Data transmission device

Abstract

The invention provides data transmission equipment, relates to the technical field of network data transmission equipment, and is used for solving the technical problems of difficulty in heat dissipation of equipment and high PCB (Printed Circuit Board) consumption. The data transmission equipment comprises a high-speed signal board and a low-speed signal board; the high-speed signal board is connected to one side of the low-speed signal board; the high-speed signal board is provided with a high-speed signal piece, a chip and a plurality of first data transmission ports, and the chip is in communication connection with the first data transmission ports; the low-speed signal board is provided with a low-speed signal piece, the power supply port, the chip and the first data transmission port are electrically connected with the power supply port, and the power supply port is configured to be connected with a power source and supply power to the high-speed signal piece, the chip and the first data transmission port. The low-speed signal piece and the power supply port are integrated on the low-speed signal board made of a common board, so that more high-speed signal boards can be produced by PCBs of the same specification, the production cost is reduced, and the single high-speed signal board can be well cooled.

Description

Technical Field

[0001] The present application relates to the technical field of network data transmission equipment, and in particular to a data transmission equipment. Background Art

[0002] With the development of network technology, the requirements for high-speed transmission of network data are also increasing. In view of this, many high-speed network data transmission devices such as switches play an important role in high-speed data transmission.

[0003] In the related art, the data transmission device generally has a chip, a PCB (Printed Circuit Board) board and a data transmission port, and the chip and the data transmission port are connected on the PCB board. The chip realizes the communication connection with the data transmission port through the routing on the PCB board. Since the number of data transmission ports directly affects the transmission speed and quality during the data transmission process, the number of data transmission ports is generally large. In order to meet the communication connection between multiple data transmission ports and the chip, in the related art, an N+N stacked routing solution or a single-layer routing + cable solution is generally adopted.

[0004] However, the N+N stacked wiring solution uses two PCB boards, which consumes more PCB boards and is more expensive. At the same time, the two-layer port cage makes it difficult for the data transmission port, which generates a lot of heat, to effectively dissipate heat. The single-layer wiring + cable solution uses the same amount of PCB boards, but adds the steps of making and connecting the transmission cables. The production cost is higher and the production process becomes more complicated. Summary of the invention

[0005] In view of the above problems, an embodiment of the present application provides a data transmission device, which aims to solve the technical problems of heat dissipation difficulties, high consumption of PCB boards and complex manufacturing processes of existing data transmission equipment, and has the technical effect of improving the heat dissipation efficiency of data transmission equipment and reducing the consumption of PCB boards.

[0006] In order to achieve the above objectives, the embodiments of the present application provide the following technical solutions:

[0007] An embodiment of the present application provides a data transmission device, including: a high-speed signal board and a low-speed signal board; the high-speed signal board is connected to one side of the low-speed signal board; the high-speed signal board has a high-speed signal component, a chip and a plurality of first data transmission ports, and the chip is communicatively connected to the first data transmission ports; the low-speed signal board has a low-speed signal component and a power supply port, the chip and the first data transmission port are electrically connected to the power supply port respectively, and the power supply port is configured to access a power supply and supply power to the high-speed signal component, the chip and the first data transmission port.

[0008] In the data transmission device provided in the embodiment of the present application, the low-speed signal components and power supply ports on the original PCB board with low requirements for signals and plates are integrated on the low-speed signal board made of ordinary plates, and only the high-speed signal components, chips and the first data transmission port with high requirements for signals and plates are retained on the high-speed signal board, which can effectively reduce the surface area and volume of the high-speed signal board made of PCB material, so that more high-speed signal boards can be produced with PCB plates of the same specifications, thereby saving the consumption of PCB plates and reducing production costs. At the same time, the first data transmission port and chip on the single high-speed signal board can also obtain good heat dissipation, ensuring stable data transmission.

[0009] In some embodiments, the data transmission device also includes: a first expansion board and a first transmission cable; the first expansion board has at least one second data transmission port, and the two ends of the first transmission cable are respectively connected to the second data transmission port and the high-speed signal board, so that the chip is communicatively connected with the second data transmission port; the second data transmission port is electrically connected to the power supply port.

[0010] With such a configuration, the second data transmission port on the first expansion board can establish a communication connection through the first transmission cable and the chip, thereby meeting the transmission requirements that require a larger number of data transmission ports. At the same time, setting the first expansion board as an ordinary board can also further reduce the consumption of PCB boards while ensuring the transmission speed.

