Electronic device, radar system and electronic equipment

Abstract

The embodiment of the invention relates to the technical field of electronics, and discloses an electronic device, a radar system and electronic equipment. The electronic device includes: a substrate having a first surface; the radiation structure and the chip are arranged on the first surface; the first radio frequency coupling structure is arranged on the chip and is used for outputting a signal generated by the chip or receiving a signal sent to the chip; the radio frequency transmission structure is arranged on the substrate and is used for performing signal transmission between the first radio frequency coupling structure and the radiation structure; and the plurality of shielding structures are arranged between the chip and the first surface, the projection of the shielding structures on the first surface surrounds the projection of the first radio frequency coupling structure on the first surface, and the plurality of shielding structures enclose to form a waveguide channel used for signal transmission between the first radio frequency coupling structure and the radio frequency transmission structure. Signal interconnection between the chip and the radiation structure in a wireless transmission mode is at least facilitated.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of electronic technology, and in particular to an electronic device, a radar system, and an electronic device. Background Art

[0002] A radiation structure needs to be set up in an electronic device to radiate signals to the outside and receive external signals. Taking the automotive millimeter-wave radar as an example, the RF signal generated by the chip is transmitted to the radiation structure through the microstrip line in the substrate, and then radiated to the external environment through the radiation structure. Then, the RF signal is reflected by the target in the external environment to generate an echo signal. After the echo signal is received by the radiation structure, it is transmitted to the chip through the transmission line in the substrate for analysis and processing. Among them, the chip and the substrate, and the chip and the radiation structure are usually interconnected through the substrate and solder balls.

[0003] However, in order to realize the above signal interconnection method, there are some restrictions on the arrangement of the chip, substrate and radiation structure in the electronic device, which is not conducive to application. Summary of the invention

[0004] The embodiments of the present application provide an electronic device, a radar system and an electronic device, which are at least conducive to realizing signal interconnection between chips and radiation structures more in a wireless transmission manner, thereby reducing signal loss compared to signal transmission through solder balls, enabling more reliable signal transmission, and being applicable to radiation structures that require signal transmission in the form of external air waveguides, thereby enhancing applicability, being able to be more widely used in various scenarios, and reducing restrictions on the settings of chips, substrates and radiation structures in electronic devices.

[0005] According to some embodiments of the present application, on the one hand, the embodiments of the present application provide an electronic device, including: a substrate, the substrate having a first surface; a radiation structure and a chip, the radiation structure and the chip being arranged on the first surface; a first RF coupling structure, the first RF coupling structure being arranged on the chip, and being used to output a signal generated by the chip or receive a signal sent to the chip; a RF transmission structure being arranged on the substrate, and being used to transmit a signal between the first RF coupling structure and the radiation structure; a plurality of shielding structures, being arranged between the chip and the first surface, and the projections of the plurality of shielding structures on the first surface surround the projections of the first RF coupling structure on the first surface, and the plurality of shielding structures enclose a waveguide channel for signal transmission between the first RF coupling structure and the RF transmission structure.

[0006] In some embodiments, each of the plurality of shielding structures has a metal surface, and a minimum distance between two adjacent shielding structures among the plurality of shielding structures is less than λ / 4, where λ is a wavelength of a signal.

[0007] In some embodiments, the number of shielding structures include solder balls.

[0008] In some embodiments, the RF transmission structure includes a second RF coupling structure and a sub-RF transmission structure, the second RF coupling structure is arranged on the first surface and is arranged opposite to the first RF coupling structure; the first RF coupling structure, the waveguide channel enclosed by the plurality of shielding structures, the second RF coupling structure, and the sub-RF transmission structure constitute a signal transmission path between the chip and the radiation structure.

[0009] In some embodiments, the sub-RF transmission structure is a transmission line, one end of the transmission line is connected to the second RF coupling structure, and the other end of the transmission line is connected to the radiation structure.

[0010] In some embodiments, the substrate is a first PCB board, the first PCB board includes a first metal layer, a dielectric layer, and a second metal layer stacked in sequence in a direction away from the first surface, the sub-RF transmission structure includes a channel formed by a plurality of first metallized holes penetrating the dielectric layer, and the projection of the channel formed by the plurality of metallized holes on the first surface covers the projections of the second RF coupling structure and the radiation structure on the first surface.

[0011] In some embodiments, the RF transmission structure is a waveguide structure disposed in the substrate, one opening of the waveguide structure is disposed on the first surface and faces the first RF coupling structure, and another opening is also disposed on the first surface and faces the radiation structure.

[0012] In some embodiments, the substrate includes a second PCB board and a first fan-out structure stacked in sequence in a direction away from the first surface, the waveguide structure includes a first through hole passing through the second PCB board, a first blind hole provided in the first fan-out structure, and a second through hole passing through the second PCB board, an opening of the first through hole is opposite to the first RF coupling structure, and an opening of the second through hole is opposite to another opening of the first blind hole, and another opening of the second through hole is opposite to the radiation structure.

[0013] In some embodiments, the substrate includes a third PCB board and a second fan-out structure stacked in sequence in a direction away from the first surface, the waveguide structure includes a third through hole penetrating the third PCB board and a second blind hole provided in the second fan-out structure, one opening of the third through hole is opposite to the first RF coupling structure and the other opening is opposite to an opening of the second blind hole, and the other opening of the second blind hole is arranged opposite to the radiation structure.

[0014] In some embodiments, the radiating structure includes at least one of the following: an external antenna, a printed antenna, and a patch antenna.

[0015] The above technical solution provided in the embodiment of the present application has at least the following advantages:

[0016] Several shielding structures form a waveguide channel for the first RF coupling structure to transmit signals to the outside, so that the chip can transmit signals with the RF transmission structure through the waveguide channel formed by the shielding structure through the first RF coupling structure, and further realize signal transmission with the radiation structure, so that the signal interconnection between the chip and the substrate, and the chip and the radiation structure can be realized more in a wireless transmission manner, overcoming the dependence on solder balls in the process of signal interconnection, thereby reducing the setting restrictions brought by the solder ball setting to the chip, substrate and radiation structure. Compared with signal transmission through solder balls, it also reduces signal loss, can transmit signals more reliably, and can be applied to radiation structures that need to use external air waveguides for signal transmission, enhancing applicability and being more widely used in various scenarios. At the same time, setting both the radiation structure and the chip on the first surface of the substrate is conducive to making full use of the space provided by the first surface of the substrate, and the signal transmission does not need to cross the interior of the substrate, which is conducive to reducing the signal loss caused by the signal transmission inside the substrate. At the same time, compared with the situation where the radiation structure and the chip are set on different surfaces of the substrate, setting both the radiation structure and the chip on the first surface of the substrate can also reduce the space required for the radiation structure, the substrate and the chip, which is conducive to making full use of the space in the electronic device, and can be more suitable for scenarios with limited space in the electronic device, and has stronger applicability. In particular, it can also be applicable to external antenna scenarios and internal antenna scenarios.

