Chip die fixing device for chip production

Abstract

The invention discloses a chip tube core fixing device for chip production, which relates to the technical field of chip production, and comprises an initial unit, a termination unit is arranged above the initial unit, a lower hand-lifting rod is fixedly installed on the surface of the initial unit, an upper hand-lifting rod is fixedly installed on the top of the termination unit, and also comprises a positioning device; wherein, the positioning device comprises a placement unit, a plurality of rubber buckles, a mounting plate, a mother sleeve, a plurality of cylindrical rods, a positioning baffle and a No. 1 spring, a plurality of the placement units are arranged above the initial unit, a plurality of the rubber buckles are fixedly installed on the surfaces of the initial unit, the placement unit and the termination unit, and the mounting plate is arranged on the surface of the rubber buckle, so as to improve the fixing effect and avoid the situation that the chip is detached or worn due to shaking when the operator eliminates bubbles.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and in particular to a chip die fixing device for chip production. Background Art

[0002] The chip die is the core part of the semiconductor integrated circuit, responsible for performing actual calculations and logical operations. With the advancement of technology, the size of the chip die is getting smaller and smaller, while the performance is getting more and more powerful, and the scope of application is becoming wider and wider.

[0003] The patent with patent announcement number CN118398549B relates to a batch chip die position fixing device for semiconductor chip production and processing, including a immersion box, a fixing frame is arranged on the inner side of the immersion box, a fixing plate is fixedly connected to the top of the fixing frame, a termination element is hinged on the side of the fixing plate, and a positioning piece is fixedly connected to the right side of the termination element. The positioning piece clamps the chip so that multiple groups of chips are fixed at the same time, which is convenient for soaking multiple groups of chips at the same time, thereby improving the processing efficiency. The bottom support platform drives the fixed structure and the chip into the immersion pool to corrode the chip surface. There is no need to manually place the chip in the immersion pool, thereby improving the efficiency of operational safety. The clamping bevel block clamps the fixing plate, so that the bottom support platform and the fixing component stop stably after descending, preventing the fixing component from loosening after being hit, thereby improving the fixing effect after moving.

[0004] The above patent has the function of preventing the fixed component from loosening after being hit. By clamping the fixing plate with the clamping bevel block, the bottom support platform and the fixed component can be stably stopped after being lowered, thereby improving the fixing effect after moving. However, bubbles will be generated during the immersion process. If the bubbles are not eliminated in time, the quality of chip production will be reduced. In order to remove the bubbles, it is usually necessary to shake the component repeatedly. However, during the shaking process, the fixing effect of the fixed positioning parts on the chip will be affected, causing the chip to shift or detach, thereby adversely affecting the subsequent overall processing flow. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a chip die fixing device for chip production, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a chip tube core fixing device for chip production, including an initial unit, a termination unit is arranged above the initial unit, a lower hand-lifting rod is fixedly installed on the surface of the initial unit, an upper hand-lifting rod is fixedly installed on the top of the termination unit, and also includes a positioning device; wherein, the positioning device includes a placement unit, a plurality of rubber buckles, a mounting plate, a mother sleeve, a plurality of cylindrical rods, a positioning baffle and a No. 1 spring, hold the upper hand-lifting rod and move downward, the movement of the upper hand-lifting rod drives the termination unit to move in a direction away from the lower hand-lifting rod, and a plurality of the placement units are arranged Above the initial unit, several of the rubber buckles are fixedly installed on the surfaces of the initial unit, the placement unit and the termination unit, the mounting plate is arranged on the surface of the rubber buckle, the female sleeve is arranged on the circumferential surface of the rubber buckle, the surfaces of the termination unit and the placement unit are provided with placement grooves, several of the cylindrical rods are fixedly penetrated through the inner and outer walls of the termination unit and the placement unit, the positioning baffle is slidably installed on the circumferential surface of the cylindrical rod, the movement of the placement unit drives the cylindrical rod to move in a direction away from the lower carrying rod, and the movement of the cylindrical rod drives the positioning baffle to move in a direction away from the lower carrying rod, and the No. 1 spring is arranged between the positioning baffle and the placement groove.

