Stress measuring device based on piezoelectric ceramics

Abstract

The invention relates to the technical field of stress measurement, and discloses a stress measurement device based on piezoelectric ceramics, which comprises a bearing frame and a base, the bearing frame is perpendicular to the upper surface of the base, the bearing frame is provided with a groove, a positioning groove and a first sliding groove, the groove is provided with an adjusting device, and a sliding rod is fixedly connected with the adjusting device. The sliding rod slides in the first sliding groove, the adjusting device slides in the groove, the adjusting device comprises an adjusting unit, the adjusting device is provided with a second sliding groove, the adjusting unit slides in the second sliding groove, the adjusting unit comprises a telescopic rod, a gradienter, a capacitance meter and an adjusting column, the groove is fixedly connected with a platform, and piezoelectric ceramics are placed on the platform. The platform is fixedly connected with a displacement sensor, the bottom of the platform is fixedly connected with one end of a force sensor, and the end, away from the platform, of the force sensor is fixedly connected with a groove. The device and the method have the characteristics of accurately acquiring various data and accurately measuring stress.

Description

Technical Field

[0001] The present invention relates to the technical field of stress measurement, and in particular to a stress measurement device based on piezoelectric ceramics. Background Art

[0002] As the requirements for the accuracy of piezoelectric ceramic stress measurement become increasingly higher, although the stress measurement device based on piezoelectric ceramics performs well in single parameter measurement, it has limitations in multi-dimensional information fusion and comprehensive analysis.

[0003] Existing devices cannot effectively collect displacement parameters, and in complex stress fields, the horizontal factor is ignored, which will lead to deviations in the measurement results. Secondly, piezoelectric ceramics will produce a certain amount of elongation when measuring stress. Failure to collect the elongation in time will also lead to deviations in the measurement results. In the stress measurement research on piezoelectric ceramics, the existing devices cannot accurately collect and evaluate the impact of these factors on stress measurement, resulting in insufficient stress measurement accuracy.

[0004] Therefore, how to provide a stress measurement device based on piezoelectric ceramics is a technical problem that those skilled in the art need to solve urgently. Summary of the invention

[0005] In view of this, the present invention proposes a stress measurement device based on piezoelectric ceramics, aiming to solve the problem of insufficient stress measurement accuracy.

[0006] The present invention proposes a stress measurement device based on piezoelectric ceramics, comprising: A load-bearing frame and a base, wherein the load-bearing frame is vertically disposed on the upper surface of the base; The load-bearing frame is provided with a groove, a positioning groove and a first sliding groove, and the load-bearing frame is provided with a plurality of limiting grooves, and the plurality of limiting grooves are axially symmetrical about the center of the load-bearing frame; The first sliding groove is provided with a sliding rod, the groove is provided with an adjusting device, the sliding rod is fixedly connected to the adjusting device, the sliding rod slides inside the first sliding groove, and the adjusting device slides inside the groove; The adjusting device comprises an adjusting unit, the adjusting device is provided with a second sliding groove, and the adjusting unit slides inside the second sliding groove; The adjustment unit comprises a telescopic rod, a level, a capacitance meter and an adjustment column, the telescopic rod is fixedly connected to the adjustment column, and the level and the capacitance meter are fixedly connected to two sides of the adjustment column; The groove is fixedly connected to a platform, a piezoelectric ceramic is placed on the platform, the platform is fixedly connected to a displacement sensor, the bottom of the platform is fixedly connected to one end of a force sensor, and the end of the force sensor away from the platform is fixedly connected to the groove; The positioning groove is provided with a positioning bolt, and the positioning bolt is used to fix the adjusting device. A plurality of the limiting grooves are provided with limiting bolts, and the limiting bolts are used to fix the load-bearing frame.

[0007] Furthermore, the stress measurement device based on piezoelectric ceramics further includes: an operating device; The operating device is electrically connected to the sliding rod, and the operating device is electrically connected to the adjusting column. The operating device is used to control the movement of the sliding rod and the adjusting column; The operating device is used to read data from the level meter, the capacitance meter, the force sensor and the displacement sensor.

