Chip transfer equipment, chip transfer method and magnetic type die bonding pen

Abstract

The present disclosure provides a chip transfer apparatus, comprising: a transmission chain loop that passes through one or more pick-up positions and one or more placement positions; the driving gear is matched with the transmission chain loop; the transmission chain loop is provided with a plurality of pick-up parts, the pick-up parts are fixed on the transmission chain loop, the driving gear is configured to drive the transmission chain loop to enable the pick-up parts to reach the pick-up positions and the placing positions, and the pick-up parts are configured to pick up chips at the pick-up positions and place the chips at the placing positions. The invention also provides a chip transfer method and a magnetic die bonding pen.

Description

Chip transfer equipment, chip transfer method and magnetic crystal bonding pen Technical Field

[0001] The present disclosure relates to the field of die bonding equipment, and in particular to a chip transfer device, a chip transfer method, and a magnetic die bonding pen. Background Art

[0002] Die bonding is a critical process in the semiconductor and electronics industries. Originally, die bonding referred to the process of attaching wafers to integrated circuits. With the continuous development of the semiconductor and electronics industries, similar processes have also been referred to as "die bonding," broadening the meaning of die bonding. The term "die bonding" is no longer limited to wafer bonding, but has expanded to encompass a variety of small objects, including chips (such as light-emitting chips).

[0003] For example, in the semiconductor integrated circuit (IC) industry, IC die bonders can be used to secure wafers to ICs. Typically, after dicing a circular wafer into an array of wafers, the IC die bonder uses a die bonder head to pick up a wafer from the array. The die bonder head then transfers the wafer to a target position on a target substrate and aligns it. Finally, the wafer is detached from the die bonder head and secured to the target substrate via welding or other methods. The die bonder head typically uses a suction nozzle to pick up and detach the wafer.

[0004] Die bonders of this type must accurately pick up the die from the die bond head and then accurately transfer the head to the target position on the target substrate. Currently, a swing-arm robotic arm is commonly used to accomplish this task. The robotic arm's pivoting motion drives the die bond head between a retrieval (chip pickup) position and a bonding (chip placement) position, transferring the die from the initial substrate to the target substrate.

[0005] There remains a need for improvement in die bonding equipment.

[0006] Overview

[0007] In one aspect, the present disclosure provides a chip transfer device, comprising:

[0008] a drive chain loop passing through one or more pick-up locations and one or more placement locations;

[0009] a drive gear that cooperates with the drive chain loop; and

[0010] A plurality of picking parts, each of which is arranged on the transmission chain loop,

[0011] The driving gear is configured to drive the transmission chain loop so that the picking portion reaches the picking position and the placing position, and the picking portion is configured to pick up a chip at the picking position and place a chip at the placing position.

[0012] Optionally, the transmission chain loop passes through at least one placement position group, and the placement position group includes a plurality of placement positions on a first straight line.

[0013] Optionally, the chip includes a light-emitting chip as a sub-pixel of a display device, and the light-emitting chip includes a first light-emitting chip,

[0014] The chip transfer device is configured to transfer the first light-emitting chips from a first initial substrate to a first target substrate so that the first light-emitting chips are periodically arranged along a first direction on the first target substrate.

[0015] The first straight line extends along the first direction,

[0016] The distance between two adjacent placement positions in the placement position group is equal to an integer multiple of the arrangement period of the first light-emitting chips.

[0017] Optionally, the transmission chain loop passes through at least one pickup position group, and the pickup position group includes a plurality of pickup positions located on a second straight line.

[0018] Optionally, the chip transfer device is configured to transfer the chips from a first initial substrate to a first target substrate, the chips being periodically arranged along a second direction on the first initial substrate.

[0019] The second straight line extends along the second direction,

[0020] The distance between two adjacent picking positions in the picking position group is equal to an integer multiple of the chip arrangement period.

[0021] Optionally, the chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip and a second light-emitting chip, the first light-emitting chip and the second light-emitting chip have different light-emitting colors,

[0022] The chip transfer device is configured to transfer the first light-emitting chip from a first initial substrate to a first target substrate, and transfer the second light-emitting chip from a second initial substrate to the first target substrate.

[0023] The chip transfer device includes a first carrying area and a second carrying area. The chip transfer device carries the first initial substrate in the first carrying area and carries the second initial substrate in the second carrying area.

[0024] A portion of the plurality of pick-up positions is located in the first carrying area, and a portion of the plurality of pick-up positions is located in the second carrying area,

[0025] The chip transfer device includes a target carrying area, the chip transfer device carries the first target substrate in the target carrying area, and the one or more placement positions are located in the target carrying area.

[0026] The transmission chain loop is configured to drive the plurality of picking parts to sequentially pass through the first carrying area, the second carrying area, and the first target carrying area.

[0027] Optionally, the light-emitting chip further includes a third light-emitting chip, and the first light-emitting chip, the second light-emitting chip and the third light-emitting chip have different light-emitting colors.

[0028] The chip transfer device is configured to further transfer the third light-emitting chip from the third initial substrate to the first target substrate,

[0029] The chip transfer device further includes a third carrying area, and the chip transfer device carries the third initial substrate in the third carrying area; a portion of the plurality of pick-up positions is located in the third carrying area,

[0030] The transmission chain loop is configured to drive the plurality of picking parts to sequentially pass through the first carrying area, the second carrying area, the third carrying area and the first target carrying area.

[0031] Optionally, the chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip and a second light-emitting chip, the first light-emitting chip and the second light-emitting chip have the same light-emitting color,

[0032] The chip transfer device is configured to transfer the first light-emitting chip from a first initial substrate to a first target substrate, and transfer the second light-emitting chip from a second initial substrate to the first target substrate.

[0033] The chip transfer device includes a first carrying area and a second carrying area. The chip transfer device carries the first initial substrate in the first carrying area and carries the second initial substrate in the second carrying area.

[0034] A portion of the plurality of pick-up positions is located in the first carrying area, and a portion of the plurality of pick-up positions is located in the second carrying area,

[0035] The chip transfer device includes a target carrying area, the chip transfer device carries the first target substrate in the target carrying area, and the one or more placement positions are located in the first target carrying area.

[0036] The transmission chain loop is configured to drive the plurality of picking parts to sequentially pass through the first carrying area, the second carrying area, and the first target carrying area.

[0037] Optionally, the chip transfer device is configured to transfer the first chip from the fourth initial substrate to the second target substrate, and transfer the second chip from the fifth initial substrate to the third target substrate.

[0038] The chip transfer device includes a fourth carrying area and a fifth carrying area, wherein the chip transfer device carries the fourth initial substrate in the fourth carrying area and the chip transfer device carries the fifth initial substrate in the fifth carrying area.

[0039] The chip transfer device further includes a second target carrying area and a third target carrying area, wherein the chip transfer device carries the second target substrate in the second target carrying area and the chip transfer device carries the third target substrate in the third target carrying area.

[0040] A portion of the plurality of pick-up positions is located in the fourth carrying area, and a portion of the plurality of pick-up positions is located in the fifth carrying area.

[0041] A portion of the plurality of placement positions is located in the second target carrying area, and a portion of the plurality of placement positions is located in the third target carrying area.

[0042] in,

[0043] The transmission chain loop is configured to drive the multiple picking parts to pass through the fourth bearing area, the fifth bearing area, the second target bearing area and the third target bearing area in sequence, or to pass through the fourth bearing area, the second target bearing area, the fifth bearing area and the third target bearing area in sequence.

[0044] Optionally, the chip transfer device includes a first movable carrier, and the first movable carrier is arranged corresponding to the placement position.

[0045] Optionally, the chip transfer device includes a second movable carrier, and the second movable carrier is arranged corresponding to the picking position.

[0046] Optionally, it further comprises a rotatable negative pressure gas cylinder, wherein the rotatable negative pressure gas cylinder has an inner cavity;

[0047] The inner cavity of the rotatable negative pressure gas cylinder is connected to the picking portion through a pipeline and is configured to provide negative pressure to the picking portion;

[0048] The rotatable negative pressure gas cylinder is driven to rotate via the pipeline by the movement of the picking part.

[0049] Optionally, the chip transfer device further includes:

[0050] a fixed cylinder, wherein the inner cavity of the fixed cylinder is in gas communication with the negative pressure trachea, and the fixed cylinder includes a recess formed by an inward extension of the inner wall; and

[0051] Multiple balls;

[0052] in,

[0053] The rotatable negative pressure gas cylinder is sleeved in the fixed cylinder and has a first end away from the negative pressure gas tube and a second end close to the negative pressure gas tube, and the inner cavity of the rotatable negative pressure gas cylinder is connected to the first end and the second end;

[0054] The outer side wall of the rotatable negative pressure cylinder includes a convex portion, and the convex portion fits into the concave portion.

[0055] The inner cavity of the rotatable negative pressure cylinder is slidably engaged with the inner cavity of the fixed cylinder, and the joint is sealed with a sealing ring.

[0056] The rotatable negative pressure cylinder has a plurality of pipeline connection ports located at the first end for connecting with the pipeline.

[0057] The concave portion and the convex portion have opposing grooves forming a first groove structure, and the first groove structure serves as a first sliding track to accommodate the ball to form a ball bearing.

[0058] Optionally, the recess and the protrusion also have relative grooves forming a second groove structure, and the second groove structure serves as a second sliding track to accommodate the balls to form a ball bearing, and the first sliding track and the second sliding track are respectively located on one side of the recess close to the first end and one side close to the second end.

[0059] Optionally, opposite grooves forming a third groove structure are provided on the outer wall of the rotatable negative pressure cylinder and the inner wall of the fixed cylinder, and the third groove structure accommodates a sealing ring surrounding the rotatable negative pressure cylinder.

[0060] Optionally, the sealing ring is further away from the first end than the protrusion.

[0061] Optionally, the pick-up position and the placement position are provided with electromagnetic pick-up positioners.

[0062] in,

[0063] The electromagnetic pickup positioner has a second magnetic component, and

[0064] The pickup portion has a first magnetic component, so that when the first magnetic component is attracted by the second magnetic component, the pickup portion is temporarily fixed to the electromagnetic bonding pen positioner.

[0065] Wherein, at least one of the first magnetic component and the second magnetic component is an electromagnetic component.

[0066] Optionally, the electromagnetic pickup portion locator has a concave bottom and the pickup portion has a convex top, or the electromagnetic pickup portion locator has a convex bottom and the pickup portion has a concave top, so that when the second magnetic component is attracted by the first magnetic component, the outer surface of the top of the pickup portion fits with the inner surface of the bottom of the electromagnetic pickup portion locator. Preferably, both the bottom and the top have a truncated cone structure.

[0067] Optionally, the chip transfer device is a Micro LED chip transfer device or a Mini LED chip transfer device

[0068] Optionally, the driving gear is a stepping gear.

[0069] Optionally, the chip is a wafer or includes a wafer.

[0070] In another aspect, the present disclosure provides a chip transfer method, comprising:

[0071] using a driving gear to drive a transmission chain loop having a plurality of picking parts disposed thereon through one or more picking positions and one or more placing positions so that the picking parts reach the picking positions and the placing positions, and

[0072] A chip is picked up at the pick-up position, and a chip is placed at the placement position.

[0073] Optionally, the transmission chain loop passes through at least one placement position group, the placement position group including a plurality of placement positions on a first straight line,

[0074] Chips are placed at the placement positions in the placement position group at the same time.

[0075] Optionally, the chip includes a light-emitting chip as a sub-pixel of a display device, and the light-emitting chip includes a first light-emitting chip, and the first light-emitting chip has the same light-emitting color.

[0076] The chip transfer method further includes transferring the first light-emitting chips from the first initial substrate to a first target substrate so that the first light-emitting chips are periodically arranged along a first direction on the first target substrate.

[0077] The first straight line extends along the first direction,

[0078] The distance between two adjacent placement positions in the placement position group is equal to an integer multiple of the first light-emitting chip arrangement period.

[0079] Optionally, the transmission chain loop passes through at least one pickup position group, and the pickup position group includes a plurality of pickup positions located on a second straight line.

[0080] Optionally, the chip transfer method further comprises transferring the chips from a first initial substrate to a first target substrate, the chips being periodically arranged along a second direction on the first initial substrate;

[0081] The second straight line extends along the second direction;

[0082] The distance between two adjacent picking positions in the picking position group is equal to an integer multiple of the chip arrangement period.

[0083] Optionally, the chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip and a second light-emitting chip, the first light-emitting chip and the second light-emitting chip have different light-emitting colors,

[0084] The chip transfer method further includes transferring the first light-emitting chip from a first initial substrate to a first target substrate, transferring the second light-emitting chip from a second initial substrate to the first target substrate,

[0085] The first initial substrate is carried in a first carrying area, the second initial substrate is carried in a second carrying area, and the first target substrate is carried in the first target carrying area.

[0086] A portion of the plurality of pick-up positions is located in the first carrying area, a portion of the plurality of pick-up positions is located in the second carrying area, and the one or more placement positions are located in the first target carrying area,

[0087] The chip transfer method further includes using the transmission chain loop to drive the plurality of pick-up parts to sequentially pass through the first carrying area, the second carrying area, and the first target carrying area.

[0088] Optionally, the light-emitting chip further includes a third light-emitting chip, and the first light-emitting chip, the second light-emitting chip and the third light-emitting chip have different light-emitting colors.

[0089] The chip transfer method further includes transferring the third light-emitting chip from the third initial substrate to the first target substrate,

[0090] The third initial substrate is carried in a third carrying area, and a portion of the plurality of pick-up positions is located in the third carrying area.

[0091] The chip transfer method further includes using the transmission chain loop to drive the multiple pick-up parts to pass through the first carrying area, the second carrying area, the third carrying area and the first target carrying area in sequence.

[0092] Optionally, the chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip and a second light-emitting chip, the first light-emitting chip and the second light-emitting chip have the same light-emitting color,

[0093] The chip transfer method further includes transferring the first light-emitting chip from a first initial substrate to a first target substrate, transferring the second light-emitting chip from a second initial substrate to the first target substrate,

[0094] The first initial substrate is carried in a first carrying area, the second initial substrate is carried in a second carrying area, and the first target substrate is carried in the first target carrying area.

[0095] A portion of the plurality of pick-up positions is located in the first carrying area, a portion of the plurality of pick-up positions is located in the second carrying area, and the one or more placement positions are located in the first target carrying area,

[0096] The chip transfer method further includes using the transmission chain loop to drive the plurality of pick-up parts to sequentially pass through the first carrying area, the second carrying area, and the first target carrying area.

[0097] Optionally, the chip transfer method further comprises transferring the first chip from the fourth initial substrate to the second target substrate, transferring the second chip from the fifth initial substrate to the third target substrate,

[0098] The fourth initial substrate is carried in the fourth carrying area, the fifth initial substrate is carried in the fifth carrying area, and the second target substrate is carried in the first target carrying area.

