A plasma polishing machine

Abstract

The present invention discloses a plasma polishing machine, comprising a vacuum chamber, a bracket, an angle adjustment mechanism, a multi-axis motion mechanism, a data processing unit and a numerical control system. The bracket is located in the vacuum chamber; the angle adjustment mechanism is used to adjust the inclination angle of the workpiece to be polished; the multi-axis motion mechanism is arranged on a side opposite to the bracket in the vacuum chamber, and is equipped with an ion source and a measuring probe, and the measuring probe is moved to multiple positions on the surface of the workpiece to be polished through the multi-axis motion mechanism to obtain the coordinate values ​​of the surface of the workpiece to be polished at multiple different positions in the thickness direction; the data processing unit analyzes the coordinate values ​​to calculate the inclination angle of the workpiece to be polished; the numerical control system controls the angle adjustment mechanism according to the inclination angle provided by the data processing unit to adjust the inclination angle of the workpiece to be polished, thereby reducing the dependence on the professional skills and experience of the operator, reducing the intensity of manual operation and the incidence of human errors, and effectively improving the processing efficiency and precision.

Description

Technical Field

[0001] The invention relates to the technical field of polishing equipment, in particular to a plasma polishing machine. Background Art

[0002] Plasma polishing machine is an advanced processing equipment that uses rare gas ions to bombard the surface of optical lenses to achieve atomic-level material removal. This technology represents the highest level in the current field of optical processing and has significant technical advantages. Its non-contact polishing method effectively avoids the defects that may occur in traditional processing methods, which makes the optical surface less susceptible to damage during the polishing process. In addition, the plasma polishing machine can efficiently remove contaminants such as metal ions remaining on the optical surface, while trimming the surface shape of the workpiece to ensure the quality of the final product.

[0003] The working principle of plasma polishing machine relies on the focused ion beam generated by the ion source device to bombard the workpiece surface. In this process, the ion beam interacts with the material surface in a complex manner, which can effectively remove surface defects, oxide layers and other irregularities. This sophisticated processing method makes the plasma polisher perform well in achieving high-precision surface finish. It is widely used in the manufacture and repair of optical components, providing strong technical support for improving the performance and reliability of optical products.

[0004] In order to ensure the high precision and convergence efficiency of the plasma polisher during processing, the workpiece must be leveled before processing. At present, most workpiece leveling methods still use the traditional method of "hitting the table + padding". Specifically, the workpiece and its fixture are placed on the workbench, and the operator measures the workpiece surface with a micrometer. During this process, the operator needs to punch multiple measuring points in the horizontal and vertical directions of the workpiece to determine the tilt state of the workpiece through the readings of the micrometer. Next, the operator will pad the low point of the workpiece to achieve leveling.

[0005] However, the above leveling process is not only labor-intensive and inefficient, but also requires extremely high professional skills and experience from the operator. Due to the reliance on manual measurement and adjustment, human errors are prone to occur, thus affecting the processing accuracy and efficiency of the plasma polisher. In addition, long-term repetitive operations make the operator prone to fatigue, further increasing the possibility of errors. Summary of the invention

[0006] In order to solve the above technical problems, the purpose of the present invention is to provide a plasma polishing machine, which can greatly reduce the intensity of manual labor and reduce the incidence of human errors, thereby improving the processing efficiency and processing accuracy of the plasma polishing machine.

[0007] The technical solution provided by the present invention is as follows:

[0008] A plasma polishing machine, comprising:

[0009] Vacuum chamber;

[0010] A bracket, located in the vacuum chamber, for supporting a workpiece to be polished;

[0011] An angle adjustment mechanism, used to adjust the inclination angle of the workpiece to be polished;

[0012] A multi-axis motion mechanism is arranged on a side of the vacuum chamber opposite to the bracket and is equipped with an ion source and a measuring probe, wherein the measuring probe is moved to multiple positions on the surface of the workpiece to be polished through the multi-axis motion mechanism to obtain coordinate values ​​of the surface of the workpiece to be polished at multiple different positions in the thickness direction of the workpiece to be polished;

[0013] a data processing unit, receiving and analyzing the coordinate values ​​from the measuring probe to calculate the tilt angle of the workpiece to be polished;

[0014] The numerical control system controls the angle adjustment mechanism according to the inclination angle provided by the data processing unit to adjust the inclination angle of the workpiece to be polished.

