Preparation method of display panel and display panel

Abstract

The invention discloses a preparation method of a display panel and the display panel. The preparation method comprises the following steps: printing and preparing a defined structure pattern by adopting an electron beam direct writing technology; printing and preparing a color resistance unit assembly pattern in the filtering opening pattern; and curing the color resistance unit assembly pattern at 80-90 DEG C to obtain the color resistance unit assembly. According to the preparation method of the display panel provided by the embodiment of the invention, the defined structure pattern and the color resistance unit assembly pattern are prepared by printing, so that the preparation precision is higher, the steps of the printing process can be arranged together, and the preparation precision is improved and the preparation cost is reduced while the technological process is reduced to improve the preparation efficiency; by adopting the low-temperature curing process step, the curing step is flexible in process arrangement of the display panel so as to improve the preparation efficiency, and meanwhile, the preparation cost can be further reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for preparing a display panel and a display panel. Background Art

[0002] Flat display devices such as organic light emitting diode (OLED) display panels and display panels using light emitting diode (LED) devices have the advantages of high image quality, power saving, thin body and wide application range. They are widely used in various consumer electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, desktop computers, etc., becoming the mainstream of display devices.

[0003] However, the performance of current OLED products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a method for manufacturing a display panel and a display panel, and propose a new process for manufacturing a COE structure, which can reduce and flexibly arrange process steps, improve manufacturing efficiency, improve manufacturing accuracy, and reduce manufacturing costs.

[0005] In a first aspect, an embodiment of the present application provides a method for preparing a display panel, comprising:

[0006] The defined structure pattern is prepared by printing using electron beam direct writing technology, wherein the defined structure pattern includes at least one filter opening pattern;

[0007] Printing and preparing a color resist unit component pattern in the filter opening pattern;

[0008] The color resist unit component pattern is cured at 80° C. to 90° C. to obtain a color resist unit component.

[0009] According to one aspect of the embodiment of the present application, before the step of printing and preparing the defined structure pattern using the electron beam direct writing technology, the method further includes:

[0010] Prepare display panel functional structure.

[0011] According to one aspect of an embodiment of the present application, the step of preparing a display panel functional structure further includes:

[0012] Prepare a light-emitting layer on one side of the array substrate layer, wherein the light-emitting layer includes at least one light-emitting unit;

[0013] The step of printing and preparing the defined structure pattern by electron beam direct writing technology also includes:

[0014] The electron beam direct writing technology is used to print and prepare the defined structure pattern on the side of the light emitting layer away from the array substrate layer.

[0015] According to one aspect of an embodiment of the present application, the step of preparing a display panel functional structure further includes:

[0016] Prepare a packaging layer on the side of the light-emitting layer away from the array substrate layer;

[0017] The step of printing and preparing the defined structure pattern by electron beam direct writing technology also includes:

[0018] The electron beam direct writing technology is used to print and prepare the defined structure pattern on the side of the packaging layer away from the light-emitting layer.

[0019] According to one aspect of the embodiment of the present application, the step of preparing the encapsulation layer further includes:

[0020] preparing a first inorganic encapsulation layer;

[0021] preparing an organic encapsulation layer;

[0022] preparing a second inorganic encapsulation layer;

[0023] The step of using electron beam direct writing technology to print and prepare the defined structure pattern also includes: using electron beam direct writing technology to print and prepare the defined structure pattern on the side of the second inorganic encapsulation layer away from the organic encapsulation layer.

[0024] According to one aspect of an embodiment of the present application, the step of preparing a display panel functional structure further includes:

[0025] Preparing a touch module on a side of the encapsulation layer away from the light-emitting layer;

[0026] The step of using electron beam direct writing technology to print and prepare the defined structure pattern also includes: using electron beam direct writing technology to print and prepare the defined structure pattern on the side of the touch module away from the packaging layer.

[0027] According to one aspect of an embodiment of the present application, the step of printing and preparing a color resist unit component pattern further includes:

[0028] The color resist unit component pattern is prepared by printing using electron beam direct writing technology, or by printing using inkjet printing technology.

[0029] According to one aspect of the embodiment of the present application, the step of curing the color resist unit component pattern at 80° C. to 90° C. further includes:

[0030] The step of curing the defined structure pattern at 80° C. to 90° C. to obtain a defined structure, wherein the defined structure includes at least one filter opening, or the step of printing and preparing the color resist unit component pattern also includes:

[0031] The defined structure pattern is cured at 80° C. to 90° C. to obtain a defined structure, wherein the defined structure includes at least one filter opening.

