Silicon carbide wafer stage detection device and detection method thereof

Abstract

The present invention belongs to the field of detection technology, and in particular to a silicon carbide wafer carrier detection device and a detection method thereof; the present invention provides a silicon carbide wafer carrier detection device, comprising: a carrier, a bottom wall of which is provided with a plurality of adsorption holes; at least two detection components, the detection components are slidably arranged in an annular groove of the inner bottom wall of the carrier, and are located at the circumferential edge of the wafer; a spray component, which is arranged on the outer wall of the carrier, and one spray component corresponds to one detection component; wherein, after the bottom wall of the wafer abuts against the inner bottom wall of the carrier, the spray component sprays water to the outer wall of the detection component to detect whether the wafer is stably adsorbed by the carrier; if the wafer is not stably adsorbed, one detection component squeezes the outer wall of the wafer from top to bottom during radial sliding, and the other detection components push the wafer from bottom to top away from the carrier during radial sliding; through the arrangement of the detection components, the stability of the wafer being adsorbed by negative pressure is detected.

Description

Technical Field

[0001] The present invention belongs to the field of detection technology, and specifically relates to testing adsorption stability, and more particularly to a silicon carbide wafer stage detection device and a detection method thereof. Background Art

[0002] In the semiconductor silicon carbide substrate industry, traditional processing methods require grinding and thinning the wafer; therefore, a vacuum stage is required to limit and fix the wafer.

[0003] In the related art, after the wafer is placed horizontally on the vacuum suction stage, negative pressure adsorption is performed on the bottom wall of the wafer. However, due to the inconsistent smoothness of the bottom wall of the wafer, after the wafer is placed on the stage, the negative pressure adsorption force of the vacuum suction stage on the wafer is insufficient, and the wafer fixing stability is poor, causing the wafer to move relative to the vacuum suction stage during the grinding process.

[0004] However, the traditional vacuum suction stage lacks effective detection means to determine whether the wafer is adsorbed and fixed.

[0005] Therefore, how to detect whether the wafer is stably adsorbed by the negative pressure of the vacuum stage is a technical problem that needs to be solved urgently in this field.

[0006] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0007] The embodiments of the present disclosure at least provide a silicon carbide wafer stage detection device and a detection method thereof.

[0008] In a first aspect, an embodiment of the present disclosure provides a silicon carbide wafer stage detection device, comprising:

[0009] The bearing platform has a plurality of adsorption holes on its bottom wall;

[0010] At least two detection components, which are slidably disposed in the annular groove of the inner bottom wall of the carrier platform and are located at the circumferential edge of the wafer;

[0011] A spray assembly is arranged on the outer wall of the bearing platform, and one spray assembly corresponds to one detection assembly;

[0012] After the bottom wall of the wafer abuts against the inner bottom wall of the carrier, the spray assembly sprays water toward the outer wall of the detection assembly to detect whether the wafer is stably adsorbed by the carrier;

[0013] If the wafer is adsorbed unstably, one detection component will press the outer wall of the wafer from top to bottom when sliding radially, and other detection components will push the wafer from bottom to top away from the carrier when sliding radially.

[0014] In an optional embodiment, the detection assembly includes: a fixing frame adapted to slide circumferentially in the annular groove;

[0015] An adjusting block, which is slidably arranged in the fixing frame;

[0016] A limit bar, which is arranged on the adjusting block, and the side wall of the limit bar is suitable for abutting against the outer wall of the wafer;

[0017] When the bottom wall of the wafer abuts against the inner bottom wall of the carrier, a gap is provided between the inner wall of each limit strip and the outer wall of the wafer;

[0018] When a limit bar is pushed to move toward the axis of the wafer, the limit bar slides inward and squeezes the outer wall of the wafer to detect whether the wafer is adsorbed stably.

