Integrated circuit high temperature testing device

Abstract

The present invention relates to the technical field of circuit element detection, and proposes an integrated circuit high temperature test device, comprising a machine body, the machine body having a heating chamber, the heating chamber having an opening; a placement rack cyclically conveyingly arranged in the heating chamber, the placement rack being used to place an integrated circuit board; a detection member lifting and sliding relative to the machine body, and being arranged horizontally, and being located on one side of the opening. Through the above technical solution, the problem of cumbersome operation and low efficiency in the production and quality inspection of integrated circuits in the prior art is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit element detection, and in particular to a high-temperature testing device for integrated circuits. Background Art

[0002] In the production and quality inspection process of integrated circuits, it is crucial to ensure their stable performance in high temperature environments. However, the existing technical means usually use special heating equipment to uniformly heat a batch of integrated circuit boards, then take out these circuit boards one by one after heating, and then use separate testing equipment for performance testing. This traditional operation method has obvious defects. First, the entire process is divided into two independent steps of heating and testing, and the circuit boards need to be transferred between different equipment. Not only is the operation cumbersome, but it is also easy to damage the circuit boards during the transfer process. Secondly, the method of taking out one by one for separate testing is extremely inefficient and difficult to meet the needs of large-scale production and rapid testing. In addition, due to the time interval between heating and testing, the temperature of the circuit board may drop after it is taken out, resulting in the accuracy of the test results being affected. Moreover, the time interval between heating and testing of different batches of circuit boards may be inconsistent, further increasing the uncertainty of the test results. Summary of the invention

[0003] The present invention provides a high-temperature testing device for integrated circuits, which solves the problem of complicated operation and low efficiency in the production and quality inspection of integrated circuits in the related art.

[0004] The technical solution of the present invention is as follows:

[0005] An integrated circuit high temperature test device is used to perform a heating test on an integrated circuit board, comprising:

[0006] A machine body, wherein the machine body has a heating chamber, and the heating chamber has an opening;

[0007] A placement rack, the placement rack is arranged in the heating chamber for cyclic transmission, and the placement rack is used to place the integrated circuit board;

[0008] A detection member, the detection member is arranged to be lifted and lowered relative to the body and to slide horizontally, and is located at one side of the opening;

[0009] A feed rack and a discharging rack, both of which are arranged on the machine body and are respectively located on both sides of the opening, the feed rack is used to store the undetected integrated circuit boards, and the discharging rack is used to store the detected integrated circuit boards.

[0010] As a further technical solution, the inner wall of the heating chamber has a first annular guide groove, and further comprises:

[0011] A sliding guide, one end of which is arranged on the side wall of the placement rack, and the other end of which is slidably arranged in the first annular guide groove, and the sliding guide is used to keep the placement rack parallel to the bottom surface of the body during movement.

[0012] As a further technical solution, the first annular guide groove has an inner annular groove and an outer annular groove, the outer annular groove is located at the periphery of the inner annular groove, the sliding guide has a first sliding portion and a second sliding portion, the first sliding portion and the second sliding portion are alternately slidably disposed in the outer annular groove and the inner annular groove;

[0013] The opening portion is located at the top of the heating chamber, and the inner ring groove and the outer ring groove both have equidistant sections and intersection sections. The equidistant sections and the intersection sections are arranged in pairs and are alternately arranged end to end. The equidistant sections of the inner ring groove and the outer ring groove are parallel to each other, and the first sliding part and the second sliding part slide into the outer ring groove and the inner ring groove alternately after passing through the intersection section.

[0014] As a further technical solution, the inner wall of the heating chamber also has an outer arc portion, the first annular guide groove is an inner groove, the outer arc portion is located on one side of the intersection section of the outer annular groove, and there are also two of them, and the sliding guide also has a third sliding portion and a fourth sliding portion, and the third sliding portion and the fourth sliding portion are configured to be driven by the placement rack to move and then roll into or cancel the abutment with the outer arc portion close to the opening, or roll into or cancel the abutment with the outer arc portion away from the opening.

[0015] As a further technical solution, the transverse direction is defined as the conveying direction, and further includes:

[0016] A first top member, the first top member is arranged on the feed rack, and an output end thereof moves horizontally, the moving direction being perpendicular to the conveying direction, and the output end of the first top member is configured to abut against or cancel abutment with a side edge of the integrated circuit board after movement;

[0017] A second top piece, the second top piece is arranged on the feed rack and is located below the integrated circuit board, the second top piece moves in a vertical direction, and the output end of the second top piece is configured to abut against the bottom of the integrated circuit board after movement and drive the integrated circuit board to move upward;

[0018] The third top piece is arranged on the feed rack and is located on a side of the integrated circuit board away from the opening. The moving direction of the output end of the third top piece is along the horizontal direction. The output end of the third top piece is configured to abut against the side wall of the integrated circuit board after movement and drive the integrated circuit board to move along the conveying direction.

[0019] As a further technical solution, it also includes:

[0020] A fourth top piece, the fourth top piece is arranged on the discharging rack, the moving direction of the output end of the fourth top piece is horizontal and perpendicular to the conveying direction, and the output end of the fourth top piece is configured to abut against or cancel the abutment with the integrated circuit board after moving;

[0021] A fifth top piece, the fifth top piece is arranged on the discharging frame, the conveying direction of the output end of the fifth top piece is the vertical direction, and the output end of the fifth top piece is configured to abut against the bottom of the integrated circuit board after moving and drive the integrated circuit board to move upward;

[0022] A sixth top member, the sixth top member is arranged on the machine body and is located between the feed rack and the discharge rack, and the output end of the sixth top member moves along the conveying direction, and after moving, abuts against the side wall of the integrated circuit board, driving the integrated circuit board to move in a direction close to the discharge rack;

[0023] The side of the integrated circuit board has an edge, the first top piece and the fourth top piece are arranged in pairs and are located on both sides of the integrated circuit board, and the first top piece and the fourth top piece both have a clamping part, which is used to abut against the edge to provide force for the edge to move upward.