[0008] Furthermore, the stress measurement device based on piezoelectric ceramics comprises: When the operating device controls the sliding rod to return to the zero position and the adjusting column to return to the zero position, initial level data of the level meter is obtained; When the operating device controls the sliding rod to start descending and the adjusting column contacts the piezoelectric ceramic, the sliding rod is stopped from descending and the second level data of the level meter and the initial stress data of the force sensor are acquired; When the adjustment column contacts the piezoelectric ceramic, the operating device controls the adjustment column to descend, and obtains the third level data of the level meter, the length data of the capacitance meter, the displacement data of the displacement sensor, and the second stress data of the force sensor; The stress value of the piezoelectric ceramic is calculated according to the initial horizontal data, the second horizontal data, the third horizontal data, the initial stress data, the second stress data, the displacement data and the length data.

[0009] Further, when calculating the stress value of the piezoelectric ceramic according to the initial horizontal data, the second horizontal data, the third horizontal data, the initial stress data, the second stress data, the displacement data and the length data, it includes: calculating a horizontal factor according to the initial horizontal data, the second horizontal data and the third horizontal data; calculating a stress factor according to the initial stress data and the second stress data; The displacement data is adjusted according to the horizontal factor to obtain a displacement value, and the stress value is determined according to the displacement value, the stress factor and the length data.

[0010] Further, when calculating the horizontal factor according to the initial horizontal data, the second horizontal data and the third horizontal data, it includes: The level factor is given by the following formula: ; in, represents the level factor, represents the initial level data, represents the second level data, represents the third level data.

[0011] Further, when calculating the stress factor according to the initial stress data and the second stress data, it includes: The stress factor is given by the following formula: ; in, represents the stress factor, represents the initial stress data, represents the second stress data.

[0012] Further, when adjusting the displacement data according to the horizontal factor to obtain the displacement value, it includes: When the displacement data is equal to zero, the horizontal factor is equal to the displacement value; When the displacement data is not equal to zero, the displacement data is adjusted according to the horizontal factor to obtain the displacement value.

[0013] Further, when the displacement data is not equal to zero, the displacement data is adjusted according to the horizontal factor to obtain a displacement value, including: Collect multiple times of initial horizontal data, second horizontal data and third horizontal data, and calculate their corresponding horizontal factors, aggregate the corresponding horizontal factors obtained to obtain a similar set, extract horizontal factors from the similar set, the horizontal factors are used to correct the horizontal factors to obtain the final horizontal factors, and the final horizontal factors are used to correct the displacement data to obtain the displacement value.

[0014] Further, the corresponding horizontal factors are aggregated to obtain a similar set, and the horizontal factors are extracted from the similar set. The horizontal factors are used to correct the horizontal factors to obtain the final horizontal factors. The final horizontal factors are used to correct the displacement data to obtain the displacement value, including: Using the corresponding horizontal factors as the data set to be aggregated; Determine the expected number of clusters k as 2 and initialize the parameters of the Gaussian distribution; Calculate the probability that each data in the to-be-aggregated data set belongs to each Gaussian distribution, and obtain a responsibility value; Obtaining a data set of the corresponding level factors according to the responsibility value, and taking the data set as a close set; Arbitrarily select a horizontal factor from the similar set as the responsibility item, take the average of all the horizontal factors in the similar set as the optimization item, compare the responsibility item and the optimization item to obtain the horizontal factor, the product value of the horizontal factor and the horizontal factor is the final horizontal factor, and the product value of the final horizontal factor and the displacement data is the displacement value.