[0015] Further, an O-XYZ coordinate system is established with the center coordinate position of the workpiece to be polished, wherein the width direction of the surface of the workpiece to be polished is the X-axis, the length direction of the surface of the workpiece to be polished is the Y-axis, and the thickness direction of the workpiece to be polished is the Z-axis;

[0016] The measuring probe moves along the X-axis through the multi-axis motion mechanism to obtain Z coordinate values ​​of a plurality of different positions of the surface of the workpiece to be polished in the X-axis direction, and the data processing unit receives and analyzes the Z coordinate value from the measuring probe to calculate the inclination angle of the workpiece to be polished in the X-axis direction;

[0017] The measuring probe moves along the Y-axis through the multi-axis motion mechanism to obtain Z coordinate values ​​of a plurality of different positions of the surface of the workpiece to be polished in the Y-axis direction. The data processing unit receives and analyzes the Z coordinate value from the measuring probe to calculate the inclination angle of the workpiece to be polished in the Y-axis direction.

[0018] Furthermore, the measuring probe moves to multiple positions of the contour edge of the workpiece to be polished through the multi-axis motion mechanism to obtain the coordinate value of the contour edge of the workpiece to be polished, and the data processing unit receives and analyzes the coordinate value from the measuring probe to calculate the center coordinate value of the workpiece to be polished.

[0019] Furthermore, the multi-axis motion mechanism is also equipped with an industrial camera, which moves to the contour edge of the workpiece to be polished through the multi-axis motion mechanism to obtain image data of the contour edge of the workpiece to be polished, and the data processing unit receives and analyzes the image data from the industrial camera to calculate the center coordinate value of the workpiece to be polished.

[0020] Further, the angle adjustment mechanism is arranged below the bracket, and the bracket comprises:

[0021] Workpiece carrier;

[0022] A workpiece clamp is arranged above the workpiece bearing platform and is used for clamping the workpiece to be polished.

[0023] Furthermore, the angle adjustment mechanism comprises:

[0024] A base, arranged on the bottom plate of the vacuum chamber;

[0025] A side plate connected to the base;

[0026] A fixed plate, arranged above the base through the side plates, and the workpiece bearing platform is arranged above the fixed plate;

[0027] Two lifting devices are respectively arranged at diagonal positions of the base, and each of the lifting devices comprises a lifting shaft, and a lifting end of the lifting shaft passes through the fixing plate and extends to the workpiece bearing platform.

[0028] Furthermore, each of the lifting devices comprises:

[0029] A guide rail, arranged on the base;

[0030] A slider, slidably mounted on the guide rail;

[0031] A driving device, a driving end of which is connected to the slider and is used to drive the slider to move;

[0032] A wedge block is arranged on the slider and moves synchronously with the slider;

[0033] A rolling element, located at the opposite end of the lifting end, abuts against the end surface of the wedge block;

[0034] When the wedge block moves with the sliding block, the lifting shaft slides along the end surface of the wedge block through the rolling element to realize the up and down movement of the lifting shaft.

[0035] Furthermore, the taper angle of the wedge block is set to 1:10.

[0036] Furthermore, the angle adjustment mechanism further comprises a pillar, which is arranged at a corner point of the fixed plate away from the two lifting shafts, one end of the pillar is connected to the fixed plate, and the other end is movably connected to the lower surface of the workpiece bearing platform;

[0037] The up and down movement of the lifting shaft drives the workpiece bearing platform to adjust the tilt angle with the support pillar as the fulcrum.

