Shell, preparation method of shell and electronic equipment
The shell is prepared through a sintering process to form the main part, the reinforcing part and the connecting layer, which solves the problem of low interface strength of the laminated composite shell in the existing technology and achieves high strength and reliability of the shell.
Patent Information
- Application Number
- CN202310855202.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-12
- Publication Date
- 2025-01-14
AI Technical Summary
The prior art stacks composite aluminum alloys and alloys with better strength through forging and pressing. When forming a shell, the interface bonding strength between the superimposed layers is lower and the risk of cracking is greater.
The shell is prepared using a sintering process, and a frame is provided and filled with powder to form a part to be sintered. After sintering, the shell is processed to form the main part, reinforcements and connecting layers to improve the interface bonding strength.
The overall strength of the shell is improved, the risk of cracking and deformation at the interface connection is reduced, and the reliability of the shell is enhanced.
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Figure CN119304190A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of terminal equipment, and in particular to a shell, a method for preparing the shell, and an electronic device. Background Art
[0002] In order to meet the requirements of good appearance and good strength of the housing of electronic equipment, aluminum alloy with good appearance and alloy with good strength are laminated and compounded through forging process, and the housing is prepared using laminated materials. The housing formed in this way has low interface bonding strength between the two superimposed alloy layers and has a high risk of cracking. Summary of the invention
[0003] The present application provides a housing, a method for preparing the housing, and an electronic device.
[0004] In a first aspect, an embodiment of the present application provides a method for preparing a shell. The preparation method comprises:
[0005] A frame is provided. The frame is made of a first metal material, which is an aluminum alloy. The frame has an inner cavity.
[0006] The inner cavity is filled with powder to form a sintered part. The powder adopts a second metal material. The aluminum content in the first metal material is higher than that in the second metal material. The hardness of the second metal material is greater than that of the first metal material.
[0007] The part to be sintered is sintered to form a green body, wherein the green body includes a first part, a second part and a third part, the third part connects the first part and the second part, the first part is formed by a frame, the second part is formed by powder, and the third part is formed by mutual diffusion of a first metal material and a second metal material.
[0008] The blank is processed to form a shell, wherein the shell includes a main body, a first reinforcement and a first connecting layer, the main body is formed by the first part, the reinforcement is formed by the second part, and the first connecting layer is formed by the third part.
[0009] It is understandable that, compared with the traditional material interface bonding process such as riveting, welding and bonding to fix the main body and the first reinforcement, the present application forms an integral structure of the main body and the first reinforcement through a sintering process. The first connection layer includes the material of the main body and the material of the first reinforcement, the interface connection strength between the main body and the first connection layer is better, the interface connection strength between the first reinforcement and the first connection layer is better, the connection reliability between the main body and the first reinforcement is better, the strength of the shell is better, and the interface connection is not easy to crack or deform or detach.
[0010] In one embodiment, the second metal material is an aluminum alloy, a particle-reinforced aluminum-based composite material, or a particle-reinforced magnesium-based composite material.
[0011] In one embodiment, the sintered part is sintered using a hot isostatic pressing process. The pressure P1 of the hot isostatic pressing process satisfies: P1 ≥ 100 MPa. The temperature T1 of the hot isostatic pressing process satisfies: 500° C. ≤ T1 ≤ 660° C. The time t1 of the hot isostatic pressing process satisfies: 2h ≤ t1 ≤ 5h.
[0012] It is understandable that the thickness of the third part changes according to the sintering process and time. The rule is: the longer the sintering time, the thicker the third part. The higher the sintering temperature, the thicker the third part. The greater the sintering pressure, the thicker the third part. At this time, while meeting the interface bonding strength, the sintering process can be accelerated and the energy consumption of the sintering process can be saved.
[0013] In a second aspect, an embodiment of the present application provides a method for preparing a shell. The preparation method comprises:
[0014] A frame is provided. The frame is made of a first metal material, which is an aluminum alloy. The frame has an inner cavity.
[0015] The plate is placed in the inner cavity. The plate is made of a third metal material. The content of aluminum in the first metal material is higher than that in the third metal material. The hardness of the third metal material is greater than that of the first metal material.
