Diamond wire surface hydrophilicity enhancing method and low-surface-energy hydrophilic diamond wire

By forming a insoluble hydrophilic polymer layer on the surface of the diamond wire, the problem of poor hydrophilicity of traditional diamond wires is solved, the cooling effect of wet cutting and tool life are improved, and the generation of wastewater is reduced.

CN119282933AInactive Publication Date: 2025-01-10XIAMEN WEIDU NEW MATERIAL CO LTD
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Patent Information

Application Number
CN202411432592.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-14
Publication Date
2025-01-10
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The high surface energy of traditional diamond wires leads to poor hydrophilicity, making it difficult to effectively carry coolant in wet cutting, affecting the cutting effect and tool life.

Method used

By attaching a hydrophilic treatment agent to the surface of the diamond wire, it forms a insoluble hydrophilic polymer layer, which enhances its hydrophilicity, and uses the polymer layer to swell in water to reduce the cooling liquid travel resistance.

Benefits of technology

Improves the cooling effect of wet cutting, reduces linear wear and cracking of workpieces, reduces modification costs, and reduces the use of surfactant and COD wastewater generation.

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Abstract

The diamond wire surface hydrophilicity enhancing method comprises the following steps that S1, a diamond wire to be treated is selected, and diamond is solidified on the surface of the diamond wire; s2, a hydrophilic treatment agent is selected, and the hydrophilic treatment agent is attached to the surface of the diamond wire; and S3, the hydrophilic treatment agent is reserved on the surface of the diamond wire to form an insoluble hydrophilic polymerization layer, and the low-surface-energy hydrophilic diamond wire is obtained. On the basis, the invention further discloses the low-surface-energy hydrophilic diamond wire which is prepared by adopting the diamond wire surface hydrophilicity enhancing method. According to the hydrophilic diamond wire with the low surface energy, the characteristic that the insoluble hydrophilic polymerization layer swells after making contact with water-based cooling liquid and keeps high hydrophilicity is utilized, when the hydrophilic diamond wire with the low surface energy is used for cutting, the cooling liquid can be carried more efficiently, the wire body passing resistance is reduced, the cooling liquid is carried to a deep cutting position, the cooling effect of the cooling liquid is better exerted, and the cutting efficiency is improved. Wire body abrasion and subfissure on the surface of a workpiece can be effectively reduced, and the method is particularly suitable for various application environments adopting wet diamond wire cutting.
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Description

Technical Field

[0001] The invention relates to the technical field of diamond wire processing, and in particular to a method for enhancing the hydrophilicity of a diamond wire surface and a low-surface-energy hydrophilic diamond wire. Background Art

[0002] Diamond wire is the abbreviation of diamond cutting wire. It is a cutting tool formed by fixing extremely hard diamond tiny particles on a high-strength matrix in a certain way. It is mainly used for cutting high-hardness brittle materials.

[0003] Traditional diamond wires are mostly made by electroplating diamond on the surface of high-strength steel wire. Because metallic nickel quickly forms an oxide layer in the air, the finished diamond wire has a high surface energy, resulting in poor hydrophilicity.

[0004] Common diamond wire cutting methods include dry cutting and wet cutting. When wet cutting is used, liquid (usually water or other aqueous coolants, a few use oily coolants) is used to cool and lubricate the cutting area. Some cutting fluid systems also add a large amount of surfactants to reduce the surface tension between the coolant and the diamond wire to achieve wetting. However, due to the poor hydrophilicity of existing diamond wires, it is difficult to carry enough aqueous coolant into the deep cutting area of ​​the workpiece during cutting, making it difficult to achieve the best cooling effect. Summary of the invention

[0005] The object of the present invention is to provide a method for enhancing the hydrophilicity of a diamond wire surface and a low-surface-energy hydrophilic diamond wire, so as to improve the cooling effect during wet cutting.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is as follows:

[0007] A method for enhancing the hydrophilicity of a diamond wire surface comprises the following steps: S1. selecting a diamond wire to be treated, wherein diamonds are solidified on the surface of the diamond wire to be treated; S2. selecting a hydrophilic treatment agent and making the hydrophilic treatment agent adhere to the surface of the diamond wire; S3. making the hydrophilic treatment agent remain on the surface of the diamond wire and form a poorly soluble hydrophilic polymer layer to obtain a low surface energy hydrophilic diamond wire.

[0008] Furthermore, in step S2, the hydrophilic treatment agent is attached to the surface of the diamond wire by dipping or spraying.