[0024] As a further technical solution, the side of the integrated circuit board has an edge, and further comprises:

[0025] A slider, the slider is transversely slidably arranged on the feed rack, and the slider has a vertical slide groove;

[0026] A pusher, the pusher is vertically slidably disposed in the vertical slide groove, and the pusher is configured to be driven by the slider to slide horizontally, and then abut against the edge to drive the integrated circuit board to slide, or cancel the abutment with the edge;

[0027] a first elastic member, wherein one end of the first elastic member acts on the bottom wall of the vertical slide groove, and the other end of the first elastic member acts on the bottom of the push member to provide a force for the push member to slide in a direction away from the bottom wall of the vertical slide groove;

[0028] A rotating support member is rotatably arranged on the feed rack, and the rotating axis is in the horizontal direction. The rotating support member has a plurality of supporting grooves in the circumferential direction. The rotating support member is configured so that after rotation, the inner walls of the plurality of supporting grooves are sequentially used to abut against the edges of the integrated circuit board from bottom to top to support the integrated circuit board.

[0029] As a further technical solution, it also includes:

[0030] A containing rack, the containing rack is arranged on the feeding rack, the containing rack has a rotating chamber, the rotating chamber has a lower opening, and the lower opening is opened downward;

[0031] A rotating transmission member, the rotating transmission member is rotatably arranged in the rotating cavity, the rotating transmission member has a clamped portion, the rotating transmission member is configured so that after rotation, the clamped portion extends out of the lower opening portion or cancels extending out of the lower opening portion, the rotating shaft of the rotating transmission member is drivingly connected with the rotating shaft of the rotating supporting member, the rotating transmission member is a polygon, and each side has the clamped portion;

[0032] A push block is arranged on the slider, and is configured to, after being driven by the slider to slide, abut against the clamped portion and push the rotating transmission member to rotate, and after rotation, the push block slides and abuts against the side of the rotating transmission member.

[0033] As a further technical solution, the rotating transmission member has a positioning slot, and the receiving frame also has a longitudinal slide slot;

[0034] A positioning card, wherein the positioning card is slidably disposed in the longitudinal slide groove, and the positioning card has a positioning card portion, and the positioning card is configured such that after sliding, the positioning card portion is inserted into the positioning card slot or leaves the positioning card slot;

[0035] A second elastic member, one end of which acts on the bottom wall of the longitudinal slide groove, and the other end of which acts on the positioning card to provide a force for the positioning card to slide in a direction away from the bottom wall of the longitudinal slide groove.

[0036] As a further technical solution, the slider, the pusher, the rotating support, the accommodating frame, the rotating transmission member, the push block and the positioning card together constitute a supporting assembly, and the supporting assembly is arranged in pairs and is respectively located on both sides of the longitudinal direction of the integrated circuit board, and further includes:

[0037] A linear drive member is disposed on the feed rack to drive the slide block to slide back and forth laterally.

[0038] The working principle and beneficial effects of the present invention are:

[0039] In the present invention, the integrated circuit board to be tested is accurately placed in the positioning groove of the placement rack. The device is started, and the placement rack is driven by the synchronous belt to circulate at a uniform speed in the heating chamber. After the placement rack circulates the integrated circuit board for one cycle, it stops accurately at the position of the opening. At this time, the detection part is lowered by the electric push rod, and at the same time slides horizontally along the linear guide rail to the top of the opening, and approaches the integrated circuit board for performance testing. After the test is completed, the detection part rises and slides horizontally to reset, waiting for the next integrated circuit board to be tested. The method of circulating the placement rack for one cycle and then conducting the test improves the production rhythm and significantly improves the work efficiency. Ensure that the integrated circuit board is heated evenly and fully in the heating chamber, and provide stable temperature conditions for accurate detection. The sealing structure of the opening effectively reduces heat loss, reduces energy consumption, and saves production costs. Stable testing conditions and precise operating procedures help to improve the accuracy and consistency of the test results, thereby ensuring product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The preferred implementation modes will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present invention.

[0041] Figure 1 It is a schematic diagram of the structure of the present invention;

[0042] Figure 2 It is a schematic diagram of the internal structure of the present invention;

[0043] Figure 3 This is a schematic diagram of the internal structure of the present invention from another perspective;

[0044] Figure 4 for Figure 2 A partial enlarged structural diagram of the middle part;

[0045] Figure 5 for Figure 3 A schematic diagram of the partially enlarged structure of the middle B part;

[0046] Figure 6 This is a schematic diagram of the structure of the feed rack in Example 2 of the present invention;

[0047] Figure 7 for Figure 5 Schematic diagram of the partial internal structure;

[0048] Figure 8 for Figure 7 Schematic diagram of the partially enlarged structure of part C in the middle.

[0049] In the figure: integrated circuit board 1, edge portion 101, body 2, heating chamber 201, opening portion 202, first annular guide groove 203, inner annular groove 204, outer annular groove 205, equidistant section 206, intersection section 207, outer arc portion 208, detection member 3, sliding guide member 4, first sliding portion 401, second sliding portion 402, third sliding portion 403, fourth sliding portion 404, feed rack 5, discharge rack 6, first top member 7, second top member 8, third top member 9, fourth top member 10, clamping portion 1001 , the fifth top member -11, the sixth top member -12, the slider -13, the vertical slide groove -1301, the pushing member -14, the first elastic member -15, the rotating supporting member -16, the supporting groove -1601, the accommodating frame -17, the rotating cavity -1701, the lower opening portion -1702, the longitudinal slide groove -1703, the rotating transmission member -18, the clamped portion -1801, the positioning clamping groove -1802, the placing frame -19, the pushing block -20, the positioning clamping member -21, the supporting assembly -2100, the positioning clamping portion -2101, the second elastic member -22, and the linear driving member -23. DETAILED DESCRIPTION

[0050] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0051] In order to simplify the drawings, only the parts related to the invention are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically shown, or only one of them is marked. In this article, "one" not only means "only one", but also means "more than one", and "several" includes "two" and "more than two".

