Ultrasonic host of ultrasonic equipment and ultrasonic equipment

Abstract

The invention discloses an ultrasonic host of ultrasonic equipment and the ultrasonic equipment. The ultrasonic equipment comprises the ultrasonic host, a display device and an operation device. The ultrasonic host comprises a transmitting assembly, a receiving assembly, a probe plate assembly and a processing assembly, and at least one of the transmitting assembly, the receiving assembly, the probe plate assembly and the processing assembly comprises a mainboard assembly and a water cooling assembly; the water cooling assembly comprises a water cooling row, a plurality of water cooling heads, a pipeline assembly and a water pump which is independently arranged outside the water cooling row and the water cooling heads and connected with the pipeline assembly. The water-cooling head is used for being in contact with a heat source on the mainboard assembly, and the water-cooling row is used for dissipating heat of cooling liquid flowing through the water-cooling row. And the pipeline assembly communicates the water-cooling row, the multiple water-cooling heads and the water pump, so that the water pump can drive the cooling liquid to circularly flow between the water-cooling row and the multiple water-cooling heads. According to the heat dissipation mode of the water cooling assembly, the heat dissipation efficiency is improved, noise during heat dissipation is reduced, and therefore the problems that an existing ultrasonic device is large in noise and high in chip temperature are solved.

Description

Technical Field

[0001] The present application relates to the technical field of ultrasonic equipment, and in particular to an ultrasonic host and an ultrasonic equipment. Background Art

[0002] In order to meet the growing demand for ultrasonic equipment, the power consumption of the chip in the ultrasonic equipment has gradually increased, which has made the pain points of ultrasonic equipment in terms of heat dissipation and noise gradually obvious. Existing ultrasonic equipment usually uses air cooling as the main heat dissipation method, but this type of ultrasonic equipment has high noise in actual application scenarios and high chip temperature, resulting in system instability and poor customer experience, so it needs to be improved. Summary of the invention

[0003] The main technical problem solved by the present invention is that the existing ultrasonic equipment has relatively large noise and high chip temperature, which causes system instability.

[0004] In a first aspect, an embodiment provides an ultrasound device, comprising:

[0005] Ultrasound host;

[0006] A display device, connected to the ultrasound host signal, for displaying ultrasound images;

[0007] and an operating device, connected to the ultrasound host signal and used for inputting operating instructions;

[0008] Among them, the ultrasonic host includes a transmitting component, a receiving component, a probe board component and a processing component, the transmitting component and the receiving component are signal-connected to the probe board component, and the probe board component is used to be signal-connected to the ultrasonic probe that transmits ultrasonic signals and collects echo signals; at least one of the transmitting component, the receiving component, the probe board component and the processing component includes a mainboard component and a water-cooling component, the water-cooling component includes a water-cooling row, multiple water-cooling heads, a pipeline component and a water pump independently arranged outside the water-cooling row and the multiple water-cooling heads and connected to the pipeline component; the water-cooling head is used to contact the heat source on the mainboard component, and the water-cooling row is used to dissipate heat for the coolant flowing through the water-cooling row; the pipeline component connects the water-cooling row, the multiple water-cooling heads and the water pump, so that the water pump can drive the coolant to circulate between the water-cooling row and the multiple water-cooling heads.

[0009] In one embodiment, multiple water-cooling heads are connected in series through the pipe assembly; the water-cooling head has a head end and a tail end, the head end of the water-cooling head is the position where the coolant enters the water-cooling head, and the tail end of the water-cooling head is the position where the coolant discharges the water-cooling head; when multiple water-cooling heads are connected in series through the pipe assembly, the multiple water-cooling heads are connected end to end in sequence along the flow path of the coolant.

[0010] In one embodiment, the water-cooling radiator has a water outlet end and a water return end, the first end of the pipe assembly is connected to the water outlet end of the water-cooling radiator, and the second end of the pipe assembly is connected to the water return end of the water-cooling radiator; the water pump and the multiple water-cooling heads are connected in series to the pipe assembly, so that the water pump can drive the coolant to pass through the water pump and the multiple water-cooling heads in sequence from the water outlet end to the water return end.

[0011] In one embodiment, multiple water-cooling heads are connected in parallel through a pipe assembly; the water-cooling head has a head end and a tail end, the head end of the water-cooling head is the position where the coolant enters the water-cooling head, and the tail end of the water-cooling head is the position where the coolant discharges the water-cooling head; when multiple water-cooling heads are connected in parallel through the pipe assembly, the multiple water-cooling heads are connected head to head and tail to tail.

[0012] In one embodiment, the water-cooling radiator has a water outlet end and a water return end, and the pipeline assembly includes at least two parallel pipelines, the first ends of at least two of the parallel pipelines are connected to the water outlet end of the water-cooling radiator, and the second ends of at least two of the parallel pipelines are connected to the water return end of the water-cooling radiator; the water pump is connected between the water outlet end of the water-cooling radiator and the first ends of at least two of the parallel pipelines, or the water pump is connected between the second ends of at least two of the parallel pipelines and the water return end. In one embodiment, at least two of the multiple water-cooling heads are connected in series through a pipe assembly, and at least two of the multiple water-cooling heads are connected in parallel through the pipe assembly; the water-cooling head has a head end and a tail end, the head end of the water-cooling head is the position where the coolant enters the water-cooling head, and the tail end of the water-cooling head is the position where the coolant discharges the water-cooling head; when the multiple water-cooling heads are connected in series through the pipe assembly, the multiple water-cooling heads are connected end to end in sequence along the flow path of the coolant; when the multiple water-cooling heads are connected in parallel through the pipe assembly, the multiple water-cooling heads are connected head to head and tail to tail.

[0013] In one embodiment, the water-cooling radiator has a water outlet and a water return end, and the pipeline assembly includes a series pipeline and a parallel pipeline; the first end of the series pipeline is connected to the water outlet of the water-cooling radiator, and the parallel pipeline is configured as at least two, the second end of the series pipeline is branched to the first ends of at least two parallel pipelines, and the second ends of at least two parallel pipelines converge to the return end of the water-cooling radiator; the water pump is connected between the water outlet of the water-cooling radiator and the first end of the series pipeline.

