The invention relates to a slicing device, in particular to a silicon wafer slicing device for bipolar transistor production. The invention provides the silicon wafer slicing device, which can be usedfor uniformly cutting a silicon wafer and can be labor-saving, for the bipolar transistor production. In order to solve the technical problem, the silicon wafer slicing device for the bipolar transistor production, provided by the invention, comprises an installation rack, wherein a through hole is formed in a left side of the bottom part of the installation rack, a cutting mechanism is arrangedat an upper part of the installation rack, a push mechanism is arranged at a lower part of the installation rack, and the push mechanism is matched with the cutting mechanism. The silicon wafer slicing device for the bipolar transistor production is arranged, the push mechanism and the cutting mechanism are arranged, a silicon body can be constantly cut and sliced by a cutter, so that the operation of silicon body slicing is completed; and a belt pulley and a flat belt are arranged, the silicon body is not needed to be pushed by manual, so that the silicon wafer cutting is more accurate and uniform, and the working efficiency is further improved.