Miniature light emitting diode device packaging structure, packaging method and display device

Abstract

The invention provides a micro light-emitting diode device packaging structure, a packaging method and a display device, the packaging structure comprises a packaging substrate, a micro light-emitting diode device and a packaging shell, and the micro light-emitting diode device comprises a micro light-emitting diode chip and a driving chip which are in bonding connection; the packaging substrate comprises a bearing plate and a circuit board which are connected, the bearing plate is arranged and connected to the face, away from the micro light-emitting diode chip, of the driving chip, and the circuit board is electrically connected with the driving chip through an electric connecting piece. The packaging shell covers the micro light-emitting diode device and part of the packaging substrate, the packaging shell comprises a hollow area and a light-transmitting area, the hollow area is arranged right opposite to the electric connecting piece, and the light-transmitting area is arranged right opposite to the micro light-emitting diode chip. On the basis, the packaging structure of the miniature light-emitting diode device has better packaging integrity, higher reliability and better aesthetic property.

Description

Technical Field

[0001] The present application relates to the field of semiconductor light emitting technology, and in particular to a micro light emitting diode device packaging structure, a packaging method, and a display device. Background Art

[0002] Micro-LED (Micro-Light Emitting Diode) display technology is a display technology that miniaturizes and arrays the traditional LED (Light Emitting Diode) structure and uses CMOS (Complementary Metal Oxide Semiconductor) or TFT (Thin Film Transistor) to make driving circuits to achieve addressing control and individual drive of each pixel.

[0003] Among them, Micro-LED needs to be packaged after preparation. Since the overall structure size of Micro-LED is very small, the packaging of Micro-LED is difficult. The packaging method of Micro-LED in related technologies needs to be improved. Summary of the invention

[0004] The purpose of the present application is to provide a micro light emitting diode device packaging structure, a packaging method, and a display device.

[0005] In order to solve the above problems, in a first aspect, the present application provides a micro light emitting diode device packaging structure, comprising:

[0006] A micro light emitting diode device, comprising a micro light emitting diode chip and a driver chip bonded together;

[0007] A packaging substrate, comprising a carrier plate and a circuit board connected to each other, wherein the carrier plate is arranged and connected to a side of the driver chip away from the micro-LED chip, and the circuit board is electrically connected to the driver chip through an electrical connector; and

[0008] The packaging shell covers the micro-LED device and part of the packaging substrate, and the packaging shell includes a hollow area and a light-transmitting area. The hollow area is arranged opposite to the electrical connector, and the light-transmitting area is arranged opposite to the micro-LED chip.

[0009] Optionally, the packaging shell further includes a bottom wall, and a side wall surrounding the periphery of the bottom wall and protruding from the bottom wall;

[0010] The packaging structure further includes a first packaging colloid and a second packaging colloid, the side wall is connected to the packaging substrate through the first packaging colloid, and a portion of the bottom wall is connected to the driving chip through the second packaging colloid.

[0011] Optionally, both the first encapsulating colloid and the second encapsulating colloid are annular structures.

[0012] Optionally, the packaging structure further includes:

[0013] A third packaging colloid is disposed in the packaging shell and wraps the electrical connector, and the third packaging colloid seals the hollow area.

[0014] Optionally, the packaging structure further includes:

[0015] The light-transmitting film structure is arranged on a side of the micro-LED chip away from the driving chip and is arranged opposite to the light-transmitting area.

[0016] In a second aspect, the present application also provides a packaging method, comprising:

[0017] A micro light emitting diode device is provided, wherein the micro light emitting diode device comprises a micro light emitting diode chip and a driving chip which are bonded to each other;

[0018] Providing a packaging substrate, the packaging substrate comprising a carrier plate and a circuit board connected to each other;

[0019] The carrier board is arranged and connected to a side of the driver chip away from the micro-LED chip, and the circuit board is electrically connected to the driver chip through an electrical connector;

[0020] Providing a packaging shell, wherein the packaging shell includes a hollow area and a light-transmitting area;

[0021] The packaging shell covers the micro-LED device and part of the packaging substrate, and the hollow area is arranged opposite to the electrical connector, and the light-transmitting area is arranged opposite to the micro-LED chip, so as to obtain a micro-LED device packaging structure.

[0022] Optionally, the packaging shell includes a bottom wall, and a side wall surrounding the periphery of the bottom wall and protruding from the bottom wall;

[0023] The step of making the packaging shell cover the micro light emitting diode device and part of the packaging substrate comprises:

[0024] The side wall is connected to the packaging substrate through a first packaging colloid, part of the bottom wall is connected to the driving chip through a second packaging colloid, and the packaging shell covers the micro light emitting diode device and part of the packaging substrate; wherein the first packaging colloid and the second packaging colloid are both annular structures.

[0025] Optionally, the packaging method further includes:

[0026] A third packaging colloid is filled into the packaging shell through the hollow area, and the third packaging colloid wraps the electrical connector and seals the hollow area.

[0027] Optionally, the packaging method further includes:

[0028] The light-transmitting film structure is arranged on a side of the micro-LED chip away from the driving chip, and the light-transmitting film structure is arranged opposite to the light-transmitting area.

[0029] In a third aspect, the present application also provides a display device, comprising the micro-light emitting diode device packaging structure as described above; or, comprising the micro-light emitting diode device packaging structure prepared by the packaging method as described above.

[0030] Based on the above technical solution, the packaging shell of the micro-LED device packaging structure of the present application covers the micro-LED device and part of the packaging substrate, the packaging shell can protect the micro-LED device, can reduce the adverse effects of water vapor and other objects on the micro-LED device, and the packaging shell can improve the reliability of the packaging structure; and the packaging shell includes a hollow area directly opposite to the electrical connector, which is convenient for the packaging structure to be filled with glue and protect the electrical connector connecting the circuit board and the driver chip, so that the subsequent process production of the micro-LED device packaging structure is more convenient; at the same time, the packaging shell also includes a light-transmitting area directly opposite to the micro-LED chip, which is not easy to affect the light emission of the micro-LED chip; and the packaging shell of the present application is a shell structure with a certain shape, and the packaging shell with a certain shape makes the micro-LED device packaging structure of the present application have better packaging integrity and aesthetics. Based on this, under the action of the packaging shell, the micro-LED device packaging structure of the present application is more convenient for process production, and at the same time, the micro-LED device packaging structure also has better packaging integrity, higher reliability, and better aesthetics. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solution in this application, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0032] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0033] Figure 1 A schematic diagram of a first structural embodiment of a micro light emitting diode device packaging structure provided in an embodiment of the present application;