[0017] According to some embodiments of the present application, on the other hand, the embodiments of the present application further provide an electronic device, including: a substrate, the substrate having a first surface; a radiation structure; a chip, the chip being arranged on the first surface; a first RF coupling structure, the first RF coupling structure being arranged on the chip, and being used to output a signal generated by the chip or receive a signal sent to the chip; a second RF coupling structure, the second RF coupling structure being arranged on the first surface and opposite to the first RF coupling structure, the second RF coupling structure being used to couple with the first RF coupling structure for signal transmission; a sub-RF transmission structure, the sub-RF transmission structure being used to transmit signals between the second RF coupling structure and the radiation structure; and a plurality of shielding structures, being arranged between the chip and the first surface, and the projections of the plurality of shielding structures on the first surface surround the projections of the first RF coupling structure on the first surface.

[0018] In some embodiments, each of the plurality of shielding structures has a metal surface, and a minimum distance between two adjacent shielding structures among the plurality of shielding structures is less than λ / 4, where λ is a wavelength of a signal.

[0019] In some embodiments, the sub-RF transmission structure is a transmission line, one end of the transmission line is connected to the second RF coupling structure, and the other end of the transmission line is connected to the radiation structure.

[0020] In some embodiments, the substrate is a first PCB board, the first PCB board includes a first metal layer, a dielectric layer, and a second metal layer stacked in sequence in a direction away from the first surface, the RF transmission structure includes a channel formed by a plurality of first metallized holes penetrating the dielectric layer, and the projection of the channel formed by the plurality of metallized holes on the first surface covers the projections of the second RF coupling structure and the radiation structure on the first surface.

[0021] In some embodiments, the number of shielding structures include solder balls.

[0022] In some embodiments, the radiation structure is disposed on the first surface.

[0023] In some embodiments, the radiating structure includes at least one of the following: an external antenna, a printed antenna, and a patch antenna.

[0024] The above technical solution provided in the embodiment of the present application has at least the following advantages:

[0025] Several shielding structures form a waveguide channel for the first RF coupling structure to transmit signals to the outside, and a second RF coupling structure is also provided on the first surface of the substrate, which can cooperate with the first RF coupling structure to achieve signal coupling, so that the chip can transmit the RF signal to the second RF coupling structure on the first surface of the substrate through the waveguide channel formed by the shielding structure through the first RF coupling structure, and further transmit the RF signal to the radiation structure through the sub-RF transmission structure, so that the signal interconnection between the chip and the substrate, and the chip and the radiation structure can be more wirelessly transmitted, overcoming the dependence on solder balls in the process of signal interconnection, thereby reducing the setting restrictions brought by the setting of solder balls to the chip, substrate and radiation structure. Compared with signal transmission through solder balls, signal loss is reduced, signal transmission can be more reliable, and it can be applied to radiation structures that need to use external air waveguides for signal transmission, enhancing applicability, and can be more widely used in various scenarios. The structure is simple and does not require a complex substrate, which is conducive to reducing the impact on maintaining the substrate clearance rate and avoiding restrictions on the radiation structure set on the substrate.

[0026] According to some embodiments of the present application, the embodiments of the present application further provide a radar system, including: the electronic device as described in any one of the above items.

[0027] According to some embodiments of the present application, on the other hand, an electronic device is provided, including: the radar system as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0029] Figure 1 is a top perspective view of an electronic device provided by an embodiment of the present application;

[0030] Figure 2 yes Figure 1 The electronic device provided by the embodiment of the present application is shown along Figure 1 A cross-sectional view along the dotted line A shown;

[0031] Figure 3 is a partial top perspective view of an electronic device provided in an embodiment of the present application;

[0032] Figure 4 yes Figure 3 The electronic device provided by the embodiment of the present application is shown along Figure 3 A cross-sectional view taken along the dot-dash line B shown;

[0033] Figure 5 is a partial top perspective view of an electronic device provided in an embodiment of the present application;

[0034] Figure 6 yes Figure 5 The electronic device provided by the embodiment of the present application is shown along Figure 5 A cross-sectional view taken along the dashed line C shown;

[0035] Figure 7 yes Figure 5 The electronic device provided by the embodiment of the present application is shown along Figure 5 A cross-sectional view along the dot-dash line D shown;

[0036] Figure 8 is a top perspective view of an electronic device provided by an embodiment of the present application;

[0037] Fig. 9 yes Figure 8 The electronic device provided by the embodiment of the present application is shown along Figure 8 A cross-sectional view taken along the dashed line E shown;

[0038] Fig.10 is a partial top perspective view of an electronic device provided in an embodiment of the present application;

[0039] Fig.11 yes Fig.10 The electronic device provided by the embodiment of the present application is shown along Fig.10 A cross-sectional view along the dashed line F shown;

[0040] Fig.12 is a partial top perspective view of an electronic device provided in an embodiment of the present application;

[0041] Fig.13 yes Fig.12 The electronic device provided by the embodiment of the present application is shown along Fig.12 A cross-sectional view taken along the dashed line G shown;

[0042] Fig.14 A schematic diagram of an orthographic projection of relevant structures involved in the electronic device provided in an embodiment of the present application on a first surface;

[0043] Fig.15 A schematic diagram of an orthographic projection of relevant structures involved in the electronic device provided in an embodiment of the present application on a substrate surface directly opposite to the first surface;

[0044] Fig.16 is a top perspective view of an electronic device provided by an embodiment of the present application;

[0045] Fig.17 yes Fig.16 The electronic device provided by the embodiment of the present application is shown along Fig.16 A cross-sectional view along the dotted line H is shown. DETAILED DESCRIPTION

[0046] As can be seen from the background art, there are many restrictions on the arrangement of chips, substrates and radiation structures in electronic devices, which is not conducive to application.

[0047] After analysis, it was found that the reason for the above problems is that solder balls are currently more commonly used to achieve signal interconnection between chips and substrates, and chips and radiating structures. In addition, the existence of solder balls has limited the arrangement of chips, substrates, and radiating structures in electronic devices. For example, the solder ball needs to occupy a signal ball, which increases the number of signal balls that need to be set in the electronic device. Since the microstrip line is below the grounding ball, there cannot be a grounding ball outside the signal ball, which limits the installation area of ​​the grounding ball on the substrate. In addition, the signal ball may also have reliability risks and other problems, which will limit the arrangement of chips, substrates, and radiating structures in electronic devices.

[0048] An electronic device, a radar system and an electronic device provided in the embodiments of the present application add more wireless transmission signal interconnection methods between the chip and the radiation structure through a plurality of shielding structures, a first RF coupling structure and a RF transmission structure, so that the signal interconnection is simpler and it is no longer necessary to set up more solder balls to achieve signal interconnection, thereby reducing the setting restrictions of the solder balls on the chip, substrate and radiation structure.

[0049] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, each embodiment of the present application will be described in detail below in conjunction with the accompanying drawings. However, it will be appreciated by those skilled in the art that in each embodiment of the present application, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can also be implemented.

