A potting glue tank

Abstract

The invention discloses a potting glue groove, which belongs to the field of potting glue packaging technology, and includes a glue groove with a variable groove depth, and the glue groove is used to hold the potting glue. After filling the glue once, the worker only needs to adjust the groove depth of the glue groove to lift the glue surface, and after scraping the glue surface, the next immersion packaging can be carried out, until the glue depth remaining in the glue groove cannot completely cover the component for packaging, there is no need to fill the glue again, thereby reducing the number of times of filling the glue, realizing a method of filling the glue once and using it multiple times, which can reduce the risk of bubble generation and improve production efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of potting glue packaging, in particular to a potting glue groove. Background Art

[0002] When encapsulating the temperature sensor, the encapsulation is mainly achieved by filling the glue tank with epoxy resin glue, and then immersing the temperature sensor in the glue tank to form a small glue head. The glue tank is generally a metal container with a fixed volume. During use, as the epoxy resin glue in the glue tank continues to decrease, workers need to fill the glue multiple times and scrape the surface flat. Bubbles are easily generated during the glue filling process, affecting production quality. At the same time, multiple glue fillings will also affect the packaging efficiency. Summary of the invention

[0003] The purpose of the present invention is to solve the above technical problems and provide a potting glue groove, which can be used multiple times by changing the groove depth of the glue groove, thereby reducing the number of glue fillings, reducing the risk of bubble generation and improving production efficiency.

[0004] To achieve the above-mentioned purpose, the present invention provides the following solution: The present invention discloses a potting glue groove, comprising a glue groove with a variable groove depth, and the glue groove is used to contain the potting glue.

[0005] Preferably, it includes a potting mold, the top and bottom surfaces of which are both flat, the top surface of the potting mold is provided with a containing groove, the notch of the containing groove encapsulates a containing film, a lifting plate for supporting the containing film is provided in the containing groove, and the lifting plate, the containing groove and the containing film form the glue groove.

[0006] Preferably, an annular rubber path is further provided on the top surface of the potting mold, the annular rubber path is sleeved on the outer side of the containing groove, and the containing film covers the annular rubber path and the containing groove.

[0007] Preferably, it also includes a pressure strip for pressing the containing film, the pressure strip includes an annular pressing groove with an annular edge, an annular protrusion is provided between the annular glue path and the notch of the containing groove, the annular protrusion matches the annular pressing groove, and the annular glue path matches the annular edge.

[0008] Preferably, a mounting groove is provided at the bottom of the containing groove, and a lifting device for driving the lifting plate to move up and down is installed in the mounting groove.

[0009] Preferably, the lifting device includes a mounting plate, an adjusting block, a rotating frame, a toggle block and a lifting plate, the mounting plate is arranged in the mounting groove, the adjusting block and the rotating frame are mounted on the mounting plate, a handle is threadedly connected to the adjusting block, the axis of the handle is parallel to the top surface of the potting mold, the toggle block is rotatably connected to the rotating frame, the rotation axis of the toggle block is parallel to the top surface of the potting mold, the rotation axis of the toggle block and the axis of the handle are perpendicular to each other, the toggle block includes a first toggle rod and a second toggle rod with an included angle, the handle is located on the rotation path of the first toggle rod, the lifting plate is vertically slidably connected to the rotating frame, the lifting plate is located on the rotation path of the second toggle rod, the lifting plate is mounted on the lifting plate, and the potting mold is provided with an extension port for the handle to extend out.

[0010] Preferably, the extension opening is a U-shaped opening, and the opening of the U-shaped opening extends to the bottom surface of the potting mold.

[0011] Preferably, a push rod is installed at the bottom of the lifting plate, and the push rod is located on the rotation path of the second shifting rod.