[0032] According to one aspect of the embodiment of the present application, the step of printing and preparing the defined structure pattern also includes:

[0033] Solute electron beam excited reactive glue printing is used to prepare defined structure graphics.

[0034] According to one aspect of the embodiment of the present application, the step of curing the defined structure pattern at 80° C. to 90° C. further includes:

[0035] The defined structure pattern is irradiated and solidified by a low-energy electron beam to obtain a defined structure.

[0036] According to one aspect of an embodiment of the present application, the step of printing and preparing a color resist unit component pattern further includes:

[0037] The color resist unit component pattern is prepared by solute electron beam excitation reaction glue printing.

[0038] According to one aspect of the embodiment of the present application, the step of curing the color resist unit component pattern at 80° C. to 90° C. further includes:

[0039] The color resist unit component pattern is irradiated and cured by a low-energy electron beam to obtain a color resist unit component.

[0040] According to one aspect of the embodiment of the present application, after the step of printing and preparing the color resist unit component pattern, the step further includes:

[0041] Print and prepare overlay graphics.

[0042] According to one aspect of the embodiment of the present application, the step of curing the color resist unit component pattern at 80° C. to 90° C. further includes:

[0043] The covering layer pattern is cured at 80° C. to 90° C. to obtain a covering layer, wherein the covering layer covers at least a portion of the color resist unit component, or after the step of curing the color resist unit component pattern at 80° C. to 90° C., the step further includes:

[0044] Printing and preparing covering layer graphics;

[0045] The covering layer pattern is cured at 80° C. to 90° C. to obtain a covering layer, wherein the covering layer covers at least a portion of the color resist unit component.

[0046] According to one aspect of the embodiment of the present application, the step of printing and preparing the covering layer pattern further includes:

[0047] The covering layer pattern is prepared by printing using electron beam direct writing technology, or by printing using inkjet printing technology.

[0048] According to one aspect of the embodiment of the present application, the step of printing and preparing the defined structure pattern also includes:

[0049] The cover layer pattern is prepared by solute electron beam excited reactive glue printing.

[0050] According to one aspect of the embodiment of the present application, the step of curing the defined structure pattern at 80° C. to 90° C. further includes:

[0051] The covering layer pattern is irradiated and cured by a low-energy electron beam to obtain the covering layer.

[0052] In a second aspect, an embodiment of the present application further provides a display panel, which is prepared by the method for preparing a display panel as described in any of the preceding items.

[0053] In the third aspect, the embodiment of the present application also provides a display panel, including: an array substrate layer; a light-emitting layer, arranged on one side of the array substrate, the light-emitting layer including at least one light-emitting unit; an encapsulation layer, arranged on the side of the light-emitting layer away from the array substrate; a light improvement structure, including a photoresist layer, the light-resist layer being arranged on the side of the encapsulation layer away from the light-emitting layer, the light-resist layer including a defining structure and a color resist unit assembly, the defining structure including at least one filter opening, the color resist unit assembly including at least one color resist unit, the color resist unit assembly being exposed by the filter opening, the light-emitting unit and the color resist unit being arranged correspondingly, and the light-emitting unit and the color resist unit having the same size.

[0054] According to one aspect of the embodiment of the present application, the size of the color-resistance unit is the same as the aperture size of the filter opening.

[0055] According to one aspect of an embodiment of the present application, the light improving structure further includes a covering layer, which is disposed on a side of the photoresist layer away from the encapsulation layer, and the covering layer covers at least a portion of the photoresist layer.

[0056] The display panel preparation method and display panel provided in the embodiments of the present application, the display panel preparation method adopts printing to prepare the defined structure graphics and the color resist unit component graphics, the preparation accuracy is higher, and no exposure and development steps are required, and no photoresist containing photoinitiator and solvent is required. The printing process steps can be arranged together, and the process steps can be reduced to improve the preparation efficiency while improving the preparation accuracy and reducing the preparation cost; by adopting a low temperature of 80°C to 90°C to cure the color resist unit component graphics, it can be cured without the process steps of heating and baking, and will not affect the process flow of the preparation of the light-emitting unit, so that the curing step can be flexibly arranged in the process steps of the display panel to improve the preparation efficiency, and can further reduce the preparation cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0058] Figure 1 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0059] Figures 2 to 4 It is a schematic diagram of the process steps of a method for preparing a display panel provided in an embodiment of the present application;

[0060] Figure 5 It is a schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0061] Figure 6 It is a schematic diagram of the process steps of another method for preparing a display panel provided in an embodiment of the present application;

