Probe assembly

Abstract

A probe assembly according to an embodiment of the present disclosure includes: a probe pin array extending from one end to the other end and including a first contact portion, a second contact portion, and an intermediate portion disposed between the first contact portion and the second contact portion; a guide panel coupled to the probe pin array so as to penetrate the first contact portion; and a wafer module coupled to the probe pin array so that the intermediate portion passes through the wafer module.

Description

Technical Field

[0001] The present disclosure relates to a probe assembly. Background Art

[0002] Generally speaking, semiconductor module refers to a general term for circuit boards that contain stacked semiconductor components to perform specific functions, such as display modules, camera modules, communication modules, memory cards, video cards, phone socket modules, semiconductor probe cards, etc.

[0003] The probe assembly is a device mounted to electrically connect such a semiconductor module to a circuit board such as a main board, and can be configured to electrically connect to a connection structure of the circuit board to achieve a predetermined function by inserting the connection terminal of the semiconductor module into a socket.

[0004] The conventional probe assembly is inserted and removed in a forced coupling form in which the semiconductor module is forcibly pushed toward the upper part of the probe pins included in the probe assembly for insertion. Therefore, there is a problem that the product is damaged due to excessive friction.

[0005] In addition, with the recent high integration of semiconductor modules, the circuit pattern formed on the wafer through the manufacturing process has become highly integrated, so the distance between adjacent contact pads, that is, the pitch, is formed to be very narrow. Therefore, in order to reduce the pitch with adjacent probe pins, the thickness of each probe pin is designed to be thinner.

[0006] However, as described above, when the thickness of the probe pin is reduced, the strength is reduced, so that the lateral force applied during the inspection process causes damage to the probe pin or damage to the contact pad on the wafer that contacts the probe pin.

[0007] Prior art literature

[0008] Patent Literature

[0009] (Patent Document 0001) Korean Patent No. 10-0984876 (Announced on October 4, 2010) Summary of the invention

[0010] Problems to be solved by the invention

[0011] The present disclosure is proposed to solve the above-mentioned problem and provides a probe assembly, which improves the manufacturing and processing accuracy, thereby reducing the spacing between multiple contact pins included in the probe pin array.

[0012] However, the technical problem to be solved by this embodiment is not limited to the technical problem described above, and there may be other technical problems.

[0013] Solutions for solving problems

[0014] According to one embodiment of the present disclosure, a probe assembly may include: a probe pin array, which extends from one end to the other end and includes a first contact portion, a second contact portion and an intermediate portion arranged between the first contact portion and the second contact portion; a guide panel, which is combined with the probe pin array in a manner that allows the first contact portion to pass through; and a wafer module, which is combined with the probe pin array in a manner that allows the intermediate portion to pass through.

[0015] Effects of the Invention

[0016] According to an embodiment of the present disclosure, the manufacturing error of a wafer module that performs the guiding function of a probe pin array is reduced, and the alignment accuracy can be improved.

[0017] Furthermore, according to an embodiment of the present disclosure, the minimum pitch (Min. Pitch) between a plurality of contact pins included in a probe pin array is reduced, and processing time and cost can be reduced while ensuring a high yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is an exploded perspective view of a probe assembly in the prior art.

[0019] Figure 2 It is a combined stereoscopic diagram of a probe assembly according to an embodiment of the present disclosure.

[0020] Figure 3a It is an exploded perspective view of a probe assembly according to an embodiment of the present disclosure.

[0021] Figure 3b It is a combined three-dimensional diagram of a wafer module according to an embodiment of the present disclosure.

[0022] Figure 4a The figure is a combined plan view of a contact pin combined with a cover according to an embodiment of the present disclosure.

[0023] Figure 4b The figure is an exploded perspective view of a contact pin combined with a cover according to an embodiment of the present disclosure.

[0024] Figure 4c It is a front view of a contact pin according to an embodiment of the present disclosure.

