An etching device for IC substrate production and processing

Abstract

The present invention relates to the technical field of semiconductor production and processing equipment, and discloses an etching device for IC carrier production and processing, including a shell, the center of the shell is rotatably connected to a spline shaft, the inner side of the shell is rotatably provided with a fixed plate for driving the carrier to rotate, the number of the fixed plates is set to be several, and the several fixed plates are rotatably connected to clamping plates for clamping the carrier through a rotating shaft. The present invention drives the carrier to rotate around the axis of the spline shaft through the clamping plate, so that the carrier rotates synchronously with the inner spray plate and the outer spray plate, while ensuring that the spray etching liquid is relatively corresponding to the angle of the carrier and the etching uniformity, the waste etching liquid in the etching tank is thrown out through the centrifugal effect that is approximately perpendicular to the etching surface, and the effect of discharging the waste etching liquid is further enhanced by the horizontal flipping of the carrier, and the alternating replacement of the centrifugal surface of the carrier improves the etching quality of the etching device.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production and processing equipment, and in particular to an etching device for producing and processing IC carrier boards. Background Art

[0002] In the process of IC substrate production and processing, it is necessary to use spray etching to perform anisotropic etching on the IC substrate to be etched. The existing spray etching equipment includes a conveyor belt composed of several roller groups, and spray pipes are arranged above and below the conveyor belt to spray etching liquid to the substrate on the conveyor belt. During etching, several flat substrates pass under the spray pipes in turn, and the upper and lower surfaces of the substrates are etched.

[0003] However, during the use of traditional spray etching equipment, the etching liquid sprayed onto the upper surface of the carrier is prone to accumulate in the etched etching groove after etching is completed. The concentration of the waste etching liquid is lower than the etching liquid in the spray pipe, and it accumulates in the etching groove to form a pool effect, which leads to a decrease in the etching efficiency and quality of the carrier. In addition, part of the adjacent sprayed etching liquid falls between the ringing carriers and directly falls into the recovery tank below, resulting in a waste of etching liquid. Summary of the invention

[0004] In view of the shortcomings of the existing spray etching equipment mentioned in the background technology during use, the present invention provides an etching device for IC substrate production and processing, which has the advantages of avoiding the pool effect, improving etching quality and saving etching liquid, and solves the technical problems raised in the above background technology.

[0005] The present invention provides the following technical solution: an etching device for IC carrier production and processing, comprising a shell, the center of the shell is rotatably connected to a spline shaft, the inner side of the shell is rotatably provided with a fixed plate for driving the carrier to rotate, the number of the fixed plates is set to be several, and the plurality of fixed plates are rotatably connected to clamping plates for clamping the carrier through a rotating shaft, the clamping plates are used to clamp and drive the carrier to flip a rated angle, the spline shaft is connected to a transmission shaft through a spline transmission, and the outer side of the transmission shaft is fixedly connected to a No. 1 transmission rod for driving the fixed plate to rotate;

[0006] An inner spray plate for spraying and etching the carrier plate is arranged on the inner side of the shell, an outer spray plate for spraying and etching the carrier plate is arranged on the inner side of the shell, a gear ring for adjusting the centrifugal surface of the carrier plate is fixedly connected to the inner side of the shell, and the clamping plate is transmission-connected with a flipping gear cooperating with the gear ring, and the flipping gear and the gear ring cooperate to drive the clamping plate to flip to a rated angle.

[0007] Preferably, the spline shaft comprises a connecting portion and a spline portion, the transmission shaft is slidably sleeved with the spline portion, and the rotation of the spline portion drives the transmission shaft to rotate through the spline;

[0008] One side of the splint is fixedly connected with gear No. 3 via a rotating shaft, one side of the fixed plate is rotatably connected with gear No. 4 that matches gear No. 3, the gear No. 3 and the gear No. 4 are both configured as bevel gears and mesh with each other, the bottom end of the gear No. 4 is fixedly connected with a transmission rod, the bottom end of the transmission rod is fixedly connected with a flipping gear, and the flipping angle of the splint is 180°.