[0050] The division of the following embodiments is for the convenience of description and shall not constitute any limitation on the specific implementation of the present application. The embodiments may be combined with each other and referenced to each other without contradiction.

[0051] The present application provides an electronic device. Figure 1-Figure 15 The electronic device provided in the embodiment of the present application is described.

[0052] In some embodiments, reference Figure 1 and Figure 2 ,in, Figure 1 is a top perspective view of an electronic device, Figure 2 for Figure 1 The electronic device shown along Figure 1 The cross-sectional view of the dotted line A is shown. The electronic device includes: a substrate 100, the substrate 100 has a first surface 101; a radiation structure 200 and a chip 300, the radiation structure 200 and the chip 300 are arranged on the first surface 101; a first RF coupling structure 400, the first RF coupling structure 400 is arranged on the chip 300, and is used to output the signal generated by the chip 300 or receive the signal sent to the chip 300; a RF transmission structure 500, the RF transmission structure 500 is arranged on the substrate 100, and is used to transmit signals between the first RF coupling structure 400 and the radiation structure 200; a plurality of shielding structures 600, which are arranged between the chip 300 and the first surface 101, and the projections of the plurality of shielding structures 600 on the first surface 101 surround the projections of the first RF coupling structure 400 on the first surface 101, and the plurality of shielding structures 600 enclose and form a waveguide channel for signal transmission between the first RF coupling structure 400 and the RF transmission structure 500.

[0053] In some embodiments, the structure of the electronic device can also refer to Figure 3and Figure 4 , Figure 3 is a partial top view perspective view of an electronic device, Figure 4 for Figure 3 The electronic device shown along Figure 3 The cross-sectional view along the dotted line B shown in FIG. Figure 3 Only the substrate 100, the chip 300, the first RF coupling structure 400, a partial opening of the RF transmission structure 500 and a shielding structure are shown, and other structures in the electronic device and other parts of the RF transmission structure 500 are not shown.

[0054] in, Figure 3 and Figure 4 The electronic device shown is Figure 1 and Figure 2 The electronic devices shown have roughly the same structure, the main difference is that Figure 3 and Figure 4 The radio frequency transmission structure 500 is disposed in the substrate 100. Figure 1 and Figure 2 The radio frequency transmission structure 500 is disposed on the first surface 101 of the substrate 100, and will not be described herein. Figure 3 and Figure 4 The electronic devices shown are described one by one.

[0055] In some embodiments, the structure of the electronic device can also refer to Figure 5-Figure 7 , Figure 5 It is a partial top view perspective view of an electronic device. Figure 6 for Figure 5 The electronic device on which the substrate 100 is located is shown Figure 4 The cross-sectional view along the dotted line C shown in FIG. Figure 7 for Figure 5 The electronic device on which the substrate 100 is located is shown Figure 4 The cross-sectional view along the dotted line D shown in FIG. Figure 5 Only the substrate 100 and the related structures arranged inside and on the surface thereof are shown.

[0056] in, Figure 5-Figure 7 The electronic device shown is Figure 1 and Figure 2 The electronic devices shown have roughly the same structure, the main difference is that Figure 5-Figure 7 The RF transmission structure 500 is partially disposed on the first surface 101 of the substrate 100 and partially disposed within the substrate 100. Figure 1 and Figure 2 The RF transmission structure 500 is disposed on the first surface 101 of the substrate 100. Figure 5-Figure 7 In the electronic device shown in FIG. 1 , the portion of the RF transmission structure 500 disposed on the first surface 101 of the substrate 100 is Figure 5The structure 501 in the figure, the part of the RF transmission structure 500 disposed in the substrate 100, namely Figure 5 The channel 502 formed by the plurality of structures 113 is not described here. Figure 5-Figure 7 The electronic devices shown are described one by one.

[0057] It should be noted that Figure 1-Figure 7 Different types of radiation structures 200 are shown for the convenience of understanding by those skilled in the art, wherein: Figure 1-Figure 2 , Figure 5-Figure 7 In the electronic device shown, the radiation structure 200 may be a patch antenna, a printed antenna, etc. Figure 3 and Figure 4 In the electronic device shown, the radiation structure 200 may be an external antenna such as a horn antenna or a waveguide antenna. In some embodiments, when the RF transmission structure 500 of the electronic device is disposed on the substrate 100, the radiation structure 200 may also be an external antenna such as a horn antenna or a waveguide antenna disposed on the first surface 101 of the substrate 100; or, when the RF transmission structure 500 of the electronic device is disposed in the substrate 100, the radiation structure 200 may be a patch antenna disposed on the first surface 101 of the substrate 100, etc., which will not be described one by one here.

[0058] In this way, when the electronic device transmits a signal, the transmit signal generated by the chip 300 will be transmitted to the RF transmission structure 500 through the first RF coupling structure 400, and then the transmit signal will continue to be transmitted on the RF transmission structure 500, reach the radiation structure 200, and finally be emitted to the outside through the radiation structure 200. When the electronic device receives a signal, the received signal is received by the radiation structure 200, and then transmitted to the first RF coupling structure 400 through the RF transmission structure 500 and sent to the chip 300 for analysis and processing.

[0059] That is to say, the waveguide channel formed by the shielding structure 600 enables the signal to be transmitted wirelessly between the first RF coupling structure 400 and the RF transmission structure 500, so that the chip 300 and the radiation structure 200 are interconnected by the first RF coupling structure 400, the waveguide channel formed by the shielding structure 600, and the RF transmission structure 500, thereby overcoming the dependence on solder balls in the process of signal interconnection, thereby reducing the setting restrictions brought by the solder ball setting to the chip 300, the substrate 100 and the radiation structure 200. At the same time, arranging both the radiation structure 200 and the chip 300 on the first surface 101 of the substrate 100 is conducive to making full use of the space provided by the first surface 101 of the substrate 100, and the signal transmission does not need to cross the interior of the substrate 100, which is conducive to reducing the signal loss caused by the transmission of the signal inside the substrate 100. At the same time, compared with the situation where the radiation structure 200 and the chip 300 are arranged on different surfaces of the substrate 100, arranging both the radiation structure 200 and the chip 300 on the first surface 101 of the substrate 100 can also reduce the space required for the radiation structure 200, the substrate 100 and the chip 300, which is conducive to making full use of the space in the electronic device, and can be more suitable for scenarios with limited space in the electronic device, and has stronger applicability. In particular, it can also be applicable to external antenna scenarios and internal antenna scenarios.

[0060] In some embodiments, reference Figure 5-Figure 9 ,in, Figure 8 is a top perspective view of an electronic device, Fig. 9 for Figure 8 The electronic device shown along Figure 8 The cross-sectional view of the dotted line E is shown. The RF transmission structure 500 includes a second RF coupling structure 501 and a sub-RF transmission structure 502. The second RF coupling structure 501 is disposed on the first surface 101 and is disposed opposite to the first RF coupling structure 400. The first RF coupling structure 400, the waveguide channel enclosed by the plurality of shielding structures 600, the second RF coupling structure 501, and the sub-RF transmission structure 502 constitute a signal transmission path between the chip 300 and the radiation structure 200.