[0025] Description of reference numerals:

[0026] 300: Probe assembly

[0027] 310: Probe Pin Array

[0028] 330: Wafer module

[0029] 350: First guide pin

[0030] 360: Guide Panel

[0031] 370: Block cover

[0032] 380: Second guide pin

[0033] 390: Block base. DETAILED DESCRIPTION

[0034] Below, the embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person skilled in the art with general knowledge in the art can easily implement them. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted in the accompanying drawings, and similar parts are marked with similar reference numerals throughout the specification.

[0035] Throughout the specification, when a component is referred to as being “on” another component, this includes not only a case where the component is in contact with the other component but also a case where there is another component between the two components.

[0036] Throughout the specification, when a part is said to “comprise” a certain constituent element, it means that it does not exclude other constituent elements and may further include other constituent elements unless otherwise specified.

[0037] The terms "approximately", "substantially", etc. used throughout the specification to express degree are used in the sense of being equal to or close to the numerical value when the inherent manufacturing and material tolerances are indicated in the mentioned meaning, and are used to prevent unscrupulous infringers from improperly using the disclosure content that mentions precise or absolute numerical values ​​to help understand the present invention. The terms "to (the) step" or "the step of to" used throughout the specification to express degree do not mean "the step of to".

[0038] Throughout the specification, the term "combination(s) thereof" included in the expression in Markush form refers to a mixture or combination of one or more selected from the group consisting of constituent elements described in the expression in Markush form, and means including one or more selected from the group consisting of the above constituent elements.

[0039] Throughout the specification, the description of "A and / or B" means "A or B, or A and B".

[0040] Hereinafter, embodiments and examples of the present application will be described in detail with reference to the accompanying drawings. However, the present application may not be limited to these embodiments, examples and drawings.

[0041] Figure 1FIG. 1 is an exploded perspective view of a probe assembly 100 according to the prior art.

[0042] Reference Figure 1 , a probe assembly 100 of the related art may include a probe pin 110 , a pin guide slot 120 , a first housing 130 , a second housing 140 , a first shaft 150 , a floating guide 160 , a main board 170 and / or a second shaft 180 .

[0043] The probe pin 110 may include at least one pin in a blade shape. A contact protrusion may be formed on the probe pin 110, and an electrical signal may be applied by contacting the contact protrusion with a contact pad formed on an inspection device, a printed circuit board, and / or a wafer.

[0044] The pin guide slot 120 may be integrated with the probe pin 110. For example, at least one slit is formed in the pin guide slot 120 so that the probe pin 110 composed of at least one pin can be inserted therein, and at least one pin is respectively inserted into at least one slit, thereby being integrated.

[0045] The first housing 130 and the second housing 140 can be combined in a manner of respectively surrounding the pin guide slit 120 integrated with the probe pin 110 in the upper and lower directions. As an embodiment, both ends of at least one pin exposed in a state of being combined with the pin guide slit 120 can be exposed to the outside through the first housing 130 and the second housing 140.

[0046] The first housing 130 and the second housing 140 may be formed of a high-function engineering plastic material, such as polyetherimide (PEI).

[0047] As one embodiment, the first shell 130 and the second shell 140 may be connected through the first shaft 150. As one embodiment, the first shaft 150 is slidably inserted into the first shell 130 and the second shell 140, thereby connecting through the first shell 130 and the second shell 140 respectively, and the first shell 130 and the second shell 140 are connected in a state where the pin guide slit 120 connected to the probe pin 110 is provided between the first shell 130 and the second shell 140, so that the first shell 130 and the second shell 140 can be connected as one.

[0048] The floating guide 160 of one embodiment may be combined with the upper portion of the first housing 130. As one embodiment, the floating guide 160 may be plug-in-coupled to a portion of the first housing 130 from the outside of the first housing 130. One end of the probe pin 110 exposed to the outside through the first housing 130 may be exposed to the outside through the floating guide 160.

