LED packaging method and packaging structure capable of being normally installed and reversely used

Abstract

The invention provides a front-mounted and reverse-used LED packaging method. The method comprises the steps of bowl cup preparation, die bonding and wire welding, dispensing and filling, black ink brushing, rib cutting and separation, secondary pin folding, overturning and use and the like. The invention further provides an LED packaging structure capable of being assembled and used reversely. The LED packaging structure capable of being assembled and used reversely is manufactured through the LED packaging method capable of being assembled and used reversely. The LED product prepared by the LED packaging method for front mounting and reverse use is higher in luminance, larger in light-emitting angle and better in light angle roundness; the front-mounted and reverse-used LED packaging structure is provided with the transparent and unshielded bottom, light is emitted through the bottom when the structure is used, the brightness is higher, the light-emitting angle is larger, and the light-emitting angle is rounder due to the fact that the bottom filler enables the light-emitting angle to be smoother.

Description

Technical Field

[0001] The present invention relates to the technical field of LED packaging, and more precisely to a method and structure for packaging an LED that is installed upright and used in reverse. Background Art

[0002] LED packaging refers to the process of connecting external circuit leads to the electrodes of LED chips to form a structure that is easy to connect to other devices. The packaging structure uses wires to connect the electrodes on the chip to the packaging shell to connect the chip to the external circuit. At the same time, it can fix and seal the chip to prevent the chip circuit from being corroded by water, external air, etc., which may cause the electrical performance to deteriorate. The packaging structure will also have a great impact on the luminous performance of the LED.

[0003] The existing upright LED packaging structure first plastic-seals the bowl on the metal bracket during packaging, cuts the ribs and folds the legs to create the bowl base, then performs die bonding and soldering on the metal circuits of the bowl base. After completion, glue is dispensed and packaged, and finally the loose particles are peeled off by deformation. The upright LED packaging structure solders wires on the front of the chip, which blocks the light-emitting layer of the chip, resulting in reduced brightness. The mouth of the bowl is located above the front of the chip, and the mouth of the bowl will also form an obstruction, resulting in a reduced light-emitting angle. The combination of the above two situations will have a significant adverse effect on the light-emitting formation of the LED. Existing LED packaging structure

[0004] In summary, the art needs to improve the existing LED packaging method and packaging structure to reduce the shading of the chip, increase the light-emitting angle, and improve the light-emitting performance. Summary of the invention

[0005] In view of this, the purpose of the present invention is to provide a method for packaging an LED that is installed upright and used in reverse, and to select corresponding materials to manufacture the LED packaging structure on the front side to form an LED product that can be turned over and used to emit light, thereby improving the brightness and light-emitting angle.

[0006] Another object of the present invention is to provide a front-mounted and inverted LED packaging structure, which is manufactured using the front-mounted and inverted LED packaging method and has higher brightness and a larger light-emitting angle.

[0007] In order to achieve the above object, the present invention provides a method for packaging an LED in a positive-mounted and reverse-used manner, comprising the steps of:

[0008] (1) removing the metal sheet in the empty slot on the bracket, leaving a number of welding areas, forming a number of pins around the empty slot, and connecting the pins to the welding areas;

[0009] (2) A cup is prepared at the empty groove to cover the upper and lower surfaces of the bracket, the upper part of the cup has a crystal fixing cavity, and the welding area is located at the bottom of the crystal fixing cavity, and the cup has a transparent bottom;

[0010] (3) Fixing a number of wafers at the bottom of the crystal bonding chamber and welding wires to connect the wafers to the welding area;

[0011] (4) dispensing glue to fill the interior of the crystal bonding cavity, covering the wafer and the lead wire, and performing a curing process to form a filling layer, wherein the filling layer has an exposed filling surface;

[0012] (5) Apply black ink to the outside of the bowl or cup except the lower part, and apply black ink to the filling surface;

[0013] (6) Cut the ribs along the dividing line to separate the pin from the bracket;

[0014] (7) Folding the lead pins a second time toward the side of the bowl with the crystal-fixing cavity to produce a front-encapsulated LED;

[0015] (8) Flip the front-side packaged LED over and mount it using the pins.

[0016] Preferably, the support in step (1) has a plurality of empty slots arranged in an array.

[0017] Preferably, the bowls and cups in step (2) are made of transparent silicone resin injection molding.

[0018] Preferably, the transparent silicone resin is made by mixing glue A, glue B and filler in a ratio of 10:8.5:0.028.

[0019] Preferably, the bowl or cup in step (2) is a cubic bowl or cup with a length, width and height ratio of 4:6:4.

[0020] Preferably, the wafer in step (3) is fixed to the bottom of the crystal fixing cavity by using transparent epoxy glue.

[0021] Preferably, in step (4), organic silica gel is used to fill the interior of the crystal bonding cavity by dispensing, and the top glue surface of the dispensing is lower than the top surface of the crystal bonding cavity.

[0022] Preferably, the curing treatment in step (4) is performed at 160° C. for 2 hours.