[0038] Furthermore, a guide sleeve is provided at a position of the fixing plate corresponding to the lifting shaft, and the lifting shaft is movably inserted into the guide sleeve;

[0039] And / or, an elastic member is provided between the fixing plate and the workpiece bearing platform;

[0040] And / or, the vacuum chamber is connected to a vacuum device.

[0041] Compared with the prior art, the plasma polishing machine provided by the embodiment of the present invention has at least the following technical effects:

[0042] The plasma polishing machine includes a vacuum chamber, a bracket, an angle adjustment mechanism, a multi-axis motion mechanism, a data processing unit and a numerical control system. The bracket is located in the vacuum chamber and is used to support the workpiece to be polished; the angle adjustment mechanism is used to adjust the inclination angle of the workpiece to be polished; the multi-axis motion mechanism is arranged on the side opposite to the bracket in the vacuum chamber, and is equipped with an ion source and a measuring probe, and the measuring probe moves to multiple positions on the surface of the workpiece to be polished through the multi-axis motion mechanism to obtain the coordinate values ​​of the surface of the workpiece to be polished at multiple different positions in the thickness direction of the workpiece to be polished; the data processing unit receives and analyzes the coordinate values ​​from the measuring probe to calculate the inclination angle of the workpiece to be polished; the numerical control system controls the angle adjustment mechanism according to the inclination angle provided by the data processing unit to adjust the inclination angle of the workpiece to be polished. Through the synergistic effect of the multi-axis motion mechanism, the measuring probe, the data processing unit, the numerical control system and the angle adjustment mechanism, the accurate measurement and effective leveling of the inclination angle of the workpiece to be polished are realized, so that the ion source can process the workpiece to be polished more accurately. Compared with the traditional "hitting the table + raising the height" leveling method, the automation degree of the polishing process is improved, the dependence on the operator's professional skills and experience is reduced, the intensity of manual operation is reduced, and the incidence of human errors is reduced, thereby effectively improving the processing efficiency and processing accuracy of the plasma polishing machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0044] Figure 1 It is a schematic diagram of the overall structure of a plasma polishing machine in one embodiment of the present invention;

[0045] Figure 2 It is a schematic diagram of the combined structure of the workpiece support platform and the angle adjustment mechanism in one embodiment of the present invention;

[0046] Figure 3 It is a schematic diagram of the overall structure of the angle adjustment mechanism in one embodiment of the present invention;

[0047] Figure 4 It is a schematic cross-sectional structure diagram of an angle adjustment mechanism in one embodiment of the present invention;

[0048] Figure 5 Schematic diagram of a measuring probe measuring method in one embodiment of the present invention.

[0049] Reference numerals:

[0050] 10. Vacuum chamber; 21. Workpiece carrier; 211. Spherical groove; 22. Workpiece fixture; 30. Workpiece to be polished; 40. Angle adjustment mechanism; 41. Base; 42. Side plate; 43. Fixed plate; 431. Guide sleeve; 432. Elastic member; 44. Lifting device; 441. Lifting shaft; 442. Guide rail; 443. Slider; 444. Driving device; 445. Wedge block; 446. Rolling element; 45. Pillar; 50. Multi-axis motion mechanism; 60. Ion source; 70. Measuring probe; 80. Industrial camera. DETAILED DESCRIPTION

[0051] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention are clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0052] It should be noted that when an element is referred to as being "fixed on" or "set on" another element, it can be directly on the other element or indirectly set on the other element; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0053] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0054] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" and "several" is two or more, unless otherwise clearly and specifically defined.

[0055] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0056] At present, there are two main structural forms of plasma polishing machines: horizontal structure and vertical structure.

[0057] In the horizontal structure, the workpiece to be processed is installed sideways on the workbench, with its processing surface facing left or right, and the ion source of the plasma polisher is arranged opposite to the workpiece to be polished, ensuring effective polishing operation. In the vertical structure, the workpiece to be processed is hung upside down on the top workbench, with its processing surface facing downward, and the ion source of the plasma polisher is vertically upward to ensure alignment with the processing surface of the workpiece to be polished. The present invention will be described in detail using the horizontal structure as an example, and the principle of its vertical structure is similar to it.