[0019] In an optional embodiment, two sliding grooves are symmetrically provided on both sides of the inner wall of the fixing frame, and a linear rack is provided at the inner bottom of each sliding groove;

[0020] Two gears are symmetrically arranged on both sides of the outer wall of the adjustment block, and the gears are meshed with the linear rack;

[0021] When the adjusting block moves toward the axis of the carrier platform, the limiting strip is suitable for turning toward the outer wall of the wafer with the gear as the axis.

[0022] In an optional embodiment, the horizontal height of the adjustment block is greater than that of the fixing frame, so that a gap is provided between the bottom wall of the limit strip and the upper surface of the fixing frame;

[0023] Wherein, when the adjusting block moves radially along the bearing platform, the limiting strip is suitable for flipping inwards or outwards relative to the fixing frame.

[0024] In an optional embodiment, a positioning ring is rotatably provided on the inner bottom wall of the annular groove, and each fixing frame is equidistantly provided on the positioning ring.

[0025] In an optional embodiment, the limiting bar is in an arc shape that matches the outer wall of the wafer, and the horizontal height of the limiting bar is greater than the horizontal height of the wafer.

[0026] In an optional embodiment, when the spray device sprays water onto the end wall of the limit strip, the water flow is suitable for pushing the limit strip so that the positioning ring slides circumferentially in the annular groove;

[0027] When the spray device sprays water onto the outer wall of the limit strip, the water flow pushes the limit strip to make the adjustment block slide radially along the bearing platform.

[0028] In an optional embodiment, the spray device includes: a fixed pipe, which is vertically arranged on the outer wall of the supporting platform and is hollow inside;

[0029] A steering head, which is rotatably arranged on the upper end of the outer wall of the fixed tube;

[0030] The spray head is arranged on the outer wall of the steering head and is communicated with the interior of the fixed pipe.

[0031] In an optional embodiment, the bottom wall of the carrier platform is provided with a plurality of adsorption holes;

[0032] A positioning ring, which is rotatably arranged in the annular groove of the inner bottom wall of the bearing platform;

[0033] At least two detection components, which are arranged on the positioning ring and located at the circumferential edge of the wafer;

[0034] A spray assembly is arranged on the outer wall of the bearing platform, and one spray assembly corresponds to one detection assembly;

[0035] The detection assembly comprises: a fixing frame, which is arranged at the upper end of the positioning ring and is suitable for sliding circumferentially in the ring groove;

[0036] An adjusting block, which is slidably arranged in the fixing frame;

[0037] A limit bar, which is arranged on the adjusting block, and the side wall of the limit bar is suitable for abutting against the outer wall of the wafer;

[0038] After the bottom wall of the wafer abuts against the inner bottom wall of the carrier, the spray assembly sprays water toward the outer wall of the limit bar to detect whether the wafer is stably adsorbed by the carrier;

[0039] If the wafer is adsorbed unstably, one detection component will press the outer wall of the wafer from top to bottom when sliding radially, and other detection components will push the wafer from bottom to top away from the carrier when sliding radially.

[0040] In an optional embodiment, two sliding grooves are symmetrically provided on both sides of the inner wall of the fixing frame, and a linear rack is provided at the inner bottom of each sliding groove;

[0041] Two gears are symmetrically arranged on both sides of the outer wall of the adjustment block, and the gears are meshed with the linear rack;

[0042] When the adjusting block moves toward the axis of the carrier platform, the limiting strip is suitable for turning toward the outer wall of the wafer with the gear as the axis.

[0043] In an optional embodiment, the horizontal height of the adjustment block is greater than that of the fixing frame, so that a gap is provided between the bottom wall of the limit strip and the upper surface of the fixing frame;

[0044] Wherein, when the adjusting block moves radially along the bearing platform, the limiting strip is suitable for flipping inwards or outwards relative to the fixing frame.

