A temperature correction method for an optical module housing

Abstract

The present invention discloses a temperature correction method for an optical module housing, which relates to the technical field of optical module temperature measurement, including: randomly selecting the position of an optical module as a collection point, and collecting temperature through a temperature sensor detector to obtain temperature data to be corrected; obtaining the actual center reference temperature; using a temperature sensor to read the actual chip temperature data of the optical module; judging whether the temperature data to be corrected meets the correction requirements; if so, correcting the temperature data to be corrected to obtain the corrected temperature data. The present invention uses a quadratic term to resist nonlinear error interference, and introduces a temperature deviation coefficient for secondary calibration to further reduce the error. High-precision calibration can be achieved without a specific test position during calibration, greatly improving the calibration accuracy. It is particularly suitable for the occasion of large-scale optical module shipment calibration, and the consistency and accuracy are far superior to conventional calibration methods, solving the problem of accuracy of the optical module housing temperature during calibration.

Description

Technical Field

[0001] The present invention relates to the technical field of optical module temperature measurement, and in particular to a temperature correction method for an optical module housing. Background Art

[0002] The optical module has a built-in temperature ADC to reflect the temperature of the chip in real time, but in actual work, it is also necessary to understand the operating temperature of the entire module, that is, the shell temperature. At present, there are two main methods for the temperature calibration of the optical module shell. One is to use a constant calibration method, using the optical module temperature ADC value plus a gain K value. This method is simple but has poor accuracy and is prone to large deviations when encountering high and low temperatures. The second is to use a first-order calibration method, using the reported temperature ADC plus the measured temperature to fit the temperature change curve. This method is more accurate than the previous method, but there are certain nonlinear measurement errors, such as deviations in the test position, and secondly, the first-order term has poor anti-interference ability. Summary of the invention

[0003] The object of the present invention is to provide a temperature correction method for an optical module housing, so as to improve the technical problem that the above-mentioned prior art is easily disturbed by nonlinear factors such as temperature, humidity and air pressure, and the calculated fitting curve will also change with the different test points of the optical module housing, affecting the accuracy of the reported temperature.

[0004] In order to achieve the above-mentioned object of the invention, the embodiment of the present invention provides the following technical solutions:

[0005] A temperature correction method for an optical module housing, comprising:

[0006] S1, randomly select the position of the optical module that is working stably as the collection point;

[0007] S2. Collect temperature at multiple collection points using a temperature sensor detector to obtain corresponding temperature data to be corrected;

[0008] S3, obtaining the actual central reference temperature of the internal chip of the optical module that is working stably;

[0009] S4, using the temperature sensor of the optical module that is working stably to read the actual chip temperature data of the optical module that is working stably;

[0010] S5, judging whether the temperature data to be calibrated meets the calibration requirements; if so, entering S6; otherwise, returning to S1;

[0011] S6. Based on the actual center reference temperature and the actual chip temperature data, the temperature data to be corrected is corrected to obtain corrected temperature data, thereby completing the correction of the temperature of the optical module housing.

[0012] Furthermore, the temperature is collected at multiple collection points by a temperature sensor detector to obtain corresponding temperature data to be corrected, including:

[0013] S2-1, determine three temperature values;

[0014] S2-2, randomly select any temperature value as the reference temperature;

[0015] S2-3, based on the reference temperature, collecting temperature at multiple collection points by the temperature sensor detector to obtain corresponding first temperature data to be corrected;

[0016] S2-4, repeat S2-2 to S2-3 until the second temperature data to be corrected and the third temperature data to be corrected are obtained;

[0017] The temperature data to be corrected includes first temperature data to be corrected, second temperature data to be corrected and third temperature data to be corrected.

[0018] Furthermore, the step of obtaining the actual central reference temperature of the internal chip of the optical module that is stably working includes:

[0019] Taking the initial actual center reference temperature of the same position of the internal chip of the optical module that is working stably for multiple times; taking a weighted average of the multiple groups of the initial actual center reference temperatures to obtain the actual center reference temperature;

[0020] The actual center reference temperature includes a first actual center reference temperature , the second actual center reference temperature and the third actual center reference temperature .

[0021] Furthermore, the correction requirement is: the number of the temperature data to be corrected is within a correction range; and the correction range is 5 to 8.

[0022] Further, the correcting the temperature data to be corrected based on the actual center reference temperature and the actual chip temperature data to obtain the corrected temperature data includes:

[0023] S6-1, determining the relationship between the actual central reference temperature, the actual chip temperature data and the temperature data to be corrected;

[0024] S6-2, determining a temperature offset coefficient, and calculating a reported temperature coefficient of the temperature sensor based on the temperature offset coefficient;

[0025] S6-3. Based on the temperature offset coefficient and the relationship, correct the temperature data to be corrected to obtain the corrected temperature data.

