Method and system for detecting wafer adhesion of elastic support body and wafer sorting machine

Abstract

The invention relates to the technical field of semiconductors, in particular to a method and system for detecting adhesion of a wafer to an elastic supporting body and a wafer sorting machine. A sound signal between an elastic supporting body assembled by the manipulator supporting fork and the wafer is generated in the process from a first position to a second position, and the first position is a position where the elastic supporting body assembled by the manipulator supporting fork supports the wafer to be static above the rotating tray; the second position is a static position after the elastic supporting body assembled by the manipulator supporting fork is separated from the wafer; and obtaining the adhesion degree of the elastic support body to the wafer based on the sound signal and a set reference signal. Automatic judgment is carried out through detection of sound signals in the carrying process, the situation that judgment is not accurate or not in time is avoided, the working efficiency and the detection quality are effectively improved, and sorting and manufacturing of wafers are facilitated.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a method and system for detecting elastic support bodies adhering to wafers, and a wafer sorting machine. Background Art

[0002] In the semiconductor manufacturing process, wafer handling is a necessary step in the semiconductor manufacturing process, and the wafer sorter is the key equipment to achieve this function. In the wafer sorter, wafer handling relies on the robot to take the wafer out of the wafer box, and then send it back to the wafer box after calibration by the wafer calibration device.

[0003] The fork of the robot is equipped with an elastic support body, and the friction between the elastic support body and the wafer is used to transfer the wafer, which is a way of wafer handling. The elastic support body is made of polymer materials and has high friction and wear resistance. However, as the number of wafers handled by the robot increases, the contact surface between the elastic support body and the wafer will change, especially when the number of wafers handled reaches hundreds of thousands or even millions, the contact surface between the elastic support body and the wafer will stick to the wafer, and the elastic support body must be replaced.

[0004] Currently, whether the elastic support body and the wafer are sticky is determined by manual observation of whether the elastic support body has a sticky phenomenon or engineering experience. There are cases where the judgment is inaccurate or untimely, which affects the sorting and manufacturing of the wafer. Summary of the invention

[0005] The present invention provides a method and system for detecting elastic support bodies sticking to wafers, and a wafer sorting machine, for solving one of the defects in the prior art. Automatic judgment is made by detecting sound signals during the transportation process, thereby avoiding inaccurate or untimely judgment, effectively improving work efficiency and detection quality, and being beneficial to the sorting and manufacturing of wafers.

[0006] The present invention provides a method for detecting whether an elastic support body is adhered to a wafer, comprising: Acquiring a sound signal between an elastic support body of a robot fork and a wafer during a process of transporting a wafer to a rotating tray of a wafer calibrator from a first position to a second position, wherein the first position is a stationary position where the elastic support body of the robot fork supports the wafer above the rotating tray, and the second position is a stationary position where the elastic support body of the robot fork is separated from the wafer; Based on the sound signal and the set reference signal, the adhesion degree of the elastic support body to the wafer is obtained.

[0007] According to a method for detecting an elastic support body sticking to a wafer provided by the present invention, the sound signal between the elastic support body assembled by the robot fork and the wafer during the process of transporting the wafer to the rotating tray of the wafer aligner from the first position to the second position comprises: Acquire a sound signal between the elastic support body of the robot fork assembly and the wafer during the process from the third position to the second position, wherein the third position is the position where the elastic support body of the robot fork assembly supports the wafer to contact the rotating tray.

[0008] According to a method for detecting an elastic support body sticking to a wafer provided by the present invention, the step of obtaining a sound signal between the elastic support body assembled by the robot fork and the wafer during the process of moving from the third position to the second position comprises: Acquire a sound signal between the elastic support body of the robot fork assembly and the wafer during the process from the third position to the fourth position, wherein the fourth position is a position where the elastic support body of the robot fork assembly is separated from the wafer.