[0012] Preferably, it also includes a support plate, the support plate is provided with an adjustment strip hole for the bolt to pass through, the mounting plate is provided with a bolt hole for the bolt to be threadedly connected, the bolt hole corresponds to the position of the adjustment strip hole, the glue groove is a rectangular groove, the adjustment strip hole is arranged along the length direction of the glue groove, the bottom surface of the encapsulation mold is provided with an adjustment groove for accommodating the support plate, the adjustment groove along the length direction of the glue groove is longer than the support plate along the length direction of the glue groove, and the adjustment groove is connected to the support plate by bolts.

[0013] Preferably, it also includes a sealing plate, the bottom surface of the potting mold is provided with a sealing groove, the adjustment groove is located in the sealing groove, the sealing groove and the sealing plate match, the sealing plate is embedded in the sealing groove, and the sealing groove and the sealing plate are connected by bolts.

[0014] Compared with the prior art, the present invention has achieved the following technical effects:

[0015] The depth of the glue groove in the present invention is variable. After filling the glue once, the worker only needs to adjust the depth of the glue groove to raise the glue surface. After scraping the glue surface, the next immersion packaging can be carried out. Until the depth of the glue remaining in the glue groove cannot completely cover the component for packaging, there is no need to fill the glue again, thereby reducing the number of times of filling the glue, and realizing a method of filling the glue once and using it multiple times, which can reduce the risk of bubble generation and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 Schematic diagram of the top view of the three-dimensional structure of the potting glue groove in the embodiment;

[0018] Figure 2 Schematic diagram of the bottom-up stereoscopic structure of the potting glue groove in the embodiment;

[0019] Figure 3 An exploded view of the potting glue groove in the embodiment;

[0020] Figure 4 is a cross-sectional view of a potting adhesive groove in an embodiment;

[0021] Figure 5 Schematic diagram of the top view of the three-dimensional structure of the potting mold in the embodiment;

[0022] Figure 6 is a bottom-up three-dimensional structural schematic diagram of the potting mold in the embodiment;

[0023] Figure 7 is a schematic top view of a stereoscopic structure of a layering strip in an embodiment;

[0024] Figure 8 is a bottom-up three-dimensional structural schematic diagram of a layering strip in an embodiment;

[0025] Fig. 9 is a position relationship diagram of the lifting device, the support plate and the cover plate in the embodiment;

[0026] Fig.10 is a connection diagram of the lifting device and the support plate in the embodiment;

[0027] Fig.11 Schematic diagram of the structure of the lifting device in the embodiment;

[0028] Fig.12 is an installation relationship diagram of the potting mold and the lifting device in the embodiment;

[0029] Fig.13 It is the installation relationship diagram of the potting mold and the packaging plate in the embodiment.

[0030] Description of reference numerals:

[0031] 1. Potting mold; 101. Glue groove; 102. Receiving groove; 103. Annular glue channel; 104. Annular protrusion; 105. Mounting groove; 106. Extension port; 107. Packaging groove; 108. Adjustment groove; 109. First threaded hole; 110. Second threaded hole;

[0032] 2. Hold the film;

[0033] 3. layering strip; 301. annular groove; 302. annular edge;

[0034] 4. Lifting device; 401. Mounting plate; 402. Adjusting block; 403. Rotating frame; 404. Toggle block; 405. Lifting plate; 406. Handle; 407. First lever; 408. Second lever; 409. Lifting plate; 410. Push rod; 411. Sliding hole;

[0035] 5. Support plate; 501. Adjustment bar hole; 502. Third threaded hole;

[0036] 6. Covering plate; 601. Fourth threaded hole;

[0037] 7. Bolts. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] This embodiment provides a potting glue groove, such as Figures 1 to 13 As shown, it includes a glue groove 101, and the glue groove 101 is used to hold the potting glue, and the groove depth of the glue groove 101 is variable. During each use, the potting glue in the glue groove 101 will be reduced. If the glue surface of the potting glue is lower than the notch of the glue groove 101, the groove depth of the glue groove 101 is reduced to make the glue surface of the potting glue slightly overflow the notch of the glue groove 101, and then the glue surface is scraped flat, and the component can be packaged. When the groove depth of the glue groove 101 cannot meet the requirements of one packaging, the glue groove 101 is restored to the initial depth and the glue is re-filled. One-time glue filling can be used multiple times, and there is no need to perform the glue filling process every time it is used, thereby reducing the risk of bubbles and improving the packaging efficiency.