[0011] In some embodiments, the data transmission device also includes: a second expansion board; the second expansion board is connected to the low-speed signal board; the second expansion board has at least one third data transmission port; the third data transmission port is communicatively connected to the chip, and the third data transmission port is electrically connected to the power supply port.

[0012] With such a configuration, the second expansion board can not only provide a larger number of third data transmission ports and improve the transmission speed by connecting to the low-speed signal board, but also receive stable power supply from the power supply port to ensure the quality of data transmission.

[0013] In some embodiments, the data transmission device also includes: a second transmission cable; the second transmission cable passes through the low-speed signal board, and both ends of the second transmission cable are respectively connected to the third data transmission port and the high-speed signal board, so that the chip is communicatively connected with the third data transmission port.

[0014] With this arrangement, the low-speed signal boards can be tightly connected to each other to ensure the integrity of the structure. When the spacing is small, the second transmission cable can penetrate the low-speed signal board to achieve communication connection with the chip, thereby ensuring the data transmission quality.

[0015] In some embodiments, the second expansion board also has a first power connector; one end of the first power connector is connected to the second expansion board and electrically connected to the third data transmission port, and the other end of the first power connector is connected to the low-speed signal board and electrically connected to the power supply port.

[0016] With this arrangement, the first power connector can supply power to the third data transmission port when there is a certain distance between the second expansion board and the low-speed signal board, and connect the second expansion board and the low-speed signal board as a whole to ensure stable data transmission.

[0017] In some embodiments, the second expansion board further has a second power connector; one end of the second power connector is connected to the second expansion board and electrically connected to the first power connector, and the other end of the second power connector is connected to the first expansion board and electrically connected to the second data transmission port.

[0018] With this arrangement, the second power connector can cooperate with the first power connector to supply power. When there is a certain distance between the second expansion board and the low-speed signal board, the second power connector can connect the first expansion board and the second expansion board as a whole while achieving stable power supply to the second data transmission port.

[0019] In some embodiments, the first extension board is connected to a side of the low-speed signal board facing the high-speed signal board and is arranged in parallel with the high-speed signal board; the second extension board is connected to a side of the low-speed signal board away from the high-speed signal board.

[0020] In this way, the first expansion board and the high-speed signal board are arranged in parallel, which can reduce the length of the first transmission cable as much as possible, ensure the stable transmission of data, and reduce the material usage of the first transmission cable, further reducing the production cost. At the same time, the second expansion board and the high-speed signal board are located on opposite sides of the low-speed signal board, which can also avoid mutual interference between the first data transmission port and the third data transmission port in space when the number is large, and minimize the space occupied by the overall structure.

[0021] In some embodiments, the high-speed signal board and the low-speed signal board are stacked, and a projection area of ​​the high-speed signal board on a horizontal plane is smaller than a projection area of ​​the low-speed signal board on the same horizontal plane.

[0022] In this way, the high-speed signal board is attached to the end surface with the largest area of ​​the low-speed signal board, and the two are parallel. The distance between the chip and the first data transmission port and the power supply port can be kept at a minimum value, thereby ensuring stable power supply. In addition, the projection area of ​​the high-speed signal board is smaller than the projection area of ​​the low-speed signal board, which ensures low consumption of PCB board and can provide installation space for other additional structures such as port cages.

[0023] In some embodiments, the low-speed signal board also has a power supply socket; the high-speed signal board also has a power connection part; the power connection part is arranged on an end surface of the high-speed signal board facing the low-speed signal board, and is electrically connected to the chip; one end of the power supply socket is electrically connected to the power supply port, and the other end of the power supply socket abuts against the power connection part, so that the power supply port and the chip are electrically connected, and the power supply port supplies power to the chip and the first data transmission port.

[0024] In this arrangement, the power supply socket is connected to the low-speed signal board and abuts against the power connection part in the high-speed signal board to achieve vertical power supply to the high-speed signal board. Furthermore, the chip and the first data transmission port can both receive power supply at the shortest distance to maintain high stability of data transmission.

[0025] In some embodiments, the data transmission device further includes a heat dissipation component; the heat dissipation component is disposed on the chip and is configured to absorb heat generated by the chip.

[0026] With such an arrangement, the heat dissipation component can effectively and directly dissipate heat for the first data transmission port. Compared with the N+N stacking solution in the related art in which it is difficult to dissipate heat for the multi-layer port cage, the heat dissipation component has a higher heat dissipation efficiency for the first data transmission port, thereby ensuring the stability of data transmission.