[0014] In one embodiment, the water pump includes a pump body, a driving mechanism and an impeller, the pump body has a pump chamber, the pump chamber has an inlet and an outlet; the impeller is arranged in the pump chamber, and the driving mechanism is used to drive the impeller to rotate to provide power for the movement of coolant flowing into and / or out of the pump chamber; the water pump also includes a cover plate assembly, which is enclosed with the pump body to close the driving mechanism.

[0015] In one embodiment, the water cooling radiator includes a heat dissipation part and a water collecting part, the heat dissipation part has a plurality of heat dissipation flat tubes for increasing the heat dissipation area of ​​the coolant in the heat dissipation flat tubes; the water collecting part is connected to the heat dissipation flat tubes for collecting the coolant flowing into or out of the heat dissipation flat tubes, and the pipeline assembly is connected to the water collecting part.

[0016] In one embodiment, at least one of the transmitting component, receiving component, probe board component and processing component also includes a chassis, and the mainboard component and the water cooling component are arranged in the chassis; the ultrasound equipment also includes a body, the body has a accommodating cavity, and the chassis is detachably arranged in the accommodating cavity.

[0017] In one embodiment, the water cooling assembly further includes a water tank, which is used to store coolant; the water tank is connected to the water cooling row, water cooling head, water pump or pipeline assembly to replenish the coolant.

[0018] In one embodiment, the water-cooling radiator, the water-cooling head and the water pump all include a quick-release structure, and the pipe assembly is detachably connected to the quick-release structure so that the coolant can circulate between the water-cooling head and the water-cooling radiator.

[0019] In one embodiment, the ultrasonic host further includes a heat dissipation device, which is disposed on at least one of the water-cooling head, the water-cooling radiator, the water pump, the pipeline assembly and the mainboard assembly for air-cooling.

[0020] In a second aspect, an embodiment provides an ultrasound host of an ultrasound device, comprising:

[0021] Launch assembly;

[0022] receiving component;

[0023] A probe plate assembly, the transmitting assembly and the receiving assembly are connected to the probe plate assembly by signal, and the probe plate assembly is used to be connected to the ultrasonic probe signal for transmitting ultrasonic signals and collecting echo signals;

[0024] and a processing component, at least one of the transmitting component, the receiving component, the probe board component and the processing component includes a mainboard component and a water-cooling component, the water-cooling component includes a water-cooling radiator, a plurality of water-cooling heads, a pipeline component and a water pump independently arranged outside the water-cooling radiator and the plurality of water-cooling heads and connected to the pipeline component; the water-cooling head is used to contact the heat source on the mainboard component, and the water-cooling radiator is used to dissipate heat for the coolant flowing through the water-cooling radiator; the pipeline component connects the water-cooling radiator, the plurality of water-cooling heads and the water pump, so that the water pump can drive the coolant to circulate between the water-cooling radiator and the plurality of water-cooling heads.

[0025] In one embodiment, multiple water-cooling heads are connected in series through the pipe assembly; the water-cooling head has a head end and a tail end, the head end of the water-cooling head is the position where the coolant enters the water-cooling head, and the tail end of the water-cooling head is the position where the coolant discharges the water-cooling head; when multiple water-cooling heads are connected in series through the pipe assembly, the multiple water-cooling heads are connected end to end in sequence along the flow path of the coolant.

[0026] In one embodiment, the water-cooling radiator has a water outlet end and a water return end, the first end of the pipe assembly is connected to the water outlet end of the water-cooling radiator, and the second end of the pipe assembly is connected to the water return end of the water-cooling radiator; the water pump and the multiple water-cooling heads are connected in series to the pipe assembly, so that the water pump can drive the coolant to pass through the water pump and the multiple water-cooling heads in sequence from the water outlet end to the water return end.

[0027] In one embodiment, multiple water-cooling heads are connected in parallel through a pipe assembly; the water-cooling head has a head end and a tail end, the head end of the water-cooling head is the position where the coolant enters the water-cooling head, and the tail end of the water-cooling head is the position where the coolant discharges the water-cooling head; when multiple water-cooling heads are connected in parallel through the pipe assembly, the multiple water-cooling heads are connected head to head and tail to tail.

[0028] In one embodiment, the water-cooling radiator has a water outlet end and a water return end, and the pipeline assembly includes at least two parallel pipelines, the first ends of at least two of the parallel pipelines are connected to the water outlet end of the water-cooling radiator, and the second ends of at least two of the parallel pipelines are connected to the water return end of the water-cooling radiator; the water pump is connected between the water outlet end of the water-cooling radiator and the first ends of at least two of the parallel pipelines, or the water pump is connected between the second ends of at least two of the parallel pipelines and the water return end.

[0029] In one embodiment, at least two of the multiple water-cooling heads are connected in series through a pipe assembly, and at least two of the multiple water-cooling heads are connected in parallel through the pipe assembly; the water-cooling head has a head end and a tail end, the head end of the water-cooling head is the position where the coolant enters the water-cooling head, and the tail end of the water-cooling head is the position where the coolant discharges the water-cooling head; when the multiple water-cooling heads are connected in series through the pipe assembly, the multiple water-cooling heads are connected end to end in sequence along the flow path of the coolant; when the multiple water-cooling heads are connected in parallel through the pipe assembly, the multiple water-cooling heads are connected head to head and tail to tail.

[0030] In one embodiment, the water-cooling radiator has a water outlet and a water return end, and the pipeline assembly includes a series pipeline and a parallel pipeline; the first end of the series pipeline is connected to the water outlet of the water-cooling radiator, and the parallel pipeline is configured as at least two, the second end of the series pipeline is branched to the first ends of at least two parallel pipelines, and the second ends of at least two parallel pipelines converge to the return end of the water-cooling radiator; the water pump is connected between the water outlet of the water-cooling radiator and the first end of the series pipeline.

[0031] In one embodiment, the water pump includes a pump body, a driving mechanism and an impeller, the pump body has a pump chamber, the pump chamber has an inlet and an outlet; the impeller is arranged in the pump chamber, and the driving mechanism is used to drive the impeller to rotate, so as to provide power for the movement of coolant flowing into and out of the pump chamber.

