Array substrate, pixel arrangement structure, display panel and display device

Abstract

The invention relates to an array substrate, a pixel arrangement structure, a display panel and a display device. The array substrate comprises a plurality of bonding pad groups, the bonding pad groups are used for being connected with a light-emitting device, and the light-emitting device comprises a plurality of sub-pixels; the bonding pad group comprises a plurality of main bonding pads and at least one redundant bonding pad; the plurality of main bonding pads are respectively used for connecting different sub-pixels, and the redundant bonding pads are configured to repair corresponding abnormal bonding pads when the main bonding pads are abnormal and are electrically connected with the pixel driving circuits corresponding to the abnormal bonding pads; wherein in the same bonding pad group, the number of the redundant bonding pads is smaller than that of the main bonding pads. According to the array substrate, the influence of redundant bits on the display effect of the display device can be reduced, the pixel density of the display device can be improved, and the display effect of the display device can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an array substrate, a pixel arrangement structure, a display panel and a display device. Background Art

[0002] With the continuous development of display technology, Micro LED (Micro Light Emitting Diode) display panels have incomparable advantages in luminous power, power consumption, contrast, response speed, and lifespan.

[0003] At present, in the preparation process of Micro LED, the arrayed chips need to be transferred and bonded to the target substrate. During the chip transfer process, a large number of redundant bits need to be reserved on the target substrate to repair the broken chips. However, the existence of a large number of redundant bits affects the display effect of the display device. Summary of the invention

[0004] Based on this, it is necessary to provide an array substrate, a pixel arrangement structure, a display panel and a display device, aiming to solve the technical problem that the presence of a large number of redundant bits in the Micro LED preparation process affects the display effect of the display device.

[0005] In a first aspect, an embodiment of the present application provides an array substrate, comprising a plurality of pad groups, the pad groups being used to connect a light-emitting device, the light-emitting device comprising a plurality of sub-pixels; the pad groups comprising a plurality of main pads and at least one redundant pad; the plurality of main pads being used to connect different sub-pixels, respectively, the redundant pads being configured to repair the corresponding abnormal pads when the main pads are abnormal, and being electrically connected to the pixel driving circuit corresponding to the abnormal pads; wherein, in the same pad group, the number of redundant pads is less than the number of main pads.

[0006] In the second aspect, an embodiment of the present application also provides a pixel arrangement structure, including multiple pixel groups, each pixel group including multiple sub-pixels and at least one redundant sub-pixel; the redundant sub-pixels are used to emit light of corresponding colors when the sub-pixels are abnormal; the redundant sub-pixels are configured to repair the corresponding abnormal sub-pixels when the sub-pixels are abnormal, and are electrically connected to the pixel driving circuit corresponding to the abnormal sub-pixels; wherein, in the same pixel group, the number of redundant sub-pixels is less than the number of sub-pixels.

[0007] In a third aspect, an embodiment of the present application further provides a display panel, which includes the array substrate provided in the first aspect or the pixel arrangement structure provided in the second aspect.

[0008] In a fourth aspect, an embodiment of the present application further provides a display device, which includes the display panel provided in the third aspect.

[0009] The array substrate provided by the embodiment of the present application is provided with a plurality of pad groups on the array substrate, and a plurality of main pads and at least one redundant pad are provided in the pad groups. When the main pad is abnormal, the corresponding abnormal pad is repaired by the redundant pad, so that the sub-pixel can emit light of the corresponding color normally again. Since the number of redundant pads is less than the number of main pads in the same pad group, it is not necessary to reserve a large number of redundant bits on the array substrate to repair the broken chip during the chip transfer process, thereby reducing the influence of the redundant bits on the display effect of the display device, thereby improving the pixel density of the display device, and improving the display effect of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 A schematic diagram of the structure of an array substrate provided in an embodiment of the present application;

[0011] Figure 2 for Figure 1 A schematic cross-sectional view of an array substrate;

[0012] Figure 3 A schematic diagram of the structure of the pad group provided in the embodiment of the present application;

[0013] Figure 4 for Figure 3 A schematic cross-sectional view of the middle pad group;

[0014] Figure 5 for Figure 3 A schematic cross-sectional view of a pad group after a redundant pad in the pad repairs a first pad;

[0015] Figure 6 for Figure 3 A schematic cross-sectional view of the pad group after two third pads in the pad group are electrically connected;

[0016] Figure 7 A schematic diagram of the structure of another pad group provided in an embodiment of the present application;

[0017] Figure 8 for Figure 7 A schematic cross-sectional view of the middle pad group;

[0018] Fig. 9 for Figure 7 A schematic cross-sectional view of the pad group after the middle redundant pad repairs the first pad;

[0019] Fig.10 A schematic diagram of the structure of another pad group provided in an embodiment of the present application;

[0020] Fig.11 for Fig.10 A schematic cross-sectional view of the middle pad group;

[0021] Fig.12 A schematic diagram of the structure of another pad group provided in an embodiment of the present application;

[0022] Fig.13 A schematic diagram of the structure of another pad group provided in an embodiment of the present application;

[0023] Fig.14 for Fig.13 A schematic cross-sectional view of the middle pad group;

[0024] Fig.15 A schematic diagram of the arrangement of the pixel arrangement structure provided in an embodiment of the present application;

[0025] Fig.16 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0026] Fig.17 Another schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0027] Fig.18 A schematic diagram of the structure of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0030] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or there may be intervening elements. Further, when a layer is referred to as being "under" another layer, it can be directly under or there may be one or more intervening elements. It is also understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or there may be one or more intervening elements.