[0049] The main board 170 of one embodiment may be combined with the upper portion of the floating guide 160. One end portion of the probe pin 110 exposed to the outside through the first housing 130 and the floating guide 160 may be exposed to the outside through the main board 170.

[0050] In one embodiment, the second shaft 180 can be connected to the main board 170. In one embodiment, one end of the second shaft 180 can be connected to the main board 170 by sliding, and the other end of the second shaft 180 can be connected to another component. In one embodiment, the main board 170 is fixed to another component through the second shaft 180, so that the probe assembly 100 can be fixedly connected.

[0051] The first housing 130, the second housing 140 and / or the pin guide slot 120 of one embodiment can be manufactured by mold-based processing and / or mechanical slot processing. Therefore, there are limitations in dealing with the probe pins 110 that require fine pitch. Even if processing is possible, there are problems such as low yield rate, increased processing time and cost.

[0052] Figure 2 FIG. 4 is a combined stereoscopic diagram of a probe assembly 300 according to an embodiment of the present disclosure. Figure 3a FIG. 4 is an exploded perspective view of a probe assembly 300 according to an embodiment of the present disclosure. Figure 3b FIG. 3 is a combined three-dimensional diagram of a wafer module 330 according to an embodiment of the present disclosure.

[0053] Reference Figure 2 , Figure 3a and Figure 3b , a probe assembly 300 of an embodiment may include a probe pin array 310 , a guide panel 360 and / or a wafer module 330 .

[0054] As an embodiment, the probe pin array 310 can be an interface structure for transmitting signals and / or currents between a circuit board and / or a measurement fixture (JIG). The probe pin array 310 prevents a connector (not shown) in contact with the probe assembly 300 from being damaged, and can manage the electrical characteristics required by each probe assembly 300.

[0055] The probe pin array 310 of one embodiment may be in a shape extending from one end to the other end. As one embodiment, the probe pin array 310 may include a plurality of contact pins. As one embodiment, the probe pin array 310 (or a plurality of contact pins) may include a first contact portion, a second contact portion, and an intermediate portion disposed between the first contact portion and the second contact portion.

[0056] The guide panel 360 of one embodiment can be combined with the probe pin array 310 in a manner that the first contact portion of the probe pin array 310 passes through. As one embodiment, a side portion (e.g., the first contact portion) of the probe pin array 310 can be inserted into the interior of the guide panel 360 to pass through the guide panel 360, thereby being exposed to the outside of the guide panel 360.

[0057] As an embodiment, the guide panel 360 assists in alignment in a manner of forming a normal contact between B2B connectors and can protect the protruding pogo pins of the probe pin array 310. As an embodiment, the guide panel 360 can determine the protruding length of the first contact portion of the probe pin array 310. As an embodiment, the guide panel 360 can be formed of a PEI film (e.g., ULTEM 1000) material among super engineering plastic films.

[0058] The wafer module 330 of one embodiment can be combined with the probe pin array 310 in a manner that the middle portion of the probe pin array 310 is penetrated. As one embodiment, the other side portion (e.g., the second contact portion) of the probe pin array can be inserted into the interior of the wafer module 330 to penetrate the wafer module 330, thereby being exposed to the outside of the wafer module 330. As one embodiment, in the probe pin array 310, the second contact portion penetrates the wafer module 330 to be exposed to the outside of the wafer module 330, and is combined in a state where a portion between the exposed portions is surrounded by the wafer module 330.

[0059] As an embodiment, the wafer module 330 may be formed by a micro-electronic mechanical system (MEMS) process. As an embodiment, the wafer module 330 may be formed by a polymer material. For example, the polymer material may be ceramic polyetheretherketone (ceramic peek) in which ceramic is reinforced in silicone or polyetheretherketone (peek).

[0060] Thus, compared with the existing pin guide slots (eg, Figure 1 The wafer module 330 that guides the probe pin array 310 can improve the alignment accuracy. Figure 1 If the manufacturing error of the pin guide slit 120 is about 20 [μm], the manufacturing error of the wafer module 330 of the present application formed by the MEMS process can be reduced to less than 5 [μm].