[0032] According to the ultrasonic host and ultrasonic device of the ultrasonic device of the above embodiment, the ultrasonic device includes an ultrasonic host, a display device and an operating device. The display device is connected to the ultrasonic host signal for displaying an ultrasonic image. The operating device is connected to the ultrasonic host signal for inputting an operating instruction. The ultrasonic host includes a transmitting component, a receiving component, a probe plate component and a processing component. The transmitting component and the receiving component are connected to the probe plate component signal. The probe plate component is used to be connected to the ultrasonic probe signal for transmitting ultrasonic signals and collecting echo signals. At least one of the transmitting component, the receiving component, the probe plate component and the processing component includes a mainboard component and a water cooling component. The water cooling component includes a water cooling row, a plurality of water cooling heads, a pipeline component and a water pump independently arranged outside the water cooling row and the plurality of water cooling heads and connected to the pipeline component. The water cooling head is used to contact the heat source on the mainboard component, and the water cooling row is used to dissipate the heat of the coolant flowing through the water cooling row. The pipeline component connects the water cooling row, the plurality of water cooling heads and the water pump so that the water pump can drive the coolant to circulate between the water cooling row and the plurality of water cooling heads. Due to the addition of a water cooling component, the heat generated by the mainboard component during operation is transferred to the water cooling head, and then the water pump drives the coolant to flow in and out of the water cooling head. The coolant flowing through the water cooling head takes away the heat transferred to the main body, thereby achieving heat dissipation of the mainboard component. On the one hand, the heat dissipation method of the water cooling component improves the heat dissipation efficiency and reduces the noise during heat dissipation, which is conducive to solving the problem of high noise and high chip temperature of existing ultrasonic equipment. On the other hand, since the water pump is independently set, when the water pump fails, it is convenient for the staff to directly repair the water pump without having to remove the water pump from the integrated mechanism first, which is conducive to improving the maintenance efficiency of the water pump. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic diagram of the structure of an ultrasonic device in one embodiment of the present application;

[0034] Figure 2 This is a schematic diagram of the structure of a processing component in an embodiment of the present application;

[0035] Figure 3 An exploded diagram of a processing component in one embodiment of the present application;

[0036] Figure 4 This is a schematic block diagram of a water cooling assembly when all water cooling heads are connected in series in one embodiment of the present application;

[0037] Figure 5 This is a schematic block diagram of a water cooling assembly when all water cooling heads are connected in parallel in one embodiment of the present application;

[0038] Figure 6 This is a schematic block diagram of a water cooling assembly when water cooling heads are mixed in series and parallel in one embodiment of the present application;

[0039] Figure 7This is a schematic diagram of the structure of a water cooling assembly when all water cooling heads are connected in series in one embodiment of the present application;

[0040] Figure 8 This is a schematic diagram of the structure of a water cooling assembly when all water cooling heads are connected in parallel in one embodiment of the present application;

[0041] Fig. 9 This is a schematic diagram of the structure of a water cooling assembly when water cooling heads are mixed in series and parallel in one embodiment of the present application;

[0042] Fig.10 This is an exploded view of a water pump in one embodiment of the present application;

[0043] Reference numerals: 100, ultrasonic host; 110, processing component; 111, mainboard component; 1111, control mainboard; 1112, graphics card; 1113, central processing unit; 112, water cooling component; 1121, water cooling radiator; 11211, water outlet; 11212, water return; 11213, heat dissipation; 11214, water collection; 112141, first water collection; 112142, second water collection; 11215, partition structure; 1122, water cooling head; 11221, head end; 11222, tail end; 11223, graphics card water cooling head; 11224, processor water cooling head; 1123, pipeline assembly; 11231, parallel pipeline; 11232, series pipeline; 1124, water pump; 11241, pump body; 11242, driving mechanism; 11243, impeller; 11244, cover plate assembly; 112441, first side cover plate; 112442, second side cover plate; 112443, bottom cover plate; 1125, water tank; 113, chassis; 200, display device; 300, operating device; 400, fuselage. DETAILED DESCRIPTION

[0044] The present invention is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are for making the present application better understood. However, those skilled in the art can easily recognize that some features can be omitted in different situations, or can be replaced by other elements, materials, methods. In some cases, some operations related to the present application are not shown or described in the specification, this is to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations according to the description in the specification and the general technical knowledge in the art.

[0045] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations. At the same time, the steps or actions in the method description can also be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for the purpose of clearly describing a certain embodiment and are not meant to be a required sequence, unless otherwise specified that a certain sequence must be followed.

[0046] The serial numbers of the components in this document, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).

[0047] The present invention provides an ultrasound host 100 of an ultrasound device and an ultrasound device, which can be applied to the medical industry and help doctors diagnose and treat by imaging the target area of ​​the examiner. The ultrasound device and the ultrasound host 100 use a water cooling component 112 for heat dissipation, which improves the heat dissipation efficiency and reduces the noise during heat dissipation.

[0048] This embodiment provides an ultrasonic device.

[0049] Please refer to Figure 1-10 , the ultrasonic device includes an ultrasonic host 100, a display device 200 and an operating device 300. The display device 200 is connected to the ultrasonic host 100 by signal, and is used to display an ultrasonic image. The operating device 300 is connected to the ultrasonic host 100 by signal, and is used to input an operation instruction. The ultrasonic host 100 includes a transmitting component (not shown), a receiving component (not shown), a probe plate component (not shown) and a processing component 110, and the transmitting component and the receiving component are connected to the probe plate component by signal, and the probe plate component is used to connect to the ultrasonic probe signal for transmitting ultrasonic signals and collecting echo signals. At least one of the transmitting component, the receiving component, the probe plate component and the processing component 110 includes a main board component 111 and a water cooling component 112, and the water cooling component 112 includes a water cooling row 1121, a plurality of water cooling heads 1122, a pipeline component 1123 and a water pump 1124 independently arranged outside the water cooling row 1121 and the plurality of water cooling heads 1122 and connected to the pipeline component 1123. The water cooling head 1122 is used to contact the heat source on the mainboard assembly 111, and the water cooling radiator 1121 is used to dissipate heat from the coolant flowing through the water cooling radiator 1121. The pipe assembly 1123 connects the water cooling radiator 1121, the multiple water cooling heads 1122 and the water pump 1124, so that the water pump 1124 can drive the coolant to circulate between the water cooling radiator 1121 and the multiple water cooling heads 1122.