[0031] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.

[0032] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present application.

[0033] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately", "approximately" or "substantially" can mean within one or more standard deviations, which are not limited here.

[0034] Furthermore, in the specification, the phrase “planar distribution schematic diagram” refers to a drawing when a target portion is viewed from above, and the phrase “cross-sectional schematic diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.

[0035] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0036] As mentioned in the background technology section, in the preparation process of Micro LED in the related technology, it is necessary to transfer and bond the arrayed chips to the target substrate. However, in the process of chip transfer, the number of chips that need to be transferred is extremely large, and a large amount of chips will be transferred. Limited by the yield of the mass transfer, a large number of chips will be damaged during the transfer process, and the damaged chips need to be replaced with new undamaged chips. Before replacing the new undamaged chips, the damaged chips need to be removed. In the process of removing the damaged chips, the main pads on the target substrate connected to the chip will be damaged simultaneously. Therefore, it is necessary to reserve a large number of redundant bits on the target substrate to repair the broken chips. However, the presence of a large number of redundant bits affects the display effect of the display device.

[0037] Based on the above technical problems, the inventors have found that the chips include green light chips, blue light chips and red light chips. The red light chips are more fragile than the green light chips and the blue light chips. During the chip transfer process, the mass transfer yield of the red light chips is lower than those of the green light chips and the blue light chips. That is, during the chip transfer process, the red light chips are more likely to be damaged.

[0038] It should be noted that the chip referred to in this application is a sub-pixel connected to the main pad in this application. The sub-pixel includes a green sub-pixel, a blue sub-pixel and a red sub-pixel, which emit green light, blue light and red light respectively. The green sub-pixel is the first sub-pixel in this application, the blue sub-pixel is the second sub-pixel in this application, and the red sub-pixel is the third sub-pixel in this application, that is, the first sub-pixel in this application is a green light chip, the second sub-pixel in this application is a blue light chip, and the third sub-pixel in this application is a red light chip.

[0039] Furthermore, based on the above research, the inventor designed the array substrate, pixel arrangement structure, display panel and display device of the present application by changing the number of redundant bits, that is, the number of redundant pads in the present application, and changing the positions of the redundant pads compared to the main pads connecting the first sub-pixel, the second sub-pixel and the third sub-pixel. This can reduce the impact of redundant bits on the display effect of the display device, thereby increasing the pixel density of the display device and improving the display effect of the display device.

[0040] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be described clearly and completely below in conjunction with the drawings in the embodiments of this application. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0041] like Figure 1 and Figure 2 As shown, the array substrate 1 provided in the embodiment of the present application includes a plurality of pad groups 11, the pad groups 11 are used to connect the light-emitting device, and the light-emitting device includes a plurality of sub-pixels 12; the pad groups 11 include a plurality of main pads 111 and at least one redundant pad 112; the plurality of main pads 111 are respectively used to connect different sub-pixels 12, and the redundant pads 112 are configured to repair the corresponding abnormal pads when the main pads 111 are abnormal, and are electrically connected to the pixel driving circuit corresponding to the abnormal pads; wherein, in the same pad group 11, the number of redundant pads 112 is less than the number of main pads 111.

[0042] It should be noted that the plurality of sub-pixels 12 are configured to emit light of the same color or light of different colors. Here, the color of the light emitted by the sub-pixels 12 is not limited.

[0043] Specifically, the pad group 11 includes a plurality of main pads 111 and at least one redundant pad 112, that is, during the preparation process of Micro LED, the light-emitting device needs to be transferred and bonded to the array substrate. During the transfer process of the light-emitting device, some of the light-emitting devices may be damaged. At this time, the damaged light-emitting device needs to be removed. It can be understood that since the main pad 111 is connected to the light-emitting device, the main pad 111 connected to the light-emitting device will be damaged during the removal of the light-emitting device, and the redundant pad 112 needs to be reserved to repair the damaged main pad 111. Among them, the plurality of main pads 111 are respectively used to connect different sub-pixels 12. When the main pad 111 is abnormal, the redundant pad 112 is used to repair the corresponding abnormal pad and is electrically connected to the pixel driving circuit corresponding to the abnormal pad, thereby controlling the corresponding sub-pixel 12 to emit light of the corresponding color normally again.

[0044] Furthermore, when the main pad 111 is not abnormal, the redundant pad 112 is not electrically connected to the pixel driving circuit, and at this time, the redundant pad 112 has no effect on the main pad 111. When the main pad 111 is abnormal, the redundant pad 112 is back-bonded to the side close to the bad point, and the overflow of the bonding metal is used to repair the corresponding abnormal pad, thereby achieving electrical connection with the pixel driving circuit corresponding to the abnormal pad, and repairing the abnormal pad.

[0045] Since the number of redundant pads 112 is less than the number of main pads 111, the number of redundant pads 112 can be reduced during the process of redundant pads 112 repairing abnormal pads, thereby reducing the space occupied by the redundant pads 112, thereby reducing the space occupied by the redundant pads 112 in the display panel 10 and the display device 100, thereby improving the pixel density of the display device 100 and improving the display effect of the display device 100.