[0061] In addition, according to the existing pin guide slit 120, the minimum pitch (Min. Pitch) between the plurality of contact pins included in the probe pin array 310 is at least 300 [μm] or more, but the wafer module 330 of the present application can achieve the minimum pitch between the plurality of contact pins to be less than 100 [μm]. In addition, according to the wafer module 330 of the present application, a high yield rate can be ensured, and processing time and cost can be reduced.

[0062] The wafer module 330 of one embodiment may include a wafer top 331 and a wafer bottom 333 formed of a silicone material, and a fixing panel 335 disposed between the wafer top 331 and the wafer bottom 333 in a manner of separating the wafer top 331 and the wafer bottom 333 in a direction parallel to the direction in which the probe pin array 310 extends. As one embodiment, the wafer module 330 may be a structure in which the wafer top 331, the fixing panel 335 and the wafer bottom 333 are stacked in sequence.

[0063] The wafer top 331 and the wafer bottom 333 of one embodiment can be combined with the probe pin array 310 through the first through holes 337 respectively corresponding to the plurality of contact pins included in the probe pin array 310. For example, the wafer top 331 and the wafer bottom 333 separated from each other along the height direction can fix the plurality of contact pins even if they have a thin thickness, so that the plurality of contact pins will not move and / or deform along the plane direction. As one embodiment, when the plurality of contact pins are inserted, the wafer top 331 and the wafer bottom 333 prevent the plurality of contact pins from being disengaged and can guide the plurality of contact pins to a specified contact position.

[0064] As an embodiment, a first through hole 337 having a shape corresponding to the cross section of a plurality of contact pins may be formed on the wafer top 331 and the wafer bottom 333. As an embodiment, the wafer top 331 and / or the wafer bottom 333 may be plugged and combined with the plurality of contact pins inserted into the first through hole 337, respectively. For example, the first through hole 337 formed on the wafer top 331 may have a shape corresponding to the cross section of the first contact portion. For example, the first through hole 337 formed on the wafer bottom 333 may have a shape corresponding to the cross section of the middle portion.

[0065] As one embodiment, a second through hole 339 through which the probe pin array 310 passes may be formed in the center of the fixed panel 335 disposed between the wafer top 331 and the wafer bottom 333. As one embodiment, the second through hole 339 may be a hole through which the probe pin array 310 including a plurality of contact pins passes as a whole. For example, the second through hole 339 may be formed in a quadrilateral shape in a manner corresponding to the shape and arrangement of the plurality of contact pins, thereby making it easy to ensure accuracy.

[0066] Thus, the probe pin array 310 including a plurality of contact pins may have an air gap between the wafer top 331 and the wafer bottom 333, which is exposed to the air through the second through hole 339 of the fixing panel 335. As an embodiment, the air gap of the fixing panel 335 may improve the electrical characteristics of the probe assembly 300.

[0067] As an embodiment, the capacitor of the probe pin array 310 according to the air gap height may be changed by adjusting the thickness of the fixing panel 335 disposed between the wafer top 331 and the wafer bottom 333 , thereby increasing the degree of freedom of impedance matching.

[0068] As an embodiment, in the probe pin array 310 of the probe assembly 300, the input / output impedance (Z) between the two ends must be matched to an impedance (Z0) determined by an inductor physical quantity (L) dependent on the contact pin length and a capacitor physical quantity (C) generated between the plurality of contact pins, in order to achieve signal transmission without reflection loss. The impedance (Z0) of the probe pin array 310 can be expressed as follows.

[0069]

Mathematical formula 1

[0070]

[0071] The capacitance (C) between the plurality of contact pins is expressed as follows.

[0072]

Mathematical formula 2

[0073]

[0074] Among them, ε r is the dielectric constant, d is the distance between multiple contact pins, and A is the area of ​​the contact pin.