[0016] The powder is filled into the inner cavity, and the frame and the plate are connected to form a part to be sintered.
[0017] The part to be sintered is sintered to form a green body.
[0018] The blank is processed to form a shell, wherein the shell includes a main body and a first reinforcement member, the main body is at least formed by a frame, the first reinforcement member is at least formed by a plate, and the first reinforcement member is connected to the main body.
[0019] It is understandable that, compared to the traditional material interface bonding processes such as riveting, welding and bonding to fix the main part and the first reinforcement, the present application uses a sintering process to form the main part and the first reinforcement into an integrated structural part. In this way, the interface connection strength between the main part and the first reinforcement is better, the strength of the shell is better, and the interface connection is not easy to crack or deform or detach. When the melting point of the third metal material is higher than the melting point of the first metal material, that is, the melting point of the material of the first reinforcement is higher than the melting point of the material of the main part, the third metal material can be prepared into a plate in advance, and then the plate and the frame can be connected by powder sintering to form a blank, so as to avoid deformation of the frame due to excessive temperature during the sintering process.
[0020] In one embodiment, the powder material is a first metal material. The blank includes a first part, a second part and a third part, the first part is formed by a frame and powder material, the second part is formed by a plate material, and the third part is formed by mutual diffusion of the first metal material and the third metal material. The shell includes a main body, a first reinforcement and a first connecting layer, the main body is formed by the first part, the first reinforcement is formed by the second part, and the first connecting layer is formed by the third part.
[0021] It is understandable that, compared with the solution in which the first reinforcement is entirely formed by sintering powder, the first reinforcement is pre-prepared as a plate for sintering, which can reduce the amount of powder used, thereby reducing material costs. At the same time, the less amount of powder used can shorten the sintering time, thereby reducing the cost of the preparation process and improving production efficiency. The material used for the powder can be the same as that of the main body.
[0022] In one embodiment, the third metal material is aluminum alloy, particle reinforced aluminum-based composite material, particle reinforced magnesium-based composite material, titanium alloy, stainless steel or amorphous alloy.
[0023] In one embodiment, the powder material adopts a third metal material. The blank comprises a first part, a second part and a third part, the first part is formed by a frame, the second part is formed by a plate material and a powder material, and the third part is formed by mutual diffusion of the first metal material and the third metal material. The shell comprises a main body, a first reinforcement and a first connecting layer, the main body is formed by the first part, the first reinforcement is formed by the second part, and the first connecting layer is formed by the third part.
[0024] It is understandable that the material used for the powder can be the same as that of the first reinforcement, that is, the first reinforcement is partially sintered as powder, and part of it is pre-prepared as a plate. Compared with the solution in which the first reinforcement is entirely sintered as powder, the amount of powder used is less, which can reduce material costs on the one hand, and shorten sintering time on the other hand, thereby reducing preparation process costs and improving production efficiency.
[0025] In one embodiment, the third metal material is an aluminum alloy, a particle-reinforced aluminum-based composite material, or a particle-reinforced magnesium-based composite material.
[0026] In one embodiment, the powder material is made of a fourth metal material, and the fourth metal material is different from the first metal material and the third metal material.
[0027] The blank ingot includes a first part, a second part, a third part, a fourth part and a fifth part, the first part is formed by a frame, the second part is formed by powder, the third part is formed by mutual diffusion of a first metal material and a fourth metal material, the fourth part is formed by a plate, and the fifth part is formed by mutual diffusion of the third metal material and the fourth metal material. The shell includes a main body, a first reinforcement, a first connection layer, a second reinforcement and a second connection layer, the main body is formed by the first part, the first reinforcement is formed by the second part, the first connection layer is formed by the third part, the second reinforcement is formed by the fourth part, and the second connection layer is formed by the fifth part.
[0028] It can be understood that by preparing the material of the first reinforcement member into powder and the second reinforcement member into a plate, two reinforcement materials can be integrated on the plate body of the shell during the sintering process of the billet, and then a shell with three materials of different strengths can be formed in one sintering process. In addition, the size and position of the first reinforcement member and the second reinforcement member can be flexibly adjusted.