[0046] In some embodiments, Figure 1 , Figure 2 and Figure 3 As shown, the main pad 111 includes at least one first pad 1111, at least one second pad 1112 and at least one third pad 1113; the sub-pixel 12 includes a first sub-pixel 121, a second sub-pixel 122 and a third sub-pixel 123; the first pad 1111 is used to connect the first sub-pixel 121, the second pad 1112 is used to connect the second sub-pixel 122, and the third pad 1113 is used to connect the third sub-pixel 123; the redundant pad 112 is configured to repair the corresponding abnormal pad when the first pad 1111, the second pad 1112 and the third pad 1113 are abnormal, and is electrically connected to the pixel driving circuit corresponding to the abnormal pad; wherein, in the same pad group 11, the number of redundant pads 112 is less than the sum of the number of the first pad 1111, the second pad 1112 and the third pad 1113.

[0047] Among them, the first pad 1111 is used to connect the first sub-pixel 121, the second pad 1112 is used to connect the second sub-pixel 122, and the third pad 1113 is used to connect the third sub-pixel 123, so that the first sub-pixel 121, the second sub-pixel 122 and the third sub-pixel 123 can be driven by the first pad 1111, the second pad 1112 and the third pad 1113 respectively to emit light of corresponding colors under the drive of the pixel driving circuit, so that the individual driving control of the sub-pixel 12 can be realized by the pixel driving circuit corresponding to the main pad 111.

[0048] Furthermore, by setting redundant pads 112 and making the number of redundant pads 112 smaller than the sum of the numbers of first pads 1111, second pads 1112 and third pads 1113, the number of redundant pads 112 can be reduced in the process of redundant pads 112 repairing abnormal pads, thereby reducing the space occupied by redundant pads 112, thereby reducing the space occupied by redundant pads 112 in the display panel 10 and the display device 100, thereby improving the pixel density of the display device 100 and improving the display effect of the display device 100.

[0049] In some embodiments, Figure 3 , Figure 4 and Figure 5 As shown, the first solder pad 1111 and the second solder pad 1112 are respectively arranged on both sides of the redundant solder pad 112; there are multiple third solder pads 1113, some of the third solder pads 1113 are arranged on the side of the first solder pad 1111 away from the redundant solder pad 112, and the remaining third solder pads 1113 are arranged on the side of the second solder pad 1112 away from the redundant solder pad 112.

[0050] Because the mass transfer yield of the third sub-pixel 123 is lower than the mass transfer yield of the first sub-pixel 121 and the second sub-pixel 122 during the mass transfer process, that is, during the mass transfer process, the third sub-pixel 123 is more likely to be damaged than the first sub-pixel 121 and the second sub-pixel 122.

[0051] In this way, since part of the third pads 1113 is arranged on the side of the first pad 1111 away from the redundant pad 112, and the remaining part of the third pads 1113 is arranged on the side of the second pad 1112 away from the redundant pad 112, when part of the third pads 1113 is abnormal, on the one hand, the corresponding third sub-pixel 123 can be directly driven to emit light of the corresponding color through the remaining part of the third pads 1113, thereby ensuring the normal light emission of the third sub-pixel 123. On the other hand, by connecting the abnormal part of the third pads 1113 and the normal part of the third pads 1113 in series, the abnormal third pads 1113 can be back-bonded through the normal third pads 1113, and the overflow of metal can be used to repair the abnormal part of the third pads 1113, thereby ensuring the normal light emission of the third sub-pixel 123.

[0052] It is understandable that when an abnormality occurs in the first pad 1111 or the second pad 1112, the redundant pad 112 can be directly used to perform back bonding with the side close to the bad point, and the overflow of the bonding metal can be used to repair the corresponding abnormal first pad 1111 or the second pad 1112. Of course, when both the first pad 1111 and the second pad 1112 are abnormal, since the first pad 1111 and the second pad 1112 are respectively arranged on both sides of the redundant pad 112, the first pad 1111 and the second pad 1112 can be repaired through the redundant pad 112.

[0053] Since only one redundant pad 112 is required in one pad group 11 , the space occupied by the redundant pad 112 can be reduced, thereby increasing the pixel density of the display device 100 and improving the display effect of the display device 100 .

[0054] Alternatively, if Figure 6 As shown, the two third pads 1113 may be electrically connected, or the corresponding third sub-pixels 123 may be driven separately.

[0055] In some embodiments, Figure 7 , Figure 8 and Fig. 9As shown, the pad group 11 includes two sub-groups, each sub-group includes a first pad 1111, a second pad 1112, at least two third pads 1113 and a redundant pad 112; the first pad 1111 and the second pad 1112 are respectively arranged on both sides of the redundant pad 112; part of the third pad 1113 is arranged on the side of the first pad 1111 away from the redundant pad 112, and the remaining part of the third pad 1113 is arranged on the side of the second pad 1112 away from the redundant pad 112; the first pad 1111 of one sub-group is electrically connected to the redundant pad 112 of the sub-group, and the second pad 1112 of the other sub-group is electrically connected to the redundant pad 112 of the sub-group.

[0056] Thus, if an abnormality occurs in the third pad 1113, since there are multiple third pads 1113 and the multiple third pads 1113 are far away from the redundant pad 112, the arrangement of the third pads 1113 in the above embodiment is similar. Therefore, when an abnormality occurs in the third pad 1113 of this embodiment, a repair bonding is performed in a manner similar to that in the above embodiment, which will not be described in detail here.