[0075] For example, in order to solve the problem that the capacitance (C) between the plurality of contact pins increases due to the integrated probe assembly 300 and / or the probe pin array 310 (d becomes smaller), so that the impedance mismatch of the probe pin array 310 is increased, the dielectric constant (ε) of the dielectric can be reduced. r ). Through the air gap of one embodiment of the present invention, the dielectric between the plurality of contact pins becomes a dielectric with a very small dielectric constant (ε r =1) air, thereby, the impedance matching of the probe pin array 310 can be achieved by reducing the capacitance (C) between the plurality of contact pins.

[0076] At least one first guide pin 350 of one embodiment may extend between the guide panel 360 and the wafer module 330 in a direction parallel to the direction in which the probe pin array 310 extends. As one embodiment, both ends of the at least one first guide pin 350 may be respectively coupled to the guide panel 360 and the wafer module 330. Through the at least one first guide pin 350, the guide panel 360 and the wafer module 330 may be slidably coupled and aligned along the direction in which the first guide pin 350 extends, and distortion may be prevented.

[0077] For example, a locking plate for limiting sliding is formed on at least one of the first guide pins 350 , and the guide panel 360 may be coupled to one side and the wafer module 330 may be coupled to the other side based on the locking plate.

[0078] As an embodiment, one end of at least one first guide pin 350 is disposed outside the probe pin array 310 and inserted into the guide panel 360 to penetrate the guide panel 360. For example, one end of at least one first guide pin 350 may be exposed to the outside by being inserted into a through hole formed in the guide panel 360. Through the at least one first guide pin 350, the wafer top 331, the fixing panel 335, and / or the wafer bottom 333 included in the wafer module 330 may be aligned along the direction in which the first guide pin 350 extends.

[0079] As an embodiment, the other end of the first guide pin 350 may be inserted into the wafer module 330. For example, the other end of the first guide pin 350 may be exposed to the outside by being inserted into a through hole formed in at least a portion of the wafer top 331, the fixing panel 335, and / or the wafer bottom 333. As an embodiment, the first guide pin 350 may be formed of stainless steel (e.g., SUS303).

[0080] The block cover 370 of one embodiment may cover the guide panel 360, the probe pin array 310, and the wafer module 330 on one side. The block base 390 of one embodiment may cover the guide panel 360, the probe pin array 310, and the wafer module 330 on the other side.

[0081] As an embodiment, the block cover 370 may be a structure that becomes a reference for product assembly of the probe assembly 300. As an embodiment, the block cover 370 sets constraints on the driving of the guide panel 360 and can prevent the guide panel 360 from being separated. As an embodiment, the block cover 370 adjusts the moving distance of other component structures and can adjust the protrusion amount of at least one first guide pin 350 and / or at least one second guide pin 380. As an embodiment, the block cover 370 may be formed of an aluminum material (AL6061).

[0082] As an embodiment, the block cover 370 and the block base 390 may cover the guide panel 360, the probe pin array 310 and the wafer module 330 on both sides. For example, the block cover 370 may be disposed on one side of the guide panel 360, and the block base 390 may be disposed on the other side of the wafer module 330.

[0083] At least one second guide pin 380 of one embodiment may extend in a direction parallel to the direction in which the probe pin array 310 extends. As one embodiment, at least one second guide pin 380 passes through the wafer module 330, and both ends thereof may be respectively coupled to the block cover 370 and the block base 390. At least one second guide pin 380 may couple the wafer module 330, the block cover 370, and the block base 390. Furthermore, at least one second guide pin 380 may also couple or engage with the wafer module 330, the block cover 370, and / or the block base 390.

[0084] For example, the at least one second guide pin 380 extends in a direction parallel to the at least one first guide pin 350 , and may be disposed at an outer side of the at least one first guide pin 350 .