[0034] Figure 2 A schematic diagram of the structure of a micro light emitting diode device provided in an embodiment of the present application;

[0035] Figure 3 A schematic diagram of a structure in which a micro light emitting diode device provided in an embodiment of the present application is connected to a packaging substrate;

[0036] Figure 4 A connection schematic diagram of a first encapsulation colloid provided in an embodiment of the present application;

[0037] Figure 5 A schematic diagram of a connection of a second encapsulation colloid provided in an embodiment of the present application;

[0038] Figure 6 A schematic diagram of a second structure of a micro light emitting diode device packaging structure provided in an embodiment of the present application;

[0039] Figure 7 A schematic diagram of a third structural embodiment of the micro light emitting diode device packaging structure provided in the embodiment of the present application;

[0040] Figure 8 A schematic diagram of a fourth structural embodiment of a micro light emitting diode device packaging structure provided in an embodiment of the present application;

[0041] Fig. 9 A schematic top view of a micro light emitting diode device packaging structure provided in an embodiment of the present application;

[0042] Fig.10 Another schematic top view of the micro light emitting diode device packaging structure provided in an embodiment of the present application;

[0043] Fig.11 A schematic diagram of a first process flow of a packaging method provided in an embodiment of the present application;

[0044] Fig.12A second schematic flow chart of the packaging method provided in the embodiment of the present application;

[0045] Fig.13 A schematic diagram of the structure of a display device provided in an embodiment of the present application.

[0046] The reference numerals are as follows:

[0047] 10. Micro-LED device packaging structure; 20. Display device; 100. Packaging substrate; 200. Micro-LED device; 300. Packaging shell; 400. First packaging colloid; 500. Glue; 600. Second packaging colloid; 700. Light-transmitting film structure; 800. Third packaging colloid; 900. Electrical connector; 101. Connection area; 110. Carrier board; 120. Circuit board; 210. Micro-LED chip; 220. Driver chip; 310. Bottom wall; 320. Side wall; 330. Hollow area; 340. Light-transmitting area; 321. First side wall portion; 322. Second side wall portion. DETAILED DESCRIPTION

[0048] The following will be combined with the appendix of this application Figure 1 To Attachment Fig.13 The technical solutions in this application are clearly and completely described in the following embodiments. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0049] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0050] The following is a detailed description with reference to specific embodiments. It should be noted that the embodiments of the present application can be presented in various forms, some examples of which will be described below.

[0051] Please refer to Figure 1 , Figure 1 The first structural schematic diagram of the micro-LED device packaging structure 10 provided in the embodiment of the present application is shown in FIG. The micro-LED device packaging structure 10 includes a packaging substrate 100 , a micro-LED device 200 and a packaging shell 300 .

[0052] The packaging substrate 100 carries the micro-LED device 200 and the packaging shell 300. The micro-LED device 200 includes a micro-LED chip 210 and a driver chip 220 that are bonded together. The packaging substrate 100 includes a carrier board 110 and a circuit board 120 that are connected to each other. The carrier board 110 is arranged and connected to the side of the driver chip 220 that is away from the micro-LED chip 210. The circuit board 120 is electrically connected to the driver chip 220 through an electrical connector 900. The packaging shell 300 covers the micro-LED device 200 and part of the packaging substrate 100. The packaging shell 300 includes a hollow area 330 and a light-transmitting area 340. The hollow area 330 is arranged opposite to the electrical connector 900, and the light-transmitting area 340 is arranged opposite to the micro-LED chip 210.

[0053] It is understandable that the micro light emitting diode device 200 is a single chip combination structure. Figure 2 and Figure 3 As shown, Figure 2 A schematic diagram of the structure of a micro light emitting diode device 200 provided in an embodiment of the present application is shown in FIG. Figure 3 A schematic diagram of a structure in which a micro-LED device 200 provided in an embodiment of the present application is connected to a packaging substrate 100. The micro-LED chip 210 and the driver chip 220 of the micro-LED device 200 are stacked on the packaging substrate 100, the driver chip 220 is located between the micro-LED chip 210 and the packaging substrate 100, and the micro-LED chip 210 is located on the side of the driver chip 220 away from the packaging substrate 100. The driver chip 220 is bonded to the micro-LED chip 210, and the driver chip 220 can provide an electrical signal to the micro-LED chip 210 and make the micro-LED chip 210 emit light.

[0054] It is understandable that the carrier board 110 is used to carry the micro-LED device 200, and the driver chip 220 can be connected to the carrier board 110 by glue 500, but is not limited to it. The circuit board 120 and the micro-LED device 200 are arranged on the same surface of the carrier board 110, and the circuit board 120 is stacked and connected to the carrier board 110. In some examples, part of the circuit board 120 is connected to the carrier board 110, and another part of the circuit board 120 extends outside the carrier board 110 and is used to be electrically connected to an external circuit to receive electrical signals and control signals provided by the external circuit.

[0055] It can be understood that, in some examples, the carrier plate 110 is a heat dissipation substrate, and the heat dissipation substrate can increase the heat dissipation of the micro-light emitting diode device package structure 10. In some examples, the circuit board 120 can be a flexible circuit board, for example, the circuit board 120 is a soft flat cable structure. The flexible circuit board is lighter in weight and has better reliability, which is more convenient for the transportation of the micro-light emitting diode device package structure 10. Among them, the driver chip 220 can be electrically connected to the circuit board 120 through the electrical connector 900, and the driver chip 220 can receive the electrical signal and control signal transmitted by the circuit board 120, so as to control the micro-light emitting diode chip 210 to emit light. The electrical connector 900 can be, but is not limited to, a conductive gold wire, a conductive copper wire, a conductive aluminum wire and other structures.

[0056] It is understandable that the packaging shell 300 can be covered on the top of the micro-light-emitting diode device 200. The packaging shell 300 is a shell structure with a certain shape. Among them, the hollow area 330 of the packaging shell 300 is arranged opposite to the electrical connector 900. The so-called opposite arrangement means that the positive projection of the hollow area 330 on the carrier board 110 can cover the positive projection of the electrical connector 900 on the carrier board 110. Among them, the driving chip 220, the electrical connector 900, the circuit board 120 and the packaging shell 300 can form a connection area 101, and the electrical connector 900 is located in the connection area 101. The hollow area 330 of the packaging shell 300 is arranged opposite to the connection area 101, and the hollow area 330 facilitates the micro-light-emitting diode device packaging structure 10 to fill the connection area 101 with glue and protect the electrical connector 900.

