Cleaning device of wafer spraying equipment

Abstract

The invention provides a wafer spraying equipment cleaning device which comprises a nozzle cleaning mechanism, the nozzle cleaning mechanism is located on the outer side of wafer spraying equipment and comprises a liquid container with an open upper side, a vertical partition plate is arranged in an inner cavity of the liquid container, and a nozzle cleaning inner groove and an overflow outer groove are formed; the upper part of the partition plate is provided with an overflow part for liquid to overflow from the nozzle cleaning inner tank to the overflow outer tank, the nozzle cleaning inner tank is provided with a water inlet and a water outlet, and the overflow outer tank is provided with an overflow water outlet; the spraying arm cleaning mechanism comprises a spraying piece used for spraying downwards, the spraying piece is located above a wafer supporting mechanism of the wafer spraying equipment, and the spraying range of the spraying piece does not exceed the working range of a liquid classified recycling and discharging mechanism below the wafer supporting mechanism. The spraying arm and the nozzles on the spraying arm can be cleaned respectively, so that process liquid water mist attached to the surfaces of the spraying arm and the nozzles can be cleaned in time.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor cleaning, and in particular relates to a wafer spray equipment cleaning device. Background Art

[0002] If the wafer is contaminated by dust particles or metal during the manufacturing process, it can easily damage the internal circuit function of the chip, causing a short circuit or open circuit, leading to the failure of the integrated circuit. Therefore, in addition to eliminating external pollution sources, the wafer must be cleaned by wafer spray equipment before processes such as high-temperature diffusion and ion implantation.

[0003] During cleaning, the clean water nozzle and process liquid nozzle on the spray arm spray clean water and process liquid to the wafer respectively. Among them, the process liquid nozzle is in the form of a spray. A small amount of process liquid will adhere to the two nozzles in a single spraying. This is not a problem in itself. The problem is that after multiple processes, the process liquid on the two nozzles will form droplets, which poses a risk of dripping. For example, during the clean water spraying stage, if droplets drip at this time, there is a risk of contamination, and crystals may form on the nozzles over time. Crystal particles may fall onto the wafer, affecting the wafer yield. Similarly, the spray arm also has the above problems.

[0004] There is currently no corresponding device that can clean the spray arm and the nozzle thereon separately. Summary of the invention

[0005] Based on this, in order to solve the above technical problems, a wafer spray equipment cleaning device is provided.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A wafer spray equipment cleaning device, characterized by comprising:

[0008] A nozzle cleaning mechanism, the nozzle cleaning mechanism is located outside the wafer spraying device, and includes a liquid container with an open upper side, the inner cavity of the liquid container has a vertical partition, forming a nozzle cleaning inner tank and an overflow outer tank, the upper part of the partition has an overflow portion for liquid to overflow from the nozzle cleaning inner tank to the overflow outer tank, the nozzle cleaning inner tank has a water inlet and a drain port, and the overflow outer tank has an overflow drain port;

[0009] A spray arm cleaning mechanism, wherein the spray arm cleaning mechanism comprises a spray component for spraying downwards, wherein the spray component is located above the wafer support mechanism of the wafer spraying equipment, and its spraying range does not exceed the working range of the liquid classification, recovery and discharge mechanism below the wafer support mechanism.

[0010] The present invention can clean the spray arm and the nozzle thereon respectively, so as to timely clean the process liquid mist attached to the surfaces of both. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of the present invention;

[0012] Figure 2 It is a structural schematic diagram of the nozzle cleaning mechanism of the present invention;

[0013] Figure 3 It is a schematic diagram of the structure of the spray arm cleaning mechanism of the present invention when viewed from above. DETAILED DESCRIPTION

[0014] The following will illustrate the implementation methods of the present invention in conjunction with the drawings in the specification. It should be noted that the implementation methods involved in this specification are not exhaustive and do not represent the only implementation methods of the present invention. The following corresponding embodiments are only for the purpose of clearly illustrating the invention content of the patent of the present invention, and are not intended to limit its implementation methods. For ordinary technicians in this field, different forms of changes and modifications can be made on the basis of the description of this embodiment. All obvious changes or modifications that belong to the technical concept and invention content of the present invention are also within the scope of protection of the present invention.