[0099] A portion of the plurality of pick-up positions is located in the fourth carrying area, and a portion of the plurality of pick-up positions is located in the fifth carrying area.

[0100] A portion of the plurality of placement positions is located in the second target carrying area, and a portion of the plurality of placement positions is located in the third target carrying area.

[0101] in,

[0102] The chip transfer method also includes driving the multiple picking parts to pass through the fourth carrying area, the fifth carrying area, the second target carrying area and the third target carrying area in sequence, or, passing through the fourth carrying area, the second target carrying area, the fifth carrying area and the third target carrying area in sequence.

[0103] Optionally, after the picking-up portion reaches the picking-up position, a positioner is used to fix the position of the picking-up portion;

[0104] Using an automated optical inspection machine to align the chip to the position of the pickup portion, and

[0105] Pick up the chip,

[0106] and

[0107] After the picking portion reaches the placement position, a positioner is used to fix the position of the picking portion;

[0108] Using an automated optical inspection machine to align a placement target with the position of the pick-up portion; and

[0109] A chip is placed on the placement target.

[0110] Optionally, picking up the chip includes applying negative pressure to the picking portion to suck the chip, and

[0111] Placing the chip includes bringing the chip into contact with the solder paste and removing the negative pressure.

[0112] Optionally, the drive gear drives the transmission chain loop in steps.

[0113] Optionally, the chip is a wafer or includes a wafer.

[0114] In another aspect, the present disclosure provides a magnetic die-bonding pen, comprising:

[0115] Tubular pen holder,

[0116] a cylindrical pen core in the tubular pen barrel, the cylindrical pen core having a first end, a second end and a side wall extending between the first end and the second end,

[0117] Wherein, the cylindrical pen core comprises:

[0118] a first magnetic component, wherein the first magnetic component is a permanent magnetic component or includes a metal that can be attracted by a magnet;

[0119] The suction nozzle at the first end,

[0120] Pipe connections on the side walls, and

[0121] An air passage extending inside the side wall and communicating with the suction nozzle and the pipeline interface.

[0122] Optionally, the magnetic die-bonding pen further comprises a convex structure or a concave structure at the second end, preferably a truncated cone-shaped convex structure or a concave structure.

[0123] Optionally, the magnetic bonding pen further comprises:

[0124] A return spring forms an axial connection between the tubular pen barrel and the cylindrical pen core.

[0125] Optionally, the side wall of the tubular pen barrel has a groove extending in the axial direction.

[0126] The pipeline interface passes through the groove to the outside of the tubular pen barrel.

[0127] Optionally, a solenoid valve is provided at the pipeline interface outside the tubular pen barrel. BRIEF DESCRIPTION OF THE DRAWINGS

[0128] FIG1 shows a top view of one embodiment of a chip transfer apparatus of the present disclosure.

[0129] FIG. 2 shows a perspective view of the embodiment of FIG. 1 .

[0130] FIG3 exemplarily shows a schematic diagram of a chip array and the corresponding arrangement of locations where the chips are to be placed.

[0131] FIG4 shows a schematic diagram of an embodiment having two sets of pick-up positions and two sets of set-up positions.

[0132] FIG5 is a schematic diagram showing an embodiment of a fixed cylinder and a rotatable negative pressure cylinder that cooperate with each other.

[0133] FIG6 shows a schematic diagram of a magnetic crystal bonding pen and an electromagnetic crystal bonding pen positioner matched therewith.

[0134] FIG7 shows a schematic diagram of the arrangement of an embodiment of the present disclosure.

[0135] FIG8 shows a schematic diagram of the arrangement of another embodiment of the present disclosure.

[0136] FIG9 shows a schematic diagram of the arrangement of another embodiment of the present disclosure.

[0137] FIG10 shows a schematic diagram of the arrangement of another embodiment of the present disclosure. DETAILED DESCRIPTION

[0138] The die bonding equipment in the related art uses a robotic arm to transfer the die bonding head from the die picking position on the initial substrate to the die bonding position on the target substrate. The conventional robotic arm is a swing-type robotic arm, which is a robotic arm with a certain length that rotates around a fixed rotation axis that is usually vertical. The distance between the die picking position and the rotation axis is the same as the distance between the die bonding position and the rotation axis. After the die bonding head picks up the chip at the die picking position, the robotic arm rotates a certain angle around the rotation axis and moves the die bonding head to the die bonding position. After the die bonding head puts down the chip at the die bonding position to complete the die bonding, the robotic arm rotates back to the die picking position, thereby completing a swing, that is, a die picking-die bonding cycle. The platforms supporting the initial substrate and the target substrate are respectively displaced slightly to provide a new chip to the die picking position and prepare a new die bonding point at the die bonding position to start the next die picking-die bonding cycle.

[0139] It should be understood that in this disclosure, unless the context specifically indicates otherwise, terms such as "crystal bonding," "crystal extraction," "crystal bonding position," "crystal extraction position," "crystal extraction-crystal bonding cycle," "crystal bonding pen," and "crystal bonding pen positioner" referring to crystals also apply to chips, such as light-emitting chips. A chip may be or include a wafer.

[0140] The inventors found that although the swinging robotic arm can achieve higher positioning accuracy, the overall speed is low and the crystal bonding efficiency is low, which directly affects the production capacity. Typically, the crystal retrieval position and the crystal bonding position are located at both ends of the diameter of the rotation axis in the rotation plane of the robotic arm. In each crystal retrieval-crystal bonding cycle, it is necessary to make the crystal bonding head perform a reciprocating motion along the circumference between the crystal retrieval position and the crystal bonding position. Since the crystal retrieval position and the crystal bonding position cannot be too close to avoid mutual interference between the initial substrate support platform and the target substrate support platform, the distance traveled by the above-mentioned reciprocating motion is relatively long. This consumes a lot of time and results in low speed. Due to the long distance, in order to reduce the tact time (TT) and process cycle time (Cycle Time), higher acceleration and deceleration can be applied to the robotic arm when starting and stopping the rotation, respectively. However, since the robotic arm is usually heavy, this may lead to poor mechanical stability of the system, which may reduce the accuracy. Another attempt to save time is to set multiple alternating crystal retrieval positions and crystal bonding positions around the rotation axis in the motion plane, so that the angle of each rotation of the robotic arm is less than 180°. However, this approach requires a separate robotic arm for each wafer retrieval and die bonding station, increasing equipment complexity. Furthermore, this approach can lead to congestion at the wafer retrieval and die bonding stations, potentially necessitating an increase in the distance between the die bonding head and the rotation axis. This increased distance largely offsets the increased density of wafer retrieval and die bonding stations, resulting in minimal improvement in overall speed. Furthermore, a longer robotic arm requires a larger circular working area, which also takes up more space.

[0141] The present disclosure can at least partially solve the problem of low overall speed of the swing-arm die bonding equipment.

[0142] In one embodiment, the present disclosure provides a chain die bonding device (specifically, a chip transfer device), comprising:

[0143] A transmission chain loop, the transmission chain loop passing through one or more wafer retrieval positions (also called pick-up positions) and one or more wafer bonding positions (also called placement positions);

[0144] a drive gear (specifically a stepping gear), which cooperates with the transmission chain loop, and

[0145] A plurality of crystal bonding pens (also referred to as pickup parts) are provided on the transmission chain loop.

[0146] Completely different from the swing-arm type die bonding equipment in the related art that uses a rotating robotic arm to transfer the die bonding head, the die bonding equipment disclosed in the present invention is a chain type die bonding equipment that uses a transmission chain to transfer the die bonding pen.

[0147] The chain-type die bonding equipment disclosed herein includes a transmission chain loop, a drive gear, and multiple die bonding pens. The multiple die bonding pens are mounted on the transmission chain loop and move along a path along the transmission chain loop as the transmission chain loop is driven by the drive gear. In particular, when the drive gear is a stepping gear, the die bonding pens move stepwise along the path along the transmission chain loop.

[0148] The transmission chain loop passes through one or more crystal retrieval positions and one or more crystal bonding positions. Therefore, the crystal bonding pen arranged thereon can be transferred between these crystal retrieval and crystal bonding positions to complete crystal retrieval and crystal bonding.

[0149] The movement of multiple die bonding pens along with the transmission chain (particularly the stepping movement) provides multiple benefits, including but not limited to increasing the overall speed of the die bonding equipment, improving the die bonding efficiency, and thus increasing the production capacity.

[0150] Arranging multiple crystal bonding pens on the transmission chain loop can make full use of the space in the working plane. As mentioned above, the transmission chain loop is arranged to pass through one or more crystal removal positions and one or more crystal bonding positions.

[0151] In one embodiment, taking the example of a transmission chain loop passing through a crystal retrieval position and a crystal bonding position, since it is a loop, there are two continuous transmission chain sections between the crystal retrieval position and the crystal bonding position, namely the section from the crystal retrieval position to the crystal bonding position and the section from the crystal bonding position to the crystal retrieval position along the direction of movement of the transmission chain. A plurality of crystal bonding pens are also arranged in these sections outside the crystal retrieval position and the crystal bonding position on the transmission chain loop path. Therefore, when the crystal bonding pen at the crystal retrieval position or the crystal bonding position on the transmission chain loop performs the crystal retrieval action or the crystal bonding action, the other crystal bonding pens on the above transmission chain section can be in a "queue" state. As the gear drives the transmission chain loop forward, the crystal bonding pen that completes the crystal retrieval action or the crystal bonding action leaves the crystal retrieval position or the crystal bonding position, and the crystal bonding pens in the queue state can subsequently reach the crystal retrieval position or the crystal bonding position. Taking the wafer retrieval process as an example, after the die-bonding pen at the wafer retrieval position leaves, this "queueing" mechanism forces the next die-bonding pen to arrive at the wafer retrieval position to move not directly from the die-bonding position to the wafer retrieval position, but rather from the position closest to the wafer retrieval position in the queue of die-bonding pens between the die-bonding position and the wafer retrieval position. Consequently, the required movement distance of the die-bonding pen is significantly reduced, and the time required between two wafer retrieval operations can be correspondingly reduced. When the drive gear is a stepping gear, this time can be minimized to the time it takes for the stepping gear to advance one step, as described below. The same applies to the wafer bonding process. In other words, the die-bonding pen no longer needs to switch between the wafer retrieval position and the wafer bonding position over a long takt time, but can gradually approach the target position over multiple short takt times. During each short takt time, a die-bonding pen can be added to either the wafer retrieval position or the wafer bonding position. Therefore, compared to swing-arm die-bonding equipment that requires the die-bonding head to move directly from the wafer retrieval position to the wafer bonding position during each takt time, the chain-type die-bonding equipment disclosed herein can save significant time and significantly improve overall speed.

[0152] The inventors also discovered that the density of die bonding heads in a swing-arm die bonding system is severely limited by factors such as the circular path, the number of robotic arms, and interference between devices, resulting in a density far lower than that achievable with die bonding pens within a chain drive loop. Therefore, even with a chain drive loop passing through only one die retrieval position and one die bonding position, the disclosed chain die bonding system significantly reduces time compared to swing-arm die bonding systems with only one retrieval position and one die bonding position, and also reduces time compared to previously described swing-arm die bonding systems with multiple alternating retrieval and bonding positions arranged circumferentially around the axis of rotation within the plane of motion.

[0153] Moreover, in the present disclosure, the transmission chain loop can also be set to pass through multiple crystal retrieval positions and / or multiple crystal bonding positions. In the case of the same transmission chain loop circumference, setting multiple crystal retrieval positions and / or multiple crystal bonding positions can further increase the overall speed than setting one crystal retrieval position and one crystal bonding position. In one embodiment, multiple crystal retrieval positions can provide different types of chips, and / or multiple crystal bonding positions can provide different types of target substrates, so that the crystal bonding pen can complete multiple different crystal bonding processes during one cycle along the loop, so as to further utilize space and improve efficiency.

[0154] In addition to increasing the overall speed, the benefits of using a transmission chain loop can also include the flexibility of setting the loop shape. Therefore, the movement route of the crystal bonding pen can be arbitrary, and does not have to be circular. Moreover, in the case of the same circumference, the area occupied by the transmission chain loop can be relatively small compared to the circle that occupies the most area. In addition, the supporting platforms for the target substrate and the initial substrate (also called the first and second movable carriers) can also be arranged at any suitable position on the transmission chain loop, rather than having to be arranged at the same distance from the rotation axis, and thus improve the flexibility of the equipment layout.

[0155] In addition, since the distance required to move the die bonding pen each time is greatly shortened and no heavy robotic arm is used, it is very beneficial to the mechanical stability of the system.

[0156] The chain is also characterized by being composed of a plurality of substantially rigid segments connected by hinges. Therefore, compared with a transmission structure such as a belt that achieves flexibility through elastic deformation, it provides much more accurate positioning for the die-bonding pen disposed thereon.

[0157] The present disclosure has no particular limitation on the specific type and size of the transmission chain.

[0158] The chain-type crystal bonding equipment disclosed in the present invention includes a driving gear that cooperates with a transmission chain loop. The cooperation between the transmission chain and the gear is well known in the mechanical field. Typically, the transmission chain can be meshed with a sprocket. The present invention preferably uses a stepping gear, which can advance the same angle each time it rotates, and drives the transmission chain that cooperates with it to advance the same distance each time, or one step forward. Correspondingly, the crystal bonding pen set on the transmission chain also advances one step along the transmission chain loop, thereby achieving stepping along the loop. Compared with other mechanical drive devices such as motor-driven non-stepping transmission (such as belt transmission), the position reached by the crystal bonding pen each time it advances is fixed. Therefore, as long as the crystal retrieval position and the crystal bonding position are set at some of these fixed positions, the crystal bonding pen can be directly located at the crystal retrieval position and the crystal bonding position, achieving high-efficiency positioning, and simple control.

[0159] The stepper gear provides the driving force for the movement of the transmission chain. There can be one or more stepper gears, and they can be positioned within the transmission chain loop. To maintain proper chain tension, one or more tensioning gears can also be provided, engaging with the transmission chain and passively rotating. It will be appreciated that various stepper gear and tensioning gear configurations can be used to provide a stable transmission chain loop, as long as they do not violate the spirit of this disclosure.

[0160] The die bonding pen is sometimes also referred to as a die bonding head, or more generally as a pickup part. Typically, it has a pen body set to the chain transmission loop and a pen head for picking up the chip. In one embodiment, the pen body can be perpendicular to the horizontal transmission chain loop plane, and thus the pen head can be located directly below the transmission chain loop. In another embodiment, the pen body can be set to form a certain angle with the transmission chain plane, and thus the trajectory of the pen head forms a similar shape to the transmission chain loop. There are no special restrictions on the size and shape of the pen head and the pen body, as long as they can achieve smooth and stable crystal removal / bonding action when set on the transmission chain.