[0050] It should be noted that the above-mentioned components included in the ultrasound host 100 can be a split layout. For example, the split layout can consider setting the transmitting component, receiving component, probe plate component and processing component 110 at different positions of the ultrasound device body. For example, the processing component 110 is set at the bottom of the ultrasound device body for heat dissipation, and the probe plate component is set at the upper end of the ultrasound device body for hanging the ultrasound probe. The above-mentioned components included in the ultrasound host 100 can also be integrated into the same position area layout, for example, all are set at the bottom of the ultrasound device body, and are contained in a compact large cavity. The large cavity can also be separated into multiple chambers to accommodate different components. The components are compactly arranged, which can achieve miniaturization of the layout and save the connection consumables between the components. The present application does not limit the position layout of the components of the ultrasound host 100. The above-mentioned transmitting component, receiving component, probe plate component and processing component 110 can all be independent board modules, or two or more of them can be integrated into the same board module. The present application does not limit the integration form of the components of the ultrasound host 100.

[0051] Due to the addition of the water cooling assembly 112, the heat generated by the mainboard assembly 111 during operation is transferred to the water cooling head 1122, and then the water pump 1124 drives the coolant to flow into and out of the water cooling head 1122, and the coolant flowing through the water cooling head 1122 takes away the heat transferred to the main body, thereby achieving heat dissipation of the mainboard assembly 111. On the one hand, the heat dissipation method of the water cooling assembly 112 improves the heat dissipation efficiency and reduces the noise during heat dissipation, which is conducive to solving the problem of high noise and high chip temperature of the existing ultrasonic equipment. On the other hand, since the water pump 1124 is independently arranged, when the water pump 1124 fails, it is convenient for the staff to directly repair the water pump 1124 without first removing the water pump 1124 from the integrated mechanism, which is conducive to improving the maintenance efficiency of the water pump 1124.

[0052] On the other hand, this embodiment also provides an ultrasound host 100 of an ultrasound device.

[0053] Please refer to Figure 1-6 The ultrasound host 100 includes a transmitting component, a receiving component, a probe board component and a processing component 110.

[0054] The transmitting component and the receiving component are connected to the probe board component signal, and the probe board component is used to be connected to the ultrasonic probe signal for transmitting ultrasonic signals and collecting echo signals. At least one of the transmitting component, the receiving component, the probe board component and the processing component 110 includes a mainboard component 111 and a water cooling component 112, and the water cooling component 112 includes a water cooling row 1121, a plurality of water cooling heads 1122, a pipeline component 1123 and an independently arranged water pump 1124. The water cooling head 1122 is used to contact the heat source on the mainboard component 111, and the water cooling row 1121 is used to dissipate heat for the coolant flowing through the water cooling row 1121. The pipeline component 1123 connects the water cooling row 1121, the plurality of water cooling heads 1122 and the water pump 1124, so that the water pump 1124 can drive the coolant to circulate between the water cooling row 1121 and the plurality of water cooling heads 1122.

[0055] Please refer to Figure 1-4 In one embodiment, multiple water cooling heads 1122 are connected in series through a pipe assembly 1123. The water cooling head 1122 has a head end 11221 and a tail end 11222. The head end 11221 of the water cooling head 1122 is where the coolant enters the water cooling head 1122, and the tail end 11222 of the water cooling head 1122 is where the coolant exits the water cooling head 1122. When multiple water cooling heads 1122 are connected in series through the pipe assembly 1123, the multiple water cooling heads 1122 are connected head to tail in sequence along the flow path of the coolant.

[0056] The meaning of "series" is explained by the connection method of the water-cooling head 1122 in the pipe assembly 1123. For example, when the head ends 11221 and the tail ends 11222 of the two water-cooling heads 1122 are connected end to end in sequence along the flow path of the coolant, the two water-cooling heads 1122 are connected in series.

[0057] Please refer to Figure 1-3 , 5 and 8, in one embodiment, multiple water cooling heads 1122 are connected in parallel through the pipe assembly 1123. The water cooling head 1122 has a head end 11221 and a tail end 11222. The head end 11221 of the water cooling head 1122 is the position where the coolant enters the water cooling head 1122, and the tail end 11222 of the water cooling head 1122 is the position where the coolant exits the water cooling head 1122. When multiple water cooling heads 1122 are connected in parallel through the pipe assembly 1123, the multiple water cooling heads 1122 are connected head to head and tail to tail.

[0058] The meaning of “parallel” is explained by the connection method of the water cooling heads 1122 in the pipe assembly 1123. For example, when the head ends 11221 and the tail ends 11222 of the two water cooling heads 1122 are connected head to head and tail to tail, the two water cooling heads 1122 are in parallel.

[0059] Please refer to Figure 1-3, 6 and 9, in one embodiment, at least two of the multiple water cooling heads 1122 are connected in series through the pipe assembly 1123, and at least two of the multiple water cooling heads 1122 are connected in parallel through the pipe assembly 1123. The water cooling head 1122 has a head end 11221 and a tail end 11222, the head end 11221 of the water cooling head 1122 is the position where the coolant enters the water cooling head 1122, and the tail end 11222 of the water cooling head 1122 is the position where the coolant exits the water cooling head 1122. When the multiple water cooling heads 1122 are connected in series through the pipe assembly 1123, the multiple water cooling heads 1122 are connected end to end in sequence along the flow path of the coolant. When the multiple water cooling heads 1122 are connected in parallel through the pipe assembly 1123, the multiple water cooling heads 1122 are connected head to head and tail to tail.

[0060] The meanings of "series" and "parallel" are explained through the connection method of the water-cooling heads 1122 in the pipe assembly 1123. For example, when the head ends 11221 and the tail ends 11222 of the two water-cooling heads 1122 are connected end to end along the flow path of the coolant, the two water-cooling heads 1122 are connected in series. When the head ends 11221 and the tail ends 11222 of the two water-cooling heads 1122 are connected end to end and end to end, the two water-cooling heads 1122 are connected in parallel.