[0058] Please refer to the attached Figure 1 To Attachment Figure 5As shown, one embodiment of the present invention provides a plasma polisher. The plasma polisher includes a vacuum chamber 10, a bracket, an angle adjustment mechanism 40, a multi-axis motion mechanism 50, a data processing unit and a numerical control system. In the plasma polisher, the vacuum chamber 10 is used to create a stable vacuum processing environment. This is because the ion source 60, as a core component, has high requirements for the working environment and must operate stably in a high negative pressure environment. Therefore, the entire plasma polisher needs to be placed in a closed vacuum chamber 10 with a high negative pressure. In addition, the vacuum chamber 10 is connected to a vacuum device to maintain the vacuum environment required by the ion source 60.

[0059] It is further explained that the bracket is located in the vacuum chamber 10, and is used to stably support the workpiece 30 to be polished, ensuring that the workpiece 30 to be polished maintains its position stable during the polishing process. The angle adjustment mechanism 40 is used to adjust the inclination angle of the workpiece 30 to be polished to improve the accuracy of the processing. The multi-axis motion mechanism 50 is arranged on the side opposite to the bracket in the vacuum chamber 10, and is equipped with an ion source 60 and a measuring probe 70, so as to achieve the precise movement and positioning of the ion source 60 and the measuring probe 70 in multiple directions. Specifically, the measuring probe 70 moves to multiple positions on the surface of the workpiece 30 to be polished through the multi-axis motion mechanism 50 to obtain the coordinate values ​​of the surface of the workpiece 30 to be polished at multiple different positions in the thickness direction of the workpiece 30 to be polished. The data processing unit receives and analyzes the coordinate values ​​from the measuring probe 70 to calculate the inclination angle of the workpiece 30 to be polished. The numerical control system controls the angle adjustment mechanism 40 according to the inclination angle provided by the data processing unit to achieve the adjustment of the inclination angle of the workpiece 30 to be polished.

[0060] In this embodiment, the plasma polishing machine includes a vacuum chamber 10, a bracket, an angle adjustment mechanism 40, a multi-axis motion mechanism 50, a data processing unit and a numerical control system. The bracket is located in the vacuum chamber 10 and is used to support the workpiece 30 to be polished; the angle adjustment mechanism 40 is used to adjust the inclination angle of the workpiece 30 to be polished; the multi-axis motion mechanism 50 is arranged on the side opposite to the bracket in the vacuum chamber 10, and is equipped with an ion source 60 and a measuring probe 70, and the measuring probe 70 is moved to multiple positions on the surface of the workpiece 30 to be polished through the multi-axis motion mechanism 50 to obtain the coordinate values ​​of the surface of the workpiece 30 to be polished at multiple different positions in the thickness direction of the workpiece 30 to be polished; the data processing unit receives and analyzes the coordinate values ​​from the measuring probe 70 to calculate the inclination angle of the workpiece 30 to be polished; the numerical control system controls the angle adjustment mechanism 40 according to the inclination angle provided by the data processing unit to adjust the inclination angle of the workpiece 30 to be polished. Through the synergistic effect of the multi-axis motion mechanism 50, the measuring probe 70, the data processing unit, the numerical control system and the angle adjustment mechanism 40, the accurate measurement and effective leveling of the inclination angle of the workpiece 30 to be polished are achieved, so that the ion source 60 can more accurately process the workpiece 30 to be polished. Compared with the traditional "metering + padding" leveling method, the automation degree of the polishing process is improved, the dependence on the operator's professional skills and experience is reduced, the intensity of manual operation is reduced, and the incidence of human errors is reduced, thereby effectively improving the processing efficiency and processing accuracy of the plasma polishing machine.

[0061] In a specific embodiment, the multi-axis motion mechanism 50 is arranged on the left side of the vacuum chamber 10, and an ion source 60 and a measuring probe 70 are installed at its end. The bracket is arranged on the right side of the vacuum chamber 10. Under the control of the numerical control system, the ion source 60 can process the surface of the workpiece 30 to be polished through the multi-axis motion mechanism 50.