[0009] Preferably, a connecting plate is fixedly connected to the inner side of the inner spray plate, the connecting plate is drivingly connected to the spline shaft, a plurality of No. 2 transmission rods are fixedly connected to the top of the inner spray plate, and one end of the No. 2 transmission rod is fixedly connected to the outer spray plate.

[0010] Preferably, the bottom radius of the transmission rod is enlarged and a limiting groove is provided, the number of the limiting grooves is set to two and the two limiting grooves are symmetrically arranged about the axis of the transmission rod, a magnetic rod adapted to the limiting groove is slidingly arranged inside the fixed plate, a stop block is fixedly sleeved at one end of the magnetic rod body, a spring for pushing the magnetic rod to be embedded in the limiting groove is movably sleeved on the outer side of the magnetic rod, a magnetic plate matching the magnetic rod is fixedly connected to the top of the gear ring, and the acting force between the magnetic plate and the magnetic rod is an attractive force.

[0011] Preferably, an upper support rod is fixedly connected to the top of the inner side of the shell, a connecting block is fixedly connected to the midpoint of the upper support rod, and a shunt pipe for connecting the rotating pipeline and the fixed pipeline is rotatably connected to the inner side of the connecting block;

[0012] The diversion pipe includes a fixed pipe and a rotating pipe, which are rotatably connected to each other. The fixed pipe and the rotating pipe are both arranged in an inner and outer layer, and the corresponding inner and outer layers are connected. The inner layer of the rotating pipe is connected to the nozzle of the outer spray plate through the No. 2 pipe, and the outer layer of the rotating pipe is connected to the nozzle of the inner spray plate through the No. 1 pipe.

[0013] Preferably, a conductive ring is fixedly sleeved on the outer side of the rotating tube, the number of the conductive rings matches the number of carrier plates, a conductive block adapted to the conductive ring is fixedly provided inside the upper support rod 10, the conductive ring is provided with an arc-shaped notch, and the conductive ring is electrically connected to the solenoid valve in the nozzle of the corresponding carrier plate.

[0014] Preferably, the bottom end of the spline shaft is transmission-connected to a servo motor, a transmission coupler is provided at the bottom of the spline shaft, the connecting portion of the spline shaft is fixedly connected to one end of the shaft of the transmission coupler, and the output end of the servo motor is fixedly connected to the other end of the shaft of the transmission coupler.

[0015] Preferably, the connecting portion of the spline shaft is fixedly sleeved with a No. 2 gear near the bottom end, the inner side of the housing is fixedly connected with a lower support rod near the bottom end, one side of the lower support rod is rotatably connected with a cam via a rotating shaft, and one side of the cam is fixedly connected with the No. 1 gear via a rotating shaft;

[0016] The number one gear is meshed with the number two gear, and an adjusting rod for adjusting the height of the transmission shaft is slidably connected to one side of the lower support rod near the top, and one end of the adjusting rod is fixedly connected to a supporting ring, which is rotatably engaged with the outer side of the transmission shaft.

[0017] Preferably, the connecting plate is fixedly connected to the connecting portion, and the No. 1 transmission rod is fixedly connected to the transmission shaft.

[0018] The present invention has the following beneficial effects:

[0019] 1. The present invention drives the spline shaft to rotate by a servo motor, and the spline shaft cooperates with the transmission shaft to drive the carrier plate and the spray plates on both sides of the carrier plate to rotate synchronously. During the rotation process, the spray plate is fixed at a spray angle corresponding to the carrier plate, so that during the rotation of the carrier plate, the etching surface of the carrier plate is subjected to a centrifugal force in a direction close to the vertical direction, so that the etched waste etching liquid in the etching groove is centrifugally thrown out. During the rotation process, the flip gear and the gear ring are cooperated to drive the clamping plate to horizontally flip the centrifugal surface of the carrier plate, further discharge the waste etching liquid in the etching groove and alternately replace the centrifugal surface of the carrier plate, while fixing the spray angle and thus ensuring that the spray surface is effective and uniform, avoiding the possible pool effect on the surface, improving the quality of etching the IC carrier by the etching device, and the sprayed etching liquid will not fall into the gap between adjacent carrier plates, avoiding the waste of etching liquid.