[0052] In this document, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0053] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0054] Reference Figure 1~Figure 5 The first embodiment of the present invention provides an integrated circuit high temperature testing device for performing a heating test on an integrated circuit board 1, comprising a body 2, the body 2 having a heating chamber 201, the heating chamber 201 having an opening 202; a placement rack 19 is arranged in the heating chamber 201 for cyclic conveying, the placement rack 19 is used to place the integrated circuit board 1; a detection member 3 is arranged to be lifted and lowered relative to the body 2 and to slide horizontally, and is located on one side of the opening 202.

[0055] In this embodiment, the heating chamber 201 is provided with uniformly distributed heating elements, such as resistance wires, and the chamber wall is made of heat-insulating materials, such as asbestos. The placement rack 19 is made of high-temperature resistant metal materials, such as stainless steel, and is provided with positioning grooves on the surface to fix the integrated circuit board 1. The placement rack 19 is circulated and transported in the heating chamber 201 through a transmission system of chains and sprockets. The detection component 3: includes detection components such as probes and sensors, which are installed on a mechanical structure that can be lifted and lowered and slid horizontally, and driven by a motor. The integrated circuit board 1 to be tested is accurately placed in the positioning groove of the placement rack 19. The device is started, and the placement rack 19 is driven by a synchronous belt to circulate uniformly in the heating chamber 201. After the placement rack 19 circulates the integrated circuit board 1 for one week, it stops precisely at the position of the opening 202. At this time, the detection component 3 is lowered by the electric push rod, and at the same time slides horizontally along the linear guide rail to the top of the opening 202, and approaches the integrated circuit board 1 for performance testing. After the detection is completed, the detection component 3 rises and slides horizontally to reset, waiting for the detection of the next integrated circuit board 1. The method of testing after one cycle of the placement rack 19 improves the production rhythm and significantly improves the work efficiency. It ensures that the integrated circuit board 1 is heated evenly and fully in the heating chamber 201, providing stable temperature conditions for accurate testing. The sealing structure of the opening 202 effectively reduces heat loss, reduces energy consumption, and saves production costs. Stable testing conditions and precise operating procedures help to improve the accuracy and consistency of test results, thereby ensuring product quality.

[0056] Furthermore, the inner wall of the heating chamber 201 has a first annular guide groove 203, and also includes a sliding guide 4, one end of the sliding guide 4 is set on the side wall of the placement rack 19, and the other end is slidably set in the first annular guide groove 203, and the sliding guide 4 is used to keep the placement rack 19 parallel to the bottom surface of the body 2 during the movement.

[0057] In this embodiment, when the placement rack 19 is circulated and transported in the heating chamber 201, the sliding guide 4 on the side wall slides smoothly along the first annular guide groove 203 on the inner wall of the heating chamber 201. This sliding fit ensures the stability and directionality of the placement rack 19 during the transport process, so that it can accurately move in a circular motion according to the predetermined track, avoiding the placement rack 19 from deflecting, getting stuck or shaking during the movement. The cooperation between the sliding guide 4 and the first annular guide groove 203 ensures the stable circulation of the placement rack 19 in the heating chamber 201, reduces the position change of the integrated circuit board 1 caused by shaking or offset, and ensures the uniformity of heating and the accuracy of detection. The smooth guide groove and the wear-resistant sliding guide 4 interact with each other, reducing the wear between the components and extending the service life of the equipment. The placement rack 19 can move strictly according to the annular track, improving the accuracy and reliability of the equipment operation. The failure and downtime that may be caused by unstable transportation are reduced, and the production efficiency is improved.

[0058] Furthermore, the first annular guide groove 203 has an inner annular groove 204 and an outer annular groove 205, the outer annular groove 205 is located on the periphery of the inner annular groove 204, the sliding guide member 4 has a first sliding portion 401 and a second sliding portion 402, the first sliding portion 401 and the second sliding portion 402 are alternately slidably arranged in the outer annular groove 205 and the inner annular groove 204; the opening portion 202 is located at the top of the heating chamber 201, the inner annular groove 204 and the outer annular groove 205 both have equidistant sections 206 and intersection sections 207, the equidistant sections 206 and the intersection sections 207 are arranged in pairs, and are alternately arranged end to end, the equidistant sections 206 of the inner annular groove 204 and the outer annular groove 205 are parallel to each other, and the first sliding portion 401 and the second sliding portion 402 alternately slide into the outer annular groove 205 and the inner annular groove 204 after passing through the intersection section 207.

[0059] In this embodiment, when the placement rack 19 is circulated and transported in the heating chamber 201, the first sliding part 401 of the sliding guide 4 slides in the inner ring groove 204, and the second sliding part 402 slides in the outer ring groove 205. The design of this double sliding part makes the placement rack 19 more stable and balanced during the movement, and effectively prevents the tilting or shaking of the placement rack 19. The two sliding parts work together in their respective grooves to ensure that the placement rack 19 moves accurately and smoothly along the established annular trajectory. During the sliding process in the equidistant section 106 on one side, the first sliding part 401 of the sliding guide 4 is closely fitted with the inner ring groove 204, and the second sliding part 402 is closely fitted with the outer ring groove 205. Due to the combined effect of the inner ring groove 204 and the outer ring groove 205, the restraining force applied to the sliding guide 4 enables the placement rack 19 to always keep parallel to the bottom surface movement of the body 2. This parallel state is maintained during the entire cyclic conveying process, and is not affected by factors such as the number, distribution and conveying speed of the integrated circuit boards 1 on the placement rack 19. After passing the intersection section, the first sliding part 401 enters the outer ring groove 205 of the equidistant section 206 on the other side, and the second sliding part 402 enters the inner ring groove 204 of the equidistant section 206 on the other side, so that the entire placement rack 19 continues to maintain a parallel state for cyclic transportation without flipping.