[0061] It should be noted that there are various combinations of multiple water cooling heads 1122 connected in series and in parallel. For example, two water cooling heads 1122 may be connected in parallel first, and then the two water cooling heads 1122 connected in parallel are connected in series with a third water cooling head 1122. It is also possible to connect two water cooling heads 1122 in series first, and then the two water cooling heads 1122 connected in series are connected in parallel with a third water cooling head 1122. The "head end 11221" and "tail end 11222" of the water cooling head 1122 may not be regarded as limiting the positional relationship between the two, but only indicating that the two are used for the coolant to flow into and out of the water cooling head 1122, respectively. For example, please refer to Figure 7-9 The “front end 11221 ” and the “rear end 11222 ” may be located on the same side of the water cooling head 1122 .

[0062] Please refer to Figure 1-3 In one embodiment, the water pump 1124 includes a pump body 11241, a driving mechanism 11242 and an impeller 11243. The pump body 11241 has a pump cavity, and the pump cavity has an inlet and an outlet. The impeller 11243 is disposed in the pump cavity, and the driving mechanism 11242 is used to drive the impeller 11243 to rotate, so as to provide power for the movement of the coolant flowing into and / or out of the pump cavity.

[0063] When the water cooling assembly 112 is working, the impeller 11243 is driven to rotate by the driving mechanism 11242, thereby providing power for the flow of the coolant. It should be noted that the meaning of the impeller 11243 driving the coolant to flow into and / or out of the pump chamber is that the impeller 11243 can only drive the coolant to flow into the pump chamber, or only drive the coolant to flow out of the pump chamber. It can also drive the coolant to flow into the pump chamber and drive the coolant to flow out of the pump chamber. For example, when the impeller 11243 is configured to only drive the coolant to flow into the pump chamber, the coolant in the pump chamber can flow out of the pump chamber under the action of gravity or the inertia force of the coolant. For another example, when the impeller 11243 is configured to only drive the coolant to flow out of the pump chamber, the coolant can be driven to flow into the pump chamber through other special modules. Specifically, the driving mechanism 11242 can use a drive motor.

[0064] Please refer to Figure 1-3 and 10 , in one embodiment, the water pump 1124 further includes a cover assembly 11244 , and the cover assembly 11244 is enclosed with the pump body 11241 to seal the driving mechanism 11242 .

[0065] The driving mechanism 11242 is sealed on the pump body 11241 by the cover assembly 11244, so as to improve the stability and reliability of the combination of the pump body 11241 and the driving mechanism 11242. Fig.10 The cover plate assembly 11244 includes a first side cover plate 112441, a second side cover plate 112442 and a bottom cover plate 112443. The first side cover plate 112441 and the second side cover plate 112442 are respectively connected to two opposite sides of the pump body 11241, and the bottom cover plate 112443 is connected to the bottom of the pump body 11241.

[0066] Please refer to Figure 1-4 In one embodiment, the water-cooling row 1121 has a water outlet 11211 and a water return end 11212, a first end of the pipe assembly 1123 is in communication with the water outlet 11211 of the water-cooling row 1121, and a second end of the pipe assembly 1123 is in communication with the water return end 11212 of the water-cooling row 1121. The water pump 1124 and the plurality of water cooling heads 1122 are connected in series to the pipe assembly 1123, so that the water pump 1124 can drive the coolant to pass through the water pump 1124 and the plurality of water cooling heads 1122 in sequence from the water outlet 11211 to the water return end 11212.

[0067] Please refer to Figure 1-4and 7. Since the water-cooling head 1122 and the water pump 1124 are connected in series through the pipe assembly 1123, when the coolant is discharged from the water outlet end 11211 of the water-cooling row 1121, the coolant flows from the first end to the second end of the pipe assembly 1123, and passes through the water pump 1124 and multiple water-cooling heads 1122 connected in series on the pipe assembly 1123 in turn, and finally returns to the water-cooling row 1121 from the return end 11212 of the water-cooling row 1121 and repeats the cycle.

[0068] Please refer to Figure 1-3 , 5 and 8, in one embodiment, the water-cooling row 1121 has a water outlet 11211 and a water return end 11212, and the pipeline assembly 1123 includes at least two parallel pipelines 11231, the first ends of the at least two parallel pipelines 11231 are both in communication with the water outlet 11211 of the water-cooling row 1121, and the second ends of the at least two parallel pipelines 11231 are both in communication with the water return end 11212 of the water-cooling row 1121. The water pump 1124 is connected between the water outlet 11211 of the water-cooling row 1121 and the first ends of the at least two parallel pipelines 11231, or the water pump 1124 is connected between the second ends of the at least two parallel pipelines 11231 and the water return end 11212.

[0069] Please refer to Figure 1-3 , 5 and 8, since the water-cooling heads 1122 are connected in parallel through the pipe assembly 1123, after the coolant is discharged from the water outlet end 11211 of the water-cooling row 1121, the coolant first flows into the water pump 1124, and then is diverted from the water pump 1124 to multiple parallel water-cooling heads 1122, and finally is discharged from the multiple parallel water-cooling heads 1122, and converges into the water-cooling row 1121 at the return end 11212 of the water-cooling row 1121, thereby realizing repeated circulation.

[0070] Please refer to Figure 1-3 , 6 and 9, in one embodiment, the water-cooling row 1121 has a water outlet 11211 and a water return end 11212, and the pipeline assembly 1123 includes a series pipeline 11232 and a parallel pipeline 11231. The first end of the series pipeline 11232 is in communication with the water outlet 11211 of the water-cooling row 1121, and the parallel pipeline 11231 is configured as at least two, and the second end of the series pipeline 11232 is split to the first ends of at least two parallel pipelines 11231, and the second ends of at least two parallel pipelines 11231 converge to the water return end 11212 of the water-cooling row 1121. The water pump 1124 is connected between the water outlet 11211 of the water-cooling row 1121 and the first end of the series pipeline 11232.

