Electronic component

Abstract

An electronic component mounted on a vehicle is provided with: a printed circuit board on which a plurality of electronic components are mounted; a capacitor which is one of the electronic components and is longer in a longitudinal direction perpendicular to a surface direction of the printed circuit board than in a lateral direction perpendicular to the surface direction of the printed circuit board in a state where the capacitor is mounted on the printed circuit board; and a pedestal that is interposed between the capacitor and the printed circuit board and that supports the capacitor. Furthermore, the capacitor and the pedestal are bonded by an adhesive on the outer peripheral surface of the capacitor and the inner peripheral surface of the pedestal, said outer peripheral surface being perpendicular to the surface of the printed circuit board.

Description

Technical Field

[0001] The invention relates to an electronic component mounted on a vehicle. Background Art

[0002] JP2000-100651A discloses an electrode plate for use in an inverter circuit or the like, in which capacitors are more firmly connected by projection welding the terminals of the capacitors to the plate electrodes than by connection with solder or screws.

[0003] One or more capacitors are used as needed in vehicle-mounted electronic components, and such electronic components are inevitably affected by vibrations generated by rotating electric machines and the like in the vehicle and vibrations generated by the road surface on which the vehicle is traveling.

[0004] In particular, capacitors, which are electronic components that are relatively long and high protruding from the printed circuit board, may break at the lead portion where the main body is electrically connected to the printed circuit board due to the above-mentioned vibration. Such capacitors may break at the base end of the lead portion (the end connected to the main body) or the connection portion with the printed circuit board, where stress is easily concentrated due to the vibration of the main body. Therefore, even if the front end of the lead portion is soldered to the printed circuit board, the capacitor may break.

[0005] In addition, in a capacitor module that includes a plurality of capacitors such as a smoothing capacitor to form a large-capacity capacitor, even if each capacitor can be projected onto an electrode plate, it is difficult to generally provide a structure for projecting the capacitors mounted on a printed circuit board. Therefore, in an electronic component in which a capacitor is mounted on a printed circuit board, the capacitor is prone to fracture due to vibration. Summary of the invention

[0006] An object of the present invention is to provide an electronic component in which a capacitor is unlikely to be broken by vibrations generated by a rotating electric machine, a road surface, or the like.

[0007] One embodiment of the present invention is an electronic component mounted on a vehicle. The electronic component comprises: a printed circuit board on which a plurality of electronic components are mounted; a capacitor, which is one of the electronic components and is longer in the longitudinal direction perpendicular to the surface of the printed circuit board than in the lateral direction of the surface of the printed circuit board when mounted on the printed circuit board; and a pedestal, which is interposed between the capacitor and the printed circuit board and supports the capacitor. Furthermore, the capacitor and the pedestal are bonded by an adhesive on the outer peripheral surface of the capacitor perpendicular to the surface of the printed circuit board and the inner peripheral surface of the pedestal. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is an explanatory diagram showing a schematic structure of an electric vehicle.

[0009] Figure 2It is a perspective view of the appearance of the first driving unit.

[0010] Figure 3 This is an explanatory diagram showing the structure of an electronic circuit.

[0011] Figure 4 This is a perspective view showing the structure of a typical pedestal.

[0012] Figure 5 It is an explanatory diagram showing the relationship between the bonding portions of the adjacent electronic components and capacitors and the base.

[0013] Figure 6 is a cross-sectional view of the first driving unit showing the positional relationship between the connection point and the capacitor. DETAILED DESCRIPTION

[0014] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0015] Figure 1 1 is an explanatory diagram showing a schematic structure of an electric vehicle 100. Figure 1 As shown, the vehicle exemplified in the present embodiment is an electric vehicle 100 , which includes a battery unit 10 , a first drive unit 11 , and a second drive unit 12 .

[0016] In the following, the front-to-back direction of the electric vehicle 100 is set as the X direction, the lateral direction is set as the Y direction, and the up-down direction (height direction) is set as the Z direction. More specifically, the positive side in the X direction is the front of the electric vehicle 100, and the negative side in the X direction is the rear of the electric vehicle 100. The positive side in the Y direction is the left side of the electric vehicle 100, and the negative side in the Y direction is the right side of the electric vehicle 100. The positive side in the Z direction is the top of the electric vehicle 100, and the negative side in the Z direction is the bottom of the electric vehicle 100. In addition, in principle, the XY plane is a horizontal plane, and the Z direction is a vertical direction. In this embodiment, for simplicity, the inclination of the road surface is not considered. Therefore, any direction in the horizontal plane (XY plane) is a horizontal direction (road surface direction). Moreover, the positive side in the Z direction is vertically above, and the negative side in the Z direction is vertically below.