[0060] The arrangement of this scheme ensures that the placement rack 19 is always parallel to the bottom surface of the body 2 during the conveying process, provides a stable heating environment for the integrated circuit board 1, avoids uneven local heating caused by the tilt of the placement rack 19, and thus improves the heating effect and the accuracy of detection. The placement rack 19 is evenly stressed during the movement, reduces the local stress concentration caused by the tilt, reduces the wear of the placement rack 19 and the guide groove, and extends the service life of the equipment. The consistency of the integrated circuit board 1 at each position is guaranteed, which helps to improve the accuracy and reliability of the detection results and reduce errors. It can adapt to integrated circuit boards 1 of different sizes and weights, and the parallel state of the placement rack 19 is not affected by load changes, which enhances the versatility and practicality of the equipment. The parallel operation mode makes it possible to more effectively arrange the placement rack 19 and the integrated circuit board 1 in the limited heating chamber 201, improves space utilization, and increases production efficiency.

[0061] When the placement rack 19 is circulated and transported in the heating chamber 201, when the sliding guide 4 enters the equidistant section 206, the placement rack 19 maintains stable movement parallel to the bottom surface of the body 2. In the intersection section 207, due to the special design of the inner ring groove 204 and the outer ring groove 205, the sliding guide 4 smoothly transitions, so that the placement rack 19 can still maintain a parallel state. Through the alternating arrangement of the equidistant sections 206 and the intersection section 207, the placement rack 19 continues to circulate in the heating chamber 201 stably and finally accurately stops at the top of the opening 202 for detection. The design of the equidistant sections 206 and the intersection section 207 ensures that the placement rack 19 is always parallel to the bottom surface of the body 2 during the entire circulation process, providing a stable and uniform heating environment for the integrated circuit board 1, and ensuring the accuracy and reliability of the detection results. The design of the intersection section 207 makes the transition of the sliding guide 4 between different sections smooth and smooth, reduces jamming and vibration, and improves the operating stability and service life of the equipment. The opening 202 is located at the top of the heating chamber 201 and the placement rack 19 can accurately stay parallel, which is convenient for detection operation and improves detection efficiency and accuracy. This special guide groove structure can adapt to the complex movement requirements of the placement rack 19 during the cycle process, improving the flexibility and versatility of the equipment. Ensuring the parallel state of the placement rack 19 reduces the structural stress concentration caused by tilt or instability, and enhances the structural stability and durability of the entire device.

[0062] Furthermore, the inner wall of the heating chamber 201 also has an outer arc portion 208, the first annular guide groove 203 is an inner groove, the outer arc portion 208 is located on one side of the intersection section 207 of the outer annular groove 205, and there are also two of them, the sliding guide member 4 also has a third sliding portion 403 and a fourth sliding portion 404, the third sliding portion 403 and the fourth sliding portion 404 are configured to be driven by the placement rack 19 to move, and then respectively roll and abut or cancel the abutment with the outer arc portion 208 close to the opening portion 202, or roll and abut or cancel the abutment with the outer arc portion 208 away from the opening portion 202; it also includes a feed rack 5 and a discharge rack 6, the feed rack 5 and the discharge rack 6 are both arranged on the machine body 2, and are respectively located on both sides of the opening portion 202, the feed rack 5 is used to store undetected integrated circuit boards 1, and the discharge rack 6 is used to store integrated circuit boards 1 after detection.

[0063] In this embodiment, when the placement rack 19 is circulated and transported in the heating chamber 201, the third sliding part 403 and the fourth sliding part 404 are driven as the placement rack 19 moves. When approaching the opening 202, the third sliding part 403 rolls and abuts against the outer arc 208 near the opening 202, providing additional guidance and support; when away from the opening 202, the third sliding part 403 cancels the abutment. At the same time, the fourth sliding part 404 rolls and abuts or cancels the abutment with the outer arc 208 away from the opening 202 accordingly. This rolling abutment and cancellation of abutment actions are alternately performed according to the position change of the placement rack 19, ensuring the stable transition and accurate movement of the placement rack 19 in the intersection section 207. In the intersection section 207, by rolling abutment with the outer arc 208, a more accurate guide is provided for the placement rack 19 to ensure its accurate movement and positioning. The cooperation between the third sliding part 403 and the fourth sliding part 404 and the outer arc part 208 makes the transition of the placement rack 19 in the intersection section 207 smoother, reduces impact and vibration, and improves the stability of the equipment operation. The rolling abutment method reduces the friction between the sliding parts, reduces wear, and prolongs the service life of the parts. It ensures that the placement rack 19 always remains stable during the complex movement process, reduces the possibility of failure, and enhances the reliability of the equipment.

[0064] The undetected integrated circuit board 1 is placed on the feed rack 5. When the placement rack 19 reaches the opening 202, the undetected integrated circuit board 1 is taken out from the feed rack 5 and placed on the placement rack 19, and then the placement rack 19 enters the heating chamber 201 for heating. After the heating and detection are completed, the placement rack 19 returns to the opening 202 again, and the detected integrated circuit board 1 is taken out and placed on the discharge rack 6. The setting of the feed rack 5 and the discharge rack 6 allows the undetected and detected integrated circuit boards 1 to be stored separately, and the operation is more orderly and avoids confusion. It is convenient for operators to quickly take and place the integrated circuit board 1, reduce waiting time, and improve the overall detection efficiency. Make full use of the space around the body 2 without taking up too much extra space. Make the detection process clearer, which is conducive to the management and monitoring of the detection process of the integrated circuit board 1. Reduce the risk of detection errors caused by confusion of the integrated circuit board 1.

[0065] Further, the horizontal direction is defined as the conveying direction, and also includes a first top member 7 arranged on the feed rack 5, and the output end moves horizontally, the moving direction is perpendicular to the conveying direction, and the output end of the first top member 7 is configured to be used to abut against or cancel the abutment with the side of the integrated circuit board 1 after movement; the second top member 8 is arranged on the feed rack 5, located below the integrated circuit board 1, and the moving direction of the second top member 8 is along the vertical direction, and the output end of the second top member 8 is configured to abut against the bottom of the integrated circuit board 1 after movement and drive the integrated circuit board 1 to move upward; the third top member 9 is arranged on the feed rack 5, located on the side of the integrated circuit board 1 away from the opening portion 202, and the moving direction of the output end of the third top member 9 is along the conveying direction, and the output end of the third top member 9 is configured to abut against the side wall of the integrated circuit board 1 after movement and drive the integrated circuit board 1 to move along the conveying direction.