[0009] According to a method for detecting an elastic support body sticking to a wafer provided by the present invention, the sound signal between the elastic support body assembled by the robot fork and the wafer during the process of transporting the wafer to the rotating tray of the wafer aligner from the first position to the second position is obtained, and further includes: Acquire a sound signal between the elastic support body of the robot fork assembly and the wafer in at least one process from the first position to the third position and from the fourth position to the second position.

[0010] According to a method for detecting adhesion of an elastic support body to a wafer provided by the present invention, obtaining the adhesion degree of the elastic support body to the wafer based on the sound signal and a set reference signal includes: Processing the sound signal to obtain a digital signal; The digital signal is compared with the set reference signal to obtain the degree of adhesion of the elastic support body to the wafer.

[0011] According to a method for detecting elastic support body adhering to wafer provided by the present invention, the processing of the sound signal to obtain a digital signal comprises: Processing the sound signal to form an analog signal; amplifying the analog signal to obtain an amplified signal; Performing analog-to-digital conversion on the amplified signal to obtain an initial digital signal; The characteristic signal of the initial digital signal is extracted and processed to obtain a digital signal.

[0012] According to a method for detecting elastic support body adhering to wafer provided by the present invention, the characteristic signal includes at least one characteristic signal of amplitude, frequency, phase, waveform and harmonic.

[0013] A method for detecting elastic support body adhering to a wafer provided by the present invention further includes: Based on the degree of adhesion of the elastic support body to the wafer, a warning message is issued.

[0014] The present invention also provides a system for detecting whether an elastic support body is adhered to a wafer, comprising: A sound sensor is adapted to obtain a sound signal between an elastic support body of a robot fork and a wafer during a process in which the wafer is transported to a rotating tray of a wafer calibrator from a first position to a second position, wherein the first position is a stationary position where the elastic support body of the robot fork supports the wafer above the rotating tray, and the second position is a stationary position where the elastic support body of the robot fork is separated from the wafer; A controller is electrically connected to the sound sensor and is suitable for obtaining the degree of adhesion of the elastic support body to the wafer based on the sound signal and a set reference signal.

[0015] The present invention also provides a wafer sorting machine, comprising: A wafer aligner, wherein the wafer aligner is provided with a rotating tray; A manipulator, the manipulator comprising a manipulator arm and a fork, the fork being arranged horizontally, an elastic support body being arranged on the upper surface of the fork, the manipulator arm being connected to the fork and being suitable for driving the fork to move between a first position and a second position; In the system for detecting elastic support body sticking to wafer as described above, the sound sensor is arranged at a position set distance from the detection position, and the detection position is the overlapping position of the wafer edge on the supporting fork.

[0016] The method for detecting the adhesion of an elastic support body to a wafer provided by the present invention comprises the following steps: a sound sensor obtains a sound signal between an elastic support body and a wafer assembled by a manipulator fork during a period from a first position to a second position when the manipulator is carrying the wafer to a rotating tray of a wafer calibrator, and sends the sound signal to a controller, and the controller processes the collected sound signal with a preset reference signal to obtain the adhesion degree of the elastic support body to the wafer. Thus, the effect of online detection of whether the elastic support body is sticky during wafer transmission is achieved. Compared with manual observation of whether the elastic support body has a sticky phenomenon or engineering experience, the present invention automatically judges by detecting the sound signal during the transportation process, thereby avoiding the situation of inaccurate or untimely judgment, effectively improving work efficiency and detection quality, and being beneficial to the sorting and manufacturing of wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is one of the structural schematic diagrams of the wafer sorting machine provided by the embodiment of the present invention; Figure 2 This is the second structural schematic diagram of the wafer sorting machine provided by the embodiment of the present invention; Figure 3 This is the third structural schematic diagram of the wafer sorting machine provided by the embodiment of the present invention; Figure 4 It is a structural schematic diagram of the first position of the method for detecting the elastic support body adhering to the wafer provided by an embodiment of the present invention; Figure 5 It is a structural schematic diagram of the third position of the method for detecting the elastic support body adhering to the wafer provided by an embodiment of the present invention; Figure 6 It is a structural schematic diagram of the fourth position of the method for detecting the elastic support body adhering to the wafer provided by an embodiment of the present invention; Figure 7 It is a structural schematic diagram of the second position of the method for detecting the elastic support body adhering to the wafer provided by an embodiment of the present invention; Figure 8 is a structural schematic diagram of a system for detecting elastic support body adhering to a wafer provided by an embodiment of the present invention; Fig. 9 It is a schematic diagram of the structure of an electronic device provided by an embodiment of the present invention.