[0040] Working process: first, the glue groove 101 has an initial groove depth; then, a potting glue, such as epoxy resin glue, silicone gel, room temperature vulcanized silicone rubber, polyurethane glue, UV potting glue, etc., is poured into the glue groove 101, and the potting glue needs to slightly overflow the notch of the glue groove 101, and then the glue surface of the notch of the glue groove 101 is scraped flat, such as using a scraper to move along the notch of the glue groove 101 to scrape the potting glue flat; then, the components to be packaged, such as electronic components (temperature sensors, etc.), are immersed in the glue groove 101 to achieve glue head packaging; then, before the next packaging, the groove depth of the glue groove 101 is reduced, the potting glue overflows the notch of the glue groove 101 again, and the glue surface of the notch of the glue groove 101 is scraped flat again, and then packaging can be performed; and so on, the next component packaging is performed until the groove depth of the glue groove 101 cannot meet the packaging of a packaged component, and the glue groove 101 is restored to the initial groove depth.

[0041] In one embodiment, if Figures 1 to 13 As shown, it includes a potting mold 1, the top and bottom surfaces of the potting mold 1 are both flat, and the top surface of the potting mold 1 is provided with a holding groove 102. The notch of the holding groove 102 encapsulates a holding film 2. A lifting plate 405 that can be raised and lowered is provided in the holding groove 102, and the lifting plate 405 is used to support the holding film 2. The lifting plate 405, the holding groove 102 and the holding film 2 form a glue groove 101. Preferably, the shape of the lifting plate 405 matches the cross-sectional shape of the holding groove 102, that is, if the holding groove 102 is a rectangular groove, the lifting plate 405 is a rectangular plate, and if the holding groove 102 is a circular groove, the lifting plate 405 is a circular plate. There is a certain gap between the lifting plate 405 and the holding groove 102, which can avoid friction between the lifting plate 405 and the holding groove 102. The containing film 2 is provided because the lifting plate 405 and the groove wall of the containing groove 102 are clearance-matched and glue is easy to leak, so the containing film 2 is used to contain the potting glue.

[0042] Working principle: the lifting plate 405 descends to the initial position of the containing groove 102 (a preset groove depth), and the potting glue is poured into the glue groove 101. Under the action of gravity, the potting glue will stretch the containing film 2, so that the containing film 2 fits the shape of the containing groove 102. As the use of potting glue decreases, the lifting plate 405 rises along the groove depth direction of the containing groove 102, pushing up the containing film 2, thereby reducing the groove depth of the glue groove 101, and then the scraper is moved along the notch of the containing groove 102 to achieve the scraping of the glue surface.

[0043] In one embodiment, if Figures 1 to 13As shown, an annular glue channel 103 is also provided on the top surface of the potting mold 1, and the annular glue channel 103 is sleeved on the outer side of the containing groove 102, and the containing film 2 covers the annular glue channel 103 and the containing groove 102. When the glue surface is scraped flat, the excess potting glue will flow from the notch of the containing groove 102 into the annular glue channel 103 for acceptance, and the potting glue flowing into the annular glue channel 103 can be recycled to prevent the glue from falling on the ground or the workbench and causing pollution.