[0066] In this embodiment, when it is necessary to place the integrated circuit board 1 on the feed rack 5 on the placement rack 19, first the second top piece 8 rises, and the support plate at its output end abuts against the bottom of the integrated circuit board 1 and lifts it to a certain height. Then the output end of the first top piece 7 moves horizontally, abuts against the side of the integrated circuit board 1, and positions it horizontally. Then the output end of the third top piece 9 moves along the conveying direction, abuts against the side wall of the integrated circuit board 1 and pushes it to move in the conveying direction until the integrated circuit board 1 accurately reaches the specified position of the placement rack 19. Through the coordinated action of the first top piece 7, the second top piece 8 and the third top piece 9, the precise position adjustment of the integrated circuit board 1 on the feed rack 5 can be achieved, ensuring that it is accurately conveyed to the placement rack 19, thereby improving the accuracy and reliability of the operation. The lifting action of the second top piece 8 and the pushing action of the third top piece 9 cooperate with each other, so that the integrated circuit board 1 remains stable during the conveying process, reducing the risk of shaking and falling. It can adapt to integrated circuit boards 1 of different sizes and shapes, and flexible feeding operation can be achieved by adjusting the stroke and position of the top piece. The cushioning and anti-skid design of the top piece can minimize physical damage to the integrated circuit board 1 and ensure product quality.

[0067] Furthermore, it also includes a fourth top piece 10 arranged on the discharge rack 6, the moving direction of the output end of the fourth top piece 10 is horizontal and perpendicular to the conveying direction, and the output end of the fourth top piece 10 is configured to be used for abutting or canceling the abutment with the integrated circuit board 1 after moving; the fifth top piece 11 is arranged on the discharge rack 6, the conveying direction of the output end of the fifth top piece 11 is vertical, and the output end of the fifth top piece 11 is configured to be used for abutting with the bottom of the integrated circuit board 1 after moving and driving the circuit board to move upward. The sixth top piece 12 is arranged on the machine body 2, and is located between the feed rack 5 and the discharge rack 6. The output end of the sixth top piece 12 moves along the conveying direction, and after moving, it abuts against the side wall of the integrated circuit board 1, driving the integrated circuit board 1 to move toward the discharge rack 6; the side of the integrated circuit board 1 has an edge 101, and the first top piece 7 and the fourth top piece 10 are arranged in pairs, located on both sides of the integrated circuit board 1, and the first top piece 7 and the fourth top piece 10 both have a clamping portion 1001, which is used to abut against the edge 101 to provide a force for the edge 101 to move upward.

[0068] In this embodiment, when the integrated circuit board 1 that has been tested is conveyed to the opening 202, the output end of the sixth top piece 12 moves rapidly along the conveying direction, and its metal push plate gently abuts against the side wall of the integrated circuit board 1, and stably pushes it toward the direction of the unloading rack 6. At this time, if there are already stacked integrated circuit boards 1 on the unloading rack 6, the fifth top piece 11 is started. The previously stacked integrated circuit boards 1 are lifted as a whole to leave space for the placement of the newly tested integrated circuit boards 1. The electric push rod of the fourth top piece 10 pushes the rubber push head at the output end to move horizontally, tightly abutting against the side of the newly delivered integrated circuit board 1, and performing precise lateral positioning. After positioning is completed, the fifth top piece 11 slowly descends, so that the previously lifted integrated circuit board 1 and the newly placed integrated circuit board 1 are placed together and stably on the unloading rack 6, and the new integrated circuit board 1 is located at the bottom layer. The entire process realizes automated operation, greatly improves production efficiency, and reduces the time and labor intensity of manual operation. Through the precise movements of each top piece, it is ensured that the integrated circuit boards 1 are neatly stacked on the unloading rack 6 and accurately positioned, which is convenient for subsequent management and transportation. During operation, the cushioning design and gentle movement of each top piece minimize the impact and wear on the integrated circuit board 1, ensuring the quality and integrity of the product. The space of the discharge rack 6 can be fully utilized to achieve multi-layer and tight stacking, thereby improving the utilization rate of the storage space.

[0069] On the feed rack 5, when it is necessary to push the integrated circuit board 1, the first top pieces 7 arranged in pairs act simultaneously. The clamping part 1001 thereof abuts against the edge 101 on the side of the integrated circuit board 1, and applies force in the direction away from the plane where the opening 202 is located, thereby pushing the integrated circuit board 1 to perform precise position adjustment and transportation. The cooperation between the clamping part 1001 and the edge 101 can realize more accurate positioning and pushing of the integrated circuit board 1, and ensure its position accuracy during transportation and stacking. The top pieces arranged in pairs can evenly apply force to the integrated circuit board 1 from both sides, avoiding skewness or instability caused by unilateral force. The rubber or plastic material used in the clamping part 1001 has certain elasticity and cushioning properties, and can reduce damage to the integrated circuit board 1 when in contact with the edge 101. Since the shape of the clamping part 1001 matches the edge 101, effective operation can be achieved for integrated circuit boards 1 of different specifications but with similar edge 101 structures, thereby improving the versatility of the equipment. By applying force in a specific direction, the stability of the integrated circuit board 1 during transportation and stacking is increased, and the risk of accidental movement or falling is reduced. On the unloading rack 6, after the integrated circuit board 1 that has been detected is in place, the paired fourth top member 10 is activated. Its clamping portion 1001 also abuts against the edge portion 101 on the side of the integrated circuit board 1, providing a force for the edge portion 101 to move away from the plane where the opening portion 202 is located, thereby achieving the positioning and arrangement of the integrated circuit board 1 for subsequent stacking operations.