[0085] As an embodiment, one end of at least one second guide pin 380 is connected to the wafer module 330 by passing through the wafer module 330 (e.g., the fixed panel 335), and can be connected to the block cover 370 by inserting or passing through the block cover 370. For example, a stopper plate for limiting sliding is formed on at least one second guide pin 380, and the wafer module 330 (e.g., the fixed panel 335) and the block cover 370 can be connected on one side with the stopper plate as a reference, and the block base 390 can be connected on the other side.

[0086] As an embodiment, the fixing panel 335 includes a bonding area extending outward from the wafer top 331 and the wafer bottom 333 , and the bonding area may be penetrated by at least one second guide pin 380 .

[0087] As an embodiment, the other end of the at least one second guide pin 380 may be combined with the block base 390 by being inserted into or penetrating the block base 390 .

[0088] As an embodiment, at least one second guide pin 380 may extend through the block base 390 to protrude toward the outside of the block base 390 .

[0089] As an embodiment, the guide panel 360 is a structure for preventing the first contact portion of the probe pin array 310 exposed to the outside from being damaged, and can determine the protruding length of the probe pin array 310. As an embodiment, the guide panel 360 can guide the alignment between the connector (not shown) combined with the probe assembly 300 and the probe assembly 300.

[0090] The guide panel 360 of one embodiment may include: a first portion 361, which is inserted into the block cover 370 (e.g., the exposure hole 375); a second portion 363, which extends outward between the block cover 370 and the block base 390 compared to the exposure hole 375; and / or a third portion 365, which is formed to protrude from the above-mentioned first portion 361 inserted into the exposure hole 375 to the outside of the above-mentioned block cover 370 through the above-mentioned exposure hole 375.

[0091] As an embodiment, the block cover 370 is a structure that becomes a reference of the probe assembly 300 and can be formed to set a movable distance of the guide panel 360 and / or a protruding length of the at least one second guide pin 380 according to product specifications of the probe pin array 310 .

[0092] As one embodiment, the block cover 370 is formed with an exposure hole 375 that penetrates in such a way that the first portion 361 of the guide panel 360 is inserted inside and exposed to the outside, and the first portion 361 of the guide panel 360 can be exposed to the outside of the block cover 370 by being inserted into the exposure hole 375 of the block cover 370. As one embodiment, the block cover 370 is shaped to surround at least a portion of the guide panel 360 (for example, the second portion 363) on the outside, thereby constraining the movement of the guide panel 360 and preventing the guide panel 360 from detaching.

[0093] As an embodiment, the second portion 363 of the guide panel 360 is disposed between the block cover 370 and the block base 390 on one side of the first portion 361, and extends outward compared to the exposure hole 375 of the block cover 370, thereby being engaged with the block cover 370. As an embodiment, the guide panel 360 is engaged with the block cover 370 through the second portion 363, thereby preventing the guide panel 360 from being separated from the outside of the block cover 370.

[0094] As an embodiment, the third portion 365 of the guide panel 360 may protrude from the first portion 361 to the outside of the block cover 370. As an embodiment, the first contact portion of the probe pin array 310 may be exposed to the outside by sequentially penetrating the second portion 363, the first portion 361, and the third portion 365 of the guide panel 360. As an embodiment, the first contact portion of the probe pin array 310 may be exposed to the outside of the block cover 370 through the third portion 365 of the guide panel 360 exposed to the outside of the block cover 370.

[0095] As an embodiment, the block base 390 can expose the second contact portion of the probe pin array 310 to the outside. In addition, the block base 390 is fixed to at least a portion of the probe pin array 310 in a manner to prevent the probe pin array 310 from being separated, and can serve as a bonding reference between the inspection object (not shown, a circuit board or a measuring instrument, etc.) and the probe assembly 300.

[0096] As an embodiment, the block base 390 can be formed to set a movable distance of the guide panel 360 and / or a protruding length of the at least one second guide pin 380 according to a product specification of the probe pin array 310 .

[0097] As an embodiment, the structure of the probe pin array 310 of the guide probe assembly 300 is formed by a MEMS process, thereby improving the alignment accuracy of the probe pin array 310 .