[0020] 2. The present invention cooperates with the conductive ring and the conductive block so that when the clamp drives the carrier to flip, the conductive block breaks contact with the conductive ring, causing the solenoid valve in the nozzle on the spray plate to disconnect and close, thereby avoiding spraying when the carrier is flipped, and further avoiding waste of etching liquid. At the same time, the No. 1 gear cooperates with the No. 2 gear and the cam transmission to drive the support ring to rise and fall, and then during the synchronous rotation of the carrier and the corresponding spray plate, the carrier is smoothly lifted and lowered. On the one hand, the spray area is relatively reciprocated to improve the uniformity of spraying, thereby ensuring the quality of etching. On the other hand, the reciprocating movement of the carrier further discharges possible etching liquid in the etching tank. In conjunction with the flipping of the carrier, the effect of discharging the etching liquid is further enhanced, thereby improving the etching quality of the etching device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 It is a partial structural schematic diagram of the present invention;

[0023] Figure 3 For the present invention Figure 2 Schematic diagram of some structures in ;

[0024] Figure 4 This is a schematic diagram of the structure of the shunt pipe of the present invention;

[0025] Figure 5 It is a schematic diagram of the transmission structure of the clamping plate of the present invention;

[0026] Figure 6 For the present invention Figure 5 A magnified view of the structure at A;

[0027] Figure 7 For the present invention Figure 5 Schematic diagram of partial structural cross section;

[0028] Figure 8 A schematic cross-sectional view of the conductive ring structure of the present invention;

[0029] Fig. 9 This is a schematic diagram of the connection method in Embodiment 5 of the present invention.

[0030] In the figure: 1, shell; 2, shunt pipe; 201, fixed pipe; 202, rotating pipe; 3, inner spray plate; 4, fixed plate; 5, clamping plate; 6, carrier plate; 7, outer spray plate; 8, No. 1 pipe; 9, No. 2 pipe; 10, upper support rod; 11, gear ring; 12, connecting block; 13, connecting plate; 14, flip gear; 15, No. 1 transmission rod; 16, lower support rod; 17, adjustment rod; 18, cam; 19, No. 1. gear No. 1; 20. transmission coupler; 21. servo motor; 22. gear No. 2; 23. spline shaft; 2301. connecting part; 2302. spline part; 24. support ring; 25. transmission shaft; 26. conductive ring; 27. gear No. 3; 28. gear No. 4; 29. ​​transmission rod; 30. magnetic plate; 31. spring; 32. magnetic rod; 33. limit groove; 34. transmission rod No. 2; 35. conductive block; 36. stop block. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] See also Figure 1 and Figure 2An etching device for IC carrier production and processing includes a shell 1, which is fixed on a bracket. The bottom of the shell 1 is used to hold the waste etching liquid after the reaction for subsequent recycling. The center of the shell 1 is rotatably connected to a spline shaft 23, and a dynamic seal is arranged between the spline shaft 23 and the bottom of the shell 1. The dynamic seal can be set as a mechanical seal. The inner side of the shell 1 is rotatably provided with a fixed plate 4 for driving the carrier 6 to rotate. The number of the fixed plates 4 is set to be several, and the several fixed plates 4 are rotatably connected to each other through a rotating shaft to clamp the carrier 6. The spline shaft 23 is connected with a transmission shaft 25 through a spline transmission, and the transmission shaft 25 is sleeved on the outer side of the spline shaft 23. Specifically, the spline shaft 23 includes a connecting portion 2301 and a spline portion 2302, and the transmission shaft 25 is slidably sleeved on the spline portion 2302. The rotation of the spline portion 2302 drives the transmission shaft 25 to rotate through the spline, and the outer side of the transmission shaft 25 is fixedly connected with a No. 1 transmission rod 15 for driving the fixed plate 4 to rotate.

[0033] An inner spray plate 3 for spraying the etching carrier plate 6 is arranged on the inner side of the shell 1, an outer spray plate 7 for spraying the etching carrier plate 6 is arranged on the inner side of the shell 1, the fixed plate 4 is located between the outer spray plate 7 and the fixed plate 4, and a plurality of nozzles for spraying etching solution are arranged on the inner spray plate 3 and the outer spray plate 7, and a servo motor 21 is connected to the bottom end of the spline shaft 23 for transmission. The rotation of the servo motor 21 drives the spline shaft 23 to rotate, and the rotation of the spline shaft 23 drives the transmission shaft 25 to rotate, and the transmission shaft 25 drives the No. 1 transmission rod 15 to rotate, and the No. 1 transmission rod 15 drives the fixed plate 4 to rotate.