[0015] Figure 1 The application environment of the embodiment of the present application is shown. Among them, the wafer spraying equipment includes a wafer support mechanism (not shown in the figure), an FFU (Fan Filter Unit) fan filter unit 21, a liquid classification recovery and discharge mechanism 22, a spray arm 23 and a process arm 24, the wafer support mechanism is located in the process area, the FFU fan filter unit 21 is located above the wafer support mechanism, and is used to provide clean air, the liquid classification recovery and discharge mechanism 22 is located below the wafer support mechanism, and is used to classify, recover and discharge process waste liquid, and the spray arm 23 has a nozzle 23a (clean water nozzle and process liquid nozzle) on it, which is used to spray clean water and process liquid to the wafer on the wafer support mechanism, respectively, and the process arm 24 is used to implement other processes, which are not specifically limited here.

[0016] like Figure 1 As shown, an embodiment of the present application provides a wafer spray equipment cleaning device, including a nozzle cleaning mechanism 1100 and a spray arm cleaning mechanism 1200 .

[0017] like Figure 2 As shown, the nozzle cleaning mechanism 1100 is located outside the wafer spraying equipment, and includes a liquid container 1110 with an open upper side. The inner cavity of the liquid container 1110 has a vertical partition 1111. The inner cavity of the liquid container 1110 is divided by the partition 1111 to form a nozzle cleaning inner tank 1112 and an overflow outer tank 1113.

[0018] The upper portion of the partition 1111 has an overflow portion for allowing liquid to overflow from the nozzle cleaning inner tank 1112 to the overflow outer tank 1113 .

[0019] In this embodiment, the upper edge of the partition 1111 is used as an overflow portion, which is lower than the edge of the upper opening of the liquid container 1110. When the water level in the nozzle cleaning inner tank 1112 is higher than the upper edge of the partition 1111, the liquid in the nozzle cleaning inner tank 1112 naturally overflows to the overflow outer tank 1113. Of course, an opening can also be provided on the partition 1111 to serve as an overflow portion.

[0020] Among them, the upper edge of the partition 1111 forms a toothed structure 1111a, which is easy to break the tension of water, accelerate the occurrence of overflow, and improve the cleaning effect. On the contrary, if the upper edge of the partition 1111 is a plane, the water level needs to reach a higher height to break the tension.

[0021] The nozzle cleaning inner tank 1112 has a water inlet 1112a and a water outlet 1112b. To avoid incomplete drainage, the water outlet 1112b needs to be located at the bottom of the nozzle cleaning inner tank 1112. In this embodiment, the lower part of the nozzle cleaning inner tank 1112 forms a water inlet and outlet pipe 1114 extending downward, the water inlet 1112a is located at the upper part of the water inlet and outlet pipe 1114, and the water outlet 1112b is located at the lower part of the water inlet and outlet pipe 1114.

[0022] The bottom of the overflow outer tank 1113 has an overflow drain port 1113a.

[0023] When cleaning the nozzle on the spray arm 23, close the drain port 1112b, and continuously deliver clean water to the nozzle cleaning inner tank 1112 through the water inlet 1112a, so that the clean water continuously overflows to the overflow outer tank 1113, forming a flow of clean water. At the same time, the spray arm 23 moves the nozzle 23a to the slot of the nozzle cleaning inner tank 1112, so that the nozzle 23a is immersed in the clean water, and the flowing clean water removes the process liquid mist attached to the nozzle 23a, so that the cleaning is thorough and the effect is good.

[0024] The clean water in the overflow outer tank 1113 is discharged from the overflow drain port 1113a.

[0025] The liquid container 1110 has an upwardly extending splash shield 1115 on its circumferential surface. The nozzle 23a on the spray arm 23 will briefly spray liquid for a few seconds at the origin position (where the liquid container 1110 is located) before officially spraying liquid. The splash shield 1115 can prevent the process liquid from splashing into the process area.

[0026] like Figure 3As shown, the spray arm cleaning mechanism 1200 includes a spray member 1210 for spraying downwards. The spray member 1210 is located above the wafer support mechanism, and its spraying range does not exceed the working range of the liquid classification, recovery and discharge mechanism 22 below the wafer support mechanism.