[0070] Example 2

[0071] Reference Figure 6~Figure 8 , which is the second embodiment of the present invention, compared with embodiment 1, further includes a slider 13 that is slidably arranged on the feed rack 5 in a horizontal direction, and the slider 13 has a vertical slide groove 1301; a push member 14 is slidably arranged in the vertical slide groove 1301 in a vertical direction, and the push member 14 is configured to be driven by the slider 13 to slide horizontally, and then to abut against the edge 101 to drive the integrated circuit board 1 to slide, or to cancel the abutment with the edge 101; one end of the first elastic member 15 acts on the bottom wall of the vertical slide groove 1301, and the other end acts on the bottom of the push member 14, providing a force for the push member 14 to slide in the direction away from the bottom wall of the vertical slide groove 1301; a rotating support member 16 is rotatably arranged on the feed rack 5, and the rotating axis is horizontally along the rotating support member 16. The circumferential direction has a plurality of support grooves 1601, and the rotating support member 16 is configured to rotate, and the inner walls of the plurality of support grooves 1601 are sequentially used to abut against the edge 101 of the integrated circuit board 1 from bottom to top to support the integrated circuit board 1.

[0072] In this embodiment, a single-drive transmission system is used at the feed rack 5 to replace the original three-drive member drive system, and the slider 13 can slide freely horizontally on the feed rack 5. The push member 14 can slide vertically smoothly in the vertical slide groove 1301 of the slider 13, and the first elastic member 15 is stably located between the bottom wall of the vertical slide groove 1301 and the bottom of the push member 14.

[0073] In the initial state, the pusher 14 is located away from the opening 202. When the bottom integrated circuit board 1 is placed in place, the slider 13 slides horizontally to drive the pusher 14 to move. Under the elastic action of the first elastic member 15, the top of the pusher 14 flexibly abuts against the edge 101 of the bottom integrated circuit board 1 and smoothly transports it to the position of the opening 202. After the transportation is completed, the slider 13 drives the pusher 14 to reset horizontally. The buffering effect of the first elastic member 15 makes the reset action of the pusher 14 gentle and will not cause damage to the edge 101 of the integrated circuit board 1. This cyclic conveying preparation mechanism enables the integrated circuit board 1 to be continuously and orderly transported to the opening 202, thereby improving work efficiency. The first elastic member 15 ensures that the pusher 14 moves gently when resetting horizontally, avoiding damage to the edge 101 of the integrated circuit board 1 and ensuring product quality. The rotation of the rotating support member 16 enables the integrated circuit boards 1 to be stacked in an orderly manner, and each time they are lowered by one grid, thereby improving stacking efficiency and space utilization. The supporting groove 1601 of the rotating supporting member 16 provides a stable support for the integrated circuit board 1, ensuring the stability of the stacking. After the pusher 14 is reset, the new integrated circuit board 1 abuts against the pusher 14, and enters a new round of conveying preparation.

[0074] Further, it also includes a accommodating frame 17 arranged on the feeding frame 5, the accommodating frame 17 has a rotating chamber 1701, the rotating chamber 1701 has a lower opening portion 1702, and the opening direction of the lower opening portion 1702 is downward; a rotating transmission member 18 is rotatably arranged in the rotating chamber 1701, the rotating transmission member 18 has a clamped portion 1801, and the rotating transmission member 18 is configured so that after rotation, the clamped portion 1801 extends out of the lower opening portion 1702 or cancels the extension of the lower opening portion 1702, the rotating axis of the rotating transmission member 18 is transmission-connected with the rotating axis of the rotating supporting member 16, the rotating transmission member 18 is a polygon, and each side has a clamped portion 1801; a pushing block 20 is arranged on the sliding block 13, and the pushing block 20 is configured so that after being driven by the sliding block 13 to slide, it abuts against the clamped portion 1801 and pushes the rotating transmission member 18 to rotate, and after rotation, the pushing block 20 slides and abuts against the side of the rotating transmission member 18.

[0075] In this embodiment, the receiving frame 17 is firmly arranged on the feeding frame 5. The rotating transmission member 18 is installed in the rotating cavity 1701 inside the receiving frame 17. The rotating transmission member 18 is a polygon, such as a quadrilateral, and the number of sides of the rotating transmission member 18 is the same as the number of the supporting slots 1601. Each side is provided with a clamped portion 1801, and its rotating shaft is connected to the rotating shaft of the rotating supporting member 16 by a suitable transmission method. The slider 13 can slide horizontally on the feeding frame 5, and the push block 20 is fixedly installed on the slider 13. When the slider 13 slides toward the opening 202, the push block 20 does not abut against the clamped portion 1801 of the rotating transmission member 18. When the slider 13 is reset, that is, slides in the opposite direction, the push block 20 abuts against the clamped portion 1801. Driven by the slider 13, the push block 20 pushes the rotating transmission member 18 to rotate a certain angle. As the slider 13 continues to reset, the push block 20 slides and abuts against the side of the rotating transmission member 18 until the slider 13 is completely reset. In this way, during the reciprocating sliding process of the slider 13, the push block 20 pushes the rotating transmission member 18 to rotate only when resetting, thereby realizing intermittent driving of the rotating support member 16. The polygonal design of the rotating transmission member 18 and the cooperation with the push block 20 realize intermittent rotation, which matches the feeding and conveying rhythm and improves work efficiency. The entire transmission structure is installed in the accommodating frame 17 and is well protected. It runs stably and reliably, and reduces the influence of external interference on the transmission. The transmission connection between the rotating transmission member 18 and the rotating support member 16 ensures the synchronization of the actions of the two, making the conveying and stacking process of the integrated circuit board 1 more coordinated.