[0062] Figure 7 It is a schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0063] Figure 8 It is a schematic diagram of the process steps of another method for preparing a display panel provided in an embodiment of the present application;

[0064] Fig. 9 It is a schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0065] Fig.10 It is a schematic diagram of the process steps of another method for preparing a display panel provided in an embodiment of the present application;

[0066] Fig.11 is a schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0067] Figure 12 to Figure 14 It is a schematic diagram of the process steps of another method for preparing a display panel provided in an embodiment of the present application;

[0068] Fig.15 It is a schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0069] Fig.16 It is a schematic diagram of the process steps of another method for preparing a display panel provided in an embodiment of the present application;

[0070] Fig.17 It is a schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0071] Fig.18 It is a schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0072] Fig.19It is a schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0073] Fig. 20 It is a schematic diagram of the process steps of another method for preparing a display panel provided in an embodiment of the present application;

[0074] Fig.21 It is a schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0075] Fig. 22 It is a schematic flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0076] Fig.23 is a schematic diagram of a planar structure of a display panel provided in an embodiment of the present application;

[0077] Fig.24 yes Fig.23 Schematic diagram of the cross-sectional structure along A-A'.

[0078] in:

[0079] 10'-delimited structure pattern; 11'-filter opening pattern; 10-delimited structure; 11-filter opening;

[0080] 20'-color resist unit component graphic; 20-color resist unit component; 21-color resist unit;

[0081] 30- Display panel functional structure;

[0082] 40-array substrate layer;

[0083] 50-light-emitting layer; 51-light-emitting unit;

[0084] 60-encapsulation layer; 61-first inorganic encapsulation layer; 62-organic encapsulation layer; 63-second inorganic encapsulation layer;

[0085] 70-touch module;

[0086] 80'-covering layer graphics; 80-covering layer;

[0087] 90-light improving structure; 91-light blocking layer;

[0088] 100-Display panel.

[0089] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale. DETAILED DESCRIPTION

[0090] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0091] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of more restrictions, the elements limited by the sentence "comprise..." do not exclude the existence of other identical elements in the process, method, article or equipment including the elements.

[0092] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the flexible circuit board and display panel of this application. In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "setting" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0093] The existing depolarizer technology usually adopts the structure of COE technology. The manufacturing process of the COE structure draws on the manufacturing process of the CF structure in the liquid crystal display panel (LCD), and each film layer in the COE is manufactured by the yellow light process. Each film layer needs to be manufactured through the steps of coating, exposure, development, baking and curing. Although the process is relatively mature, there has always been a problem of waste of photoresist. The solvent in the photoresist volatilizes during the baking and curing process, causing environmental pollution, requiring additional equipment and sites for control, and there are many process steps, and there is a problem of relatively high preparation cost.

[0094] In order to solve the above problems, the present application provides a method for preparing a display panel and a display panel, and proposes a new process for preparing a COE structure.

[0095] In order to better understand this application, Figures 1 to 4 The method for preparing the display panel according to the embodiment of the present application is described in detail.

[0096] See also Figure 1 In a first aspect, an embodiment of the present application provides a method for preparing a display panel, and the method for preparing a display panel includes:

[0097] Step S200, as Figure 2 As shown, the defined structure pattern 10' is prepared by printing using electron beam direct writing technology, and the defined structure pattern 10' includes at least one filter opening pattern 11';

[0098] Step S300, as Figure 3 As shown, a color resist unit component pattern 20' is printed in the filter opening pattern 11';

[0099] Step S400, as Figure 4 As shown, the color resist unit component pattern 20 ′ is cured at 80° C. to 90° C. to obtain the color resist unit component 20 .

[0100] The method for preparing a display panel provided in an embodiment of the present application adopts printing to prepare a defined structure pattern 10' and a color resist unit component pattern 20', so that the preparation accuracy is higher, and no exposure and development steps are required, and no photoresist containing a photoinitiator and a solvent is required. The printing process steps can be arranged together, and the process steps can be reduced to improve the preparation efficiency while improving the preparation accuracy and reducing the preparation cost. By adopting a low temperature of 80°C to 90°C to cure the color resist unit component pattern 20', it can be cured without adopting a heating and baking process step, and will not affect the process flow of the preparation of the light-emitting unit, so that the curing step can be flexibly arranged in the process of the display panel to improve the preparation efficiency, and can further reduce the preparation cost.