[0057] It is understandable that the light-transmitting area 340 of the package shell 300 is spaced from the hollow area 330. The light-transmitting area 340 is arranged opposite to the micro-LED chip 210, and the orthographic projection of the light-transmitting area 340 on the carrier board 110 can cover the orthographic projection of the micro-LED chip 210 on the carrier board 110. At this time, the light-transmitting area 340 is not easy to block the light emission of the micro-LED chip 210.

[0058] It is understandable that the packaging shell 300 of the present application is different from the glue structure formed after the glue solidifies in the related art. The packaging structure of the micro-LED device in the related art often fills glue on the surface of the micro-LED device and the packaging substrate, and the micro-LED device and the connection area between the micro-LED device and the packaging substrate are wrapped with glue. However, this packaging method of the related art has high requirements for the packaging process precision, which makes the production of the packaging structure difficult; and this packaging method will also make the frame width of the micro-LED device too large, increase the product structure size, which is not conducive to the miniaturization design of the packaging structure, and is not conducive to the matching and assembly of the packaging structure with the optical machine; and the glue packaging of the related art often requires multiple glue dispensing processes, which makes it difficult to ensure the aesthetic appearance of the glue after condensation; and the glue wrapping packaging method has low protection for the micro-LED device, and air and water vapor can easily enter the glue and affect the micro-LED device, resulting in low product reliability of the packaging structure.

[0059] The packaging shell 300 of the micro-LED device packaging structure 10 of the present application covers the micro-LED device 200 and part of the packaging substrate 100. The packaging shell 300 can protect the micro-LED device 200 and reduce the adverse effects of water vapor and other objects on the micro-LED device 200. The packaging shell 300 can improve the reliability of the micro-LED device packaging structure 10; and the packaging shell 300 includes a hollow area 330 directly facing the electrical connector 900, and the hollow area 330 is convenient for the micro-LED device packaging structure 10 0 is filled with glue and the electrical connector 900 is protected, so that the subsequent process production of the micro-LED device packaging structure 10 is more convenient; at the same time, the packaging shell 300 also includes a light-transmitting area 340 arranged opposite to the micro-LED chip 210, and the light-transmitting area 340 is not easy to affect the light emission of the micro-LED chip 210; and the packaging shell 300 of the present application is a shell structure with a certain shape, and the packaging shell 300 with a certain shape makes the micro-LED device packaging structure 10 of the present application have better packaging integrity and aesthetics. Based on this, under the action of the packaging shell 300, the micro-LED device packaging structure 10 of the present application is more convenient for subsequent process production, and at the same time, the micro-LED device packaging structure 10 also has better packaging integrity, higher reliability, and better aesthetics.

[0060] In some embodiments, the packaging shell 300 also includes a bottom wall 310 and a side wall 320 surrounding the periphery of the bottom wall 310 and protruding from the bottom wall 310, the side wall 320 can be connected to the packaging substrate 100 through the first packaging colloid 400, the bottom wall 310 is located above the micro light emitting diode device 200 away from the packaging substrate 100, the micro light emitting diode device 200 is located inside the enclosed area formed by the side wall 320 and the bottom wall 310 of the packaging shell 300, and the packaging shell 300 can realize the packaging of the micro light emitting diode device 200.

[0061] It is understandable that if Figure 4 As shown, Figure 4 A connection schematic diagram of the first encapsulation colloid 400 provided in an embodiment of the present application. The first encapsulation colloid 400 can be pre-set on the encapsulation substrate 100, and then the encapsulation substrate 100 is connected to the encapsulation shell 300 through the first encapsulation colloid 400. Among them, the first encapsulation colloid 400 can be an annular structure, and the first encapsulation colloid 400 of the annular structure can be adapted to the side wall 320 of the encapsulation shell 300. The first encapsulation colloid 400 can better seal the gap between the side wall 320 of the encapsulation shell 300 and the encapsulation substrate 100, and the first encapsulation colloid 400 can improve the packaging reliability of the micro light emitting diode device packaging structure 10.

[0062] The side wall 320 of the packaging shell 300 of the micro-LED device packaging structure 10 of the present application is connected to the packaging substrate 100 through the first packaging colloid 400, and the bottom wall 310 of the packaging shell 300 is arranged on the side of the micro-LED device 200 away from the packaging substrate 100. The packaging shell 300 can cover the micro-LED device 200 and make the micro-LED device 200 located in the accommodating space formed by the bottom wall 310 and the side wall 320 of the packaging shell 300. The packaging shell 300 can protect the micro-LED device 200 and reduce the interference of the micro-LED device 200 with external objects; at the same time, the packaging shell 300 can also play a blocking and sealing role. The packaging shell 300 can reduce the influence of water vapor on the micro-LED device 200 and improve the reliability of the packaging structure.

[0063] Please continue to refer to Figures 1 to 4In some examples, part of the side wall of the packaging shell 300 is connected to the circuit board 120 of the packaging substrate 100 through the first packaging colloid 400, and another part of the side wall of the packaging shell 300 is connected to the carrier board 110 of the packaging substrate 100 through the first packaging colloid 400. The first packaging colloid 400 can be arranged on the circuit board 120 and the carrier board 110 at the same time. Considering that the circuit board 120 is arranged on the carrier board 110, there is a height difference between the connection surface between the circuit board 120 and the first packaging colloid 400 and the connection surface between the carrier board 110 and the first packaging colloid 400. In this embodiment, the side wall 320 of the packaging shell 300 includes a first side wall portion 321 and a second side wall portion 322, the maximum distance between the second side wall portion 322 and the bottom wall 310 is greater than the maximum distance between the first side wall portion 321 and the bottom wall 310, and the second side wall portion 322 is higher than the first side wall portion 321. The first side wall portion 321 is connected to the circuit board 120 through the first packaging colloid 400 , and the second side wall portion 322 is connected to the carrier board 110 through the first packaging colloid 400 .

[0064] It is understandable that the first encapsulating colloid 400 of the embodiment of the present application can be a ring structure with a certain height difference to adapt to the circuit board 120 and the carrier board 110 with a height difference. Under the action of the first side wall portion 321 and the second side wall portion 322, the thickness of different areas of the first encapsulating colloid 400 can be the same or substantially the same, and the first encapsulating colloid 400 can be a colloid structure with relatively uniform thickness.

