Circuit board copper deposition equipment

Abstract

The invention discloses circuit board copper deposition equipment which comprises a supporting plate, the left side and the right side of the upper surface of the supporting plate are connected with two telescopic columns, the middle side of the upper surface of the supporting plate is connected with a forward and reverse motor, the forward and reverse motor is connected with a rotating shaft, the other side of the rotating shaft is connected with a connecting rod, and the connecting rod is connected with an upper frame. The front side and the rear side of the upper frame are each provided with two upper supporting legs, each upper supporting leg is provided with a first through hole, the upper supporting legs are connected with lower supporting legs in a sliding mode, each lower supporting leg is provided with a plurality of second through holes, the lower supporting legs are located on the lower frame, and the portions, between the left lower supporting leg and the right lower supporting leg, of the lower frame and the upper frame are each provided with a plurality of clamping grooves. The copper deposition equipment provided by the invention has the advantages that the functions are diversified, and the effect of improving the copper deposition quality can be achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit boards, and in particular relates to a circuit board copper deposition device. Background Art

[0002] In the production process of printed circuit boards, copper plating is an indispensable process, and the quality of copper plating is directly related to the performance of the circuit board. The existing copper plating process is to place multiple circuit boards in a basket, and then put the basket into a container filled with copper plating liquid, so that the circuit boards are fully immersed in the copper plating liquid in the container, and the circuit boards after drilling undergo oxidation-reduction reactions in the copper plating tank to form a copper layer to metallize the holes, so that copper is deposited on the surface of the original insulating substrate to achieve electrical connectivity between layers.

[0003] During the copper plating process, the circuit board needs to be placed in a basket and the groove in the basket is used to clamp the main circuit board. Generally, the thickness of the circuit board is smaller than the width of the groove, which will cause the risk of it falling off during the copper plating process. When the width of the circuit board is much smaller than or close to the width of the groove, it will cause trouble for installation or removal. At the same time, the circuit board is required to be of consistent height, which is not flexible enough. In addition, during the copper plating process, the tiny holes on the circuit board cannot be covered by copper due to the presence of small bubbles, resulting in the produced circuit boards being unusable and of poor quality. Summary of the invention

[0004] The object of the present invention is to provide a circuit board copper deposition device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a circuit board copper plating equipment, comprising a support plate, two telescopic columns are connected to the left and right sides of the upper surface of the support plate, the middle side of the upper surface of the support plate is connected to a forward and reverse motor, the forward and reverse motor is connected to a rotating shaft, the other side of the rotating shaft is connected to a connecting rod, the connecting rod is connected to an upper frame, two upper legs are respectively provided on the front and rear sides of the upper frame, the upper legs are provided with a through hole 1, the upper legs are slidably connected to the lower legs, the lower legs are provided with a plurality of through holes 2, the lower legs are located on the lower frame, and a plurality of slots are provided on the lower frame and the upper frame between the left and right lower legs, an elastic plate is provided in the slot, and the through hole 1 is the same size as the through hole 2.

[0006] Preferably, the left and right sides of the upper frame are provided with a plurality of side panels 1, the side panels 1 are provided with a plurality of conical rods 1, the right side of the lower frame is provided with a plurality of side panels 2, the side panels 2 are provided with a plurality of conical rods 2.

[0007] Preferably, the upper and lower card slots have one-to-one correspondence.

[0008] Technical effects and advantages of the present invention: The circuit board can be well fixed by the provided card slot and the elastic plate in the card slot to prevent it from slipping, and the operation is convenient, which greatly improves the work efficiency.

[0009] By setting the through hole 1 and the through hole 2, the distance between the upper and lower frames can be changed through the cooperation of the plugs to adapt to different batches of circuit boards.

[0010] The tapered rod can puncture the bubbles generated by copper deposition and improve the copper deposition effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the present invention; Figure 2 For the present invention Figure 1 A partial enlarged view of part A.