[0019] Reference numerals: 100, sound sensor; 110, signal amplification circuit; 120, AD collector; 130, DSP digital signal processor; 140, early warning device; 150, database; 200, wafer aligner; 210, rotating tray; 220, base; 300, manipulator; 310, mechanical arm; 320, fork; 321, elastic support body; 400, wafer; 500, wafer box. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] like Figures 1 to 7 As shown, the wafer sorting machine provided by the embodiment of the present invention includes a wafer aligner 200, a robot 300 and a system for detecting an elastic support body 321 adhering to the wafer 400, the wafer aligner 200 is provided with a rotating tray 210; the robot 300 includes a robot arm 310 and a support fork 320, the support fork 320 is horizontally arranged, and an elastic support body 321 is provided on the upper surface of the support fork 320, the robot arm 310 is connected to the support fork 320, and is suitable for driving the support fork 320 to move between a first position and a second position; the sound sensor 100 is arranged at a position set a distance from the detection position, and the detection position is the overlapping position of the edge of the wafer 400 on the support fork 320.

[0022] The wafer 400 sorting machine of the embodiment of the present invention is mainly composed of a wafer calibrator 200, a robot 300 and a system for detecting the elastic support body 321 adhering to the wafer 400. The robot 300 is mainly composed of a robot arm 310 and a support fork 320. The robot arm 310 can drive the support fork 320 to move horizontally and vertically. The support fork 320 is horizontally arranged and an elastic support body 321 is arranged on the upper surface. The support fork 320 supports the wafer 400 through the elastic support body 321, thereby driving the wafer 400 to move horizontally or vertically.

[0023] In the wafer 400 sorting machine, the wafer 400 is transported by the robot 300 taking the wafer 400 out of the wafer box 500, and the robot arm 310 drives the supporting fork 320 to support the wafer 400 and move horizontally to the first position, that is, above the wafer aligner 200, the robot 300 stops and then the robot arm 310 drives the supporting fork 320 to support the wafer 400 and move vertically downward, and the lower surface of the wafer 400 gradually approaches the rotating tray 210 of the wafer aligner 200, the rotating tray 210 holds the wafer 400, and the robot 300 continues to move vertically downward until the elastic support body 321 is detached from the wafer 400, and the robot 300 moves downward to the second position, that is, it stops after a certain distance from the wafer 400 and moves on other tracks.

[0024] In the process from the first position to the second position, the wafer 400 is transferred from the elastic support body 321 to the rotating tray 210, and the wafer 400 is transported to the wafer calibrator 200. After being calibrated by the wafer calibrator 200, it is sent back to the wafer box 500. A system for detecting the elastic support body 321 sticking to the wafer 400 is added to the wafer 400 sorting machine, wherein the sound sensor 100 is set at a position with a set distance from the detection position. The detection position is the overlap position of the edge of the wafer 400 on the fork 320. The detection position and the set distance are both conducive to the sound sensor 100 detecting the sound emitted by the robot 300 in the process of supporting the movement of the wafer 400. The sound signal between the first position and the second position collected by the sound sensor 100 is processed to reflect the degree of adhesion between the elastic support body 321 and the wafer 400.

[0025] In this embodiment, the vertical direction refers to a direction perpendicular to the upper surface of the rotating tray 210 of the wafer aligner 200 .