[0161] In one embodiment, the stepping gear is configured so that each step causes at least one of the die-bonding pens to reach the crystal retrieval position or the die-bonding position. Specifically, the stepping gear and transmission chain can be appropriately configured so that each step of a die-bonding pen brings it to the position of the previous die-bonding pen. This allows the next die-bonding pen to be positioned immediately after the previous one has left. For example, in one embodiment, a die-bonding pen can be positioned at each node of the transmission chain, and each step advances the pen by the distance of one chain link. Thus, with each step of the stepping gear, all die-bonding pens advance one step along the transmission chain loop, reaching the position of the previous one.

[0162] Figure 1 shows a top view of an embodiment of the chain-type crystal bonding equipment disclosed in the present invention. Figure 2 shows a perspective view of the embodiment of Figure 1. In which, the transmission chain loop 3 is arranged in a horizontal plane, and a vertically arranged crystal bonding pen 6 is provided at each pin shaft (node) thereof. Two stepping gears 10 are arranged inside the transmission chain loop 3 and cooperate with it. A tensioning gear 4 is provided outside the transmission chain loop 3 to keep the transmission chain loop 3 tense. In this way, when the stepping gear 10 rotates step by step, the transmission chain loop 3 is driven to move forward step by step, driving the crystal bonding pen 6 to move forward accordingly. In one embodiment, every time the stepping gear 10 rotates one step, the transmission chain loop 3 moves forward a distance of one chain link, and the crystal bonding pen 6 reaches the position where its adjacent previous crystal bonding pen is located.

[0163] In Figures 1 and 2, the initial substrate 7 on which the chip matrix is ​​arranged is located on the right, and the target substrate 5 on which the chip position to be fixed is located on the left. Within the range of the initial substrate 7 and the target substrate 5, there are respectively a crystal retrieval position and a crystal solidification position (each located vertically below the crystal solidification pen positioner 2). The crystal solidification pen 6 that reaches these two positions can perform crystal retrieval and crystal solidification actions respectively. Subsequently, the stepping gear 10 rotates clockwise one step. The crystal solidification pen 6 that has completed the crystal retrieval action and carries the chip 8 leaves the crystal retrieval position and begins to move toward the crystal solidification position along the lower half of the transmission chain loop in Figure 1. The crystal solidification pen 6 that has completed the crystal solidification action and is idle leaves the crystal solidification position and begins to move toward the crystal retrieval position along the upper half of the transmission chain loop in Figure 1. At the same time, the next idle crystal solidification pen 6 in the queue arrives at the crystal retrieval position, and the next crystal solidification pen 6 in the queue with the chip 8 arrives at the crystal solidification position. The figure also shows a rotatable negative pressure gas cylinder 1, which has a plurality of radially extending pipeline connection ports 9 for communicating with the pipeline interfaces of each crystal bonding pen 6 through pipelines (such as flexible pipelines, not shown).

[0164] Since the chip corresponding to the crystal retrieval position on the initial substrate has been removed, and a chip is already fixed at the corresponding die bonding position on the target substrate, the platform supporting the initial substrate 7 and the target substrate 5 also translates to provide a new chip and an unbonded target substrate to the crystal retrieval position and the die bonding position, respectively. Support platforms with such functions are known in the related art. For example, an automated optical inspection (AOI) machine can be used to assist in positioning the support platform at the crystal retrieval and die bonding positions.

[0165] Through the steps described above, the chain die bonder of the present disclosure picks up chips from an initial substrate, gradually transports them along a drive chain loop to a target substrate, and secures them to the target substrate. Compared to swing-arm die bonders, this significantly reduces cycle time and process cycle time, significantly increasing overall die bond speed, efficiency, and production capacity.

[0166] The chip and the corresponding initial and target substrates can be objects already involved in die bonding related technologies, such as LED chips, discrete devices, wafers, etc. Die removal and die bonding can be performed using conventional methods in related technologies. For example, die removal can be performed using a suction nozzle, and die bonding can be performed by soldering. The solder used for soldering can be tin. For example, solder paste can be applied to the target substrate at the points where the die is to be bonded, and then the chip can be placed thereon to perform die bonding.

[0167] The number and location of the die-bonding pens installed on the transmission chain loop can be adjusted appropriately. As shown in Figures 1 and 2, a die-bonding pen can be installed at each node of the transmission chain. However, it is also possible to install die-bonding pens only at selected nodes. The die-bonding pens can also be installed at locations outside of the nodes, as long as they are located relative to the transmission chain loop and can be moved to a fixed position as the transmission chain advances.

[0168] The shape of the transmission chain loop can be appropriately set according to specific needs and can be adjusted by adding more stepping gears or tensioning gears. As shown in Figures 1 and 2, the transmission chain loop 3 can have either outwardly protruding sections or inwardly recessed sections. The tensioning gear 4 ensures that the transmission chain loop 3 maintains an appropriate degree of tension.

[0169] The relative relationship between the stepping amplitude of the stepping gear and the stepping amplitude of the transmission chain can be appropriately adjusted so that the crystal bonding pen is in place after an appropriate number of steps. As mentioned above, it is preferred that the stepping gear can put a crystal bonding pen in place with each step, but it can also put a crystal bonding pen in place after multiple steps.

[0170] In order to further improve the accuracy of the crystal bonding pen in position, in one embodiment, the crystal retrieval position and the crystal bonding position are provided with a crystal bonding pen positioner. Figures 1 and 2 show the crystal bonding pen positioner 2 located at the crystal retrieval position and the crystal bonding position.

[0171] The crystal bonding pen positioner is used to position the crystal bonding pen more accurately. Since the transmission chain may have a slight slack, the spatial position of the crystal bonding pen can be further limited for more precise positioning. The crystal bonding pen positioner is set at the crystal retrieval position and the crystal bonding position independently of the transmission chain, and can impose removable spatial restrictions on the crystal bonding pen moved to this position, so that the crystal bonding pen can perform crystal retrieval and crystal bonding actions at the required precise horizontal and vertical coordinates, and be released from the crystal bonding pen positioner after the action is completed. In one embodiment, the crystal bonding pen positioner can only move vertically, so that the crystal bonding pen temporarily fixed thereon can be pressed down and lifted in the vertical direction, but the position is fixed in the horizontal direction.

[0172] In one embodiment, AOI is also used for auxiliary positioning. Various AOIs can be used to perform precise alignment at the crystal retrieval position or the crystal solidification position after the platform supporting the initial substrate or the target substrate is moved. Any suitable AOI in the relevant technology can be used. Preferably, the AOI auxiliary positioning of the supporting platform is used in conjunction with the positioning of the crystal solidification pen positioner, so that the crystal solidification pen is aligned with the desired position on the initial substrate or the target substrate with higher precision, thereby achieving extremely high-precision crystal retrieval and crystal solidification. This process can be called position correction. That is, the initial substrate or the target substrate is moved to the crystal retrieval and crystal solidification position more accurately by the AOI.

[0173] Because the present invention utilizes a free-form transmission chain loop design, the chain-type die bonder offers significant flexibility in the design of the die pick-up and die bonding positions, compared to swing-arm die bonders, which can only be positioned along the arc of the robotic arm. The transmission chain loop shape can be predetermined, and the platforms supporting the initial and target substrates can be configured to match this shape.

[0174] In addition, the crystal retrieval and crystal bonding operations of the present invention can be completed simultaneously. Compared with the swing arm crystal bonding equipment that usually requires alternating crystal retrieval and crystal bonding, the chain crystal bonding equipment of the present invention can further save time and improve efficiency.

[0175] In one embodiment, the transmission chain loop passes through a die-bonding position group, the die-bonding position group is in a straight line, and the distance between two adjacent die-bonding positions in the die-bonding position group is the distance between adjacent die-bonding pens.

[0176] In the present disclosure, a "set" of die pick-up positions or die bonding positions refers to a plurality of positions for the same initial substrate or target substrate.

[0177] In this embodiment, the chain die bonding equipment disclosed herein can pick up a die from any pick-up position and simultaneously bond a group of die bonding positions on a target substrate. This embodiment can quickly bond multiple identical or different chips in groups to a target substrate.

[0178] For example, on a display substrate, sub-pixels of the same color are arranged periodically in the sub-pixels. Therefore, it may be desirable to periodically fix multiple light-emitting chips of the same monochrome sub-pixel to the target substrate at one time. In this case, a group of continuous die-bonding heads can obtain the same-color sub-pixels and simultaneously fix these same-color sub-pixels to a straight line (also referred to as the first straight line) on the target substrate at one time. The spacing between the formed same-color sub-pixels, that is, the spacing between adjacent die-bonding heads, is an integer multiple of the spacing between the sub-pixels of the same color in adjacent pixel units in the display device. By fixing the light-emitting chips of the same color in batches according to different colors, a display substrate can be formed efficiently.

[0179] For another example, when you want to fix R / G / B LEDs to a target substrate to form RGB pixels, you can consider using the following method to perform crystal extraction and crystal bonding. The transmission chain loop passes through the initial substrates that provide red, green, and blue LEDs in sequence. As the transmission chain advances, three adjacent vacant crystal bonding heads on the transmission chain loop first pass through the initial substrate that provides red LEDs, and one of the crystal bonding heads obtains a red LED at the crystal extraction position of the initial substrate. Subsequently, when passing through the initial substrate that provides green LEDs, one of the remaining two vacant crystal bonding heads obtains a green LED at the crystal extraction position of the initial substrate. Finally, when passing through the initial substrate that provides blue LEDs, the remaining vacant crystal bonding head obtains a blue LED at the crystal extraction position of the initial substrate. In this way, three adjacent crystal bonding heads that each obtains red, green, and blue LEDs are obtained. When the three die-bonding heads reach a set of straight-line die-bonding positions above the target substrate, the distance between adjacent die-bonding positions is the same as the distance between adjacent die-bonding pens. Therefore, the red, green, and blue LEDs can be simultaneously bonded to the target substrate, significantly saving time compared to bonding individual LED colors separately. This approach of rapidly bonding multiple different chips to the target substrate in groups further improves overall speed, and group bonding also increases the relative precision between the bonded chips.

[0180] The chain-type die bonder of the present disclosure is uniquely capable of simultaneously securing multiple chips in groups at adjacent die bonding positions in a straight line. This is because the shape of the drive chain loop can be arbitrarily designed and can form straight sections. In contrast, swing-arm die bonders cannot simultaneously secure multiple chips in a straight line due to the circular path of the die bonding head.

[0181] In another embodiment, the transmission chain loop passes through a crystal picking position group, the crystal picking position group is on a straight line (which can be called a second straight line), and the distance between two adjacent crystal picking positions in the crystal picking position group is the distance between adjacent crystal bonding pens.

[0182] In this embodiment, the chain-type crystal bonding equipment disclosed in the present invention can pick up and bond crystals in groups. By setting the transmission chain loop to have a straight section at an initial substrate, multiple chips can be picked up simultaneously in groups at adjacent crystal retrieval positions on a straight line, thereby further saving time and improving the overall speed. This is particularly advantageous in the case of large-scale transfer of fixed chips from matrix to matrix. Taking into account that the spacing of the crystal bonding heads on the transmission chain is larger than the arrangement spacing of the LEDs on the initial substrate, the spacing of the LEDs on the initial substrate can be arranged as an integer multiple of the spacing between two adjacent crystal bonding heads, thereby facilitating crystal retrieval. Correspondingly, the spacing of the points to be bonded on the target substrate can also be set to an integer multiple of the spacing between two adjacent crystal bonding heads. Figure 3 exemplarily shows a schematic diagram of the corresponding arrangement of a chip and a point to be bonded. Among them, the right-hand figure shows a circular initial substrate 31 and chips arranged in a rectangular array on the initial substrate 31, and the left-hand figure shows a rectangular target substrate 32 and the points to be bonded arranged in a rectangular matrix on the target substrate 32. The chips 311, 312, 313, and 314 represented in white represent chips corresponding to a group of crystallization positions. The spacing between the crystallization positions is set to the spacing between the chips in the chip array on the initial substrate, so that the spacing between the crystallization positions is four times the spacing between the chips. In this way, by moving the initial substrate, the chips 311-314 can be aligned with a group of four crystallization positions. The spacing of the crystallization heads is also set to the spacing of the crystallization positions, so that the four crystallization heads can be aligned with these crystallization positions at the same time to remove these chips at one time. Correspondingly, the spacing of the sites to be crystallized on the target substrate is also set to the same spacing as the crystallization positions to facilitate crystallization. For example, the chips 311-314 can each be fixed to the sites to be crystallized 321, 322, 323, and 324 represented in white at the same time. It should be noted that the figure is only an exemplary partial view.

[0183] In one embodiment, the transmission chain loop passes through a plurality of the wafer retrieval position groups and a plurality of the wafer bonding position groups. The combination of wafer retrieval positions and wafer bonding positions can be flexibly set to achieve wafer retrieval from multiple initial substrates and wafer bonding to multiple target substrates.

[0184] As an example, FIG4 shows a schematic diagram of an embodiment having two groups of crystal retrieval positions and two groups of crystal bonding positions. By providing four stepping gears, a transmission chain loop having four straight sides and a substantially rectangular shape is formed. Two initial substrates 4a and 4b and two target substrates 4c and 4d are alternately arranged on the four straight sides, correspondingly forming two groups of crystal retrieval positions (4a1, 4a2, 4a3, 4a4, 4a5) and (4b1, 4b2, 4b3, 4b4, 4b5) and two groups of crystal bonding positions (4c1, 4c2, 4c3, 4c4, 4c5) and (4d1, 4d2, 4d3, 4d4, 4d5), wherein the crystal retrieval positions and crystal bonding positions of the same group are in a straight line. In this way, two target substrates can be processed simultaneously using the same transmission chain loop, increasing crystal bonding efficiency and output.

[0185] Due to the flexibility of the shape of the transmission chain loop, the chain die bonding equipment disclosed herein can be configured to appropriately arrange the initial substrate and the target substrate as needed, thereby substantially improving the overall speed and production efficiency.

[0186] In one embodiment, the chain die bonding apparatus further includes a rotatable negative pressure gas cylinder having an inner cavity in pneumatic communication with each die bonding pen via a pipeline. The rotatable negative pressure gas cylinder can be supported on a support surface via an annular ball bearing and driven to rotate on the support surface via the flexible air tube by the movement of the die bonding pen. The pipeline can be, for example, a flexible air tube or a partially flexible air tube.

[0187] In a swing-arm die bonding device, the die bonding head will move at a relatively high speed along a circular path with a fixed radius around the axis. Therefore, the die bonding head is usually connected to a negative pressure air pipe arranged near the rotating shaft through a fixed air path that extends along the robotic arm and moves together with the robotic arm. In contrast, when the chain-type die bonding device of the present disclosure is in operation, the positions of the multiple die bonding pens therein move along the transmission chain loop, which is usually not circular and therefore does not have an axis at the center of the circle. In addition, the chain-type die bonding device of the present disclosure does not have a robotic arm of a fixed length. Therefore, a fixed air path that extends through the robotic arm and moves together with the robotic arm is generally not suitable for the chain-type die bonding device of the present disclosure.