[0007] According to the above technical solution, rectangular grooves are provided on the surfaces of the initial unit and the placement unit, and an arc surface 1 is provided on the side of the rubber buckle away from the mounting plate, and the female sleeve is pulled to move in the direction away from the mounting plate. During the movement, the female sleeve contacts the arc surface 1 of the rubber buckle, so that the female sleeve moves to squeeze the arc surface 1, and the side of the female sleeve close to the placement unit contacts the mounting plate.

[0008] According to the above technical solution, the shape of the positioning baffle is set to be "C" shape, and an anti-slip groove is opened at the bottom of the positioning baffle. The anti-slip groove of the positioning baffle contacts the top of the chip during movement, and the positioning baffle is blocked by the chip and stops moving.

[0009] According to the above technical scheme, it also includes a stabilizing device and a locking device; the stabilizing device includes a sliding plate, a Z-shaped piece, a loading frame, a telescopic rod, a No. 2 spring, a rubber plate and a pull rod, the positioning baffle is in contact with the top of the rubber plate, and since the elastic coefficient of the No. 2 spring is smaller than that of the No. 1 spring, the positioning baffle moves and drives the rubber plate to move downward, the sliding plate slides through the inner wall of the rectangular groove, the Z-shaped piece is arranged between the sliding plate and the rectangular groove, the loading frame is fixedly installed on the side of the sliding plate away from the Z-shaped piece, the telescopic rod slides through the inner and outer walls of the loading frame, the No. 2 spring is arranged between the telescopic rod and the loading frame, the telescopic rod stretches the No. 2 spring during movement, and the No. 2 spring is deformed by the stretching, the rubber plate is fixedly installed on the circumferential surface of the telescopic rod, and the pull rod is fixedly installed on the bottom of the loading frame.

[0010] According to the above technical solution, the rubber plate is provided with corrugations on one side close to the rubber buckle, and the chip contacts the corrugations of the rubber plate when placed, and the rubber plate blocks the chip. The surface of the loading frame is provided with a receiving groove, and the receiving groove is adapted to the size of the rubber plate. When the rubber plate moves downward, it contacts the inner wall of the receiving groove. The circumferential surface of the pull rod is provided with a circular groove.

[0011] According to the above technical scheme, the locking device includes several fixed frames, movable plates, limit rods, pushing plates, No. 3 springs, T-rods, No. 4 springs, card plates and limiting plates. The T-rod is manually pulled downward to move, and the T-rod stretches the No. 4 spring during movement, and the No. 4 spring is deformed by the stretching. Several of the fixed frames are fixedly installed at the bottom of the initial unit and the placement unit, the movable plate slides through the inner and outer walls of the fixed frame, the limit rod slides through the inner and outer walls of the movable plate, the pushing plate is fixedly installed on the side of the limit rod away from the pull rod, the No. 3 spring is arranged between the pushing plate and the movable plate, the T-rod slides through the bottom of the movable plate, the No. 4 spring is arranged between the T-rod and the movable plate, the card plate is fixedly installed on the circumferential surface of the T-rod, and the limiting plate is fixedly installed at the bottom of the fixed frame, and a spherical surface 1 is provided on the side of the limit rod away from the pushing plate, and the circumferential surface of the pull rod contacts with the spherical surface 1 of the limit rod during movement. The movement of the pull rod applies pressure on the spherical surface 1, so that the limit rod moves in the direction away from the pull rod.

[0012] According to the above technical solution, the top of the fixing frame contacts the bottom of the loading frame. When the loading frame moves, the fixing frame provides support force for the loading frame so that the loading frame can move smoothly. The moving plates are relatively arranged with the pull rod as the vertical axis.

[0013] According to the above technical solution, a slot is provided at the bottom of the limiting plate, and the fixing plate contacts the inner wall of the slot. The fixing plate separates from the slot of the limiting plate during movement, so that the limit imposed by the limiting plate on the movable plate is released.

[0014] The present invention provides a chip die fixing device for chip production, which has the following beneficial effects:

[0015] (1) The chip tube core fixing device used in chip production, the mother sleeve moves and contacts with the mounting plate, so that the mother sleeve locks the initial unit, the placement unit and the termination unit. By adopting the mother sleeve assembly method, the operator can flexibly assemble according to the processing quantity, and can also realize the simple placement and removal of chips, effectively improving the overall efficiency of chip processing. At the same time, the positioning baffle is affected by the reaction force and exerts downward pressure on the chip, thereby realizing effective fixation of the chip. By applying pressure to the chip by the positioning baffle, the fixing effect is effectively improved, and the chip is prevented from being detached or worn due to shaking when the operator eliminates bubbles, thereby ensuring stability during production and processing.