[0029] In one embodiment, the third metal material is aluminum alloy, particle-reinforced aluminum-based composite material, titanium alloy, stainless steel or amorphous alloy. And / or, the fourth metal material is aluminum alloy, particle-reinforced aluminum-based composite material or particle-reinforced magnesium-based composite material.
[0030] In one embodiment, the third metal material has a higher melting point than the first metal material.
[0031] It is understandable that when the melting point of the third metal material of the second reinforcement is higher than the melting point of the first metal material of the main body, the fourth metal material of the first reinforcement with a lower melting point can be used as an intermediate connecting member to connect the second reinforcement and the main body. In this way, the problem of deformation of the main body due to excessively high sintering temperature during sintering can be avoided.
[0032] In one embodiment, the part to be sintered is sintered using a hot isostatic pressing process.
[0033] The pressure P1 of the hot isostatic pressing sintering process satisfies: P1 ≥ 100 MPa. The temperature T1 of the hot isostatic pressing sintering process satisfies: 500°C ≤ T1 ≤ 660°C. The time t1 of the hot isostatic pressing sintering process satisfies: 2h ≤ t1 ≤ 5h.
[0034] It is understandable that the thickness of the third part changes according to the sintering process and time. The rule is: the longer the sintering time, the thicker the third part. The higher the sintering temperature, the thicker the third part. The greater the sintering pressure, the thicker the third part. At this time, while meeting the interface bonding strength, the sintering process can be accelerated and the energy consumption of the sintering process can be saved.
[0035] In one embodiment, after the step of "sintering the part to be sintered to form a blank", and before the step of "processing the blank to form a shell", the preparation method further comprises:
[0036] The blank is solution treated.
[0037] Cool the dough to room temperature.
[0038] The blank is subjected to aging treatment.
[0039] It is understood that by performing a solution treatment on the blank, the yield strength and hardness of the part formed by the powder material can be enhanced. By performing an aging treatment on the blank, the hardness of the part formed by the powder material can be further enhanced.
[0040] In one embodiment, the powder material is an aluminum alloy or a particle-reinforced aluminum-based composite material, and the solution temperature T2 of the solution treatment satisfies: 500°C ≤ T2 ≤ 550°C, and the solution time t2 satisfies: 15min ≤ t2 ≤ 60min. And / or, the aging treatment temperature T3 satisfies: 170°C ≤ T3 ≤ 200°C, and the aging time t3 satisfies: 4h ≤ t3 ≤ 24h.
[0041] In one embodiment, the powder material is a particle-reinforced magnesium-based composite material, and the solution temperature T2 of the solution treatment satisfies: 380°C≤T2≤420°C, and the solution time t2 satisfies: 0.5h≤t2≤12h. And / or, the temperature T3 of the aging treatment satisfies: 180°C≤T3≤220°C, and the aging time t3 satisfies: 1h≤t3≤8h.
[0042] It is understandable that, depending on the material type of the powder, different solution treatment process parameters and aging treatment process parameters can be selected to enhance the yield strength and hardness of the part formed by the powder, while making the processing efficiency higher.
[0043] In one embodiment, after the step of "filling the inner cavity of the frame with powder" and before the step of "sintering the part to be sintered", the preparation method further includes: using a cold isostatic pressing process to press the powder into a green compact so that the powder forms a block. In this way, the powder can be prevented from scattering and is convenient for taking and placing.
[0044] In one embodiment, the pressure P4 of the cold isostatic pressing process satisfies: P4 ≥ 100 MPa, and the time t4 of the cold isostatic pressing process satisfies: 1 h ≤ t4 ≤ 3 h.
[0045] In a third aspect, an embodiment of the present application provides a shell. The shell is applied to an electronic device. The shell includes a main body, a first reinforcement and a first connection layer, the main body surrounds the first reinforcement, and the first connection layer is fixedly connected between the main body and the first reinforcement. The main body is made of aluminum alloy, the first connection layer includes the material of the main body and the material of the first reinforcement, the aluminum content of the main body is higher than the aluminum content of the first reinforcement, and the hardness of the material of the first reinforcement is greater than the hardness of the material of the main body. Among them, the main body forms the frame and part of the plate body of the shell, and the first reinforcement forms part of the plate body of the shell. Alternatively, the main body forms the frame of the shell, and the first reinforcement forms the plate body of the shell.