[0076] Further, the rotating transmission member 18 has a positioning card slot 1802, and the accommodating frame 17 also has a longitudinal slide slot 1703; the positioning card member 21 is slidably arranged in the longitudinal slide slot 1703, and the positioning card member 21 has a positioning card portion 2101, and the positioning card member 21 is configured so that the positioning card portion 2101 is inserted into the positioning card slot 1802 or leaves the positioning card slot 1802 after sliding; one end of the second elastic member 22 acts on the bottom wall of the longitudinal slide slot 1703, and the other end acts on the positioning card member 21, providing a force for the positioning card member 21 to slide in a direction away from the bottom wall of the longitudinal slide slot 1703;

[0077] In this embodiment, the receiving frame 17 is fixedly arranged on the feeding frame 5. One end of the rotating transmission member 18 is a spherical head, and the positioning slot 1802 is also a spherical groove that smoothly transitions with the surroundings. The rotating transmission member 18 is installed in the rotating cavity 1701 of the receiving frame 17, and the positioning slot 1802 is located at a position where the rotating transmission member 18 deviates from the center line. The slider 13 slides on the feeding frame 5. Initially, the positioning clamping part 2101 of the positioning clamping member 21 is not clamped into the positioning slot 1802. When the slider 13 slides to the position closest to the opening 202, the positioning clamping part 2101 of the positioning clamping member 21 is clamped into the positioning slot 1802 under the action of the second elastic member 22. At this time, the clamped part 1801 of the rotating transmission member 18 is in a state of extending out of the lower opening 1702, and the rotating support member 16 will not rotate, ensuring stable support for the integrated circuit board 1, and at the same time making the rotating transmission member 18 in a state of waiting for the push block 20 to push. When the slider 13 slides in the opposite direction, the positioning card portion 2101 of the positioning card member 21 leaves the positioning card slot 1802, and the rotating transmission member 18 can rotate under the push of the push block 20. Only when the slider 13 slides to a specific position, the positioning card portion 2101 is inserted into the positioning card slot 1802, thereby realizing precise control of the timing of state switching of the rotating transmission member 18. Ensuring the stationary state of the rotating support member 16 at the right time greatly enhances the stability of the support for the integrated circuit board 1. Performing actions in a specific order makes the entire feeding process more orderly and efficient. Accurate control and a stable structure reduce the occurrence of unexpected situations and improve the reliability of the entire system. Stable support helps to ensure the position accuracy of the integrated circuit board 1 during the feeding process, thereby ensuring the subsequent detection quality.

[0078] Furthermore, the slider 13, the pushing member 14, the rotating supporting member 16, the accommodating frame 17, the rotating transmission member 18, the pushing block 20 and the positioning card 21 together constitute a supporting assembly 2100. The supporting assembly 2100 is arranged in pairs and is respectively located on both longitudinal sides of the integrated circuit board 1. It also includes a linear driving member 23 arranged on the feed frame 5 to drive the slider 13 to slide back and forth horizontally.

[0079] In this embodiment, on the feed rack 5, the supporting components 2100 are arranged in pairs on both longitudinal sides of the integrated circuit board 1. Each supporting component 2100 includes a slider 13, a pusher 14, a rotating supporting component 16, a receiving frame 17, a rotating transmission component 18, a push block 20 and a positioning card 21. The linear drive component 23 is an electric push rod or a cylinder, which is installed on the feed rack 5. The output end of the linear drive component 23 is connected to the slider 13, driving the slider 13 to slide back and forth horizontally on the feed rack 5. The supporting components 2100 are arranged in pairs and operated from both sides of the integrated circuit board 1 to ensure that the conveying process is smoother and more accurate. The entire feeding process is driven by the linear drive component 23, which realizes automated operation, reduces manual intervention, and improves production efficiency.

[0080] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. An integrated circuit high temperature test device, used for performing a heating test on an integrated circuit board (1), characterized in that: include: A machine body (2), the machine body (2) having a heating chamber (201), the heating chamber (201) having an opening (202); a placement rack (19), the placement rack (19) being arranged in the heating chamber (201) for cyclic transport, the placement rack (19) being used to place the integrated circuit board (1), the inner wall of the heating chamber (201) having a first annular guide groove (203); A detection member (3), the detection member (3) being arranged to be lifted and lowered and horizontally slidable relative to the machine body (2), and being located on one side of the opening (202); a feed rack (5) and a discharge rack (6), wherein the feed rack (5) and the discharge rack (6) are both arranged on the machine body (2) and are respectively located on both sides of the opening (202); the feed rack (5) is used to store the untested integrated circuit boards (1), and the discharge rack (6) is used to store the tested integrated circuit boards (1); a sliding guide member (4), one end of the sliding guide member (4) being arranged on the side wall of the placement rack (19), and the other end being slidably arranged in the first annular guide groove (203), the sliding guide member (4) being used to keep the placement rack (19) parallel to the bottom surface of the machine body (2) during movement; The first annular guide groove (203) comprises an inner annular groove (204) and an outer annular groove (205), the outer annular groove (205) being located at the periphery of the inner annular groove (204), the sliding guide member (4) comprising a first sliding portion (401) and a second sliding portion (402), the first sliding portion (401) and the second sliding portion (402) being alternately slidably disposed in the outer annular groove (205) and in the inner annular groove (204); The opening portion (202) is located at the top of the heating chamber (201); the inner annular groove (204) and the outer annular groove (205) both have equidistant sections (206) and intersection sections (207); the equidistant sections (206) and the intersection sections (207) are arranged in pairs and are alternately arranged end to end; the equidistant sections (206) of the inner annular groove (204) and the outer annular groove (205) are parallel to each other; and the first sliding portion (401) and the second sliding portion (402) alternately slide into the outer annular groove (205) and the inner annular groove (204) after passing through the intersection section (207).

2. The high temperature testing device for integrated circuits according to claim 1, characterized in that: The inner wall of the heating chamber (201) also has an outer arc portion (208), the first annular guide groove (203) is an inner groove, the outer arc portion (208) is located on one side of the intersection section (207) of the outer annular groove (205), and there are two of them, the sliding guide member (4) also has a third sliding portion (403) and a fourth sliding portion (404), the third sliding portion (403) and the fourth sliding portion (404) are configured to be moved by the placement rack (19) and then respectively roll into contact with or cancel contact with the outer arc portion (208) close to the opening portion (202), or roll into contact with or cancel contact with the outer arc portion (208) away from the opening portion (202).