[0071] Please refer to Figure 1-3, 6 and 9, since the multiple water-cooling heads 1122 include a series part and a parallel part, after the coolant is discharged from the water outlet end 11211 of the water-cooling row 1121, the coolant first flows into the water pump 1124, and then flows from the water pump 1124 to the water-cooling head 1122 on the series pipeline 11232, and then the coolant is diverted to the cooling heads on at least two parallel pipelines 11231, and finally the coolant is gathered from the return water end 11212 of the water-cooling row 1121 to the water-cooling row 1121, thereby realizing repeated circulation.

[0072] Please refer to Figure 1-3 7-9, in one embodiment, the water cooling radiator 1121 includes a heat dissipation portion 11213 and a water collecting portion 11214. The heat dissipation portion 11213 has a plurality of heat dissipation flat tubes to increase the heat dissipation area of ​​the coolant in the heat dissipation flat tubes. The water collecting portion 11214 is connected to the heat dissipation flat tubes to collect the coolant flowing into or out of the heat dissipation flat tubes, and the pipeline assembly 1123 is connected to the water collecting portion 11214.

[0073] The water outlet 11211 and the water return 11212 of the water cooling radiator 1121 may both be provided with a water collecting portion 11214. When the water cooling radiator 1121 returns water, the coolant first returns to the water collecting portion 11214 of the water return 11212, and then flows from the water collecting portion 11214 of the water return 11212 to the multiple heat dissipation flat tubes. The heat dissipation area of ​​the coolant in the heat dissipation flat tubes is increased by the heat dissipation flat tubes, so that the coolant in the heat dissipation flat tubes is quickly cooled. The coolant cooled in the heat dissipation flat tubes first converges to the water collecting portion 11214 of the water outlet 11211, and then flows from the water collecting portion 11214 of the water outlet 11211 to the pipeline assembly 1123. Specifically, the water collecting portion 11214 may be tubular, row-shaped, or other suitable shapes.

[0074] Please refer to Figure 8 In one embodiment, the water cooling radiator 1121 includes a first water collecting portion 112141 and a second water collecting portion 112142. The motherboard assembly 111 includes a control motherboard 1111. The control motherboard 1111 is provided with a graphics card 1112 and a central processing unit 1113. The water cooling head 1122 includes a graphics card water cooling head 11223 and a processor water cooling head 11224. When the water cooling assembly 112 is running, the flow path of the coolant is as follows: Figure 8As shown by the arrows in . Driven by the water pump 1124, the coolant first flows from the water outlet 11211 to the first water collecting part 112141, and part or all of the coolant flows from the first water collecting part 112141 through three parallel pipes 11231 to two graphics card water cooling heads 11223 and one processor water cooling head 11224, and then the coolant in the two graphics card water cooling heads 11223 and one processor water cooling head 11224 flows to the second water collecting part 112142, and the coolant in the second water collecting part 112142 flows to the return water end 11212, and finally the coolant in the return water end 11212 flows from the heat dissipation part 11213 to the water outlet 11211, and the cycle continues.

[0075] Please refer to Fig. 9 In one embodiment, the water cooling radiator 1121 includes a first water collecting part 112141 and a second water collecting part 112142. A partition structure 11215 is provided in the middle of the first water collecting part 112141. The partition structure 11215 divides the first water collecting part 112141 into two parts. The motherboard assembly 111 includes a control motherboard 1111. The control motherboard 1111 is provided with a graphics card 1112 and a central processing unit 1113. The water cooling head 1122 includes a graphics card water cooling head 11223 and a processor water cooling head 11224. When the water cooling assembly 112 is in operation, the flow path of the coolant is as follows: Fig. 9 As shown by the arrows in , driven by the water pump 1124, the coolant first flows from the water outlet 11211 to the part of the first water collecting section 112141 close to the water outlet 11211, and then flows from the part of the first water collecting section 112141 close to the water outlet 11211 through two parallel pipes 11231 to the two graphics card water cooling heads 11223 respectively, and then flows from the two graphics card water cooling heads 11223 to the second water collecting section 112142, and then a part of the coolant flows from the second water collecting section 112142 to the processor water cooling head 11224, and the other part flows from the second water collecting section 112142 to the return water end 11212. The coolant in the processor water cooling head 11224 flows to the part of the first water collecting section 112141 close to the return water end 11212, and then flows from the part of the first water collecting section 112141 close to the return water end 11212 to the return water end 11212, and finally the coolant at the return water end 11212 flows from the heat dissipation section 11213 to the water outlet end 11211, and the cycle continues.

[0076] Please refer to Figure 1-3 7-9, in one embodiment, at least one of the transmitting component, the receiving component, the probe board component and the processing component 110 further includes a chassis 113, and the mainboard component 111 and the water cooling component 112 are disposed in the chassis 113. The ultrasound device further includes a body 400, the body 400 has a receiving cavity, and the chassis 113 is detachably disposed in the receiving cavity.

[0077] The mainboard assembly 111 and the water cooling assembly 112 are arranged in the chassis 113, which is conducive to the modularization of the processing assembly 110. The chassis 113 is detachably arranged in the accommodating cavity, which is convenient for the staff to disassemble and repair the processing assembly 110. Specifically, the chassis 113 can be detachably arranged in the accommodating cavity through a pull-out structure.

[0078] Please refer to Figure 1-3 7-9, in one embodiment, the water cooling assembly 112 further includes a water tank 1125, which is used to store the coolant. The water tank 1125 is connected to the water cooling row 1121, the water cooling head 1122, the water pump 1124 or the pipe assembly 1123 to replenish the coolant.

[0079] When the coolant flows in the water cooling head 1122, the water cooling row 1121, the water pump 1124 and the pipe assembly 1123, a small amount of leakage and evaporation may occur, which may reduce the cooling effect of the coolant on the water cooling head 1122, thereby reducing the cooling efficiency of the water cooling assembly 112. Replenishing the coolant to the water cooling row 1121, the water cooling head 1122, the water pump 1124 or the pipe assembly 1123 through the water tank 1125 can avoid the reduction of the cooling efficiency of the water cooling assembly 112 and increase the service life of the water cooling assembly 112. Specifically, the water tank 1125 can be replenished by gravity automatic replenishment or electric replenishment.