[0065] The packaging shell 300 of the embodiment of the present application is provided with a first side wall portion 321 and a second side wall portion 322 of different heights. The two side wall portions with the height difference can be adapted to the circuit board 120 and the carrier board 110 with the height difference. The height difference between the second side wall portion 322 and the first side wall portion 321 can make up for the height difference between the circuit board 120 and the carrier board 110; thereby, the connection stability between the packaging shell 300 and the circuit board 120 and the carrier board 110 is better. At the same time, the present application does not require the first packaging colloid 400 to make up for the height difference between the circuit board 120 and the carrier board 110, and the amount of glue used in the first packaging colloid 400 can be reduced. The first packaging colloid 400 can be a colloid structure with a relatively uniform thickness, and the sealing performance of the first packaging colloid 400 is better.

[0066] In some embodiments, the packaging structure further includes a second packaging colloid 600. Figures 1 to 4 Please also refer to Figure 5 and Figure 6 , Figure 5 A connection diagram of the second encapsulation colloid 600 provided in an embodiment of the present application is shown in FIG. Figure 6This is a schematic diagram of a second structure of the micro-LED device packaging structure 10 provided in an embodiment of the present application. A portion of the bottom wall 310 is connected to the micro-LED device 200 through a second packaging colloid 600 .

[0067] It is understandable that the size of the micro-LED chip 210 of the micro-LED device 200 is often smaller than the size of the driver chip 220. In the present application, the second encapsulation colloid 600 can be set in the area of ​​the driver chip 220 that is not covered or blocked by the micro-LED chip 210. In this case, the second encapsulation colloid 600 is not likely to affect the light emission of the micro-LED chip 210, and the second encapsulation colloid 600 is not likely to increase the "black edge area" of the micro-LED device 200.

[0068] It is understandable that the second encapsulating colloid 600 can be an annular structure, and the second encapsulating colloid 600 of the annular structure can surround the micro-LED device 200, and the micro-LED device 200 is located in the area enclosed by the second encapsulating colloid 600. At this time, the second encapsulating colloid 600 located at the periphery of the micro-LED device 200 can reduce the water vapor entering the micro-LED device 200 and affecting the performance of the micro-LED device 200, and the second encapsulating colloid 600 of the annular structure can further improve the packaging reliability of the micro-LED device packaging structure 10.

[0069] It is understandable that the material of the second encapsulation colloid 600 is the same as the material of the first encapsulation colloid 400, or the material of the second encapsulation colloid 600 is different from the material of the first encapsulation colloid 400. Among them, at least one of the first encapsulation colloid 400 and the second encapsulation colloid 600 can be, but is not limited to, silicone potting glue, epoxy resin potting glue or other colloids.

[0070] It is understandable that the thickness of the first encapsulation colloid 400 and the second encapsulation colloid 600 are both greater than 0 and less than or equal to 50 micrometers (μm). For example, the thickness of the first encapsulation colloid 400 or the second encapsulation colloid 600 is about 10μm, 20μm, 30μm, 40μm or 50μm. At this time, the first encapsulation colloid 400 and the second encapsulation colloid 600 are not likely to make the overall thickness of the micro-LED device packaging structure 10 too thick, which is not conducive to the light and thin design of the micro-LED device packaging structure 10.

[0071] In the micro-LED device packaging structure 10 of the embodiment of the present application, the side wall 320 of the packaging shell 300 is connected to the packaging substrate 100 through the first packaging colloid 400, and the bottom wall 310 of the packaging shell 300 is connected to the micro-LED device 200 through the second packaging colloid 600. On the one hand, the connection between the packaging shell 300 and the packaging substrate 100 and the micro-LED device 200 is more secure, and the structure of the micro-LED device packaging structure 10 is more stable; on the other hand, the packaging shell 300 can protect the micro-LED device 200, and the first packaging colloid 400 and the second packaging colloid 600 can further improve the sealing and waterproof properties of the packaging structure, and the reliability of the micro-LED device packaging structure 10 is better.

[0072] Among them, please refer to Figure 7 , Figure 7 The third structural schematic diagram of the micro-LED device packaging structure 10 provided in the embodiment of the present application. The micro-LED device packaging structure 10 also includes a light-transmitting film structure 700. The light-transmitting film structure 700 is arranged on the side of the micro-LED chip 210 away from the driver chip 220, and the light-transmitting film structure 700 is arranged opposite to the light-transmitting area 340. The light-transmitting film structure 700 can protect the micro-LED chip 210.

[0073] It is understandable that the light-transmitting film structure 700 can be but is not limited to being adhered to the side of the micro-LED chip 210 away from the driver chip 220 , and the light-transmitting film structure 700 can better fit the micro-LED chip 210 .

[0074] It is understandable that the light-transmitting film structure 700 may be, but is not limited to, a glass film structure, a glue film structure, etc. The light emitted by the micro-LED device 200 can pass through the light-transmitting film structure 700 and be emitted outward, and the light-transmitting film structure 700 is not easy to block or affect the light generated by the micro-LED device 200.

[0075] It is understandable that the thickness of the light-transmitting film structure 700 is much smaller than the thickness of the bottom wall 310 of the packaging shell 300. For example, the thickness of the light-transmitting film structure 700 is greater than 0 and less than or equal to 50 μm. Further, the thickness of the light-transmitting film structure 700 is about 10 μm, 20 μm, 30 μm, 40 μm or 50 μm. The thinner light-transmitting film structure 700 provided in the present application can reduce the optical loss when light passes through the light-transmitting film structure 700, thereby ensuring the luminous performance of the micro-LED chip 210.

[0076] In the embodiment of the present application, a light-transmitting film structure 700 is disposed on a side of the micro-LED chip 210 away from the driver chip 220 . The light-transmitting film structure 700 is not likely to affect the light emission of the micro-LED device 200 and can protect the micro-LED chip 210 .

[0077] In some embodiments, the light-transmitting area 340 provided on the bottom wall 310 of the package shell 300 can be a through hole penetrating the thickness direction of the bottom wall 310. At this time, in terms of production technology, the light-transmitting film structure 700 can be attached and connected to the side of the micro-LED chip 210 away from the driver chip 220 from the light-transmitting area 340, and the assembly of the light-transmitting film structure 700 is more convenient. In addition, the area adjacent to the light-transmitting film structure 700 and the package shell 300 can be sealed, such as but not limited to filling with sealant, to achieve sealing between the package shell 300 and the micro-LED chip 210.