[0044] In one embodiment, if Figures 1 to 13 As shown, it also includes a pressure strip 3 for pressing the containing film 2. The pressure strip 3 includes an annular pressure groove 301, and the annular pressure groove 301 has an annular edge 302. An annular protrusion 104 is provided between the annular adhesive path 103 and the notch of the containing groove 102, and the annular protrusion 104 matches the annular pressure groove 301. The annular adhesive path 103 matches the annular edge 302. After covering the entire containing film 2 on the annular adhesive path 103 and the containing groove 102, align the annular pressure groove 301 of the pressure strip 3 with the annular protrusion 104, align the annular edge 302 with the annular adhesive path 103, press the pressure strip 3 downward, buckle the annular pressure groove 301 on the annular protrusion 104, and press the annular edge 302 into the annular adhesive path 103, so that the edge of the containing film 2 can be pressed to prevent affecting the scraping of glue.

[0045] In one embodiment, if Figures 1 to 13 As shown, the container film 2 can be an elastic film or an inelastic film. When an elastic film is used, the pressure strip 3 can be pressed first, and then the potting glue can be poured in. The elastic film must ensure the size of the film's open area, and must be able to meet the edge of the elastic film when it is filled with potting glue. Cover the annular glue path 103. When an inelastic film is used, the potting glue must be poured in first. During grouting, the center of the inelastic film will sink under the action of gravity, and the edge of the inelastic film will move toward the center. After the inelastic film is opened, the pressure strip 3 is pressed in. Pressing the pressure strip 3 first requires reserving the remaining area for the container film 2 to move when it is filled with the potting glue, which is not easy to control. In addition, when the edge of the inelastic film is used, the area of ​​the film must be ensured to be large enough to meet the edge of the inelastic film when the inelastic film is filled with potting glue. The container film 2 can be replaced at any time regardless of whether it is an elastic film or an inelastic film.

[0046] In one embodiment, if Figures 1 to 13 As shown, a mounting groove 105 is provided at the bottom of the containing groove 102, and a lifting device 4 is installed in the mounting groove 105. The lifting device 4 is used to drive the lifting plate 405 to move up and down.

[0047] In one embodiment, if Figures 1 to 13As shown, the lifting device 4 includes a mounting plate 401, an adjustment block 402, a rotating frame 403, a toggle block 404 and a lifting plate 409. The mounting plate 401 is arranged in the mounting groove 105, the adjustment block 402 and the rotating frame 403 are mounted on the mounting plate 401, and a handle 406 is threadedly connected to the adjustment block 402, and the axis of the handle 406 is parallel to the top surface of the encapsulation mold 1. The toggle block 404 is rotatably connected to the rotating frame 403, and the rotation axis of the toggle block 404 is parallel to the top surface of the encapsulation mold 1, and the rotation axis of the toggle block 404 and the axis of the handle 406 are perpendicular to each other. The toggle block 404 includes a first toggle rod 407 and a second toggle rod 408 having an angle, and the handle 406 is located on the rotation path of the first toggle rod 407, and the lifting plate 409 is vertically slidably connected to the rotating frame 403, and the lifting plate 409 is located on the rotation path of the second toggle rod 408. The lifting plate 405 is mounted on the lifting plate 409, and the encapsulating mold 1 is provided with an extension opening 106 for the handle 406 to extend out. The handle 406 is rotated to move toward the first lever 407 along the axial direction, thereby pushing the first lever 407, driving the toggle block 404 to rotate, and the second lever 408 is rotated upward to push the lifting plate 409 upward, and the lifting plate 409 is raised to drive the lifting plate 405 to rise, so that the groove depth of the glue groove 101 is reduced, and the handle 406 is rotated in the opposite direction, so that the handle 406 is located in the direction of the first lever 407 away from the first lever 407 along the axial direction, and the second lever 408 is rotated downward, and the lifting plate 409 and the lifting plate 405 are lowered, and the groove depth of the glue groove 101 is increased.

[0048] In one embodiment, if Figures 1 to 13 As shown, the extension opening 106 is a U-shaped opening, and the opening of the U-shaped opening extends to the bottom surface of the potting mold 1 .