[0027] In addition to the technical problems solved by the embodiments of the present application, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the data transmission equipment provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 A schematic diagram of the structure of a data transmission device provided in an embodiment of the present application;

[0030] Figure 2 A schematic diagram of the structure of the data transmission device provided in another angle according to an embodiment of the present application;

[0031] Figure 3 A schematic diagram of the exploded structure of a data transmission device provided in an embodiment of the present application;

[0032] Figure 4 This is a structural schematic diagram of the perspective of an end face of a high-speed signal board of a data transmission device provided in an embodiment of the present application, which is away from the printed end face.

[0033] Reference numerals:

[0034] 100-data transmission equipment;

[0035] 110-high-speed signal board; 111-high-speed signal component; 112-chip; 113-first data transmission port; 114-power connection unit;

[0036] 120- low speed signal board; 121- low speed signal component; 122- power supply port; 123- cable through hole; 124- power supply socket;

[0037] 130 - first expansion board; 131 - second data transmission port;

[0038] 140-first transmission cable;

[0039] 150 - second expansion board; 151 - third data transmission port; 152 - first power connection piece; 153 - second power connection piece;

[0040] 160-second transmission cable;

[0041] 170-Heat dissipation assembly. DETAILED DESCRIPTION

[0042] In the related art, the data transmission device generally has a chip, a PCB (Printed Circuit Board) board and a data transmission port, and the chip and the data transmission port are connected on the PCB board. The PCB board provides the operating basis for high-speed data transmission signals. The chip realizes communication connection with the data transmission port through the routing on the PCB board to realize the control of data transmission. Since the number of data transmission ports directly affects the transmission speed and quality during the data transmission process, the number of data transmission ports is generally large. In order to meet the communication connection between a large number of data transmission ports and chips, the related art generally adopts the port setting method of N+N stacked routing solution or single-layer routing + cable solution.

[0043] The N+N stacked wiring scheme generally uses two PCB boards with N layers to press the chip and wiring between the two PCB boards, and connects the data transmission ports on both PCB boards, and mechanically connects the data transmission ports to the port cage to achieve data transmission. The N+N stacked wiring scheme will stack two layers of port cages on each PCB board to meet the connection requirements of a large number of data transmission ports. However, due to the use of two PCB boards, the production consumes more PCB boards, the cost is high, and the pressing process steps are also more cumbersome; at the same time, the two-layer port cage makes it difficult for the data transmission port that generates a lot of heat to dissipate heat effectively.

[0044] The single-layer wiring + cable solution sets the chip and some data transmission ports on a single PCB board, and the remaining data transmission ports that cannot be connected to the PCB board are set on another single PCB board, and a transmission cable is used to connect the data transmission ports on the other PCB board to the chip for communication. Although the heat dissipation effect is improved, the size of the PCB board, the number of boards consumed and the manufacturing process remain unchanged, and the production and connection steps of the transmission cable are increased, which not only increases the production cost, but also makes the production process more complicated.

[0045] In order to solve the above problems, the present application provides a data transmission device, which integrates the low-speed signal parts and power supply ports on the original PCB board with low requirements for signals and plates on the low-speed signal board made of ordinary plates, and only retains the high-speed signal parts, chips and first data transmission ports with high requirements for signals and plates on the high-speed signal board, which can effectively reduce the surface area and volume of the high-speed signal board made of PCB material, so that more high-speed signal boards can be produced with PCB plates of the same specifications, thereby saving the consumption of PCB plates and reducing production costs. At the same time, the first data transmission port and chip on the single high-speed signal board can also obtain good heat dissipation, ensuring the stable data transmission.

[0046] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of this application.

[0047] Reference Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of a data transmission device 100 provided in an embodiment of the present application is shown in FIG. Figure 2This is a structural diagram of the data transmission device 100 provided in another angle according to an embodiment of the present application. Figure 1 and Figure 2 As shown, an embodiment of the present application provides a data transmission device 100, including: a high-speed signal board 110 and a low-speed signal board 120; the high-speed signal board 110 is connected to one side of the low-speed signal board 120; the high-speed signal board 110 has a high-speed signal component 111, a chip 112 and a plurality of first data transmission ports 113, and the chip 112 is communicatively connected to the first data transmission port 113; the low-speed signal board 120 has a low-speed signal component 121 and a power supply port 122, the chip 112 and the first data transmission port 113 are electrically connected to the power supply port 122 respectively, and the power supply port 122 is configured to access a power source and supply power to the high-speed signal component 111, the chip 112 and the first data transmission port 113.

