Physical cooling instrument driving system and method

Abstract

The invention provides a physical cooling instrument driving system and method. The physical cooling instrument driving system comprises an intelligent monitoring module, a display interaction module, a refrigerating and heating module, a semiconductor and a central processing unit. The intelligent monitoring module is used for sending detected detection data to the display interaction module and sending the detection data to the central processing unit, and the display interaction module is used for responding to interaction operation of a user for external equipment of the display interaction module and transmitting corresponding interaction parameters to the central processing unit; and the central processing unit is used for receiving the detection data and the interaction parameters, determining a corresponding control instruction based on the detection data and the interaction parameters and sending the control instruction to the refrigerating and heating module, and the refrigerating and heating module sends the control instruction to the intelligent monitoring module and displays the detection data sent by the intelligent monitoring module in real time. And the controller is used for controlling the semiconductor to refrigerate or heat based on the control instruction and disconnecting power supply of the semiconductor when the temperature of the semiconductor is abnormal.

Description

Technical Field

[0001] The present application relates to the field of medical technology, and in particular to a physical cooling device driving system and method. Background Art

[0002] Fever is one of the common symptoms in infants and young children. Because young infants do not have a sound body temperature regulation function, persistent high fever will hinder the function of the central nervous system, and in severe cases, it will threaten the life safety of infants and young children. Therefore, physical cooling for patients with moderate or high fever can effectively remove the local high fever of the patient through heat exchange, which effectively protects the patient.

[0003] At present, when controlling semiconductor cooling or heating, over-temperature protection is mainly achieved by controlling the polarity of the semiconductor through a relay and detecting the temperature of the water tank through a sensor.

[0004] However, when the temperature is close to the target value, the relay is easily switched frequently, which affects the life of the relay. When the water temperature is detected by the sensor, when the sensor has problems or the software crashes, it will also cause the user to be at risk of frostbite or scalds, affecting the user experience. Summary of the invention

[0005] In view of this, the purpose of the present application is to provide a physical cooling instrument driving system and method, which can determine the corresponding control instructions through data transmission of the intelligent monitoring module, the display interaction module and the central processing unit, and send the control instructions to the cooling and heating module, so as to control the semiconductor to cool or heat based on the control instructions, and disconnect the power supply of the semiconductor when the temperature of the semiconductor is abnormal, without frequently switching the relay to disconnect the power supply of the semiconductor, thereby improving the life of the relay, and when the water temperature is detected by the intelligent monitoring module, the semiconductor is controlled to cool or heat according to the water temperature, which will not cause the risk of frostbite or scald to the user, thereby improving the user experience.

[0006] In a first aspect, an embodiment of the present application provides a physical cooling device driving system, the physical cooling device driving system comprising an intelligent monitoring module, a display interaction module, a cooling and heating module, a semiconductor and a central processing unit;

[0007] The display interaction module, the intelligent monitoring module, the cooling and heating module, and the semiconductor are respectively connected to the central processing unit, and the semiconductor is connected to the intelligent monitoring module and the cooling and heating module;

[0008] The intelligent monitoring module is used to send the detected detection data to the display interaction module, and send the detection data to the central processor; wherein the detection data at least includes water temperature, body temperature, pressure, and liquid level data;

[0009] The display interaction module is used to transmit the corresponding interaction parameters to the central processor in response to the user's interaction operation on the external device of the display interaction module, and simultaneously display the detection data sent by the intelligent monitoring module in real time; wherein the interaction parameters at least include training mode, training duration, set water temperature, and music playback parameters;

[0010] The central processor is used to receive the detection data and the interaction parameters, determine corresponding control instructions based on the detection data and the interaction parameters, and send the control instructions to the cooling and heating module;

[0011] The cooling and heating module is used to control the semiconductor to cool or heat based on the control instruction, and to cut off the power supply of the semiconductor when the temperature of the semiconductor is abnormal.

[0012] In a possible implementation, the cooling and heating module includes a driver chip; and controlling the semiconductor to perform cooling or heating includes:

[0013] adjusting the output polarity of the semiconductor to the target output polarity corresponding to the control instruction through the driving chip;

[0014] The semiconductor based on the target output polarity performs cooling or heating corresponding to the target output polarity.