[0049] Further, in one embodiment, if Figures 1 to 13 As shown, a push rod 410 is installed at the bottom of the lifting plate 409 , and the push rod 410 is located on the rotation path of the second shifting rod 408 .

[0050] Further, in one embodiment, if Figures 1 to 13 As shown, a sliding hole 411 is provided on the lifting plate 409, and a vertically arranged sliding rod is provided on the rotating frame 403. The sliding hole 411 of the lifting plate 409 is sleeved on the sliding rod. Through the sliding cooperation between the sliding rod and the sliding hole 411, the guiding effect of the vertical movement of the lifting plate 409 can be realized.

[0051] Further, in one embodiment, if Figures 1 to 13 As shown, the lifting plate 405 and the lifting plate 409 are connected by bolts 7.

[0052] In one embodiment, if Figures 1 to 13As shown, the lifting device 4 uses a telescopic rod or a scissor-type lifting mechanism to lift the lifting plate 405. The specific vertical setting of the telescopic rod can use an electric telescopic rod, a pneumatic telescopic rod or a hydraulic telescopic rod, and the screw of the screw nut is rotatably connected in the installation groove 105.

[0053] In one embodiment, if Figures 1 to 13 As shown, it also includes a support plate 5, an adjustment strip hole 501 is provided on the support plate 5, and a bolt hole is provided on the mounting plate 401. The bolt hole corresponds to the position of the adjustment strip hole 501. The bolt 7 is passed through the adjustment strip hole 501 and screwed into the bolt hole to realize the connection between the support plate 5 and the mounting plate 401. The glue groove 101 is a rectangular groove. The adjustment strip hole 501 is arranged along the length direction of the glue groove 101, and the bottom surface of the encapsulation mold 1 is provided with an adjustment groove 108, and the adjustment groove 108 is used to accommodate the support plate 5. The adjustment groove 108 is longer than the support plate 5 along the length direction of the glue groove 101. By adjusting the strip hole 501, the position of the bolt hole corresponding to the adjustment strip hole 501 can be changed, thereby changing the position of the mounting plate 401 in the length direction of the glue groove 101. As a preferred embodiment, the support plate 5 and the adjustment groove 108 are both rectangular. The adjustment groove 108 is connected to the support plate 5 by bolts.

[0054] In one embodiment, if Figures 1 to 13 As shown, it also includes a cover plate 6, a packaging groove 107 is provided on the bottom surface of the potting mold 1, and the adjustment groove 108 is located in the packaging groove 107. The packaging groove 107 and the cover plate 6 are connected by bolts. Preferably, the cover plate 6 and the packaging groove 107 are both rectangular.

[0055] In one embodiment, if Figures 1 to 13 As shown, the adjustment groove 108 is provided with a first threaded hole 109, the packaging groove 107 is provided with a second threaded hole 110, the support plate 5 is provided with a third threaded hole 502, and the cover plate 6 is provided with a fourth threaded hole 601. The third threaded hole 502 matches the first threaded hole 109, and the third threaded hole 502 and the first threaded hole 109 are screwed with bolts 7, so that the adjustment groove 108 and the support plate 5 can be bolted. The fourth threaded hole 601 matches the second threaded hole 110, and the third threaded hole 502 and the first threaded hole 109 are screwed with bolts 7, so that the packaging groove 107 and the cover plate 6 can be bolted.

[0056] In one embodiment, if Figures 1 to 13 As shown, the potting mold 1 is in the shape of a rectangular parallelepiped as a whole, but it can also be in other shapes, such as a cylinder, a polygonal column, or even a special shape.

[0057] In one embodiment, if Figures 1 to 13 As shown, the NTC temperature sensor packaging process is as follows:

[0058] The first step is to turn the handle 406 to lower the lifting plate 405 to the lowest position of the containing tank 102, and then spread the containing film 2 on the containing tank 102, and fill the containing film 2 with epoxy resin glue until it is filled, and then press the containing film 2 with the pressure strip 3, and scrape the glue surface along the pressure strip 3;

[0059] The second step is to soak the NTC temperature sensor rubber head;

[0060] The third step is to rotate the handle 406 to adjust the height of the rubber surface and to smooth the rubber surface as required.