[0026] Furthermore, the calculation formula for calculating the reported temperature coefficient of the temperature sensor based on the temperature offset coefficient is:

[0027] ;

[0028] in, Indicates Reported temperature coefficients, represents the polynomial exponential, Indicates The temperature offset coefficient, Indicates the ambient temperature, , , , Represents the temperature offset coefficient.

[0029] Further, based on the temperature offset coefficient and the relationship, the temperature data to be corrected is corrected to obtain the corrected temperature data, and the corresponding formula is:

[0030] ;

[0031] in, Indicates the actual chip temperature data, Represents the corrected temperature data, Indicates the ambient temperature, , , , , , , , , Indicates the temperature offset coefficient at different reference temperatures.

[0032] The beneficial effects of the present invention are:

[0033] The present invention can greatly improve the calibration accuracy through a multi-data fitting method, reduce nonlinear interference and errors through quadratic terms and temperature offset terms, improve test accuracy and repeatability, and realize flexible transformation of accurate calibration at any test position of the optical module, thereby saving calibration time and improving timeliness. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 A flow chart of a method in an embodiment of the present invention;

[0036] Figure 2 Schematic diagram of the collection position of the actual central reference temperature in an embodiment of the present invention. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0038] See also Figure 1 This embodiment provides a temperature correction method for an optical module housing, which includes:

[0039] S1. Randomly select the position of a stable working optical module as a collection point; and take the optical module that has been working for 30 minutes as a stable working optical module.

[0040] S2. Collect temperature at multiple collection points using a temperature sensor detector to obtain corresponding temperature data to be corrected;

[0041] The temperature is collected at multiple collection points by a temperature sensor detector to obtain corresponding temperature data to be corrected, including:

[0042] S2-1. Determine three temperature values; the three temperature values ​​are high temperature, medium temperature and low temperature; among them, when the temperature is in the range of 55℃ to 75℃, it can be regarded as high temperature, which is usually 65℃. When the temperature is in the range of 10℃ to 30℃, it can be regarded as medium temperature, which is usually 25℃. When the temperature is in the range of -20℃ to 0℃, it can be regarded as low temperature, which is usually -10℃.

[0043] S2-2, randomly select any temperature value as the reference temperature;

[0044] S2-3, based on the reference temperature, collecting temperature at multiple collection points by the temperature sensor detector to obtain corresponding first temperature data to be corrected;

[0045] S2-4, repeat S2-2 to S2-3 until the second temperature data to be corrected and the third temperature data to be corrected are obtained;

[0046] The temperature data to be corrected includes first temperature data to be corrected, second temperature data to be corrected and third temperature data to be corrected.

[0047] S3. Obtain the internal chip of the optical module that works stably. Figure 2 Actual center reference temperature at the location shown;

[0048] The step of obtaining the actual central reference temperature of the internal chip of the optical module in a stably working state includes:

[0049] Taking the initial actual center reference temperature of the same position of the internal chip of the optical module that is working stably for multiple times; taking a weighted average of the multiple groups of the initial actual center reference temperatures to obtain the actual center reference temperature;

[0050] The actual center reference temperature includes a first actual center reference temperature , the second actual center reference temperature and the third actual center reference temperature .

[0051] Select multiple times to collect the actual center reference temperature and perform weighted average to obtain the first actual center reference temperature , the second actual center reference temperature and the third actual center reference temperature , which can further improve the accuracy of collection.

[0052] S4, using the temperature sensor of the optical module that is working stably to read the actual chip temperature data of the optical module that is working stably;

[0053] S5, judging whether the temperature data to be calibrated meets the calibration requirements; if so, entering S6; otherwise, returning to S1;

[0054] The correction requirement is: the number of the temperature data to be corrected is within the correction range; the correction range is 5 to 8.

[0055] S6. Based on the actual center reference temperature and the actual chip temperature data, the temperature data to be corrected is corrected to obtain corrected temperature data, thereby completing the correction of the temperature of the optical module housing.

[0056] The method of correcting the temperature data to be corrected based on the actual center reference temperature and the actual chip temperature data to obtain the corrected temperature data includes:

[0057] S6-1, determining the relationship between the actual central reference temperature, the actual chip temperature data and the temperature data to be corrected, the corresponding process is:

[0058] The temperature data to be corrected and the actual chip temperature data Integrate into a data set, the expression is:

[0059] ;

[0060] Will The data were fitted to obtain the corresponding polynomial calibration curve.