[0017] The battery unit 10 includes one or more batteries for storing electric power for driving the electric vehicle 100. In the present embodiment, the electric vehicle 100 includes two drive units, namely a first drive unit 11 and a second drive unit 12, and therefore the battery unit 10 supplies electric power to each of these drive units. In the present embodiment, the battery unit 10 is generally arranged under the floor of the vehicle compartment 13.

[0018] The first drive unit 11 is a drive unit integrally constituted by a motor 14, a speed reducer 15, and an inverter 16 as an electronic component, and drives the rear wheels 60 of the electric vehicle 100 using the power supplied from the battery unit 10 (see Figure 6). In the present embodiment, the first drive unit 11 is generally arranged under the bottom plate of the load chamber 17. Therefore, in order to make the load chamber 17 as wide as possible, in the first drive unit 11, the inverter 16 is installed on the motor 14 in a tilted manner forward (positive side in the X direction) with the horizontal direction as a reference. In addition, the speed reducer 15 can be omitted. That is, the first drive unit 11 can be composed of the motor 14 and the inverter 16.

[0019] As is generally done, the first drive unit 11 is fixed to the suspension member via a mounting bracket including an elastic bushing (neither of which is shown in the figure). In the case where vibration is generated by the road surface on which the electric vehicle 100 travels, the vibration is attenuated by these structures and transmitted (input) to the first drive unit 11. The electric vehicle 100 vibrates substantially in the up-and-down direction due to the road surface, so hereinafter, the vibration generated by the road surface is referred to as up-and-down vibration.

[0020] The second drive unit 12 is a drive unit integrally composed of a motor 18, a speed reducer 19, and an inverter 20 as an electronic component, and uses the power supplied from the battery unit 10 to drive the front wheels (not shown) of the electric vehicle 100. In this embodiment, the second drive unit 12 is arranged in a so-called motor room 21. Therefore, the second drive unit 12 is arranged approximately horizontally on the motor 18 and the speed reducer 19. In addition, the speed reducer 19 can be omitted. That is, the second drive unit 12 can be composed of the motor 18 and the inverter 20.

[0021] The second drive unit 12 is fixed to the suspension member via a mounting bracket including an elastic bushing (neither is shown) similarly to the first drive unit 11 . Therefore, the vertical vibration generated by the road surface is attenuated by these structures and transmitted (input) to the second drive unit 12 .

[0022] Figure 2 is a perspective view of the appearance of the first drive unit 11. Figure 2 As shown, the inverter 16 is fixed to the motor 14 at four connection points, namely, a first connection point 22A, a second connection point 22B, a third connection point 22C, and a fourth connection point 22D. Among these connection points, the first connection point 22A and the second connection point 22B are upper connection points located relatively upward, and the third connection point 22C and the fourth connection point 22D are relatively lower connection points.

[0023] In the present embodiment, the first connection point 22A and the second connection point 22B as the upper connection points are set at approximately the same position (height) in the vertical direction. That is, the first connection point 22A and the second connection point 22B are arranged in a row along the horizontal direction (Y direction). Similarly, the third connection point 22C and the fourth connection point 22D as the lower connection points are set at approximately the same position (height) in the vertical direction. That is, the third connection point 22C and the fourth connection point 22D are arranged in a row along the horizontal direction (Y direction). However, the third connection point 22C and the fourth connection point 22D are located further forward (positive side in the X direction) than the first connection point 22A and the second connection point 22B.

[0024] The inverter 16 includes one or more capacitors 32 (see Figure 3 ) of the electronic circuit 23. As is usually done, the electronic circuit 23 is mounted on the housing of the inverter 16 via a vibration-proof material (not shown). Therefore, the up and down vibration caused by the road surface and the vibration generated by the motor 14 (hereinafter referred to as rotational vibration) are attenuated by the vibration-proof material and transmitted (input) to the capacitor 32. In addition, the up and down vibration and the rotational vibration are transmitted from each connection point of the inverter 16 to the capacitor 32. However, in this embodiment, the electronic circuit 23 is particularly provided in the vicinity of the third connection point 22C. Therefore, the up and down vibration and the rotation start are transmitted roughly from the third connection point 22C.