[0045] In a second aspect, an embodiment of the present disclosure further provides a detection method of a detection device, the detection method comprising:

[0046] After the wafer is placed horizontally on the carrier, the adsorption holes are negatively pressurized to limit the wafer;

[0047] The spray component sprays water onto the outer wall of a detection component, and the detection component moves inward along the radial direction of the carrier to detect the stability of the wafer being adsorbed by negative pressure;

[0048] If the wafer is adsorbed unstably, one detection component will press the outer wall of the wafer from top to bottom when sliding radially, and simultaneously push the wafer to slide horizontally, and other detection components will push the wafer from bottom to top when sliding radially to move it away from the carrier;

[0049] The dragged wafer is limited by adsorption, and a detection component cannot push the wafer to slide horizontally relative to the carrier when sliding radially.

[0050] The beneficial effect of the present invention is that the silicon carbide wafer stage detection device of the present invention cooperates with the detection component and the spray component. After the wafer is adsorbed and fixed by the adsorption hole, the spray component sprays water to the outer wall of the detection component to push the detection component to move horizontally. The stability of the wafer when it is adsorbed by negative pressure is checked by checking whether the detection component can push the wafer to move horizontally synchronously. If the wafer is adsorbed unstably, one detection component squeezes the outer wall of the wafer from top to bottom during radial sliding, and other detection components push the wafer from bottom to top away from the carrier during radial sliding. This avoids the synchronous rotation of the wafer with the grinding disc due to unstable adsorption during the wafer processing and grinding, thereby improving the grinding efficiency.

[0051] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0052] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0054] Figure 1A three-dimensional diagram of a silicon carbide wafer stage detection device provided in an embodiment of the present disclosure;

[0055] Figure 2 A three-dimensional diagram of a carrier platform and a detection assembly provided in an embodiment of the present disclosure;

[0056] Figure 3 A three-dimensional diagram of a detection assembly provided in an embodiment of the present disclosure;

[0057] Figure 4 A cutaway perspective view of a detection assembly provided in an embodiment of the present disclosure;

[0058] Figure 5 A front view of a spray assembly provided in an embodiment of the present disclosure;

[0059] Figure 6 A schematic diagram of a detection component detecting a wafer status provided in an embodiment of the present disclosure.

[0060] In the figure:

[0061] 1. Carrying platform; 10. Adsorption hole; 11. Positioning ring;

[0062] 2. Detection assembly; 21. Fixed frame; 22. Adjustment block; 23. Limiting strip; 24. Sliding slot; 25. Gear; 26. Linear rack;

[0063] 3. Spray assembly; 31. Fixed pipe; 32. Steering head; 33. Spray head; 4. Wafer. DETAILED DESCRIPTION

[0064] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0065] In this article, when it is mentioned that the first component is located on the second component, this may mean that the first component may be directly formed on the second component, or the third component may be interposed between the first component and the second component. In addition, in the drawings, in order to effectively describe the technical content, the thickness of the components may be exaggerated or reduced.

[0066] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0067] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limited. As used herein, the singular articles "one", "an" and "the" may also be intended to include plural forms, unless it is clearly indicated above that this is not the case. The terms "comprise", "include" and "have" are inclusive, and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0068] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0069] Research has found the shortcomings of the existing technology: in the related technology, after the wafer is placed horizontally on the vacuum suction stage, the bottom wall of the wafer is subjected to negative pressure adsorption. However, due to the inconsistent smoothness of the bottom wall of the wafer, after the wafer is placed on the stage, the negative pressure adsorption force of the vacuum suction stage on the wafer is insufficient, and the wafer fixing stability is poor, causing the wafer to move relative to the vacuum suction stage during the grinding process.

[0070] However, the traditional vacuum suction stage lacks effective detection means to determine whether the wafer is adsorbed and fixed.

[0071] Therefore, how to detect whether the wafer is stably adsorbed by the negative pressure of the vacuum stage is a technical problem that needs to be solved urgently in this field.

[0072] The defects existing in the above solutions are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present invention in this article for the above problems should be the contributions made by the inventor to the present invention during the disclosure process.