[0061] Assume that the actual temperature of the temperature sensor of the optical module that is working stably has the following relationship with the test temperature:

[0062] ;

[0063] in, Indicates the temperature sensor The initial upload temperature coefficient is In general, The middle exponent is 2 for calculation.

[0064] Initial upload temperature coefficient Take the weighted average and substitute it into the relationship between the actual temperature of the temperature sensor of the optical module working stably and the test temperature to obtain:

[0065] ;

[0066] in, Indicates the actual chip temperature data, Indicates the temperature data to be corrected corresponding to the actual chip temperature data. Indicates the total number of temperature data to be corrected at the reference temperature. , , Respectively represent the first temperature data to be corrected, the second temperature data to be corrected, and the third temperature data to be corrected corresponding to The initial upload temperature coefficient after weighted average.

[0067] Within a certain temperature range, for example This temperature range meets the thermal conductivity of the housing material (aluminum alloy) of the optical module. And the thermal conductivity of the filling heat dissipation silicone material The stable range, therefore, the thermal conductivity of the shell material And the thermal conductivity of the filling heat dissipation silicone material Considered as a constant, we can obtain the following according to Fourier's law of heat conduction:

[0068] ;

[0069] in, Indicates the heat dissipation of the optical module when it is working stably. Represents the thermal conductivity of the material, which includes the thermal conductivity of the shell material And the thermal conductivity of the filling heat dissipation silicone material , represents the conductive contact area, Indicates the temperature change value, Indicates the conduction distance.

[0070] Due to the heat dissipation of the stable working optical module and conductive contact area are all constant values, then the temperature change value under stable working condition Only with conduction distance Because the temperature distribution on the surface of the optical module shows a gradient downward trend from the center to the surroundings, the temperature change value Only with conduction distance So at the same acquisition position, we collect data under a set of high temperature, medium temperature, and low temperature environments, and get:

[0071] ;

[0072] ;

[0073] ;

[0074]

[0075] ;

[0076]

[0077] ;

[0078] in, , , , , Respectively represent the first, second, third, , The temperature change value, express, , , , , Respectively represent the first, second, third, , The temperature to be corrected.

[0079] Due to temperature change It is equivalent to the difference between the acquisition point and the actual center reference temperature, and we get:

[0080] ;

[0081] in, represents the actual center reference temperature, which includes the first actual center reference temperature , the second actual center reference temperature and the third actual center reference temperature , Indicates The temperature data to be corrected.

[0082] Therefore, the formula corresponding to the temperature data to be corrected is:

[0083] ;

[0084] ;

[0085] ;

[0086]

[0087] ;

[0088] S6-2, determining a temperature offset coefficient, and calculating a reported temperature coefficient of the temperature sensor based on the temperature offset coefficient;

[0089] Based on the temperature offset coefficient and the above equation, the calculation formula for the reported temperature coefficient of the temperature sensor can be calculated as follows:

[0090] ;

[0091] in, Indicates Reported temperature coefficients, represents the polynomial exponential, Indicates The temperature offset coefficient, Indicates the ambient temperature, , , , Represents the temperature offset coefficient.

[0092] Will As a polynomial, when The larger the value, the closer it is to the real temperature curve, and the corresponding calculation difficulty increases accordingly. The value is 2, so at different ambient temperatures The calculation formula of the reported temperature coefficient is expanded as follows:

[0093] ;

[0094] ;

[0095] ;

[0096]

[0097] ;

[0098] ;

[0099] ;

[0100] ;

[0101]

[0102] ;

[0103] ;

[0104] ;

[0105] ;

[0106]

[0107] ;

[0108] in, to Respectively represent the first to the second The reported temperature coefficient of to Respectively represent the first to the second The reported temperature coefficient of to Respectively represent the first to the second The reported temperature coefficient of , , , , , , , , represents the temperature offset coefficient, , , , Represents the first, second, third and Ambient temperature.

[0109] S6-3. Based on the temperature offset coefficient and the relationship, correct the temperature data to be corrected to obtain the corrected temperature data.

[0110] Based on the temperature offset coefficient and the relationship, the temperature data to be corrected is corrected to obtain the corrected temperature data, and the corresponding formula is:

[0111] ;

[0112] in, Indicates the actual chip temperature data, Represents the corrected temperature data, Indicates the ambient temperature, , , , , , , , , Indicates the temperature offset coefficient at different reference temperatures.

[0113] Since there may be sub-zero (negative numbers) and decimal parts during temperature testing, in order to further ensure the reporting accuracy, select a sampling sensor with higher resolution or process the temperature calibration coefficient and temperature offset coefficient into floating-point data during firmware processing before uploading them to Flash.