[0025] Figure 3 2 is an explanatory diagram showing the structure of the electronic circuit 23. Figure 3 As shown in FIG. 1 , the electronic circuit 23 is composed of a printed circuit board 31 and electronic components mounted on the printed circuit board 31. That is, the printed circuit board 31 on which the electronic components are mounted is the electronic circuit 23. The electronic components mounted on the printed circuit board 31 are, for example, an IC (Integrated Circuit) chip (not shown), a capacitor 32, a coil 55 (see FIG. 1 ), and a capacitor 32. Figure 5 ), and a connector (not shown) for connecting the electronic circuit 23 to an external circuit, etc. In the present embodiment, the electronic circuit 23 is a structure in which at least a capacitor 32 is mounted on a printed circuit board 31 as an electronic component.

[0026] The printed circuit board 31 is a flat substrate having a wiring pattern formed on one or more layers. In the present embodiment, the printed circuit board 31 is a so-called rigid substrate formed using an insulator base material that is not flexible. However, the printed circuit board 31 may be fully or partially flexible.

[0027] Hereinafter, an arbitrary direction parallel to the surface of the printed substrate 31 is referred to as a first direction La1, and a direction perpendicular to the first direction La1 is referred to as a second direction La2. A direction perpendicular to the first direction La1 and the second direction La2 (the surface of the printed substrate 31) is referred to as a third direction Lo. The surface of the printed substrate 31 is, for example, a surface on which electronic components such as a capacitor 32 are mounted.

[0028] With respect to electronic components, the lateral direction refers to a direction parallel to the surface of the printed substrate 31, such as the first direction La1 or the second direction La2. The width of the electronic component refers to the length in the lateral direction. With respect to electronic components, the longitudinal direction refers to the third direction Lo perpendicular to the surface of the printed substrate 31. The height of the electronic component refers to the length in the longitudinal direction. The upper surface of the electronic component refers to the surface on the positive side in the third direction Lo. The lower surface of the electronic component refers to the surface on the negative side in the third direction Lo. The side surface of the electronic component refers to the surface connecting the upper surface and the lower surface. The side surface of the electronic component is formed, for example, by a surface parallel to the third direction Lo (a surface perpendicular to the surface of the printed substrate 31).

[0029] The capacitor 32 is one of the electronic components mounted on the printed circuit board 31. In the present embodiment, the capacitor 32 is mounted on the printed circuit board 31, and is longer in the longitudinal direction (third direction Lo) perpendicular to the surface of the printed circuit board 31 than in the lateral direction (for example, first direction La1) parallel to the surface of the printed circuit board 31. That is, in the present embodiment, the capacitor 32 is an electronic component with a relatively high vertical shape as a whole.

[0030] Capacitor 32 is, for example, a wet electrolytic capacitor. However, capacitor 32 may be a capacitor of another type as long as it is formed in a vertically elongated shape. Capacitor 32 includes a main body portion 33 and a lead portion 34 .

[0031] The main body 33 is a part that accommodates the cathode, the anode, and the electrolyte, and is generally formed in a vertically long cylindrical shape. Specifically, the height H of the main body 33 is B Than its width W B As a result, the capacitor 32 as a whole becomes an electronic component that is longer in the longitudinal direction than in the lateral direction, that is, an electronic component with a high height. In addition, the side surface forming the outer periphery of the main body 33 (hereinafter referred to as the outer peripheral surface 35 of the capacitor 32) is formed by a substantially cylindrical curved surface.

[0032] The main body 33 has an explosion-proof valve 36. The explosion-proof valve 36 is a structure for releasing the gas generated inside the main body 33 to prevent the capacitor 32 from exploding. In this embodiment, a sealing portion 37 for sealing the electrolyte or the like as the content of the main body 33 is formed at the end portion on the printed circuit board 31 side, that is, at the lower portion of the main body 33, and the explosion-proof valve 36 is formed on the sealing portion 37. However, the explosion-proof valve 36 may be formed on the upper surface of the main body 33.

[0033] The lead portion 34 is connected to the cathode or anode of the main body portion 33, is an electrode protruding from the main body portion 33, and is a portion electrically connected to the wiring pattern of the printed substrate 31. In the present embodiment, the lead portion 34 is bent into an L-shape and extended from the main body portion 33, and is electrically connected to the wiring pattern of the printed substrate 31 by solder or welding at a portion parallel to the surface of the printed substrate 31 after the bend.