[0073] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0074] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0075] like Figures 1 to 6 As shown, some embodiments provide a silicon carbide wafer stage detection device, including:

[0076] The carrier 1 has a plurality of adsorption holes 10 on its bottom wall; the adsorption holes 10 are connected to the air pump, and when the wafer 4 is placed horizontally on the carrier 1, the air pump uses negative pressure suction to limit and fix the wafer 4, thereby improving the stability of the wafer 4 during the polishing process. At least two detection components 2, the detection components 2 are slidably arranged in the annular groove of the inner bottom wall of the carrier 1, and are located at the circumferential edge of the wafer 4; the spray component 3 is arranged on the outer wall of the carrier 1, and one spray component 3 corresponds to one detection component 2; preferably, the spray head 33 of the spray component 3, its horizontal height and spray angle can be adjusted in real time according to the polishing process; in the water-flowing state, the height and angle of the water spray can be adjusted through the control panel, and the appropriate height and angle of the water spray can be found quickly and accurately, saving time, improving work efficiency, and improving the first-time pass rate and yield of the product. Among them, after the bottom wall of the wafer 4 abuts against the inner bottom wall of the carrier 1, the spray component 3 sprays water to the outer wall of the detection component 2 to detect whether the wafer 4 is stably adsorbed by the carrier 1; when the wafer 4 is stably adsorbed by the negative pressure, the detection component 2 moves along the radial direction of the carrier 1 and will not push the wafer 4 to move horizontally. If the wafer 4 is not stably adsorbed, one detection component 2 squeezes the outer wall of the wafer 4 from top to bottom when sliding radially. At this time, the wafer 4 is pushed to move horizontally, and the wafer 4 pushes other detection components 2 to slide radially. When moving, other detection components 2 push the wafer 4 from bottom to top away from the carrier 1.

[0077] During detection, only one spray assembly 3 sprays water outward, and the other spray assemblies 3 stop working. When polishing the wafer 4, each spray assembly 3 sprays water synchronously. Through the cooperation between the detection assembly 2 and the spray assembly 3, after the wafer 4 is adsorbed and fixed by the adsorption hole 10, the spray assembly 3 sprays water to the outer wall of the detection assembly 2 to push the detection assembly 2 to move horizontally. The stability of the wafer 4 when adsorbed by negative pressure is checked by checking whether the detection assembly 2 can push the wafer 4 to move horizontally synchronously. If the wafer 4 is adsorbed unstably, one detection assembly 2 squeezes the outer wall of the wafer 4 from top to bottom during radial sliding, and the other detection assemblies 2 push the wafer 4 from bottom to top away from the carrier 1 during radial sliding. This avoids the synchronous rotation of the wafer 4 with the grinding disc due to unstable adsorption during the processing and polishing of the wafer 4, thereby improving the polishing efficiency.

[0078] Reference Figure 3 The detection assembly 2 includes: a fixed frame 21, which is suitable for sliding in the circumferential direction in the annular groove; the fixed frame 21 is arranged along the radial direction of the carrier 1, and when the spray device sprays water to the side walls at both ends of the limit strip 23, the fixed frame 21 is suitable for sliding in the annular groove along the circumferential direction of the carrier 1. An adjustment block 22 is slidably arranged in the fixed frame 21; the adjustment block 22 can slide relative to the fixed frame 21, and the adjustment block 22 is also suitable for flipping relative to the fixed frame 21. A limit strip 23 is arranged on the adjustment block 22, and the side wall of the limit strip 23 is suitable for abutting against the outer wall of the wafer 4; the limit strip 23 is an arc shape that matches the outer wall of the wafer 4, and the horizontal height of the limit strip 23 is greater than the horizontal height of the wafer 4. When the wafer 4 is horizontally placed above the inner bottom wall of the carrier 1, the fixed frame 21 is located below the wafer 4, and the limit strip 23 is located outside the wafer 4, and the limit strip 23 has a gap with the outer wall of the wafer 4. Among them, when the bottom wall of the wafer 4 abuts against the inner bottom wall of the carrier 1, a gap is provided between the inner wall of each limit bar 23 and the outer wall of the wafer 4; when a spray assembly 3 sprays water to the outer wall of the corresponding limit bar 23, the water flow pushes the limit bar 23 to move the limit bar 23 toward the axis of the wafer 4, and the limit bar 23 slides inward to squeeze the outer wall of the wafer 4 to detect whether the wafer 4 is adsorbed stably. If the wafer 4 is fixed by the negative pressure adsorption of each adsorption hole 10, the wafer 4 will not be horizontally displaced at this time. If the stability of the wafer 4 being adsorbed and fixed by the negative pressure hole is not good, the wafer 4 moves horizontally relative to the carrier 1. When the wafer 4 moves horizontally, it is suitable to push the limit bars 23 at other positions and move synchronously away from the axis of the carrier 1.