[0078] In some embodiments, the light-transmitting area 340 of the package shell 300 can be a non-through-hole type structure, and the light-transmitting area 340 does not penetrate the bottom wall 310 along the thickness direction of the bottom wall 310 of the package shell 300. At this time, in the production process, the light-transmitting film structure 700 can be first arranged on the side of the micro-LED chip 210 away from the driver chip 220 to realize the assembly of the light-transmitting film structure 700 and the micro-LED device 200; then the assembled structure is assembled with the package substrate 100, and then assembled with the package shell 300. Alternatively, the micro-LED device 200 can be connected to the package substrate 100 first, and then the light-transmitting film structure 700 and the micro-LED device 200 are assembled, and finally assembled with the package shell 300.

[0079] The packaging shell 300 of the embodiment of the present application is provided with a light-transmitting area 340. On the one hand, the light-transmitting area 340 is not likely to affect the light emission of the micro-LED device 200. On the other hand, the light-transmitting area 340 is a part of the packaging shell 300, and the structural strength of the packaging shell 300 is relatively high. At the same time, the packaging shell 300 has a better sealing effect on the micro-LED device 200, and water vapor is not likely to enter the interior of the packaging shell 300 and affect the performance of the micro-LED device 200. The reliability of the micro-LED device packaging structure 10 is relatively good.

[0080] It should be noted that the entire packaging shell 300 of the embodiment of the present application can be a light-transmitting structure, that is, the packaging shell 300 can also be light-transmitting except for the light-transmitting area 340. In this case, the appearance consistency of the packaging shell 300 is better.

[0081] Among them, please refer to Figures 8 to 10 , Figure 8This is a fourth structural schematic diagram of the micro light emitting diode device packaging structure 10 provided in an embodiment of the present application, Fig. 9 A schematic top view of a micro light emitting diode device packaging structure 10 provided in an embodiment of the present application, Fig.10 Another schematic top view of the micro-LED device package structure 10 provided in the embodiment of the present application. The micro-LED device package structure 10 further includes a third package colloid 800, which is disposed in a connection area 101 formed by the package shell 300, the package substrate 100 and the micro-LED device 200, and the third package colloid 800 encapsulates an electrical connector 900 electrically connected to the driver chip 220 and the circuit board 120.

[0082] It is understandable that the third encapsulation colloid 800 is a non-conductive (insulating) colloid structure. At least two of the third encapsulation colloid 800, the first encapsulation colloid 400, and the second encapsulation colloid 600 are made of the same material, or the three colloids are made of different materials.

[0083] The micro-LED device packaging structure 10 of the embodiment of the present application is provided with a third packaging colloid 800, which can seal and protect the electrical connector 900 to prevent the connection between the electrical connector 900 and the driver chip 220 and the circuit board 120 from being corroded by water vapor. The third packaging colloid 800 can further improve the reliability of the micro-LED device packaging structure 10.

[0084] In some examples, the third encapsulant 800 can be filled into the connection area 101 through the hollow area 330 on the bottom wall 310 of the encapsulation shell 300 , and the third encapsulant 800 can seal the hollow area 330 .

[0085] It is understandable that the hollow area 330 can penetrate the bottom wall 310 along the thickness direction of the bottom wall 310, and the size of the hollow area 330 can be determined according to actual conditions. For example, the size of the hollow area 330 can be equivalent to the cross-sectional area of ​​the enclosed area.

[0086] It is understandable that the filling height of the third encapsulating colloid 800 does not exceed the outer surface of the bottom wall 310 of the encapsulating shell 300. Further, the third encapsulating colloid 800 can be flush with the outer surface of the bottom wall 310 of the encapsulating shell 300, and the third encapsulating colloid 800 is connected to the encapsulating shell 300 as a whole, and the appearance of the encapsulating shell 300 is consistent.

[0087] The third encapsulant 800 of the embodiment of the present application is filled to the connection area 101 through the hollow area 330 , and the production process of the third encapsulant 800 is simpler.

[0088] Based on the above description, the packaging shell 300 of the micro-LED device packaging structure 10 provided in the embodiment of the present application is connected to the packaging substrate 100 through the first packaging colloid 400, and the packaging shell 300 can protect the micro-LED device 200. At the same time, the packaging shell 300 is provided with a first side wall portion 321 and a second side wall portion 322 of different heights, which can make up for the height difference between the circuit board 120 and the carrier board 110, which can not only make the connection stability between the packaging shell 300 and the circuit board 120 and the carrier board 110 better, but also reduce the glue amount of the first packaging colloid 400, and improve the sealing performance of the first packaging colloid 400. Moreover, part of the bottom wall 310 of the package shell 300 is connected to the micro-LED device 200 through the second packaging colloid 600, which can further increase the connection firmness between the package shell 300 and the package substrate 100 and the micro-LED device 200; and the electrical connector 900 electrically connected to the driver chip 220 and the circuit board 120 is wrapped by the third packaging colloid 800, and the third packaging colloid 800 can seal and protect the electrical connector 900; at the same time, the side of the micro-LED chip 210 away from the driver chip 220 is provided with a light-transmitting film structure 700, and the light-transmitting film structure 700 can protect the micro-LED chip 210. Based on this, the micro-LED device packaging structure 10 of the present application has better packaging integrity, higher reliability and better aesthetics.

[0089] Based on the above description of the micro-LED device packaging structure 10, the present application embodiment also provides a packaging method. Fig.11 , Fig.11 A first flow chart of the packaging method provided in an embodiment of the present application.

[0090] In S101 , a micro light emitting diode device 200 is provided. The micro light emitting diode device 200 includes a micro light emitting diode chip 210 and a driving chip 220 that are bonded together.

[0091] like Figure 2 and Figure 3 As shown, the micro-LED device 200 is a single chip bonding structure, and the driving chip 220 of the micro-LED device 200 is bonded to the micro-LED chip 210 .

[0092] In S102 , a packaging substrate 100 is provided, and the packaging substrate 100 includes a carrier board 110 and a circuit board 120 connected to each other.

[0093] In S103 , the carrier board 110 is disposed and connected to a side of the driver chip 220 facing away from the micro-LED chip 210 , and the circuit board 120 is electrically connected to the driver chip 220 via the electrical connector 900 .

[0094] The carrier board 110 is used to carry the micro-LED device 200. The driver chip 220 and the micro-LED chip 210 are stacked on the carrier board 110. The driver chip 220 is located between the micro-LED chip 210 and the carrier board 110. The circuit board 120 is disposed on the carrier board 110 and is spaced apart from the driver chip 220. The circuit board 120 is used to be electrically connected to an external circuit. The driver chip 220 is electrically connected to the circuit board 120 through an electrical connector 900. The driver chip 220 can receive electrical signals and control signals transmitted by the circuit board 120, thereby controlling the micro-LED chip 210 to emit light.