[0101] Electron beam lithography is a graphic transfer technology based on the principle of focused electron beam scanning. It uses focused electrons with extremely short wavelengths to directly act on electron-sensitive reaction glue and draw on its surface to form micro-nano structures that match the designed graphics. It includes a direct-write exposure working mode that can directly draw patterns. It has ultra-high resolution with a limit size of less than 10nm and flexible mapping. Direct writing does not require a mask and can be used to directly print and prepare partial structures in COE, including defining structural graphics 10'.

[0102] Due to the high precision of the electron beam direct writing technology, the filter opening pattern 11' of the same size as the color resist unit component pattern 20' can be directly prepared. The filter opening pattern 11' forms an opening pattern of a certain size through the peripheral defining structure pattern 10', which can directly limit the size of the color resist unit component pattern 20' and facilitate printing and preparation, without considering the positioning accuracy of the photolithography process in the yellow light process. It is necessary to set the size of the color resist unit component pattern 20' to be slightly larger than the size of the filter opening to ensure that the color resist unit component pattern 20' can cover the filter opening. The filter opening pattern 11' plays a role of limiting to simplify the process, while improving the preparation accuracy of the color resist unit component pattern 20'.

[0103] The color resist unit component pattern 20' includes a color resist unit pattern of a red sub-pixel, a color resist unit pattern of a green sub-pixel, and a color resist unit pattern of a blue sub-pixel. The specific size of the color resist unit pattern is set according to the sub-pixel size of the specific corresponding color of the light-emitting unit in the display panel structure, and the embodiment of the present application is not limited here.

[0104] Printing and preparing the color resist unit component graphics 20' and curing the color resist unit component graphics 20' at 80°C to 90°C, optionally, it can be set to first print and prepare the color resist unit graphics corresponding to each color sub-pixel, and then uniformly cure the color resist unit graphics corresponding to each color sub-pixel in one process; it can also be set to first print and prepare the color resist unit graphics corresponding to a single color sub-pixel, first perform a process of curing the color resist unit graphics corresponding to the prepared single color sub-pixel at 80°C to 90°C, and then respectively print and prepare and cure the color resist unit graphics corresponding to the second color sub-pixel and the color resist unit graphics corresponding to the third color sub-pixel at 80°C to 90°C, the color resist unit graphics are respectively printed and prepared and cured, and the order of printing and curing can be arranged according to the size of the corresponding sub-pixel, or can be arranged freely, which is not limited in the embodiment of the present application. In the embodiment of the present application, the color resist unit graphics are prepared by printing and preparing and curing at 80°C to 90°C, without the need for high-temperature baking, and the process arrangement is flexible, which improves efficiency while further reducing costs.

[0105] See also Figure 5 In some embodiments, before step S200, the process further includes:

[0106] Step S100, see Figure 6 , preparing a display panel functional structure 30.

[0107] In these embodiments, the method for preparing a display panel provided in the embodiments of the present application can integrate the process for preparing COE into the process for preparing a display panel, thereby flexibly arranging the process, improving efficiency, and further reducing costs.

[0108] The existing COE process has a high-temperature baking and curing process step, and the luminescent material used in the luminescent structure of the display panel is not resistant to high temperatures, which easily causes the luminescent material to fail in a high-temperature environment. Therefore, the COE structure needs to be arranged in the process of the entire display panel before the luminescent material is prepared, and then transferred to the luminescent side of the display panel structure after preparation, which makes the process complicated. Alternatively, the COE structure can also be prepared separately and then transferred to the display panel structure, which adds a new process and increases the cost.

[0109] In the embodiment of the present application, since the color resist unit component pattern 20' is cured at 80°C to 90°C, the properties of the luminescent material can be maintained without affecting the sequence of the process steps for preparing the luminescent structure, and there is no need to transfer the COE structure as a whole, further reducing the preparation cost.

[0110] Among them, the display panel functional structure 30 can be set as a conventional structure of an organic light-emitting diode display panel (OLED) to realize different functions in the embodiment of the present application, including but not limited to an array substrate layer 40, a light-emitting structure layer, a packaging layer and a touch module 70.

[0111] See also Figure 7 In some optional embodiments, step S100 further includes:

[0112] Step S101, see Figure 8 , preparing a light-emitting layer 50 on one side of the array substrate layer 40, wherein the light-emitting layer 50 includes at least one light-emitting unit 51;

[0113] Wherein, step S200 also includes:

[0114] Step S201 : Printing and preparing a defined structure pattern 10 ′ on a side of the light emitting layer 50 away from the array substrate layer 40 by using electron beam direct writing technology.