[0009] Furthermore, in step S3, the hydrophilic treatment agent is promoted to be soluble and condensed or polymerized into a sparingly soluble hydrophilic polymer layer by drying or natural air drying.

[0010] Furthermore, the poorly soluble hydrophilic polymer layer contains a hydrophilic group and an anchoring group that has an anchoring effect on the surface of the diamond wire.

[0011] Furthermore, the hydrophilic group is at least one of a hydroxyl group, a carboxyl group, an amide group, an amino group, an aldehyde group, a sulfonic acid group, a phosphoric acid group, an ether group, and a thiol group.

[0012] Furthermore, the anchoring group is at least one of an amino group, a sulfonic acid group, a phosphoric acid group, a thiol group, and a carboxyl group.

[0013] Furthermore, the hydrophilic treatment agent is any one of polymaleic acid aqueous solution, polydiallyl dimethyl ammonium chloride solution, polyethylene imine, polyacrylic acid, polyacrylate, dimethyl diallyl ammonium chloride / acrylamide copolymer, acrylic acid-2-acrylamide-2-methylpropane sulfonic acid copolymer, polyvinyl pyrrolidone, polyacrylamide, polyethylene oxide, polyethylene oxide derivatives, and polyvinyl alcohol.

[0014] Furthermore, the concentration of the polymaleic acid aqueous solution is 0.01-300 g / L, the concentration of the polydiallyl dimethyl ammonium chloride solution is 0.01-300 g / L; and the polyethyleneimine is polyethyleneimine terminated with ethylenediamine.

[0015] Furthermore, the sparingly soluble hydrophilic polymer layer is in a semi-concentrated solution or gel state and the thickness H of the sparingly soluble hydrophilic polymer layer is less than 10 μm.

[0016] A low surface energy hydrophilic diamond wire is prepared by using the above-mentioned method for enhancing the surface hydrophilicity of the diamond wire.

[0017] The present invention has the following beneficial effects:

[0018] 1. The present invention provides a method for enhancing the hydrophilicity of a diamond wire surface and a low surface energy hydrophilic diamond wire. The method uses a hydrophilic treatment agent to treat the diamond wire and retains an insoluble hydrophilic polymer layer on the surface of the diamond wire to finally obtain a low surface energy hydrophilic diamond wire. The insoluble hydrophilic polymer layer swells and maintains high hydrophilicity after contacting an aqueous coolant. When the low surface energy hydrophilic diamond wire is used for cutting, the coolant can be carried more efficiently and the resistance of the wire body passing through the coolant can be reduced. The coolant can be carried to a deep cutting position to better exert the cooling effect of the coolant, which can effectively reduce the wear of the wire body and the surface cracks of the workpiece. The diamond wire is particularly suitable for various application environments using wet diamond wire cutting.

[0019] 2. The method for enhancing the hydrophilicity of the diamond wire surface can be directly introduced with slight modifications to the existing diamond wire manufacturing process, is easy to implement, and has low modification costs.

[0020] 3. When using the low surface energy hydrophilic diamond wire for cutting, the aqueous coolant used can reduce or eliminate the addition of surfactants, thereby reducing the generation of COD wastewater and the trouble caused by treating COD wastewater. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the diamond wire structure of the present invention.

[0022] Figure 2 It is a schematic diagram of the structure of the low surface energy hydrophilic diamond wire of the present invention.

[0023] Explanation of the main component symbols: 1. Diamond wire; 2. Substrate; 3. Nickel plating layer; 4. Diamond; 5. Insoluble hydrophilic polymer layer; 6. Low surface energy hydrophilic diamond wire; H, thickness value. DETAILED DESCRIPTION

[0024] The present invention will be further described below in conjunction with the accompanying drawings and specific implementation methods.

[0025] like Figure 1-2 As shown, the present invention discloses a method for enhancing the hydrophilicity of the surface of a diamond wire 1, comprising the following steps:

[0026] S1. Select a diamond wire 1 to be processed, the surface of which is consolidated with diamonds 4, that is, the processing object is the diamond wire 1 after thickening and consolidation. In this embodiment, the base 2 of the selected diamond wire 1 is a high-strength steel wire, and the surface layer is a nickel-plated layer 3.

[0027] S2. Select a suitable hydrophilic treatment agent, and attach a small amount of the hydrophilic treatment agent to the surface of the diamond wire 1. In this embodiment, the hydrophilic treatment agent is in liquid form or prepared as a solution, and is attached to the surface of the diamond wire 1 by dipping or spraying.