[0057] If an abnormality occurs in the first pad 1111 or the second pad 1112, for the sake of convenience of explanation, exemplarily, when an abnormality occurs in the first pad 1111, since the first pad 1111 of one subgroup is electrically connected to the redundant pad 112 of the subgroup, and the second pad 1112 of the other subgroup is electrically connected to the redundant pad 112 of the subgroup, the redundant pad 112 electrically connected to the first pad 1111 is directly connected to the first sub-pixel 121, and the connection between the second pad 1112 and the redundant pad 112 is disconnected, and the redundant pad 112 is also electrically connected to the first sub-pixel 121 in the subgroup, thereby realizing the repair of the first pad 1111, which can facilitate the backfilling process of the first pad 1111 during the repair, and can facilitate the repair of the first pad 1111.

[0058] Similarly, the positions of the second pad 1112 and the redundant pad 112 are similar to those of the first pad 1111 and the redundant pad 112, and are repaired in the same manner as the first pad 1111, and the repair method of the second pad 1112 is not described in detail here.

[0059] Since a pad group 11 includes at least 8 main pads 111 and at least 2 redundant pads 112 , the space occupied by the redundant pads 112 can be greatly reduced, thereby further improving the pixel density of the display device 100 and the display effect of the display device 100 .

[0060] Optionally, the two third pads 1113 may be electrically connected, or the corresponding third sub-pixels 123 may be driven separately.

[0061] In some embodiments, Figure 8 and Fig. 9 As shown, in any subgroup, the distance between the center of the first pad 1111 and the center of the redundant pad 112 is not equal to the distance between the center of the second pad 1112 and the center of the redundant pad 112 .

[0062] In this way, illustratively, the first pad 1111 is electrically connected to the redundant pad 112, and the second pad 1112 is not connected to the redundant pad 112. If an abnormality occurs in the first pad 1111, since the first pad 1111 is electrically connected to the redundant pad 112, it is only necessary to electrically connect the redundant pad 112 to the first sub-pixel 121, that is, the first sub-pixel 121 can be driven by the pixel driving circuit corresponding to the first pad 1111 to re-emit the corresponding color of light normally. In another sub-group, the connection between the second pad 1112 and the redundant pad 112 is disconnected, and then the first sub-pixel 121 and the redundant pad 112 are connected, so that the first pad 1111 is repaired.

[0063] Furthermore, since in any subgroup, the distance between the center of the first pad 1111 and the center of the redundant pad 112 and the distance between the center of the second pad 1112 and the center of the redundant pad 112 are not equal, the distance between the first pad 1111 and the second pad 1112 relative to the redundant pad 112 can be changed, so that the space occupied by the redundant pad 112 can be further reduced, so that the pixel density of the display device 100 can be further improved, and the display effect of the display device 100 can be further improved.

[0064] In some embodiments, Fig.10 As shown, the pad group 11 includes two redundant pads 112, namely a first redundant pad 1121 and a second redundant pad 1122. The first pad 1111 and the second pad 1112 are respectively arranged on both sides of the first redundant pad 1121; the second redundant pad 1122 is arranged on a side of the first pad 1111 away from the first redundant pad 1121, and the third pad 1113 is arranged on a side of the second redundant pad 1122 away from the first pad 1111.

[0065] In this way, since the first pad 1111 and the second pad 1112 are respectively arranged on both sides of the first redundant pad 1121, when an abnormality occurs in the first pad 1111 and / or the second pad 1112, the abnormal first pad 1111 and / or the second pad 1112 can be repaired by the first redundant pad 1121. At the same time, since the third pad 1113 is arranged on the side of the second redundant pad 1122 away from the first pad 1111, that is, the second redundant pad 1122 is arranged between the first pad 1111 and the third pad 1113, when an abnormality occurs in the first pad 1111 and / or the third pad 1113, the abnormal first pad 1111 and / or the third pad 1113 can be repaired by the second redundant pad 1122.

[0066] Since the present embodiment uses two redundant pads 112, namely, the first pad 1111, the second pad 1112 and the third pad 1113 can be repaired, the space occupied by the redundant pads 112 can be reduced, thereby improving the pixel density of the display device 100 and improving the display effect of the display device 100.

[0067] Optionally, since the third sub-pixel 123 is more susceptible to damage than the first sub-pixel 121 and the second sub-pixel 122, the second redundant pad 1122 can be preset to another third pad 1113, so that when one of the third pads 1113 is damaged, the corresponding third sub-pixel 123 is directly driven to emit light of a corresponding color through the other third pad 1113, thereby reducing the difficulty of repairing the third pad 1113 by the second redundant pad 1122, making it more convenient for the second redundant pad 1122 to repair the third pad 1113, improving the efficiency of the repair, and facilitating the repair operation of the operator.

[0068] In some embodiments, Fig.11 and Fig.12 As shown, the pad group 11 includes two redundant pads 112, namely a first redundant pad 1121 and a second redundant pad 1122. The first redundant pad 1121 and the second redundant pad 1122 are respectively arranged on both sides of the third pad 1113, the first pad 1111 is arranged on the side of the first redundant pad 1121 away from the third pad 1113, and the second pad 1112 is arranged on the side of the second redundant pad 1122 away from the third pad 1113.

[0069] In this way, since the first redundant pad 1121 and the second redundant pad 1122 are respectively arranged on both sides of the third pad 1113, the first pad 1111 is arranged on the side of the first redundant pad 1121 away from the third pad 1113, and the second pad 1112 is arranged on the side of the second redundant pad 1122 away from the third pad 1113, that is, the first redundant pad 1121 is arranged between the first pad 1111 and the third pad 1113, and the second redundant pad 1122 is arranged between the second pad 1112 and the third pad 1113. 3, so that when an abnormality occurs in the first solder pad 1111, the abnormal first solder pad 1111 can be repaired by the first redundant solder pad 1121, when an abnormality occurs in the second solder pad 1112, the abnormal second solder pad 1112 can be repaired by the second redundant solder pad 1122, and when an abnormality occurs in the third solder pad 1113, the abnormal third solder pad 1113 can be repaired by the first redundant solder pad 1121, and can also be repaired by the second redundant solder pad 1122.