[0034] The capacitor 32 is connected to the printed circuit board 31 via the pedestal 38. The pedestal 38 is interposed between the capacitor 32 and the printed circuit board 31, and supports the capacitor 32. In particular, the pedestal 38 supports the outer peripheral surface 35 of the capacitor 32 in part or in its entirety. Thus, the pedestal 38 restricts the tilt of the capacitor 32 (particularly the main body 33). For example, when vertical vibration and rotational vibration are transmitted to the printed circuit board 31, the pedestal 38 suppresses the relative shaking (vibration) of the capacitor 32 with respect to the printed circuit board 31. That is, the pedestal 38 is a vibration-proof component for the capacitor 32, and large shaking caused by vertical vibration and rotational vibration is suppressed by the pedestal 38 in principle.

[0035] The pedestal 38 has a through hole that allows the lead portion 34 to pass through to the printed circuit board 31. The portion of the lead portion 34 exposed through the through hole is connected to the wiring pattern of the printed circuit board 31. In addition, the pedestal 38 is integrated with the capacitor 32 and the printed circuit board 31 at least when the capacitor 32 is mounted on the printed circuit board 31. However, the pedestal 38 may be integrated with the capacitor 32 or the printed circuit board 31 from the beginning.

[0036] Furthermore, in the present embodiment, the adhesive 40 is applied or filled at least between the outer peripheral surface 35 of the capacitor 32 perpendicular to the surface of the printed circuit board 31 and the inner peripheral surface 39 of the pedestal 38 perpendicular to the surface of the printed circuit board 31. That is, the capacitor 32 and the pedestal 38 are bonded to each other by the adhesive 40 at the outer peripheral surface 35 of the capacitor 32 and the inner peripheral surface 39 of the pedestal 38. Thus, compared with the case where the capacitor 32 is supported by the pedestal 38 without using the adhesive 40, the shaking (vibration) of the capacitor 32 can be suppressed more firmly and reliably. As a result, the base end of the lead portion 34 (the connection end with the main body 33) and the connection portion with the printed circuit board 31, which are parts where stress is easily concentrated due to shaking (vibration) of the main body 33, are particularly reliably prevented from being broken.

[0037] However, not all but a part of the outer peripheral surface 35 of the capacitor 32 is bonded to the base 38. Therefore, the explosion-proof valve 36 and the path of the gas leaking from the explosion-proof valve 36 are not completely sealed. Figure 3 As shown, in this embodiment, the right side of the capacitor 32 in the outer peripheral surface 35 is bonded to the base 38 by the adhesive 40, but the left side is not coated with the adhesive 40 and is open. In addition, when the explosion-proof valve 36 is formed on the upper surface of the main body 33, or when the capacitor 32 does not have the explosion-proof valve 36 due to the nature of the capacitor 32, the outer peripheral surface 35 of the capacitor 32 is entirely bonded to the base 38.

[0038] exist Figure 3 In the embodiment, the adhesive 40 for bonding the capacitor 32 and the pedestal 38 is filled in the entire range where the outer circumference 35 of the capacitor 32 and the inner circumference 39 of the pedestal 38 are opposite to each other. However, it is sufficient that the adhesive 40 for bonding the capacitor 32 and the pedestal 38 is filled in at least a part of the range where the outer circumference 35 of the capacitor 32 and the inner circumference 39 of the pedestal 38 are opposite to each other.

[0039] In addition, if Figure 3 As shown, the adhesive 40 for bonding the capacitor 32 and the pedestal 38 is not only filled in the space formed between the capacitor 32 and the pedestal 38, but also applied to a position higher than the pedestal 38 in the longitudinal direction. That is, the adhesive 40 is applied to a position higher than the upper surface 41 of the pedestal 38 along the outer peripheral surface 35 of the capacitor 32. As a result, the supporting performance of the pedestal 38 for the capacitor 32 is particularly improved, and the shaking (vibration) of the capacitor 32 is suppressed more firmly and reliably.

[0040] The above condition about the coating height of the adhesive 40 can also be said to be a condition that the contact area S2 between the capacitor 32 and the adhesive 40 is larger than the contact area S1 between the base 38 and the adhesive 40. That is, the adhesive 40 is preferably applied in a manner that overflows from the base 38. The contact area S2 between the capacitor 32 and the adhesive 40 is larger than the contact area S1 between the base 38 and the adhesive 40. When the adhesive 40 overflows from the base 48, the base 38 becomes a state in which the overflowing adhesive 40 is substantially extended. As a result, the supporting performance of the base 38 for the capacitor 32 is particularly improved, and the shaking (vibration) of the capacitor 32 is firmly and reliably suppressed. Therefore, in the present embodiment, as described above, the adhesive 40 is overflowed from the base 38 in the longitudinal direction (third direction Lo), but the adhesive 40 may also be overflowed in the lateral direction (first direction La1 or second direction La2). Of course, the adhesive 40 may overflow in both the longitudinal and lateral directions to make the contact area S2 between the capacitor 32 and the adhesive 40 larger than the contact area S1 between the base 38 and the adhesive 40. Figure 3As shown, adhesive 40 for bonding capacitor 32 and base 38 is applied in a manner that overflows from base 38 in the longitudinal direction.