[0048] In the embodiment of the present application, the high-speed signal board 110 is made of PCB board material, while the low-speed signal board 120 is made of ordinary board material. The reason is that the data signal transmission of the chip 112, the first data transmission port 113 and the high-speed signal member 111 on the high-speed signal board 110 requires the support of high-quality PCB board material to reduce the loss of signal transmission; while for the low-speed signal board 120, the low-speed signal member 121 and the power supply port 122 arranged thereon have lower requirements for the loss of signal transmission, so the low-speed signal board 120 can be manufactured with ordinary board material.

[0049] The main function of the chip 112 is to process data and issue transmission instructions to the data to control each first data transmission port 113 to transmit data. Each first data transmission port 113 is connected to the device to be transmitted to transmit data. The first data transmission port 113 can be in the form of an optical module. The high-speed signal component 111 can include high-speed transmission signal components such as clock signal components, PCIE (Peripheral Component Interconnect Express, high-speed serial computer expansion bus standard) signal components, and these signal components are connected to the printed end surface of the high-speed signal board 110. The printed end surface of the high-speed signal board 110 is the end surface with the largest area in the high-speed signal board 110, and the chip 112 and the first data transmission port 113 are also installed on the printed end surface of the high-speed signal board 110. The chip 112, the high-speed signal component 111 and the first data transmission port 113 are all welded or plugged between the high-speed signal board 110 to achieve fixation with the high-speed signal board 110. At the same time, there is an electrical connection between the chip 112, the high-speed signal component 111 and the first data transmission port 113 and the high-speed signal board 110. The high-speed signal board 110 has wiring, and the chip 112 can be electrically and communicatively connected with the high-speed signal component 111 through the wiring, and the chip 112 is electrically and communicatively connected with the first data transmission port 113 through the wiring. Exemplarily, the wiring between the chip 112 and the first data transmission port 113 can be a 224G or higher serializer and deserializer (Serializer / Deserializer, referred to as SerDes) wiring, which supports high-speed data transmission. Correspondingly, the first data transmission port 113 needs to be a 1.6T optical module to adapt to 224G or higher data transmission.

[0050] The chip 112, the high-speed signal component 111 and the first data transmission port 113 all need power to operate, and the low-speed signal board 120 can effectively power the chip 112, the high-speed signal component 111 and the first data transmission port 113. The low-speed signal board 120 is provided with a low-speed signal component 121 such as a CPLD / I2C low-speed component, and is also provided with a power supply port 122. The power supply port 122 and the low-speed signal component 121 are arranged on the printed end surface of the low-speed signal board 120, and the power supply port 122 and the low-speed signal component 121 are also electrically connected through wiring. The power supply port 122 can be connected to an external power supply. After receiving power supply, the low-speed signal board 120 can power the chip 112, the high-speed signal component 111 and the first data transmission port 113 on the high-speed signal board 110. Exemplarily, the high-speed signal board 110 and the low-speed signal board 120 can be electrically connected via a flexible power supply cable, that is, the pins of the chip 112, the pins of the first data transmission port 113, and the pins of the high-speed signal component 111 can all be electrically connected via the power supply cable and the power supply port 122 on the low-speed signal board 120; alternatively, a rigid conductive component can be provided, one end of the conductive component is electrically connected to the pins of the chip 112, the pins of the first data transmission port 113, and the pins of the high-speed signal component 111, and the other end is electrically connected to the power supply port 122, so as to realize power supply from the low-speed signal board 120 to the high-speed signal board 110.

[0051] In addition, the positional relationship between the high-speed signal board 110 and the low-speed signal board 120 can be parallel to each other or have a certain angle. The high-speed signal board 110 can partially or completely overlap with the low-speed signal board 120, or can be arranged in parallel, as long as a stable electrical connection is ensured between the low-speed signal board 120 and the high-speed signal board 110.

[0052] Compared with the related art, the high-speed signal component 111 and the low-speed signal component 121 are both arranged on the same PCB board. In the present application, the low-speed signal component 121 and the power supply port 122 are transferred to the low-speed signal board 120, and only the high-speed signal component 111, the chip 112 and the first data transmission port 113 with higher requirements on signals and boards are retained on the high-speed signal board 110. This can effectively reduce the area of ​​the high-speed signal board 110 made of PCB material, while ensuring the normal operation of high-speed signal transmission, reducing the consumption of PCB board materials. At the same time, compared to the related art, in which a piece of N-layer PCB board made of PCB material is pressed together with another piece of power PCB board to realize power supply to the N-layer PCB board, the present application further integrates the low-speed signal component 121 into the low-speed signal board 120 made of ordinary board, and cancels the pressing step between the low-speed signal board 120 and the high-speed signal board 110, and implements a non-pressed electrical connection between the low-speed signal board 120 and the high-speed signal board 110, which can reduce the production steps and improve the production efficiency while reducing the consumption of PCB board. At the same time, compared to the low heat dissipation of the two PCB boards of the N+N stacking scheme in the related art, the first data transmission port 113 and the chip 112 on the single high-speed signal board 110 can also get good heat dissipation, thereby ensuring the stable data transmission.

