a winding roller, wherein the supporting plate is fixedly connected to the top of the machine body, and the winding roller is used to wind up the waste film after circular cutting.

[0008] Preferably: the limiting component penetrates and fixes the machine cover, the limiting component includes a limiting block, the limiting block is provided with a through slot penetrating from top to bottom, one end of the through slot is provided with a groove, the circle cutting component includes a connecting column and a sleeve block, the connecting column penetrates the sleeve block, the sleeve block is slidably connected to the inside of the through slot, the sleeve block fits into the groove, the connecting column is located inside the sleeve block and is fixedly connected with a connecting ring, a bearing is installed on the periphery of the connecting ring, and the periphery of the bearing is fixedly connected to the sleeve block.

[0009] Preferably: the linkage assembly includes a longitudinal plate and a linkage longitudinal plate, the rolling assembly includes a support frame and a film pressing roller, a limiting column is fixedly connected to the top of the support frame, the limiting column passes through the linkage longitudinal plate, a spring 1 is surrounded by the periphery of the limiting column, the spring 1 is located above the linkage longitudinal plate, the opposite sides of the side plates are fixedly connected with a transverse slide rail and a limiting slide rail, the limiting slide rail is a special-shaped rail, consisting of a transverse middle and vertical directions at both ends.

[0010] Preferably: the longitudinal plate is rotatably connected by a connecting column, and both ends of the longitudinal plate and the linked longitudinal plate are slidably connected to the inside of the transverse slide rail, and both ends of the film pressing roller are fixedly connected with a convex rod, and the film pressing roller is rotatably connected to the bottom of the support frame through the convex rod, and the convex rod is slidably connected to the inside of the limiting slide rail.

[0011] Preferably: a rack is fixedly connected to the top of the transverse slide rail, both ends of the longitudinal plates are rotatably connected to drive links, one end of the drive link away from the longitudinal plate is rotatably connected to a linkage link, one end of the linkage link away from the drive link is rotatably connected to both ends of the linkage longitudinal plate, and a gear is fixedly connected to the longitudinal plate where the drive link is rotatably connected, and the gear fits with the rack.

[0012] Preferably: the machine body is provided with a pull-out groove, the inner wall of the pull-out groove is provided with a track assembly, the track assembly is located on both sides of the receiving block, the receiving block is slidably connected to the inside of the pull-out groove through the track assembly, the receiving block is provided with a receiving groove at one end close to the machine body, two receiving connecting rods are rotatably connected to both sides of the workbench, and the lower ends of the receiving connecting rods are rotatably connected to the inner wall of the receiving groove.

[0013] Preferably: the winding roller is rotatably connected to one side of the support plate, and one end of the winding roller located inside the support plate is fixedly connected to gear 2, and a one-way gear is meshedly connected below gear 2, and the one-way gear is rotatably connected between the support plate and the inside of the machine body, a slide groove is provided above the receiving block, and rack 2 is slidably connected to the inside of the slide groove, and rack 2 cooperates with the bottom of the one-way gear.

[0014] Preferably: two springs evenly arranged and distributed are fixedly connected below the second rack, the UV film surrounds the periphery of the new film cylinder, a waste film cylinder is arranged at one end of the UV film away from the new film cylinder, and the waste film cylinder is fixedly sleeved on the periphery of the winding roller.

[0015] Preferably: a notch is provided at the bottom of the receiving groove, the notch is used for connecting the film sticking table to the pump body inside the machine body, and a buckle is provided at one end of the receiving block away from the machine body, and the buckle is installed on both sides of the receiving block.

[0016] Preferably, a transverse connecting rod is fixedly connected to the bottom of the connecting column, circular cutting knives are rotatably connected to both ends of the connecting rod, and a driving hand rod is fixedly connected to the top of the connecting column.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The present invention cooperates with each other through the main body mechanism, film laminating table, workbench, barrel mechanism, machine cover, processing mechanism and receiving mechanism. When in use, the wafer can be placed on the top of the film laminating table and the film laminating table is started through the control panel. After the receiving block is pushed into the machine body, the driving hand lever is held and pushed to rotate the circular cutting assembly so that the bottom circular cutting knife can cut the UV film into a circle. Then, the circular cutting assembly can be reset and the receiving block can be pulled out, thereby making the operation more convenient and quick, saving time and improving processing efficiency.