[0034] The fixed plate 4 drives the carrier plate 6 clamped on the clamping plate 5 to make a circular motion around the axis of the spline shaft 23. At the same time, the outer spray plate 7 and the inner spray plate 3 spray the etching solution onto the etching surface of the carrier plate 6. The circular motion of the carrier plate 6 causes the carrier plate 6 to be subjected to a centrifugal force approximately perpendicular to its etching surface. The carrier plate 6 throws out the waste etching liquid after etching on one side through the centrifugal action to avoid the waste etching liquid from forming a pool effect that affects the etching quality of the carrier plate 6. A toothed ring 11 for adjusting the centrifugal surface of the carrier plate 6 is fixedly connected to the inner side of the shell 1. The toothed ring 11 is set to a toothless structure. One side of the clamping plate 5 is fixedly connected to a third gear 27 through a rotating shaft. One side of the fixed plate 4 is rotatably connected to a fourth gear 28 adapted to the third gear 27. The third gear 27 and the fourth gear 28 are both set to bevel gears and mesh with each other.

[0035] The bottom end of the fourth gear 28 is fixedly connected with a transmission rod 29, and the transmission rod 29 is rotatably connected with the fixed plate 4. The bottom end of the transmission rod 29 is fixedly connected with a flip gear 14 that cooperates with the gear ring 11. The flip gear 14 can mesh with the gear ring 11. The fixed plate 4 drives the flip gear 14 to rotate around the axis of the spline shaft 23. The flip gear 14 rotates to mesh with the gear ring 11. The gear ring 11 is fixed, so that the flip gear 14 is driven to rotate by the gear ring 11, and the flip gear 14 drives the transmission rod 29 to rotate. The transmission rod 29 drives the fourth gear 28 to rotate, and the fourth gear 28 drives the third gear 27 to rotate. The clamping plate 5 is driven to rotate, and the angle of rotation of the flip gear 14 and the gear ring 11 is 180 degrees, so that the clamping plate 5 drives one side of the carrier plate 6 to flip to the outside to correspond to the outer spray plate 7. The flip axis of the carrier plate 6 is a horizontal line to reduce possible air resistance. Therefore, during the etching process of the carrier plate 6, the carrier plate 6 is driven to rotate one circle, and the etching surfaces on both sides of the carrier plate 6 are alternated once, and in the subsequent rotation process, the etching surface on the outside avoids the pool effect through the centrifugal action perpendicular to the etching surface. The flipping process is also conducive to the discharge of waste etching liquid, thereby improving the efficiency and quality of etching. Example

[0036] See 1. Figure 2 , Figure 4-Figure 7 On the basis of the first embodiment, the inner spray plate 3 and the outer spray plate 7 are both rotatably arranged in the shell 1. Specifically, a connecting plate 13 is fixedly connected to the inner side of the inner spray plate 3, and the connecting plate 13 is fixedly connected to the connecting portion 2301 of the spline shaft 23. A plurality of No. 2 transmission rods 34 are fixedly connected to the top of the inner spray plate 3, and one end of the No. 2 transmission rod 34 is fixedly connected to the outer spray plate 7. The spline shaft 23 rotates to drive the connecting plate 13 to rotate, and the connecting plate 13 drives the inner spray plate 3 to rotate. The inner spray plate 3 drives the outer spray plate 7 to rotate through the No. 2 transmission rod 34, so that the inner spray plate 3, the outer spray plate 7 and the carrier plate 6 rotate synchronously, and the inner spray plate 3 and the outer spray plate The nozzles of 7 are distributed corresponding to the inner and outer sides of the carrier plate 6 respectively, and the etching solution pressures corresponding to the inner spray plate 3 and the second outer spray plate 7 are set respectively, so that the pressure of the angle of spraying the etching solution on the etching surfaces on both sides of the carrier plate 6 is within the rated range, ensuring the uniformity of etching of the carrier plate 6 and further improving the quality of etching. At the same time, since the spraying areas of the inner spray plate 3 and the outer spray plate 7 corresponding to different carrier plates 6 are fixed, compared with the method of arranging the driven carrier plates 6 and passing under the spray pipes on the conveyor belt in sequence, the etching solution at the spraying point will not fall into the gap between adjacent carrier plates 6, thereby causing waste of etching solution, ensuring the etching quality while saving the use of etching solution.