[0053] In some embodiments, Figure 1 and Figure 2 As shown, the data transmission device 100 also includes: a first expansion board 130 and a first transmission cable 140; the first expansion board 130 has at least one second data transmission port 131, and the two ends of the first transmission cable 140 are respectively connected to the second data transmission port 131 and the high-speed signal board 110, so that the chip 112 is communicatively connected with the second data transmission port 131; the second data transmission port 131 is electrically connected to the power supply port 122.

[0054] In the embodiment of the present application, the first expansion board 130 is manufactured using ordinary board materials, and there is an electrical connection between the second data transmission port 131 and the first expansion board 130. In actual production, the high-speed signal board 110 is limited by the grade of its own PCB board material, and the number of first data transmission ports 113 provided thereon is also limited, because the wiring lengths between the chip 112 and the first data transmission port 113 are different in PCB boards of different grades. The higher the grade of the board material, the higher the data transmission rate, and the shorter its wiring. Therefore, in the high-speed signal board 110 of the same area, the higher the grade of the board material, the fewer first data transmission ports 113 it can accommodate. This easily leads to a situation where there are too few first data transmission ports 113 and the data transmission of more ports cannot be met.

[0055] When the number of the first data transmission ports 113 cannot meet the requirements of high-speed data transmission, the second expansion board 150 can use the second data transmission port 131 to supplement the number of data transmission ports. The number of the first expansion board 130 can be one or more, so as to connect different numbers of second data transmission ports 131 to the high-speed signal board 110 according to the needs. Correspondingly, a plurality of first cable interfaces are provided on the high-speed signal board 110, and the first cable interface is communicated and electrically connected with the chip 112 through wiring. One end of the first transmission cable 140 is communicated and connected with the first cable interface, and the other end of the first transmission cable 140 is communicated and connected with the second data transmission port 131, and then, the second data transmission port 131 can be communicated and connected with the chip 112 to smoothly transmit data. Among them, the second data transmission port 131 can be electrically connected with the power supply port 122 through a powered cable or a conductive member.

[0056] With such a configuration, the second data transmission port 131 on the first expansion board 130 can establish a communication connection through the first transmission cable 140 and the chip 112, thereby meeting the transmission requirements requiring a larger number of data transmission ports. At the same time, setting the first expansion board 130 as an ordinary board can also prevent an increase in the consumption of PCB boards while ensuring the transmission speed.

[0057] In some embodiments, Figure 1 and Figure 2 As shown, the data transmission device 100 also includes: a second expansion board 150; the second expansion board 150 is connected to the low-speed signal board 120; the second expansion board 150 has at least one third data transmission port 151; the third data transmission port 151 is communicatively connected to the chip 112, and the third data transmission port 151 is electrically connected to the power supply port 122.

[0058] In an embodiment of the present application, the second expansion board 150 is directly mechanically connected to the low-speed signal board 120. For example, the second expansion board 150 can be stacked with the low-speed signal board 120 and can be connected by bolts and other connectors. Furthermore, the connection between the second expansion board 150 and the low-speed signal board 120 is more stable, and a larger number of third data transmission ports 151 can be accommodated. The third data transmission port 151 can be connected to the chip 112 through a data transmission component or a transmission cable, and can be electrically connected to the power supply port 122 through a powered cable or a conductive component. The second expansion board 150 can not only provide a larger number of third data transmission ports 151 through the connection with the low-speed signal board 120, meet the transmission requirements of multiple ports, and improve the transmission speed, but also accept the stable power supply of the power supply port 122 to ensure the quality of data transmission. Among them, the number of second expansion boards 150 can also be one or more, which can be selected according to the number of data transmission ports required.

[0059] In some embodiments, reference Figure 3 , Figure 3 Schematic diagram of the exploded structure of the data transmission device 100 provided in the embodiment of the present application. Figure 3 As shown, the data transmission device 100 also includes: a second transmission cable 160; the second transmission cable 160 passes through the low-speed signal board 120, and the two ends of the second transmission cable 160 are respectively connected to the third data transmission port 151 and the high-speed signal board 110, so that the chip 112 is communicatively connected with the third data transmission port 151.