[0015] Further, when determining the stress value according to the displacement value, the stress factor and the length data, it includes: The stress values ​​are obtained from the following formula: ; in, represents the stress value, represents the displacement value, Indicates the length data, represents the stress factor.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: the verticality of the load-bearing frame and the base and the axially symmetrical arrangement of the limit grooves enhance stability, effectively reduce the offset or error of stress measurement caused by external interference, and ensure the reliability and accuracy of the measurement. Through the coordinated work of the sliding rod, the adjustment device and the adjustment unit, the position can be accurately adjusted so that the piezoelectric ceramics and the force sensor and the displacement sensor remain relatively stable, providing precise control for stress measurement. The displacement sensor, the force sensor, the level and the capacitance meter work together to comprehensively measure a variety of data to comprehensively evaluate the stress situation, avoid errors caused by a single data, and improve the accuracy of the measurement results by combining a variety of data. The limit grooves facilitate the fixing and disassembly of the load-bearing frame, reduce the installation time of the device, reduce the complexity of manual operation, and improve the timeliness of stress measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings: Figure 1 A schematic structural diagram of a stress measurement device based on piezoelectric ceramics provided in an embodiment of the present invention; Figure 2 A cross-sectional view of a load-bearing frame provided by an embodiment of the present invention; Figure 3 A front view of an adjustment unit provided in an embodiment of the present invention.

[0018] In the figure, 1, load-bearing frame; 100, groove; 101, positioning groove; 102, first sliding groove; 103, limit groove; 2, adjustment device; 200, second sliding groove; 201, telescopic rod; 202, level; 203, capacitor; 204, adjustment column; 3, force sensor; 4, platform; 5, piezoelectric ceramic; 6, displacement sensor; 7, sliding rod; 8, operating device; 9, positioning bolt; 10, limit bolt; 11, base. DETAILED DESCRIPTION

[0019] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features described in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0020] See also Figure 1-3 As shown, this embodiment provides a stress measurement device based on piezoelectric ceramics, including: a load-bearing frame 1 and a base 11, the load-bearing frame 1 is perpendicular to the upper surface of the base 11, the load-bearing frame 1 is provided with a groove 100, a positioning groove 101 and a first sliding groove 102, the load-bearing frame 1 is provided with a plurality of limit grooves 103, and the plurality of limit grooves 103 are axisymmetric about the center of the load-bearing frame 1, the first sliding groove 102 is provided with a sliding rod 7, the groove 100 is provided with an adjustment device 2, the sliding rod 7 is fixedly connected to the adjustment device 2, the sliding rod 7 slides inside the first sliding groove 102, the adjustment device 2 slides inside the groove 100, the adjustment device 2 includes an adjustment unit, the adjustment device 2 is provided with a second sliding groove 200, and the adjustment unit is in the first The second sliding groove 200 slides internally, and the adjustment unit includes a telescopic rod 201, a level 202, a capacitor 203 and an adjustment column 204. The telescopic rod 201 is fixedly connected to the adjustment column 204, and the level 202 and the capacitor 203 are fixedly connected on both sides of the adjustment column 204. The groove 100 is fixedly connected to the platform 4, and the piezoelectric ceramic 5 is placed on the platform 4. The platform 4 is fixedly connected to the displacement sensor 6. The bottom of the platform 4 is fixedly connected to one end of the force sensor 3, and the end of the force sensor 3 away from the platform 4 is fixedly connected to the groove 100. The positioning groove 101 is provided with a positioning bolt 9, and the positioning bolt 9 is used to fix the adjustment device 2. A plurality of limit grooves 103 are provided with limit bolts 10, and the limit bolts 10 are used to fix the load-bearing frame 1.

[0021] Specifically, the load-bearing frame 1 is vertically mounted on the upper surface of the base 11 to form a stable support. The groove 100, the positioning groove 101 and the first sliding groove 102 provided in the load-bearing frame 1 are intended to meet the multifunctional requirements in stress measurement. The sliding rod 7 can slide up and down in the first sliding groove 102 to measure different stress requirements. The adjustment device 2 is fixedly connected to the sliding rod 7 and slides inside the groove 100. The groove 100 provides a sliding track for the adjustment device 2, so as to achieve precise adjustment of the position of the adjustment device 2. There are preferably two limit grooves 103, which are axially symmetrically distributed around the center of the load-bearing frame 1. The limit bolts 10 are installed in the limit grooves 103. The limit bolts 10 are used to fix the load-bearing frame 1, so as to ensure the stability of the load-bearing frame 1 in high-intensity stress measurement. The adjustment device 2 is provided with a second sliding groove 200, so that the adjustment unit can slide inside the second sliding groove 200, so as to achieve fine adjustment of the adjustment column 204 of the adjustment unit. The telescopic rod 201 is fixedly connected to the adjustment column 204, and the level 202 and the capacitance meter 203 are respectively fixedly installed on both sides of the adjustment column 204. The adjustment unit can be precisely adjusted in the vertical direction to meet the stress measurement requirements under different conditions. The positioning bolt 9 provided in the positioning groove 101 is used to fix the adjustment device 2, thereby ensuring the stability of the adjustment device 2, preventing vibration from affecting the result of stress measurement, and ensuring the accuracy and reliability of the stress measurement result.