[0046] It is understandable that the shell has a better appearance, and the first reinforcement can enhance the overall strength of the shell, and the overall reliability of the shell is better. Compared with the traditional material interface bonding process such as riveting, welding and bonding to fix the main body and the first reinforcement, the main body and the first reinforcement are fixedly connected by the first connection layer, the first connection layer includes the material of the main body and the material of the first reinforcement, the interface connection strength between the main body and the first connection layer is better, the interface connection strength between the first reinforcement and the first connection layer is better, the interface connection strength between the main body and the first reinforcement is better, the overall strength of the shell is better, and the interface connection is not easy to crack or deform or detach.
[0047] In one embodiment, the thickness of the first connection layer is greater than 0.1 μm. And / or, the thickness of the first connection layer is in the range of 2 μm to 30 μm. In this case, the interface bonding strength between the main body and the first reinforcement is better, and the overall strength of the middle frame is better.
[0048] In one embodiment, the hardness of the material of the first reinforcement piece is in the range of 100 HV to 200 HV. In this way, the first reinforcement piece has a better reinforcement effect on the shell.
[0049] In one embodiment, the elastic modulus of the material of the first reinforcement member is greater than the elastic modulus of the material of the main body member, and / or the yield strength of the material of the first reinforcement member is greater than the yield strength of the material of the main body member.
[0050] It is understandable that the yield strength of the material of the first reinforcement member can be greater than the yield strength of the material of the main member, and the plate body of the shell has better resistance to plastic deformation. The elastic modulus of the material of the first reinforcement member is greater than the elastic modulus of the material of the main member, so that the plate body of the shell has better rigidity and better resistance to elastic deformation.
[0051] In one embodiment, the first reinforcement is made of aluminum alloy, particle reinforced aluminum-based composite material, particle reinforced magnesium-based composite material, titanium alloy, stainless steel or amorphous alloy.
[0052] In one embodiment, the shell further includes a back cover, which is made of a metal material that is consistent with the material of the main body, and the plate body of the shell is connected to the inner surface 221 of the back cover.
[0053] In one embodiment, the shell further includes a second reinforcement and a second connection layer, the first reinforcement surrounds the second reinforcement, and the second connection layer is fixedly connected between the first reinforcement and the second reinforcement. The second connection layer includes the material of the main body and the material of the second reinforcement, and the hardness of the material of the second reinforcement is greater than the hardness of the material of the first reinforcement. Wherein, the main body forms the frame and part of the plate body of the shell, and the first reinforcement and the second reinforcement form another part of the plate body of the shell. Alternatively, the main body forms the frame of the shell, and the first reinforcement and the second reinforcement form the plate body of the shell.
[0054] It can be understood that the plate strength of the shell is further enhanced by providing the second reinforcement member, so that the shell has better strength and appearance.
[0055] In one embodiment, the thickness of the second connection layer is greater than 0.1 μm. And / or, the thickness of the second connection layer is in the range of 2 μm to 30 μm. In this case, the interface bonding strength between the first reinforcement and the second reinforcement is better.
[0056] In one embodiment, the second reinforcement member is made of aluminum alloy, particle-reinforced aluminum-based composite material, particle-reinforced magnesium-based composite material, titanium alloy, stainless steel or amorphous alloy.
[0057] In a fourth aspect, an embodiment of the present application provides an electronic device, wherein the electronic device comprises a display screen and a housing, wherein the display screen is mounted on the housing.
[0058] It is understandable that by providing the first reinforcement, the strength of the housing can be increased, and the overall reliability of the housing is better. During a drop test or a drum test, the housing of the electronic device is not easily deformed, and the electronic devices in the internal space of the electronic device are effectively protected. BRIEF DESCRIPTION OF THE DRAWINGS
[0059] In order to illustrate the technical solution of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.