[0115] In these optional embodiments, the method for preparing a display panel provided in the embodiments of the present application can directly integrate the preparation process of the COE structure into the preparation process of the display panel by arranging the preparation process of the COE structure after the preparation process of the light-emitting layer 50 without affecting the light-emitting material. While there is no need to transfer the COE structure again, the display panel including the COE structure can be directly formed in a complete and continuous process, further reducing costs.

[0116] See also Fig. 9 In some embodiments, step S100 further includes:

[0117] Step S102, see Fig.10 , preparing an encapsulation layer on the side of the light emitting layer 50 away from the array substrate layer 40;

[0118] Wherein, step S200 also includes:

[0119] Step S202, using electron beam direct writing technology to print and prepare a defined structure pattern 10' on a side of the encapsulation layer away from the light-emitting layer 50;

[0120] In these embodiments, the method for preparing a display panel provided in the embodiments of the present application arranges the preparation process of the COE structure after the encapsulation layer process, and directly prepares the COE module on the display panel after the encapsulation is completed, thereby reducing costs and reducing the impact on the internal structure of the display panel.

[0121] See also Fig.11 In some optional embodiments, step S102 further includes:

[0122] Step S1021, please refer to Fig.12 , preparing a first inorganic encapsulation layer 61;

[0123] Step S1022, please refer to Fig.13 , preparing an organic encapsulation layer 62;

[0124] Step S1023, please refer to Fig.14 , preparing a second inorganic encapsulation layer 63;

[0125] Wherein, step S200 also includes:

[0126] Step S203 , a defined structure pattern 10 ′ is prepared by printing on the side of the second inorganic encapsulation layer 63 away from the organic encapsulation layer 62 using electron beam direct writing technology.

[0127] In these optional embodiments, the method for preparing a display panel provided in the embodiments of the present application arranges the preparation process of the COE structure after the second packaging layer process, and directly prepares the COE module on the display panel after the packaging is completed, thereby reducing costs and further reducing the impact on the internal structure of the display panel.

[0128] The encapsulation layer of an existing OLED display panel generally includes a first encapsulation layer deposited on one side of the light-emitting structure layer using a chemical vapor deposition process (CVD), an organic encapsulation layer 62 is prepared on the first encapsulation layer using inkjet printing technology (IJP), and then a second encapsulation layer is deposited using a CVD process to form a complete encapsulation structure.

[0129] See also Fig.15 In some optional embodiments, step S100 further includes:

[0130] Step S103, see Fig.16 , preparing a touch module 70 on the side of the encapsulation layer away from the light-emitting layer 50;

[0131] Wherein, step S200 also includes:

[0132] Step S204 , using electron beam direct writing technology to print and prepare a defined structure pattern 10 ′ on the side of the touch module 70 away from the encapsulation layer.

[0133] In these optional embodiments, the method for preparing a display panel provided in the embodiments of the present application arranges the preparation process of the COE structure after the preparation process of the touch module 70, and then directly prepares the COE module on the functional module of the display panel after the preparation is completed. This reduces costs while further reducing the impact on the internal structure of the display panel.

[0134] In some embodiments, step S300 further includes:

[0135] The color resist unit component pattern 20' is prepared by printing using an electron beam direct writing technique, or by printing using an inkjet printing technique.

[0136] In these embodiments, the display panel manufacturing method provided in the embodiments of the present application can flexibly select printing technology to prepare the color resist unit component pattern 20 ′, and the process arrangement is more flexible, thereby improving the manufacturing efficiency and further reducing the cost.

[0137] The color resist unit component pattern 20 ′ can be prepared by printing with the electron beam direct writing technology, and can be prepared together with the defining structure pattern 10 ′ in the same process, thereby improving the preparation efficiency and further reducing the cost.

[0138] The color resist unit component pattern 20' is prepared by using the inkjet printing IJP technology. The material for preparing the color resist unit component pattern 20' can be configured into a solution, and then the volume of the ink droplets can be controlled at the precision of the picoliter level through a high-precision nozzle, and the solution is printed in the pre-selected filter opening pattern 11'. The filter opening pattern 11' not only plays a role of limiting, but also can accommodate the solution of the color resist unit component pattern 20' formed by the IJP technology, and accurately forms the color resist unit component pattern 20' with the same size as the filter opening. There is no need to prepare a color resist unit component pattern 20' with a size larger than the filter opening pattern 11', so that when there is an error in the covering position, the color resist unit component pattern 20' can completely cover the filter opening, while utilizing the existing structure and further reducing the cost.