[0037] In order to further ensure the flipping angle of the carrier plate 6, the bottom radius of the transmission rod 29 is increased and a limiting groove 33 is provided. The number of the limiting grooves 33 is set to two and the two limiting grooves 33 are symmetrically arranged about the axis of the transmission rod 29. The internal sliding of the fixed plate 4 is provided with a magnetic rod 32 adapted to the limiting groove 33. One end of the magnetic rod 32 can be embedded in the limiting groove 33 to limit the rotation of the transmission rod 29 relative to the fixed plate 4. One end of the rod body of the magnetic rod 32 is fixedly sleeved with a stopper 36, and the outer side of the magnetic rod 32 is movably sleeved with a spring 31 for pushing the magnetic rod 32 to be embedded in the limiting groove 33. The top of the gear ring 11 is fixedly connected with a magnetic plate 30 that cooperates with the magnetic rod 32, and the acting force between the magnetic plate 30 and the magnetic rod 32 is an suction Gravity, when the flip gear 14 rotates to be about to engage with the gear ring 11, the magnetic rod 32 rotates to correspond to the position of the magnetic plate 30, and the magnetic plate 30 drives the magnetic rod 32 to slide out of the limit groove 33 through magnetic force. In the process of the flip gear 14 engaging and rotating with the gear ring 11, the magnetic rod 32 and the magnetic plate 30 are staggered, and the spring 31 pushes the block 36 to move, thereby pushing the magnetic rod 32 to move against the side wall of the transmission rod 29 until the carrier plate 6 flips 180°. At this time, the magnetic rod 32 is embedded in another limit groove 33 and fixed again, thereby ensuring the flipping angle of the carrier plate 6 each time, so that the spraying angle of the carrier plate 6 and the synchronously rotating inner spray plate 3 and outer spray plate 7 is guaranteed to be within the rated range, further ensuring the quality of spray etching. Example

[0038] See also Figure 1 , Figure 2 , Figure 4-Figure 8 On the basis of the second embodiment, an upper support rod 10 is fixedly connected to the top of the inner side of the shell 1, and a connecting block 12 is fixedly connected to the midpoint of the upper support rod 10. The inner side of the connecting block 12 is rotatably connected with a shunt pipe 2 for connecting the rotating pipeline and the fixed pipeline. The shunt pipe 2 includes a fixed pipe 201 and a rotating pipe 202. The fixed pipe 201 and the rotating pipe 202 are both arranged as inner and outer layers and the corresponding inner and outer layers are connected. The joint surfaces of the fixed pipe 201 and the rotating pipe 202 are both provided with dynamic seals, which can be arranged as mechanical seals. The fixed pipe 201 is fixedly connected to the upper support rod 10 and is used to be connected to the etching liquid supply device. The rotating pipe 202 is rotatably connected to the upper support rod 10. The rotating pipe 202 is fixedly connected to the connecting portion 2301 of the spline shaft 23. The inner layer of the rotating pipe 202 is connected to the nozzle of the outer spray plate 7 through the No. 2 pipe 9, and the outer layer of the rotating pipe 202 is connected to the nozzle of the inner spray plate 3 through the No. 1 pipe 8, so as to control the pressure of the etching liquid separately.