[0188] In one embodiment, for a chain transmission method, by using a rotatable negative pressure air cylinder, negative pressure can be easily provided to multiple crystal bonding pens whose positions are constantly changing along the transmission chain loop. The rotatable negative pressure air cylinder is supported on a supporting surface by an annular ball bearing and can rotate on the supporting surface. The supporting surface is used to support the annular ball bearing. In order to allow the rotatable negative pressure air cylinder to rotate, necessary constraints are imposed on the annular ball bearing in the planar direction along the supporting surface. In one embodiment, the supporting surface is basically a horizontal plane, ideally completely in a horizontal plane. In this case, the rotatable negative pressure air cylinder supported thereon can rotate around a vertical rotation axis, and the annular ball bearing can be the main force-bearing position supporting the deadweight of the rotatable negative pressure air cylinder.

[0189] The rotatable negative pressure gas cylinder is used to provide negative pressure to each crystal bonding pen so that the crystal bonding pen can pick up the chip using negative pressure. The rotatable negative pressure gas cylinder has an inner cavity, which is in gaseous communication with a negative pressure air pipe that is further connected to a negative pressure source, and is in gaseous communication with each crystal bonding pen via a flexible air pipe. In this way, the negative pressure from the negative pressure air pipe can be applied to the crystal bonding pen via the inner cavity of the rotatable negative pressure gas cylinder and the flexible air pipe. Due to the use of the flexible air pipe, the distance between the crystal bonding pen and the rotatable negative pressure gas cylinder is variable. In one embodiment, the length of the flexible air pipe is not less than the farthest distance between the rotatable negative pressure gas cylinder and the transmission chain loop. In this way, it can be ensured that the rotatable negative pressure gas cylinder can achieve negative pressure supply to the crystal bonding pen located at any position on the transmission chain loop.

[0190] The rotatable negative pressure air cylinder used in the present disclosure is characterized in that it can be passively rotated following the movement of the crystal bonding pen. That is, the rotatable negative pressure air cylinder can be rotated on the support surface without using a special drive device. Instead, the movement of the crystal bonding pen drives the rotation of the rotatable negative pressure air cylinder via the flexible air tube. Specifically, when the crystal bonding pen advances step by step along the chain transmission circuit, the connection point of the flexible air tube connected to it on the rotatable negative pressure air cylinder can temporarily not move. This is because the flexible air tube is flexible and can have a length longer than the distance between the crystal bonding pen and the connection point. When the crystal bonding pen continues to advance, the distance between the crystal bonding pen and the above-mentioned connection point may become longer, so that the flexible air tube may gradually straighten. If the flexible air tube straightens to the extent that the connection point is subjected to force, it will apply force to the rotatable negative pressure air cylinder. Due to the presence of the annular ball bearing, the horizontal tensile component of this force, even if very small, will cause the rotatable negative pressure air cylinder to rotate. As the negative pressure cylinder rotates, the connection point moves closer to the advancing die-bonding pen, shortening the distance between them. This relaxes the flexible air tube, freeing the force on the connection point and allowing the rotatable negative pressure cylinder to stop rotating. This process repeats, allowing the rotatable negative pressure cylinder to rotate in sync with the movement of the die-bonding pen, ensuring a secure connection between the flexible air tube and the rotatable negative pressure cylinder and delivering adequate negative pressure to the pen. It should be understood that the rotation of the rotatable negative pressure cylinder is the result of the combined movement of the entire die-bonding pen and the flexible air tube.

[0191] The passively rotating rotatable negative pressure air cylinder brings many advantages to the chain-type crystal bonding equipment disclosed herein. Since the negative pressure air tube is connected to the crystal bonding pen through the flexible air tube via the rotatable negative pressure air cylinder, the distance between the crystal bonding pen and the negative pressure air tube for providing negative pressure can be flexible. Since it is a passive rotation, it can adapt to the various positions of each crystal bonding pen without precise adjustment. In addition, there is no need to set up an active drive device for the rotation of the negative pressure air cylinder, which reduces equipment investment. Moreover, due to the use of ball bearings, the required driving force is very small, so the surplus power can be fully utilized, and the stepping gear and transmission chain loop do not need to provide additional energy to the crystal bonding pen and the flexible air tube.

[0192] In a more specific embodiment, the chain die bonding equipment further comprises:

[0193] a fixed cylinder, wherein the inner cavity of the fixed cylinder is in gas communication with the negative pressure trachea, the inner wall of the fixed cylinder having an inward flange serving as the support surface, and the center of the flange having a through hole;

[0194] Among them, the rotatable negative pressure air cylinder is a suspended negative pressure air cylinder passing through the through hole, the annular ball bearing is on the outer wall of the suspended negative pressure air cylinder and suspended on the flange, the inner cavity of the suspended negative pressure air cylinder is slidably engaged with the inner cavity of the fixed cylinder and sealed at the joint, and the side wall of the suspended negative pressure air cylinder has multiple flexible air tube connection ports.

[0195] By using the fixed cylinder in conjunction with the rotatable negative pressure cylinder, the rotation of the rotatable negative pressure cylinder and the supply of negative pressure to the crystal bonding pen can be conveniently achieved.

[0196] The fixed cylinder has two main functions: one is to connect the negative pressure air pipe, and the other is to provide a support surface and horizontal constraint for the rotatable negative pressure air cylinder.

[0197] The distal end of the relatively thick negative pressure tube, which supplies negative pressure to the entire system, is typically connected to an external negative pressure source at a fixed location. Therefore, ideally, the proximal end of the negative pressure tube is connected to a fixed location, and more ideally, a non-flexible negative pressure tube is used to ensure negative pressure delivery. Therefore, a fixed cylinder can be provided as a transition between the rotatable negative pressure cylinder and the negative pressure tube, rather than directly connecting the negative pressure tube to the rotating rotatable negative pressure cylinder.

[0198] The fixed cylinder also provides a support surface and horizontal constraint for the rotatable negative pressure air cylinder via a flange on its inner wall and a through hole therein. Accordingly, an annular ball bearing is on the outer wall of the rotatable negative pressure air cylinder. In this way, the rotatable negative pressure air cylinder can be "suspended" in the fixed cylinder by placing the annular ball bearing on the flange and inserting the rotatable negative pressure air cylinder through the through hole. In such a case, the rotatable negative pressure air cylinder can be referred to as a suspended negative pressure air cylinder. The suspended negative pressure air cylinder is suspended in the fixed cylinder and can rotate on the flange in the through hole.

[0199] The inner cavity of the suspended negative pressure air cylinder is slidably engaged with the inner cavity of the fixed cylinder and sealed at the joint. That is, the inner cavity of the suspended negative pressure air cylinder and the inner cavity of the fixed cylinder are joined to form a space that is airtight to the outside, but relative rotational displacement can occur between the inner cavity of the suspended negative pressure air cylinder and the inner cavity of the fixed cylinder. This can be achieved, for example, by providing a sealing ring at an appropriate position outside the joint. Through such a joint, the suspended negative pressure air cylinder can obtain negative pressure through the inner cavity of the fixed cylinder, and the negative pressure will not leak. At the same time, the suspended negative pressure air cylinder can rotate relative to the non-rotating fixed cylinder by, for example, sliding.

[0200] Figure 5 shows a schematic diagram of an embodiment of a fixed cylinder and a rotatable negative pressure cylinder 4. The inner cavity of the fixed cylinder 52 is connected to the negative pressure air tube 51. The rotatable negative pressure cylinder 54 is sleeved within the fixed cylinder 52. The rotatable negative pressure cylinder 54 includes a first end and a second end that are interconnected, with the second end being closer to the negative pressure air tube 51 than the first end. In other words, the rotatable negative pressure cylinder has a first end distal to the negative pressure air tube and a second end proximal to the negative pressure air tube, both of which are connected by the inner cavity of the rotatable negative pressure cylinder. The outer wall of the rotatable negative pressure cylinder 54 includes a convex portion, and the fixed cylinder 52 includes a concave portion formed by an inward extension of the inner wall. The convex portion fits into the concave portion, allowing the inner cavity of the rotatable negative pressure cylinder 54 to slide into engagement with the inner cavity of the fixed cylinder 52. The joint is sealed with a sealing ring 53. The rotatable negative pressure cylinder 54 has multiple pipeline connection ports 56 for connecting to the pipeline. Specifically, the multiple pipeline connection ports 56 are located at the first end. When the tube connected to the tube connection port 56 moves with the die bonding pen, it can drive the rotatable negative pressure cylinder 54 to passively rotate within the fixed cylinder 52. During this process, the negative pressure air pipe 51 can continuously apply negative pressure to the tube connection port 56, allowing the die bonding pen to absorb the chip. Specifically, the rotatable negative pressure cylinder 54 can be a hanging type negative pressure cylinder.

[0201] For example, an annular ball bearing 55 is provided between the rotatable negative-pressure cylinder 54 and the fixed cylinder 52. The annular ball bearing 55 includes multiple balls, which are arranged around the rotatable negative-pressure cylinder 54. For example, the convex portion and the concave portion are each provided with a first groove structure. The first groove structures on the convex and concave portions are arranged opposite each other, forming a first sliding track for the annular ball bearing 55. That is, the concave and convex portions have opposing grooves forming the first groove structure. The first groove structure serves as a first sliding track to accommodate the balls, forming the ball bearing. For example, there may be multiple annular ball bearings 55. Preferably, the convex and concave portions are each provided with a second groove structure. The second groove structures on the convex and concave portions are arranged opposite each other, forming a second sliding track for another annular ball bearing 55. That is, the concave and convex portions also have opposing grooves forming a second groove structure. The second groove structure serves as a second sliding track to accommodate the balls, forming the ball bearing. Referring to Figure 5, the first sliding track and the second sliding track are located on opposite sides of a recess formed by the inner wall of the fixed cylinder 52 extending inward. Specifically, the first sliding track and the second sliding track are respectively located on one side of the recessed portion close to the first end and one side close to the second end, so that the rotatable negative pressure cylinder 54 and the fixed cylinder 52 can cooperate and slide better.

[0202] For example, the sealing ring 53 is arranged around the rotatable negative pressure air cylinder 54. For example, a third groove structure is respectively provided on the outer wall of the rotatable negative pressure air cylinder 4 and the inner wall of the fixed cylinder 52. Specifically, the outer wall of the rotatable negative pressure air cylinder 54 and the inner wall of the fixed cylinder 52 have opposing grooves forming the third groove structure; the third groove structure is arranged around the rotation axis of the rotatable negative pressure air cylinder 54. The sealing ring 53 is located in the third groove structure. That is, the third groove structure accommodates the sealing ring surrounding the rotatable negative pressure air cylinder. Preferably, the sealing ring 53 fills the third groove structure on the outer wall of the rotatable negative pressure air cylinder 54 and the inner wall of the fixed cylinder 52, so that the sealing effect is better.

[0203] For example, the sealing ring 53 is disposed near the second end.

[0204] For example, the sealing ring 53 is located on a side of the protrusion away from the pipeline connection port 56. That is, the sealing ring 53 is farther away from the first end than the protrusion.

[0205] For example, the rotatable negative pressure cylinder 54 can be a suspended negative pressure cylinder, in which the negative pressure air pipe 51, the fixed cylinder 52, and the suspended negative pressure air cylinder are sequentially arranged in a direction gradually approaching the ground, so that the suspended negative pressure air cylinder is suspended on the fixed cylinder 52. Specifically, the negative pressure air pipe 51, the sealing ring 53, the protrusion, and the pipe connection port 56 are sequentially arranged in a direction gradually approaching the ground, so that the suspended negative pressure air cylinder rotates passively.

[0206] For example, the plurality of pipe connection ports 56 are arranged around the rotation axis of the rotatable negative pressure cylinder 54, so that the pipe can effectively drive the rotatable negative pressure cylinder 54 to rotate. For example, the distribution plane of the plurality of pipe connection ports 56 is perpendicular to the rotation axis of the rotatable negative pressure cylinder 54, and the plurality of pipe connection ports 56 can be evenly arranged along the circumference.

[0207] It should be understood that the combination of the fixed cylinder and the suspended negative pressure cylinder is only an exemplary embodiment of the rotatable negative pressure cylinder. Components of other specific shapes and structures can be used to implement the aforementioned rotatable negative pressure cylinder.

[0208] In one embodiment, the chain die bonding equipment of the present disclosure further includes an electromagnetic die bonding pen positioner, wherein:

[0209] The electromagnetic crystal bonding pen positioner has an electromagnetic attraction component, and

[0210] The crystal bonding pen has a permanent magnetic component, so that when the permanent magnetic component is attracted by the electromagnetic attraction component, the crystal bonding pen is temporarily fixed to the electromagnetic crystal bonding pen positioner.

[0211] High positioning accuracy can be problematic when using a chain drive to transport the die bonder. Compared to a robotic arm, the chain drive can have slightly lower positional stability. Therefore, while it's possible to place the die bonder directly at the die retrieval and die bonding positions within the chain drive, it's preferable to further secure the die bonder's position before performing these operations.

[0212] As described above, in one embodiment, a fixed position die-bonding pen positioner can be used to position the die-bonding pen to provide more precise positioning than that provided by a transmission chain. In a preferred embodiment of the present disclosure, the die-bonding pen positioner is an electromagnetic die-bonding pen positioner that uses electromagnetic interaction to achieve positioning.

[0213] In one embodiment, the chain die bonding equipment of the present disclosure further includes an electromagnetic die bonding pen positioner, wherein:

[0214] The electromagnetic crystal bonding pen positioner has an electromagnetic attraction component, and the crystal bonding pen includes a permanent magnetic component or a metal that can be attracted by a magnet (such as iron, cobalt, nickel), so that when the permanent magnetic component is attracted by the electromagnetic attraction component, the crystal bonding pen is temporarily fixed to the electromagnetic crystal bonding pen positioner.

[0215] The advantages of this electromagnetic crystal bonding pen positioner are speed, ease of control, and low cost. By setting an electromagnetic attraction component in the positioner, which cooperates with the permanent magnetic component in the crystal bonding pen or metal that can be attracted by magnets, the crystal bonding pen can be quickly fixed and released.

[0216] In this way, when the crystal fixing pen is transferred to the crystal retrieval position or the crystal fixing position along the transmission chain, power is supplied to the electromagnetic attraction component to attract and fix the crystal fixing pen to the precise crystal retrieval position or the crystal fixing position. It should be understood that the displacement required for the crystal fixing pen to achieve precise positioning is very small and its overall position is still provided by the transmission chain. In one embodiment, as described below, the crystal fixing pen can be composed of a fixed part and a movable part. The fixed part can be, for example, a tubular pen barrel, and the movable part can be, for example, a cylindrical pen core. The tubular pen barrel is fixed relative to the transmission chain loop position, and the cylindrical pen core with a suction nozzle can undergo slight displacement in the horizontal and vertical directions relative to the tubular pen barrel. In this way, while the crystal fixing pen is basically positioned by the transmission chain, further precise fine-tuning of the suction nozzle position can be achieved.