[0139] See also Fig.17 In some embodiments, step S400 further includes:

[0140] Step S401, curing the boundary structure pattern 10' at 80°C to 90°C to obtain a boundary structure 10, wherein the boundary structure 10 includes at least one filter opening, or, see Fig.18 , before step S300, it also includes:

[0141] Step S401, curing the defining structure pattern 10' at 80°C to 90°C to obtain a defining structure 10, wherein the defining structure 10 includes at least one filter opening;

[0142] In these embodiments, the display panel preparation method provided in the embodiments of the present application can perform printing and curing and other process steps on the defining structure 10 and the color resist unit assembly 20 separately, or can print out the structural graphics first according to actual production needs, and then cure them together in the same process step. The process arrangement is flexible, further reducing costs.

[0143] In some optional embodiments, step S200 further includes:

[0144] The defined structure pattern 10' is prepared by printing with solute electron beam-excited reactive glue.

[0145] In these optional embodiments, the method for preparing the display panel provided in the embodiments of the present application does not need to add solvents and photoinitiators to the materials for preparing the defined structural pattern 10', does not need to remove the photoresist by exposure and development, and does not need to bake and cure to volatilize the solvent, thereby reducing the process steps and improving efficiency while further reducing costs.

[0146] In some optional embodiments, step S401 further includes:

[0147] The defining structure pattern 10 ′ is irradiated and cured by a low-energy electron beam to obtain a defining structure 10 .

[0148] In these optional embodiments, the method for preparing the display panel provided in the embodiments of the present application uses low-energy electron beam irradiation to solidify the defined structural pattern 10', and no high-temperature baking curing step is required. Curing can be achieved at only 80°C to 90°C, thereby achieving flexible arrangement of the process and improving preparation efficiency.

[0149] In some optional embodiments, step S300 further includes:

[0150] The color resist unit component pattern 20' is prepared by printing with solute electron beam excitation reaction glue.

[0151] In these optional embodiments, the method for preparing the display panel provided in the embodiments of the present application does not need to add solvents and photoinitiators to the materials for preparing the color resist unit component pattern 20', does not need to remove the photoresist by exposure and development, and does not need to bake and cure to volatilize the solvent, thereby reducing the process steps and improving efficiency while further reducing costs.

[0152] In some optional embodiments, step S400 further includes:

[0153] The color resist unit component pattern 20 ′ is irradiated and cured by a low energy electron beam to obtain a color resist unit component 20 .

[0154] In these optional embodiments, the method for preparing a display panel provided in the embodiments of the present application uses low-energy electron beam irradiation to cure the color resist unit component pattern 20', and no high-temperature baking curing step is required. Curing can be achieved at only 80°C to 90°C, thereby achieving flexible arrangement of the process and improving preparation efficiency.

[0155] See also Fig.19 In some embodiments, after step S400, the following steps are further included:

[0156] Step S500, see Fig. 20 , printing and preparing the covering layer pattern 80'.

[0157] In these embodiments, the method for manufacturing a display panel provided in the embodiments of the present application further protects the defining structure 10 and the color resist unit assembly 20 by providing a covering layer 80 .

[0158] See also Fig.21 In some optional embodiments, step S400 further includes:

[0159] Step S402, curing the cover layer pattern 80' at 80°C to 90°C to obtain a cover layer 80, the cover layer 80 covers at least a portion of the color resist unit assembly 20, or, refer to Fig. 22 , after step S400, further comprising:

[0160] Step S500, printing and preparing a covering layer pattern 80';

[0161] Step S402 , curing the covering layer pattern 80 ′ at 80° C. to 90° C. to obtain a covering layer 80 , wherein the covering layer 80 covers at least a portion of the color resist unit assembly 20 .

[0162] In these embodiments, the display panel preparation method provided in the embodiments of the present application can perform process steps such as printing and curing of the covering layer 80 separately, or can first print the covering layer pattern 80' according to actual production needs, and then cure it together with the curing color resist unit component pattern 20' in the same process step. The process arrangement is flexible and the cost is further reduced.

[0163] In some optional embodiments, step S500 further includes:

[0164] The cover layer pattern 80' is prepared by printing using an electron beam direct writing technique, or by printing using an inkjet printing technique.

[0165] In these optional embodiments, the method for preparing the display panel provided in the embodiment of the present application can flexibly select printing technology to prepare the cover layer pattern 80', and the process arrangement is more flexible, which improves the preparation efficiency and further reduces the cost.

[0166] In some optional embodiments, step S500 further includes:

[0167] The cover layer pattern 80' is prepared by printing with solute electron beam-excited reactive glue.