[0016] (2) The chip tube core fixing device used in chip production has a rubber plate to block the chip, and at the same time, the positioning baffle moves to drive the rubber plate to move downward. By setting the rubber plate, the safety of the chip when the placement unit is closed is effectively improved, and the normal fixation of the positioning baffle is not affected, thereby ensuring the stable processing. At the same time, the pull rod is pulled to move, and the movement of the pull rod drives the loading frame to move. By moving the rubber plate and resetting it, chips of different sizes are effectively positioned, reducing the downtime for adjustment, meeting the function of positioning chips of different sizes, and effectively improving the applicability of the rubber plate.

[0017] (3) In the chip tube core fixing device used in chip production, the limit rod contacts the inner wall of the circular groove, so that the limit rod applies a limit to the pull rod. The pull rod moved to the specified position is automatically limited by the limit rod, which reduces the operating burden and makes it convenient for operators to fix the rubber plate in a uniform position, thereby improving the standardization of operations. At the same time, the card plate is separated from the card slot, so that the limit imposed by the limit plate on the movable plate is released. The distance between the limit rod and the pull rod can be quickly adjusted through standardized operations, so that the fixed position of the rubber plate is changed, thereby enhancing the flexibility of the limit rod to meet different operating requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 This is a schematic diagram of the structure of the placement unit in a closed state of the present invention;

[0020] Figure 3 It is a schematic diagram of the position structure of the termination unit and the placement unit of the present invention;

[0021] Figure 4 It is a schematic diagram of the position structure of the initial unit and the placement unit of the present invention;

[0022] Figure 5 This is a schematic diagram of the Z-shaped sheet position structure of the present invention;

[0023] Figure 6 This is a schematic diagram of the position structure of the stabilizing device and the locking device of the present invention;

[0024] Figure 7 It is a schematic diagram of the internal structure of the locking device of the present invention.

[0025] In the figure: 1. initial unit; 2. termination unit; 3. lower hand handle; 4. upper hand handle; 5. placement unit; 6. rubber buckle; 7. loading plate; 8. mother sleeve; 9. cylindrical rod; 10. positioning baffle; 11. No. 1 spring; 121. sliding plate; 122. Z-shaped sheet; 123. loading frame; 124. telescopic rod; 125. No. 2 spring; 126. rubber sheet; 127. pull rod; 131. fixed frame; 132. moving plate; 133. limit rod; 134. push plate; 135. No. 3 spring; 136. T-shaped rod; 137. No. 4 spring; 138. card plate; 139. limiting plate. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] See also Figure 1-Figure 7 One embodiment of the present invention is: a chip die fixing device for chip production, comprising an initial unit 1, a termination unit 2 is arranged above the initial unit 1, a lower hand-lifting rod 3 is fixedly installed on the surface of the initial unit 1, an upper hand-lifting rod 4 is fixedly installed on the top of the termination unit 2, and also includes a positioning device; wherein the positioning device comprises a placement unit 5, a plurality of rubber buckles 6, a mounting plate 7, a mother sleeve 8, a plurality of cylindrical rods 9, a positioning baffle 10 and a No. 1 spring 11, a plurality of placement units 5 are arranged above the initial unit 1, a plurality of rubber buckles 6 are fixedly installed on the initial unit 1, The surfaces of the placement unit 5 and the termination unit 2, the mounting plate 7 is arranged on the surface of the rubber buckle 6, the female sleeve 8 is arranged on the circumferential surface of the rubber buckle 6, the surfaces of the termination unit 2 and the placement unit 5 are provided with placement grooves, and a plurality of cylindrical rods 9 are fixedly passed through the inner and outer walls of the termination unit 2 and the placement unit 5, the positioning baffle 10 is slidably installed on the circumferential surface of the cylindrical rod 9, and a No. 1 spring 11 is arranged between the positioning baffle 10 and the placement groove. The positioning baffle 10 applies pressure to the chip, which effectively improves the fixing effect and avoids the chip from being detached or worn due to shaking when the operator eliminates bubbles.