[0027] The spraying member 1210 is formed by a horizontally coiled tube, and the lower peripheral surface of the tube has a plurality of spraying holes 1211 evenly spaced.

[0028] In this embodiment, the tube body is fixed to the grid air outlet of the FFU fan filter unit 21 through a support frame 1220 .

[0029] Specifically, Figure 3 As shown, the support frame 1220 includes four horizontal support rods 1221 .

[0030] One ends of the four support rods 1221 are connected to each other in a cross shape. The lower side of each support rod 1221 has a plurality of first grooves evenly spaced along its length, and the horizontally coiled tube body is fixed in the plurality of first grooves.

[0031] The lower side of the other end of each support rod 1221 has a second groove 1221a, and the second groove 1221a has a through hole in the up-and-down direction. The support frame 1220 is fixed to the grid air outlet by screws passing through the through holes.

[0032] After the wafer spraying is completed, the spray arm 23 remains above the wafer support mechanism, and the spray component 1210 sprays clean water to the spray arm 23 to clean it, remove the process liquid mist attached to it, and clean the fallen waste liquid into the liquid classification recovery and discharge mechanism 22.

[0033] It can be seen from the above that the wafer spray equipment cleaning device provided in the embodiment of the present application can clean the spray arm and the nozzle thereon separately, so as to promptly clean off the process liquid mist attached to the surfaces of both.

[0034] Obviously, those skilled in the art should realize that the above embodiments are only used to illustrate the present invention, and are not used to limit the present invention. As long as they are within the spirit of the present invention, any changes and modifications to the above embodiments will fall within the scope of the claims of the present invention.

Claims

1. A wafer spray equipment cleaning device, characterized in that: include: A nozzle cleaning mechanism, the nozzle cleaning mechanism is located outside the wafer spraying device, and includes a liquid container with an open upper side, the inner cavity of the liquid container has a vertical partition, forming a nozzle cleaning inner tank and an overflow outer tank, the upper part of the partition has an overflow portion for liquid to overflow from the nozzle cleaning inner tank to the overflow outer tank, the nozzle cleaning inner tank has a water inlet and a drain port, and the overflow outer tank has an overflow drain port; A spray arm cleaning mechanism, wherein the spray arm cleaning mechanism comprises a spray component for spraying downwards, wherein the spray component is located above the wafer support mechanism of the wafer spraying equipment, and its spraying range does not exceed the working range of the liquid classification, recovery and discharge mechanism below the wafer support mechanism.

2. A wafer spray equipment cleaning device according to claim 1, characterized in that: The upper edge of the partition is the overflow portion, which is lower than the edge of the upper opening of the liquid container.

3. A wafer spray equipment cleaning device according to claim 2, characterized in that: The upper edge of the partition forms a tooth-like structure.

4. The wafer spray equipment cleaning device according to claim 1, characterized in that: The drain port is located at the bottom of the nozzle cleaning inner tank.

5. A wafer spray equipment cleaning device according to claim 4, characterized in that: The lower part of the nozzle cleaning inner tank forms an inlet and outlet water pipe extending downward, and the water inlet and the water outlet are located on the inlet and outlet water pipe.

6. The wafer spray equipment cleaning device according to claim 1, characterized in that: The liquid container is provided with an upwardly extending anti-splashing baffle plate on its circumferential surface for preventing the chemical liquid from splashing onto the process area of ​​the wafer spraying equipment.

7. The wafer spray equipment cleaning device according to claim 1, characterized in that: The spraying member is formed by a horizontally coiled tube body, and the lower peripheral surface of the tube body is provided with a plurality of spraying holes arranged at even intervals.

8. A wafer spray equipment cleaning device according to claim 7, characterized in that: The tube body is fixed on the grid air outlet of the FFU fan filter unit of the wafer spraying equipment through a support frame.

9. A wafer spray equipment cleaning device according to claim 8, characterized in that: The support frame includes four horizontal support rods, one ends of which are interconnected to form a cross shape, the lower side of the support rod has a plurality of first grooves evenly spaced along its length, the horizontally coiled tube body is fixed in the plurality of first grooves, the support rod has through holes in the up and down directions, and the support frame is fixed to the grille air outlet by screws passing through the through holes.

Images