[0079] Reference Figure 4, two sliding grooves 24 are symmetrically provided on both sides of the inner wall of the fixed frame 21, and the sliding grooves 24 extend along the length direction of the fixed frame 21. A linear rack 26 is provided at the inner bottom of each sliding groove 24; two gears 25 are symmetrically provided on both sides of the outer wall of the adjustment block 22, and the gears 25 and the linear racks 26 are meshed with each other; wherein, when the adjustment block 22 moves toward the axis direction of the carrier 1, the limit bar 23 is suitable for turning toward the outer wall of the wafer 4 with the gear 25 as the axis. When the limit bar 23 is pushed to move along the radial direction of the carrier 1, the adjustment block 22 moves synchronously, and the adjustment block 22 drives the gear 25 to move synchronously. When the gear 25 moves, it rotates relative to the linear rack 26, so that the adjustment block 22 turns over with the gear 25 as the axis. When the adjustment block 22 moves toward the axis direction of the carrier 1, the limit bar 23 gradually moves toward the outer wall of the wafer 4, and the limit bar 23 squeezes the outer wall of the wafer 4 from the outside to the inside as the adjustment block 22 turns over.

[0080] Reference Figure 4 The horizontal height of the adjusting block 22 is greater than that of the fixing frame 21, so that a gap is provided between the bottom wall of the limiting strip 23 and the upper surface of the fixing frame 21; wherein, when the adjusting block 22 moves radially along the supporting platform 1, the limiting strip 23 is suitable for flipping inward or outward relative to the fixing frame 21.

[0081] Reference Figure 2 In order to enable each fixing frame 21 to slide synchronously along the circumferential direction of the bearing platform 1, a positioning ring 11 is rotatably provided on the inner bottom wall of the annular groove, and each fixing frame 21 is arranged on the positioning ring 11 at equal intervals. When any spray head 33 sprays water to the end wall of the limit bar 23, the water flow is suitable for pushing the limit bar 23 to slide along the circumferential direction of the annular groove, and the limit bar 23 drives the positioning ring 11 to rotate synchronously, so that the remaining fixing frames 21 move synchronously. When the spray device sprays water to the end wall of the limit bar 23, the water flow is suitable for pushing the limit bar 23 to make the positioning ring 11 slide circumferentially in the inner ring groove; when the spray device sprays water to the outer wall of the limit bar 23, the water flow pushes the limit bar 23 to make the adjustment block 22 slide radially along the bearing platform 1.

[0082] Reference Figure 5The spray device includes: a fixed pipe 31, which is vertically arranged on the outer wall of the supporting platform 1 and is hollow inside; the fixed pipe 31 is connected to the water inlet pipe, and the fixed pipe 31 can be set to be liftable, and the water outlet height of the spray head 33 can be adjusted by adjusting the lifting and lowering of the fixed pipe 31. The steering head 32 is rotatably arranged on the upper end of the outer wall of the fixed pipe 31; the spray head 33 is arranged on the outer wall of the steering head 32 and is connected to the inside of the fixed pipe 31. The height of the fixed pipe 31 and the flip angle of the steering head 32 can be adjusted through the control panel. In the water-flowing state, the height and angle of the water spray can be adjusted through the control panel, so as to quickly and accurately find the appropriate height and angle of the water spray, and solve the problem of too long time to adjust the water spray position and inadequate adjustment.