[0015] In a possible implementation, the cooling and heating module includes a semiconductor control circuit; the semiconductor control circuit includes the driving chip and the MOS tube; the driving chip is connected to the MOS tube, and the semiconductor is connected through the MOS tube;

[0016] The driving chip is used to generate a corresponding control signal in response to the PWM signal input by the input end of the semiconductor control circuit based on the control instruction, and send the control signal to the MOS tube so that the MOS tube drives the output polarity of the semiconductor;

[0017] The semiconductor is used to change the output polarity under the drive of the MOS tube to perform cooling or heating.

[0018] In a possible implementation manner, the driving chip includes a first driving chip and a second driving chip; the PWM signal includes a first PWM signal and a second PWM signal; the control signal includes a first control signal and a second control signal;

[0019] The first driving chip is used to generate a corresponding first control signal in response to a first PWM signal inputted at an input end of the semiconductor control circuit based on the control instruction, and send the first control signal to the MOS tube so that the MOS tube drives the output polarity of the semiconductor;

[0020] The second driving chip is used to generate a corresponding second control signal in response to a second PWM signal input based on the control instruction at the input end of the semiconductor control circuit, and send the second control signal to the MOS tube so that the MOS tube drives the output polarity of the semiconductor; the first PWM signal and the second PWM signal are two PWM signals with the same frequency and opposite polarities;

[0021] The semiconductor is used to change the output polarity to a target output polarity under the control of the first control signal and the second control signal to perform cooling or heating.

[0022] In a possible implementation, the physical cooling device driving system further includes a wireless communication module; the wireless communication module includes a Bluetooth module and a 4G module;

[0023] The Bluetooth module is used to achieve interconnection with the external device, so as to push the interaction information corresponding to the interaction operation to the display interaction module through the external device; wherein the interaction information at least includes music and reports;

[0024] The 4G module is used to realize the remote control of the physical cooling instrument driving system by the external device.

[0025] In a possible implementation, the semiconductor includes two sides; a copper heat sink is installed on each side of the semiconductor; a first temperature sensor is installed on the copper heat sink; the water temperature is a water tank temperature; and the method of disconnecting the power supply of the semiconductor when the temperature of the semiconductor is abnormal includes:

[0026] The water tank temperature is collected based on the second temperature sensor in the intelligent monitoring module, and when it is detected that the water tank temperature is higher than a preset first threshold or lower than a preset second threshold, the power supply of the semiconductor is disconnected; and / or,

[0027] detecting the temperature of the copper heat sink based on the first temperature sensor on the copper heat sink to determine the semiconductor temperature of the semiconductor, and disconnecting the power supply of the semiconductor when it is detected that the semiconductor temperature is higher than a preset third threshold or lower than a preset fourth threshold; and / or,

[0028] In response to a problem occurring in the target software, the target software is reset so that the semiconductor is powered off.

[0029] In a possible implementation manner, disconnecting the power supply of the semiconductor when the temperature of the semiconductor is abnormal further includes:

[0030] In response to the first temperature sensor detecting that the temperature of the semiconductor is abnormal, the power supply to the semiconductor is cut off based on the output polarity of the semiconductor control circuit driving the semiconductor.

[0031] In a possible implementation, the physical cooling device driving system includes a lithium battery management module; the lithium battery management module is connected to the central processing unit; the lithium battery management module is used to manage the charging and discharging of the lithium battery.

[0032] In a second aspect, the embodiment of the present application further provides a physical cooling device driving method, which is applied to the physical cooling device driving system of the embodiment of the first aspect; the physical cooling device driving system includes an intelligent monitoring module, a display interaction module, a cooling and heating module, a semiconductor and a central processing unit; the method includes:

[0033] The intelligent monitoring module sends the detected detection data to the display interaction module, and sends the detection data to the central processor; wherein the detection data at least includes water temperature, body temperature, pressure, and liquid level data;

[0034] The display interaction module transmits the corresponding interaction parameters to the central processor in response to the user's interaction operation on the external device of the display interaction module, and simultaneously displays the detection data sent by the intelligent monitoring module in real time; wherein the interaction parameters at least include training mode, training duration, set water temperature, and music playback parameters;

[0035] The central processor receives the detection data and the interaction parameters, determines corresponding control instructions based on the detection data and the interaction parameters, and sends the control instructions to the cooling and heating module;

[0036] The cooling and heating module controls the semiconductor to cool or heat based on the control instruction, and cuts off the power supply to the semiconductor when the temperature of the semiconductor is abnormal.

[0037] In a possible implementation, the physical cooling device driving system further includes a lithium battery management module; the method further includes:

[0038] The lithium battery management module manages the charging and discharging of the lithium battery.