[0070] In this way, it can be understood that since the third sub-pixel 123 is more easily damaged than the first sub-pixel 121 and the second sub-pixel 122, and the first pad 1111 is connected to the first sub-pixel 121, the second pad 1112 is connected to the second sub-pixel 122, and the third pad 1113 is connected to the third sub-pixel 123, that is, the third pad 1113 is more easily damaged than the first pad 1111 and the second pad 1112, the third pad 1113 that is more easily damaged can be repaired by the first redundant pad 1121 and the second redundant pad 1122, so that more space will not be occupied, the pixel density of the display device 100 can be improved, and the display effect of the display device 100 can be improved.

[0071] Optionally, considering the differences between the third sub-pixel 123 and the first sub-pixel 121 and the second sub-pixel 122 , the third sub-pixel 123 may adopt the technology of combining the second sub-pixel 122 with quantum dots, thereby further improving the display effect of the display device 100 .

[0072] In some embodiments, Fig.13 and Fig.14As shown, the first pad 1111, the second pad 1112 and the third pad 1113 are all two, and the pad group 11 includes three redundant pads 112, namely the first redundant pad 1121, the second redundant pad 1122 and the third redundant pad 1123; the two first pads 1111, the two second pads 1112 and the two third pads 1113 are respectively arranged on both sides of the first redundant pad 1121, and the first pad on either side of the first redundant pad 1121 The pad 1111 is arranged between the second pad 1112 and the third pad 1113, and the second pad 1112 is located on the side of the third pad 1113 away from the first redundant pad 1121; the second redundant pad 1122 is arranged between the first pad 1111 and the second pad 1112 on one side of the first redundant pad 1121, and the third redundant pad 1123 is arranged between the first pad 1111 and the second pad 1112 on the other side of the first redundant pad 1121.

[0073] Specifically, the first redundant pad 1121 is disposed between two third pads 1113 , the second redundant pad 1122 is disposed between one of the first pads 1111 and one of the second pads 1112 , and the third redundant pad 1123 is disposed between another first pad 1111 and another second pad 1112 .

[0074] Furthermore, if any one of the third pads 1113 is abnormal, the abnormal third pad 1113 can be repaired by the first redundant pad 1121; if the first pad 1111 or the second pad 1112 is abnormal, the abnormal first pad 1111 or the second pad 1112 can be repaired by the second redundant pad 1122 or the third redundant pad 1123.

[0075] Since a pad group 11 includes at least 6 main pads 111 and at least 3 redundant pads 112 , the space occupied by the redundant pads 112 can be greatly reduced, thereby further improving the pixel density of the display device 100 and the display effect of the display device 100 .

[0076] In some embodiments, Figure 2 and Figure 4 As shown, along the direction from redundant pad 112 toward first pad 1111 , the size of redundant pad 112 is larger than the size of first pad 1111 , the size of redundant pad 112 is larger than the size of second pad 1112 , and the size of redundant pad 112 is larger than the size of third pad 1113 .

[0077] In this way, the redundant pad 112 having a size larger than the first pad 1111, the second pad 1112, and the third pad 1113 can be used to simultaneously repair the first pad 1111, the second pad 1112, or the third pad 1113 on both sides of the redundant pad 112, thereby improving the repair efficiency of the redundant pad 112 on the first pad 1111, the second pad 1112, and the third pad 1113. Further, since the redundant pad 112 can simultaneously repair the two main pads 111 at the same position, the space occupied by the redundant pad 112 can be reduced, thereby improving the display effect of the display device 100.

[0078] In some embodiments, Figure 1 and Figure 3 As shown, a plurality of pad groups 11 are arranged in rows along a first direction, and are arranged in columns along a second direction intersecting the first direction.

[0079] In this way, the pixel density of the display device 100 can be increased by using the pad groups 11 arranged in multiple rows and columns, thereby improving the display effect of the display device 100 .

[0080] Based on the same application concept, the embodiment of the present application also provides a pixel arrangement structure 2. Fig.15 As shown, the pixel arrangement structure 2 includes a plurality of pixel groups 21, each pixel group 21 includes a plurality of sub-pixels 12 and at least one redundant sub-pixel 211; the redundant sub-pixel 211 is used to emit light of a corresponding color when the sub-pixel 12 is abnormal; the redundant sub-pixel 211 is configured to repair the corresponding abnormal sub-pixel 12 when the sub-pixel 12 is abnormal, and is electrically connected to the pixel driving circuit corresponding to the abnormal sub-pixel 12; wherein, in the same pixel group 21, the number of redundant sub-pixels 211 is less than the number of sub-pixels 12.

[0081] It can be understood that when a sub-pixel 12 is abnormal, the corresponding abnormal sub-pixel 12 can be directly repaired by the redundant sub-pixel 211. Since the number of redundant sub-pixels 211 is less than the number of sub-pixels 12, the number of redundant sub-pixels 211 can be reduced in the process of redundant sub-pixels 211 repairing the abnormal sub-pixels 12, and the space occupied by the redundant sub-pixels 211 can be reduced, and the space of the pixels in the display panel 10 and the display device 100 occupied by the redundant sub-pixels 211 can be reduced, the pixel density of the display device 100 can be improved, and the display effect of the display device 100 can be improved.