[0039] To further avoid unnecessary waste of etching solution, a conductive ring 26 is fixedly sleeved on the outer side of the rotating tube 202, and the number of the conductive rings 26 is adapted to the number of the carrier plates 6. A conductive block 35 adapted to the conductive ring 26 is fixedly arranged inside the upper support rod 10, and the conductive ring 26 is provided with an arc-shaped notch. The conductive ring 26 is electrically connected to the solenoid valve in the nozzle of the corresponding carrier plate 6. When the circuit is disconnected, the solenoid valve is closed, and the conductive block 35 and the conductive ring 26 can be electrically connected in a sliding contact manner. When the carrier plate 6 is flipped, the corresponding conductive block 35 slides to the arc-shaped notch of the conductive ring 26, the circuit is disconnected, and the corresponding nozzle stops spraying the etching solution to avoid etching when the carrier plate 6 is in a state of angle change, thereby ensuring the etching angle of the carrier plate 6 while saving the amount of etching solution.

[0040] A transmission coupler 20 is provided at the bottom of the spline shaft 23. The transmission coupler 20 can be set as a magnetic coupler or an electromagnetic friction clutch. The connecting portion 2301 of the spline shaft 23 is fixedly connected to one end of the shaft of the transmission coupler 20, and the output end of the servo motor 21 is fixedly connected to the other end of the shaft of the transmission coupler 20, so as to realize the transmission between the servo motor 21 and the spline shaft 23. After the etching of the carrier plate 6 is completed, the spraying of the chemical is stopped and the servo motor 21 is turned off, and the transmission coupler 20 is disconnected at the same time, so that the carrier plate 6 in the shell and the structure supporting the carrier plate 6 continue to rotate for a period of time under the action of rotational inertia, so that the residual waste etching solution on the carrier plate 6 is centrifugally thrown out, thereby avoiding the etching solution accumulated in the etching tank after the etching is completed to continue etching and affect the etching quality of the carrier plate 6. Example

[0041] See also Figure 1-Figure 3On the basis of the third embodiment, the connecting portion 2301 of the spline shaft 23 is fixedly sleeved with the second gear 22 near the bottom end, the lower support rod 16 is fixedly connected to the bottom end of the inner side of the housing 1, one side of the lower support rod 16 is rotatably connected to the cam 18 through a rotating shaft, one side of the cam 18 is fixedly connected to the first gear 19 through a rotating shaft, the first gear 19 is meshed with the second gear 22, and one side of the lower support rod 16 is slidably connected to the top of the adjusting rod 17 for adjusting the height of the transmission shaft 25, one end of the adjusting rod 17 is fixedly connected to the support ring 24, the support ring 24 is rotatably connected to the outer side of the transmission shaft 25, and a support bearing can be set between the support ring 24 and the transmission shaft 25 to The friction is reduced and the bearing capacity is provided. The rotation of the spline shaft 23 drives the No. 2 gear 22 to rotate. The rotation of the No. 2 gear 22 drives the No. 1 gear 19 to rotate. The No. 1 gear 19 drives the cam 18 to rotate. The adjusting rod 17 always rests on the top of the cam 18 under the action of gravity, so that the adjusting rod 17 can be lifted and lowered reciprocatingly smoothly. The adjusting rod 17 cooperates with the supporting ring 24 to make the transmission shaft 25 rise and fall synchronously, and then the transmission shaft 25 drives the carrier plate 6 to rise and fall, so that the carrier plate 6 moves back and forth corresponding to the etching solution coverage surface sprayed by the nozzle, further improving the uniformity of etching. At the same time, the lifting of the carrier plate 6 further reduces the possibility of the pool effect on the etching surfaces on both sides, thereby improving the etching quality of the carrier plate 6. Example

[0042] See also Figure 1 , Figure 2 and Fig. 9 , which is different from the fourth embodiment, the fixed connection between the connecting plate 13 and the connecting part 2301, and the fixed connection between the No. 1 transmission rod 15 and the transmission shaft 25 are replaced by: the connecting plate 13 is fixedly connected to the transmission shaft 25, and the No. 1 transmission rod 15 is fixedly connected to the connecting part 2301, and the No. 1 transmission rod 15 is located at the top of the shell 1, and the No. 2 transmission rod 34 is located at the bottom of the shell 1, so that the lifting and lowering of the support ring 24 drives the inner spray plate 3 and the outer spray plate 7 to lift and lower reciprocate, and then the etching solution coverage surface of the carrier plate 6 corresponding to the nozzle spray moves back and forth, thereby improving the uniformity of etching.