[0039] The embodiment of the present application provides a physical cooling device driving system and method, an intelligent monitoring module, which is used to send the detected detection data to the display interaction module, and send the detection data to the central processing unit, the display interaction module, which is used to transmit the corresponding interaction parameters to the central processing unit in response to the user's interactive operation on the external device of the display interaction module, and at the same time, the detection data sent by the intelligent monitoring module is displayed in real time, the central processing unit is used to receive the detection data and the interaction parameters, and determine the corresponding control instructions based on the detection data and the interaction parameters, and send the control instructions to the cooling and heating module, the cooling and heating module is used to control the semiconductor to cool or heat based on the control instructions, and disconnect the power supply of the semiconductor when the semiconductor temperature is abnormal. In the present application, the corresponding control instructions are determined through the data transmission of the intelligent monitoring module, the display interaction module and the central processing unit, and the control instructions are sent to the cooling and heating module, so as to control the semiconductor to cool or heat based on the control instructions, and disconnect the power supply of the semiconductor when the semiconductor temperature is abnormal, without disconnecting the power supply of the semiconductor by frequently switching the relay, thereby improving the life of the relay, and when the water temperature is detected by the intelligent monitoring module, the semiconductor is controlled to cool or heat according to the water temperature, which will not cause the risk of frostbite or scald to the user, thereby improving the user experience.

[0040] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 is a structural block diagram of a physical cooling device driving system according to an embodiment of the present application;

[0043] Figure 2 It is a schematic diagram of the overall architecture of the physical cooling instrument drive system;

[0044] Figure 3(a) is a schematic diagram of a semiconductor control circuit. Figure 1 ;

[0045] Figure 3(b) is a schematic diagram of a semiconductor control circuit. Figure 2 ;

[0046] Figure 4 It is a flow chart of a method for driving a physical cooling device according to another embodiment of the present application. DETAILED DESCRIPTION

[0047] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the drawings in the present application only serve the purpose of explanation and description and are not used to limit the scope of protection of the present application. In addition, it should be understood that the schematic drawings are not drawn in real proportion. The flowchart used in this application shows the operations implemented according to some embodiments of the present application. It should be understood that the operations of the flowchart can be implemented out of sequence, and the steps without logical context can be reversed in order or implemented simultaneously. In addition, those skilled in the art can add one or more other operations to the flowchart under the guidance of the content of the present application, or remove one or more operations from the flowchart.

[0048] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0049] It should be noted that the term "comprising" will be used in the embodiments of the present application to indicate the existence of the features declared thereafter, but does not exclude the addition of other features.

[0050] Considering that fever is one of the common symptoms in infants and young children, and because young infants do not have a sound body temperature regulation function, persistent high fever will hinder the function of the central nervous system, and in severe cases will threaten the life safety of infants and young children. Therefore, physical cooling can be used for patients with moderate or high fever, which can effectively remove the local high fever of the patient through heat exchange and play an effective protective role for the patient.

[0051] At present, when controlling semiconductor cooling or heating, over-temperature protection is mainly achieved by controlling the polarity of the semiconductor through a relay and detecting the temperature of the water tank through a sensor.

[0052] However, when the temperature is close to the target value, the relay is easily switched frequently, which affects the life of the relay. When the water temperature is detected by the sensor, when the sensor has problems or the software crashes, it will also cause the user to be at risk of frostbite or scalds, affecting the user experience.

[0053] To address this problem, the present application provides a physical cooling device driving system and method, the physical cooling device driving system comprising an intelligent monitoring module, a display interaction module, a cooling and heating module, a semiconductor and a central processing unit; the intelligent monitoring module is used to send the detected detection data to the display interaction module, and send the detection data to the central processing unit, the display interaction module is used to transmit the corresponding interaction parameters to the central processing unit in response to the user's interaction operation on the external device of the display interaction module, and simultaneously display the detection data sent by the intelligent monitoring module in real time, the central processing unit is used to receive the detection data and the interaction parameters, and determine the corresponding control instructions based on the detection data and the interaction parameters, and send the control instructions to the cooling and heating module, the cooling and heating module is used to control the semiconductor to cool or heat based on the control instructions, and disconnect the power supply of the semiconductor when the temperature of the semiconductor is abnormal. In the present application, the corresponding control instructions are determined through data transmission among the intelligent monitoring module, the display interaction module and the central processing unit, and the control instructions are sent to the cooling and heating module to control the semiconductor for cooling or heating based on the control instructions, and disconnect the power supply of the semiconductor when the temperature of the semiconductor is abnormal. There is no need to disconnect the power supply of the semiconductor by frequently switching the relay, thereby improving the life of the relay. When the water temperature is detected by the intelligent monitoring module, the semiconductor is controlled for cooling or heating according to the water temperature, which will not cause the risk of frostbite or scald to the user, thereby improving the user experience.