[0080] Please refer to Figure 7-9 In one embodiment, the water-cooling radiator 1121, the water-cooling head 1122 and the water pump 1124 all include a quick-release structure, and the pipe assembly 1123 is detachably connected to the quick-release structure so that the coolant can circulate between the water-cooling head 1122 and the water-cooling radiator 1121.

[0081] The staff can quickly connect or disconnect the pipe assembly 1123 with the water cooling radiator 1121, the water cooling head 1122 and the water pump 1124 through the quick-release structure. Specifically, the quick-release structure can be a plug-in structure, a snap-on structure, a magnetic structure or other suitable detachable structure.

[0082] Please refer to Figure 7-9 In one embodiment, the ultrasound host 100 further includes a heat dissipation device, which is disposed on at least one of the water cooling head 1122, the water cooling row 1121, the water pump 1124, the pipeline assembly 1123 and the mainboard assembly 111 for air cooling.

[0083] Specifically, the heat dissipation device may be a heat sink, a heat plate, a heat dissipation film or other suitable heat dissipation structure, which is used to increase the heat dissipation area or improve the heat conduction efficiency during air cooling. The heat dissipation device may be arranged at any position of the ultrasound host 100 where heat dissipation is required, for example, it may be arranged on at least one of the water cooling head 1122, the water cooling row 1121, the water pump 1124, the pipeline assembly 1123 and the mainboard assembly 111. The heat dissipation mode combining water cooling and air cooling is conducive to further improving the heat dissipation efficiency of the ultrasound host 100.

[0084] The above specific examples are used to illustrate the present invention, which is only used to help understand the present invention and is not intended to limit the present invention. For those skilled in the art, according to the concept of the present invention, some simple deductions, modifications or substitutions can be made.

Claims

1. An ultrasonic device, characterized in that: include: Ultrasound host; A display device, connected to the ultrasound host signal, for displaying ultrasound images; and an operating device, connected to the ultrasound host signal and used for inputting operating instructions; Wherein, the ultrasonic host comprises a transmitting component, a receiving component, a probe board component and a processing component, the transmitting component and the receiving component are connected to the probe board component signal, the probe board component is used to be connected to the ultrasonic probe signal for transmitting ultrasonic signals and collecting echo signals; at least one of the transmitting component, the receiving component, the probe board component and the processing component comprises a mainboard component and a water cooling component, the water cooling component comprises a water cooling row, a plurality of water cooling heads, a pipeline component and a water pump independently arranged outside the water cooling row and the plurality of water cooling heads and connected to the pipeline component; the water cooling head is used to contact the heat source on the mainboard component, and the water cooling row is used to dissipate the heat of the coolant flowing through the water cooling row; The pipe assembly connects the water-cooling radiator, the plurality of water-cooling heads and the water pump, so that the water pump can drive the coolant to circulate between the water-cooling radiator and the plurality of water-cooling heads.

2. The ultrasonic device according to claim 1, characterized in that The multiple water-cooling heads are connected in series through the pipe assembly; the water-cooling head has a head end and a tail end, the head end of the water-cooling head is the position where the coolant enters the water-cooling head, and the tail end of the water-cooling head is the position where the coolant discharges the water-cooling head; when the multiple water-cooling heads are connected in series through the pipe assembly, the multiple water-cooling heads are connected end to end in sequence along the flow path of the coolant.

3. The ultrasonic device according to claim 2, characterized in that The water-cooling radiator has a water outlet end and a water return end, the first end of the pipe assembly is connected to the water outlet end of the water-cooling radiator, and the second end of the pipe assembly is connected to the water return end of the water-cooling radiator; the water pump and the multiple water-cooling heads are connected in series to the pipe assembly, so that the water pump can drive the coolant to pass through the water pump and the multiple water-cooling heads in sequence from the water outlet end to the water return end.

4. The ultrasonic device according to claim 1, characterized in that The multiple water-cooling heads are connected in parallel through the pipeline assembly; the water-cooling head has a head end and a tail end, the head end of the water-cooling head is the position where the coolant enters the water-cooling head, and the tail end of the water-cooling head is the position where the coolant discharges the water-cooling head; when the multiple water-cooling heads are connected in parallel through the pipeline assembly, the multiple water-cooling heads are connected head to head and tail to tail.

5. The ultrasonic device according to claim 4, characterized in that The water-cooling radiator has a water outlet and a water return end, and the pipeline assembly includes at least two parallel pipelines, the first ends of at least two of the parallel pipelines are connected to the water outlet of the water-cooling radiator, and the second ends of at least two of the parallel pipelines are connected to the water return end of the water-cooling radiator; the water pump is connected between the water outlet of the water-cooling radiator and the first ends of at least two of the parallel pipelines, or the water pump is connected between the second ends of at least two of the parallel pipelines and the water return end.

6. The ultrasonic device according to claim 1, characterized in that At least two of the multiple water-cooling heads are connected in series through the pipeline assembly, and at least two of the multiple water-cooling heads are connected in parallel through the pipeline assembly; the water-cooling head has a head end and a tail end, the head end of the water-cooling head is the position where the coolant enters the water-cooling head, and the tail end of the water-cooling head is the position where the coolant discharges the water-cooling head; when the multiple water-cooling heads are connected in series through the pipeline assembly, the multiple water-cooling heads are connected end to end in sequence along the flow path of the coolant; when the multiple water-cooling heads are connected in parallel through the pipeline assembly, the multiple water-cooling heads are connected head to head and tail to tail.

7. The ultrasonic device according to claim 6, characterized in that The water-cooling radiator has a water outlet and a water return end, and the pipeline assembly includes a series pipeline and a parallel pipeline; the first end of the series pipeline is connected to the water outlet of the water-cooling radiator, and the parallel pipeline is configured as at least two, the second end of the series pipeline is divided to the first ends of at least two parallel pipelines, and the second ends of at least two parallel pipelines converge to the water return end of the water-cooling radiator; the water pump is connected between the water outlet of the water-cooling radiator and the first end of the series pipeline.