[0043] The method of use (working principle) of the present invention is as follows:

[0044] The servo motor 21 cooperates with the spline shaft 23 and the transmission shaft 25 to drive the clamping plate 5 and the inner spray plate 3 and the outer spray plate 7 to rotate synchronously and concentrically. While keeping the spray angle of the nozzle to the carrier plate 6 unchanged, the outer etching surface of the carrier plate 6 is subjected to the centrifugal force approximately perpendicular to the etching surface, and the waste etching liquid in the etching tank is thrown out. After the carrier plate 6 rotates one circle, the flip gear 14 and the gear ring 11 are meshed and driven for a distance, and the transmission rod 29, the fourth gear 28 and the third gear 27 drive the clamping plate 5 to rotate 180°, so that the centrifugal surface of the carrier plate 6 is flipped, and then the nozzle and the carrier plate 6 are always corresponding in the whole etching process, ensuring the spray angle and avoiding the waste of etching liquid, while avoiding the accumulation of etching liquid in the etching tank, improving the quality of etching.

[0045] During the flipping of the carrier plate 6, the corresponding nozzle stops spraying to further avoid the waste of etching solution. The spline shaft 23 rotates while driving the No. 2 gear 22 to rotate. The No. 2 gear 22 cooperates with the No. 1 gear 19, the cam 18, the adjustment rod 17 and the support ring 24 to drive the transmission shaft 25 to rise and fall while rotating, thereby driving the carrier plate 6 to rise and fall, so that the spray surface of the etching solution moves back and forth relatively, which is beneficial to discharge the waste etching solution in the etching grooves on both sides of the carrier plate 6 while improving the uniformity of spraying. When the carrier plate 6 is in the flipped state, the discharge effect is further improved.

Claims

1. An etching device for IC substrate production and processing, comprising a housing (1), characterized in that: The center of the housing (1) is rotatably connected to a spline shaft (23); a fixed plate (4) for driving the carrier plate (6) to rotate is rotatably provided on the inner side of the housing (1); the number of the fixed plates (4) is set to be a plurality and a clamping plate (5) for clamping the carrier plate (6) is rotatably connected between two of the fixed plates (4) via a rotating shaft; the clamping plate (5) is used to clamp and drive the carrier plate (6) to flip to a rated angle; the spline shaft (23) is connected to a transmission shaft (25) via a spline transmission; the outer side of the transmission shaft (25) is fixedly connected to a No. 1 transmission rod (15) for driving the fixed plate (4) to rotate; An inner spray plate (3) for spraying and etching the carrier plate (6) is arranged on the inner side of the shell (1), an outer spray plate (7) for spraying and etching the carrier plate (6) is arranged on the inner side of the shell (1), a toothed ring (11) for adjusting the centrifugal surface of the carrier plate (6) is fixedly connected to the inner side of the shell (1), and a flipping gear (14) cooperating with the toothed ring (11) is drivingly connected to the clamping plate (5), and the flipping gear (14) and the toothed ring (11) cooperate to drive the clamping plate (5) to flip to a rated angle.

2. The etching device for producing and processing an IC substrate according to claim 1, characterized in that: The spline shaft (23) comprises a connecting portion (2301) and a spline portion (2302); the transmission shaft (25) is slidably sleeved with the spline portion (2302); the spline portion (2302) rotates to drive the transmission shaft (25) to rotate via the spline; One side of the clamping plate (5) is fixedly connected to a third gear (27) via a rotating shaft, and one side of the fixed plate (4) is rotatably connected to a fourth gear (28) adapted to the third gear (27). The third gear (27) and the fourth gear (28) are both configured as bevel gears and mesh with each other. The bottom end of the fourth gear (28) is fixedly connected to a transmission rod (29), and the bottom end of the transmission rod (29) is fixedly connected to a flipping gear (14). The flipping angle of the clamping plate (5) is 180°.

3. The etching device for producing and processing an IC substrate according to claim 2, characterized in that: A connecting plate (13) is fixedly connected to the inner side of the inner spray plate (3), and the connecting plate (13) is drivingly connected to the spline shaft (23). A plurality of No. 2 transmission rods (34) are fixedly connected to the top of the inner spray plate (3), and one end of the No. 2 transmission rod (34) is fixedly connected to the outer spray plate (7).