[0054] Figure 1 It is a structural block diagram of a physical cooling device driving system according to an embodiment of the present application. The physical cooling device driving system 100 includes an intelligent monitoring module 1, a display interaction module 2, a cooling and heating module 3, a semiconductor 4 and a central processing unit 5.

[0055] Among them, the display interaction module 2 , the intelligent monitoring module 1 , the cooling and heating module 3 , and the semiconductor 4 are respectively connected to the central processing unit 5 , and the semiconductor 4 is connected to the intelligent monitoring module 1 and the cooling and heating module 3 .

[0056] For example, Figure 2 This is a schematic diagram of the overall architecture of the physical cooling device drive system. Figure 2 As shown, the display screen represents the display interaction module 2 of the present application, the data acquisition represents the intelligent monitoring module 1 of the present application, the water pump control, the cooling fan control, the solenoid valve control and the semiconductor 4 control represent the cooling and heating module 3 of the present application, and the CPU (Central Processing Unit) represents the central processing unit 5 of the present application.

[0057] The intelligent monitoring module 1 is used to send the detected detection data to the display interaction module 2, and send the detection data to the central processor 5. It should be noted that the detection data at least includes water temperature, body temperature, pressure, and liquid level data.

[0058] The display interaction module 2 is used to transmit the corresponding interaction parameters to the central processor 5 in response to the user's interaction operation on the display interaction module 2, and at the same time display the detection data sent by the intelligent monitoring module 1 in real time. Among them, the interaction parameters at least include training mode, training duration, set water temperature, and music playback parameters. For example, the user sets the training mode through human-computer interaction operations such as clicking and touching on the display screen of the display interaction module 2, thereby transmitting the determined corresponding interaction parameters to the central processor 5.

[0059] The central processor 5 is used to receive the detection data and the interaction parameters, determine the corresponding control instructions based on the detection data and the interaction parameters, and send the control instructions to the cooling and heating module 3. The control instructions are instructions for controlling the semiconductor 4 to perform cooling or heating.

[0060] The cooling and heating module 3 is used to control the semiconductor 4 to cool or heat based on the control instruction, and to cut off the power supply of the semiconductor 4 when the temperature of the semiconductor 4 is abnormal.

[0061] In the physical cooling device driving system of the present application, the intelligent monitoring module 1 is used to send the detected detection data to the display interaction module 2 and send the detection data to the central processing unit 5. The display interaction module 2 is used to transmit the corresponding interaction parameters to the central processing unit 5 in response to the user's interaction operation on the external device of the display interaction module 2, and at the same time display the detection data sent by the intelligent monitoring module 1 in real time. The central processing unit 5 is used to receive the detection data and the interaction parameters, and determine the corresponding control instructions based on the detection data and the interaction parameters, and send the control instructions to the cooling and heating module 3. The cooling and heating module 3 is used to control the semiconductor 4 to cool or heat based on the control instructions, and disconnect the power supply of the semiconductor 4 when the temperature of the semiconductor 4 is abnormal. In the present application, the corresponding control instructions are determined through data transmission among the intelligent monitoring module, the display interaction module and the central processing unit, and the control instructions are sent to the cooling and heating module to control the semiconductor for cooling or heating based on the control instructions, and disconnect the power supply of the semiconductor when the temperature of the semiconductor is abnormal. There is no need to disconnect the power supply of the semiconductor by frequently switching the relay, thereby improving the life of the relay. When the water temperature is detected by the intelligent monitoring module, the semiconductor is controlled for cooling or heating according to the water temperature, which will not cause the risk of frostbite or scald to the user, thereby improving the user experience.

[0062] Furthermore, the cooling and heating module 3 includes a driver chip. The control semiconductor 4 for cooling or heating may include the following steps:

[0063] The output polarity of the semiconductor 4 is adjusted to the target output polarity corresponding to the control instruction through the driving chip; based on the target output polarity, the semiconductor 4 performs cooling or heating corresponding to the target output polarity.