[0061] In this way, when the electronic device transmits a signal, the transmission signal generated by the chip 300 will be transmitted from the first RF coupling structure 400 to the second RF coupling structure 501 through the waveguide channels enclosed by the plurality of shielding structures 600, and then transmitted to the radiation structure 300 through the sub-RF transmission structure 502, so as to be radiated outward through the radiation structure 300. When the electronic device receives a signal, the received signal is received by the radiation structure 200, and then transmitted to the second RF coupling structure 501 through the sub-RF transmission structure 502, and then transmitted from the second RF coupling structure 502 to the first RF coupling structure 400 through the waveguide channels enclosed by the plurality of shielding structures 600, and then sent to the chip 300 for analysis and processing.

[0062] That is to say, signal transmission between the substrate 100 and the chip 300 is achieved through the coupling of the first RF coupling structure 400 and the second RF coupling structure 501. The structure is simple and there is no need to construct a complex substrate 100, which is beneficial to reducing the impact on maintaining the clearance rate of the substrate 100 and avoiding interference with the radiation structure 200 set on the substrate 100.

[0063] In some embodiments, reference Figure 8-Figure 9 The sub-RF transmission structure 502 is a transmission line, one end of which is connected to the second RF coupling structure 501 , and the other end of which is connected to the radiation structure 200 .

[0064] In this way, when the electronic device transmits a signal, the signal generated by the chip 300 is transmitted to the second RF coupling structure 501 disposed opposite to the first RF coupling structure 400 through the first RF coupling structure 400, so as to be transmitted from one end of the transmission line connected to the second RF coupling structure 501 to the radiation structure 200 connected to the other end of the transmission line, and radiated outward. When the electronic device receives a signal, the signal received by the radiation structure 200 is transmitted from the other end of the transmission line connected to the radiation structure 200 to the second RF coupling structure 501 connected to one end of the transmission line, and is transmitted from the second RF coupling structure 501 to the first RF coupling structure 400, so as to be sent to the chip 300 for analysis and processing.

[0065] That is to say, the signal transmission between the second RF coupling structure 501 and the radiation structure 200 is realized through the transmission line, which is easy to realize and is conducive to production and wide application.

[0066] In some embodiments, reference Figure 5-Figure 7The substrate 100 is a first PCB board, and the first PCB board includes a first metal layer 102, a dielectric layer 103 and a second metal layer 104 stacked in sequence in a direction away from the first surface 101. The sub-RF transmission structure 502 includes a channel formed by a plurality of first metallized holes 113 penetrating the dielectric layer 103. The projection of the channel formed by the plurality of metallized holes 113 on the first surface 101 covers the projection of the second RF coupling structure 502 and the radiation structure 200 on the first surface 101.

[0067] It can be understood that the plurality of first metallized holes 113 penetrating the dielectric layer 103 actually form a substrate integrated waveguide (SIW) structure, thereby confining the signal to a channel enclosed by the plurality of first metallized holes 113 penetrating the dielectric layer 103 .

[0068] Furthermore, since the projection of the channel formed by the plurality of metallized holes 113 on the first surface 101 covers the projection of the second RF coupling structure 502 and the radiation structure 200 on the first surface 101, the second RF coupling structure 502 and the radiation structure 200 are enclosed in the channel formed by the plurality of first metallized holes 113 penetrating the dielectric layer 103. In other words, the signal transmitted between the second RF coupling structure 502 and the radiation structure 200 is limited to the channel formed by the plurality of first metallized holes 113 penetrating the dielectric layer 103, and the signal will be transmitted from one of the second RF coupling structure 502 and the radiation structure 200 to the other through the channel formed by the plurality of first metallized holes 113 penetrating the dielectric layer 103, thereby avoiding signal loss caused by outward diffusion of the signal, which is beneficial to improving the signal transmission quality.

[0069] Of course, in other embodiments, the sub-RF transmission structure 502 may be implemented in other ways, such as setting a perfect electric conductor (PEC) boundary and a perfect magnetic conductor (PMC) boundary, thereby forming a signal transmission channel based on the space between the PEC boundary and the PMC boundary.

[0070] In some embodiments, reference Figure 3-Figure 4 ,as well as, Figure 10-13 ,in, Fig.10 is a partial top view perspective view of an electronic device, Fig.12 for Fig.11 The electronic device shown along Fig.11 The cross-sectional view along the dashed line F shown in FIG. Fig.10Only the substrate 100, the chip 300, the first RF coupling structure 400, the partial opening of the RF transmission structure 500 and the shielding structure are shown, and other structures in the electronic device and other parts of the RF transmission structure 500 are not shown; Fig.12 is a partial top view perspective view of an electronic device, Fig.13 for Fig.12 The electronic device shown along Fig.12 The cross-sectional view along the dotted line G shown in FIG. Fig.12 Only the substrate 100, the chip 300, the first RF coupling structure 400, the partial opening of the RF transmission structure 500 and the shielding structure are shown, and other structures in the electronic device and other parts of the RF transmission structure 500 are not shown. The RF transmission structure 500 is a waveguide structure in the substrate 100, and one opening of the waveguide structure is provided on the first surface 101 and directly faces the first RF coupling structure 400, and the other opening is also provided on the first surface 101 and directly faces the radiation structure 200.

[0071] In this way, the RF transmission structure 500 is realized by setting a waveguide structure inside the substrate 100. The structure is simple and easy to implement, which is conducive to wide application. In addition, setting a waveguide structure inside the substrate 100 is also conducive to saving resources and reducing costs.

[0072] In some embodiments, reference Figure 4 The substrate 100 is a PCB board, and the radio frequency transmission structure 500 is composed of a waveguide structure, which is arranged inside the PCB board.

[0073] That is to say, there is no need to set up additional structures to assist in forming the waveguide structure of the RF transmission structure 500 , thereby avoiding increasing the complexity of the substrate 100 .

[0074] It is understandable that the thickness of the PCB board is usually small, and it is difficult to construct a waveguide structure inside it. Fig.10 and Fig.11 The substrate 100 includes a second PCB board 105 and a first fan-out structure 106 stacked in sequence in a direction away from the first surface 101. The waveguide structure serving as the RF transmission structure 500 includes a first through hole 503 penetrating the second PCB board 105, a first blind hole 504 provided in the first fan-out structure 106, and a second through hole 505 penetrating the second PCB board 105. An opening of the first through hole 503 is opposite to the first RF coupling structure 400, and an opening of the second through hole 505 is opposite to another opening of the first blind hole 504, and another opening of the second through hole 505 is opposite to the radiation structure 200.

[0075] Among them, when the substrate 100 includes a second PCB board 105 and a first fan-out structure 106 stacked in sequence in a direction away from the first surface 101, that is, when the first fan-out structure 106 does not belong to the PCB board, the first fan-out structure 106 can be a metal structural part or a plastic electroplated part, etc., which will not be described one by one here.