[0041] The adhesive 40 is made of any material. For example, a potting agent or a coating agent 42 of the printed substrate 31 can be used as the adhesive 40. The coating agent of the printed substrate 31 forms an insulating film for preventing moisture and foreign matter from adhering. In the present embodiment, the coating agent 42 of the printed substrate 31 is used as the adhesive 40.

[0042] Figure 4 3 is a perspective view showing the structure of a typical pedestal 38. Figure 4 As shown, the pedestal 38 has a substantially square bottom surface, and a first columnar portion 51a, a second columnar portion 51b, a third columnar portion 51c, and a fourth columnar portion 51d extending in the longitudinal direction of the capacitor 32 are provided at its four corners. In the present embodiment, each columnar portion 51a to 51d has the same height, but its height is lower than the height of the capacitor 32. That is, the pedestal 38 supports the capacitor 32 in a part of the longitudinal direction through each of these columnar portions 51a to 51d. In addition, in the pedestal 38 of this shape, the portion (hereinafter referred to as the adhesive portion) that can be filled or applied with the adhesive 40 in principle is one or more portions of the portions corresponding to each of the columnar portions 51a to 51d. When the adhesive 40 is applied in a manner that overflows from the base 38 in the longitudinal direction, the adhesive 40 can be applied to one or more parts of the first adhesive portion 52a corresponding to the first columnar portion 51a, the second adhesive portion 52b corresponding to the second columnar portion 51b, the third adhesive portion 52c corresponding to the third columnar portion 51c, and the fourth adhesive portion 52d corresponding to the fourth columnar portion 51d.

[0043] Figure 5 3 is an explanatory diagram of the relationship between adjacent electronic components and the bonding portion between the capacitor 32 and the pedestal 38. Figure 5 As shown, the coil 55 and the capacitor 32 are arranged adjacent to each other on the printed circuit board 31 .

[0044] If the coil 55 is adhered with the coating agent 42 or the adhesive 40, it may not be able to exert the expected normal performance or function due to expansion and contraction caused by the applied current. Therefore, the coil 55 is generally an electronic component that is prohibited from being coated with the coating agent 42 or the like. Therefore, in the case where the coil 55 is configured adjacent to the capacitor 32, the adhesive 40 is selectively applied to the portion on the opposite side relative to the coil 55. Specifically, on the printed circuit board 31, when the coil 55 is installed adjacent to the capacitor 32, the capacitor 32 and the base 38 are not bonded on the side of the outer peripheral surface 35 facing the coil 55, and the capacitor 32 and the base 38 are bonded on the side of the outer peripheral surface 35 not facing the coil 55. Figure 5In the embodiment, the adhesive 40 etc. is not applied to the second adhesive portion 52b and the third adhesive portion 52c relatively close to the coil 55 among the adhesive portions 52a to 52d, but the adhesive 40 etc. is applied to the first adhesive portion 52a and the fourth adhesive portion 52d relatively far from the coil 55.

[0045] The bonding portion to which the adhesive 40 or the like should be applied is selected, for example, as follows. Figure 5 As shown, on the surface of the printed substrate 31, a line connecting the center C1 of the capacitor 32 and the center C2 of the coil 55 is set as the center line CL. In this case, a straight line (hereinafter referred to as a dividing line DL) passing through the center C1 of the capacitor 32 and perpendicular to the center line CL divides the capacitor 32 into a first area A1 away from the coil 55 and a second area A2 close to the coil 55. Therefore, an adhesive 40 or the like is applied to the first adhesive portion 52a and the fourth adhesive portion 52d belonging to the first area A1 away from the coil 55. Thus, the performance and function of the coil 55 are not impaired, and the capacitor 32 can be prevented from being broken.