[0095] In S104 , a packaging shell 300 is provided, wherein the packaging shell 300 includes a hollow area 330 and a light-transmitting area 340 .

[0096] like Figure 1 As shown, the side wall 320 of the encapsulation shell 300 cooperates with the bottom wall 310 so that the encapsulation shell 300 is a shell structure with a certain accommodation space and a certain shape. The shell structure is different from the glue structure formed after the glue solidifies. Among them, the hollow area 330 and the light-transmitting area 340 are formed on the bottom wall 310, and the hollow area 330 and the light-transmitting area 340 are arranged at intervals.

[0097] In S105, the packaging shell 300 covers the micro-LED device 200 and part of the packaging substrate 100, and the hollow area 330 is arranged opposite to the electrical connector 900, and the light-transmitting area 340 is arranged opposite to the micro-LED chip 210, and the micro-LED device packaging structure 10 is obtained.

[0098] It is understandable that the orthographic projection of the hollow area 330 on the carrier board 110 can cover the orthographic projection of the electrical connector 900 on the carrier board 110 , and the orthographic projection of the light-transmitting area 340 on the carrier board 110 can cover the orthographic projection of the micro-LED chip 210 on the carrier board 110 .

[0099] The packaging shell 300 of the micro-LED device packaging structure 10 prepared by the packaging method of the present application covers the micro-LED device 200 and part of the packaging substrate 100. The packaging shell 300 can protect the micro-LED device 200 and reduce the influence of water vapor and other objects on the micro-LED device 200. The packaging shell 300 can improve the reliability of the micro-LED device packaging structure 10; and the packaging shell 300 includes a hollow area 330 facing the electrical connector 900 and a light-transmitting area 340 facing the micro-LED chip 210. The hollow area 330 is a hollow area 340 disposed opposite to the electrical connector 900. 30 facilitates the filling of glue in the micro-LED device packaging structure 10 and protects the connecting electrical connector 900, which can improve the sealing safety of the micro-LED device packaging structure 10; the light-transmitting area 340 is not easy to affect the light emission of the micro-LED chip 210, and the packaging shell 300 is more convenient to take into account the light-emitting performance and sealing safety performance of the micro-LED device packaging structure 10; moreover, the packaging shell 300 of the present application is a shell structure with a certain shape, and the packaging shell 300 with a certain shape enables the micro-LED device packaging structure 10 of the present application to have better packaging integrity. Based on this, under the action of the packaging shell 300, the micro-LED device packaging structure 10 of the present application has better packaging integrity, higher reliability, and better aesthetics.

[0100] In some embodiments, the packaging shell 300 includes a bottom wall 310 and a side wall 320 surrounding the periphery of the bottom wall 310 and protruding from the bottom wall 310. In step 105, the step of making the packaging shell 300 cover the micro-LED device 200 and part of the packaging substrate 100 includes: connecting the side wall 320 to the packaging substrate 100 through the first packaging colloid 400, connecting part of the bottom wall 310 to the micro-LED device 200 through the second packaging colloid 600, and making the packaging shell 300 cover the micro-LED device 200 and part of the packaging substrate 100.

[0101] It is understandable that if Figures 1 to 4 As shown, the first encapsulant 400 can be disposed on the encapsulation substrate 100. The side wall 320 of the encapsulation shell 300 is connected to the encapsulation substrate 100 through the first encapsulant 400. Figures 5 to 8 As shown, the second encapsulation colloid 600 is disposed in the area of ​​the driving chip 220 that is not covered or blocked by the micro-LED chip 210, and part of the bottom wall 310 can be connected to the micro-LED device 200 through the second encapsulation colloid 600. At this time, the second encapsulation colloid 600 is not likely to affect the light emission of the micro-LED chip 210, and the second encapsulation colloid 600 is not likely to increase the "black edge area" of the micro-LED device 200.

[0102] It can be understood that, in some examples, the first packaging colloid 400 can be a ring-shaped structure, and the second packaging colloid 600 can also be a ring-shaped structure. The first packaging colloid 400 with a ring-shaped structure can be adapted to the side wall 320 of the packaging shell 300, and the second packaging colloid 600 with a ring-shaped structure can be adapted to the bottom wall 310 of the packaging shell 300. Thus, the first packaging colloid 400 with a ring-shaped structure can improve the packaging reliability of the micro light-emitting diode device packaging structure 10.

[0103] In the packaging method of the present application, the side wall 320 of the packaging shell 300 is connected to the packaging substrate 100 through the first packaging colloid 400, and the bottom wall 310 of the packaging shell 300 is arranged on the side of the micro-LED device 200 away from the packaging substrate 100 and connected to the area of ​​the driver chip 220 not covered or blocked by the micro-LED chip 210 through the second packaging colloid 600. The packaging shell 300 can cover the micro-LED device 200 and make the micro-LED device 200 located in the packaging shell 300. On the one hand, the packaging shell 300 can protect the micro-LED device 200 and reduce the interference of the micro-LED device 200 by external objects; on the other hand, the packaging shell 300 can play a blocking role, and the packaging shell 300 can reduce the influence of water vapor on the micro-LED device 200, thereby improving the reliability of the packaging structure. Based on this, the micro-LED device packaging structure 10 prepared by the packaging method of the present application has better packaging integrity, reliability and good aesthetics.

[0104] In some examples, the packaging method further includes: disposing a light-transmitting film structure 700 on a side of the micro-LED chip 210 away from the driver chip 220, and disposing the light-transmitting film structure 700 opposite to the light-transmitting area 340. In this case, the light-transmitting film structure 700 is not likely to affect the light emission of the micro-LED device 200, and can also protect the micro-LED chip 210.

[0105] In some examples, the packaging method further includes: filling the third packaging colloid 800 into the connection area 101 through the hollow area 330, and making the third packaging colloid 800 wrap the electrical connector 900 and seal the hollow area 330. At this time, the third packaging colloid 800 can seal and protect the electrical connector 900, and prevent the connection between the electrical connector 900 and the driver chip 220 and the circuit board 120 from being corroded by water vapor. The third packaging colloid 800 can further improve the reliability of the micro light emitting diode device packaging structure 10.