[0076] In this way, the first fan-out structure 106 is used to assist the second PCB board 105 in constructing a waveguide structure as the RF transmission structure 500. It is no longer required to construct a waveguide structure inside the PCB board, but only to provide a first through hole 503 and a second through hole 505 on the second PCB board 105, which is conducive to reducing the difficulty of implementation, reducing costs, and being more easily widely used. In addition, more waveguide results are used to achieve signal interconnection between the chip 300 and the radiation structure 200, and the effectiveness of RF signal transmission under the wireless transmission mode is further increased in the form of chip-waveguide structure-radiation structure. Compared with the traditional chip-PCB board wiring-waveguide structure-radiation structure, there is less signal transmission based on PCB board wiring, and then by reducing the signal transmission based on PCB board wiring, the PCB board does not need a high-frequency plate material, which is conducive to reducing the difficulty of implementation and reducing costs.

[0077] As a result, the signal can be transmitted more through the air with less loss, which helps to further reduce signal transmission loss.

[0078] In some embodiments, reference Fig.12 and Fig.13 The substrate 100 includes a third PCB board 107 and a second fan-out structure 108 stacked in sequence in a direction away from the first surface. The waveguide structure serving as the RF transmission structure 500 includes a third through hole 506 penetrating the third PCB board 107 and a second blind hole 507 provided in the second fan-out structure 109. One opening of the third through hole 506 is opposite to the first RF coupling structure 400 and the other opening of the third through hole 506 is opposite to one opening of the second blind hole 507. The other opening of the second blind hole 507 is arranged opposite to the radiation structure 400.

[0079] At this time, the other opening of the second blind hole 507 and the radiating structure 400 may also perform signal transmission through the medium of the third PCB board 107 between the other opening of the second blind hole 507 and the radiating structure 400 .

[0080] for Fig.10 and Fig.11In the electronic device shown, since the second through hole 505 passes through the second PCB board 105, the radiation structure 200 directly opposite to the other opening of the second through hole 505 can be an external antenna. In this way, the radiation structure 200 does not need to be set on the first surface 101 of the substrate 100 by printing, patching, etc., and the other opening of the second through hole 505 and the radiation structure 200 will not affect each other's settings.

[0081] And for Fig.12 and Fig.13 In the electronic device shown, since the portion where the third PCB board 107 and the radiation structure 400 are arranged opposite to each other is not penetrated, the radiation structure 400 can be a patch antenna, a printed antenna, etc., which is more conducive to the application of patch antennas and printed antennas in electronic devices. Of course, the radiation structure can still be an external antenna, or not be arranged by printing or patch process, which will not be described here one by one.

[0082] It should be noted that Figure 3-Figure 4 ,as well as Figure 10-13 The waveguide structure in the substrate 100 is merely used as an example of the RF transmission structure 500. In other embodiments, the waveguide structure serving as the RF transmission structure 500 may also be on the first surface 101 of the substrate 100, or may be partially disposed on the first surface 101 of the substrate 100 and partially disposed in the substrate 100, etc., which will not be described in detail here.

[0083] In some embodiments, reference Fig.14 and Fig.15 ,in, Fig.14 for Figure 8 and Fig. 9 In the electronic device shown, a schematic diagram of an orthographic projection of a radiation device 200, a plurality of shielding structures 600 and a radio frequency transmission structure 500 on a first surface 101 of a substrate 100 is shown; Fig.15 for Figure 5-Figure 7 In the electronic device shown, a plurality of shielding structures 600 and a first RF coupling structure 400 are schematically projected on the surface of the chip 300 directly opposite to the first surface 101 of the substrate 10. Each of the plurality of shielding structures 600 has a metal surface, and the minimum distance between two adjacent shielding structures 600 in the plurality of shielding structures 600 is less than λ / 4, where λ is the wavelength of the signal.

[0084] In this way, since the distance between two adjacent shielding structures 600 is less than λ / 4, the signal cannot be transmitted in the space between the two adjacent shielding structures 600, which limits the transmission of the signal between the two adjacent shielding structures 600, and the metal surfaces of several shielding structures 600 can also limit the signal from being transmitted outward across their metal surfaces, so that the signal transmitted between the first RF coupling structure 400 and the RF transmission structure 500 is limited to the space enclosed by the several shielding structures 600 and does not diffuse outward. The signal can be transmitted between the first RF coupling structure 400 and the RF transmission structure 500 with low loss, thereby realizing wireless transmission of the signal between the first RF coupling structure 400 and the RF transmission structure 500.

[0085] It should be noted that the minimum distance between two adjacent shielding structures 600 refers to the distance between two points closest to each other on the surfaces of the two shielding structures 600 that are closest to each other.

[0086] It should also be noted that Fig.14 and Fig.15 This is only an exemplary representation of the minimum distance between two adjacent shielding structures 600 . The minimum distance between any other two shielding structures 600 is also less than λ / 4, which will not be described in detail here.

[0087] It should also be noted that Fig.14 and Fig.15 This is mainly to help those skilled in the art to better understand that the minimum distance between two adjacent shielding structures 600 among the shielding structures 600 is less than λ / 4. Figure 1-Figure 4 ,as well as, Figure 10-13 In the electronic devices shown in the related embodiments, the minimum distance between two adjacent shielding structures 600 in the plurality of shielding structures 600 may also be less than λ / 4 to facilitate better signal transmission, which will not be described in detail here.

[0088] In some embodiments, number of shield structures 600 include solder balls.

[0089] In some embodiments, the solder balls may be Figure 1-Figure 13 As shown in , it is arranged on the chip 300.

[0090] In some embodiments, the solder balls may also be disposed on the substrate 100. For example, when the solder balls are disposed on the substrate 100, they may be disposed on the first surface 101 of the substrate 100. In this case, the top view of the substrate 100, the solder balls, the radiation structure 200, and the RF transmission structure 500 may be as shown in FIG. Fig.14 As shown, the solder ball is Fig.14 The shielding structure 600 in FIG.

[0091] That is to say, the shielding structure 600 can be flexibly set on the chip 300 and / or the substrate 100 according to needs, so that the electronic device provided by the embodiment of the present application can be used in a wider range of application scenarios. For example, in a scenario where the setting area of ​​the shielding structure 600 on the chip 300 is limited, several shielding structures 600 can be set on the substrate 100, etc., which is conducive to improving the applicability and practicality of the electronic device provided by the embodiment of the present application.

[0092] In some cases, the solder balls may be chip solder balls on chip 300 .

[0093] In this way, the shielding structure 600 is constructed with the chip solder balls on the chip 300, so that the existing structure on the chip 300 is fully utilized, which is beneficial to reducing the complexity of the chip 300, saving resources and reducing costs.

[0094] At this time, in some cases, the solder balls may be solder used for connecting circuits or devices on the substrate 100 .

[0095] In this way, the shielding structure 600 is constructed by soldering on the substrate 100, so that the existing structure on the substrate 100 is fully utilized, which is beneficial to reducing the complexity of the substrate 300, improving the clearance rate, saving resources and reducing costs.