[0217] In a preferred embodiment, the electromagnetic die-bonding pen positioner has a concave bottom, and the die-bonding pen has a convex top, so that when the die-bonding pen is attracted by the electromagnetic attraction component, the outer surface of the convex top is aligned with the inner surface of the concave bottom. For example, preferably, both the concave bottom and the convex top have a truncated cone structure.

[0218] In a preferred embodiment, the electromagnetic die-bonding pen positioner has a convex bottom, and the die-bonding pen has a concave top, so that when the die-bonding pen is attracted by the electromagnetic attraction component, the outer surface of the convex bottom mates with the inner surface of the concave top. For example, preferably, both the concave top and the convex bottom have a truncated cone structure.

[0219] When the crystal bonding pen moves to the bottom of this concave-convex magnetic attraction mechanism (electromagnetic crystal bonding pen positioner), the magnetic attraction system starts and attracts the convex structure to the inside of the concave structure. The fit between the convex structure and the concave structure can effectively utilize the electromagnetic suction force to smoothly guide the crystal bonding pen to the positioning position, and can easily make the crystal bonding pen exit the positioner after the electromagnetic suction force disappears. Moreover, the fit between the convex and concave surfaces, especially the fit between the frustum-shaped convex and concave surfaces, can achieve extremely high precision. The inventors found that the use of this electromagnetic crystal bonding pen positioner in the chain crystal bonding equipment disclosed in the present invention further ensures the accuracy of crystal bonding, improves the yield rate, and the positioning process is quick and easy to control.

[0220] Typically, the negative pressure applied to the die bond pen is constant, for example, by a rotatable negative pressure cylinder. Therefore, in order to pick up the chip during wafer removal and place it down during die bonding, the negative pressure at the die bond pen's nozzle (i.e., the pen tip) needs to be controlled.

[0221] In one embodiment, the die bonding pen has a suction nozzle and an air extraction port. The suction nozzle and the air extraction port are connected to each other through a channel within the die bonding pen to form an airway. The airway has a controllable switch. The controllable switch can be controlled by any suitable means, preferably wirelessly, because the die bonding pen continuously changes position along the transmission chain loop.

[0222] In a preferred embodiment, the chip is a Mini LED or Micro LED chip for direct display. As Mini LED and Micro LEDs advance toward high definition and high resolution, the number of LED chips and ICs required to be fixed on a single display during the production process has increased exponentially. This has led to an exponential increase in processing time for single-chip displays and exponentially increased requirements for die bonding precision. Currently, the primary limiting factor in Mini LED and Micro LED production capacity and yield lies in the die bonding equipment used. Traditional die bonding methods in the related art include needle-piercing and swing-arm die bonding. While needle-piercing die bonding machines offer high efficiency, they are only suitable for small-sized LEDs and can suffer from leaks when used in the LED industry. In particular, they are not suitable for simple solder paste soldering processes, resulting in significant limitations in the LED industry. Swing-arm die bonding machines, while suitable for solder paste soldering and large target substrates, suffer from issues such as the long travel distance of the robotic arm to pick and place the chips, resulting in low die bonding efficiency and difficulty meeting the speed and precision requirements of Mini LED and Micro LED production. In contrast, the chip transfer equipment disclosed in this paper improves efficiency while accommodating LEDs of varying sizes, and is unconstrained by solder paste processing. Therefore, when applied to the LED industry, particularly Mini LED and Micro LED, the chip transfer equipment disclosed in this paper can significantly increase production capacity while maintaining a high yield rate, effectively improving mass production output, precision, and quality, thereby reducing product unit costs and enhancing product competitiveness.

[0223] When using the chain-type LED chip transfer device disclosed herein, the initial substrate may be an organic plastic film material supporting Mini LEDs and Micro LEDs arranged in a matrix by arranging sheets, and the target substrate may be a PCB substrate or a glass substrate.

[0224] In general, the implementation scheme of the chain-type die bonding equipment disclosed in the present invention can achieve at least some of the following benefits. In terms of improving the efficiency of die bonding, the overall efficiency of die bonding is improved by using a transmission chain loop and a stepping gear. By setting up an array-type die bonding head and transferring the LED or IC to the position of the target substrate one by one. As the distance to the final die bonding position gets closer and closer, the path that needs to be traversed becomes shorter, thereby improving the efficiency and speed of die bonding, reducing the cycle time and cycle time, and improving the overall efficiency. In terms of improving the accuracy and yield of die bonding, the position correction performed by AOI and the structural design of the magnetic suction mechanism of the positioner and the concave and convex surface of the die bonding head can be used to further improve the accuracy of the chain transmission. When the die bonding head moves under the concave-convex magnetic suction mechanism, the magnetic suction system starts and sucks the convex structure into the inside of the concave structure, thereby ensuring the accuracy of die bonding and improving the yield. Due to the improvement of the efficiency of die bonding, the accuracy and yield of the factory are more stable. The factory's mass production plan can be implemented more stably. In the LED industry, the disclosed chain die bonding equipment design improves efficiency while accommodating both large and small LEDs. It is not limited by solder paste processing, effectively improving mass production yield, precision, and quality. This reduces the cost per die and enhances product competitiveness.

[0225] In one embodiment, the present disclosure provides a method for obtaining a crystal in a crystal obtaining and crystal solidification process, the method comprising:

[0226] A driving gear, especially a stepping gear, is used to drive a transmission chain loop passing through the crystal retrieval position, so that multiple crystal bonding pens fixed on the transmission chain loop sequentially reach the crystal retrieval position and perform crystal retrieval at the crystal retrieval position.

[0227] As described above, the coordinated movement of the stepping gear, the transmission chain loop, and the plurality of die bonding pens, through a "queuing" mechanism, can at least partially solve the overall low speed problem of the method using the swing-arm die bonding equipment.

[0228] In one embodiment, the transmission chain loop passes through a crystal picking position group, the crystal picking position group is in a straight line, and the distance between two adjacent crystal picking positions in the crystal picking position group is the distance between adjacent crystal bonding pens.

[0229] Crystallization is performed simultaneously at the one crystallization position group.

[0230] As described above, the disclosed method utilizes a transmission chain, enabling simultaneous wafer retrieval from consecutive wafer retrieval positions on the same straight line. This allows multiple chips to be picked up simultaneously from a single initial substrate. This is impossible with a swing-arm wafer retrieval and wafer bonding process, where the wafer bonding head moves along a circular arc, and thus significantly improves wafer retrieval efficiency.

[0231] In one embodiment, after the crystal fixing pen reaches the crystal retrieval position, a crystal fixing pen positioner is used to fix the position of the crystal fixing pen;

[0232] Using an automatic optical inspection machine to control the platform carrying the initial substrate so that the chip on the initial substrate is aligned with the position of the die bonding pen; and

[0233] The air passage between the suction nozzle and the air outlet in the crystal bonding pen is opened, and the chip is sucked into the suction nozzle to perform crystal extraction.

[0234] In this embodiment, it is preferred to further combine a solid crystal pen positioner, an automatic optical inspection machine and an air suction type crystal retrieval method. As described above, the solid crystal pen positioner and the appropriate deformation flexibility of the transmission chain work together to achieve more precise positioning. The solid crystal pen positioner is preferably an electromagnetic solid crystal pen positioner. Using AOI to control and fine-tune the platform carrying the initial substrate can achieve extremely high precision in the crystal retrieval of the present invention and is beneficial to subsequent solid crystals. The suction type crystal retrieval method is suitable for the design of a pen-shaped solid crystal pen, which facilitates the pickup and subsequent placement of the chip.

[0235] In one embodiment, the present disclosure provides a method for solidifying a crystal during a crystal extraction and solidification process, the method comprising:

[0236] A driving gear, especially a stepping gear, is used to drive a transmission chain loop passing through the crystal bonding position, so that multiple crystal bonding pens fixed on the transmission chain loop sequentially reach the crystal bonding position and perform crystal bonding at the crystal bonding position.

[0237] Die bonding can be performed by bringing the chip into contact with the solder paste and removing or reducing the negative pressure at the suction nozzle. The solder paste has a certain viscosity. When the chip is in contact with the solder paste and the negative pressure at the suction nozzle is removed or reduced, the viscosity is sufficient to detach the chip from the suction nozzle and position it. Since the suctioned chip and the suction nozzle are usually not completely airtight, the negative pressure at the suction nozzle can quickly disappear naturally after the negative pressure is cut off. Of course, additional devices can also be provided to assist in reducing the negative pressure, such as providing a valve in the airway that is connected to the atmosphere and opening the valve after the negative pressure is cut off.

[0238] It can be considered that die bonding (or chip placement) is completed after the chip position is fixed. However, die bonding can also include permanent fixing steps such as welding. Any method of fixing the chip in the relevant technology can be used.

[0239] As described above, by driving the gears, the transmission chain loop and the coordinated movement of the plurality of die bonding pens, the problem of low overall speed of the method using the swing arm die bonding equipment can be at least partially solved through the "queuing" mechanism.

[0240] In one embodiment, the transmission chain loop passes through a die bonding position group, the die bonding position group is in a straight line, and the distance between two adjacent die bonding positions in the die bonding position group is the distance between adjacent die bonding pens.

[0241] Wherein, crystal bonding is performed simultaneously at the one crystal taking position group.

[0242] As described above, the disclosed method utilizes a transmission chain, enabling simultaneous die bonding at consecutive die bonding locations on the same straight line. This allows multiple chips to be simultaneously secured to a single target substrate. This is impossible with a swing-arm die pick-up and die bonding process, where the die bonding head moves along a circular arc. Consequently, this significantly improves die bonding efficiency.

[0243] In particular, in the field of LEDs, for example, red, green, and blue (RGB) LED chips can be die-bonded together in groups, advantageously forming pixel elements with high chip pitch accuracy.

[0244] In one embodiment, after the die-bonding pen reaches the die-bonding position, a die-bonding pen positioner is used to fix the position of the die-bonding pen;

[0245] Using an automatic optical inspection machine to control the platform carrying the target substrate so that the site to be bonded on the target substrate is aligned with the position of the bonding pen; and

[0246] By closing the air passage between the suction nozzle and the air outlet in the crystal bonding pen, the chip is lowered from the suction nozzle to perform crystal bonding.

[0247] In this embodiment, a die-bonding pen positioner, an automated optical inspection machine, and an air-suction-type wafer retrieval method are preferably further combined. As described above, the die-bonding pen positioner works in conjunction with the drive chain and die-bonding pen to achieve more precise positioning. The die-bonding pen positioner is preferably an electromagnetic die-bonding pen positioner. Using AOI to control and fine-tune the platform supporting the target substrate allows the die-bonding of the present invention to achieve extremely high precision. The air-suction-type wafer retrieval method is suitable for the design of a pen-shaped die-bonding pen, facilitating the pickup and subsequent placement of the chip.

[0248] The crystal retrieval method and the crystal solidification method disclosed herein can be flexibly combined with each other. In one embodiment, the chip can be retrieved individually and fixed individually. In one embodiment, different types of chips can be retrieved individually and fixed in groups. In one embodiment, the same type of chips can be retrieved in groups and fixed in groups. In one embodiment, different chips can be retrieved from multiple initial substrates and the different chips can be fixed to different target substrates respectively. In one embodiment, crystal retrieval and crystal solidification can be performed simultaneously. Those skilled in the art can further flexibly combine parameters such as crystal retrieval position, crystal solidification position, chip type, crystal retrieval / crystal solidification time point to obtain higher overall efficiency.

[0249] In one embodiment, the present disclosure provides a magnetic die-bonding pen comprising:

[0250] Tubular pen holder,

[0251] a cylindrical pen core located in the tubular pen barrel, the cylindrical pen core having a first end, a second end and a side wall extending between the first end and the second end,

[0252] Wherein, the cylindrical pen core comprises:

[0253] a first magnetic component, the first magnetic component being a permanent magnetic component or comprising a metal that can be attracted by a magnet,

[0254] The suction nozzle at the first end,

[0255] Pipe connections on the side walls, and

[0256] An air passage extending inside the side wall and communicating with the suction nozzle and the pipeline interface.

[0257] The magnetic die-bonding pen disclosed herein can be used with chain-type die-bonding equipment or chip transfer equipment equipped with an electromagnetic die-bonding pen positioner. The first magnetic component is a permanent magnet or a metal that is attracted to a magnet. This allows for use with, for example, an electromagnetic pickup positioner to achieve the desired position of the magnetic die-bonding pen. Examples of magnet-attractive metals include iron, cobalt, and nickel.

[0258] For example, the cylindrical pen core itself is the first magnetic component.

[0259] For example, the first magnetic component is located on a side of the cylindrical pen core away from the nozzle. The first magnetic component can be located at the second end.

[0260] By setting an electromagnetic attraction component in the positioner and cooperating with the permanent magnetic component in the crystal bonding pen or metal that can be attracted by the magnet, the crystal bonding pen can be quickly fixed and released.

[0261] The function of the tubular pen barrel is to accommodate the columnar pen core and to be fixed to the transmission chain of the chain-type die bonding device. When the tubular pen barrel is fixed to the transmission chain, the die bonding pen as a whole can move along with the transmission chain.

[0262] The tubular pen barrel contains a cylindrical pen core which serves to locate the pen and provide an airway.

[0263] In one embodiment, the magnetic die-bonding pen further comprises a convex structure or a concave structure at the second end.

[0264] Preferably, the second end of the cylindrical pen core (also called the top, that is, the side away from the suction nozzle located at the first end, that is, the bottom) has a convex structure or a protruding shape, which can be used in conjunction with an electromagnetic solid crystal pen positioner with a concave structure or a concave shape to achieve the positioning of the cylindrical pen core.

[0265] Preferably, the second end of the cylindrical pen core has a concave structure or a concave shape, which can be used in conjunction with an electromagnetic die-bonding pen positioner having a convex structure or a convex shape to achieve positioning of the cylindrical pen core.

[0266] For example, the first magnetic component is located on the top of the cylindrical pen core.

[0267] To achieve the minute radial displacement required for positioning, the tubular barrel and cylindrical refill are radially spaced apart. An airway within the cylindrical refill connects the nozzle and the piping interface, allowing the nozzle to pick up and place chips using an external negative pressure source. The aforementioned controllable switch is located within the airway to control the airway.

[0268] Preferably, the magnetic die-bonding pen further includes a return spring that forms an axial connection between the tubular pen barrel and the cylindrical pen core. This allows the cylindrical pen core to be lifted and pressed relative to the tubular pen barrel by the action of the electromagnetic die-bonding pen positioner and the platform supporting the initial / target substrate, facilitating positioning, die retrieval, and die bonding. The return spring returns the pen core to its original position after the die retrieval and bonding process are complete.