[0026] like Figures 1 to 8 As shown, a system for detecting elastic support body adhesion to wafers provided by an embodiment of the present invention includes a sound sensor 100 and a controller, wherein the sound sensor 100 is suitable for obtaining a sound signal between an elastic support body 321 assembled to a support fork 320 of a manipulator 300 and the wafer 400 during a process in which the wafer 400 is transported to a rotating tray 210 of a wafer calibrator 200 from a first position to a second position, wherein the first position is a stationary position where the elastic support body 321 assembled to a support fork 320 of a manipulator 300 supports the wafer 400 above the rotating tray 210, and the second position is a stationary position where the elastic support body 321 assembled to a support fork 320 of a manipulator 300 is detached from the wafer 400; the controller is electrically connected to the sound sensor 100, and is suitable for obtaining a degree of adhesion of the elastic support body 321 to the wafer 400 based on the sound signal and a set reference signal.

[0027] The system for detecting the adhesion of the elastic support body 321 to the wafer 400 according to the embodiment of the present invention is mainly composed of a sound sensor 100 and a controller. When the manipulator 300 transports the wafer 400 to the rotating tray 210 of the wafer calibrator 200, the sound sensor 100 can detect the sound signal between the manipulator 300 and the wafer 400 in the motion trajectory from the first position to the second position. The sound sensor 100 sends the collected sound signal to the controller, and the controller can process the sound signal, and finally compare the processed sound signal with the set reference signal to obtain the degree of adhesion of the elastic support body 321 to the wafer 400.

[0028] The tail section of the supporting fork 320 is connected to the robot arm 310. The area of ​​the wafer 400 is much larger than that of the supporting fork 320. Therefore, part of the edge of the wafer 400 falls on the tail section of the supporting fork 320. This position is defined as the detection position. The sound sensor 100 is set corresponding to the detection position and can collect sound signals most directly. The set distance is generally between 5cm and 7cm, which can ensure that the descending path of the supporting fork 320 is not affected by the sound sensor 100, and can also ensure that the sound signal is collected at a closer distance to avoid interference from other noises.

[0029] In this embodiment, the sound sensor 100 is disposed on the wafer aligner 200 and is located below the fork 320. In other embodiments, the sound sensor 100 may also be disposed on the side or above the fork 320 as long as the alignment detection position and the set distance are ensured.

[0030] The following is a description of a method for detecting the elastic support body 321 adhering to the wafer 400 provided by the present invention. The method for detecting the elastic support body 321 adhering to the wafer 400 described below and the system for detecting the elastic support body 321 adhering to the wafer 400 described above can correspond to each other.

[0031] like Figures 1 to 7 As shown, the method for detecting the elastic support body adhering to the wafer provided by the embodiment of the present invention comprises: Acquiring a sound signal between the elastic support body 321 assembled to the fork 320 of the robot 300 and the wafer 400 during the process of transporting the wafer 400 to the rotating tray 210 of the wafer aligner 200 from the first position to the second position, wherein the first position is a stationary position where the elastic support body 321 assembled to the fork 320 of the robot 300 supports the wafer 400 above the rotating tray 210, and the second position is a stationary position where the elastic support body 321 assembled to the fork 320 of the robot 300 is separated from the wafer 400; Based on the sound signal and the set reference signal, the adhesion degree of the elastic support body 321 to the wafer 400 is obtained.

[0032] In the method for detecting the adhesion of the elastic support body 321 to the wafer 400 according to the embodiment of the present invention, the sound sensor 100 obtains the sound signal between the elastic support body 321 assembled by the fork 320 of the manipulator 300 and the wafer 400 during the process of the manipulator 300 carrying the wafer 400 to the rotating tray 210 of the wafer calibrator 200 from the first position to the second position, and sends the sound signal to the controller, and the controller processes the collected sound signal with the preset reference signal to obtain the adhesion degree of the elastic support body 321 to the wafer 400. In this way, the effect of online detection of whether the elastic support body 321 is sticky during the transmission of the wafer 400 is achieved. Compared with whether the elastic support body 321 is sticky by manual observation or engineering experience, the present invention automatically judges by detecting the sound signal during the transportation process, avoiding the situation of inaccurate or untimely judgment, effectively improving the work efficiency and detection quality, and facilitating the sorting and manufacturing of the wafer 400.