[0082] The pixel arrangement structure 2 also has the beneficial effects of the array substrate 1 in the above embodiment. The similarities can be understood by referring to the above explanation of the array substrate 1. At the same time, the following embodiments of the pixel arrangement structure 2 also have the beneficial effects of the array substrate 1 in the above embodiment. The similarities can be understood by referring to the above explanation of the array substrate 1, and will not be repeated below. Similarly, since the pixel arrangement structure 2 and the array substrate 1 in the above embodiment are based on the same application concept and also have the beneficial effects of the array substrate 1 in the above embodiment, the drawings in the following embodiments can refer to the drawings in the above array substrate 1 and the above drawings. Fig.15 The drawings of the pixel arrangement structure 2 shown in the figure are used to understand the above, and no additional illustrations of the drawings of the following embodiments of the pixel arrangement structure 2 are given below.

[0083] In some embodiments, the sub-pixel 12 includes at least one first sub-pixel 121, at least one second sub-pixel 122 and at least one third sub-pixel 123; the first sub-pixel 121, the second sub-pixel 122 and the third sub-pixel 123 are respectively used to emit light of different colors; the redundant sub-pixel 211 is used to emit light of corresponding colors when the first sub-pixel 121, the second sub-pixel 122 and the third sub-pixel 123 are abnormal; the redundant sub-pixel 211 is configured to repair the corresponding abnormal sub-pixel 12 when the first sub-pixel 121, the second sub-pixel 122 and the third sub-pixel 123 are abnormal, and is electrically connected to the pixel driving circuit corresponding to the abnormal sub-pixel 12; wherein, in the same pixel group 21, the number of redundant sub-pixels 211 is less than the sum of the number of the first sub-pixel 121, the second sub-pixel 122 and the third sub-pixel 123.

[0084] In some embodiments, the first sub-pixel 121 and the second sub-pixel 122 are respectively arranged on both sides of the redundant sub-pixel 211; there are multiple third sub-pixels 123, some of the third sub-pixels 123 are arranged on the side of the first sub-pixel 121 away from the redundant sub-pixel 211, and the remaining third sub-pixels 123 are arranged on the side of the second sub-pixel 122 away from the redundant sub-pixel 211.

[0085] In some embodiments, the pixel group 21 includes two sub-groups, each sub-group includes a first sub-pixel 121, a second sub-pixel 122, at least two third sub-pixels 123 and a redundant sub-pixel 211, and the first sub-pixel 121 and the second sub-pixel 122 are respectively arranged on both sides of the redundant sub-pixel 211; part of the third sub-pixels 123 are arranged on the side of the first sub-pixel 121 away from the redundant sub-pixel 211, and the remaining part of the third sub-pixels 123 are arranged on the side of the second sub-pixel 122 away from the redundant sub-pixel 211; the first sub-pixel 121 of one sub-group is electrically connected to the redundant sub-pixel 211 of the sub-group, and the second sub-pixel 122 of the other sub-group is electrically connected to the redundant sub-pixel 211 of the sub-group.

[0086] In some embodiments, in any subgroup, the distance between the center of the first subpixel 121 and the center of the redundant subpixel 211 and the distance between the center of the second subpixel 122 and the center of the redundant subpixel 211 are not equal.

[0087] In some embodiments, the pixel group 21 includes two redundant sub-pixels 211, namely a first redundant sub-pixel 211 and a second redundant sub-pixel 211, and the first sub-pixel 121 and the second sub-pixel 122 are respectively arranged on both sides of the first redundant sub-pixel 211; the second redundant sub-pixel 211 is arranged on a side of the first sub-pixel 121 away from the first redundant sub-pixel 211, and the third sub-pixel 123 is arranged on a side of the second redundant sub-pixel 211 away from the first sub-pixel 121.

[0088] In some embodiments, the pixel group 21 includes two redundant sub-pixels 211, namely a first redundant sub-pixel 211 and a second redundant sub-pixel 211. The first redundant sub-pixel 211 and the second redundant sub-pixel 211 are respectively arranged on both sides of the third sub-pixel 123, the first sub-pixel 121 is arranged on a side of the first redundant sub-pixel 211 away from the third sub-pixel 123, and the second sub-pixel 122 is arranged on a side of the second redundant sub-pixel 211 away from the third sub-pixel 123.

[0089] In some embodiments, the number of the first sub-pixel 121, the number of the second sub-pixel 122, and the number of the third sub-pixel 123 are all two, and the pixel group 21 includes three redundant sub-pixels 211, namely the first redundant sub-pixel 211, the second redundant sub-pixel 211, and the third redundant sub-pixel 211; the two first sub-pixels 121, the two second sub-pixels 122, and the two third sub-pixels 123 are respectively arranged on both sides of the first redundant sub-pixel 211, and the first sub-pixel 121 on either side of the first redundant sub-pixel 211 is arranged between the second sub-pixel 122 and the third sub-pixel 123, and the second sub-pixel 122 is located on a side of the third sub-pixel 123 away from the first redundant sub-pixel 211; the second redundant sub-pixel 211 is arranged between the first sub-pixel 121 and the second sub-pixel 122 on one side of the first redundant sub-pixel 211, and the third redundant sub-pixel 211 is arranged between the first sub-pixel 121 and the second sub-pixel 122 on the other side of the first redundant sub-pixel 211.