[0083] Some embodiments provide a silicon carbide wafer stage detection device, including:

[0084] The support platform 1 has a plurality of adsorption holes 10 on its bottom wall;

[0085] A positioning ring 11, which is rotatably arranged in a ring groove on the inner bottom wall of the bearing platform 1;

[0086] At least two detection components 2, wherein the detection components 2 are arranged on the positioning ring 11 and are located at the circumferential edge of the wafer 4;

[0087] A spray component 3, which is arranged on the outer wall of the supporting platform 1, and one spray component 3 corresponds to one detection component 2;

[0088] The detection assembly 2 comprises: a fixing frame 21, which is arranged at the upper end of the positioning ring 11 and is suitable for circumferential sliding in the ring groove;

[0089] An adjusting block 22, which is slidably disposed in the fixing frame 21;

[0090] A limit bar 23, which is arranged on the adjusting block 22, and the side wall of the limit bar 23 is suitable for abutting against the outer wall of the wafer 4;

[0091] After the bottom wall of the wafer 4 abuts against the inner bottom wall of the carrier 1, the spray assembly 3 sprays water toward the outer wall of the limiting strip 23 to detect whether the wafer 4 is stably adsorbed by the carrier 1;

[0092] If the wafer 4 is adsorbed unstably, one detection component 2 presses the outer wall of the wafer 4 from top to bottom when sliding radially, and the other detection components 2 push the wafer 4 from bottom to top when sliding radially, away from the carrier 1.

[0093] Furthermore, two sliding grooves 24 are symmetrically formed on both sides of the inner wall of the fixing frame 21, and a linear rack 26 is disposed at the inner bottom of each sliding groove 24;

[0094] Two gears 25 are symmetrically arranged on both sides of the outer wall of the adjustment block 22, and the gears 25 are meshed with the linear rack 26;

[0095] When the adjusting block 22 moves toward the axis of the carrier platform 1 , the limiting bar 23 is adapted to be turned toward the outer wall of the wafer 4 with the gear 25 as the axis.

[0096] Furthermore, the horizontal height of the adjustment block 22 is greater than that of the fixing frame 21, so that a gap is provided between the bottom wall of the limiting strip 23 and the upper surface of the fixing frame 21;

[0097] When the adjusting block 22 moves radially along the supporting platform 1 , the limiting strip 23 is adapted to flip inward or outward relative to the fixing frame 21 .

[0098] Some embodiments provide a detection method of a detection device, the detection method comprising:

[0099] After the wafer 4 is horizontally placed on the carrier 1, the adsorption holes 10 are negatively adsorbed to limit the position of the wafer 4;

[0100] The spray component 3 sprays water onto the outer wall of a detection component 2, and the detection component 2 moves inward along the radial direction of the carrier 1 to detect the stability of the wafer 4 being adsorbed by negative pressure;

[0101] If the wafer 4 is adsorbed unstably, one detection component 2 presses the outer wall of the wafer 4 from top to bottom when sliding radially, and simultaneously pushes the wafer 4 to slide horizontally, and the other detection components 2 push the wafer 4 from bottom to top when sliding radially to move away from the carrier 1;

[0102] The drag wafer 4 is adsorbed and limited, and one detection component 2 cannot push the wafer 4 to slide horizontally relative to the supporting platform 1 when sliding radially.

[0103] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0104] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0105] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A silicon carbide wafer stage detection device, characterized in that: include: A supporting platform (1) has a bottom wall provided with a plurality of adsorption holes (10); At least two detection components (2), the detection components (2) being slidably arranged in an annular groove on the inner bottom wall of the carrier platform (1) and being located at the circumferential edge of the wafer; A spray assembly (3) arranged on the outer wall of the support platform (1), and one spray assembly (3) corresponds to one detection assembly (2); After the bottom wall of the wafer contacts the inner bottom wall of the carrier platform (1), the spray component (3) sprays water toward the outer wall of the detection component (2). If the wafer is adsorbed unstably, one detection component (2) presses the outer wall of the wafer from top to bottom when sliding radially, and the other detection components (2) push the wafer from bottom to top when sliding radially, so that the wafer moves on the carrier (1).