[0269] Figure 6 shows a schematic diagram of a magnetic die-bonding pen and its associated electromagnetic die-bonding pen positioner. The upper electromagnetic die-bonding pen positioner 61 comprises an electromagnet 611 as a second magnetic component and a truncated concave bottom 612. The lower magnetic die-bonding pen 62 comprises a tubular pen barrel 621 and a cylindrical pen core 622 within the tubular pen barrel 621. A return spring 623 is disposed between the cylindrical pen core 622 and the tubular pen barrel 621. The return spring 623 forms an axial connection between the tubular pen barrel 621 and the cylindrical pen core 622. The axial connection can be achieved by securing the two ends of the return spring 623 to the tubular pen barrel 621 and the cylindrical pen core 622, respectively. For example, as shown in the figure, the upper end of the return spring 623 can be secured to a flange on the outer wall of the cylindrical pen core 622, while the lower end can be secured to the inner wall of the tubular pen barrel. Axial connection means that when the cylindrical refill 622 moves upward relative to the tubular barrel 621 and the return spring 623 is in a stretched state, the return spring 623 provides a gradually increasing pulling force and resists this movement, providing a buffer. Conversely, when the cylindrical refill 622 moves downward relative to the tubular barrel 621 and the return spring 623 is in a compressed state, the return spring 623 provides a gradually increasing pushing force and also resists this movement, providing a buffer. Other fixing methods can also be used. For example, the upper end of the return spring can be fixed to the inner wall of the tubular barrel, and the lower end can be fixed to the outer wall of the cylindrical refill. In this case, when the cylindrical refill moves upward, the return spring provides a gradually increasing pushing force, and when it moves downward, the return spring provides a gradually increasing pulling force. Because the force provided by the return spring is opposite to the direction of movement, this fixing method can also achieve both buffering and restoring. In short, as long as the return spring forms an axial connection between the tubular barrel and the cylindrical refill, it will suffice.

[0270] For example, the top of the cylindrical pen core 622 has a truncated cone-shaped protruding top 6221 that cooperates with the truncated cone-shaped concave bottom 612, and a first magnetic component is provided in the top 6221. In this article, the truncated cone can also include a cone. The cylindrical pen core 622 has a suction nozzle 6223 at the bottom, a pipe interface 6222 on the side wall, and an airway inside that connects the suction nozzle 223 and the pipe interface 6222. A switch / valve can be provided to control the negative pressure state in the airway. Such a valve can be a solenoid valve, for example, a solenoid valve provided at the pipe interface 6222 outside the solid crystal pen.

[0271] The cylindrical pen core is thus able to move axially relative to the tubular pen holder. A return spring provides a resetting connection between the two and cushions their relative motion. The cylindrical pen core works in conjunction with the electromagnetic die-bonding pen positioner and the AOI-controlled platform that supports the initial / target substrates to achieve die removal / bonding at the desired location. The tubular pen holder enables the magnetic die-bonding pen to follow the drive chain loop.

[0272] Continuing with Figure 6, we will explain how the magnetic die-bonding pen and the electromagnetic die-bonding pen positioner work together to achieve die retrieval and bonding. The cylindrical pen core 622 and the tubular pen barrel 621 are fitted with a clearance, so even when the tubular pen barrel 621 is fixed, for example, on a drive chain, the cylindrical pen core 622 can still make slight horizontal movements within the tubular pen barrel 621. When the magnetic die-bonding pen 62 moves below the electromagnetic die-bonding pen positioner 61 at the pickup position, the electromagnet 611 in the electromagnetic die-bonding pen positioner 61 is energized, applying a magnetic force to the first magnetic component at the top of the cylindrical pen core. This magnetic force overcomes the gravity of the cylindrical pen core 622 and pulls the cylindrical pen core 622 upward toward the magnetic die-bonding pen 62. Because the truncated cone-shaped protruding top 6221 and the truncated cone-shaped recessed bottom 612 are fitted together via a conical surface, the truncated cone-shaped protruding top 6221 of the cylindrical pen core 622 slides into the truncated cone-shaped recessed bottom 612 of the electromagnetic die-bonding pen positioner 61 under the action of magnetic force, forming a coaxial fixation. This deprives the cylindrical pen core 622 of its horizontal freedom and is precisely positioned by the magnetic die-bonding pen positioner 61. When the upper end of the return spring 623 is secured to the flange on the outer wall of the cylindrical pen core 622 and the lower end is secured to the inner wall of the tubular pen holder as shown, as the cylindrical pen core 622 rises and the return spring 623 is in tension, the downward force exerted by the return spring 623 on the cylindrical pen core 622 gradually increases, creating a buffer and preventing violent collisions between the cylindrical pen core 622 and the electromagnetic die-bonding pen positioner 61 or the tubular pen holder, which could cause structural damage. The precise horizontal positioning of the columnar pen core 622 by means of the electromagnetic crystal bonding pen positioner compensates for the horizontal position error that may occur when the tubular pen barrel 621 moving along the transmission chain is in place.

[0273] When the columnar pen core 622 is tightly fitted with the magnetic crystal bonding pen positioner 61, the magnetic crystal bonding pen positioner 61 can move vertically downward to achieve crystal extraction or crystal bonding, in other words, chip picking or chip placement. When the magnetic crystal bonding pen positioner 61 moves downward, the columnar pen core 622 moves downward in the tubular pen barrel 621. At this time, the suction nozzle 6223 at the tip of the pen approaches the initial substrate or the target substrate. When picking up the chip, the suction nozzle 6223 approaches the chip on the initial substrate from above, and even contacts it. At this time, the suction nozzle 6223 is in a negative pressure state, sucking the chip from the initial substrate to complete the picking action. When the upper end of the return spring 623 is fixed to the flange on the outer wall of the cylindrical pen core 622 and the lower end is fixed to the inner wall of the tubular pen barrel as shown in the figure, when the cylindrical pen core 622 descends and the return spring 623 is in a compressed state, the upward support force of the return spring 623 on the cylindrical pen core 622 gradually increases, forming a buffer, thereby avoiding violent collision between the cylindrical pen core 622 and the electromagnetic solid crystal pen positioner 61 or the tubular pen barrel or the chip, causing structural damage.

[0274] When the chip is sucked onto the nozzle 6223, the magnetic die-bonding pen positioner 61 moves upward and the electromagnet 611 is de-energized. In this way, the cylindrical pen core 622 that has picked up the chip returns to its initial position under the action of the return spring and can move with the tubular pen barrel 621 to leave the picking position.

[0275] A similar process occurs at the placement position, the difference being that when the magnetic die-bonding pen locator 61 is pressed down, the chip on the nozzle 6223 comes into contact with, for example, the solder paste on the target substrate, and when the negative pressure of the nozzle 6223 is removed, the chip remains on the target substrate due to the viscosity of the solder paste, thereby completing the chip placement action.

[0276] Preferably, as described above, the first magnetic component of the magnetic die-bonding pen is a permanent magnet, and the second magnetic component of the magnetic die-bonding pen positioner is an electromagnet. This can make the magnetic die-bonding pen lighter. Of course, it is also possible to set the first magnetic component as an electromagnet and the second magnetic component as a permanent magnet (or a metal that can be attracted by a magnet), or both as electromagnets.

[0277] In one embodiment, as shown in FIG6 , the side wall of the tubular pen barrel 621 has a groove extending in the axial direction.

[0278] The pipeline interface 6222 passes through the groove to the outside of the tubular pen barrel.

[0279] Preferably, the conduit interface can be perpendicular to the axis and extend radially as shown in the figure. However, the conduit interface can also be at a certain angle to the axis as long as it passes the groove to the outside of the tubular pen barrel.

[0280] The axially extending groove and the conduit interface restrict horizontal rotation of the conduit interface, thereby providing circumferential constraints on the cylindrical refill 622 and mitigating potential rotation within the tubular barrel. The axially extending groove does not impede axial relative motion between the cylindrical refill and the tubular barrel. Furthermore, when a return spring is present, the cushioning provided by the return spring prevents severe collisions between the conduit interface and the ends of the groove.

[0281] For example, when there is a return spring, the return spring makes the position of the cylindrical pen core 622 under the action of natural gravity (that is, the state when it is located on the chain-type solid crystal device and does not interact with the solid crystal pen positioner) satisfy the pipe interface and does not contact the upper and lower edges of the axially extending groove (that is, the edges on both sides of the axial direction). In this way, the buffering effect of the return spring is better.

[0282] In one embodiment, a solenoid valve is provided at the pipeline interface outside the tubular pen barrel. The benefit of disposing the solenoid valve at the pipeline interface outside the tubular pen barrel is that the solenoid valve is usually large, so disposing it inside the cylindrical pen core will take up space, which is not conducive to further miniaturization of the die bonding pen.

[0283] Based on the above findings, in one aspect, the present disclosure provides a chip transfer device, comprising:

[0284] a drive chain loop passing through one or more pick-up locations and one or more placement locations;

[0285] a drive gear that cooperates with the drive chain loop; and

[0286] A plurality of pickup parts, each of which is fixed on the transmission chain loop,

[0287] The driving gear is configured to drive the transmission chain loop so that the picking portion reaches the picking position and the placing position, and the picking portion is configured to pick up a chip at the picking position and place a chip at the placing position.

[0288] The use of a transmission chain loop for fixing and moving chip pick-up units is beneficial in that a high density of pick-up units and a queuing mechanism can be achieved to improve overall efficiency. In addition, the transmission chain loop can provide a flexible moving path and related benefits.

[0289] In one embodiment, the drive chain loop passes through at least one placement position group, the placement position group including a plurality of placement positions on a first straight line.

[0290] Such a placement position group can be advantageous for placing multiple chips simultaneously in a straight line.

[0291] In one embodiment, the chip includes a light-emitting chip as a sub-pixel of a display device, and the light-emitting chip includes a first light-emitting chip,

[0292] The chip transfer device is configured to transfer the first light-emitting chips from a first initial substrate to a first target substrate so that the first light-emitting chips are periodically arranged along a first direction on the first target substrate.

[0293] The first straight line extends along the first direction,

[0294] The distance between two adjacent placement positions in the placement position group is equal to an integer multiple of the arrangement period of the first light-emitting chips.

[0295] Such an arrangement can be beneficial for periodically forming sub-pixels of the same color in a display device.

[0296] In one embodiment, the transmission chain loop passes through at least one pick-up position group, the pick-up position group comprising a plurality of pick-up positions located on a second straight line.

[0297] The pickup position group arranged in this way can be helpful for simultaneously obtaining multiple chips from chips arranged in a straight line.

[0298] In one embodiment, the chip transfer device is configured to transfer the chips from a first initial substrate to a first target substrate, the chips being periodically arranged along a second direction on the first initial substrate.

[0299] The second straight line extends along the second direction,

[0300] The distance between two adjacent picking positions in the picking position group is equal to an integer multiple of the chip arrangement period.

[0301] Such a set-up can be advantageous for simultaneously obtaining multiple chips from a stack of chips arranged in a straight line, and then transferring them as a whole to a target substrate.

[0302] In one embodiment, the chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip and a second light-emitting chip, the first light-emitting chip and the second light-emitting chip have different light-emitting colors,

[0303] The chip transfer device is configured to transfer the first light-emitting chip from a first initial substrate to a first target substrate, and transfer the second light-emitting chip from a second initial substrate to the first target substrate.

[0304] The chip transfer device includes a first carrying area and a second carrying area. The chip transfer device carries the first initial substrate in the first carrying area and carries the second initial substrate in the second carrying area.

[0305] A portion of the plurality of pick-up positions is located in the first carrying area, and a portion of the plurality of pick-up positions is located in the second carrying area,

[0306] The chip transfer device includes a target carrying area, the chip transfer device carries the first target substrate in the target carrying area, and the one or more placement positions are located in the target carrying area.

[0307] The transmission chain loop is configured to drive the plurality of picking parts to sequentially pass through the first carrying area, the second carrying area, and the first target carrying area.

[0308] Such a setup can take different chips from different starting substrates and transfer them to the same target substrate.

[0309] In the present disclosure, a “carrying area” refers to an area that carries an initial substrate / target substrate, which is equivalent to a range within which the initial substrate / target substrate can move.

[0310] As shown in Figure 7, the first initial substrate I1, the second initial substrate I2, and the first target substrate T1 can be positioned in corresponding loading zones ZI1, ZI2, and ZT3 and are movable. Pickup positions or placement positions can be set within the corresponding loading zones. A transmission chain loop L passing through these zones can transfer different types of chips from different initial substrates to the same target substrate.

[0311] In one embodiment, the light-emitting chip further includes a third light-emitting chip, and the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip have different light-emitting colors.

[0312] The chip transfer device is configured to further transfer the third light-emitting chip from the third initial substrate to the first target substrate,

[0313] The chip transfer device further includes a third carrying area, and the chip transfer device carries the third initial substrate in the third carrying area; a portion of the plurality of pick-up positions is located in the third carrying area,

[0314] The transmission chain loop is configured to drive the plurality of picking parts to sequentially pass through the first carrying area, the second carrying area, the third carrying area and the first target carrying area.

[0315] This setup can take chips from different starting substrates and transfer them to the same target substrate. This setup is particularly useful for die bonding of RGB display substrates.

[0316] As shown in Figure 8, the first initial substrate I1, the second initial substrate I2, the third initial substrate I3, and the first target substrate T1 can be located in corresponding loading zones ZI1, ZI2, ZI3, and ZT1 and are movable. Pickup or placement positions can be set within the corresponding loading zones. A transmission chain loop passing through these zones can transfer different types of chips from different initial substrates to the same target substrate. The first, second, and third light-emitting chips can, for example, be R, G, and B light-emitting chips, respectively.

[0317] In one embodiment, the chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip and a second light-emitting chip, the first light-emitting chip and the second light-emitting chip have the same light-emitting color,

[0318] The chip transfer device is configured to transfer the first light-emitting chip from a first initial substrate to a first target substrate, and transfer the second light-emitting chip from a second initial substrate to the first target substrate.

[0319] The chip transfer device includes a first carrying area and a second carrying area. The chip transfer device carries the first initial substrate in the first carrying area and carries the second initial substrate in the second carrying area.

[0320] A portion of the plurality of pick-up positions is located in the first carrying area, and a portion of the plurality of pick-up positions is located in the second carrying area,

[0321] The chip transfer device includes a target carrying area, the chip transfer device carries the first target substrate in the target carrying area, and the one or more placement positions are located in the first target carrying area.

[0322] The transmission chain loop is configured to drive the plurality of picking parts to sequentially pass through the first carrying area, the second carrying area, and the first target carrying area.

[0323] Such a setup can take chips of the same type from different initial substrates and transfer them to the same target substrate, which can further improve efficiency.

[0324] As shown in Figure 9, the first initial substrate I1, the second initial substrate I2, and the first target substrate T1 can be movable within corresponding loading zones ZI1, ZI2, and ZT1. Pickup and placement positions can be set within the corresponding loading zones. A transmission chain loop L passing through these zones can transfer the same type of chips from different initial substrates to the same target substrate.