[0090] In some embodiments, along the direction of the redundant sub-pixel 211 toward the first sub-pixel 121, the size of the redundant sub-pixel 211 is larger than the size of the first sub-pixel 121, the size of the redundant sub-pixel 211 is larger than the size of the second sub-pixel 122, and the size of the redundant sub-pixel 211 is larger than the size of the third sub-pixel 123.

[0091] In some embodiments, the plurality of pixel groups 21 are arranged in rows along a first direction, and are arranged in columns along a second direction intersecting the first direction.

[0092] Based on the same application concept, the embodiment of the present application also provides a display panel 10. Fig.16 and 17 As shown, the display device 100 includes the array substrate 1 or the pixel arrangement structure 2 in any of the above embodiments. Therefore, the display panel 10 also has the beneficial effects of the array substrate 1 or the pixel arrangement structure 2 in the above embodiments, and the similarities can be understood by referring to the above explanation of the array substrate 1 or the pixel arrangement structure 2, which will not be repeated below.

[0093] Based on the same application concept, the embodiment of the present application further provides a display device 100 . Fig.18 A schematic diagram of the structure of a display device 100 provided in an embodiment of the present application is shown in FIG. Fig.18 As shown, the display device 100 includes the display panel 10 in any of the above embodiments. Fig.18 As shown, the display device 100 includes a display panel 10. Therefore, the display device 100 also has the beneficial effects of the display panel 10 in the above embodiment, and the similarities can be understood by referring to the above explanation of the display panel 10, which will not be repeated below.

[0094] The display device 100 provided in the embodiment of the present application can be Fig.18 The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, industrial control equipment, medical display screens, touch interactive terminals, etc. The embodiments of the present application do not specifically limit this.

[0095] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0096] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. An array substrate, characterized in that: comprising a plurality of pad groups, wherein the pad groups are used to connect a light emitting device, wherein the light emitting device comprises a plurality of sub-pixels; The pad group includes a plurality of main pads and at least one redundant pad; the plurality of main pads are respectively used to connect different sub-pixels, and the redundant pad is configured to repair the corresponding abnormal pad when the main pad is abnormal, and is electrically connected to the pixel driving circuit corresponding to the abnormal pad; Among them, in the same pad group, the number of the redundant pads is less than the number of the main pads.

2. The array substrate according to claim 1, characterized in that: The main pad includes at least one first pad, at least one second pad and at least one third pad; the sub-pixel includes a first sub-pixel, a second sub-pixel and a third sub-pixel; the first pad is used to connect the first sub-pixel, the second pad is used to connect the second sub-pixel, and the third pad is used to connect the third sub-pixel; The redundant pad is configured to repair the corresponding abnormal pad when the first pad, the second pad and the third pad are abnormal, and is electrically connected to the pixel driving circuit corresponding to the abnormal pad; Among them, in the same pad group, the number of the redundant pads is less than the sum of the number of the first pad, the second pad and the third pad.

3. The array substrate according to claim 2, characterized in that: The first pad and the second pad are respectively arranged on both sides of the redundant pad; there are multiple third pads, some of which are arranged on the side of the first pad away from the redundant pad, and the rest of the third pads are arranged on the side of the second pad away from the redundant pad.

4. The array substrate according to claim 2, characterized in that: The pad group includes two subgroups, each subgroup includes one first pad, one second pad, at least two third pads and one redundant pad; The first pad and the second pad are respectively arranged on both sides of the redundant pad; part of the third pad is arranged on a side of the first pad away from the redundant pad, and the rest of the third pad is arranged on a side of the second pad away from the redundant pad; The first pad of one of the subgroups is electrically connected to the redundant pad of the subgroup, and the second pad of the other subgroup is electrically connected to the redundant pad of the subgroup.

5. The array substrate according to claim 4, characterized in that: In any of the subgroups, a distance between a center of the first pad and a center of the redundant pad is unequal to a distance between a center of the second pad and a center of the redundant pad.

6. The array substrate according to claim 2, characterized in that: The pad group includes two redundant pads, namely a first redundant pad and a second redundant pad, the first pad and the second pad are respectively arranged on both sides of the first redundant pad; the second redundant pad is arranged on a side of the first pad away from the first redundant pad, and the third pad is arranged on a side of the second redundant pad away from the first pad.

7. The array substrate according to claim 2, characterized in that: The pad group includes two redundant pads, namely a first redundant pad and a second redundant pad. The first redundant pad and the second redundant pad are respectively arranged on both sides of the third pad. The first pad is arranged on a side of the first redundant pad away from the third pad, and the second pad is arranged on a side of the second redundant pad away from the third pad.

8. The array substrate according to claim 2, characterized in that: The number of the first pad, the second pad and the third pad are all two, and the pad group includes three redundant pads, namely a first redundant pad, a second redundant pad and a third redundant pad; The two first pads, the two second pads and the two third pads are respectively arranged on both sides of the first redundant pad, and the first pad on either side of the first redundant pad is arranged between the second pad and the third pad, and the second pad is located on a side of the third pad away from the first redundant pad; The second redundant pad is disposed between the first pad and the second pad on one side of the first redundant pad, and the third redundant pad is disposed between the first pad and the second pad on the other side of the first redundant pad.

9. The array substrate according to any one of claims 2 to 8, characterized in that: Along the direction from the redundant pad toward the first pad, the redundant pad has a size larger than the first pad, a size larger than the second pad, and a size larger than the third pad.