3. The high temperature testing device for integrated circuits according to claim 1, characterized in that: The definition of transverse direction is the conveying direction, which also includes: A first top member (7), the first top member (7) being arranged on the feed rack (5), and having an output end that moves horizontally, with the moving direction being perpendicular to the conveying direction, and the output end of the first top member (7) being configured to abut against or cancel abutment with a side edge of the integrated circuit board (1) after movement; a second top member (8), the second top member (8) being arranged on the feed rack (5) and located below the integrated circuit board (1); the second top member (8) moving in a vertical direction; and the output end of the second top member (8) being configured to abut against the bottom of the integrated circuit board (1) and drive the integrated circuit board (1) to move upward after movement; A third top piece (9), the third top piece (9) being arranged on the feed rack (5) and located on a side of the integrated circuit board (1) away from the opening (202), the movement direction of the output end of the third top piece (9) being in a lateral direction, and the output end of the third top piece (9) being configured to abut against a side wall of the integrated circuit board (1) after movement and drive the integrated circuit board (1) to move along a conveying direction.

4. The high temperature testing device for integrated circuits according to claim 3, characterized in that: Also includes: a fourth top piece (10), the fourth top piece (10) being arranged on the discharging frame (6), the moving direction of the output end of the fourth top piece (10) being horizontal and perpendicular to the conveying direction, the output end of the fourth top piece (10) being configured to abut against or cancel abutment with the integrated circuit board (1) after movement; a fifth top piece (11), the fifth top piece (11) being arranged on the discharging frame (6), the conveying direction of the output end of the fifth top piece (11) being a vertical direction, and the output end of the fifth top piece (11) being configured to abut against the bottom of the integrated circuit board (1) after movement and drive the integrated circuit board (1) to move upward; a sixth top member (12), the sixth top member (12) being arranged on the machine body (2) and being located between the feed rack (5) and the discharge rack (6); the output end of the sixth top member (12) moving along the conveying direction, and after moving, abutting against the side wall of the integrated circuit board (1), thereby driving the integrated circuit board (1) to move in a direction close to the discharge rack (6); The side edge of the integrated circuit board (1) has an edge portion (101), the first top piece (7) and the fourth top piece (10) are arranged in pairs and are located on both sides of the integrated circuit board (1), and the first top piece (7) and the fourth top piece (10) both have a clamping portion (1001), and the clamping portion (1001) is used to abut against the edge portion (101) to provide a force for the edge portion (101) to move upward.

5. The high temperature testing device for integrated circuits according to claim 1, characterized in that: The integrated circuit board (1) has a side edge with an edge portion (101), and further comprises: A sliding block (13), the sliding block (13) being arranged on the feeding frame (5) in a transverse sliding manner, the sliding block (13) having a vertical sliding groove (1301); a pushing member (14), the pushing member (14) being vertically slidably disposed in the vertical sliding groove (1301), the pushing member (14) being configured to be driven by the sliding block (13) to slide horizontally, and then to abut against the edge portion (101) to drive the integrated circuit board (1) to slide, or to cancel the abutment with the edge portion (101); a first elastic member (15), wherein one end of the first elastic member (15) acts on the bottom wall of the vertical slide groove (1301), and the other end of the first elastic member (15) acts on the bottom of the push member (14), providing a force for the push member (14) to slide in a direction away from the bottom wall of the vertical slide groove (1301); A rotating support member (16), the rotating support member (16) is rotatably arranged on the feed rack (5), the rotating axis is in the horizontal direction, the rotating support member (16) has a plurality of supporting grooves (1601) in the circumferential direction, and the rotating support member (16) is configured such that after the rotating support member (16) is rotated, the inner walls of the plurality of supporting grooves (1601) are sequentially used to abut against the edge portion (101) of the integrated circuit board (1) from bottom to top, thereby supporting the integrated circuit board (1).

6. The high temperature testing device for integrated circuits according to claim 5, characterized in that: Also includes: a containing rack (17), the containing rack (17) being arranged on the feeding rack (5), the containing rack (17) having a rotating chamber (1701), the rotating chamber (1701) having a lower opening portion (1702), the lower opening portion (1702) opening in a downward direction; A rotating transmission member (18), the rotating transmission member (18) being rotatably disposed in the rotating cavity (1701), the rotating transmission member (18) having a clamped portion (1801), the rotating transmission member (18) being configured such that, after rotation, the clamped portion (1801) extends out of the lower opening portion (1702) or stops extending out of the lower opening portion (1702), the rotating shaft of the rotating transmission member (18) being in driving connection with the rotating shaft of the rotating support member (16), the rotating transmission member (18) being a polygon, each side of which having the clamped portion (1801); A push block (20), the push block (20) being arranged on the slider (13), the push block (20) being configured to, after being driven by the slider (13) to slide, abut against the clamped portion (1801) and push the rotating transmission member (18) to rotate, and after the rotation, the push block (20) abuts against the side of the rotating transmission member (18) in a sliding manner.

7. The high temperature testing device for integrated circuits according to claim 6, characterized in that: The rotating transmission member (18) has a positioning slot (1802), and the accommodating frame (17) also has a longitudinal sliding slot (1703); A positioning card (21), the positioning card (21) being slidably disposed in the longitudinal slide groove (1703), and the positioning card (21) having a positioning card portion (2101), the positioning card (21) being configured such that after sliding, the positioning card portion (2101) is snapped into the positioning card groove (1802) or leaves the positioning card groove (1802); A second elastic member (22), one end of the second elastic member (22) acts on the bottom wall of the longitudinal slide groove (1703), and the other end of the second elastic member (22) acts on the positioning clamp (21), providing a force for the positioning clamp (21) to slide in a direction away from the bottom wall of the longitudinal slide groove (1703).

8. The high temperature testing device for integrated circuits according to claim 7, characterized in that: The slider (13), the pushing member (14), the rotating support member (16), the accommodating frame (17), the rotating transmission member (18), the pushing block (20) and the positioning clamp (21) together constitute a supporting assembly (2100). The supporting assembly (2100) is arranged in pairs and is respectively located on both sides of the longitudinal direction of the integrated circuit board (1), and further comprises: A linear drive member (23), wherein the linear drive member (23) is arranged on the feed rack (5) and drives the slide block (13) to slide back and forth laterally.

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