[0096] It should be noted that Fig.14 In the case where the RF transmission structure 500 includes the second RF coupling structure 501 and the sub-RF transmission structure 502, and the sub-RF transmission structure 502 is a transmission line, the exemplary description of the plurality of shielding structures 600 disposed on the substrate 100 is provided. In this case, the plurality of shielding structures 600 are not in contact with the transmission line, so as to avoid the plurality of shielding structures 600 affecting the signal transmission on the transmission line. In the case where the RF transmission structure 500 includes the second RF coupling structure 501 and the sub-RF transmission structure 502, and the sub-RF transmission structure 502 is a transmission line, it is assumed that the plurality of shielding structures 600 are disposed on the chip 300. In this case, the plurality of shielding structures 600 will not be in contact with the transmission line. In some examples, the plurality of shielding structures 600 can be prevented from being in contact with the transmission line by making the orthographic projections of the plurality of shielding structures 600 on the first surface 101 not coincide with the transmission line.

[0097] Of course, the above is merely an example of the shielding structure 600. In other embodiments, the shielding structure 600 may also be a metal block. Alternatively, when the chip solder balls on the chip 300 are not sufficient to satisfy the requirement that the minimum distance between two adjacent shielding structures in a plurality of shielding structures 600 is less than λ / 4, a metal block may be added to the substrate 100 as a shielding structure 600, so that the plurality of shielding structures 600 satisfy the requirement that the minimum distance between two adjacent shielding structures is less than λ / 4, etc., which will not be elaborated here.

[0098] In some embodiments, the radiating structure 200 includes at least one of the following: an external antenna, a printed antenna, and a patch antenna.

[0099] Another aspect of the present application embodiment is to provide an electronic device. Figure 5-9 ,as well as Figure 16-17 The electronic device provided in the embodiment of the present application is described.

[0100] refer to Figure 8 and Fig. 9 The electronic device includes: a substrate 100, the substrate 100 having a first surface 101; a radiation structure 200; a chip 300, the chip 300 is arranged on the first surface 101; a first RF coupling structure 400, the first RF coupling structure 400 is arranged on the chip 300, and is used to output a signal generated by the chip 300 or receive a signal sent to the chip 300; a second RF coupling structure 501, the second RF coupling structure 501 is arranged on the first surface 101 and is arranged opposite to the first RF coupling structure 400, and the second RF coupling structure 501 is used to couple with the first RF coupling structure 400 for signal transmission; a sub-RF transmission structure 502, the sub-RF transmission structure 502 is used for signal transmission between the second RF coupling structure 501 and the radiation structure 200; a plurality of shielding structures 600, which are arranged between the chip 300 and the first surface 101, and the projections of the plurality of shielding structures 600 on the first surface 101 surround the projections of the first RF coupling structure 400 on the first surface 101.

[0101] In some embodiments, the structure of the electronic device can also refer to Fig.16 and Fig.17 ,in, Fig.16 is a top perspective view of an electronic device, Fig.17 for Fig.16 The electronic device shown along Fig.16 A cross-sectional view along the dotted line H is shown.

[0102] in, Fig.16 and Fig.17 The electronic device shown is Figure 8 and Fig. 9 The electronic devices shown have roughly the same structure, the main difference is that Fig.16 and Fig.17 In the electronic device shown, the radiation structure 200 may be disposed on a surface of the substrate 100 opposite to the first surface 101. Figure 8 and Fig. 9 The radiation structure 200 in the electronic device shown in the figure may be disposed on the first surface 101 of the substrate 100, and will not be described in detail herein. Fig.16 and Fig.17 The electronic devices shown are described one by one.

[0103] It should be noted that Fig.16 and Fig.17 It is a brief schematic diagram of the sub-RF transmission structure 502, rather than a specific description of the sub-RF transmission structure 502. It can be understood that in some cases, the sub-RF transmission structure 502 can be connected to the second RF coupling structure 501 at one end and connected to the radiation structure 200 at the other end, so as to transmit signals between the second RF coupling structure 501 and the radiation structure 200; in some cases, the sub-RF transmission structure 502 can be connected to the second RF coupling structure 501 at one end and connected to the radiation structure 200 through a waveguide structure at the other end, so as to transmit signals between the second RF coupling structure 501 and the radiation structure 200, etc., which will not be described one by one here.

[0104] In some embodiments, the structure of the electronic device can also refer to Figure 5-Figure 7 .in, Figure 5-Figure 7 The electronic device shown is Figure 8 and Fig. 9 The electronic devices shown have roughly the same structure, the main difference is that Figure 5-Figure 7 The neutron radio frequency transmission structure 502 of the electronic device shown is a channel formed by a plurality of first metallized holes 113 penetrating the dielectric layer 103. Figure 8 and Fig. 9 The electronic device neutron radio frequency transmission structure 502 shown in the figure can be a transmission line, which will not be described here. Fig.16 and Fig.17 The electronic devices shown are described one by one.

[0105] It should be noted that Figure 5-Figure 7 The electronic device shown is only an example. In some embodiments, the structure of the electronic device may also be similar to Figure 5-Figure 7 The structure shown mainly differs in that the radiation device 200 is no longer arranged on the first surface 101 of the substrate 100, but is arranged on a surface of the substrate 100 different from the first surface 101, such as on a surface opposite to the first surface 101. This embodiment does not limit the setting position of the radiation structure 200, so that the electronic device provided by the embodiment of the present application can be used in the scenario where the chip 300 and the radiation structure 200 are arranged on different sides of the substrate 100, and it will not be described one by one here.

[0106] In this way, the waveguide channel formed by the shielding structure 600 enables the signal to be transmitted between the first RF coupling structure 400 and the second RF coupling structure 501 in a wireless transmission manner, so that the chip 300 and the radiation structure 200 are interconnected by the first RF coupling structure 400, the waveguide channel formed by the shielding structure 600, the second RF coupling structure 501 and the sub-RF transmission structure 502, thereby overcoming the dependence on solder balls in the process of signal interconnection, thereby reducing the setting restrictions brought by the setting of solder balls to the chip 300, the substrate 100 and the radiation structure 200. At the same time, the signal transmission between the substrate 100 and the chip 300 is realized through the coupling and cooperation between the first RF coupling structure 400 and the second RF coupling structure 502, and the structure is simple, and there is no need to construct a complex substrate 100, which is conducive to reducing the impact on maintaining the clearance rate of the substrate 100 and avoiding restrictions on the radiation structure 200 set on the substrate 100.

[0107] In some embodiments, in some embodiments, reference Fig.14 and Fig.15 , each of the plurality of shielding structures 600 has a metal surface, and a minimum distance between two adjacent shielding structures 600 among the plurality of shielding structures 600 is less than λ / 4, where λ is the wavelength of the signal.