[0028] When the attachment is performed by dipping, a water tank can be added after the thickening and consolidation process to contain the hydrophilic treatment agent, and the diamond wire 1 is passed through the water tank to attach the hydrophilic treatment agent to the diamond wire 1. The operation is convenient and easy to implement. When the attachment is performed by spraying, the hydrophilic treatment agent can be evenly sprayed on the surface of the diamond wire 1, and the attachment is relatively uniform, and it is also convenient to control the attachment thickness.

[0029] S3. The hydrophilic treatment agent is allowed to remain on the surface of the diamond wire 1 and form a sparingly soluble hydrophilic polymer layer 5. The obtained diamond wire 1 with the sparingly soluble hydrophilic polymer layer 5 is a low surface energy hydrophilic diamond wire 6.

[0030] Specifically, the hydrophilic treatment agent is selected from any one of polymaleic acid aqueous solution, polydiallyl dimethyl ammonium chloride solution, polyethylene imine, polyacrylic acid, polyacrylate, dimethyl diallyl ammonium chloride / acrylamide copolymer, acrylic acid-2-acrylamide-2-methylpropane sulfonic acid copolymer, polyvinyl pyrrolidone (PVP), polyacrylamide (PAM), polyethylene oxide, polyethylene oxide derivatives, and polyvinyl alcohol (PVA).

[0031] Preferably, when the hydrophilic treatment agent is a polymaleic acid aqueous solution, its concentration is preferably between 0.01 and 300 g / L. When a polydimethyl ammonium chloride solution is selected, its concentration is preferably between 0.01 and 300 g / L. When polyethyleneimine is selected, polyethyleneimine terminated with ethylenediamine is preferred.

[0032] In step S3, the solvent volatilization can be promoted by drying or natural air drying, so that the hydrophilic treatment agent is dissolved and condensed into a semi-concentrated solution-like sparingly soluble hydrophilic polymer layer 5, or polymerized into a gel-like sparingly soluble hydrophilic polymer layer 5, which is then retained on the surface of the diamond wire 1 to obtain a low surface energy hydrophilic diamond wire 6. The use of drying or natural air drying to promote solvent volatilization has the advantages of convenient control, low cost, environmental protection and energy saving.

[0033] The formed sparingly soluble hydrophilic polymer layer 5 contains hydrophilic groups with strong hydrophilicity, and also contains anchoring groups that have an anchoring effect on the surface of the diamond wire 1. Among them, the hydrophilic group is at least one of a hydroxyl group (-OH), a carboxyl group (-COOH), an amide group (-CO-NHx), an amino group (-NHx), an aldehyde group (-CHO), a sulfonic acid group (-SO3H), a phosphoric acid group (-PO3Hx), an ether group (-O-), and a thiol group (R-SH). The anchoring group is at least one of an amino group (R-NHx), a sulfonic acid group (-SO3H), a phosphoric acid group (-PO3Hx), and a thiol group (R-SH). The anchoring group is coordinated with the nickel atom and has a strong binding force with nickel, which makes the sparingly soluble hydrophilic polymer layer 5 remaining on the diamond wire 1 not easy to fall off and can maintain long-lasting hydrophilicity.

[0034] The sparingly soluble hydrophilic polymer layer 5 is in the form of a subconcentrated solution or swells into a gel and adheres to the surface of the diamond wire 1. Most of it is filled between the diamonds 4 and is combined with the nickel-plated layer 3 through chemical bonds or van der Waals forces. A small part is formed on the surface of the diamond 4 and can be quickly worn away during the cutting process without affecting further cutting. The sparingly soluble hydrophilic polymer layer 5 has a certain swelling property in water and is not easily soluble in water, and has a drag-reducing effect. By utilizing its drag-reducing effect, the turbulent friction resistance on the surface of the wire body can be greatly reduced when the diamond wire 1 passes through the coolant fluid at high speed. In addition, the thickness value H of the sparingly soluble hydrophilic polymer layer 5 is below 10 μm, which basically does not affect the physical size of the diamond wire 1.

[0035] The present invention also discloses a low surface energy hydrophilic diamond wire 1, which is prepared by using the above-mentioned method for enhancing the surface hydrophilicity of the diamond wire 1.