[0061] Step 4: Dip the NTC temperature sensor rubber tip again;

[0062] Step 5: When the depth of the glue groove 101 is not enough to immerse the glue head of the NTC temperature sensor again, the lifting plate 405 is lowered to the lowest position of the containing groove 102, and the previous steps 1 to 4 are repeated until all the NTC temperature sensors are packaged.

[0063] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A potting glue tank, characterized in that: The invention comprises a potting mold and a glue groove with a variable groove depth, wherein the glue groove is used to hold the potting glue, the top surface and the bottom surface of the potting mold are both planes, the top surface of the potting mold is provided with a holding groove, the notch of the holding groove is encapsulated with a holding film, a lifting plate for supporting the holding film is provided in the holding groove, the lifting plate, the holding groove and the holding film form the glue groove, a mounting groove is provided at the bottom of the holding groove, a lifting device for driving the lifting plate to lift is installed in the mounting groove, the lifting device comprises a mounting plate, an adjusting block, a rotating frame, a toggle block and a lifting plate, the mounting plate is arranged in the mounting groove, the adjusting block and the rotating frame are installed The mounting plate is mounted on the adjusting block, and a handle is threadedly connected to the adjusting block, and the axis of the handle is parallel to the top surface of the potting mold. The toggle block is rotatably connected to the rotating frame, and the rotation axis of the toggle block is parallel to the top surface of the potting mold. The rotation axis of the toggle block and the axis of the handle are perpendicular to each other. The toggle block includes a first toggle rod and a second toggle rod with an included angle, and the handle is located on the rotation path of the first toggle rod. The lifting plate is vertically slidably connected to the rotating frame, and the lifting plate is located on the rotation path of the second toggle rod. The lifting plate is mounted on the lifting plate, and the potting mold is provided with an extension port for the handle to extend out.

2. The potting glue groove according to claim 1, characterized in that: An annular rubber path is also provided on the top surface of the potting mold, and the annular rubber path is sleeved on the outer side of the containing groove, and the containing film covers the annular rubber path and the containing groove.

3. The potting glue groove according to claim 2, characterized in that: It also includes a pressure strip for pressing the containing film, the pressure strip includes an annular pressing groove with an annular edge, an annular protrusion is provided between the annular glue path and the notch of the containing groove, the annular protrusion matches the annular pressing groove, and the annular glue path matches the annular edge.

4. The potting glue groove according to claim 1, characterized in that: The extension opening is a U-shaped opening, and the opening of the U-shaped opening extends to the bottom surface of the potting mold.

5. The potting glue groove according to claim 1, characterized in that: A push rod is installed at the bottom of the lifting plate, and the push rod is located on the rotation path of the second shifting rod.

6. The potting glue groove according to claim 1, characterized in that: It also includes a support plate, which is provided with an adjustment strip hole for the bolt to pass through, and the mounting plate is provided with a bolt hole for the bolt to be threadedly connected, the bolt hole corresponds to the position of the adjustment strip hole, the glue groove is a rectangular groove, and the adjustment strip hole is arranged along the length direction of the glue groove. The bottom surface of the encapsulation mold is provided with an adjustment groove for accommodating the support plate, the adjustment groove along the length direction of the glue groove is longer than the support plate along the length direction of the glue groove, and the adjustment groove is connected to the support plate by bolts.

7. The potting glue groove according to claim 6, characterized in that: It also includes a sealing plate. The bottom surface of the potting mold is provided with a sealing groove. The adjusting groove is located in the sealing groove. The sealing groove matches the sealing plate. The sealing plate is embedded in the sealing groove. The sealing groove and the sealing plate are connected by bolts.

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