[0325] In one embodiment, the chip transfer apparatus is configured to transfer the first chip from the fourth initial substrate to the second target substrate, and to transfer the second chip from the fifth initial substrate to the third target substrate.

[0326] The chip transfer device includes a fourth carrying area and a fifth carrying area, wherein the chip transfer device carries the fourth initial substrate in the fourth carrying area and the chip transfer device carries the fifth initial substrate in the fifth carrying area.

[0327] The chip transfer device further includes a second target carrying area and a third target carrying area, wherein the chip transfer device carries the second target substrate in the second target carrying area and the chip transfer device carries the third target substrate in the third target carrying area.

[0328] A portion of the plurality of pick-up positions is located in the fourth carrying area, and a portion of the plurality of pick-up positions is located in the fifth carrying area.

[0329] A portion of the plurality of placement positions is located in the second target carrying area, and a portion of the plurality of placement positions is located in the third target carrying area.

[0330] in,

[0331] The transmission chain loop is configured to drive the multiple picking parts to pass through the fourth bearing area, the fifth bearing area, the second target bearing area and the third target bearing area in sequence, or to pass through the fourth bearing area, the second target bearing area, the fifth bearing area and the third target bearing area in sequence.

[0332] Such a setup can take chips from different initial substrates and transfer them to different target substrates, which can further improve efficiency.

[0333] As shown in FIG10 , the fourth initial substrate I4, the fifth initial substrate I5, the second target substrate T2, and the third target substrate T3 can be located in corresponding loading zones ZI4, ZI5, ZT2, and ZT3 and are movable. Within the corresponding loading zones, a pickup position or a placement position can be set. A transmission chain loop passing through these zones can transfer chips from different initial substrates to different target substrates. The order of the fifth initial substrate I5, the second target substrate T2, and the corresponding loading zones can be interchanged.

[0334] In one embodiment, the chip transfer device includes a first movable stage, and the first movable stage is arranged corresponding to the placement position.

[0335] In one embodiment, the chip transfer device includes a second movable stage, and the second movable stage is arranged corresponding to the picking position.

[0336] The movable stage is used to deliver the required components to the placement and pick-up locations. For example, a solder paste site or a chip can be provided. The movable stage can also serve as an auxiliary support platform for AOI.

[0337] In one embodiment, further comprising a rotatable gas cylinder having an inner cavity;

[0338] The inner cavity of the rotatable gas cylinder is connected to the pickup portion through a pipeline and is configured to provide negative pressure to the pickup portion;

[0339] The rotatable gas cylinder is driven to rotate via the pipeline by the movement of the pickup portion.

[0340] In one embodiment, the chip transfer device further comprises:

[0341] a fixed cylinder, wherein the inner cavity of the fixed cylinder is in gas communication with the negative pressure trachea, the inner wall of the fixed cylinder having an inward flange, and the center of the flange having a through hole;

[0342] Among them, the rotatable air cylinder is a suspended air cylinder passing through the through hole, and the suspended air cylinder is suspended on the flange through an annular ball bearing, so that the suspended air cylinder can rotate in the through hole, the inner cavity of the suspended negative pressure air cylinder is engaged with the inner cavity of the fixed cylinder by means of a sealing mechanism, and the side wall of the suspended air cylinder has multiple pipeline connection ports.

[0343] In one embodiment, the tubing is a flexible tubing.

[0344] In one embodiment, the sealing mechanism is a sealing ring.

[0345] In one embodiment, the plurality of pipeline connection ports are radially extending tubes uniformly distributed along the circumference of the side wall.

[0346] An embodiment of the rotatable gas cylinder can be shown in FIG5 .

[0347] In one embodiment, the pick-up position and the placement position are provided with electromagnetic pick-up positioners,

[0348] in,

[0349] The electromagnetic pickup positioner has a second magnetic component, and

[0350] The pickup portion has a first magnetic component, so that when the first magnetic component is attracted by the second magnetic component, the pickup portion is temporarily fixed to the electromagnetic bonding pen positioner.

[0351] Wherein, at least one of the first magnetic component and the second magnetic component is an electromagnetic component.

[0352] In one embodiment, the electromagnetic pickup portion locator has a concave bottom and the pickup portion has a convex top, or the electromagnetic pickup portion locator has a convex bottom and the pickup portion has a concave top, so that when the second magnetic component is attracted by the first magnetic component, the outer surface of the top of the pickup portion fits with the inner surface of the bottom of the electromagnetic pickup portion locator. Preferably, both the bottom and the top have a truncated cone structure.

[0353] In one embodiment, the chip transfer device is a Micro LED chip transfer device or a Mini LED chip transfer device.

[0354] In one embodiment, the drive gear is a stepper gear.

[0355] In one embodiment, the chip is or comprises a wafer.

[0356] In another aspect, the present disclosure provides a chip transfer method, comprising:

[0357] using a driving gear to drive a transmission chain loop having a plurality of picking parts fixed thereon through one or more picking positions and one or more placing positions so that the picking parts reach the picking positions and the placing positions, and

[0358] A chip is picked up at the pick-up position, and a chip is placed at the placement position.

[0359] The chip transfer method disclosed herein utilizes a transmission chain loop and a driving gear to achieve high-efficiency chip transfer.

[0360] In one embodiment, the transmission chain loop passes through at least one placement position group, the placement position group including a plurality of placement positions on a first straight line,

[0361] Chips are placed at the placement positions in the placement position group at the same time.

[0362] In one embodiment, the chip includes a light-emitting chip as a sub-pixel of a display device, wherein the light-emitting chip includes a first light-emitting chip, wherein the first light-emitting chip has the same light-emitting color,

[0363] The chip transfer method further includes transferring the first light-emitting chips from the first initial substrate to a first target substrate so that the first light-emitting chips are periodically arranged along a first direction on the first target substrate.

[0364] The first straight line extends along the first direction,

[0365] The distance between two adjacent placement positions in the placement position group is equal to an integer multiple of the first light-emitting chip arrangement period.

[0366] In one embodiment, the transmission chain loop passes through at least one pick-up position group, the pick-up position group comprising a plurality of pick-up positions located on a second straight line.

[0367] In one embodiment, the chip transfer method further comprises transferring the chips from a first initial substrate to a first target substrate, the chips being periodically arranged along a second direction on the first initial substrate;

[0368] The second straight line extends along the second direction;

[0369] The distance between two adjacent picking positions in the picking position group is equal to an integer multiple of the chip arrangement period.

[0370] In one embodiment, the chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip and a second light-emitting chip, the first light-emitting chip and the second light-emitting chip have different light-emitting colors,

[0371] The chip transfer method further includes transferring the first light-emitting chip from a first initial substrate to a first target substrate, transferring the second light-emitting chip from a second initial substrate to the first target substrate,

[0372] The first initial substrate is carried in a first carrying area, the second initial substrate is carried in a second carrying area, and the first target substrate is carried in the first target carrying area.

[0373] A portion of the plurality of pick-up positions is located in the first carrying area, a portion of the plurality of pick-up positions is located in the second carrying area, and the one or more placement positions are located in the first target carrying area,

[0374] The chip transfer method further includes using the transmission chain loop to drive the plurality of pick-up parts to sequentially pass through the first carrying area, the second carrying area, and the first target carrying area.

[0375] In one embodiment, the light-emitting chip further includes a third light-emitting chip, and the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip have different light-emitting colors.

[0376] The chip transfer method further includes transferring the third light-emitting chip from the third initial substrate to the first target substrate,

[0377] The third initial substrate is carried in a third carrying area, and a portion of the plurality of pick-up positions is located in the third carrying area.

[0378] The chip transfer method further includes using the transmission chain loop to drive the multiple pick-up parts to pass through the first carrying area, the second carrying area, the third carrying area and the first target carrying area in sequence.

[0379] In one embodiment, the chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip and a second light-emitting chip, the first light-emitting chip and the second light-emitting chip have the same light-emitting color,

[0380] The chip transfer method further includes transferring the first light-emitting chip from a first initial substrate to a first target substrate, transferring the second light-emitting chip from a second initial substrate to the first target substrate,

[0381] The first initial substrate is carried in a first carrying area, the second initial substrate is carried in a second carrying area, and the first target substrate is carried in the first target carrying area.

[0382] A portion of the plurality of pick-up positions is located in the first carrying area, a portion of the plurality of pick-up positions is located in the second carrying area, and the one or more placement positions are located in the first target carrying area,

[0383] The chip transfer method further includes using the transmission chain loop to drive the plurality of pick-up parts to sequentially pass through the first carrying area, the second carrying area, and the first target carrying area.

[0384] In one embodiment, the chip transfer method further comprises transferring the first chip from the fourth initial substrate to the second target substrate, transferring the second chip from the fifth initial substrate to the third target substrate,

[0385] The fourth initial substrate is carried in the fourth carrying area, the fifth initial substrate is carried in the fifth carrying area, and the second target substrate is carried in the first target carrying area.

[0386] A portion of the plurality of pick-up positions is located in the fourth carrying area, and a portion of the plurality of pick-up positions is located in the fifth carrying area.

[0387] A portion of the plurality of placement positions is located in the second target carrying area, and a portion of the plurality of placement positions is located in the third target carrying area.

[0388] in,

[0389] The chip transfer method also includes driving the multiple picking parts to pass through the fourth carrying area, the fifth carrying area, the second target carrying area and the third target carrying area in sequence, or, passing through the fourth carrying area, the second target carrying area, the fifth carrying area and the third target carrying area in sequence.

[0390] The benefit of the above embodiment is that the combination of the placement position and the pickup position with the target substrate and the initial substrate can be selected as needed, so that the chip transfer method of the present disclosure can be flexibly used for various transfer purposes.

[0391] In one embodiment, after the pickup portion reaches the pickup position, a positioner is used to fix the position of the pickup portion;

[0392] Using an automated optical inspection machine to align the chip to the position of the pickup portion, and

[0393] Pick up the chip,

[0394] and

[0395] After the picking portion reaches the placement position, a positioner is used to fix the position of the picking portion;

[0396] Using an automated optical inspection machine to align a placement target with the position of the pick-up portion; and

[0397] A chip is placed on the placement target.

[0398] In one embodiment, picking up the chip includes applying negative pressure to the picking portion to suck the chip, and

[0399] Placing the chip includes bringing the chip into contact with the solder paste and removing the negative pressure.

[0400] In one embodiment, the drive gear drives the drive chain loop in steps.

[0401] In one embodiment, the chip is or comprises a wafer.

[0402] In another aspect, the present disclosure provides a magnetic die-bonding pen, comprising:

[0403] Tubular pen holder,

[0404] a cylindrical pen core in the tubular pen barrel, the cylindrical pen core having a first end, a second end and a side wall extending between the first end and the second end,

[0405] Wherein, the cylindrical pen core comprises:

[0406] a first magnetic component, wherein the first magnetic component is a permanent magnetic component or includes a metal that can be attracted by a magnet;

[0407] The suction nozzle at the first end,

[0408] Pipe connections on the side walls, and

[0409] An air passage extending inside the side wall and communicating with the suction nozzle and the pipeline interface.

[0410] The magnetic bonding pen is suitable for use as the pickup portion in the present disclosure.

[0411] In one embodiment, the magnetic die-bonding pen further comprises a convex structure or a concave structure at the second end, preferably a truncated cone-shaped convex structure or a concave structure.

[0412] In one embodiment, the magnetic bonding pen further comprises:

[0413] A return spring forms an axial connection between the tubular pen barrel and the cylindrical pen core.

[0414] In one embodiment, the side wall of the tubular pen barrel has a groove extending in the axial direction.

[0415] The pipeline interface passes through the groove to the outside of the tubular pen barrel.

[0416] In one embodiment, a solenoid valve is provided at the pipeline interface outside the tubular pen barrel.

[0417] Example

[0418] Example 1

[0419] The chain-type die bonding equipment shown in Figures 1 and 2 is used to carry out the die removal and die bonding process. The equipment includes a hanging negative pressure air cylinder shown in Figure 5 and an electromagnetic die bonding pen positioner shown in Figure 6.

[0420] When the equipment is in operation, the die bonding head first moves above the LED matrix on the initial substrate disc. The electromagnet in the electromagnetic die bonding pen positioner at the die removal position is energized, drawing the truncated conical protrusion above the die bonding pen into the conical concave recess, precisely positioning the die bonding pen. The movable platform supporting the initial substrate, assisted by AOI positioning, then moves below the die bonding pen. The platform cooperates with the die bonding pen to push the pen downward. The air flow in the die bonding pen is then opened, completing the die removal process. Driven by the stepping gear and drive chain, the die bonding pen gradually moves along the drive chain loop to the die bonding position above the target substrate. The precise positioning of the die bonding pen at the die bonding position is similar to that used at the die removal position. When the die bonding pen moves above the pad on the target substrate to be bonded, the electromagnet in the electromagnetic die bonding pen positioner at the die bonding position is energized, drawing the truncated conical protrusion above the die bonding pen into the conical concave recess, precisely positioning the die bonding pen. A movable platform supporting the target substrate, guided by the AOI, moves beneath the die-bonding pen. The platform and pen engage, allowing the pen to press down and contact the solder paste pads on the target substrate. This disconnects the pen's air path, allowing the chip to adhere to the pads and complete the die-bonding process. As the drive chain advances, the flexible air tube rotates with the pen, driving the suspended negative-pressure cylinder within the fixed cylinder wall.

[0421] In the experiment, a chip transfer speed of 30 chips / second was achieved with satisfactory die bonding yield.

[0422] Example 2

[0423] Using the configuration shown in Figure 3, a process similar to that of Example 1 was employed to simultaneously pick up, transfer, and secure multiple chips from a starting substrate to a target substrate. Each set of wafer pickup / bonding positions consisted of four positions. Experiments achieved a wafer transfer speed of 120 chips / second with a satisfactory die bonding yield.

[0424] Example 3

[0425] Using the configuration shown in Figure 4, a process similar to that of Example 1 was employed to simultaneously pick up, transfer, and secure multiple chips from two initial substrates to two target substrates. Each set of wafer pickup / bonding positions consisted of four positions. Experiments achieved a wafer transfer speed of 240 chips / second with a satisfactory die bonding yield.

[0426] Compared with the present invention, the chip transfer speed of the swing arm type LED chip bonding machine in the related art is generally 10-20 chips / second. It can be seen that the method disclosed in the present invention greatly improves the overall efficiency.

[0427] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A chip transfer device, comprising: a drive chain loop passing through one or more pick-up locations and one or more placement locations; a driving gear, the driving gear cooperating with the transmission chain loop; and A plurality of pick-up parts, each of which is arranged on the transmission chain loop, The driving gear is configured to drive the transmission chain loop so that the picking portion reaches the picking position and the placing position, and the picking portion is configured to pick up a chip at the picking position and place a chip at the placing position.