[0019] 2. The present invention cooperates with the receiving mechanism and the winding mechanism, so that the UV film can be rolled up by the winding roller during the process of pulling out the receiving block, and the new UV film can be unfolded. This not only allows the waste film to be rolled up for later use, but also simplifies the operation of unfolding the UV film, further simplifying the operation.

[0020] 3. The present invention provides a winding mechanism, which can sleeve a new film tube inside the barrel mechanism when used for the first time, unfold the UV film on the outer periphery of the new film tube for the first time and adhere its end to the outer periphery of the waste film tube, then sleeve the waste film tube on the outer periphery of the winding roller, and then close the machine cover to avoid opening the machine cover repeatedly, thereby avoiding the external environment from causing the UV film to move and affecting the wafer, thereby ensuring and maintaining the quality of film pasting. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional diagram of the wafer processing equipment of the present invention;

[0022] Figure 2 A three-dimensional diagram of the wafer processing equipment of the present invention when in use;

[0023] Figure 3 A three-dimensional diagram of the wafer processing equipment of the present invention during maintenance;

[0024] Figure 4 It is a structural schematic diagram of the receiving mechanism of the present invention;

[0025] Figure 5 For the present invention Figure 4 A cross-sectional view of the structure in the middle;

[0026] Figure 6 It is a structural schematic diagram of the winding mechanism of the present invention;

[0027] Figure 7 It is a structural schematic diagram of the processing mechanism of the present invention;

[0028] Figure 8 For the present invention Figure 7 Schematic diagram of the structure of the middle linkage assembly and the roller pressing assembly;

[0029] Fig. 9 For the present invention Figure 7 Schematic diagram of the structure of the middle limit component and the cutting circle component;

[0030] Fig.10 For the present invention Fig. 9 A magnified view of the displacement of part A.

[0031] In the figure:

[0032] 1. Main body; 11. Machine body; 12. Drawer slot;

[0033] 2. Film sticking table; 3. Workbench; 4. Barrel mechanism; 5. Machine cover;

[0034] 6. Processing mechanism; 61. Side plate; 62. Transverse slide rail; 63. Rack 1; 64. Limiting slide rail;

[0035] 65, linkage assembly; 651, longitudinal plate; 652, driving connecting rod; 653, gear 1; 654, linkage connecting rod; 655, linkage longitudinal plate;

[0036] 66, rolling assembly; 661, support frame; 662, limiting column; 663, spring 1; 664, film pressing roller; 665, convex rod;

[0037] 67, limiting assembly; 671, limiting block; 672, through slot; 673, groove;

[0038] 68, circle cutting assembly; 681, connecting column; 682, connecting ring; 683, sleeve block; 684, bearing; 685, driving handle; 686, connecting rod; 687, circle cutting knife;

[0039] 7. receiving mechanism; 71. receiving block; 72. receiving groove; 73. notch; 74. slide groove; 75. buckle; 76. receiving connecting rod; 77. rack 2; 78. spring 2; 79. track assembly;

[0040] 8. Winding mechanism; 81. Support plate; 82. Winding roller; 83. Gear 2; 84. One-way gear;

[0041] 9. UV film; 91. New film tube; 92. Waste film tube. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] Reference Figure 1-Figure 10 As shown, the present invention provides a wafer processing device, including a main mechanism 1, a workbench 3, a processing mechanism 6, a receiving mechanism 7, a winding mechanism 8 and a UV film 9; the main mechanism 1 includes a body 11, a cover 5 is connected to the upper part of the body 11 through a hinge, a barrel mechanism 4 for sleeve film is installed on the upper part of the body 11, the processing mechanism 6 is installed inside the cover 5, and a film sticking table 2 for positioning wafers is installed in an embedded manner on the upper part of the workbench 3;

[0044] The processing mechanism 6 includes a side plate 61, a linkage assembly 65, a rolling assembly 66, a limiting assembly 67, and a circular cutting assembly 68. The side plate 61 is used to guide the linkage assembly 65 and the rolling assembly 66. The limiting assembly 67 is used to guide the circular cutting assembly 68. The linkage assembly 65 is used to connect the rolling assembly 66 and the circular cutting assembly 68. The rolling assembly 66 is used to roll the UV film 9, and the circular cutting assembly 68 is used to cut the UV film 9.