[0168] In these optional embodiments, the method for preparing the display panel provided in the embodiments of the present application does not need to add solvents and photoinitiators to the materials for preparing the covering layer pattern 80', does not need to remove the photoresist by exposure and development, and does not need to bake and cure to volatilize the solvent, thereby reducing the process steps and improving efficiency while further reducing costs.

[0169] In some optional embodiments, step S402 further includes:

[0170] The cover layer pattern 80 ′ is irradiated and cured by a low energy electron beam to obtain a cover layer 80 .

[0171] In these optional embodiments, the method for preparing the display panel provided in the embodiments of the present application uses low-energy electron beam irradiation to cure the covering layer pattern 80', and no high-temperature baking curing step is required. Curing can be achieved at only 80°C to 90°C, thereby achieving flexible arrangement of the process and improving preparation efficiency.

[0172] In the second aspect, the embodiment of the present application further provides a display panel, which is prepared by the method for preparing the display panel of the above embodiment. Since the display panel provided by the embodiment of the present application is prepared by the method for preparing the display panel of the above embodiment, the display panel provided by the embodiment of the second aspect of the present application has the beneficial effects of the method for preparing the display panel of the embodiment of the first aspect, which will not be described in detail here.

[0173] Third, see Fig.23 and Fig.24 The embodiment of the present application further provides another display panel 100 , including an array substrate layer 40 , a light emitting layer 50 , an encapsulation layer and a light improving structure 90 .

[0174] See also Fig.23 and Fig.24 , the light emitting layer 50 is disposed on one side of the array substrate, and the light emitting layer 50 includes at least one light emitting unit 51;

[0175] The encapsulation layer is arranged on a side of the light emitting layer 50 away from the array substrate;

[0176] The light improving structure 90 includes a photoresist layer 91, which is arranged on the side of the encapsulation layer away from the light emitting layer 50. The photoresist layer 91 includes a defining structure 10 and a color resist unit assembly 20. The defining structure 10 includes at least one filter opening. The color resist unit assembly 20 includes at least one color resist unit 21. The color resist unit assembly 20 is exposed by the filter opening. The light emitting unit 51 and the color resist unit 21 are arranged correspondingly and have the same size.

[0177] The display panel 100 provided in the embodiment of the present application adopts printing to prepare the color resist unit component pattern 20', so the precision is higher. There is no need to set the size of the color resist unit 21 slightly larger to ensure that it covers the light-emitting unit 51 due to positioning errors in the yellow light process. The light-emitting unit 51 can be set to the same size as the color resist unit 21, which has a better shading effect.

[0178] In some embodiments, the size of the color-resist unit 21 is the same as the aperture size of the filter opening 11 .

[0179] In these embodiments, the defining structure 10 not only limits the color resist unit 21, but also has higher printing and preparation accuracy. It is not necessary to set the size of the color resist unit 21 slightly larger to ensure that it covers the filter opening 11 due to positioning errors in the yellow light process. The color resist unit 21 can be set to the same size as the filter opening 11, and the photoresist layer 91 has higher flatness.

[0180] In some embodiments, the light-improving structure 90 further includes a covering layer 80 . The covering layer 80 is disposed on a side of the photoresist layer 91 away from the encapsulation layer 60 . The covering layer 80 covers at least a portion of the photoresist layer 91 .

[0181] In these embodiments, the cover layer 80 is provided to achieve a further protection effect on the light blocking layer 91 in the light improving structure 90 .

[0182] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for preparing a display panel, characterized in that: include: The defined structure pattern is prepared by printing using electron beam direct writing technology, wherein the defined structure pattern includes at least one filter opening pattern; Printing and preparing a color resist unit component pattern in the filter opening pattern; The color resist unit component pattern is cured at 80° C. to 90° C. to obtain a color resist unit component.

2. The method for preparing a display panel according to claim 1, characterized in that: Before the step of printing and preparing the defined structure pattern by electron beam direct writing technology, the method further comprises: preparing a display panel functional structure; Preferably, the step of preparing the display panel functional structure further includes: Prepare a light-emitting layer on one side of the array substrate layer, wherein the light-emitting layer includes at least one light-emitting unit; The step of printing and preparing the defined structure pattern by electron beam direct writing technology also includes: The delimiting structure pattern is prepared by printing on a side of the light emitting layer away from the array substrate layer using electron beam direct writing technology.