2. The chip transfer device according to claim 1, wherein: The transmission chain loop passes through at least one placement position group, and the placement position group includes a plurality of placement positions located on a first straight line.

3. The chip transfer device according to claim 2, wherein: The chip includes a light-emitting chip as a sub-pixel of a display device, and the light-emitting chip includes a first light-emitting chip, The chip transfer device is configured to transfer the first light-emitting chips from a first initial substrate to a first target substrate so that the first light-emitting chips are periodically arranged along a first direction on the first target substrate. The first straight line extends along the first direction, The distance between two adjacent placement positions in the placement position group is equal to an integer multiple of the arrangement period of the first light-emitting chips.

4. The chip transfer device according to claim 2, wherein: The transmission chain loop passes through at least one pick-up position group, and the pick-up position group includes a plurality of pick-up positions located on a second straight line.

5. The chip transfer device according to claim 4, wherein: The chip transfer device is configured to transfer the chips from a first initial substrate to a first target substrate, the chips being arranged periodically along a second direction on the first initial substrate, The second straight line extends along the second direction, The distance between two adjacent pick-up positions in the pick-up position group is equal to an integral multiple of the chip arrangement period.

6. The chip transfer device according to claim 1, wherein: The chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip and a second light-emitting chip, the first light-emitting chip and the second light-emitting chip have different light-emitting colors, The chip transfer device is configured to transfer the first light-emitting chip from a first initial substrate to a first target substrate, and to transfer the second light-emitting chip from a second initial substrate to the first target substrate, The chip transfer device comprises a first carrying area and a second carrying area, wherein the chip transfer device carries the first initial substrate in the first carrying area and carries the second initial substrate in the second carrying area. A portion of the plurality of pick-up positions is located in the first carrying area, and a portion of the plurality of pick-up positions is located in the second carrying area, The chip transfer device comprises a target carrying area, the chip transfer device carries the first target substrate in the target carrying area, the one or more placement positions are located in the target carrying area, The transmission chain loop is configured to drive the plurality of picking parts to pass through the first carrying area, the second carrying area and the first target carrying area in sequence.

7. The chip transfer device according to claim 6, wherein: The light-emitting chip further includes a third light-emitting chip, and the first light-emitting chip, the second light-emitting chip and the third light-emitting chip have different light-emitting colors. The chip transfer device is configured to further transfer the third light emitting chip from the third initial substrate to the first target substrate, The chip transfer device further comprises a third carrying area, wherein the chip transfer device carries the third initial substrate in the third carrying area; a part of the plurality of pick-up positions is located in the third carrying area, The transmission chain loop is configured to drive the plurality of picking parts to sequentially pass through the first bearing area, the second bearing area, the third bearing area and the first target bearing area.

8. The chip transfer device according to claim 1, wherein: The chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip and a second light-emitting chip, the first light-emitting chip and the second light-emitting chip have the same light-emitting color, The chip transfer device is configured to transfer the first light-emitting chip from a first initial substrate to a first target substrate, and to transfer the second light-emitting chip from a second initial substrate to the first target substrate, The chip transfer device comprises a first carrying area and a second carrying area, wherein the chip transfer device carries the first initial substrate in the first carrying area and carries the second initial substrate in the second carrying area. A portion of the plurality of pick-up positions is located in the first carrying area, and a portion of the plurality of pick-up positions is located in the second carrying area, The chip transfer device comprises a target carrying area, the chip transfer device carries the first target substrate in the target carrying area, the one or more placement positions are located in the first target carrying area, The transmission chain loop is configured to drive the plurality of picking parts to pass through the first carrying area, the second carrying area and the first target carrying area in sequence.

9. The chip transfer device according to claim 1, wherein: The chip transfer device is configured to transfer the first chip from the fourth initial substrate to the second target substrate, and transfer the second chip from the fifth initial substrate to the third target substrate, The chip transfer device comprises a fourth carrying area and a fifth carrying area, the chip transfer device carries the fourth initial substrate in the fourth carrying area, and the chip transfer device carries the fifth initial substrate in the fifth carrying area. The chip transfer device further includes a second target carrying area and a third target carrying area, wherein the chip transfer device carries the second target substrate in the second target carrying area, and the chip transfer device carries the third target substrate in the third target carrying area. A portion of the plurality of pick-up positions is located in the fourth carrying area, and a portion of the plurality of pick-up positions is located in the fifth carrying area, A portion of the plurality of placement positions is located in the second target bearing area, and a portion of the plurality of placement positions is located in the third target bearing area. in, The transmission chain loop is configured to drive the plurality of pick-up parts to sequentially pass through the fourth bearing area, the fifth bearing area, the second target bearing area and the third target bearing area, or sequentially pass through the fourth bearing area, the second target bearing area, the fifth bearing area and the third target bearing area. Mark the bearing area.

10. The chip transfer device according to any one of claims 1 to 9, comprising a first movable carrier, wherein the first movable carrier is arranged corresponding to the placement position.

11. The chip transfer device according to any one of claims 1 to 9, comprising a second movable stage, wherein the second movable stage is arranged corresponding to the pick-up position.

12. The chip transfer device according to any one of claims 1 to 11, further comprising a rotatable negative pressure gas cylinder, wherein the rotatable negative pressure gas cylinder has an inner cavity; The inner cavity of the rotatable negative pressure gas cylinder is connected to the pick-up portion through a pipeline and is configured to provide negative pressure to the pick-up portion; The rotatable negative pressure gas cylinder is driven to rotate via the pipeline by the movement of the picking part.

13. The chip transfer device according to claim 12, wherein: The chip transfer device also includes: A fixed tube, the inner cavity of which is in gas communication with the negative pressure trachea, the fixed tube comprising a recess formed by an inner wall extending inwardly; and Multiple balls; in, The rotatable negative pressure cylinder is sleeved in the fixed cylinder and has a first end away from the negative pressure air tube and a second end close to the negative pressure air tube, and the inner cavity of the rotatable negative pressure cylinder is connected with the first end and the second end; The outer side wall of the rotatable negative pressure cylinder includes a convex portion, and the convex portion fits into the concave portion. The inner cavity of the rotatable negative pressure cylinder is slidably engaged with the inner cavity of the fixed cylinder, and the joint is sealed with a sealing ring. The rotatable negative pressure cylinder has a plurality of pipeline connection ports located at the first end for connecting with the pipeline. The concave portion and the convex portion have opposing grooves forming a first groove structure, and the first groove structure serves as a first sliding track to accommodate the ball to form a ball bearing.

14. The chip transfer device according to claim 12, wherein: The recess and the protrusion also have relative grooves forming a second groove structure, and the second groove structure serves as a second sliding track to accommodate the balls to form a ball bearing. The first sliding track and the second sliding track are respectively located on one side of the recess close to the first end and one side close to the second end.

15. The chip transfer device according to claim 12, wherein: Opposite grooves forming a third groove structure are provided on the outer side wall of the rotatable negative pressure cylinder and the inner side wall of the fixed cylinder. The third groove structure accommodates a sealing ring surrounding the rotatable negative pressure cylinder.

16. The chip transfer device according to claim 12, wherein: The sealing ring is further away from the first end than the protrusion.

17. The chip transfer device according to any one of claims 1 to 16, wherein: The pick-up position and the placement position are provided with electromagnetic pick-up positioners, in, The electromagnetic pickup positioner has a second magnetic component, and The pickup portion has a first magnetic component, so that when the first magnetic component is attracted by the second magnetic component, the pickup portion is temporarily fixed to the electromagnetic bonding pen positioner. Wherein, at least one of the first magnetic component and the second magnetic component is an electromagnetic component.

18. The chip transfer device according to any one of claims 17, wherein: The electromagnetic pickup part locator has a concave bottom and the pickup part has a convex top, or the electromagnetic pickup part locator has a convex bottom and the pickup part has a concave top, so that when the second magnetic component is attracted by the first magnetic component, the outer surface of the top of the pickup part fits with the inner surface of the bottom of the electromagnetic pickup part locator. Preferably, both the bottom and the top have a truncated cone structure.

19. The chip transfer device according to any one of claims 1 to 18, wherein: The chip transfer equipment is a Micro LED chip transfer equipment or a Mini LED chip transfer equipment.

20. The chip transfer apparatus according to any one of claims 1 to 19, wherein the driving gear is a stepping gear.

21. The chip transfer device according to any one of claims 1 to 20, wherein the chip is or includes a wafer.

22. A chip transfer method, the chip transfer method comprising: A drive gear is used to drive a transmission chain loop having a plurality of pick-up parts fixed thereon through one or more pick-up positions and one or more placement positions, so that the pick-up parts reach the pick-up positions. location and said placement, and A chip is picked up at the pick-up position, and a chip is placed at the placement position.

23. The chip transfer method according to claim 22, wherein: The transmission chain loop passes through at least one placement position group, the placement position group includes a plurality of placement positions on a first straight line, The chips are placed at the placement positions in the placement position group at the same time.

24. The chip transfer method according to claim 23, wherein: The chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip, the first light-emitting chip has the same light-emitting color, The chip transfer method further includes transferring the first light-emitting chips from a first initial substrate to a first target substrate so that the first light-emitting chips are periodically arranged along a first direction on the first target substrate. The first straight line extends along the first direction, The distance between two adjacent placement positions in the placement position group is equal to an integral multiple of the first light-emitting chip arrangement period.

25. The chip transfer method according to claim 23, wherein: The transmission chain loop passes through at least one pick-up position group, and the pick-up position group includes a plurality of pick-up positions located on a second straight line.

26. The chip transfer method according to claim 25, wherein: The chip transfer method further includes transferring the chips from a first initial substrate to a first target substrate, the chips being periodically arranged along a second direction on the first initial substrate; The second straight line extends along the second direction; The distance between two adjacent picking positions in the picking position group is equal to an integral multiple of the chip arrangement period.

27. The chip transfer method according to claim 22, wherein: The chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip and a second light-emitting chip, the first light-emitting chip and the second light-emitting chip have different light-emitting colors, The chip transfer method further includes transferring the first light-emitting chip from a first initial substrate to a first target substrate, transferring the second light-emitting chip from a second initial substrate to the first target substrate, The first initial substrate is carried in a first carrying area, the second initial substrate is carried in a second carrying area, and the first target substrate is carried in the first target carrying area. A portion of the plurality of pick-up positions is located in the first carrying area, a portion of the plurality of pick-up positions is located in the second carrying area, and the one or more placement positions are located in the first target carrying area, The chip transfer method further includes using the transmission chain loop to drive the plurality of pick-up parts to sequentially pass through the first bearing area, the second bearing area and the first target bearing area.

28. The chip transfer method according to claim 27, wherein: The light-emitting chip further includes a third light-emitting chip, and the first light-emitting chip, the second light-emitting chip and the third light-emitting chip have different light-emitting colors. The chip transfer method further includes transferring the third light emitting chip from the third initial substrate to the first target substrate, The third initial substrate is carried in a third carrying area, and a part of the plurality of picking positions is located in the third carrying area. The chip transfer method further includes using the transmission chain loop to drive the plurality of pick-up parts to sequentially pass through the first bearing area, the second bearing area, the third bearing area and the first target bearing area.

29. The chip transfer method according to claim 22, wherein: The chip includes a light-emitting chip as a sub-pixel of a display device, the light-emitting chip includes a first light-emitting chip and a second light-emitting chip, the first light-emitting chip and the second light-emitting chip have the same light-emitting color, The chip transfer method further includes transferring the first light-emitting chip from a first initial substrate to a first target substrate, transferring the second light-emitting chip from a second initial substrate to the first target substrate, The first initial substrate is carried in a first carrying area, the second initial substrate is carried in a second carrying area, and the first target substrate is carried in a first target carrying area. A portion of the plurality of pick-up positions is located in the first carrying area, a portion of the plurality of pick-up positions is located in the second carrying area, and the one or more placement positions are located in the first target carrying area, The chip transfer method further includes using the transmission chain loop to drive the plurality of pick-up parts to sequentially pass through the first bearing area, the second bearing area and the first target bearing area.

30. The chip transfer method according to claim 22, wherein: The chip transfer method further includes transferring the first chip from the fourth initial substrate to the second target substrate, transferring the second chip from the fifth initial substrate to the third target substrate, The fourth initial substrate is carried in the fourth carrying area, the fifth initial substrate is carried in the fifth carrying area, and the second target substrate is carried in the first target carrying area. A portion of the plurality of pick-up positions is located in the fourth carrying area, and a portion of the plurality of pick-up positions is located in the fifth carrying area, A portion of the plurality of placement positions is located in the second target bearing area, and a portion of the plurality of placement positions is located in the third target bearing area. in, The chip transfer method also includes driving the multiple picking parts to pass through the fourth carrying area, the fifth carrying area, the second target carrying area and the third target carrying area in sequence, or passing through the fourth carrying area, the second target carrying area, the fifth carrying area and the third target carrying area in sequence.

31. The chip transfer method according to any one of claims 22 to 30, wherein: After the picking-up part reaches the picking-up position, a positioner is used to fix the position of the picking-up part; Using an automatic optical inspection machine to align the chip to the position of the pickup portion, and Pick up the chip, and After the picking-up part reaches the placement position, a positioner is used to fix the position of the picking-up part; Using an automatic optical inspection machine to align a placement target with the position of the pick-up portion; as well as A chip is placed on the placement target.

32. The chip transfer method according to claim 31, wherein: Picking up the chip includes applying negative pressure to the pickup portion to suck the chip, and Placing the chip includes contacting the chip with the solder paste and canceling the negative pressure.

33. The chip transfer method according to any one of claims 22 to 32, wherein: The drive gear drives the transmission chain loop in steps.

34. The chip transfer method according to any one of claims 22 to 33, wherein: The chip is a wafer or includes a wafer.

35. A magnetic crystal bonding pen, comprising: Tubular pen holder, A cylindrical pen core in the tubular pen barrel, the cylindrical pen core having a first end, a second end and a side wall extending between the first end and the second end, in, The cylindrical pen core comprises: a first magnetic component, the first magnetic component being a permanent magnetic component or comprising a metal that can be attracted by a magnet; The suction nozzle at the first end, Pipe connections on the side walls, and An air passage extending inside the side wall and communicating with the suction nozzle and the pipeline interface.

36. The magnetic crystal bonding pen according to claim 35, further comprising a convex structure or a concave structure at the second end, preferably a truncated cone convex structure or a concave structure.

37. The magnetic crystal bonding pen according to claim 35, further comprising: A return spring forms an axial connection between the tubular pen barrel and the cylindrical pen core.

38. The magnetic crystal bonding pen according to claim 35, wherein: The side wall of the tubular pen barrel has a groove extending in the axial direction. The pipeline interface passes through the groove to the outside of the tubular pen barrel.

39. The magnetic crystal bonding pen according to claim 38, wherein: A solenoid valve is arranged at the pipeline interface outside the tubular pen holder.

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