[0036] In summary, the present invention utilizes the property of the sparingly soluble hydrophilic polymer layer 5 to swell and maintain high hydrophilicity after contacting the aqueous coolant to enhance the surface hydrophilicity of the diamond wire 1. The enhancement method is easy to implement and can be directly introduced with a slight modification to the existing diamond wire 1 manufacturing process, and the modification cost is relatively low. When the obtained low surface energy hydrophilic diamond wire 1 is used for wet cutting, it can efficiently carry the coolant and reduce the resistance of the wire body passing through the coolant, carry the coolant to the deep cutting position, better exert the cooling effect of the coolant, and the degree of wear of the wire body is relatively small, and there are fewer hidden cracks on the workpiece surface.

[0037] The low surface energy hydrophilic diamond wire 1 is particularly suitable for various application environments where wet diamond wire 1 cutting is adopted. When used for wet cutting, the addition of surfactant can be reduced or eliminated, and the generation of COD wastewater and various troubles caused by the treatment of COD wastewater can be reduced.

[0038] Although the present invention has been specifically shown and described in conjunction with the preferred embodiments, it should be understood by those skilled in the art that various changes in form and details may be made to the present invention without departing from the spirit and scope of the invention as defined in the appended claims, all of which are within the scope of protection of the present invention.

Claims

1. A method for enhancing the hydrophilicity of a diamond wire surface, characterized in that: The following steps are involved: S1. Selecting a diamond wire to be processed, the surface of which is solidified with diamonds; S2. Select a hydrophilic treatment agent and attach the hydrophilic treatment agent to the surface of the diamond wire; S3. The hydrophilic treatment agent is retained on the surface of the diamond wire to form a poorly soluble hydrophilic polymer layer, thereby obtaining a low surface energy hydrophilic diamond wire.

2. A method for enhancing the hydrophilicity of a diamond wire surface as claimed in claim 1, characterized in that: In step S2, the hydrophilic treatment agent is attached to the surface of the diamond wire by dipping or spraying.

3. A method for enhancing the hydrophilicity of a diamond wire surface as claimed in claim 1, characterized in that: In step S3, drying or natural air drying is performed to promote the hydrophilic treatment agent to coagulate or polymerize into a sparingly soluble hydrophilic polymer layer.

4. A method for enhancing the hydrophilicity of a diamond wire surface as claimed in claim 1, characterized in that: The poorly soluble hydrophilic polymer layer contains a hydrophilic group and an anchoring group having an anchoring effect on the surface of the diamond wire.

5. A method for enhancing the hydrophilicity of a diamond wire surface as claimed in claim 4, characterized in that: The hydrophilic group is at least one of a hydroxyl group, a carboxyl group, an amide group, an amino group, an aldehyde group, a sulfonic acid group, a phosphoric acid group, an ether group, and a thiol group.

6. A method for enhancing the hydrophilicity of a diamond wire surface as claimed in claim 4, characterized in that: The anchoring group is at least one of an amino group, a sulfonic acid group, a phosphoric acid group, a thiol group, and a carboxyl group.

7. A method for enhancing the hydrophilicity of a diamond wire surface as claimed in claim 1, characterized in that: The hydrophilic treatment agent is any one of polymaleic acid aqueous solution, polydiallyl dimethyl ammonium chloride solution, polyethylene imine, polyacrylic acid, polyacrylate, dimethyl diallyl ammonium chloride / acrylamide copolymer, acrylic acid-2-acrylamide-2-methylpropane sulfonic acid copolymer, polyvinyl pyrrolidone, polyacrylamide, polyethylene oxide, polyethylene oxide derivatives, and polyvinyl alcohol.

8. A method for enhancing the hydrophilicity of a diamond wire surface as claimed in claim 7, characterized in that: The concentration of the polymaleic acid aqueous solution is 0.01-300 g / L, the concentration of the polydiallyl dimethyl ammonium chloride solution is 0.01-300 g / L; and the polyethylene imine is polyethylene imine terminated with ethylenediamine.

9. A method for enhancing the hydrophilicity of a diamond wire surface as claimed in claim 1, characterized in that: The sparingly soluble hydrophilic polymer layer is in a semi-concentrated solution state or a gel state, and a thickness H of the sparingly soluble hydrophilic polymer layer is less than 10 μm.

10. A low surface energy hydrophilic diamond wire, characterized in that: The diamond wire is prepared by the method for enhancing the hydrophilicity of the diamond wire surface as described in any one of claims 1 to 9.