[0022] It is understandable that the platform 4 provides a placement area for the piezoelectric ceramic 5 and the displacement sensor. The piezoelectric ceramic 5 can directly sense the externally applied stress through the change of charge, thereby realizing high-precision stress detection. The displacement sensor 6 can monitor the displacement change of the piezoelectric ceramic 5 in real time, laying a data foundation for analyzing stress measurement. The force sensor 3 is used to capture the stress acting on the platform 4 and coordinate with the response of the piezoelectric ceramic 5 to improve the accuracy of the stress measurement data. By accurately adjusting the position of the sliding rod 7 and the adjustment column 204, different stress measurement requirements can be met. The displacement sensor 6 and the force sensor 3 work together to realize the synchronous collection of multi-dimensional information. In addition, the installation of the level 202 and the capacitance meter 203 on the adjustment column 204 enables the adjustment device 2 to provide accurate horizontal data and length parameters in a complex environment, providing strong technical support for stress measurement in a variety of complex scenes. The accuracy, stability and multi-dimensional information processing capabilities of the stress measurement device are improved.

[0023] In some embodiments of the present application, the stress measuring device based on piezoelectric ceramics also includes: an operating device 8, the operating device 8 is electrically connected to the sliding rod 7, the operating device 8 is electrically connected to the adjusting column 204, the operating device 8 is used to control the movement of the sliding rod 7 and the adjusting column 204, and the operating device 8 is used to read data from the level 202, the capacitance meter 203, the force sensor 3 and the displacement sensor 6.

[0024] It can be understood that the operating device 8 improves the intelligent level of stress measurement. The operating device 8 is linked with the sliding rod 7 and the adjusting column 204 through electrical connection, and their movement can be accurately controlled to meet the stress measurement requirements in different scenarios. Through the control of the sliding rod 7 by the operating device 8, the sliding rod 7 can be smoothly moved up and down along the first sliding groove 102, so as to measure the stress of the piezoelectric ceramic 5. At the same time, through the control of the adjusting column 204, the precise adjustment of the level 202 and the capacitor 203 can be achieved, ensuring that the state of the piezoelectric ceramic 5 can be monitored in real time and the rigor of the data can be ensured. The operating device 8 can not only adjust the position, but also read the collected data. It is electrically connected with the level 202, the capacitor 203, the force sensor 3 and the displacement sensor 6, and can read the data of these sensors in real time, and integrate the multi-dimensional measurement information, so as to accurately measure stress.

[0025] In some embodiments of the present application, a stress measurement device based on piezoelectric ceramics includes: when the operating device 8 controls the sliding rod 7 to return to the zero position and the adjusting column 204 to return to the zero position, the initial horizontal data of the level 202 is obtained; when the operating device 8 controls the sliding rod 7 to start to descend and the adjusting column 204 contacts the piezoelectric ceramic 5, the sliding rod 7 stops descending and the second horizontal data of the level 202 and the initial stress data of the force sensor 3 are obtained; when the adjusting column 204 contacts the piezoelectric ceramic 5, the operating device 8 controls the adjusting column 204 to descend, and obtains the third horizontal data of the level 202, the length data of the capacitor 203, the displacement data of the displacement sensor 6 and the second stress data of the force sensor 3; and the stress value of the piezoelectric ceramic 5 is calculated according to the initial horizontal data, the second horizontal data, the third horizontal data, the initial stress data, the second stress data, the displacement data and the length data.