[0033] In this embodiment, the sound sensor 100 can be used to detect the sound signal of the robot 300 driving the wafer 400 in the vertical direction from static, descending, the wafer 400 is placed on the rotating tray 210 of the wafer aligner 200, the elastic support body 321 is separated from the wafer 400, and descends to stop. The robot arm 310 is the actuator at the front end of the robot 300. The three elastic support bodies 321 are distributed on the front end of the fork 320. When the wafer 400 is transferred, the elastic support body 321 supports the lower surface of the wafer 400. The base 220 is equipped with the wafer aligner 200 and the sound sensor 100. The sound sensor 100 is as close to the wafer aligner 200 as possible. The rotating tray 210 is the actuator of the wafer aligner 200.

[0034] On the path of transporting the wafer 400 to the rotating tray 210 of the wafer calibrator 200, the first position is defined as the detection starting position, and the second position is defined as the detection ending position, that is, the sound sensor 100 can collect the sound signal on a path or several paths between the detection starting position and the detection ending position.

[0035] According to an embodiment provided by the present invention, obtaining a sound signal between the elastic support body 321 assembled by the fork 320 of the robot 300 and the wafer 400 during the process of transporting the wafer 400 to the rotating tray 210 of the wafer aligner 200 from the first position to the second position includes: Acquire the sound signal between the elastic support body 321 assembled on the fork 320 of the robot 300 and the wafer 400 during the process from the third position to the second position, wherein the third position is the position where the elastic support body 321 assembled on the fork 320 of the robot 300 supports the wafer 400 and contacts the rotating tray 210.

[0036] The robot 300 drives the wafer 400 to move downward from a static position above the wafer aligner 200 until the wafer 400 contacts the rotating tray 210, which is moving from the first position to the third position. At the third position, the elastic support body 321 on the fork 320 and the rotating tray 210 contact the lower surface of the wafer 400 together. The robot 300 continues to move downward. After the elastic support body 321 is separated from the wafer 400, only the rotating tray 210 contacts the lower surface of the wafer 400. When the robot 300 stops moving, it moves from the third position to the second position.

[0037] In this embodiment, the sound sensor 100 collects the sound signal when the robot 300 moves the wafer 400 from the third position to the second position. The sound signal between the elastic support body 321 and the wafer 400 from the third position to the second position can more directly reflect the degree of adhesion between the elastic support body 321 and the wafer 400. As the degree of adhesion changes, the sound signal will also change more obviously. Concentrated collection and processing of the sound signals of this part can improve the accuracy of detection.

[0038] In this embodiment, the determination of the third position can be triggered by a time condition. When the robot 300 supporting the wafer 400 is stationary at the first position, the distance between the robot 300 and the rotating tray 210 is fixed. Therefore, the moment when the robot 300 starts from the first position and moves downward at a set speed, the position reached after a set time is the third position.

[0039] According to an embodiment provided by the present invention, obtaining a sound signal between the elastic support body 321 assembled by the fork 320 of the robot 300 and the wafer 400 during the process of moving from the third position to the second position includes: Acquire the sound signal between the elastic support body 321 assembled on the fork 320 of the robot 300 and the wafer 400 during the process from the third position to the fourth position, wherein the fourth position is the position where the elastic support body 321 assembled on the fork 320 of the robot 300 is separated from the wafer 400.