[0108] In this way, since the distance between two adjacent shielding structures 600 is less than λ / 4, the signal cannot be transmitted in the space between the two adjacent shielding structures 600, which limits the transmission of the signal between the two adjacent shielding structures 600, and the metal surfaces of several shielding structures 600 can also limit the signal from being transmitted outward across their metal surfaces, so that the signal transmitted between the first RF coupling structure 400 and the RF transmission structure 500 is limited to the space enclosed by the several shielding structures 600 and does not diffuse outward. The signal can be transmitted between the first RF coupling structure 400 and the RF transmission structure 500 with low loss, thereby realizing wireless transmission of the signal between the first RF coupling structure 400 and the RF transmission structure 500.

[0109] It should be noted that the minimum distance between two adjacent shielding structures 600 refers to the distance between two points closest to each other on the surfaces of the two shielding structures 600 that are closest to each other.

[0110] It should also be noted that Fig.14 and Fig.15 This is only an exemplary representation of the minimum distance between two adjacent shielding structures 600 . The minimum distance between any other two shielding structures 600 is also less than λ / 4, which will not be described in detail here.

[0111] It should also be noted that Fig.14 and Fig.15This is mainly to help those skilled in the art to better understand that the minimum distance between two adjacent shielding structures 600 among the shielding structures 600 is less than λ / 4. Figure 16-17 In the electronic devices shown in the related embodiments, the minimum distance between two adjacent shielding structures 600 in the plurality of shielding structures 600 may also be less than λ / 4 to facilitate better signal transmission, which will not be described in detail here.

[0112] In some embodiments, number of shield structures 600 include solder balls.

[0113] In some embodiments, the solder balls may be Figure 5-9 ,as well as Figure 16-17 As shown in , it is arranged on the chip 300.

[0114] In some embodiments, the solder balls may also be disposed on the substrate 100. For example, when the solder balls are disposed on the substrate 100, they may be disposed on the first surface 101 of the substrate 100. In this case, the top view of the substrate 100, the solder balls, the radiation structure 200, and the RF transmission structure 500 may be as shown in FIG. Fig.14 As shown, the solder ball is Fig.14 The shielding structure 600 in FIG.

[0115] That is to say, the shielding structure 600 can be flexibly set on the chip 300 and / or the substrate 100 according to needs, so that the electronic device provided by the embodiment of the present application can be used in a wider range of application scenarios. For example, in a scenario where the setting area of ​​the shielding structure 600 on the chip 300 is limited, several shielding structures 600 can be set on the substrate 100, etc., which is conducive to improving the applicability and practicality of the electronic device provided by the embodiment of the present application.

[0116] In some cases, the solder balls may be chip solder balls on chip 300 .

[0117] In this way, the shielding structure 600 is constructed with the chip solder balls on the chip 300, so that the existing structure on the chip 300 is fully utilized, which is beneficial to reducing the complexity of the chip 300, saving resources and reducing costs.

[0118] At this time, in some cases, the solder balls may be solder used for connecting circuits or devices on the substrate 100 .

[0119] In this way, the shielding structure 600 is constructed by soldering on the substrate 100, so that the existing structure on the substrate 100 is fully utilized, which is beneficial to reducing the complexity of the substrate 300, improving the clearance rate, saving resources and reducing costs.

[0120] It should be noted that Fig.14In the case where the RF transmission structure 500 includes the second RF coupling structure 501 and the sub-RF transmission structure 502, and the sub-RF transmission structure 502 is a transmission line, the exemplary description of the plurality of shielding structures 600 disposed on the substrate 100 is provided. In this case, the plurality of shielding structures 600 are not in contact with the transmission line, so as to avoid the plurality of shielding structures 600 affecting the signal transmission on the transmission line. In the case where the RF transmission structure 500 includes the second RF coupling structure 501 and the sub-RF transmission structure 502, and the sub-RF transmission structure 502 is a transmission line, it is assumed that the plurality of shielding structures 600 are disposed on the chip 300. In this case, the plurality of shielding structures 600 will not be in contact with the transmission line. In some examples, the plurality of shielding structures 600 can be prevented from being in contact with the transmission line by making the orthographic projections of the plurality of shielding structures 600 on the first surface 101 not coincide with the transmission line.

[0121] Of course, the above is merely an example of the shielding structure 600. In other embodiments, the shielding structure 600 may also be a metal block. Alternatively, when the chip solder balls on the chip 300 are not sufficient to satisfy the requirement that the minimum distance between two adjacent shielding structures in a plurality of shielding structures 600 is less than λ / 4, a metal block may be added to the substrate 100 as a shielding structure 600, so that the plurality of shielding structures 600 satisfy the requirement that the minimum distance between two adjacent shielding structures is less than λ / 4, etc., which will not be elaborated here.

[0122] In some embodiments, reference Figure 8 and Fig. 9 The sub-RF transmission structure 502 is a transmission line, one end of which is connected to the second RF coupling structure 501 , and the other end of which is connected to the radiation structure 200 .

[0123] In this way, when the electronic device transmits a signal, the signal generated by the chip 300 is transmitted to the second RF coupling structure 501 disposed opposite to the first RF coupling structure 400 through the first RF coupling structure 400, so as to be transmitted from one end of the transmission line connected to the second RF coupling structure 501 to the radiation structure 200 connected to the other end of the transmission line, and radiated outward. When the electronic device receives a signal, the signal received by the radiation structure 200 is transmitted from the other end of the transmission line connected to the radiation structure 200 to the second RF coupling structure 501 connected to one end of the transmission line, and is transmitted from the second RF coupling structure 501 to the first RF coupling structure 400, so as to be sent to the chip 300 for analysis and processing.

[0124] That is to say, the signal transmission between the second RF coupling structure 501 and the radiation structure 200 is realized through the transmission line, which is easy to realize and is conducive to production and wide application.

[0125] In some embodiments, reference Figure 5-Figure 7The substrate 100 is a first PCB board, and the first PCB board includes a first metal layer 102, a dielectric layer 103 and a second metal layer 104 stacked in sequence in a direction away from the first surface 101. The sub-RF transmission structure 502 includes a channel formed by a plurality of first metallized holes 113 penetrating the dielectric layer 103. The projection of the channel formed by the plurality of metallized holes 113 on the first surface 101 covers the projection of the second RF coupling structure 502 and the radiation structure 200 on the first surface 101.

[0126] It can be understood that the plurality of first metallized holes 113 penetrating the dielectric layer 103 actually form a substrate integrated waveguide (SIW) structure, thereby confining the signal to a channel enclosed by the plurality of first metallized holes 113 penetrating the dielectric layer 103 .

[0127] Furthermore, since the projection of the channel formed by the plurality of metallized holes 113 on the first surface 101 covers the projection of the second RF coupling structure 502 and the radiation structure 200 on the first surface 101, the second RF coupling structure 502 and the radiation structure 200 are enclosed in the channel formed by the plurality of first metallized holes 113 penetrating the dielectric layer 103. In other words, the signal transmitted between the second RF coupling structure 502 and the radiation structure 200 is limited to the channel formed by the plurality of first metallized holes 113 penetrating the dielectric layer 103, and the signal will be transmitted from one of the second RF coupling structure 502 and the radiation structure 200 to the other through the channel formed by the plurality of first metallized holes 113 penetrating the dielectric layer 103, thereby avoiding signal loss caused by outward diffusion of the signal, which is beneficial to improving the signal transmission quality.