[0026] It can be understood that when the operating device 8 controls the sliding rod 7 and the adjusting column 204 to return to the zero position respectively, the adjusting device 2 is located at the top of the groove 100, the bottom of the adjusting column 204, the bottom of the level 202 and the bottom of the capacitor 203 are in the same horizontal plane and are located inside the second sliding groove 200, and the operating device 8 obtains the initial horizontal data of the level 202. Subsequently, the operating device 8 controls the sliding rod 7 to start moving downward. When the adjusting column 204 contacts the piezoelectric ceramic 5, the operating device 8 immediately stops the downward movement of the sliding rod 7, and obtains the second horizontal data of the level 202 and the initial stress data of the force sensor 3, effectively capturing the initial state of the piezoelectric ceramic 5 before it is subjected to stress. After acquiring the second level data and the initial stress data, the operating device 8 controls the adjusting column 204 to slowly descend to apply stress to the piezoelectric ceramic 5. The operating device 8 simultaneously collects data from multiple sensors, including the third level data of the level meter 202, the length data of the capacitor 203, the displacement data of the displacement sensor 6, and the second stress data of the force sensor 3. The multi-dimensional real-time data reflects the physical state and deformation of the piezoelectric ceramic 5 during the stress process. The accuracy of stress measurement is improved. Secondly, the precise control of the operating device 8 ensures the stability and consistency of data acquisition, and effectively avoids measurement deviations caused by human factors. In addition, the stress measurement process realizes the dynamic monitoring of the stress changes of the piezoelectric ceramic 5, providing reliable data support for measuring stress values.

[0027] In some embodiments of the present application, the stress value of the piezoelectric ceramic 5 is calculated according to the initial horizontal data, the second horizontal data, the third horizontal data, the initial stress data, the second stress data, the displacement data and the length data, including: calculating the horizontal factor according to the initial horizontal data, the second horizontal data and the third horizontal data, calculating the stress factor according to the initial stress data and the second stress data, adjusting the displacement data according to the horizontal factor to obtain the displacement value, and determining the stress value according to the displacement value, the stress factor and the length data.

[0028] It can be understood that the horizontal factor of the piezoelectric ceramic 5 during the stress application process is calculated based on the initial horizontal data, the second horizontal data and the third horizontal data. This factor reflects the change in the horizontal state of the piezoelectric ceramic 5 at different measurement stages, and provides an important reference for the adjustment of subsequent data. The stress factor represents the change trend of the stress of the piezoelectric ceramic 5 during the stress process. The displacement data is adjusted using the calculated horizontal factor to obtain the corrected displacement value, thereby eliminating the displacement measurement error caused by the horizontal deviation. Finally, based on the corrected displacement value, stress factor and length data, the actual stress value of the piezoelectric ceramic 5 is determined. The horizontal factor and stress factor can effectively reduce the interference of errors on the measurement results and improve the measurement accuracy. In addition, combined with the length data and displacement value, the stress state of the piezoelectric ceramic 5 can be accurately reflected in a complex stress field, ensuring the comprehensiveness and reliability of the measurement results.

[0029] In some embodiments of the present application, calculating the level factor according to the initial level data, the second level data and the third level data includes: The horizontal factor is given by the following formula: ; in, represents the horizontal factor, represents the initial level data, represents the second level data, Represents the third level of data.

[0030] It can be understood that by calculating the horizontal factor, the relative change of the horizontal state at different stages is obtained, which reflects the trend from the initial to the final horizontal state, so that the accuracy of the results can be maintained when processing the measurement conditions, which helps to reduce the error accumulation caused by single-stage horizontal data deviation during the measurement process and improves the stability and reliability of data calculation.

[0031] In some embodiments of the present application, calculating the stress factor according to the initial stress data and the second stress data includes: The stress factor is given by the following formula: ; in, represents the stress factor, represents the initial stress data, Represents the second stress data.

[0032] It can be understood that the stress factor reflects the changing law of local stress distribution, provides a reliable data basis for the stress response of the piezoelectric ceramic 5 under different conditions, and at the same time, accurately describes the stress characteristics of the piezoelectric ceramic 5 and improves the calculation accuracy of subsequent stress values.