[0060] In the embodiment of the present application, a cable through hole 123 is provided on the low-speed signal board 120, and the second transmission cable 160 is inserted into the cable through hole 123, thereby realizing the communication connection between the third data transmission port 151 and the chip 112. Similar to the above-mentioned first transmission cable 140, a second cable interface is provided on the high-speed signal board 110, and there is an electrical connection and a communication connection between the second cable interface and the chip 112, and then, the second transmission cable 160 is connected to the chip 112 through the second cable interface. In the case where the distance between the low-speed signal board 120 and the second expansion board 150 is small, the communication connection with the chip 112 is realized by passing the second transmission cable 160 through the low-speed signal board 120, which can ensure the transmission quality of data.

[0061] In some embodiments, Figure 1 and Figure 2 As shown, the second expansion board 150 also has a first power connector 152; one end of the first power connector 152 is connected to the second expansion board 150 and electrically connected to the third data transmission port 151, and the other end of the first power connector 152 is connected to the low-speed signal board 120 and electrically connected to the power supply port 122.

[0062] In the embodiment of the present application, the first electrical connector 152 is a conductive component made of a conductive material with a certain length, for example, it can be made of copper. The first electrical connector 152 is protrudingly arranged on one end surface of the second expansion board 150 facing the low-speed signal board 120, and there is a mechanical connection between the first electrical connector 152 and the low-speed signal board 120, connecting the second expansion board 150 and the low-speed signal board 120 as a whole to ensure stable data transmission. After the first electrical connector 152 is connected to the low-speed signal board 120, it can be electrically connected to the power supply port 122 through the wiring on the low-speed signal board 120, or it can be electrically connected to the power supply port 122 through an additional power supply cable, thereby realizing the power supply from the power supply port 122 to the third data transmission port 151.

[0063] In some embodiments, Figure 1 and Figure 2 As shown, the second expansion board 150 also has a second connector 153 ; one end of the second connector 153 is connected to the second expansion board 150 and electrically connected to the first connector 152 , and the other end of the second connector 153 is connected to the first expansion board 130 and electrically connected to the second data transmission port 131 .

[0064] In the embodiment of the present application, similar to the first electrical connector 152, the second electrical connector 153 is a conductive component made of a conductive material with a certain length, for example, it can be made of copper. The second electrical connector 153 is protrudingly arranged in the second expansion board 150 on one end surface facing the first expansion board 130 to achieve mechanical connection with the first expansion board 130. After the second electrical connector 153 is connected to the first expansion board 130, the first expansion board 130 and the second expansion board 150 are connected as a whole. At the same time, the whole forms a larger whole with the low-speed signal board 120 through the first electrical connector 152, thereby ensuring the stability of the structure. The power supply port 122 is electrically connected to the first electrical connector 152 through a wiring or a power supply cable, and the first electrical connector 152 is electrically connected to the second electrical connector 153 through the wiring on the second expansion board 150, thereby realizing the power supply from the power supply port 122 to the second electrical connector 153 and the power supply to the second data transmission port 131. When the first expansion board 130 and the second expansion board 150 are located on different sides of the low-speed signal board 120, the second electrical connector 153 can also penetrate the low-speed signal board 120 and connect the first expansion board 130 and the second expansion board 150 located on different sides to form a more stable overall structure.

[0065] With such configuration, the second power connector 153 can cooperate with the first power connector 152 to supply power. When there is a certain distance between the second expansion board 150 and the low-speed signal board 120, the second power connector 153 can connect the first expansion board 130 and the second expansion board 150 as a whole while realizing stable power supply to the second data transmission port 131.

[0066] In some embodiments, Figure 1 and Figure 2 As shown, the first expansion board 130 is connected to the side of the low-speed signal board 120 facing the high-speed signal board 110 and is arranged in parallel with the high-speed signal board 110; the second expansion board 150 is connected to the side of the low-speed signal board 120 away from the high-speed signal board 110.

[0067] In the embodiment of the present application, the first expansion board 130 and the high-speed signal board 110 are located on the same side of the low-speed signal board 120, for example, both can be located on one side of the printed end surface of the low-speed signal board 120, and the second expansion board 150 is located on the side of the low-speed signal board 120 away from the printed end surface. When there are two first expansion boards 130, they can also be symmetrically arranged on both sides of the high-speed signal board 110. In addition, the interface ends of the first data transmission port 113, the second data transmission port 131 and the third data transmission port 151 can be kept flush to keep the interface ends in the same plane for easy data transmission.