[0106] In some examples, the side wall 320 of the packaging shell 300 includes a first side wall portion 321 and a second side wall portion 322, and the maximum distance between the second side wall portion 322 and the bottom wall 310 is greater than the maximum distance between the first side wall portion 321 and the bottom wall 310. The packaging method further includes: connecting the first side wall portion 321 to the circuit board 120 through the first packaging colloid 400, and connecting the second side wall portion 322 to the carrier board 110 through the first packaging colloid 400. At this time, the height difference between the second side wall portion 322 and the first side wall portion 321 can make up for the height difference between the circuit board 120 and the carrier board 110. The present application does not need the first packaging colloid 400 to make up for the height difference between the circuit board 120 and the carrier board 110, and can reduce the amount of glue used for the first packaging colloid 400.

[0107] Based on the above description, please refer to Fig.12 , Fig.12 A second flow chart of the packaging method provided in an embodiment of the present application.

[0108] In S201 , a micro light emitting diode device 200 and a packaging substrate 100 are provided; and the micro light emitting diode device 200 is disposed on and connected to the packaging substrate 100 .

[0109] like Figures 1 to 3 As shown, the micro-LED device 200 is a single chip bonding structure, and the micro-LED device 200 includes a micro-LED chip 210 and a driver chip 220, and the driver chip 220 is bonded to the micro-LED chip 210. The package substrate 100 includes a carrier board 110 and a circuit board 120, and the circuit board 120 is used to be electrically connected to an external circuit. The driver chip 220 is electrically connected to the circuit board 120 through an electrical connector 900, and the driver chip 220 can receive electrical signals and control signals transmitted by the circuit board 120, so as to control the micro-LED chip 210 to emit light.

[0110] In S202 , a packaging shell 300 is provided. The packaging shell 300 includes a bottom wall 310 , a side wall 320 surrounding the periphery of the bottom wall 310 and protruding from the bottom wall 310 , a hollow area 330 and a light-transmitting area 340 opened on the bottom wall 310 .

[0111] like Figure 1 As shown, the side wall 320 and the bottom wall 310 of the packaging shell 300 cooperate to make the packaging shell 300 a shell structure with a certain accommodation space and a certain shape. The shell structure is different from the glue structure formed after the glue solidifies.

[0112] In S203 , a first encapsulant 400 is disposed on the encapsulation substrate 100 , and a second encapsulant 600 is disposed on the micro light emitting diode device 200 .

[0113] The first encapsulant 400 can be disposed on the circuit board 120 and the carrier board 110 of the package substrate 100. The first encapsulant 400 can be an annular structure. Further, the first encapsulant 400 can be an annular structure with a certain height difference to adapt to the circuit board 120 and the carrier board 110 with a height difference.

[0114] The second encapsulant 600 can be disposed in an area of ​​the driver chip 220 that is not covered or blocked by the micro-LED chip 210. The second encapsulant 600 can be a ring structure. The material of the second encapsulant 600 is the same as or different from that of the first encapsulant 400.

[0115] In S204, the side wall 320 of the packaging shell 300 is connected to the packaging substrate 100 through the first packaging colloid 400, and the bottom wall 310 of the packaging shell 300 is covered on the side of the micro light emitting diode device 200 away from the packaging substrate 100, and a part of the bottom wall 310 of the packaging shell 300 is connected to the micro light emitting diode device 200 through the second packaging colloid 600.

[0116] In this step, the first side wall portion 321 of the packaging shell 300 is connected to the circuit board 120 through the first packaging colloid 400 , and the second side wall portion 322 of the packaging shell 300 is connected to the carrier board 110 through the first packaging colloid 400 to achieve the connection between the packaging shell 300 and the packaging substrate 100 .

[0117] In S205 , the third packaging resin 800 is filled into the accommodating space through the hollow area 330 of the packaging shell 300 , and the third packaging resin 800 wraps the electrical connector 900 .

[0118] In this step, the dispensing machine can fill the third encapsulating colloid 800 into the accommodating space through the hollow area 330. In some examples, the filling height of the third encapsulating colloid 800 does not exceed the outer surface of the bottom wall 310 of the encapsulating shell 300. Further, the third encapsulating colloid 800 can be flush with the outer surface of the bottom wall 310 of the encapsulating shell 300.

[0119] It is understandable that the third encapsulating colloid 800 is an insulating colloid structure. At least one of the third encapsulating colloid 800, the first encapsulating colloid 400, and the second encapsulating colloid 600 is made of the same material, or the three colloids are made of different materials.

[0120] In S206 , a light-transmitting film structure 700 is disposed on a side of the micro-LED chip 210 away from the driving chip 220 , and the light-transmitting film structure 700 is disposed opposite to the light-transmitting region 340 , thereby obtaining a micro-LED device packaging structure 10 .

[0121] The light-transmitting film structure 700 may be, but is not limited to, pasted on the side of the micro-LED chip 210 away from the driver chip 220. The light-transmitting film structure 700 may be, but is not limited to, a glass film structure, a glue film structure, or the like.

[0122] It can be understood that, in some embodiments, the light-transmitting area 340 can be a through hole that penetrates the bottom wall 310 of the package shell 300 in the thickness direction. At this time, in the process production, the light-transmitting film structure 700 can be attached and connected to the side of the micro-LED chip 210 away from the driver chip 220 from the light-transmitting area 340, and the assembly of the light-transmitting film structure 700 is more convenient. In other embodiments, the light-transmitting area 340 can be a non-through hole type structure. At this time, in the process production, the light-transmitting film structure 700 can be first set on the side of the micro-LED chip 210 away from the driver chip 220 to realize the assembly of the light-transmitting film structure 700 and the micro-LED device 200; then the assembled structure is assembled with the package substrate 100, and then assembled with the package shell 300. Alternatively, this step can also first connect the micro-LED device 200 to the package substrate 100, then assemble the light-transmitting film structure 700 with the micro-LED device 200, and finally assemble it with the package shell 300.

[0123] It should be noted that, in the above steps of the encapsulation method of the present application, the order of the steps can be advanced or moved backward according to actual needs, provided that there is no conflict.