[0114] The algorithm of the present invention is an offset correction algorithm or a polynomial offset correction algorithm. The temperature of the optical module housing is corrected using a constant term correction algorithm, a first-order correction algorithm, a second-order correction algorithm, and an offset correction algorithm, respectively, to obtain the corresponding corrected temperature data. The accuracy between the corrected temperature data and the actual temperature data is measured. Since optical modules are small-volume, high-heat integrated modules, they are generally used in important occasions such as data centers and mobile base stations. The better the temperature accuracy, the more timely feedback the stability of the module during operation. As shown in Table 1, the correction accuracy of the offset correction algorithm of the present invention is ±0.2°C, which is better than the first-order correction algorithm, the second-order correction algorithm, and the offset correction algorithm. It can be seen that the present invention is more suitable for temperature correction of optical modules with small size and high heat generation, with high correction accuracy, and can timely feedback the stability of the optical module during operation.

[0115] Table 1 Calibration accuracy comparison table

[0116]

[0117] In summary, the present invention uses quadratic terms to resist nonlinear error interference, and introduces temperature deviation coefficients for secondary calibration, further reducing the error, and can achieve high-precision calibration without a specific test position during calibration, and the calibration accuracy is greatly improved through the curve fitting of multiple sets of data. It is particularly suitable for the occasion of large-scale optical module shipment calibration, and its consistency and accuracy are far superior to conventional calibration methods, solving the problem of accuracy of optical module housing temperature during calibration.

[0118] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A temperature correction method for an optical module housing, characterized in that: include: S1, randomly select the position of the optical module that is working stably as the collection point; S2. Collect temperature at multiple collection points using a temperature sensor detector to obtain corresponding temperature data to be corrected; S3, obtaining the actual central reference temperature of the internal chip of the optical module that is working stably; S4, using the temperature sensor of the optical module that is working stably to read the actual chip temperature data of the optical module that is working stably; S5, judging whether the temperature data to be calibrated meets the calibration requirements; if so, entering S6; otherwise, returning to S1; S6. Based on the actual center reference temperature and the actual chip temperature data, the temperature data to be corrected is corrected to obtain the corrected temperature data, thereby completing the correction of the temperature of the optical module housing; The method of correcting the temperature data to be corrected based on the actual center reference temperature and the actual chip temperature data to obtain the corrected temperature data includes: S6-1, determining the relationship between the actual central reference temperature, the actual chip temperature data and the temperature data to be corrected; S6-2, determining a temperature offset coefficient, and calculating a reported temperature coefficient of the temperature sensor based on the temperature offset coefficient; S6-3, correcting the temperature data to be corrected based on the temperature offset coefficient and the relationship to obtain the corrected temperature data; The calculation formula for correcting the reported temperature coefficient of the temperature sensor based on the temperature offset coefficient is: ； in, Indicates Reported temperature coefficients, represents the polynomial exponential, Indicates The temperature offset coefficient, Indicates the ambient temperature, , , , represents the temperature offset coefficient; Based on the temperature offset coefficient and the relationship, the temperature data to be corrected is corrected to obtain the corrected temperature data, and the corresponding formula is: ； in, Indicates the actual chip temperature data, Represents the corrected temperature data, Indicates the ambient temperature, , , , , , , , , Indicates the temperature offset coefficient at different reference temperatures.

2. The temperature correction method for an optical module housing according to claim 1, characterized in that: The temperature is collected at multiple collection points by a temperature sensor detector to obtain corresponding temperature data to be corrected, including: S2-1, determine three temperature values; S2-2, randomly select any temperature value as the reference temperature; S2-3, based on the reference temperature, collecting temperature at multiple collection points by the temperature sensor detector to obtain corresponding first temperature data to be corrected; S2-4, repeat S2-2 to S2-3 until the second temperature data to be corrected and the third temperature data to be corrected are obtained; The temperature data to be corrected includes first temperature data to be corrected, second temperature data to be corrected and third temperature data to be corrected.

3. The temperature correction method for an optical module housing according to claim 1, characterized in that: The step of obtaining the actual central reference temperature of the internal chip of the optical module in a stably working state includes: Taking the initial actual center reference temperature of the same position of the internal chip of the optical module that is working stably for multiple times; taking a weighted average of the multiple groups of the initial actual center reference temperatures to obtain the actual center reference temperature; The actual center reference temperature includes a first actual center reference temperature , the second actual center reference temperature and the third actual center reference temperature .

4. The temperature correction method for an optical module housing according to claim 1, characterized in that: The correction requirement is: the number of the temperature data to be corrected is within the correction range; the correction range is 5 to 8.

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