[0033] In some embodiments of the present application, when the displacement data is adjusted according to the horizontal factor to obtain the displacement value, it includes: when the displacement data is equal to zero, the horizontal factor is equal to the displacement value; when the displacement data is not equal to zero, the displacement data is adjusted according to the horizontal factor to obtain the displacement value.

[0034] It is understandable that the displacement data will be affected by the change of the horizontal state of the piezoelectric ceramic 5 during the measurement process, resulting in errors. By introducing the horizontal factor, the data can be dynamically adjusted according to the actual horizontal state, thereby effectively eliminating the error caused by the horizontal deviation of the piezoelectric ceramic 5, providing an accurate data basis for the calculation of subsequent stress values, and improving the accuracy of stress measurement. When the displacement data is zero, the displacement value is directly set as the horizontal factor, which optimizes the calculation logic, improves the efficiency of the device operation, reduces unnecessary resource consumption, and improves the intelligence level of the device.

[0035] In some embodiments of the present application, when the displacement data is not equal to zero, the displacement data is adjusted according to the horizontal factor to obtain the displacement value, including: collecting multiple initial horizontal data, second horizontal data and third horizontal data, and calculating their corresponding horizontal factors, aggregating the corresponding horizontal factors obtained to obtain a similar set, extracting the horizontal factor from the similar set, the horizontal factor is used to correct the horizontal factor to obtain the final horizontal factor, and the final horizontal factor is used to correct the displacement data to obtain the displacement value.

[0036] It is understandable that when the displacement data is not equal to zero, there is a displacement deviation, and the displacement data needs to be adjusted, and the measured horizontal factor will produce errors due to the randomness of the data, which needs to be corrected. Collect multiple initial horizontal data, second horizontal data, and third horizontal data, and calculate the corresponding horizontal factors each time, and aggregate the calculated multiple horizontal factors. Through aggregation, similar horizontal factors can be aggregated to form a similar set. The horizontal factors in this set have high consistency and can effectively represent the actual horizontal correction standard. The extracted horizontal factors are used to correct the horizontal factors measured by the initial horizontal data, the second horizontal data, and the third horizontal data, thereby obtaining an accurate final horizontal factor. The final horizontal factor will serve as the basis for correcting the displacement data, ensuring the accuracy of the displacement value.

[0037] In some embodiments of the present application, the corresponding horizontal factors are aggregated to obtain a similar set, and the horizontal factors are extracted from the similar set. The horizontal factors are used to correct the horizontal factors to obtain the final horizontal factors. The final horizontal factors are used to correct the displacement data. When the displacement value is obtained, it includes: taking the corresponding horizontal factors as the data set to be aggregated, determining the expected number of clusters k to be 2, and initializing the parameters of the Gaussian distribution; Calculate the probability that each data in the data set to be aggregated belongs to each Gaussian distribution, obtain the responsibility value, obtain the data set corresponding to the horizontal factor according to the responsibility value, regard the data set as a similar set, arbitrarily select a horizontal factor in the similar set as the responsibility item, take the average of all horizontal factors in the similar set as the optimization item, compare the responsibility item and the optimization item to get the horizontal factor, the product of the horizontal factor and the horizontal factor is the final horizontal factor, and the product of the final horizontal factor and the displacement data is the displacement value.

[0038] It can be understood that, taking the multiple horizontal factors to be aggregated as a data set, the expected number of clusters is selected as 2, and the multiple horizontal factors are divided into two main distributions. Then, the parameters of the Gaussian distribution are initialized, and the parameters include the mean and variance. After the parameters are initialized, the probability that the horizontal factors in the data set to be aggregated belong to each Gaussian distribution is calculated. The probability value is called the responsibility value. The responsibility value can be used to determine the degree of association between each horizontal factor and the Gaussian distribution and establish a similar set. All horizontal factors in the similar set are counted and their means are calculated. The mean is used as an optimization item. A horizontal factor in the similar set is arbitrarily selected as the responsibility item. The responsibility item and the optimization item are compared to obtain the horizontal factor. The horizontal factor corrects the horizontal factor measured by the initial horizontal data, the second horizontal data, and the third horizontal data to obtain the final horizontal factor, avoiding the contingency of calculating the horizontal factor and improving the accuracy of the horizontal factor value. The final horizontal factor is multiplied by the displacement data to correct the displacement data. The correction process combines the results of multiple data measurements, reduces the impact of data fluctuations, and improves the accuracy of the displacement value.