[0023] Preferably, the coating thickness of the black ink in step (5) is not less than 15 μm.

[0024] The present invention provides an upright and inverted LED packaging structure, which is manufactured by the upright and inverted LED packaging method, wherein the side of the pin away from the lower part is fixedly connected to the mounting surface by fixing glue, and the chip emits light through the transparent lower part.

[0025] Compared with the prior art, the advantages of the upright and inverted LED packaging method and packaging structure disclosed in the present invention are: the LED product prepared by the upright and inverted LED packaging method has higher luminous brightness, a larger luminous angle, and better roundness of the light angle; the upright and inverted LED packaging structure has a transparent and unobstructed bottom, and when in use, light is emitted through the bottom, with higher brightness and a larger luminous angle, and the bottom filler makes the luminous angle more rounded. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] like Figure 1 Shown is a schematic structural diagram of a metal bracket in a method for packaging an LED for upright installation and reverse use according to the present application.

[0028] like Figure 2 Shown Figure 1 Enlarged schematic diagram of part A.

[0029] like Figure 3A Shown is a top view of a bowl after preparing the bowl in a method of LED packaging for upright and reverse use of the present application.

[0030] like Figure 3B The front cross-sectional view is shown after preparing the bowl cup in a method of LED packaging for upright installation and reverse use of the present application.

[0031] like Figure 4A Shown is a top view of a face-up and reverse-mounted LED packaging method of the present application after die bonding and wire bonding.

[0032] like Figure 4B The front cross-sectional view after die bonding in a front-mounted and reversed LED packaging method of the present application is shown.

[0033] like Figure 5A Shown is a top view of a face-up and reverse-use LED packaging method of the present application after glue dispensing packaging.

[0034] like Figure 5B The front cross-sectional view is shown after glue dispensing packaging in a method of packaging an LED for upright installation and reverse use according to the present application.

[0035] like Fig. 6A The figure shows a top view of the upper half of a method for packaging an LED in an upright and reverse manner according to the present application after the outer portion is painted black.

[0036] like Figure 6B The front cross-sectional view is shown after the upper half of the exterior is painted black in a method of packaging an LED for upright installation and reverse use according to the present application.

[0037] like Fig. 7A Shown is a top view of a method for packaging an LED for upright and reverse use according to the present application after the ribs are cut and the pins are separated.

[0038] like Figure 7B The front cross-sectional view is shown after the ribs are cut and the pins are separated in a method of packaging an LED for upright installation and reverse use according to the present application.

[0039] like Fig. 8A Shown is a top view of a method for packaging an LED for upright installation and reverse use according to the present application after the pins are bent in reverse.

[0040] like Figure 8B The figure shows a front cross-sectional view of a method for packaging an LED for upright installation and reverse use according to the present application after the pins are bent in reverse.

[0041] like Fig. 9 Shown is a front cross-sectional view of an upright and inverted LED packaging structure of the present application. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] like Figures 1 to 8B As shown, the present invention provides a method for packaging an LED for upright installation and reverse use, comprising the steps of:

[0044] (1) The metal sheet 101 in the empty slot 100 on the bracket 1 is removed, and a plurality of welding areas 11 are retained. A plurality of pins 10 are formed around the empty slot 100, and the pins 10 are connected to the welding areas 11;

[0045] (2) A cup 2 covering the upper and lower surfaces of the bracket 1 is prepared at the empty groove 100, the upper portion of the cup 2 has a crystal fixing cavity 200, and the welding area 11 is located at the bottom of the crystal fixing cavity 200, and the cup 2 has a transparent bottom 21;

[0046] (3) A plurality of wafers 3 are fixed to the bottom of the crystal bonding cavity 200, and wires 31 are welded to connect the wafers 3 and the welding area 11;

[0047] (4) dispensing glue to fill the interior of the crystal bonding cavity 200 to cover the wafer and the lead 31, and then performing a curing process to form a filling layer 4, wherein the filling layer 4 has an exposed filling surface;

[0048] (5) Apply black ink 5 to the outside of the bowl 2 except the lower portion 21, and apply black ink 5 to the filling surface;

[0049] (6) cutting the ribs along the dividing line 102 to separate the pin 10 from the bracket 1;

[0050] (7) Folding the lead 10 a second time toward the side of the cup 2 having the crystal-fixing cavity 20 to produce a front-side packaged LED;

[0051] (8) Flip the LED packaged on the front side and mount it through pin 10.

[0052] The LED product prepared by the forward-mounted and reverse-used LED packaging method has higher luminous brightness, a larger luminous angle, and better light angle roundness.

[0053] Specifically, the support 1 in step (1) has a plurality of empty slots 100 arranged in an array, and batch automation processing can be performed when removing the metal sheet 101, thereby achieving higher processing efficiency.