[0028] Rectangular grooves are provided on the surfaces of the initial unit 1 and the placement unit 5, an arc surface is provided on the side of the rubber buckle 6 away from the mounting plate 7, and a side of the mother sleeve 8 close to the placement unit 5 is in contact with the mounting plate 7. By adopting the mother sleeve 8 assembly method, the operator can flexibly assemble according to the processing quantity, and can also realize easy placement and removal of chips.

[0029] The shape of the positioning baffle 10 is set to be "C" shape, and an anti-skid groove is opened at the bottom of the positioning baffle 10. By opening the anti-skid groove at the bottom of the positioning baffle 10, the friction force generated when the positioning baffle 10 contacts the chip is increased, thereby improving the stability of the fixation.

[0030] When the present embodiment is working, the chip is sequentially placed in the initial unit 1 and the placement unit 5, and the multiple mother sleeves 8 are sequentially pulled to move in the direction away from the mounting plate 7. The mother sleeve 8 contacts the arc surface 1 of the rubber buckle 6 during the movement, so that the mother sleeve 8 moves to squeeze the arc surface 1, and the two sides of the rubber buckle 6 are squeezed and deformed. When the contact surface between the mother sleeve 8 and the rubber buckle 6 is separated, the deformed rubber buckle 6 recovers under the action of its own elasticity, and at the same time, the lock applied by the mother sleeve 8 to the initial unit 1, the placement unit 5 and the termination unit 2 is released, and the upper hand lever 4 is held and moved downward, and the upper hand lever 4 moves to drive the termination unit 2 to move away from the lower hand lever 3. The terminating unit 2 moves in the direction of rotation, and the terminating unit 2 moves to drive the mounting plate 7 to rotate. The rotation of the mounting plate 7 drives the placement unit 5 to move in the direction away from the lower hand pole 3, so that the placement unit 5 moves and drives the chip to move together. When the upper hand pole 4 moves to the specified position, it remains parallel to the lower hand pole 3. At the same time, the initial unit 1 contacts the moving placement unit 5, and the terminating unit 2 contacts the placement unit 5 during the movement, so that the initial unit 1, the placement unit 5 and the terminating unit 2 are parallel. The removed multiple mother sleeves 8 are moved in the direction of the mounting plate 7 in turn. When the inner wall of the mother sleeve 8 contacts the arc surface of the rubber buckle 6 during the movement, the mother sleeve 8 moves to squeeze the rubber buckle 6. On both sides, the rubber buckle 6 is squeezed and deformed, and the mother sleeve 8 continues to move and contact the mounting plate 7, so that the mother sleeve 8 locks the initial unit 1, the placement unit 5 and the termination unit 2. By adopting the mother sleeve 8 assembly method, the operator can flexibly assemble according to the processing quantity, and can also realize the simple placement and removal of chips, effectively improving the overall efficiency of chip production and processing. When the placement unit 5 moves, it drives the cylindrical rod 9 to move away from the lower hand handle 3. The movement of the cylindrical rod 9 drives the positioning baffle 10 to move away from the lower hand handle 3. The anti-skid groove of the positioning baffle 10 contacts the top of the chip during movement, and the positioning baffle 10 is locked. The plate 10 stops moving due to the obstruction of the chip, and the placement unit 5 continues to move to squeeze the No. 1 spring 11. The No. 1 spring 11 is squeezed and deformed, so that the deformed No. 1 spring 11 applies a reaction force to the positioning baffle 10. The positioning baffle 10 is affected by the reaction force and exerts downward pressure on the chip, thereby effectively fixing the chip. The termination unit 2 repeats the above movement to fix the chip with the positioning baffle 10. By applying pressure to the chip by the positioning baffle 10, the fixing effect is effectively improved, and the chip is prevented from detaching or being worn due to shaking when the operator eliminates bubbles, thereby ensuring stability during production and processing.

[0031] See also Figure 1-Figure 7On the basis of the above embodiment, another embodiment of the present invention further includes a stabilizing device and a locking device; the stabilizing device includes a sliding plate 121, a Z-shaped piece 122, a loading frame 123, a telescopic rod 124, a second spring 125, a rubber plate 126 and a pull rod 127, the sliding plate 121 slides through the inner wall of the rectangular groove, the Z-shaped piece 122 is arranged between the sliding plate 121 and the rectangular groove, the loading frame 123 is fixedly installed on a side of the sliding plate 121 away from the Z-shaped piece 122, the telescopic rod 124 slides through the inner and outer walls of the loading frame 123, the second spring 125 is arranged between the telescopic rod 124 and the loading frame 123, the rubber plate 126 is fixedly installed on the circumferential surface of the telescopic rod 124, and the pull rod 127 is fixedly installed on the bottom of the loading frame 123. By arranging the rubber plate 126, the safety of the chip when the placement unit 5 is closed is effectively improved, and the normal fixation of the positioning baffle 10 is not affected, thereby ensuring the stable operation.