[0045] The receiving mechanism 7 includes a receiving block 71 and a second rack 77. The receiving block 71 is used to receive the workbench 3 and the film laminating table 2, and the second rack 77 is used to drive the winding mechanism 8.

[0046] The winding mechanism 8 includes a support plate 81 and a winding roller 82. The support plate 81 is fixedly connected to the top of the machine body 11, and the winding roller 82 is used to wind up the waste film after cutting into a circle.

[0047] Reference Figure 7-10 In a further embodiment, the limiting component 67 passes through the fixed machine cover 5, and the limiting component 67 includes a limiting block 671. The limiting block 671 is provided with a through slot 672 that passes through from top to bottom, and a groove 673 is provided at one end of the through slot 672. The circle cutting component 68 includes a connecting column 681 and a sleeve block 683. The connecting column 681 passes through the sleeve block 683, and the sleeve block 683 is slidably connected to the inside of the through slot 672. The sleeve block 683 fits into the groove 673. The connecting column 681 is located inside the sleeve block 683 and is fixedly connected with a connecting ring 682. A bearing 684 is installed on the periphery of the connecting ring 682, and the periphery of the bearing 684 is fixedly connected to the sleeve block 683.

[0048] In this embodiment, the coupling post 681 will not affect the sleeve block 683 when rotating, and the sleeve block 683 is only used to engage the groove 673 and limit its sliding connection inside the through groove 672.

[0049] Reference Figure 7-Figure 8 In a further embodiment, the linkage assembly 65 includes a longitudinal plate 651 and a linkage longitudinal plate 655, the rolling assembly 66 includes a support frame 661 and a film pressing roller 664, a limiting column 662 is fixedly connected above the support frame 661, the limiting column 662 passes through the linkage longitudinal plate 655, a spring 663 is surrounded by the periphery of the limiting column 662, and the spring 663 is located above the linkage longitudinal plate 655, and the opposite sides of the side plate 61 are fixedly connected with a transverse slide rail 62 and a limiting slide rail 64, and the limiting slide rail 64 is a special-shaped track, which is composed of a horizontal middle and vertical directions at both ends.

[0050] In this embodiment, the top end of the limiting column 662 is a limiting disk, and the upper end of a spring 663 is located below the limiting disk, which is mainly used to lift the support frame 661, the film pressing roller 664 and the protruding rod 665 when the protruding rod 665 reaches the track that limits the vertical direction of the slide rail 64, so that the film pressing roller 664 cannot temporarily contact the film.

[0051] Reference Figure 7-Figure 8 In a further embodiment, the longitudinal plate 651 is rotatably connected by the connecting column 681, and both ends of the longitudinal plate 651 and the linked longitudinal plate 655 are slidably connected to the inside of the transverse slide rail 62. The two ends of the film pressing roller 664 are fixedly connected with the protruding rod 665. The film pressing roller 664 is rotatably connected to the bottom of the support frame 661 through the protruding rod 665, and the protruding rod 665 is slidably connected to the inside of the limiting slide rail 64.

[0052] In this embodiment, the longitudinal plate 651 is also used to support the circle cutting assembly 68 so that the circle cutting assembly 68 can rotate normally; the transverse slide rail 62 is used to limit the sliding direction of the linkage assembly 65 and the rolling assembly 66; the film pressing roller 664 is made of the same material as the existing manual pressing roller and has a certain degree of softness, thereby avoiding damage to the wafer during rolling.

[0053] Reference Figure 7-Figure 8 In a further embodiment, a rack 63 is fixedly connected to the top of the transverse slide rail 62, and driving links 652 are rotatably connected to both ends of the longitudinal plate 651. The end of the driving link 652 away from the longitudinal plate 651 is rotatably connected to a linkage link 654, and the end of the linkage link 654 away from the driving link 652 is rotatably connected to both ends of the linkage longitudinal plate 655. The driving link 652 is rotatably connected to the longitudinal plate 651 and is fixedly connected to a gear 653, and the gear 653 fits with the rack 63.