[0064] For example, the driver chip is a half-bridge driver chip. This application describes the half-bridge driver chip as an example, but does not constitute a limitation on the driver chip. Specifically, for example, when the control instruction indicates that the semiconductor 4 needs to be cooled, the output polarity of the semiconductor 4 is adjusted to the target output polarity required for cooling (for example, negative pole) through the driver chip, and the semiconductor 4 with the adjusted output polarity is cooled.

[0065] Furthermore, the cooling and heating module 3 includes a semiconductor 4 control circuit; the semiconductor 4 control circuit includes a driving chip and a MOS tube; the driving chip and the MOS tube are connected, and connected to the semiconductor 4 through the MOS tube.

[0066] Among them, the driving chip is used to generate a corresponding control signal in response to the PWM (Pulse Width Modulation) signal input based on the control instruction at the input end of the semiconductor 4 control circuit, and send the control signal to the MOS tube (Metal Oxide Semiconductor Field Effect Transistor) so that the MOS tube drives the output polarity of the semiconductor 4.

[0067] The semiconductor 4 is used to change the output polarity under the drive of the MOS tube to perform cooling or heating. That is, the MOS tube drives the output polarity of the semiconductor 4.

[0068] For example, as shown in FIG. 3( a ) and FIG. 3( b ), they together constitute the semiconductor 4 control circuit of the present application, wherein U12 and U13 both represent driving chips.

[0069] Furthermore, the driving chip includes a first driving chip and a second driving chip; the PWM signal includes a first PWM signal and a second PWM signal; and the control signal includes a first control signal and a second control signal.

[0070] Among them, the first driving chip is used to generate a corresponding first control signal in response to the first PWM signal input based on the control instruction at the input end of the semiconductor 4 control circuit, and send the first control signal to the MOS tube so that the MOS tube drives the output polarity of the semiconductor 4.

[0071] The second driving chip is used to generate a corresponding second control signal in response to the second PWM signal input based on the control instruction at the input end of the semiconductor 4 control circuit, and send the second control signal to the MOS tube so that the MOS tube drives the output polarity of the semiconductor 4.

[0072] It should be noted that the first PWM signal and the second PWM signal are two PWM signals with the same frequency and opposite polarities.

[0073] The semiconductor 4 is used to change the output polarity to the target output polarity under the control of the first control signal and the second control signal to perform cooling or heating.

[0074] For example, as shown in Figures 3(a) and 3(b), Figure 3(a) corresponds to a first driver chip, and Figure 3(b) corresponds to a second driver chip. The first driver chip generates a corresponding first control signal in the circuit in Figure 3(a), and sends the first control signal to the MOS tube so that the MOS tube drives the output polarity of the semiconductor 4, while the second driver chip generates a corresponding second control signal in the circuit in Figure 3(b), and sends the second control signal to the MOS tube so that the MOS tube drives the output polarity of the semiconductor 4.

[0075] Furthermore, the physical cooling device driving system also includes a wireless communication module; the wireless communication module includes a Bluetooth module and a 4G module; the wireless communication module is connected to the central processor 5.

[0076] The Bluetooth module is used to achieve interconnection with external devices, so as to push the interactive information corresponding to the interactive operation to the display interactive module 2 through the external device. The interactive information includes music and reports; the external device can be an electronic device that supports Bluetooth communication, such as a mobile phone and a tablet. For example, the external device can push music to the display interactive module 2 through the Bluetooth module for playback to relieve the mood of the user, especially the baby, and control the display interactive module 2 to print reports, etc.

[0077] The 4G module is used to realize the remote control of the physical cooling device drive system by an external device. Specifically, the 4G module is used to realize the remote control of the physical cooling device drive system, for example, remotely controlling the physical cooling device drive system through a mobile phone.

[0078] It should be noted that the 4G module can also be used to collect user information and abnormal status information of the user, and adjust the display interaction module 2 based on the user information and abnormal status information. Therefore, the display interaction module 2 can be adjusted after information collection to make it more suitable for the characteristics of the user, and the user's personalization is achieved to a certain extent.

[0079] Furthermore, the semiconductor 4 includes two sides; a copper heat sink is installed on each side of the semiconductor 4; a temperature sensor is installed on the copper heat sink; and the water temperature is the water tank temperature. It should be noted that the copper heat sink can also be understood as a copper cooling plate, that is, when the output polarity is switched, the copper heat sink will function as a copper cooling plate, that is, according to the output polarity of the semiconductor 4, the copper heat sink performs heat dissipation or heat dissipation.

[0080] It should be noted that one side of the semiconductor 4 realizes cooling or heating, and the other side of the semiconductor 4 realizes corresponding cooling or heat dissipation.