2. The silicon carbide wafer stage detection device according to claim 1, characterized in that: The detection assembly (2) comprises: a fixing frame (21) adapted to slide in the annular groove; An adjustment block (22) slidably disposed in the fixing frame (21); A limit strip (23) arranged on the adjustment block (22), the side wall of the limit strip (23) being suitable for abutting against the outer wall of the wafer; When the bottom wall of the wafer abuts against the inner bottom wall of the carrier platform (1), a gap is provided between the inner wall of each limiting strip (23) and the outer wall of the wafer; When a limiting bar (23) is pushed to move in the axial direction of the wafer, the limiting bar (23) slides inwards to press the outer wall of the wafer to detect whether the wafer is adsorbed stably.

3. The silicon carbide wafer stage detection device according to claim 2, characterized in that: Two sliding grooves (24) are symmetrically formed on both sides of the inner wall of the fixing frame (21), and a linear rack is provided at the inner bottom of each sliding groove (24); Two gears are symmetrically arranged on both sides of the outer wall of the adjustment block (22), and the gears are meshed with the linear rack; When the adjustment block (22) moves toward the axis of the carrier platform (1), the limit strip (23) is adapted to flip toward the outer wall of the wafer with the gear as the axis.

4. The silicon carbide wafer stage detection device according to claim 2, characterized in that: The horizontal height of the adjustment block (22) is greater than that of the fixing frame (21), so that a gap is provided between the bottom wall of the limiting strip (23) and the upper surface of the fixing frame (21); Wherein, when the adjustment block (22) moves radially along the support platform (1), the limit strip (23) is suitable for turning inward or outward relative to the fixing frame (21).

5. The silicon carbide wafer stage detection device according to claim 2, characterized in that: A positioning ring (11) is rotatably arranged on the inner bottom wall of the annular groove, and each fixing frame (21) is arranged on the positioning ring (11) at equal intervals.

6. The silicon carbide wafer stage detection device according to claim 2, characterized in that: The limiting strip (23) is in an arc shape that matches the outer wall of the wafer, and the horizontal height of the limiting strip (23) is greater than the horizontal height of the wafer.

7. The silicon carbide wafer stage detection device according to claim 5 or 6, characterized in that: When the spray device sprays water onto the end wall of the limiting strip (23), the water flow is suitable for pushing the limiting strip (23) so that the positioning ring (11) slides circumferentially in the annular groove; When the spray device sprays water onto the outer wall of the limit strip (23), the water flow pushes the limit strip (23) to cause the adjustment block (22) to slide radially along the support platform (1).

8. The silicon carbide wafer stage detection device according to claim 2, characterized in that: The spray assembly (3) comprises: a fixed pipe (31) which is vertically arranged on the outer wall of the supporting platform (1) and is hollow inside; A steering head (32) rotatably disposed on the upper end of the outer wall of the fixed tube (31); A spray head (33) is arranged on the outer wall of the steering head (32) and is communicated with the interior of the fixed pipe (31).

9. A detection method of a detection device, characterized in that: Using the silicon carbide wafer stage detection device as described in any one of claims 1 to 8, the detection method comprises: After the wafer is horizontally placed on the carrier (1), the adsorption holes (10) are negatively adsorbed to position the wafer; The spray component (3) sprays water onto the outer wall of a detection component (2), and the detection component (2) moves inward along the radial direction of the carrier platform (1) to detect the stability of the wafer being adsorbed by negative pressure; If the wafer is adsorbed unstably, one detection component (2) presses the outer wall of the wafer from top to bottom when sliding radially, and simultaneously pushes the wafer to slide horizontally, and the other detection components (2) push the wafer from bottom to top when sliding radially to move it away from the carrier (1); The dragged wafer is adsorbed and limited, and a detection component (2) cannot push the wafer to slide horizontally relative to the carrier platform (1) when sliding radially.

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