[0054] In this embodiment, the bottom of one end of the driving link 652 close to the longitudinal plate 651 is movably connected to the longitudinal plate 651 through a vertical plug rod, and the gear 1 653 is coaxial with the plug rod. Therefore, when the gear 1 653 is passively rotated due to the engagement with the rack 1 63, the driving link 652 is also rotated, thereby increasing the distance between the longitudinal plate 651 and the linkage longitudinal plate 655, and vice versa.

[0055] Reference Figure 1-Figure 4 In a further embodiment, the machine body 11 is provided with a pull-out groove 12, and the inner wall of the pull-out groove 12 is provided with a track assembly 79, the track assembly 79 is located on both sides of the receiving block 71, and the receiving block 71 is slidably connected to the inside of the pull-out groove 12 through the track assembly 79. A receiving groove 72 is provided at one end of the receiving block 71 close to the machine body 11, and two receiving connecting rods 76 are rotatably connected to both sides of the workbench 3, and the lower ends of the receiving connecting rods 76 are rotatably connected to the inner wall of the receiving groove 72.

[0056] In this embodiment, the track assembly 79 is composed of a slide rail and a slideway, wherein the slide rail is installed on the inner wall of the pull-out groove 12, and the slideway is installed with the receiving block 71; the receiving groove 72 is used to receive the workbench 3 and the film-sticking plate 2 after they have been lowered, and the upper end surfaces of the workbench 3 and the film-sticking plate 2 after they have been lowered are lower than the end surface of the receiving block 71, so as to facilitate the receiving block 71 to carry the workbench 3 and the film-sticking plate 2, as well as the wafer installed above the film-sticking plate 2 when being pulled out.

[0057] Reference Figure 4-Figure 6 In a further embodiment, the winding roller 82 is rotatably connected to one side of the support plate 81, and one end of the winding roller 82 located inside the support plate 81 is fixedly connected to a second gear 83, and a one-way gear 84 is meshed and connected below the second gear 83. The one-way gear 84 is rotatably connected between the support plate 81 and the inside of the machine body 11, and a slide groove 74 is provided above the receiving block 71, and a second rack 77 is slidably connected to the inside of the slide groove 74, and the second rack 77 cooperates with the bottom of the one-way gear 84.

[0058] In this embodiment, the one-way gear 84 is composed of a ratchet and a peripheral gear ring, so that the one-way gear 84 can only rotate in one direction. There are clamps and springs between the gear ring and the ratchet, and the ratchet is fixed inside the body 11.

[0059] Reference Figure 3-Figure 5 In a further embodiment, a spring 2 78 which is evenly arranged and distributed is fixedly connected to the lower part of the rack 2 77 , the UV film 9 is surrounded by the periphery of the new film cylinder 91 , and a waste film cylinder 92 is provided at one end of the UV film 9 away from the new film cylinder 91 , and the waste film cylinder 92 is fixedly sleeved on the periphery of the winding roller 82 .

[0060] In this embodiment, since the one-way gear 84 can only rotate in one direction clockwise, when the rack 2 77 moves to the right, the one-way gear 84 cannot rotate and continuously squeezes the rack 2 77, so that the rack 2 77 slides to the inside of the slide groove 74. During this process, the spring 2 78 is always used to reset and push the rack 2 77 upward until the receiving block 71 moves the rack 2 77 to the left again, and the rack 2 77 can mesh with the one-way gear 84 again; the new film cylinder 91 is the state of the UV film 9 after it is initially curled, and the new film cylinder 91 is connected to the barrel mechanism 4, and the waste film cylinder 92 is fixedly connected to the winding roller 82, so after the winding roller 82 rotates, the new UV film 9 is continuously unfolded to the top of the film sticking table 2.

[0061] Reference Figure 1-Figure 3 In a further embodiment, a notch 73 is provided at the bottom of the receiving groove 72, and the notch 73 is used to connect the film-sticking plate 2 to the pump body inside the machine body 11. A buckle 75 is provided at one end of the receiving block 71 away from the machine body 11, and the buckle 75 is installed on both sides of the receiving block 71.

[0062] In this embodiment, a control panel is provided at the front end of the machine body 11, and an air pump is provided at the bottom of the control panel, which is connected to the bottom of the film-sticking plate 2 through a hose, so that negative pressure is generated above the film-sticking plate 2 to fix the wafer.