[0046] in addition, Figure 5 In the figure, the coil 55 is shown as a representative of the electronic components to which the adhesive 40 (coating agent 42) is prohibited from being attached, but the invention is not limited to this. When an electronic component such as a connector that connects the electronic circuit 23 to an external circuit, etc., which must ensure electrical conductivity, is arranged adjacent to the capacitor 32, the adhesive 40 is selectively applied to the portion on the opposite side of the electronic component in the same manner as described above. That is, in order to ensure the function and performance, when an electronic component to which the adhesive 40 is prohibited from being attached is arranged adjacent to the capacitor 32, the portion to which the adhesive 40 is applied is selected in the same manner as described above so that the adhesive 40 does not adhere to the electronic component.

[0047] Figure 6 FIG. 2 is a cross-sectional view of the first drive unit 11 showing the positional relationship between the third connection point 22C and the capacitor 32. Figure 6 In FIG. 2 , the third connection point 22C is indicated by a star mark. Figure 6 As shown, when the inverter 16 is arranged tilted relative to the horizontal direction, the capacitor 32 bonded to the pedestal 38 is preferably arranged on the vertical line VL or as close to the vertical line VL as possible in the transverse cross section (XZ cross section perpendicular to the Y direction) of the electric vehicle 100. The vertical line VL is a straight line parallel to the vertical direction (Z direction) passing through the third connection point 22C which is the starting point for transmitting the vertical vibration and the rotational vibration to the electronic circuit 23.

[0048] In this way, when the capacitor 32 is arranged on the vertical line VL of the third connection point 22C, which is the starting point of transmission of vibration, the moment generated in the capacitor 32 due to the up-and-down vibration caused by the road surface is minimized. Therefore, when the capacitor 32 is located on the vertical line VL of the third connection point 22C, the capacitor 32 is at least least susceptible to the shaking of the up-and-down vibration caused by the road surface. As a result, it is possible to particularly reliably prevent the breakage of the parts where stress is easily concentrated due to the shaking (vibration) of the main body 33, such as the base end of the lead part 34 (the connection end with the main body 33) and the connection part with the printed circuit board 31.

[0049] The same is true for the case where vibration is transmitted from other connection points of the inverter 16 to the electronic circuit 23. For example, when vibration is mainly transmitted from the second connection point 22B to the electronic circuit 23, the capacitor 32 bonded to the base 38 is preferably arranged on the vertical line VL passing through the second connection point 22B or as close to it as possible.

[0050] However, since vertical vibration is input from the bottom (road surface) of the electric vehicle 100, when there are multiple connection points, the capacitor 32 bonded to the pedestal 38 is preferably located vertically above the connection point located vertically below among the connection points. Figure 6 As shown, it is particularly preferred that the capacitor 32 bonded to the base 38 is located vertically above the third connection point 22C serving as the lower connection point.

[0051] In the above embodiment, the structure of the capacitor 32 included in the inverter 16 of the first drive unit 11 is described, but the structure of the capacitor 32 in the above embodiment is also suitable for the capacitor included in the inverter 20 of the second drive unit 12. That is, in the inverter 20 arranged substantially horizontally (parallel to the road surface), it is also preferable to use the capacitor 32 bonded to the pedestal 38 on the outer peripheral surface 35. In this case, the lead portion 34 of the capacitor 32 is also less likely to break due to vertical vibration and rotational vibration.

[0052] In the above embodiment, an example in which the capacitor 32 bonded to the outer peripheral surface 35 and the base 38 is used to drive the inverter 16 of the motor 14 is described, but the present invention is not limited to this. For example, the capacitor 32 bonded to the outer peripheral surface 35 and the base 38 is also applicable to electronic components other than the inverter 16. In addition, the electric vehicle 100 sometimes has a generator in addition to the motor 14. The capacitor 32 bonded to the outer peripheral surface 35 and the base 38 is also suitable for driving an inverter of such a generator. That is, the capacitor 32 bonded to the outer peripheral surface 35 and the base 38 can be used to drive the motor 14 or the inverter of the rotating electric machine as a generator.

[0053] As described above, the electronic component (inverter 16) of the present embodiment is an electronic component mounted on a vehicle (electric vehicle 100). The electronic component includes: a printed circuit board 31 on which a plurality of electronic components are mounted; a capacitor 32, which is one of the electronic components and is longer in a longitudinal direction perpendicular to the surface of the printed circuit board 31 than in a transverse direction parallel to the surface of the printed circuit board 31 when mounted on the printed circuit board 31; and a pedestal 38, which is interposed between the capacitor 32 and the printed circuit board 31 and supports the capacitor 32. The capacitor 32 and the pedestal 38 are bonded to each other by an adhesive 40 at an outer peripheral surface 35 of the capacitor 32 perpendicular to the surface of the printed circuit board 31 and an inner peripheral surface 39 of the pedestal 38.