[0054] In step (2), the bowl cup 2 is made of transparent organic silicone resin by injection molding, and the bowl cup 2 is a cubic bowl cup with a length, width and height ratio of 4:6:4. The transparent organic silicone resin used in the bowl cup 2 is made by injection molding after mixing A glue, B glue and filler in a ratio of 10:8.5:0.028. The bowl cup 2 can ensure high transparency, and the added filler can reduce the internal stress between it and the metal material pin 10, making the light-emitting angle more rounded.

[0055] The chip 3 in step (3) is a horizontally structured upright RGB chip. The chip 3 is fixed to the bottom of the crystal cavity 200 by transparent epoxy glue, and the transparent epoxy glue does not block the light output of the chip 3. Preferably, the spacing between the chips 3 is not less than 80 μm. The lead 31 preferably uses a pure copper double friction welding wire. The welding wire area of ​​the lead 31 is located on the top surface of the chip 3.

[0056] In step (4), organic silica gel is applied to fill the interior of the crystal cavity 200. Preferably, the top surface of the applied glue is lower than the top surface of the crystal cavity 200 to avoid interference with the secondary folding of the lead 10 in the subsequent step (7). The curing treatment is preferably performed at 160° C. for 2 hours.

[0057] In step (5), the thickness of the black ink 5 applied is not less than 15 μm. By applying the black ink 5, the contrast of the lamp beads can be improved, and the utilization rate of other light-emitting surfaces of the chip 3 can be increased, thereby improving the light-emitting effect.

[0058] In step (7), the pin 10 is folded twice toward the side of the cup 2 having the crystal fixing cavity 20 to form a pin structure with upper and lower sides parallel to each other, which is convenient for subsequent reverse installation.

[0059] See also Fig. 9 The present application discloses an upright and inverted LED packaging structure made by the upright and inverted LED packaging method. The side of the pin 10 away from the lower part 21 is fixedly connected to the mounting surface by a fixing glue. The chip 3 emits light through the transparent lower part 21. The chip 3 is not blocked, the light brightness is stronger, the light angle is larger, and the filler in the bottom 21 material makes the light angle more rounded, and the overall light-emitting performance is greatly improved.

[0060] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for packaging an LED with a positive installation and reverse use, characterized in that: Includes steps: (1) removing the metal sheet in the empty slot on the bracket, leaving a number of welding areas, forming a number of pins around the empty slot, and connecting the pins to the welding areas; (2) A cup is prepared at the empty groove to cover the upper and lower surfaces of the bracket, the upper part of the cup has a crystal fixing cavity, and the welding area is located at the bottom of the crystal fixing cavity, and the cup has a transparent bottom; (3) Fixing a number of wafers at the bottom of the crystal bonding chamber and welding wires to connect the wafers to the welding area; (4) dispensing glue to fill the interior of the crystal bonding cavity, covering the wafer and the lead wire, and performing a curing process to form a filling layer, wherein the filling layer has an exposed filling surface; (5) Apply black ink to the outside of the bowl or cup except the lower part, and apply black ink to the filling surface; (6) Cut the ribs along the dividing line to separate the pin from the bracket; (7) Folding the lead pins a second time toward the side of the bowl with the crystal-fixing cavity to produce a front-side packaged LED; (8) Flip the front-side packaged LED over and mount it using the pins.

2. The method for packaging an LED for upright installation and reverse use as claimed in claim 1, characterized in that: The support in step (1) has a plurality of empty slots arranged in an array.

3. The method for packaging an LED for upright installation and reverse use as claimed in claim 1, characterized in that: The bowls and cups in step (2) are made of transparent silicone resin injection molding.

4. The method for packaging an LED for upright installation and reverse use as claimed in claim 3, characterized in that: The transparent organic silicone resin is prepared by mixing glue A, glue B and filler in a ratio of 10:8.5:0.

028.

5. The method for packaging an LED for upright installation and reverse use as claimed in claim 1, characterized in that: The bowl or cup in step (2) is a cubic bowl or cup with a length, width and height ratio of 4:6:

4.

6. The method for packaging an LED for upright installation and reverse use as claimed in claim 1, characterized in that: The wafer in step (3) is fixed to the bottom of the crystal fixing cavity by using transparent epoxy glue.

7. The method for packaging an LED for upright installation and reverse use as claimed in claim 1, characterized in that: In the step (4), organic silica gel is used to fill the interior of the crystal bonding cavity by dispensing, and the top glue surface of the dispensing is lower than the top surface of the crystal bonding cavity.

8. The method for packaging an LED for upright installation and reverse use as claimed in claim 1, characterized in that: The curing treatment in step (4) is performed at 160° C. for 2 hours.

9. The method for packaging an LED for upright installation and reverse use as claimed in claim 1, characterized in that: The coating thickness of the black ink in the step (5) is not less than 15 μm.

10. A positive-mounted and reverse-used LED packaging structure, characterized in that: The LED is manufactured by the method for packaging an upright and reverse-mounted LED as described in any one of claims 1 to 9, wherein the side of the pin away from the lower portion is fixedly connected to the mounting surface by a fixing glue, and the chip emits light through the transparent lower portion.

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