[0068] In this way, the first expansion board 130 and the high-speed signal board 110 are arranged in parallel, which can reduce the length of the first transmission cable 140 as much as possible, ensure the stable transmission of data, and reduce the material usage of the first transmission cable 140, further reducing the production cost. At the same time, the second expansion board 150 and the high-speed signal board 110 are located on opposite sides of the low-speed signal board 120, and when the number of the first data transmission port 113 and the third data transmission port 151 is large, it can also avoid the mutual interference between the two in space, and minimize the space occupied by the overall structure.

[0069] In some embodiments, Figure 1 and Figure 2 As shown, the high-speed signal board 110 and the low-speed signal board 120 are stacked, and the projection area of ​​the high-speed signal board 110 on the horizontal plane is smaller than the projection area of ​​the low-speed signal board 120 on the same horizontal plane.

[0070] In the embodiment of the present application, the area of ​​the printed end face of the high-speed signal board 110 is smaller than the area of ​​the printed end face of the low-speed signal board 120. Therefore, when the high-speed signal board 110 and the low-speed signal board 120 are stacked, the space occupied is actually the space occupied by the low-speed signal board 120, and the high-speed signal board 110 does not occupy more space, thereby ensuring the compactness of the structure. The end face of the high-speed signal board 110 opposite to the printed end face is attached to the end face with the largest area (i.e., the printed end face) of the low-speed signal board 120, and the two are in a parallel state. The distance between the chip 112 and the first data transmission port 113 and the power supply port 122 can be kept at the minimum value, thereby ensuring stable power supply. In addition, the projection area of ​​the high-speed signal board 110 is smaller than the projection area of ​​the low-speed signal board 120, while ensuring the low consumption of the PCB board, it can provide installation space for other additional structures such as port cages. In addition, the PCB board of the same size can produce a larger number of high-speed signal boards 110 with reduced area, thereby accelerating production efficiency.

[0071] In some embodiments, reference Figure 3 and Figure 4 , Figure 4 This is a structural schematic diagram of a perspective of an end surface of a high-speed signal board 110 of a data transmission device 100 provided in an embodiment of the present application, which is away from the printed end surface. Figure 3 and Figure 4 As shown, the low-speed signal board 120 also has a power supply socket 124; the high-speed signal board 110 also has a power connection portion 114; the power connection portion 114 is arranged on an end surface of the high-speed signal board 110 facing the low-speed signal board 120, and is electrically connected to the chip 112; one end of the power supply socket 124 is electrically connected to the power supply port 122, and the other end of the power supply socket 124 abuts against the power connection portion 114 and is electrically connected to the power connection portion 114, so that the power supply port 122 and the chip 112 are electrically connected, and the power supply port 122 supplies power to the chip 112.

[0072] In the embodiment of the present application, the power supply socket 124 is located between the high-speed signal board 110 and the low-speed signal board 120. The power supply socket 124 directly abuts against an end face of the high-speed signal board 110 that is away from the printed end face, and the power connection portion 114 is located on the end face away from the printed end face, and the power connection portion 114 is electrically connected to the chip 112. The power supply socket 124 abuts against the power connection portion 114 and is electrically connected to the power connection portion 114, thereby realizing the shortest distance power supply from the low-speed signal board 120 to the chip 112 in the high-speed signal board 110 and the first data transmission port 113 when the high-speed signal board 110 and the low-speed signal board 120 are stacked.

[0073] In some embodiments, Figure 2As shown, the data transmission device 100 further includes a heat dissipation component 170 ; the heat dissipation component 170 is disposed on one side of the first data transmission port 113 and is located on the chip 112 , and the heat dissipation component 170 is configured to absorb heat generated by the chip 112 .

[0074] In the embodiment of the present application, the heat dissipation assembly 170 may include a port cage and a heat sink, the heat sink is arranged inside the port cage, and the heat sink is arranged on the chip 112 and directly contacts the chip 112 to absorb the heat of the chip 112. The heat sink may be arranged in the form of a fin or an aluminum extruded heat sink. The heat dissipation assembly 170 can effectively and directly dissipate the heat of the chip 112, with higher heat dissipation efficiency, thereby ensuring the stability of data transmission. Among them, the chip 112 may be a MAC chip or a switching chip.