[0054] In the electronic components such as the inverter 16 mounted on the electric vehicle 100, when up-and-down vibration or rotational vibration is input, the capacitor 32 with a high height will shake, and its lead portion 34 may break. Therefore, the capacitor 32 with a high height is usually mounted on a base 38 to suppress vibration. However, depending on the installation position of the capacitor 32, even if the main body 33 is supported by the base 38, there is a possibility that the lead portion 34 will break due to the shaking of the capacitor 32. Therefore, the capacitor 32 and the base 38 are bonded as described above using an adhesive 40. As a result, even if up-and-down vibration and rotational vibration are input, the capacitor 32 can be more reliably prevented from breaking.

[0055] In the electronic component (inverter 16) of the above embodiment, at least a portion of the printed substrate 31 is coated with a coating agent 42, and the coating agent 42 is used as the adhesive 40. In this way, when the coating agent 42 of the printed substrate 31 is used as the adhesive 40 for bonding the capacitor 32 and the pedestal 38, when the coating agent 42 is applied to the printed substrate 31, the capacitor 32 and the pedestal 38 can be bonded together. Therefore, the shaking and breaking of the capacitor 32 can be easily and reliably prevented. In addition, by using the coating agent 42 as the adhesive 40, there is also an auxiliary effect of being able to achieve the shaking and breaking of the capacitor 32 at a low cost.

[0056] In the electronic component (inverter 16) of the above embodiment, the capacitor 32 is bonded to the pedestal 38 at a portion of the outer peripheral surface 35. In this way, by bonding not the entire outer peripheral surface 35 of the capacitor 32 and the inner peripheral surface 39 of the pedestal 38 but a portion thereof, the explosion-proof valve 36 of the capacitor 32 is not blocked, and the path of the gas leaking from the explosion-proof valve 36 in an emergency is ensured. Therefore, while maintaining the safety function, the capacitor 32 is prevented from shaking and breaking.

[0057] In the electronic component (inverter 16) of the above embodiment, other electronic components (coil 55 or connector) that are different from capacitor 32 are mounted adjacent to capacitor 32 on printed circuit board 31. Furthermore, capacitor 32 and pedestal 38 are not bonded to each other on the side of outer peripheral surface 35 that faces other electronic components (coil 55 or connector), and capacitor 32 and pedestal 38 are bonded to each other on the side of outer peripheral surface 35 that does not face other electronic components (coil or connector).

[0058] In the electronic component (converter 16) of the above-mentioned embodiment, the pedestal 38 supports the capacitor 32 in a part of the longitudinal direction. Furthermore, the adhesive 40 is filled in the space formed between the capacitor 32 and the pedestal 38, and is applied to a position higher than the pedestal 38 in the longitudinal direction. In this way, by applying the adhesive 40 in a manner overflowing from the pedestal 38, the pedestal 38 is substantially extended by the overflowing adhesive 40. As a result, the supporting performance of the pedestal 38 for the capacitor 32 can be particularly improved, and the shaking and breaking of the capacitor 32 can be further reliably suppressed.

[0059] In the electronic component (inverter 16) of the above embodiment, the contact area S2 between the capacitor 32 and the adhesive 40 is larger than the contact area S1 between the pedestal 38 and the adhesive 40. Thus, by making the contact area S2 between the capacitor 32 and the adhesive 40 larger than the contact area S1 between the pedestal 38 and the adhesive 40, the pedestal 38 is actually extended by the overflowing adhesive 40. As a result, the supporting performance of the pedestal 38 for the capacitor 32 can be particularly improved, and the shaking and breaking of the capacitor 32 can be further reliably suppressed.

[0060] In the electronic component (converter 16) of the above embodiment, the pedestal 38 has a plurality of columnar portions (51a to 51d) for supporting the capacitor 32. Furthermore, the capacitor 32 is bonded to the pedestal 38 at at least one of the columnar portions (51a to 51d). The columnar portions (51a to 51d) of the pedestal 38 are structures for suppressing the shaking of the capacitor 32. Therefore, as described above, by bonding the capacitor 32 and the pedestal 38 at the columnar portions (51a to 51d), the shaking and breaking of the capacitor 32 can be particularly easily and reliably prevented.