[0081] The above-mentioned method of disconnecting the power supply of the semiconductor 4 when the temperature of the semiconductor 4 is abnormal may include the following steps:

[0082] a. The water tank temperature is collected based on the second temperature sensor in the intelligent monitoring module 1, and when it is detected that the water tank temperature is higher than a preset first threshold or lower than a preset second threshold, the power supply of the semiconductor 4 is disconnected.

[0083] b. Based on the first temperature sensor on the copper heat sink, the temperature of the copper heat sink is detected to determine the temperature of the semiconductor 4, and when it is detected that the temperature of the semiconductor 4 is higher than the preset third threshold or lower than the preset fourth threshold, the power supply of the semiconductor 4 is disconnected.

[0084] c. In response to a problem with the target software, the target software is reset to power off the semiconductor 4.

[0085] Specifically, steps a, b, and c correspond to the first-level temperature protection, the second-level temperature protection, and the third-level temperature protection, respectively. In step a, the two second temperature sensors (for example, PT1000) in the intelligent monitoring module 1 can be used to collect the temperatures of the two water tanks. When it is detected that the temperature of any water tank is higher or lower than the threshold, the power supply of the semiconductor 4 is disconnected; in step b, the first temperature sensor (for example, 18B20) on the copper heat sink is used to detect the temperature of the copper heat sink, that is, the first temperature sensors 18B20 installed on the two copper heat sinks on both sides of the semiconductor 4 are detected. When the temperature on either side is detected to be abnormal, the power supply of the semiconductor 4 is disconnected; in step c, when a problem occurs with the target software (for example, the watchdog software), a reset is performed to return the semiconductor 4 to the power-off state.

[0086] Thus, through steps a, b, and c, three-level temperature protection is achieved for the semiconductor 4. It should be noted that the three-level temperature protection is temperature protection at the software level, that is, temperature abnormality protection achieved by software.

[0087] Furthermore, the above-mentioned disconnecting the power supply of the semiconductor 4 when the temperature of the semiconductor 4 is abnormal may also include the following steps:

[0088] d. In response to the first temperature sensor detecting that the temperature of the semiconductor 4 is abnormal, the output polarity of the semiconductor 4 driven by the control circuit is controlled based on the semiconductor 4 to cut off the power supply to the semiconductor 4 .

[0089] Specifically, when the first temperature sensor on the copper heat sink detects that the temperature of the semiconductor 4 is abnormal, and the temperature is higher or lower than a preset threshold, the power supply of the semiconductor 4 is disconnected through the semiconductor 4 control circuit.

[0090] It should be noted that step d is the fourth level temperature protection for the semiconductor 4 , and the fourth level temperature protection is temperature protection at the hardware level, that is, temperature abnormality protection implemented by hardware.

[0091] Therefore, through the multi-level temperature protection of the first, second and third level temperature protection at the software level and the fourth level temperature protection at the hardware level, it is ensured that when the temperature of the semiconductor 4 is abnormal, there is no risk of scalding or freezing the user.

[0092] Furthermore, the physical cooling device driving system includes a lithium battery management module; the lithium battery management module is connected to the central processor 5.

[0093] Among them, the lithium battery management module is used to manage the charging and discharging of the lithium battery;

[0094] As a possible implementation, in response to detecting that the lithium battery has an external voltage input, the lithium battery is charged; in response to detecting that the lithium battery has no external voltage supply, the lithium battery is switched to discharge. For example, the lithium battery is a 24-volt lithium battery, and the lithium battery management module manages the charge and discharge of the 24-volt lithium battery. When an external voltage input is detected, the lithium battery is charged, and when there is no external power supply, the lithium battery is switched to discharge.

[0095] It should be noted that the lithium battery management module is also used to send the power level of the lithium battery to the display interaction module 2 so as to be displayed in real time through the target icon on the display screen of the display interaction module 2 .

[0096] Furthermore, the intelligent monitoring module 1 is also used to issue an alarm and perform processing when abnormal data is detected.

[0097] Therefore, the semiconductor is driven by the half-bridge driver chip to control cooling or heating, and feedback control is achieved by monitoring pressure, water temperature, body temperature, etc.

[0098] Figure 4 is a flow chart of a method for driving a physical cooling device according to an embodiment of the present application, such as Figure 4 As shown, the physical cooling device driving method of the embodiment of the present application may specifically include the following steps:

[0099] S401, the intelligent monitoring module sends the detected detection data to the display interaction module, and sends the detection data to the central processing unit.