[0040] The robot 300 drives the wafer 400 to move downward from a static position above the wafer aligner 200 until the wafer 400 contacts the rotating tray 210, which is moving from the first position to the third position. At the third position, the elastic support body 321 on the fork 320 and the rotating tray 210 contact the lower surface of the wafer 400 together. The robot 300 continues to move downward until the elastic support body 321 is separated from the wafer 400, which is moving from the third position to the fourth position. At the fourth position, only the rotating tray 210 contacts the lower surface of the wafer 400. The robot 300 continues to descend until it stops moving, which is moving from the fourth position to the second position.

[0041] In this embodiment, the path from the third position to the second position can be further divided into multiple paths to collect sound signals. The sound sensor 100 collects the sound signal of the manipulator 300 carrying the wafer 400 from the third position to the fourth position, and the sound signal between the elastic support 321 and the wafer 400 from the third position to the fourth position, which more directly reflects the degree of adhesion between the elastic support 321 and the wafer 400. As the degree of adhesion changes, the sound signal will also change significantly. Centrally collecting and processing the sound signal of this part can improve the accuracy of detection.

[0042] In this embodiment, the determination of the fourth position can be triggered by a stress condition or a weight condition. When the robot 300 supports the wafer 400, the stress or weight on the fork 320 is fixed or maintained within a certain range. Therefore, when the wafer 400 is completely supported on the rotating tray 210 and is separated from the elastic support body 321, the stress or weight of the fork 320 will change significantly. At this moment, the position of the robot 300 is the fourth position.

[0043] According to an embodiment provided by the present invention, obtaining a sound signal between the elastic support body 321 assembled by the fork 320 of the robot 300 and the wafer 400 during the process of transporting the wafer 400 to the rotating tray 210 of the wafer aligner 200 from the first position to the second position also includes: Acquire a sound signal between the elastic support body 321 assembled by the fork 320 of the robot 300 and the wafer 400 in at least one process from the first position to the third position and from the fourth position to the second position.

[0044] The robot 300 drives the wafer 400 to move downward from a static position above the wafer aligner 200 until the wafer 400 contacts the rotating tray 210, which is moving from the first position to the third position. At the third position, the elastic support body 321 on the fork 320 and the rotating tray 210 contact the lower surface of the wafer 400 together. The robot 300 continues to move downward until the elastic support body 321 is separated from the wafer 400, which is moving from the third position to the fourth position. At the fourth position, only the rotating tray 210 contacts the lower surface of the wafer 400. The robot 300 continues to descend until it stops moving, which is moving from the fourth position to the second position.

[0045] In this embodiment, in order to ensure the accuracy of the sound signal throughout the entire process from the first position to the second position, sound signals can be further acquired for one or more processes from the first position to the third position and from the fourth position to the second position. On the basis of acquiring the sound signal from the third position to the fourth position, the sound signals before the wafer 400 contacts the rotating tray 210 and after the wafer 400 has separated from the robot 300 are added as a comparison. This allows for more direct selection and correction of the sound signal of the entire process of transporting the wafer 400, and for determining the degree of adhesion between the reaction elastic support body 321 and the wafer 400. As the degree of adhesion changes, the sound signal will also change significantly. Concentrated collection and processing of the sound signals of this part can improve the accuracy of detection.

[0046] According to an embodiment provided by the present invention, based on the sound signal and the set reference signal, obtaining the adhesion degree of the elastic support body 321 to the wafer 400 includes: Process the sound signal to obtain a digital signal; The digital signal is compared with the set reference signal to obtain the adhesion degree of the elastic support body 321 to the wafer 400 .

[0047] In this embodiment, the controller pre-stores a set basic signal. After receiving the sound signal emitted by the sound sensor 100, the sound signal is processed to obtain a digital signal, and then the digital signal is compared with the set basic signal. The degree of adhesion of the elastic support body 321 to the wafer 400 can be determined through the comparison result.