[0063] Reference Fig.10 In a further embodiment, a transverse connecting rod 686 is fixedly connected to the bottom of the connecting column 681, and circular cutting knives 687 are rotatably connected to both ends of the connecting rod 686. A driving handle 685 is fixedly connected to the top of the connecting column 681.

[0064] In this embodiment, the connecting rod 686 and the circular cutting knife 687 are both existing technologies and are used to perform circular cutting on the UV film 9; the driving handle 685 is a rotating handle for the convenience of the staff to rotate.

[0065] The working principle of the present invention is as follows:

[0066] When starting to use it, first, by unfastening the buckle 75, the receiving block 71 can be pulled out from the inside of the pull-out slot 12, and the wafer is placed on the top of the film-sticking table 2, and then the film-sticking table 2 is started through the control panel to generate negative pressure to adsorb and fix the wafer, and then the receiving block 71 is re-inserted into the inside of the pull-out slot 12. At this time, the workbench 3 with the film-sticking table 2 will also re-enter the inside of the pull-out slot 12, and due to the contact between the workbench 3 and the pull-out slot 12, the workbench 3 with the film-sticking table 2 will be lifted to a certain height, so that the wafer is coplanar with the upper surface of the machine body 11. After completion, the position of the receiving block 71 is re-positioned by connecting it with the machine body 11 through the buckle 75; secondly, the machine cover 5 is opened, and the new film cylinder 91 is installed on the roller of the barrel mechanism 4, and then the UV film 9 on the outer periphery of the new film cylinder 91 is unfolded and one end of it is glued and fixed to the outer periphery of the waste film cylinder 92, and then The waste film cylinder 92 is fixedly sleeved on the outer periphery of the winding roller 82, and finally the machine cover 5 is closed to the top of the machine body 11. At this time, the UV film 9 is located within a height of five millimeters above the wafer. Finally, the staff can hold the driving handle 685 and push it, so that the sleeve block 683 and the objects inside it slide inside the through groove 672 until the sleeve block 683 is snapped into the inside of the groove 673. At this time, the driving handle 685 is selected again, so that the circular cutting knife 687 rotates around the connecting column 681 as the axis through the connecting column 681 and the connecting rod 686, thereby completing the circular cutting operation; finally, after completing the circular cutting operation, the driving handle 685 can be pulled out to make the sleeve block 683 return to the sliding range of the through groove 672, and the sleeve block 683 is pulled back to the initial position, and finally the buckle 75 is unlocked to pull out the receiving block 71, and the adsorption of the film pasting plate 2 is turned off to take out the wafer after film pasting.

[0067] After the above-mentioned circle cutting operation is completed, when the buckle 75 is unlocked and the receiving block 71 is pulled out, that is, when the receiving block 71 moves to the left, the one-way gear 84 will rotate clockwise through the rack 2 77, thereby making the gear 2 83 rotate counterclockwise, and then the winding roller 82 will also rotate clockwise synchronously, so that the winding roller 82 can rewind the UV film 9 after the circle cutting through the waste film cylinder 92; when the receiving block 71 is pushed again to make it re-enter the interior of the drawing groove 12 with the workbench 3 and the film pasting table 2, that is, when the receiving block 71 moves to the right, it will first slide smoothly, and then the right side of the workbench 3 will contact the inner wall of the drawing groove 12, but due to The staff continuously pushes the receiving block 71 to move rightward, thereby squeezing the workbench 3, and then lifting the workbench 3 and the film-sticking plate 2 by a certain distance through the receiving connecting rod 76. Due to the length limit of the receiving connecting rod 76, the wafer fixed above the film-sticking plate 2 is just coplanar with the upper surface of the machine body 11. At this time, since the one-way gear 84 is one-way, the one-way gear 84 cannot rotate and squeezes the rack 2 77, so that the rack 2 77 slides into the inside of the slide groove 74 until the receiving block 71 stops moving right. The rack 2 77 will re-engage with the one-way gear 84 under the rebound action of the spring 2 78.