3. The method for preparing a display panel according to claim 2, characterized in that: The step of preparing the display panel functional structure also includes: Preparing a packaging layer on a side of the light-emitting layer away from the array substrate layer; The step of printing and preparing the defined structure pattern by electron beam direct writing technology also includes: The defined structure pattern is prepared by printing on the side of the encapsulation layer away from the light-emitting layer using electron beam direct writing technology; Preferably, the step of preparing the encapsulation layer further comprises: preparing a first inorganic encapsulation layer; preparing an organic encapsulation layer; preparing a second inorganic encapsulation layer; Wherein, the step of using electron beam direct writing technology to print and prepare the defined structure pattern also includes: using electron beam direct writing technology to print and prepare the defined structure pattern on the side of the second inorganic encapsulation layer away from the organic encapsulation layer; Preferably, the step of preparing the display panel functional structure further includes: Preparing a touch module on a side of the encapsulation layer away from the light-emitting layer; The step of using electron beam direct writing technology to print and prepare the defined structure pattern also includes: using electron beam direct writing technology to print and prepare the defined structure pattern on a side of the touch module away from the encapsulation layer.

4. The method for preparing a display panel according to claim 1, characterized in that: The step of printing and preparing the color resist unit component pattern also includes: The color resist unit component pattern is prepared by printing using electron beam direct writing technology, or, The color resist unit component pattern is prepared by printing using inkjet printing technology.

5. The method for preparing a display panel according to claim 1, characterized in that: The step of curing the color resist unit component pattern at 80° C. to 90° C. also includes: The defining structure pattern is cured at 80° C. to 90° C. to obtain a defining structure, wherein the defining structure includes at least one filter opening, or Before the step of printing and preparing the color resist unit component pattern, the step further includes: Curing the defined structure pattern at 80° C. to 90° C. to obtain a defined structure, wherein the defined structure includes at least one filter opening; Preferably, the step of printing and preparing the defined structure pattern also includes: The defined structure pattern is prepared by printing with solute electron beam excited reaction glue; Preferably, the step of curing the defined structural pattern at 80° C. to 90° C. further comprises: Using a low-energy electron beam to irradiate and solidify the defined structure pattern to obtain the defined structure; Preferably, the step of printing and preparing the color resist unit component pattern further includes: The color resist unit component pattern is prepared by printing with solute electron beam excitation reaction glue; Preferably, the step of curing the color resist unit component pattern at 80° C. to 90° C. further includes: The color resist unit component pattern is irradiated and cured by a low-energy electron beam to obtain the color resist unit component.

6. The method for preparing a display panel according to claim 1, characterized in that: After the step of printing and preparing the color resist unit component pattern, the following steps are further included: Printing and preparing covering layer graphics; Preferably, the step of curing the color resist unit component pattern at 80° C. to 90° C. further includes: The covering layer pattern is cured at 80° C. to 90° C. to obtain a covering layer, wherein the covering layer covers at least a portion of the color resist unit component, or, After the step of curing the color resist unit component pattern at 80° C. to 90° C., the following step is further included: Printing and preparing covering layer graphics; Curing the covering layer pattern at 80° C. to 90° C. to obtain a covering layer, wherein the covering layer covers at least a portion of the color resist unit component; Preferably, the step of printing and preparing the covering layer pattern further comprises: The cover layer pattern is prepared by printing using electron beam direct writing technology, or, The covering layer pattern is prepared by printing using inkjet printing technology; Preferably, the step of printing and preparing the defined structure pattern also includes: The covering layer pattern is prepared by printing with solute electron beam excited reaction glue; Preferably, the step of curing the defined structural pattern at 80° C. to 90° C. further comprises: The covering layer pattern is irradiated and cured by low-energy electron beam to obtain the covering layer.

7. A display panel, characterized in that: The display panel is prepared by the method for preparing the display panel according to claim 1 to claim 6.

8. A display panel, characterized in that: include: An array substrate layer; A light-emitting layer, disposed on one side of the array substrate, the light-emitting layer comprising at least one light-emitting unit; An encapsulation layer, disposed on a side of the light-emitting layer away from the array substrate; The light-improving structure comprises a photoresist layer, wherein the photoresist layer is arranged on the side of the encapsulation layer away from the light-emitting layer, the photoresist layer comprises a defining structure and a color-resist unit component, the defining structure comprises at least one light-filtering opening, the color-resist unit component comprises at least one color-resist unit, the color-resist unit component is exposed and arranged by the light-filtering opening, the light-emitting unit is arranged corresponding to the color-resist unit, and the light-emitting unit and the color-resist unit have the same size.

9. The display panel according to claim 8, characterized in that: The size of the color resistance unit is the same as the aperture size of the filter opening.

10. The display panel according to claim 8, characterized in that: The light-improving structure further includes a covering layer, which is disposed on a side of the photoresist layer away from the encapsulation layer, and covers at least a portion of the photoresist layer.

Images