[0048] If the basic signal is set to a parameter range, and the digital signal exceeds this parameter range, it proves that the elastic support body 321 is sticky to the wafer 400. The degree of excess can reflect the degree of adhesion, and whether to replace the elastic support body 321 is determined based on the degree of excess. If it does not exceed this parameter range, it proves that the star support body is not sticky to the wafer 400 and there is no need to replace the elastic support body 321.

[0049] According to an embodiment provided by the present invention, processing the sound signal to obtain the digital signal includes: Processing sound signals to form analog signals; amplifying the analog signal to obtain an amplified signal; Performing analog-to-digital conversion on the amplified signal to obtain an initial digital signal; The characteristic signal of the initial digital signal is extracted and processed to obtain a digital signal.

[0050] In this embodiment, when the controller processes the sound signal to obtain a digital signal, the sound signal is output as an analog signal of a voltage, and then the analog signal is amplified by the signal amplification circuit 110 to form an amplified signal, and the amplified signal is converted into an initial digital signal by the AD collector 120, and finally the initial digital signal is processed into a digital signal by the DSP digital signal processor 130.

[0051] The AD collector 120 uses a specific sampling rate and resolution during the process to ensure that the collected sound signal can truly reflect the state of the elastic support body 321. The DSP digital signal processor 130 performs preliminary processing on the initial digital signal, such as filtering, amplification or noise reduction, to improve the signal quality, and extracts useful information or features from the signal, such as frequency, amplitude, phase, etc., for subsequent analysis or decision-making.

[0052] According to an embodiment provided by the present invention, the characteristic signal includes at least one characteristic signal of amplitude, frequency, phase, waveform, and harmonics. In this embodiment, the sound sensor 100 can obtain the waveform, loudness, amplitude, frequency, etc. of the sound as the sound signal, and after processing the corresponding signal, at least one characteristic signal of amplitude, frequency, phase, waveform, and harmonics can be obtained. Accordingly, the setting reference signal is also adjusted with the change of the characteristic signal.

[0053] According to an embodiment provided by the present invention, the method for detecting that the elastic support body is adhered to the wafer further includes: Based on the degree of adhesion of the elastic support body 321 to the wafer 400 , a warning message is issued.

[0054] In this embodiment, after the controller obtains the degree of adhesion of the elastic support body 321 to the wafer 400 based on the sound signal and the set reference signal, it can also issue a warning message through the display or the alarm 140, indicating that the elastic support body 321 must be replaced, thereby realizing the online detection and warning function.

[0055] The sound sensor 100 detects the sound signal output voltage as an analog signal. After the analog signal is generated by the signal amplification circuit 110, the AD collector 120, and the DSP digital signal processor 130, it is compared with the set reference signal I0 pre-stored in the database 150 to determine the situation of exceeding the signal △I. When the elastic support body 321 and the wafer 400 are sticky, the digital signal I1 will have an abnormal change, and the change of exceeding the signal △I is obvious. The machine displays the elastic support body 321 sticking alarm information and the information of replacing the elastic support body 321.

[0056] Fig. 9An example of a physical structure diagram of an electronic device is shown, and the electronic device may include: a processor 810, a communication interface 820, a memory 830, and a communication bus 840, wherein the processor 810, the communication interface 820, and the memory 830 communicate with each other through the communication bus 840. The processor 810 may call the logic instructions in the memory 830 to execute the method for detecting the elastic support body sticking to the wafer.

[0057] In addition, the logic instructions in the above-mentioned memory 830 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when it is sold or used as an independent product. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art or the part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0058] On the other hand, the present invention also provides a computer program product, which includes a computer program. The computer program can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the methods provided by the above methods for detecting elastic support bodies sticking to wafers.

[0059] On the other hand, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which is implemented when the computer program is executed by a processor to execute the methods provided by the above methods for detecting elastic support bodies adhering to wafers.

[0060] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Those of ordinary skill in the art may understand and implement it without creative work.