[0068] When the cover 5 is closed to the top of the body 11, the side plates 61 will be located on both sides of the UV film 9, while the film pressing roller 664 and the circular cutting knife 687 are in a suspended state and do not contact the UV film 9. However, when the user holds the driving handle 685 to push, that is, when it moves to the right, the longitudinal plate 651 can be moved to the right through the connecting column 681, and in the process of moving to the right, the gear 1 653 on the right side of both ends will mesh with the rack 1 63 and passively rotate the gear 1 653 clockwise, so that the driving connecting rod 652 rotates together with the gear 1 653 as the center through the linkage connecting rod. The transmission of 654 allows the linkage longitudinal plate 655 to move right as well, so that the longitudinal plate 651 and the linkage longitudinal plate 655 will move right synchronously, and the distance between the two will increase during the process. At the same time, the film pressing roller 664 rotatably connected to the support frame 661 below the linkage longitudinal plate 655 slides inside the limiting slide rail 64 through the convex rod 665, so that the film pressing roller 664 contacts the upper surface of the UV film 9 at the beginning of the synchronous rightward movement and presses the UV film 9 downward, so that the UV film 9 is closely attached to the surface of the wafer. When the gear 1 653 is not engaged with the rack 1 63, the convex rod 665 65 and the longitudinal plate 651 are spaced greater than the radius of the wafer, at which point the film pressing roller 664 completes the rolling of the UV film 9 so that the UV film 9 is closely attached to the wafer; and when the gear 1 653 is not meshed with the rack 1 63, the connecting column 681 will also move to the center of the film laminating table 2, and the sleeve block 683 will also be clamped from the through slot 672 to the inside of the groove 673, that is, the entire circular cutting assembly 68 is moved down a certain distance, so that the circular cutting knife 687 is in contact with the UV film 9, and at this time, the driving hand lever 685 is selected to make the connecting column 681 carry the connecting rod 686 with the circular cutting knife 6 87 rotates with the center of the film laminating table 2 to complete the circle cutting of the UV film 9; after completing the circle cutting, pull the driving hand rod 685 so that the circle cutting knife 687 no longer contacts the UV film 9, and let the sleeve block 683 return to the sliding range of the through groove 672, and pull the driving hand rod 685 to make the circle cutting assembly 68 move to the left as a whole, at this time, the gear 1 653 will re-engage with the rack 1 63 to shorten the distance between the longitudinal plate 651 and the linkage longitudinal plate 655, and the film pressing roller 664 will roll the UV film 9 again until the connecting column 681 returns to the initial position and is located on the right side of the winding roller 82.

[0069] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer processing device, comprising a main body mechanism (1), a workbench (3), a processing mechanism (6), a receiving mechanism (7), a winding mechanism (8) and a UV film (9), characterized in that: The main mechanism (1) comprises a machine body (11), a cover (5) is connected to the upper part of the machine body (11) via a hinge, a barrel mechanism (4) for sleeve film is installed on the upper part of the machine body (11), the processing mechanism (6) is installed inside the cover (5), and a film sticking table (2) for positioning wafers is installed in an embedded manner on the upper part of the workbench (3); The processing mechanism (6) comprises a side plate (61), a linkage assembly (65), a rolling assembly (66), a limiting assembly (67), and a cutting assembly (68), wherein the side plate (61) is used to guide the linkage assembly (65) and the rolling assembly (66), the limiting assembly (67) is used to guide the cutting assembly (68), the linkage assembly (65) is used to connect the rolling assembly (66) and the cutting assembly (68), the rolling assembly (66) is used to roll the UV film (9), and the cutting assembly (68) is used to cut the UV film (9); The receiving mechanism (7) comprises a receiving block (71) and a second rack (77), wherein the receiving block (71) is used to receive the workbench (3) and the film pasting table (2), and the second rack (77) is used to drive the winding mechanism (8); The winding mechanism (8) comprises a support plate (81) and a winding roller (82), wherein the support plate (81) is fixedly connected to the top of the machine body (11), and the winding roller (82) is used to wind up the waste film after cutting into a circle.

2. The wafer processing equipment according to claim 1, characterized in that: The limiting component (67) penetrates and fixes the machine cover (5), and the limiting component (67) includes a limiting block (671). The limiting block (671) is provided with a through groove (672) penetrating from top to bottom, and a groove (673) is provided at one end of the through groove (672). The circle cutting component (68) includes a connecting column (681) and a sleeve block (683). The connecting column (681) penetrates the sleeve block (683), and the sleeve block (683) is slidably connected to the inside of the through groove (672). The sleeve block (683) fits into the groove (673). The connecting column (681) is located inside the sleeve block (683) and is fixedly connected with a connecting ring (682). A bearing (684) is installed on the periphery of the connecting ring (682), and the periphery of the bearing (684) is fixedly connected to the sleeve block (683).