[0039] In some embodiments of the present application, determining the stress value according to the displacement value, the stress factor and the length data includes: The stress value is obtained from the following formula: ; in, represents the stress value, represents the displacement value, Indicates the length data, represents the stress factor.

[0040] It can be understood that the combination of displacement value, stress factor and length data, the influence of different factors on stress is comprehensively considered, the stress value can be accurately measured, the stress measurement error caused by single parameter calculation is avoided, the reliability and accuracy of the stress value result are improved, and it is helpful to achieve high-precision stress measurement. In summary, the beneficial effect of the present invention is that compared with the prior art, the beneficial effect of the present invention is that the verticality of the load-bearing frame and the base and the axisymmetric arrangement of the limit groove enhance the stability, effectively reduce the offset or error of stress measurement caused by external interference, and ensure the reliability and accuracy of the measurement. Through the coordinated work of the sliding rod, the adjustment device and the adjustment unit, the position can be accurately adjusted so that the piezoelectric ceramics and the force sensor and the displacement sensor remain relatively stable, providing precise control for stress measurement. The displacement sensor, the force sensor, the level and the capacitance meter work together to comprehensively measure multiple data and comprehensively evaluate the stress situation, avoiding the error caused by a single data, and the accuracy of the measurement results is improved by combining multiple data. The limit groove facilitates the fixing and disassembly of the load-bearing frame, reduces the installation time of the device, reduces the complexity of manual operation, and improves the timeliness of stress measurement.

[0041] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems or computer program products. Therefore, the present application may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Furthermore, the present application may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0042] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0043] These computer program instructions may also be stored in a computer-readable storage device that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable storage device produce a product including an instruction device that implements the process. Figure 1A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0044] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the present invention can still be modified or replaced by equivalents. Any modification or equivalent replacement that does not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A stress measurement device based on piezoelectric ceramics, characterized in that: include: A load-bearing frame and a base, wherein the load-bearing frame is vertically disposed on the upper surface of the base; The load-bearing frame is provided with a groove, a positioning groove and a first sliding groove, and the load-bearing frame is provided with a plurality of limiting grooves, and the plurality of limiting grooves are axially symmetrical about the center of the load-bearing frame; The first sliding groove is provided with a sliding rod, the groove is provided with an adjusting device, the sliding rod is fixedly connected to the adjusting device, the sliding rod slides inside the first sliding groove, and the adjusting device slides inside the groove; The adjusting device comprises an adjusting unit, the adjusting device is provided with a second sliding groove, and the adjusting unit slides inside the second sliding groove; The adjustment unit comprises a telescopic rod, a level, a capacitance meter and an adjustment column, the telescopic rod is fixedly connected to the adjustment column, and the level and the capacitance meter are fixedly connected to two sides of the adjustment column; The groove is fixedly connected to a platform, a piezoelectric ceramic is placed on the platform, the platform is fixedly connected to a displacement sensor, the bottom of the platform is fixedly connected to one end of a force sensor, and the end of the force sensor away from the platform is fixedly connected to the groove; The positioning groove is provided with a positioning bolt, and the positioning bolt is used to fix the adjusting device. A plurality of the limiting grooves are provided with limiting bolts, and the limiting bolts are used to fix the load-bearing frame.

2. The stress measurement device based on piezoelectric ceramics according to claim 1, characterized in that: Also includes: Operating device; The operating device is electrically connected to the sliding rod, and the operating device is electrically connected to the adjusting column. The operating device is used to control the movement of the sliding rod and the adjusting column; The operating device is used to read data from the level meter, the capacitance meter, the force sensor and the displacement sensor.