[0124] In the packaging method of the embodiment of the present application, the packaging shell 300 is connected to the packaging substrate 100 through the first packaging colloid 400, and the packaging shell 300 can protect the micro-LED device 200. In addition, the packaging shell 300 is provided with a first side wall portion 321 and a second side wall portion 322 of different heights, which can make up for the height difference between the circuit board 120 and the carrier board 110, which can not only make the connection stability between the packaging shell 300 and the circuit board 120 and the carrier board 110 better, but also reduce the amount of glue used in the first packaging colloid 400, and improve the sealing performance of the first packaging colloid 400. Moreover, part of the bottom wall 310 of the packaging shell 300 is connected to the micro-LED device 200 through the second packaging colloid 600, which can further increase the connection firmness between the packaging shell 300 and the packaging substrate 100 and the micro-LED device 200; and the electrical connector 900 electrically connected to the driver chip 220 and the circuit board 120 is wrapped by the third packaging colloid 800, and the third packaging colloid 800 can seal and protect the electrical connector 900; and the side of the micro-LED chip 210 away from the driver chip 220 is provided with a light-transmitting film structure 700, and the light-transmitting film structure 700 can protect the micro-LED chip 210. Based on this, the micro-LED device packaging structure 10 prepared by the packaging method of the present application has better packaging integrity, high reliability and good aesthetics.

[0125] Based on the above description, the present application embodiment further provides a display device 20, please refer to Fig.13 , Fig.13 A structural schematic diagram of a display device 20 provided in an embodiment of the present application. The display device 20 can be applied to electronic devices to realize extended reality (Extended Reality, XR) technologies such as augmented reality (AR), virtual reality (VR), and mixed reality (MR). In implementation, the display device 20 can be the projection part of an electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the display device 20 can also be the display part of an electronic device, for example, the electronic device can include: any device with a display screen, such as a smart phone, a smart watch, a laptop computer, a tablet computer, a driving recorder, a navigator, a head-mounted device, etc.; for another example, the display device 20 can also be the lighting part of an electronic device, for example, the electronic device can include: any device with a lighting component, such as a vehicle, a street lamp, etc.

[0126] It can be understood that the display device 20 of the embodiment of the present application includes the micro-LED device packaging structure 10 of any of the above embodiments, or includes the micro-LED device packaging structure 10 prepared by the packaging method of any of the above embodiments. Therefore, the display device 20 of the present application has better packaging integrity, high reliability and good aesthetics.

[0127] It should be noted that the micro-LED device packaging structure 10, packaging method, and display device 20 of the embodiments of the present application are different subjects under the same inventive concept. Features not described in detail in each embodiment can be found in the description of other embodiments.

[0128] It should be noted that the "multiple" mentioned in this application generally refers to two or more. Moreover, the directional terms mentioned in the embodiments of the present application, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the embodiments of the present application, rather than to limit the embodiments of the present application. In the various drawings, units with similar structures are represented by the same figure numbers. For clarity, the various parts in the drawings are not drawn to scale. In addition, certain related parts may not be shown in the drawings.

[0129] It should be understood that, in the description of this application, terms such as "first", "second", etc. are only used to distinguish similar objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0130] It is understandable that those skilled in the art can combine various implementations in the above embodiments under the guidance of the above embodiments to obtain technical solutions of multiple implementations. The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0131] The above is a detailed introduction to the micro-LED device packaging structure, packaging method, and display device provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. A micro light emitting diode device packaging structure, characterized in that: include: A micro light emitting diode device, comprising a micro light emitting diode chip and a driver chip bonded together; A packaging substrate, comprising a carrier plate and a circuit board connected to each other, wherein the carrier plate is arranged and connected to a side of the driver chip away from the micro-LED chip, and the circuit board is electrically connected to the driver chip through an electrical connector; and The packaging shell covers the micro-LED device and part of the packaging substrate, and the packaging shell includes a hollow area and a light-transmitting area. The hollow area is arranged opposite to the electrical connector, and the light-transmitting area is arranged opposite to the micro-LED chip.

2. The micro light emitting diode device packaging structure according to claim 1, characterized in that: The packaging shell further includes a bottom wall, and a side wall surrounding the periphery of the bottom wall and protruding from the bottom wall; The packaging structure further includes a first packaging colloid and a second packaging colloid, the side wall is connected to the packaging substrate through the first packaging colloid, and a portion of the bottom wall is connected to the driving chip through the second packaging colloid.

3. The micro light emitting diode device packaging structure according to claim 2, characterized in that: The first encapsulating colloid and the second encapsulating colloid are both ring-shaped structures.

4. The micro light emitting diode device packaging structure according to any one of claims 1 to 3, characterized in that: The packaging structure further includes: A third packaging colloid is disposed in the packaging shell and wraps the electrical connector, and the third packaging colloid seals the hollow area.

5. The micro light emitting diode device packaging structure according to any one of claims 1 to 3, characterized in that: The packaging structure further includes: The light-transmitting film structure is arranged on a side of the micro-LED chip away from the driving chip and is arranged opposite to the light-transmitting area.

6. A packaging method, characterized in that: include: A micro light emitting diode device is provided, wherein the micro light emitting diode device comprises a micro light emitting diode chip and a driving chip which are bonded to each other; Providing a packaging substrate, the packaging substrate comprising a carrier plate and a circuit board connected to each other; The carrier board is arranged and connected to a side of the driver chip away from the micro-LED chip, and the circuit board is electrically connected to the driver chip through an electrical connector; Providing a packaging shell, wherein the packaging shell includes a hollow area and a light-transmitting area; The packaging shell covers the micro-LED device and part of the packaging substrate, and the hollow area is arranged opposite to the electrical connector, and the light-transmitting area is arranged opposite to the micro-LED chip, so as to obtain a micro-LED device packaging structure.

7. The packaging method according to claim 6, characterized in that: The packaging shell includes a bottom wall, and a side wall surrounding the periphery of the bottom wall and protruding from the bottom wall; The step of making the packaging shell cover the micro light emitting diode device and part of the packaging substrate comprises: The side wall is connected to the packaging substrate through a first packaging colloid, part of the bottom wall is connected to the driving chip through a second packaging colloid, and the packaging shell covers the micro light emitting diode device and part of the packaging substrate; wherein the first packaging colloid and the second packaging colloid are both annular structures.

8. The packaging method according to claim 6 or 7, characterized in that: The packaging method further comprises: A third packaging colloid is filled into the packaging shell through the hollow area, and the third packaging colloid wraps the electrical connector and seals the hollow area.

9. The packaging method according to claim 6 or 7, characterized in that: The packaging method further comprises: The light-transmitting film structure is arranged on a side of the micro-LED chip away from the driving chip, and the light-transmitting film structure is arranged opposite to the light-transmitting area.

10. A display device, characterized in that: It comprises a micro-light emitting diode device packaging structure as described in any one of claims 1 to 5; or, it comprises a micro-light emitting diode device packaging structure prepared by the packaging method as described in any one of claims 6 to 9.

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