[0032] A corrugation is provided on one side of the rubber plate 126 close to the rubber buckle 6, a receiving groove is provided on the surface of the loading frame 123, and the receiving groove is adapted to the size of the rubber plate 126. A circular groove is provided on the circumferential surface of the pull rod 127. By moving the position of the rubber plate 126, chips of different sizes can be effectively positioned, thereby reducing the downtime of replacing the placement unit 5 and effectively improving the applicability of the rubber plate 126.

[0033] The locking device includes a plurality of fixed frames 131, a movable plate 132, a limiting rod 133, a pushing plate 134, a third spring 135, a T-shaped rod 136, a fourth spring 137, a clamping plate 138 and a limiting plate 139. The plurality of fixed frames 131 are fixedly mounted at the bottom of the initial unit 1 and the placement unit 5. The movable plate 132 slides through the inner and outer walls of the fixed frame 131. The limiting rod 133 slides through the inner and outer walls of the movable plate 132. The pushing plate 134 is fixedly mounted on the side of the limiting rod 133 away from the pull rod 127. The third spring 135 is arranged on the pushing plate 138. Between the plate 134 and the movable plate 132, the T-shaped rod 136 slides through the bottom of the movable plate 132, the No. 4 spring 137 is set between the T-shaped rod 136 and the movable plate 132, the clamping plate 138 is fixedly installed on the circumferential surface of the T-shaped rod 136, the limiting plate 139 is fixedly installed at the bottom of the fixed frame 131, and the limit rod 133 is provided with a spherical surface on the side away from the pushing plate 134. The limit rod 133 automatically applies a limit to the pull rod 127 moved to the specified position, which reduces the operating burden and quickly positions the chips of the same size through unified limit.

[0034] The top of the fixing frame 131 contacts the bottom of the loading frame 123, and the moving plate 132 is relatively arranged with the pull rod 127 as the vertical axis. The supporting force provided by the fixing frame 131 enables the loading frame 123 to move smoothly while reducing the burden of the sliding plate 121, thereby extending the service life of the sliding plate 121.

[0035] A card slot is provided at the bottom of the limiting plate 139 , and the card plate 138 contacts the inner wall of the card slot. The distance between the limiting rod 133 and the pull rod 127 can be quickly adjusted through standard operation, thereby achieving the effect of flexible limiting of the pull rod 127 .

[0036] When the present embodiment is working, the chip contacts with the corrugations of the rubber plate 126 when being placed, and the rubber plate 126 blocks the chip, so that the chip will not be separated due to shaking when the placement unit 5 moves. At the same time, the positioning baffle 10 contacts with the top of the rubber plate 126 before contacting the chip. Since the elastic coefficient of the No. 2 spring 125 is smaller than that of the No. 1 spring 11, the positioning baffle 10 moves to drive the rubber plate 126 to move downward, and the movement of the rubber plate 126 drives the telescopic rod 124 to move downward. The telescopic rod 124 stretches the No. 2 spring 125 during movement, and the No. 2 spring 125 is stretched and deformed. At the same time, the rubber plate 126 moves. The rubber plate 126 is moved upwards by the rubber plate 126, and the safety of the chip when the placement unit 5 is closed is effectively improved by setting the rubber plate 126, and the normal fixation of the positioning baffle 10 is not affected, thereby ensuring the stable operation. When chips of different sizes need to be produced and processed, the pull rod 127 is manually pulled away from the rubber buckle 6, and the pull rod 127 moves to drive the installation unit 5 to move. The loading frame 123 moves in a direction away from the rubber buckle 6, and the loading frame 123 moves to drive the telescopic rod 124 to move in a direction away from the rubber buckle 6. The telescopic rod 124 moves to drive the rubber plate 126 to move in a direction away from the rubber buckle 6. At the same time, the loading frame 123 moves to drive the sliding plate 121 to move in a direction away from the rubber buckle 6. The sliding plate 121 stretches the Z-shaped sheet 122 during the movement, and the Z-shaped sheet 122 is deformed by the stretching. When the rubber sheet 126 moves to a predetermined position, the chip is placed in the placement unit 5, and the pull rod 127 is released, so that the deformed Z-shaped sheet 122 recovers and drives the sliding plate 121 to move in the direction of the rubber buckle 6. The sliding plate 121 moves and drives the loading frame 123 to move toward the rubber buckle 6. The loading frame 123 moves and drives the telescopic rod 124 to move toward the rubber buckle 6. The telescopic rod 124 moves and drives the rubber plate 126 to move toward the rubber buckle 6. The corrugations of the rubber plate 126 contact the outer wall of the chip during movement. The rubber plate 126 applies a thrust to the chip, so that the chip is in close contact with the inner wall of the placement unit 5. By changing the position of the rubber plate 126, the chips of different sizes are effectively positioned by moving the position of the rubber plate 126, which reduces the downtime of replacing the placement unit 5 and effectively improves the applicability of the rubber plate 126.