8. The ultrasonic device according to claim 1, characterized in that The water pump includes a pump body, a driving mechanism and an impeller, wherein the pump body has a pump cavity, and the pump cavity has an inlet and an outlet; the impeller is arranged in the pump cavity, and the driving mechanism is used to drive the impeller to rotate, so as to provide power for the movement of the coolant flowing into and / or out of the pump cavity; the water pump also includes a cover plate assembly, and the cover plate assembly is enclosed with the pump body to close the driving mechanism.

9. The ultrasonic device according to any one of claims 1 to 8, characterized in that: The water cooling radiator includes a heat dissipation part and a water collecting part. The heat dissipation part has a plurality of heat dissipation flat tubes for increasing the heat dissipation area of ​​the coolant in the heat dissipation flat tubes. The water collecting part is connected to the heat dissipation flat tubes for collecting the coolant flowing into or out of the heat dissipation flat tubes. The pipeline assembly is connected to the water collecting part.

10. The ultrasonic device according to any one of claims 1 to 8, characterized in that: At least one of the transmitting component, receiving component, probe board component and processing component also includes a chassis, and the mainboard component and the water cooling component are arranged in the chassis; the ultrasound equipment also includes a body, the body has a accommodating cavity, and the chassis is detachably arranged in the accommodating cavity.

11. The ultrasonic device according to any one of claims 1 to 8, characterized in that: The water cooling assembly also includes a water tank, which is used to store coolant; the water tank is connected to the water cooling row, water cooling head, water pump or pipeline assembly to replenish the coolant.

12. The ultrasonic device according to any one of claims 1 to 8, characterized in that: The ultrasonic host also includes a heat dissipation device, which is arranged on at least one of the water-cooling head, the water-cooling radiator, the water pump, the pipeline assembly and the mainboard assembly for air-cooling and heat dissipation.

13. An ultrasonic host of an ultrasonic device, characterized in that: include: Launch assembly; receiving component; A probe plate assembly, the transmitting assembly and the receiving assembly are connected to the probe plate assembly by signal, and the probe plate assembly is used to be connected to the ultrasonic probe signal for transmitting ultrasonic signals and collecting echo signals; and a processing component, wherein at least one of the transmitting component, the receiving component, the probe board component and the processing component includes a mainboard component and a water cooling component, wherein the water cooling component includes a water cooling row, a plurality of water cooling heads, a pipeline component and a water pump independently arranged outside the water cooling row and the plurality of water cooling heads and connected to the pipeline component; the water cooling head is used to contact with a heat source on the mainboard component, and the water cooling row is used to dissipate heat from a coolant flowing through the water cooling row; The pipe assembly connects the water-cooling radiator, the plurality of water-cooling heads and the water pump, so that the water pump can drive the coolant to circulate between the water-cooling radiator and the plurality of water-cooling heads.

14. The ultrasound host according to claim 13, characterized in that: The multiple water-cooling heads are connected in series through the pipe assembly; the water-cooling head has a head end and a tail end, the head end of the water-cooling head is the position where the coolant enters the water-cooling head, and the tail end of the water-cooling head is the position where the coolant discharges the water-cooling head; when the multiple water-cooling heads are connected in series through the pipe assembly, the multiple water-cooling heads are connected end to end in sequence along the flow path of the coolant.

15. The ultrasound host according to claim 14, characterized in that: The water-cooling radiator has a water outlet end and a water return end, the first end of the pipe assembly is connected to the water outlet end of the water-cooling radiator, and the second end of the pipe assembly is connected to the water return end of the water-cooling radiator; the water pump and the multiple water-cooling heads are connected in series to the pipe assembly, so that the water pump can drive the coolant to pass through the water pump and the multiple water-cooling heads in sequence from the water outlet end to the water return end.

16. The ultrasound host according to claim 13, characterized in that: The multiple water-cooling heads are connected in parallel through the pipeline assembly; the water-cooling head has a head end and a tail end, the head end of the water-cooling head is the position where the coolant enters the water-cooling head, and the tail end of the water-cooling head is the position where the coolant discharges the water-cooling head; when the multiple water-cooling heads are connected in parallel through the pipeline assembly, the multiple water-cooling heads are connected head to head and tail to tail.

17. The ultrasound host according to claim 16, characterized in that: The water-cooling radiator has a water outlet and a water return end, and the pipeline assembly includes at least two parallel pipelines, the first ends of at least two of the parallel pipelines are connected to the water outlet of the water-cooling radiator, and the second ends of at least two of the parallel pipelines are connected to the water return end of the water-cooling radiator; the water pump is connected between the water outlet of the water-cooling radiator and the first ends of at least two of the parallel pipelines, or the water pump is connected between the second ends of at least two of the parallel pipelines and the water return end.

18. The ultrasound host according to claim 13, characterized in that: At least two of the multiple water-cooling heads are connected in series through the pipeline assembly, and at least two of the multiple water-cooling heads are connected in parallel through the pipeline assembly; the water-cooling head has a head end and a tail end, the head end of the water-cooling head is the position where the coolant enters the water-cooling head, and the tail end of the water-cooling head is the position where the coolant discharges the water-cooling head; when the multiple water-cooling heads are connected in series through the pipeline assembly, the multiple water-cooling heads are connected end to end in sequence along the flow path of the coolant; when the multiple water-cooling heads are connected in parallel through the pipeline assembly, the multiple water-cooling heads are connected head to head and tail to tail.

19. The ultrasound host according to claim 18, characterized in that: The water-cooling radiator has a water outlet and a water return end, and the pipeline assembly includes a series pipeline and a parallel pipeline; the first end of the series pipeline is connected to the water outlet of the water-cooling radiator, and the parallel pipeline is configured as at least two, the second end of the series pipeline is divided to the first ends of at least two parallel pipelines, and the second ends of at least two parallel pipelines converge to the water return end of the water-cooling radiator; the water pump is connected between the water outlet of the water-cooling radiator and the first end of the series pipeline.

20. The ultrasound host according to claim 13, characterized in that: The water pump includes a pump body, a driving mechanism and an impeller. The pump body has a pump chamber, and the pump chamber has an inlet and an outlet. The impeller is arranged in the pump chamber, and the driving mechanism is used to drive the impeller to rotate, so as to provide power for the movement of the coolant flowing into and out of the pump chamber.

Images