10. The array substrate according to any one of claims 2 to 8, characterized in that: The plurality of pad groups are arranged in rows along a first direction, and in columns along a second direction intersecting the first direction.

11. A pixel arrangement structure, characterized in that: The method comprises a plurality of pixel groups, each of which comprises a plurality of sub-pixels and at least one redundant sub-pixel; the redundant sub-pixel is used to emit light of a corresponding color when the sub-pixel is abnormal; the redundant sub-pixel is configured to repair the corresponding abnormal sub-pixel when the sub-pixel is abnormal, and is electrically connected to a pixel driving circuit corresponding to the abnormal sub-pixel; Wherein, in the same pixel group, the number of the redundant sub-pixels is less than the number of the sub-pixels.

12. The pixel arrangement structure according to claim 11, characterized in that: The sub-pixels include at least one first sub-pixel, at least one second sub-pixel and at least one third sub-pixel; the first sub-pixel, the second sub-pixel and the third sub-pixel are respectively used to emit light of different colors; The redundant sub-pixel is used to emit light of corresponding colors when the first sub-pixel, the second sub-pixel and the third sub-pixel are abnormal; the redundant sub-pixel is configured to repair the corresponding abnormal sub-pixel when the first sub-pixel, the second sub-pixel and the third sub-pixel are abnormal, and is electrically connected to the pixel driving circuit corresponding to the abnormal sub-pixel; In the same pixel group, the number of the redundant sub-pixels is less than the sum of the number of the first sub-pixels, the second sub-pixels and the third sub-pixels.

13. The pixel arrangement structure according to claim 12, characterized in that: The first sub-pixel and the second sub-pixel are respectively arranged on both sides of the redundant sub-pixel; there are multiple third sub-pixels, some of the third sub-pixels are arranged on the side of the first sub-pixel away from the redundant sub-pixel, and the rest of the third sub-pixels are arranged on the side of the second sub-pixel away from the redundant sub-pixel.

14. The pixel arrangement structure according to claim 12, characterized in that: The pixel group includes two sub-groups, each sub-group includes one first sub-pixel, one second sub-pixel, at least two third sub-pixels and one redundant sub-pixel, the first sub-pixel and the second sub-pixel are respectively arranged on both sides of the redundant sub-pixel; part of the third sub-pixels are arranged on a side of the first sub-pixel away from the redundant sub-pixel, and the rest of the third sub-pixels are arranged on a side of the second sub-pixel away from the redundant sub-pixel; The first sub-pixel of one of the sub-groups is electrically connected to the redundant sub-pixel of the sub-group, and the second sub-pixel of another sub-group is electrically connected to the redundant sub-pixel of the sub-group.

15. The pixel arrangement structure according to claim 14, characterized in that: In any of the subgroups, a distance between a center of the first subpixel and a center of the redundant subpixel is unequal to a distance between a center of the second subpixel and a center of the redundant subpixel.

16. The pixel arrangement structure according to claim 12, characterized in that: The pixel group includes two redundant sub-pixels, namely a first redundant sub-pixel and a second redundant sub-pixel, the first sub-pixel and the second sub-pixel are respectively arranged on both sides of the first redundant sub-pixel; the second redundant sub-pixel is arranged on a side of the first sub-pixel away from the first redundant sub-pixel, and the third sub-pixel is arranged on a side of the second redundant sub-pixel away from the first sub-pixel.

17. The pixel arrangement structure according to claim 12, characterized in that: The pixel group includes two redundant sub-pixels, namely a first redundant sub-pixel and a second redundant sub-pixel, the first redundant sub-pixel and the second redundant sub-pixel are respectively arranged on both sides of the third sub-pixel, the first sub-pixel is arranged on a side of the first redundant sub-pixel away from the third sub-pixel, and the second sub-pixel is arranged on a side of the second redundant sub-pixel away from the third sub-pixel.

18. The pixel arrangement structure according to claim 12, characterized in that: The number of the first sub-pixel, the second sub-pixel and the third sub-pixel are all two, and the pixel group includes three redundant sub-pixels, namely, a first redundant sub-pixel, a second redundant sub-pixel and a third redundant sub-pixel; The two first sub-pixels, the two second sub-pixels and the two third sub-pixels are respectively arranged on both sides of the first redundant sub-pixel, and the first sub-pixels on either side of the first redundant sub-pixel are arranged between the second sub-pixel and the third sub-pixel, and the second sub-pixel is located on a side of the third sub-pixel away from the first redundant sub-pixel; The second redundant sub-pixel is disposed between the first sub-pixel and the second sub-pixel on one side of the first redundant sub-pixel, and the third redundant sub-pixel is disposed between the first sub-pixel and the second sub-pixel on the other side of the first redundant sub-pixel.

19. The pixel arrangement structure according to any one of claims 12 to 18, characterized in that: Along the direction from the redundant sub-pixel toward the first sub-pixel, the size of the redundant sub-pixel is larger than the size of ... second sub-pixel, and the size of the redundant sub-pixel is larger than the size of the third sub-pixel.

20. The pixel arrangement structure according to any one of claims 12 to 18, characterized in that: The plurality of pixel groups are arranged in rows along a first direction and in columns along a second direction intersecting the first direction.

21. A display panel, characterized in that: It comprises the array substrate as described in any one of claims 1 to 10 or the pixel arrangement structure as described in any one of claims 11 to 20.

22. A display device, characterized in that: Comprising the display panel as claimed in claim 21.

Images