[0037] When the operator needs to fix the position of the rubber plate 126, the pull rod 127 is pulled to move toward the moving plate 132. The circumferential surface of the pull rod 127 contacts the spherical surface 1 of the limiting rod 133 during the movement. The pull rod 127 continues to move to apply pressure to the spherical surface 1. The limiting rod 133 is affected by the pressure and moves in the direction away from the pull rod 127. The movement of the limiting rod 133 drives the push plate 134 to move in the direction away from the pull rod 127. The push plate 134 stretches the No. 3 spring 135 during the movement. The No. 3 spring 135 is stretched and deformed. When the spherical surface 1 and the circumferential surface of the pull rod 127 are separated, the deformed No. 3 spring 135 recovers and drives the push plate 134 to move toward the pull rod 1 27 direction, the push plate 134 moves and drives the limit rod 133 to move in the direction of the pull rod 127, the circumferential surface of the limit rod 133 contacts the inner wall of the circular groove during the movement, so that the limit rod 133 applies a limit to the pull rod 127. When the limit needs to be released, the push plate 134 is manually pulled away from the pull rod 127, the push plate 134 moves to stretch the No. 3 spring 135, and at the same time, the push plate 134 moves and drives the limit rod 133 to move away from the pull rod 127, the limit rod 133 is separated from the circular groove during the movement, so that the limit imposed on the pull rod 127 by the limit rod 133 is released, and the limit rod 133 is used to apply the limit to the pull rod 127 moved to the specified position The limit is added to facilitate the operator to quickly adjust the position of the rubber plate 126, thereby improving the standardization of the operation. When the position of the limit rod 133 needs to be adjusted, the T-shaped rod 136 is manually pulled downward, and the T-shaped rod 136 stretches the No. 4 spring 137 during the movement. The No. 4 spring 137 is deformed due to the stretching, and at the same time, the movement of the T-shaped rod 136 drives the card plate 138 to move downward, and the card plate 138 is separated from the card slot of the limiting plate 139 during the movement, so that the limit imposed by the limiting plate 139 on the moving plate 132 is released, pushing the T-shaped rod 136 to move in the direction of the pull rod 127, and the movement of the T-shaped rod 136 drives the moving plate 132 to move in the direction of the pull rod 127. The movement drives the limit rod 133 to move toward the pull rod 127. After the limit rod 133 moves to the predetermined position, the T-shaped rod 136 is released, and the deformed No. 4 spring 137 recovers and drives the T-shaped rod 136 to move upward. The movement of the T-shaped rod 136 drives the clamping plate 138 to move upward. The clamping plate 138 contacts the inner wall of the clamping slot during the movement, so that the limiting plate 139 applies a limit to the moving plate 132. At the same time, the contact position of the pull rod 127 and the limit rod 133 changes. The distance between the limit rod 133 and the pull rod 127 is quickly adjusted through standardized operation, so that the pull rod 127 can be flexibly limited, and the flexibility of the limit rod 133 is enhanced to meet different operation requirements.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip die fixing device for chip production, comprising an initial unit, characterized in that: A termination unit is arranged above the initial unit, a lower handlebar is fixedly installed on the surface of the initial unit, an upper handlebar is fixedly installed on the top of the termination unit, and also includes a positioning device, a stabilizing device and a locking device; Wherein, the positioning device includes a placement unit, a plurality of rubber buckles, a mounting plate, a mother sleeve, a plurality of cylindrical rods, a positioning baffle and a No. 1 spring, a plurality of the placement units are arranged above the initial unit, a plurality of the rubber buckles are fixedly mounted on the surfaces of the initial unit, the placement unit and the termination unit, the mounting plate is arranged on the surface of the rubber buckle, the mother sleeve is arranged on the circumferential surface of the rubber buckle, the surfaces of the termination unit and the placement unit are provided with placement grooves, a plurality of the cylindrical rods are fixedly penetrated through the inner and outer walls of the termination unit and the placement unit, the positioning baffle is slidably mounted on the circumferential surface of the cylindrical rod, and the No. 1 spring is arranged between the positioning baffle and the placement groove; The shape of the positioning baffle is set to be "C" shape, and the bottom of the positioning baffle is provided with an anti-slip groove; By holding the upper carrying rod and moving downward, the movement of the upper carrying rod drives the termination unit to move away from the lower carrying rod, the movement of the termination unit drives the mounting plate to rotate, and the rotation of the mounting plate drives the placement unit to move away from the lower carrying rod, so that the placement unit moves with the chip, and the upper carrying rod moves to the specified position and remains parallel to the lower carrying rod. At the same time, the initial unit contacts the moving placement unit, and the termination unit contacts the placement unit during movement, so that the initial unit, the placement unit and the termination unit are parallel, and the anti-slip groove of the positioning baffle contacts the top of the chip during movement. The positioning baffle is affected by the reaction force and exerts downward pressure on the chip, thereby effectively fixing the chip.