3. The stress measurement device based on piezoelectric ceramics according to claim 2, characterized in that: include: When the operating device controls the sliding rod to return to the zero position and the adjusting column to return to the zero position, initial level data of the level meter is obtained; When the operating device controls the sliding rod to start descending and the adjusting column contacts the piezoelectric ceramic, the sliding rod is stopped from descending and the second level data of the level meter and the initial stress data of the force sensor are acquired; When the adjustment column contacts the piezoelectric ceramic, the operating device controls the adjustment column to descend, and obtains the third level data of the level meter, the length data of the capacitance meter, the displacement data of the displacement sensor, and the second stress data of the force sensor; The stress value of the piezoelectric ceramic is calculated according to the initial horizontal data, the second horizontal data, the third horizontal data, the initial stress data, the second stress data, the displacement data and the length data.

4. The stress measurement device based on piezoelectric ceramics according to claim 3, characterized in that: When calculating the stress value of the piezoelectric ceramic according to the initial horizontal data, the second horizontal data, the third horizontal data, the initial stress data, the second stress data, the displacement data and the length data, it includes: calculating a horizontal factor according to the initial horizontal data, the second horizontal data and the third horizontal data; calculating a stress factor according to the initial stress data and the second stress data; The displacement data is adjusted according to the horizontal factor to obtain a displacement value, and the stress value is determined according to the displacement value, the stress factor and the length data.

5. The stress measuring device based on piezoelectric ceramics according to claim 4, characterized in that: When calculating the level factor according to the initial level data, the second level data and the third level data, it includes: The level factor is given by the following formula: ； in, represents the level factor, represents the initial level data, represents the second level data, represents the third level data.

6. The stress measurement device based on piezoelectric ceramics according to claim 5, characterized in that: Calculating the stress factor according to the initial stress data and the second stress data includes: The stress factor is given by the following formula: ； in, represents the stress factor, represents the initial stress data, represents the second stress data.

7. The stress measuring device based on piezoelectric ceramics according to claim 6, characterized in that: When the displacement data is adjusted according to the horizontal factor to obtain the displacement value, it includes: When the displacement data is equal to zero, the horizontal factor is equal to the displacement value; When the displacement data is not equal to zero, the displacement data is adjusted according to the horizontal factor to obtain the displacement value.

8. The stress measuring device based on piezoelectric ceramics according to claim 7, characterized in that: When the displacement data is not equal to zero, adjusting the displacement data according to the horizontal factor to obtain a displacement value includes: Collect multiple times of initial horizontal data, second horizontal data and third horizontal data, and calculate their corresponding horizontal factors, aggregate the corresponding horizontal factors obtained to obtain a similar set, extract horizontal factors from the similar set, the horizontal factors are used to correct the horizontal factors to obtain the final horizontal factors, and the final horizontal factors are used to correct the displacement data to obtain the displacement value.

9. The stress measurement device based on piezoelectric ceramics according to claim 8, characterized in that: Aggregating the corresponding horizontal factors obtained to obtain a similar set, extracting horizontal factors from the similar set, and using the horizontal factors to correct the horizontal factors to obtain a final horizontal factor, and using the final horizontal factor to correct the displacement data to obtain the displacement value, including: Using the corresponding horizontal factors as the data set to be aggregated; Determine the expected number of clusters k as 2 and initialize the parameters of the Gaussian distribution; Calculate the probability that each data in the to-be-aggregated data set belongs to each Gaussian distribution, and obtain a responsibility value; Obtaining a data set of the corresponding level factors according to the responsibility value, and taking the data set as a close set; Arbitrarily select a horizontal factor from the similar set as the responsibility item, take the average of all the horizontal factors in the similar set as the optimization item, compare the responsibility item and the optimization item to obtain the horizontal factor, the product value of the horizontal factor and the horizontal factor is the final horizontal factor, and the product value of the final horizontal factor and the displacement data is the displacement value.

10. The stress measurement device based on piezoelectric ceramics according to claim 9, characterized in that: Determining the stress value according to the displacement value, the stress factor and the length data comprises: The stress values ​​are obtained from the following formula: ； in, represents the stress value, represents the displacement value, Indicates the length data, represents the stress factor.

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