[0061] The electronic component of the above-mentioned embodiment is particularly an inverter 16 that constitutes a driving rotating electric machine (motor 14), and the inverter 16 is connected to the rotating electric machine (motor 14) at an angle from the horizontal direction. Moreover, the capacitor 32 is located on the plumb line VL passing through the connection point (22C) of the inverter 16 to the rotating electric machine (motor 14) in the transverse section (XZ section perpendicular to the Y direction) of the vehicle (electric vehicle 100). In this way, when the electronic component (inverter 16) is tilted, when the capacitor 32 bonded to the base 38 is located on the plumb line VL passing through its connection point (22C), the moment generated in the capacitor 32 due to the up and down vibration can be reduced, so the capacitor 32 is least likely to shake due to the up and down vibration. As a result, shaking and breaking of the capacitor 32 can be more reliably prevented.

[0062] In the electronic component (inverter 16) of the above embodiment, when there are a plurality of connection points (22A to 22D), the capacitor 32 is located vertically above the connection point (22C) located vertically below the connection points (22A to 22D). Since vertical vibration is input from below the electric vehicle 100, as described above, by locating the capacitor 32 bonded to the pedestal 38 vertically above the lower connection point (third connection point 22C), it is particularly easy to prevent the capacitor 32 from shaking and breaking due to the vertical vibration.

[0063] The embodiments of the present invention have been described above. However, the configurations described in the above embodiments and the various modifications merely represent some application examples of the present invention and do not limit the technical scope of the present invention.

[0064] For example, the capacitor 32 bonded to the pedestal 38 on the outer peripheral surface 35 is also applicable to vehicles other than the electric vehicle 100, such as a two-wheel drive vehicle or a hybrid vehicle. In addition, in addition to vehicles, the capacitor 32 bonded to the pedestal 38 on the outer peripheral surface 35 is also applicable to electronic components that can input some kind of vibration. In addition, the inverter 16 of the first drive unit 11 is tilted forward and connected to the motor 14, but the tilting direction of the inverter 16 is arbitrary. The inverter 16 is connected to the motor 14, but the inverter 16 can also be connected to the reducer 15 and other rigid bodies. In this way, the structure that is not related to the part of the capacitor 32 can be changed arbitrarily.

Claims

1. An electronic component mounted on a vehicle, wherein: have: a printed circuit board on which a plurality of electronic components are mounted; a capacitor which is one of the electronic components and which, when mounted on the printed circuit board, is longer in a longitudinal direction perpendicular to a surface of the printed circuit board than in a lateral direction parallel to the surface of the printed circuit board; a pedestal, which is interposed between the capacitor and the printed circuit board and supports the capacitor, The capacitor and the mount are bonded to each other by an adhesive at an outer peripheral surface of the capacitor and an inner peripheral surface of the mount that are perpendicular to the surface of the printed circuit board.

2. The electronic component according to claim 1, wherein: At least a portion of the printed substrate is coated with a coating agent, and The coating agent is used as the adhesive.

3. The electronic component according to claim 1, wherein: The capacitor is bonded to the base at a portion of the outer peripheral surface.

4. The electronic component according to claim 3, wherein: On the printed circuit board, the electronic component other than the capacitor, that is, another electronic component, is mounted adjacent to the capacitor. The capacitor and the mount are not bonded to each other on the side of the outer peripheral surface facing the other electronic components, and the capacitor and the mount are bonded to each other on the side of the outer peripheral surface not facing the other electronic components.

5. The electronic component according to claim 1, wherein: The pedestal supports the capacitor in a portion in the longitudinal direction, The adhesive fills a space formed between the capacitor and the pedestal, and is applied to a position higher than the pedestal in the longitudinal direction.

6. The electronic component according to claim 1, wherein: A contact area between the capacitor and the adhesive is larger than a contact area between the base and the adhesive.

7. The electronic component according to claim 1, wherein: The pedestal has a plurality of columnar portions for supporting the capacitor. The capacitor is bonded to the pedestal at at least one of the columnar portions.

8. The electronic component according to claim 1, wherein: The inverter that drives the rotating motor is formed. The inverter is connected to the rotating electric machine at an angle from the horizontal direction. The capacitor is located on a vertical line passing through a connection point of the inverter with respect to the rotating electric machine in a transverse cross section of the vehicle.

9. The electronic component according to claim 8, wherein: When there are a plurality of connection points, the capacitor is located vertically above a connection point located vertically below among the connection points.

Images