[0098] Figure 4a FIG. 4 is a combined plan view of a contact pin 400 combined with covers 460 and 470 according to an embodiment of the present disclosure. Figure 4b FIG. 4 is an exploded perspective view of a contact pin 400 combined with covers 460 and 470 according to an embodiment of the present disclosure. Figure 4c It is a front view of a contact pin 400 according to an embodiment of the present disclosure.

[0099] Reference Figure 4a , Figure 4b and Figure 4c , the contact pin 400 of an embodiment may include a first contact portion 410 , a second contact portion 420 , a middle portion 430 and / or a sidewall portion 480 .

[0100] As an embodiment, the contact pin 400 may be formed by a micro-electronic mechanical system (MEMS) process. As an embodiment, the contact pin 400 is a pogo pin type, and may include an elastically deformable middle portion 430 and covers 460 and 470 disposed on both sides.

[0101] As an embodiment, in the first contact portion 410, at least one contact protrusion protruding upward is formed in a manner of facing the inspection device, and the inspection device can be contacted through the contact protrusion. Figure 4a and Figure 4b As shown, the contact protrusion may be formed in a plurality of forms, such as Figure 4c As shown, a single contact protrusion may also be formed.

[0102] As an embodiment, a middle portion 430 may be provided between the first contact portion 410 and the second contact portion 420. As an embodiment, the middle portion 430 may be provided with a plate-shaped region 435 extending between the first contact portion 410 and the second contact portion 420 along a direction intersecting the arrangement direction connecting the first contact portion 410 and the second contact portion 420 (e.g., a perpendicular direction), a first elastic portion 440, and a second elastic portion 450.

[0103] As an embodiment, the plate-shaped area 435 of the middle portion 430 is arranged between the first contact portion 410 and the second contact portion 420, and divides the first elastic portion 440 and the second elastic portion 450. Thus, the forces generated in the first contact portion 410 and the second contact portion 420 by the lateral force consistent with the arrangement direction connecting the first contact portion 410 and the second contact portion 420 do not affect each other. Therefore, the stability of the first contact portion 410 and the second contact portion 420 can be improved, and the stability can also be maintained against external vibration or external force.

[0104] The side wall portion 480 of one embodiment may be formed into a plate shape extending from the plate-shaped area 435 of the middle portion 430 along the arrangement direction. Since the side wall portion 480 extends bidirectionally from the middle portion 430, it is possible to prevent the first elastic portion 440 and / or the second elastic portion 450 from failing to achieve elastic recovery and deforming the appearance when a lateral force is applied to the contact pin 400. In addition, since the side wall portion 480 is provided on one side of the contact pin 400, the process of inserting the contact pin 400 into the inspection device becomes easy and the working efficiency can be increased. That is, during the operation of the first elastic portion 440 and / or the second elastic portion 450, the side wall portion 480 can perform a guiding role.

[0105] The contact pin 400 of one embodiment may include a first elastic portion 440 and / or a second elastic portion 450 that are compressed and deformed by a lateral force acting on the contact pin 400. As one embodiment, the first elastic portion 440 may be configured as a zigzag shape formed by connecting at least one straight portion 442 and at least one curved portion 441. As one embodiment, the second elastic portion 450 may be configured as a zigzag shape formed by connecting at least one straight portion 452 and at least one curved portion 451. For example, the first elastic portion 440 and / or the second elastic portion 450 are compressed and deformed along the vertical direction by a lateral force acting on the contact pin 400, and the curved portions 441 and 451 can be displaced along the two-side direction according to the strength of the lateral force, so that they can be arranged in a manner close to or connected to the side wall portion 480.

[0106] As an embodiment, the first elastic portion 440 may be connected to the first contact portion 410 and the second elastic portion 450 , and / or may be connected to the middle portion 430 and the second contact portion 420 , and may be retractable along the arrangement direction.

[0107] The contact pin 400 of one embodiment may be combined with covers 460 and 470 that cover at least a portion of the area (eg, the middle portion 430 ) at the front and rear sides.