[0061] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for detecting elastic support body sticking to wafer, characterized in that: include: Acquiring a sound signal between an elastic support body of a robot fork and a wafer during a process of transporting a wafer to a rotating tray of a wafer calibrator from a first position to a second position, wherein the first position is a stationary position where the elastic support body of the robot fork supports the wafer above the rotating tray, and the second position is a stationary position where the elastic support body of the robot fork is separated from the wafer; Based on the sound signal and the set reference signal, the adhesion degree of the elastic support body to the wafer is obtained.

2. The method for detecting elastic support body adhering to wafer according to claim 1, characterized in that: The acquisition of the sound signal between the elastic support body of the robot fork assembly and the wafer during the process of transferring the wafer to the rotating tray of the wafer aligner from the first position to the second position includes: Acquire a sound signal between the elastic support body of the robot fork assembly and the wafer during the process from the third position to the second position, wherein the third position is the position where the elastic support body of the robot fork assembly supports the wafer to contact the rotating tray.

3. The method for detecting elastic support body adhering to wafer according to claim 2, characterized in that: The step of obtaining a sound signal between the elastic support body of the robot fork assembly and the wafer during the process of moving from the third position to the second position comprises: Acquire a sound signal between the elastic support body of the robot fork assembly and the wafer during the process from the third position to the fourth position, wherein the fourth position is the position where the elastic support body of the robot fork assembly is separated from the wafer.

4. The method for detecting elastic support body adhering to wafer according to claim 3, characterized in that: The process of obtaining the sound signal between the elastic support body of the robot fork assembly and the wafer during the process of transferring the wafer to the rotating tray of the wafer aligner from the first position to the second position also includes: Acquire a sound signal between the elastic support body of the robot fork assembly and the wafer in at least one process from the first position to the third position and from the fourth position to the second position.

5. The method for detecting elastic support body adhering to wafer according to any one of claims 1 to 4, characterized in that: The step of obtaining the adhesion degree of the elastic support body to the wafer based on the sound signal and the set reference signal includes: Processing the sound signal to obtain a digital signal; The digital signal is compared with the set reference signal to obtain the degree of adhesion of the elastic support body to the wafer.

6. The method for detecting elastic support body adhering to wafer according to claim 5, characterized in that: The processing of the sound signal to obtain a digital signal comprises: Processing the sound signal to form an analog signal; amplifying the analog signal to obtain an amplified signal; Performing analog-to-digital conversion on the amplified signal to obtain an initial digital signal; The characteristic signal of the initial digital signal is extracted and processed to obtain a digital signal.

7. The method for detecting elastic support body adhering to wafer according to claim 6, characterized in that: The characteristic signal includes at least one characteristic signal of amplitude, frequency, phase, waveform, and harmonics.

8. The method for detecting elastic support body adhering to wafer according to claim 5, characterized in that: Also includes: Based on the degree of adhesion of the elastic support body to the wafer, a warning message is issued.

9. A system for detecting elastic support body sticking to wafer, characterized in that: include: A sound sensor is adapted to obtain a sound signal between an elastic support body of a robot fork and a wafer during a process in which the wafer is transported to a rotating tray of a wafer calibrator from a first position to a second position, wherein the first position is a stationary position where the elastic support body of the robot fork supports the wafer above the rotating tray, and the second position is a stationary position where the elastic support body of the robot fork is separated from the wafer; A controller is electrically connected to the sound sensor and is suitable for obtaining the degree of adhesion of the elastic support body to the wafer based on the sound signal and a set reference signal.

10. A wafer sorting machine, characterized in that: include: A wafer aligner, wherein the wafer aligner is provided with a rotating tray; A manipulator, the manipulator comprising a manipulator arm and a fork, the fork being arranged horizontally, an elastic support body being arranged on the upper surface of the fork, the manipulator arm being connected to the fork and being suitable for driving the fork to move between a first position and a second position; According to the system for detecting elastic support bodies adhering to wafers as described in claim 9, the sound sensor is arranged at a position set distance from a detection position, and the detection position is the overlapping position of the wafer edge on the support fork.

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