[0062] Before processing the workpiece 30 to be polished, its center position must be found first in order to determine the coordinate position of the workpiece 30 to be polished relative to the multi-axis motion mechanism 50. In some optional embodiments, an O-XYZ coordinate system is established with the center coordinate position of the workpiece 30 to be polished, wherein the width direction of the surface of the workpiece 30 to be polished is the X-axis, the length direction of the surface of the workpiece to be polished is the Y-axis, and the thickness direction of the workpiece 30 to be polished is the Z-axis; the measuring probe 70 moves along the X-axis through the multi-axis motion mechanism 50 to obtain the Z coordinate values ​​of the surface of the workpiece 30 to be polished at multiple different positions in the X-axis direction, and the data processing unit receives and analyzes the Z coordinate value from the measuring probe 70 to calculate the inclination angle of the workpiece 30 to be polished in the X-axis direction; the measuring probe 70 moves along the Y-axis through the multi-axis motion mechanism 50 to obtain the Z coordinate values ​​of the surface of the workpiece 30 to be polished at multiple different positions in the Y-axis direction, and the data processing unit receives and analyzes the Z coordinate value from the measuring probe 70 to calculate the inclination angle of the workpiece 30 to be polished in the Y-axis direction. It should be noted that the attached Figure 5 The black dots in the figure are the detection points corresponding to the measuring probe 70 .

[0063] In some optional embodiments, the measuring probe 70 is moved to multiple positions of the contour edge of the workpiece 30 to be polished through the multi-axis motion mechanism 50 to obtain the coordinate value of the contour edge of the workpiece 30 to be polished, and the data processing unit receives and analyzes the coordinate value from the measuring probe 70 to calculate the center coordinate value of the workpiece 30 to be polished. In this embodiment, the measuring probe 70 is used to detect the contour edge of the workpiece 30 to be polished multiple times to obtain the center coordinate value of the workpiece 30 to be polished. Since the measuring probe 70 itself has extremely high precision, combined with the comprehensive measurement of the entire contour boundary of the workpiece 30 to be polished by the measuring probe 70, through the data processing unit, a high-precision centering function is finally achieved. This embodiment is suitable for occasions with high requirements for processing accuracy, and can effectively improve processing quality and accuracy.

[0064] In some optional embodiments, the multi-axis motion mechanism 50 is also equipped with an industrial camera 80, which is moved to the contour edge of the workpiece to be polished 30 through the multi-axis motion mechanism 50 to obtain image data of the contour edge of the workpiece to be polished 30, and the data processing unit receives and analyzes the image data from the industrial camera 80 to calculate the center coordinate value of the workpiece to be polished 30. In this embodiment, the industrial camera 80 is used to collect the image of the contour edge of the workpiece to be polished 30 to obtain the center coordinate value of the workpiece to be polished 30. The operation is relatively simple and suitable for mass production and occasions with low processing accuracy requirements.

[0065] In practical applications, the operator can choose to obtain the center coordinate value of the workpiece 30 to be polished by precise measurement through the measuring probe 70 or by rapid shooting through the industrial camera 80 according to specific needs. Such a flexible selection method can meet different requirements of processing accuracy and efficiency.

[0066] In some optional embodiments, the angle adjustment mechanism 40 is disposed below the bracket, and the bracket includes a workpiece carrier 21 and a workpiece fixture 22; the workpiece fixture 22 is disposed above the workpiece carrier 21, and is used to clamp the workpiece to be polished 30. Specifically, the workpiece to be polished 30 is firmly fixed on the workpiece carrier 21 by the workpiece fixture 22, and is aligned with the ion source 60, the industrial camera 80, and the measurement probe 70 installed on the multi-axis motion mechanism 50.