[0100] In the embodiment of the present application, the detection data includes at least water temperature, body temperature, pressure, and liquid level data.

[0101] S402, the display interaction module transmits corresponding interaction parameters to the central processor in response to the user's interaction operation on the external device of the display interaction module, and simultaneously displays the detection data sent by the intelligent monitoring module in real time.

[0102] In the embodiment of the present application, the interactive parameters include at least training mode, training duration, set water temperature, and music playback parameters.

[0103] S403, the central processing unit receives the detection data and the interaction parameters, determines corresponding control instructions based on the detection data and the interaction parameters, and sends the control instructions to the cooling and heating module.

[0104] S404, the cooling and heating module controls the semiconductor to cool or heat based on the control instruction, and disconnects the power supply of the semiconductor when the temperature of the semiconductor is abnormal.

[0105] The physical cooling device driving method of the present application, the intelligent monitoring module is used to send the detected detection data to the display interaction module and send the detection data to the central processing unit, the display interaction module is used to respond to the user's interactive operation on the external device of the display interaction module to transmit the corresponding interaction parameters to the central processing unit, and at the same time, the detection data sent by the intelligent monitoring module is displayed in real time, the central processing unit is used to receive the detection data and the interaction parameters, and determine the corresponding control instructions based on the detection data and the interaction parameters, and send the control instructions to the cooling and heating module, the cooling and heating module is used to control the semiconductor to cool or heat based on the control instructions, and disconnect the power supply of the semiconductor when the semiconductor temperature is abnormal. The physical cooling device driving method of the present application determines the corresponding control instructions through the data transmission of the intelligent monitoring module, the display interaction module and the central processing unit, and sends the control instructions to the cooling and heating module, so as to control the semiconductor to cool or heat based on the control instructions, and disconnect the power supply of the semiconductor when the semiconductor temperature is abnormal, without disconnecting the power supply of the semiconductor by frequently switching the relay, thereby improving the life of the relay, and when the water temperature is detected by the intelligent monitoring module, the semiconductor is controlled to cool or heat according to the water temperature, which will not cause the risk of frostbite or scald to the user, thereby improving the user experience.

[0106] Furthermore, the physical cooling device driving system 100 also includes a lithium battery management module.

[0107] The lithium battery management module manages the charging and discharging of the lithium battery.

[0108] It should be noted here that the explanations and descriptions of the above-mentioned embodiments are also applicable to the physical cooling device driving method of the embodiments of the present application, and the specific process will not be repeated here.

[0109] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, the specific working process of the system and device described above can refer to the corresponding process in the method embodiment, and will not be repeated in this application. In the several embodiments provided in this application, it should be understood that the disclosed system, device and method can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation. For example, multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.

[0110] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0111] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0112] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the deployment method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard drives, ROM, RAM, magnetic disks, or optical disks.

[0113] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A physical cooling device driving system, characterized in that: The physical cooling device driving system includes an intelligent monitoring module, a display interaction module, a cooling and heating module, a semiconductor and a central processing unit; The display interaction module, the intelligent monitoring module, the cooling and heating module, and the semiconductor are respectively connected to the central processing unit, and the semiconductor is connected to the intelligent monitoring module and the cooling and heating module; The intelligent monitoring module is used to send the detected detection data to the display interaction module, and send the detection data to the central processor; wherein the detection data at least includes water temperature, body temperature, pressure, and liquid level data; The display interaction module is used to transmit the corresponding interaction parameters to the central processor in response to the user's interaction operation on the external device of the display interaction module, and simultaneously display the detection data sent by the intelligent monitoring module in real time; wherein the interaction parameters at least include training mode, training duration, set water temperature, and music playback parameters; The central processor is used to receive the detection data and the interaction parameters, determine corresponding control instructions based on the detection data and the interaction parameters, and send the control instructions to the cooling and heating module; The cooling and heating module is used to control the semiconductor to cool or heat based on the control instruction, and to cut off the power supply of the semiconductor when the temperature of the semiconductor is abnormal.

2. The system according to claim 1, characterized in that The cooling and heating module includes a driving chip; the controlling the semiconductor to perform cooling or heating includes: adjusting the output polarity of the semiconductor to the target output polarity corresponding to the control instruction through the driving chip; The semiconductor based on the target output polarity performs cooling or heating corresponding to the target output polarity.