[0128] Of course, in other embodiments, the sub-RF transmission structure 502 may be implemented in other ways, such as setting a perfect electric conductor (PEC) boundary and a perfect magnetic conductor (PMC) boundary, thereby forming a signal transmission channel based on the space between the PEC boundary and the PMC boundary.

[0129] In some embodiments, the radiating structure 200 may include at least one of the following: an external antenna, a printed antenna, and a patch antenna.

[0130] It should be noted that the above embodiments are based on Figure 1-Figure 17 In the provided electronic device, the setting of the shielding structure 600 is only a schematic diagram, and the number and quantity of the shielding structure 600 may vary according to the setting of the solder balls on the chip 300 and / or the substrate 100, etc., and the embodiments of the present application are not limited to this.

[0131] According to some embodiments of the present application, the embodiments of the present application further provide a radar system, including: the electronic device as described in any one of the above items.

[0132] It is not difficult to find that this embodiment is a system embodiment corresponding to the above-mentioned embodiment, and this embodiment can be implemented in conjunction with the above-mentioned embodiment. The relevant technical details mentioned in the above-mentioned embodiment are still valid in this implementation, and in order to reduce repetition, they are not repeated here. Accordingly, the relevant technical details mentioned in this embodiment can also be applied in the above-mentioned embodiment.

[0133] According to some embodiments of the present application, on the other hand, an electronic device is provided, including: the radar system as described above.

[0134] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present invention, and in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present invention.

Claims

1. An electronic device, characterized in that: include: a substrate having a first surface; a radiation structure and a chip, wherein the radiation structure and the chip are arranged on the first surface; a first radio frequency coupling structure, which is disposed on the chip and is used to output a signal generated by the chip or receive a signal sent to the chip; A radio frequency transmission structure, provided on the substrate, for transmitting signals between the first radio frequency coupling structure and the radiation structure; A plurality of shielding structures are arranged between the chip and the first surface, and the projections of the plurality of shielding structures on the first surface surround the projection of the first RF coupling structure on the first surface. The plurality of shielding structures enclose a waveguide channel for signal transmission between the first RF coupling structure and the RF transmission structure.

2. The electronic device according to claim 1, characterized in that: Each of the plurality of shielding structures has a metal surface, and a minimum distance between two adjacent shielding structures among the plurality of shielding structures is less than λ / 4, where λ is a wavelength of a signal.

3. The electronic device according to claim 2, characterized in that: The plurality of shielding structures include solder balls.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The RF transmission structure includes a second RF coupling structure and a sub-RF transmission structure, wherein the second RF coupling structure is arranged on the first surface and is arranged opposite to the first RF coupling structure; the first RF coupling structure, the waveguide channel enclosed by the plurality of shielding structures, the second RF coupling structure, and the sub-RF transmission structure constitute a signal transmission path between the chip and the radiation structure.

5. The electronic device according to claim 4, characterized in that: The sub-RF transmission structure is a transmission line, one end of which is connected to the second RF coupling structure, and the other end of which is connected to the radiation structure.

6. The electronic device according to claim 4, characterized in that: The substrate is a first PCB board, which includes a first metal layer, a dielectric layer, and a second metal layer stacked in sequence in a direction away from the first surface. The sub-RF transmission structure includes a channel formed by a plurality of first metallized holes penetrating the dielectric layer, and the projection of the channel formed by the plurality of metallized holes on the first surface covers the projections of the second RF coupling structure and the radiation structure on the first surface.

7. The electronic device according to any one of claims 1 to 3, characterized in that: The RF transmission structure is a waveguide structure disposed in the substrate, one opening of the waveguide structure is disposed on the first surface and faces the first RF coupling structure, and another opening is also disposed on the first surface and faces the radiation structure.

8. The electronic device according to claim 7, characterized in that: The substrate includes a second PCB board and a first fan-out structure stacked in sequence in a direction away from the first surface, the waveguide structure includes a first through hole penetrating the second PCB board, a first blind hole provided in the first fan-out structure, and a second through hole penetrating the second PCB board, an opening of the first through hole is opposite to the first RF coupling structure, an opening of the second through hole is opposite to the other opening of the first blind hole, and the other opening of the second through hole is opposite to the radiation structure.

9. The electronic device according to claim 7, characterized in that: The substrate includes a third PCB board and a second fan-out structure stacked in sequence in a direction away from the first surface, the waveguide structure includes a third through hole penetrating the third PCB board and a second blind hole arranged in the second fan-out structure, one opening of the third through hole is opposite to the first RF coupling structure and the other opening is opposite to one opening of the second blind hole, and the other opening of the second blind hole is arranged opposite to the radiation structure.

10. The electronic device according to any one of claims 1 to 3, characterized in that: The radiation structure includes at least one of the following: an external antenna, a printed antenna and a patch antenna.

11. An electronic device, characterized in that: include: a substrate having a first surface; Radiating structure; a chip, wherein the chip is disposed on the first surface; a first radio frequency coupling structure, which is disposed on the chip and is used to output a signal generated by the chip or receive a signal sent to the chip; a second RF coupling structure, the second RF coupling structure being disposed on the first surface and arranged opposite to the first RF coupling structure, the second RF coupling structure being used to couple with the first RF coupling structure for signal transmission; a sub-RF transmission structure, the sub-RF transmission structure being used to transmit signals between the second RF coupling structure and the radiation structure; A plurality of shielding structures are disposed between the chip and the first surface, and projections of the plurality of shielding structures on the first surface surround a projection of the first radio frequency coupling structure on the first surface.

12. The electronic device according to claim 11, characterized in that: Each of the plurality of shielding structures has a metal surface, and a minimum distance between two adjacent shielding structures among the plurality of shielding structures is less than λ / 4, where λ is a wavelength of a signal.

13. The electronic device according to claim 11, characterized in that: The sub-RF transmission structure is a transmission line, one end of which is connected to the second RF coupling structure, and the other end of which is connected to the radiation structure.

14. The electronic device according to claim 11, characterized in that: The substrate is a first PCB board, which includes a first metal layer, a dielectric layer, and a second metal layer stacked in sequence in a direction away from the first surface. The RF transmission structure includes a channel formed by a plurality of first metallized holes penetrating the dielectric layer, and a projection of the channel formed by the plurality of metallized holes on the first surface covers projections of the second RF coupling structure and the radiation structure on the first surface.

15. The electronic device according to claim 11, characterized in that: The plurality of shielding structures include solder balls.

16. The electronic device according to any one of claims 11 to 14, characterized in that: The radiation structure is arranged on the first surface.

17. The electronic device according to any one of claims 11 to 14, characterized in that: The radiation structure includes at least one of the following: an external antenna, a printed antenna and a patch antenna.

18. A radar system, characterized in that: include: The electronic device according to any one of claims 1 to 10, or the electronic device according to any one of claims 11 to 17.

19. An electronic device, characterized in that: include: The radar system of claim 18.

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