[0067] In some optional embodiments, the angle adjustment mechanism 40 is disposed on the bottom plate of the vacuum chamber 10. The angle adjustment mechanism 40 includes a base 41, a side plate 42, a fixed plate 43 and two lifting devices 44. The base 41 is disposed on the bottom plate of the vacuum chamber 10; the side plate 42 is connected to the base 41, specifically, there are two side plates 42, which are respectively disposed on opposite sides of the base 41; the fixed plate 43 is disposed above the base 41 through the side plate 42, and is disposed parallel to the base 41, and the workpiece bearing platform 21 is disposed above the fixed plate 43; the two lifting devices 44 are respectively disposed at diagonal positions of the base 41, and each lifting device 44 includes a lifting shaft 441, and the lifting end of the lifting shaft 441 passes through the fixed plate 43 and extends to the workpiece bearing platform 21.

[0068] In some optional embodiments, each lifting device 44 includes a guide rail 442, a slider 443, a driving device 444, a wedge block 445 and a rolling element 446. The guide rail 442 is arranged on the base 41; the slider 443 is slidably mounted on the guide rail 442; the driving end of the driving device 444 is connected to the slider 443, and is used to drive the slider 443 to move; the wedge block 445 is arranged on the slider 443, and moves synchronously with the slider 443; the rolling element 446 is located at the opposite end of the lifting end, and abuts against the end surface of the wedge block 445. Among them, when the wedge block 445 moves with the slider 443, the lifting shaft 441 slides along the end surface of the wedge block 445 through the rolling element 446 to realize the up and down movement of the lifting shaft 441. Specifically, the driving device 444 can adopt a servo cylinder, and other high-precision drivers can also be selected.

[0069] In some optional embodiments, the rolling element 446 is a rolling bearing. When the wedge block 445 moves with the slider 443, the lifting shaft 441 slides along the end surface of the wedge block 445 through the rolling bearing, which can effectively reduce the wear of the wedge block 445.

[0070] In some optional embodiments, the end face of the wedge block 445 is designed as an inclined surface, and its taper angle can be adjusted according to the precision requirements. Preferably, the taper angle of the wedge block 445 is set to 1:10. When the wedge block 445 moves along the guide rail 442 with the slider 443, the lifting shaft 441 above the wedge block 445 will move up and down in the guide sleeve 431 of the fixed plate 43. When the wedge block 445 moves forward by 10 mm, the lifting shaft 441 will rise by 1 mm accordingly. This design improves the operating resolution of the lifting shaft 441, thereby achieving more precise control and adjustment.

[0071] In some optional embodiments, the angle adjustment mechanism 40 further includes a support 45, which is disposed at a corner point of the fixed plate 43 away from the two lifting shafts 441, one end of the support 45 is connected to the fixed plate 43, and the other end is movably connected to the lower surface of the workpiece carrier 21; the lifting shaft 441 moves up and down to drive the workpiece carrier 21 to adjust the tilt angle with the support 45 as the fulcrum. In a specific embodiment, when the lifting shaft 441 at one corner point moves up and down, it can drive the workpiece carrier 21 to perform tilt and swing motion in the Y-axis direction with the support 45 as the fulcrum. Similarly, when the lifting shaft 441 at another corner point moves up and down, it can drive the workpiece carrier 21 to perform tilt and swing motion in the X-axis direction with the support 45 as the fulcrum. In this way, the tilt angle adjustment of the workpiece carrier 21 and the workpiece 30 to be polished above can be achieved. It should be further explained that the upper end surface of the support 45 is designed to be spherical, and the lower surface of the workpiece supporting platform 21 is provided with a spherical groove 211 matching the spherical shape. This design allows the workpiece supporting platform 21 to be movably connected with the spherical shape of the support 45 through the spherical groove 211 on its lower surface.