3. The system according to claim 2, characterized in that The cooling and heating module includes a semiconductor control circuit; the semiconductor control circuit includes the driving chip and the MOS tube; the driving chip is connected to the MOS tube, and the semiconductor is connected through the MOS tube; The driving chip is used to generate a corresponding control signal in response to the PWM signal input by the input end of the semiconductor control circuit based on the control instruction, and send the control signal to the MOS tube so that the MOS tube drives the output polarity of the semiconductor; The semiconductor is used to change the output polarity under the drive of the MOS tube to perform cooling or heating.

4. The system according to claim 3, characterized in that The driving chip includes a first driving chip and a second driving chip; the PWM signal includes a first PWM signal and a second PWM signal; the control signal includes a first control signal and a second control signal; The first driving chip is used to generate a corresponding first control signal in response to a first PWM signal inputted at an input end of the semiconductor control circuit based on the control instruction, and send the first control signal to the MOS tube so that the MOS tube drives the output polarity of the semiconductor; The second driving chip is used to generate a corresponding second control signal in response to a second PWM signal input based on the control instruction at the input end of the semiconductor control circuit, and send the second control signal to the MOS tube so that the MOS tube drives the output polarity of the semiconductor; the first PWM signal and the second PWM signal are two PWM signals with the same frequency and opposite polarities; The semiconductor is used to change the output polarity to a target output polarity under the control of the first control signal and the second control signal to perform cooling or heating.

5. The system according to claim 4, characterized in that The physical cooling device driving system also includes a wireless communication module; the wireless communication module includes a Bluetooth module and a 4G module; The Bluetooth module is used to achieve interconnection with the external device, so as to push the interaction information corresponding to the interaction operation to the display interaction module through the external device; wherein the interaction information at least includes music and reports; The 4G module is used to realize the remote control of the physical cooling instrument driving system by the external device.

6. The system according to claim 5, characterized in that The semiconductor includes two sides; a copper heat sink is installed on each side of the semiconductor; a first temperature sensor is installed on the copper heat sink; the water temperature is the water tank temperature; the power supply of the semiconductor is disconnected when the temperature of the semiconductor is abnormal, including: The water tank temperature is collected based on the second temperature sensor in the intelligent monitoring module, and when it is detected that the water tank temperature is higher than a preset first threshold or lower than a preset second threshold, the power supply of the semiconductor is disconnected; and / or, detecting the temperature of the copper heat sink based on the first temperature sensor on the copper heat sink to determine the semiconductor temperature of the semiconductor, and disconnecting the power supply of the semiconductor when it is detected that the semiconductor temperature is higher than a preset third threshold or lower than a preset fourth threshold; and / or, In response to a problem occurring in the target software, the target software is reset so that the semiconductor is powered off.

7. The system according to claim 6, characterized in that The method of disconnecting the power supply of the semiconductor when the temperature of the semiconductor is abnormal also includes: In response to the first temperature sensor detecting that the temperature of the semiconductor is abnormal, the power supply to the semiconductor is cut off based on the output polarity of the semiconductor control circuit driving the semiconductor.

8. The system according to claim 1, characterized in that The physical cooling device driving system includes a lithium battery management module; the lithium battery management module is connected to the central processing unit; The lithium battery management module is used to manage the charging and discharging of the lithium battery.

9. A method for driving a physical cooling device, characterized in that: The physical cooling device driving system applied to any one of claims 1 to 8; the physical cooling device driving system comprises an intelligent monitoring module, a display interaction module, a cooling and heating module, a semiconductor and a central processing unit; the method comprises: The intelligent monitoring module sends the detected detection data to the display interaction module, and sends the detection data to the central processor; wherein the detection data at least includes water temperature, body temperature, pressure, and liquid level data; The display interaction module transmits the corresponding interaction parameters to the central processor in response to the user's interaction operation on the external device of the display interaction module, and simultaneously displays the detection data sent by the intelligent monitoring module in real time; wherein the interaction parameters at least include training mode, training duration, set water temperature, and music playback parameters; The central processor receives the detection data and the interaction parameters, determines corresponding control instructions based on the detection data and the interaction parameters, and sends the control instructions to the cooling and heating module; The cooling and heating module controls the semiconductor to cool or heat based on the control instruction, and cuts off the power supply to the semiconductor when the temperature of the semiconductor is abnormal.

10. The method according to claim 9, characterized in that The physical cooling device driving system also includes a lithium battery management module; the method also includes: The lithium battery management module manages the charging and discharging of the lithium battery.

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