[0108] As one embodiment, when a lateral force is applied to the contact pin 400, the first elastic portion 440 and / or the second elastic portion 450 bends toward the front or rear where the cover 460, 470 is located, whereby a portion of the first elastic portion 440 and / or the second elastic portion 450 can be disposed in a manner close to or connected to the cover 460, 470 disposed in the front or rear.

[0109] The foregoing description of the present disclosure is for illustrative purposes only, and those skilled in the art of the present disclosure should know that the present disclosure can be easily transformed into other specific forms without changing the technical ideas or essential features of the present disclosure. Therefore, the embodiments described above should be understood to be illustrative rather than restrictive in all respects. For example, each constituent element described as a single type may be implemented in a distributed manner, and similarly, constituent elements described as distributed may be implemented in a combined manner.

[0110] The scope of the present disclosure is determined by the claims rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts should be construed as being included in the scope of the present disclosure.

Claims

1. A probe assembly, characterized in that: include: a probe pin array configured to extend from one end to the other end and including a first contact portion, a second contact portion, and an intermediate portion configured between the first contact portion and the second contact portion; a guide panel configured to be combined with the probe pin array in such a manner that the first contact portion penetrates therethrough; and The wafer module is configured to be combined with the probe pin array in a manner that the middle portion penetrates.

2. The probe assembly according to claim 1, characterized in that: The wafer module is formed by a micro-electro-mechanical system process.

3. The probe assembly according to claim 1, characterized in that: The wafer module includes a wafer top and a wafer bottom formed of organic silicon material. The wafer top and the wafer bottom are combined with the probe pin array through first through holes, and the first through holes respectively correspond to a plurality of contact pins included in the probe pin array.

4. The probe assembly according to claim 3, characterized in that: The wafer module further includes a fixing panel disposed between the wafer top and the wafer bottom in a manner of separating the wafer top and the wafer bottom along a direction parallel to a direction in which the probe pin array extends.

5. The probe assembly according to claim 4, characterized in that: A second through hole is formed in the center of the fixed panel so that the probe pin array passes through the second through hole.

6. The probe assembly according to claim 1, characterized in that: Also includes: At least one first guide pin is configured to extend between the guide panel and the wafer module along a direction parallel to the direction in which the probe pin array extends, and both ends of the at least one first guide pin are respectively combined with the guide panel and the wafer module.

7. The probe assembly according to claim 1, characterized in that: Also includes: a block cover configured to cover the guide panel, the probe pin array, and the wafer module on one side; a block base configured to cover the guide panel, the probe pin array and the wafer module on the other side; as well as At least one second guide pin is configured to extend in a direction parallel to the direction in which the probe pin array extends and penetrate the wafer module, and both ends of the at least one second guide pin are respectively combined with the block cover and the block base.

8. The probe assembly according to claim 7, characterized in that: The wafer module further includes: a fixed panel, which is arranged between the top of the wafer and the bottom of the wafer in a manner of separating the top of the wafer and the bottom of the wafer in a direction parallel to the direction in which the probe pin array extends, The fixing panel includes a bonding area extending in an outer direction than the wafer top and the wafer bottom, and the at least one second guide pin penetrates through the bonding area.

9. The probe assembly according to claim 7, characterized in that: The at least one second guide pin extends through the block base so as to protrude toward the outside of the block base.

10. The probe assembly according to claim 7, characterized in that: The block cover is formed with an exposing hole penetrating therethrough in such a manner that the first portion of the guide panel is inserted inside and exposed to the outside. The guide panel includes the first portion and a second portion extending outwardly from the exposing hole between the block cover and the block base, so as to be engaged with the block cover through the second portion.

11. The probe assembly according to claim 10, characterized in that: The guide panel includes a third portion formed to protrude from the first portion inserted into the exposure hole to the outside of the block cover through the exposure hole, In the probe pin array, the first contact portion is exposed to the outside through the third portion.

Images