[0075] In summary, in the data transmission device provided in the embodiment of the present application, by integrating the low-speed signal components and power supply ports on the original PCB board with low signal and board requirements on the low-speed signal board made of ordinary board, only retaining the high-speed signal components, chips and first data transmission ports with high signal and board requirements on the high-speed signal board, the surface area and volume of the high-speed signal board made of PCB material can be effectively reduced, so that more high-speed signal boards can be produced with PCB boards of the same specifications, thereby saving the consumption of PCB boards and reducing production costs. At the same time, the first data transmission port and chip on the single high-speed signal board can also obtain good heat dissipation, ensuring stable data transmission.

[0076] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0077] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A data transmission device, characterized in that: include: A high-speed signal board (110) and a low-speed signal board (120); the high-speed signal board (110) is connected to one side of the low-speed signal board (120); The high-speed signal board (110) is provided with a high-speed signal component (111), a chip (112) and a plurality of first data transmission ports (113), and the chip (112) is communicatively connected to the first data transmission ports (113); the low-speed signal board (120) is provided with a low-speed signal component (121) and a power supply port (122), the chip (112) and the first data transmission ports (113) are electrically connected to the power supply port (122) respectively, and the power supply port (122) is configured to access a power source and supply power to the high-speed signal component (111), the chip (112) and the first data transmission ports (113).

2. The data transmission device according to claim 1, characterized in that: Also includes: A first expansion board (130) and a first transmission cable (140); the first expansion board (130) is provided with at least one second data transmission port (131); two ends of the first transmission cable (140) are respectively connected to the second data transmission port (131) and the high-speed signal board (110), so that the chip (112) is communicatively connected with the second data transmission port (131); the second data transmission port (131) is electrically connected to the power supply port (122).

3. The data transmission device according to claim 2, characterized in that: Also includes: A second expansion board (150); the second expansion board (150) is connected to the low-speed signal board (120); the second expansion board (150) has at least one third data transmission port (151); the third data transmission port (151) is communicatively connected to the chip (112), and the third data transmission port (151) is electrically connected to the power supply port (122).

4. The data transmission device according to claim 3, characterized in that: Also includes: A second transmission cable (160); the second transmission cable (160) passes through the low-speed signal board (120), and two ends of the second transmission cable (160) are respectively connected to the third data transmission port (151) and the high-speed signal board (110), so that the chip (112) is communicatively connected with the third data transmission port (151).

5. The data transmission device according to claim 3, characterized in that: The second expansion board (150) also has a first electrical connector (152); one end of the first electrical connector (152) is connected to the second expansion board (150) and is electrically connected to the third data transmission port (151), and the other end of the first electrical connector (152) is connected to the low-speed signal board (120) and is electrically connected to the power supply port (122).

6. The data transmission device according to claim 5, characterized in that: The second expansion board (150) also has a second electrical connector (153); one end of the second electrical connector (153) is connected to the second expansion board (150) and is electrically connected to the first electrical connector (152), and the other end of the second electrical connector (153) is connected to the first expansion board (130) and is electrically connected to the second data transmission port (131).

7. The data transmission device according to any one of claims 3 to 6, characterized in that: The first expansion board (130) is connected to a side of the low-speed signal board (120) facing the high-speed signal board (110) and is arranged in parallel with the high-speed signal board (110); and the second expansion board (150) is connected to a side of the low-speed signal board (120) facing away from the high-speed signal board (110).

8. The data transmission device according to any one of claims 1 to 6, characterized in that: The high-speed signal board (110) and the low-speed signal board (120) are stacked, and the projection area of ​​the high-speed signal board (110) on a horizontal plane is smaller than the projection area of ​​the low-speed signal board (120) on the same horizontal plane.

9. The data transmission device according to claim 8, characterized in that: The low-speed signal board (120) also has a power supply seat (124); the high-speed signal board (110) also has a power connection portion (114); the power connection portion (114) is arranged on an end surface of the high-speed signal board (110) facing the low-speed signal board (120), and is electrically connected to the chip (112); one end of the power supply seat (124) is electrically connected to the power supply port (122), and the other end of the power supply seat (124) abuts against the power connection portion (114) and is electrically connected to the power connection portion (114), so that the power supply port (122) and the chip (112) are electrically connected, and the power supply port (122) supplies power to the chip (112) and the first data transmission port (113).

10. The data transmission device according to any one of claims 1 to 6, characterized in that: A heat dissipation component (170) is also included; the heat dissipation component (170) is arranged on the chip (112) and is configured to absorb heat generated by the chip (112).

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