[0012] In the figure: 100 support plate, 200 telescopic column, 300 forward and reverse motor, 310 rotating shaft, 320 connecting rod, 400 upper frame, 410 upper leg, 420 through hole 1, 430 side plate 1, 440 tapered rod 1, 500 lower frame, 510 lower leg, 520 through hole 2, 530 slot, 540 elastic plate, 560 side plate 2, 570 tapered rod 2. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0014] The present invention provides Figure 1-2 A circuit board copper deposition device shown in the figure includes a support plate 100, two telescopic columns 200 are connected to the left and right sides of the upper surface of the support plate 100, the middle side of the upper surface of the support plate 100 is connected to the forward and reverse motor 300, the forward and reverse motor 300 is connected to the rotating shaft 310, the other side of the rotating shaft 310 is connected to the connecting rod 320, the connecting rod 320 is connected to the upper frame 400, and two upper legs 410 are respectively provided on the front and rear sides of the upper frame 400, the upper leg 410 is provided with a through hole 1 420, the upper leg 410 is slidably connected to the lower leg 510, the lower leg 510 is provided with a plurality of through holes 2 520, the lower leg 510 is located on the lower frame 500, and a plurality of slots 530 are provided on the lower frame 500 and the upper frame 400 between the left and right lower legs 510, and an elastic plate 540 is provided in the slot 530, and the through hole 1 420 is the same size as the through hole 2 520.

[0015] Among them, the function of the telescopic column 200 is to place the circuit board into the copper deposition pool, and adjust the distance between the upper frame 400 and the lower frame 500 of the same batch of circuit boards according to the height. Specifically, by inserting the plug into the through hole 1 420 and the through hole 2 520, after adjusting the height, the circuit board is clamped into the elastic plate 540 of the upper and lower slots 530 to fix it, and the forward and reverse motor 300 is used to rotate it to improve the copper deposition effect.

[0016] In some specific embodiments of the present invention, a plurality of side panels 430 are provided on the left and right sides of the upper frame 400, a plurality of conical rods 440 are provided on the side panel 430, and a plurality of side panels 560 are provided on the right side of the lower frame 500, a plurality of conical rods 570 are provided on the side panel 560.

[0017] The tapered rod 570 can burst the bubbles in the pool when the circuit board rotates during copper deposition, thereby enhancing the copper deposition effect.

[0018] In some specific embodiments of the present invention, the upper and lower slots 530 are located in one-to-one correspondence.

[0019] When the circuit board is installed into the upper frame 400 and the lower frame 500, no misalignment occurs.

[0020] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A circuit board copper deposition device, comprising a support plate (100), wherein two telescopic columns (200) are connected to the left and right sides of the upper surface of the support plate (100), a forward and reverse motor (300) is connected to the middle side of the upper surface of the support plate (100), the forward and reverse motor (300) is connected to a rotating shaft (310), and the other side of the rotating shaft (310) is connected to a connecting rod (320), characterized in that: The connecting rod (320) is connected to the upper frame (400). Two upper legs (410) are respectively provided on the front and rear sides of the upper frame (400). The upper legs (410) are provided with a first through hole (420). The upper legs (410) are slidably connected to the lower legs (510). The lower legs (510) are provided with a plurality of second through holes (520). The lower legs (510) are located on the lower frame (500). A plurality of slots (530) are provided on the lower frame (500) and the upper frame (400) between the left and right lower legs (510). An elastic plate (540) is provided in the slots (530). The size of the first through hole (420) is the same as that of the second through hole (520).

2. A circuit board copper deposition equipment according to claim 1, characterized in that: The upper frame (400) is provided with a plurality of side panels (430) on the left and right sides, and a plurality of conical rods (440) are provided on the side panels (430). The lower frame (500) is provided with a plurality of side panels (560) on the right side, and a plurality of conical rods (570) are provided on the side panels (560).

3. A circuit board copper deposition equipment according to claim 1, characterized in that: The upper and lower card slots (530) correspond in position to each other.

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