2. The chip die fixing device for chip production according to claim 1, characterized in that: The surfaces of the initial unit and the placement unit are both provided with rectangular grooves, the side of the rubber buckle away from the mounting plate is provided with an arc surface 1, and the side of the female sleeve close to the placement unit is in contact with the mounting plate.

3. The chip die fixing device for chip production according to claim 2, characterized in that: The stabilizing device includes a sliding plate, a Z-shaped piece, a loading frame, a telescopic rod, a No. 2 spring, a rubber plate and a pull rod. The sliding plate slides through the inner wall of the rectangular groove, the Z-shaped piece is arranged between the sliding plate and the rectangular groove, the loading frame is fixedly installed on a side of the sliding plate away from the Z-shaped piece, the telescopic rod slides through the inner and outer walls of the loading frame, the No. 2 spring is arranged between the telescopic rod and the loading frame, the rubber plate is fixedly installed on the circumferential surface of the telescopic rod, and the pull rod is fixedly installed on the bottom of the loading frame.

4. The chip die fixing device for chip production according to claim 3, characterized in that: The rubber plate has corrugations on one side close to the rubber buckle, the loading frame has a receiving groove on its surface, the receiving groove is matched with the size of the rubber plate, and the pull rod has a circular groove on its circumferential surface.

5. The chip die fixing device for chip production according to claim 4, characterized in that: The locking device includes several fixed frames, movable plates, limit rods, pushing plates, No. 3 springs, T-shaped rods, No. 4 springs, card plates and limiting plates. Several of the fixed frames are fixedly installed at the bottom of the initial unit and the placement unit, the movable plate slides through the inner and outer walls of the fixed frame, the limit rod slides through the inner and outer walls of the movable plate, the pushing plate is fixedly installed on the side of the limit rod away from the pull rod, the No. 3 spring is arranged between the pushing plate and the movable plate, the T-shaped rod slides through the bottom of the movable plate, the No. 4 spring is arranged between the T-shaped rod and the movable plate, the card plate is fixedly installed on the circumferential surface of the T-shaped rod, the limiting plate is fixedly installed at the bottom of the fixed frame, and the side of the limit rod away from the pushing plate is provided with a spherical surface.

6. The chip die fixing device for chip production according to claim 5, characterized in that: The top of the fixing frame contacts the bottom of the loading frame, and the moving plates are relatively arranged with the pull rod as a vertical axis.

7. The chip die fixing device for chip production according to claim 6, characterized in that: A clamping slot is formed at the bottom of the limiting plate, and the clamping plate contacts the inner wall of the clamping slot.

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