[0072] In some optional embodiments, a guide sleeve 431 is provided at a position corresponding to the fixed plate 43 and the lifting shaft 441, and the lifting shaft 441 is movably inserted into the guide sleeve 431. The guide sleeve 431 is a hollow wear-resistant sleeve, which can be, but not limited to, a linear bearing or an oil-free brass bushing. The lifting end surface of the lifting shaft 441 is designed to be spherical, and the lower surface of the workpiece bearing platform 21 is provided with a spherical groove 211 matching the spherical shape. This design allows the workpiece bearing platform 21 to be movably connected with the spherical shape of the lifting end through the spherical groove 211 on its lower surface.

[0073] In some optional embodiments, an elastic member 432 is provided between the fixed plate 43 and the workpiece carrier 21. Specifically, the elastic member 432 is a tension spring, which is installed near the two lifting shafts 441 and near the support 45. By providing the elastic member 432 between the fixed plate 43 and the workpiece carrier 21, the shaking of the workpiece carrier 21 can be effectively suppressed, thereby improving the stability of the device.

[0074] The specific steps of adjusting the inclination angle of the workpiece 30 to be polished are as follows: first, the workpiece 30 to be polished is mounted on the workpiece carrier 21 of the bracket through the workpiece fixture 22, and the posture of the workpiece 30 to be polished is roughly adjusted so that it basically maintains an opposing state with the multi-axis motion mechanism 50, and then the workpiece 30 to be polished is fixed, and the multi-axis motion mechanism 50 is equipped with a measuring probe 70 to detect the Z coordinate values ​​corresponding to several points on the surface of the workpiece 30 to be polished along the Y-axis direction. The data processing unit receives and analyzes the Z coordinate value from the measuring probe 70 to calculate the inclination angle of the workpiece 30 to be polished in the Y-axis direction, and then the numerical control system controls the driving device 444 corresponding to the jacking device 44 to operate according to the inclination angle value in the Y-axis direction, and the corresponding jacking shaft 441 moves up and down accordingly, thereby realizing the inclination angle adjustment of the workpiece carrier 21 in the Y-axis direction, and the adjustment is repeated several times until the required accuracy is achieved. The inclination angle adjustment method in the X-axis direction is similar and will not be repeated here.

[0075] In the present invention, the specific steps of adjusting the inclination angle of the workpiece 30 to be polished are as follows:

[0076] First, the workpiece 30 to be polished is mounted on the workpiece carrier 21 of the bracket through the workpiece fixture 22, and is roughly adjusted so that it is roughly in an opposing state with the multi-axis motion mechanism 50. Subsequently, the workpiece 30 to be polished is fixed. Next, the measuring probe 70 on the multi-axis motion mechanism 50 detects the Z coordinate values ​​of several points on the surface of the workpiece 30 to be polished along the Y-axis direction. The data processing unit receives and analyzes the Z coordinate value from the measuring probe 70 to calculate the inclination angle of the workpiece 30 to be polished in the Y-axis direction. According to the calculated Y-axis inclination angle, the numerical control system controls the corresponding driving device 444 of the lifting device 44 to operate, so that the lifting shaft 441 moves up and down, and the inclination angle of the workpiece carrier 21 in the Y-axis direction is adjusted. This process can be repeated many times until the required accuracy is achieved. It should be further explained that the method for adjusting the inclination angle in the X-axis direction is similar to this and will not be repeated here.