3. The wafer processing equipment according to claim 1, characterized in that: The linkage assembly (65) includes a longitudinal plate (651) and a linkage longitudinal plate (655); the rolling assembly (66) includes a support frame (661) and a film pressing roller (664); a limiting column (662) is fixedly connected to the top of the support frame (661); the limiting column (662) passes through the linkage longitudinal plate (655); a spring (663) is surrounded by the periphery of the limiting column (662); the spring (663) is located above the linkage longitudinal plate (655); the opposite sides of the side plate (61) are fixedly connected to a transverse slide rail (62) and a limiting slide rail (64); the limiting slide rail (64) is a special-shaped rail, which is composed of a transverse middle and vertical directions at both ends.

4. The wafer processing equipment according to claim 3, characterized in that: The longitudinal plate (651) is rotatably connected by a connecting column (681), and both ends of the longitudinal plate (651) and the linked longitudinal plate (655) are slidably connected to the inside of the transverse slide rail (62). Both ends of the film pressing roller (664) are fixedly connected with a protruding rod (665), and the film pressing roller (664) is rotatably connected to the bottom of the support frame (661) through the protruding rod (665), and the protruding rod (665) is slidably connected to the inside of the limiting slide rail (64).

5. The wafer processing equipment according to claim 4, characterized in that: A rack (63) is fixedly connected to the top of the transverse slide rail (62), and driving links (652) are rotatably connected at both ends of the longitudinal plate (651). The end of the driving link (652) away from the longitudinal plate (651) is rotatably connected to a linkage link (654), and the end of the linkage link (654) away from the driving link (652) is rotatably connected to the two ends of the linkage longitudinal plate (655). The driving link (652) is rotatably connected to the longitudinal plate (651) and is fixedly connected to a gear (653), and the gear (653) fits with the rack (63).

6. The wafer processing equipment according to claim 1, characterized in that: The machine body (11) is provided with a drawer groove (12), and the inner wall of the drawer groove (12) is provided with a track assembly (79), and the track assembly (79) is located on both sides of the receiving block (71), and the receiving block (71) is slidably connected to the inside of the drawer groove (12) through the track assembly (79), and a receiving groove (72) is provided at one end of the receiving block (71) close to the machine body (11), and two receiving connecting rods (76) are rotatably connected to the two sides of the workbench (3), and the lower ends of the receiving connecting rods (76) are rotatably connected to the inner wall of the receiving groove (72).

7. The wafer processing equipment according to claim 1, characterized in that: The winding roller (82) is rotatably connected to one side of the support plate (81); one end of the winding roller (82) located inside the support plate (81) is fixedly connected to a second gear (83); a one-way gear (84) is meshedly connected below the second gear (83); the one-way gear (84) is rotatably connected to the support plate (81) and the inside of the machine body (11); a sliding groove (74) is provided above the receiving block (71); the second rack (77) is slidably connected to the inside of the sliding groove (74) up and down; the second rack (77) cooperates with the bottom of the one-way gear (84).

8. The wafer processing equipment according to claim 7, characterized in that: A spring (78) that is evenly arranged and distributed is fixedly connected below the second rack (77), and the UV film (9) surrounds the periphery of the new film cylinder (91). A waste film cylinder (92) is provided at one end of the UV film (9) away from the new film cylinder (91), and the waste film cylinder (92) is fixedly sleeved on the periphery of the winding roller (82).

9. The wafer processing equipment according to claim 6, characterized in that: A notch (73) is provided at the bottom of the receiving groove (72), and the notch (73) is used for connecting the film sticking table (2) to the pump body inside the machine body (11). A buckle (75) is provided at one end of the receiving block (71) away from the machine body (11), and the buckle (75) is installed on both sides of the receiving block (71).

10. The wafer processing equipment according to claim 4, characterized in that: The bottom of the connecting column (681) is fixedly connected to a transverse connecting rod (686), both ends of the connecting rod (686) are rotatably connected to circular cutting knives (687), and the top of the connecting column (681) is fixedly connected to a driving handle (685).

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