4. The etching device for producing and processing an IC substrate according to claim 3, characterized in that: The bottom radius of the transmission rod (29) is increased and a limiting groove (33) is provided. The number of the limiting grooves (33) is set to two and the two limiting grooves (33) are symmetrically arranged about the axis of the transmission rod (29). A magnetic rod (32) adapted to the limiting groove (33) is slidably arranged inside the fixing plate (4). A stopper (36) is fixedly sleeved at one end of the rod body of the magnetic rod (32). A spring (31) for pushing the magnetic rod (32) to be embedded in the limiting groove (33) is movably sleeved on the outer side of the magnetic rod (32). A magnetic plate (30) matched with the magnetic rod (32) is fixedly connected to the top of the gear ring (11). The acting force between the magnetic plate (30) and the magnetic rod (32) is an attractive force.

5. The etching device for producing and processing an IC substrate according to claim 4, characterized in that: An upper support rod (10) is fixedly connected to the top of the inner side of the shell (1), a connecting block (12) is fixedly connected to the midpoint of the upper support rod (10), and a shunt pipe (2) for connecting a rotating pipeline and a fixed pipeline is rotatably connected to the inner side of the connecting block (12); The flow distribution pipe (2) comprises a fixed pipe (201) and a rotating pipe (202), the fixed pipe (201) and the rotating pipe (202) are rotatably connected to each other, the fixed pipe (201) and the rotating pipe (202) are both provided with an inner layer and an outer layer, and the corresponding inner and outer layers are connected to each other, the inner layer of the rotating pipe (202) is connected to the nozzle of the outer spray plate (7) through the No. 2 pipe (9), and the outer layer of the rotating pipe (202) is connected to the nozzle of the inner spray plate (3) through the No. 1 pipe (8).

6. The etching device for producing and processing an IC substrate according to claim 5, characterized in that: A conductive ring (26) is fixedly sleeved on the outer side of the rotating tube (202), the number of the conductive rings (26) being matched with the number of the carrier plates (6), a conductive block (35) matched with the conductive ring (26) being fixedly arranged inside the upper support rod 10, the conductive ring (26) being provided with an arc-shaped notch, and the conductive ring (26) being electrically connected to the solenoid valve in the nozzle of the corresponding carrier plate (6).

7. The etching device for producing and processing an IC carrier according to claim 6, characterized in that: The bottom end of the spline shaft (23) is transmission-connected to a servo motor (21); a transmission coupler (20) is provided at the bottom of the spline shaft (23); a connecting portion (2301) of the spline shaft (23) is fixedly connected to a shaft body at one end of the transmission coupler (20); and an output end of the servo motor (21) is fixedly connected to a shaft body at the other end of the transmission coupler (20).

8. An etching device for producing and processing an IC carrier according to any one of claims 2 to 7, characterized in that: The connecting portion (2301) of the spline shaft (23) is fixedly sleeved with a No. 2 gear (22) near the bottom end, and the inner side of the housing (1) is fixedly connected with a lower support rod (16) near the bottom end, one side of the lower support rod (16) is rotatably connected to a cam (18) via a rotating shaft, and one side of the cam (18) is fixedly connected to a No. 1 gear (19) via a rotating shaft; The first gear (19) is meshed with the second gear (22); an adjusting rod (17) for adjusting the height of the transmission shaft (25) is slidably connected to one side of the lower support rod (16) near the top; one end of the adjusting rod (17) is fixedly connected to a supporting ring (24); the supporting ring (24) is rotatably engaged with the outer side of the transmission shaft (25).

9. The etching device for producing and processing an IC substrate according to claim 8, characterized in that: The connecting plate (13) is fixedly connected to the connecting portion (2301), and the first transmission rod (15) is fixedly connected to the transmission shaft (25).

10. The etching device for producing and processing an IC substrate according to claim 8, characterized in that: The connecting plate (13) is fixedly connected to the transmission shaft (25), and the No. 1 transmission rod (15) is fixedly connected to the connecting portion (2301).

Images