[0077] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A plasma polishing machine, characterized in that: include: Vacuum chamber; A bracket, located in the vacuum chamber, for supporting a workpiece to be polished, the bracket comprising a workpiece bearing platform; An angle adjustment mechanism is used to adjust the inclination angle of the workpiece to be polished, the angle adjustment mechanism is arranged below the bracket, the angle adjustment mechanism comprises a base arranged on the bottom plate of the vacuum chamber, a fixed plate arranged above the base and two lifting devices respectively arranged at diagonal positions of the base, the workpiece bearing platform is arranged above the fixed plate, each of the lifting devices comprises a lifting shaft, the lifting end of the lifting shaft passes through the fixed plate and extends to the workpiece bearing platform; the angle adjustment mechanism also comprises a pillar, the pillar is arranged at a corner point of the fixed plate away from the two lifting shafts, one end of the pillar is connected to the fixed plate, and the other end is movably connected to the lower surface of the workpiece bearing platform; the lifting shaft moves up and down to drive the workpiece bearing platform to adjust the inclination angle with the pillar as a fulcrum; A multi-axis motion mechanism is arranged on a side of the vacuum chamber opposite to the bracket and is equipped with an ion source and a measuring probe, wherein the measuring probe is moved to multiple positions on the surface of the workpiece to be polished through the multi-axis motion mechanism to obtain coordinate values ​​of the surface of the workpiece to be polished at multiple different positions in the thickness direction of the workpiece to be polished; a data processing unit, receiving and analyzing the coordinate values ​​from the measuring probe to calculate the tilt angle of the workpiece to be polished; The numerical control system controls the angle adjustment mechanism according to the inclination angle provided by the data processing unit to adjust the inclination angle of the workpiece to be polished.

2. The plasma polishing machine according to claim 1, characterized in that: Establishing an O-XYZ coordinate system with the center coordinate position of the workpiece to be polished, wherein the width direction of the surface of the workpiece to be polished is the X axis, the length direction of the surface of the workpiece to be polished is the Y axis, and the thickness direction of the workpiece to be polished is the Z axis; The measuring probe moves along the X-axis through the multi-axis motion mechanism to obtain Z coordinate values ​​of a plurality of different positions of the surface of the workpiece to be polished in the X-axis direction, and the data processing unit receives and analyzes the Z coordinate value from the measuring probe to calculate the inclination angle of the workpiece to be polished in the X-axis direction; The measuring probe moves along the Y-axis through the multi-axis motion mechanism to obtain Z coordinate values ​​of a plurality of different positions of the surface of the workpiece to be polished in the Y-axis direction. The data processing unit receives and analyzes the Z coordinate value from the measuring probe to calculate the inclination angle of the workpiece to be polished in the Y-axis direction.

3. The plasma polishing machine according to claim 2, characterized in that: The measuring probe moves to multiple positions of the edge of the workpiece to be polished through the multi-axis motion mechanism to obtain the coordinate value of the edge of the workpiece to be polished. The data processing unit receives and analyzes the coordinate value from the measuring probe to calculate the center coordinate value of the workpiece to be polished.

4. The plasma polishing machine according to claim 2, characterized in that: The multi-axis motion mechanism is also equipped with an industrial camera, which moves to the contour edge of the workpiece to be polished through the multi-axis motion mechanism to obtain image data of the contour edge of the workpiece to be polished. The data processing unit receives and analyzes the image data from the industrial camera to calculate the center coordinate value of the workpiece to be polished.

5. The plasma polishing machine according to claim 1, characterized in that: The bracket also includes: A workpiece clamp is arranged above the workpiece bearing platform and is used for clamping the workpiece to be polished.

6. The plasma polishing machine according to claim 5, characterized in that: The angle adjustment mechanism further comprises a side plate connected to the base, and the fixing plate is arranged above the base through the side plate.

7. The plasma polishing machine according to claim 6, characterized in that: Each of the lifting devices comprises: A guide rail, arranged on the base; A slider, slidably mounted on the guide rail; A driving device, a driving end of which is connected to the slider and is used to drive the slider to move; A wedge block is arranged on the slider and moves synchronously with the slider; A rolling element, located at the opposite end of the lifting end, abuts against the end surface of the wedge block; When the wedge block moves with the sliding block, the lifting shaft slides along the end surface of the wedge block through the rolling element to realize the up and down movement of the lifting shaft.

8. The plasma polishing machine according to claim 7, characterized in that: The taper angle of the wedge block is set to 1:

10.

9. The plasma polishing machine according to claim 1, characterized in that: A guide sleeve is provided at a position of the fixing plate corresponding to the lifting shaft, and the lifting shaft is movably inserted into the guide sleeve; And / or, an elastic member is provided between the fixing plate and the workpiece bearing platform; And / or, the vacuum chamber is connected to a vacuum device.

Images