[0060] Figure 1 is an exploded schematic diagram of an implementation manner of an electronic device provided in an embodiment of the present application;
[0061] Figure 2 yes Figure 1 A structural schematic diagram of an implementation mode of the middle frame shown in ;
[0062] Figure 3 yes Figure 2A structural schematic diagram of an implementation of the middle frame shown in FIG. 1 at the section line AA;
[0063] Figure 4 yes Figure 3 Schematic diagram of the variation trend of the component content in the first connection layer shown in ;
[0064] Figure 5 yes Figure 1 A diagram of the steps for preparing an embodiment of a housing shown in FIG.
[0065] Figures 6 to 8 yes Figure 5 The schematic diagram of the corresponding structure in the preparation steps of the shell shown;
[0066] Fig. 9 yes Figure 1 A diagram of the preparation steps of another embodiment of the housing shown in ;
[0067] Figures 10 to 13 yes Fig. 9 The corresponding structural schematic diagram in the preparation steps of the shell shown in ;
[0068] Fig.14 yes Figure 1 A diagram showing the steps for preparing another embodiment of the housing shown in FIG.
[0069] Fig.15 yes Figure 1 A structural schematic diagram of another embodiment of the middle frame shown in ;
[0070] Fig.16 yes Fig.15 A schematic diagram of an assembly of the middle frame and the card holder at the section line BB shown in FIG.
[0071] Fig.17 yes Figure 1 A structural schematic diagram of another embodiment of the middle frame shown in ;
[0072] Fig.18 yes Figure 1 A structural schematic diagram of another embodiment of the middle frame shown in ;
[0073] Fig.19 yes Figure 1 A structural schematic diagram of another embodiment of the middle frame shown in ;
[0074] Fig. 20 yes Figure 1 A diagram showing the steps for preparing another embodiment of the housing shown in FIG.
[0075] Fig.21 is an exploded schematic diagram of another implementation of the electronic device provided in an embodiment of the present application;
[0076] Fig. 22 yes Fig.21 FIG. 4 is a schematic structural diagram of an embodiment of a housing shown in FIG. 1 at section line CC. DETAILED DESCRIPTION
[0077] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.
[0078] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative position relationship after the connection remains unchanged. It should be understood that when component A is fixedly connected to component C through component B, changes in the relative position relationship caused by the deformation of component A, component B and component C itself are allowed. Among them, the two components are integrated into an integrated structure through an integrated molding process, which means that in the process of forming one of the two components, the component is connected to the other component, and there is no need to connect the two components together through reprocessing (such as bonding, welding, snap connection, screw connection).
[0079] The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", "side", etc., are only references to the directions of the drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.
[0080] The term "plurality" means at least two. The term "above" includes the number itself. The term "and / or" is a description of an association relationship between associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. The terms "first", "second", etc. are used only for descriptive purposes and cannot be understood as suggesting or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more of the features.
[0081] Figure 1 It is a schematic diagram of an exploded view of an implementation of an electronic device 1000 provided in an embodiment of the present application.
[0082] The electronic device 1000 may include, but is not limited to, a mobile or fixed terminal having a housing 200, such as a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a wearable device, a virtual reality device, or the like. Figure 1 The electronic device 1000 shown in FIG. 1 is introduced by taking a mobile phone as an example.
[0083] like Figure 1 As shown, the electronic device 1000 may include a display screen 100 and a housing 200. The display screen 100 is mounted on the housing 200. Exemplarily, the housing 200 may include a middle frame 210 and a back cover 220. The middle frame 210 is connected between the back cover 220 and the display screen 100.
[0084] The display screen 100 can be used to display images, videos, etc. The touch sensing function of the display screen 100 is used to sense the user's touch action to achieve human-computer interaction. Exemplarily, the display screen 100 can be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a flexible light-emitting diode (FLED) display screen, a Mini-LED display screen, a Micro-LED display screen, a Micro-OLED display screen, a quantum dot light emitting diode (QLED) display screen, etc.
[0085] The back cover 220 may be made of metal, glass, plastic, or ceramic. The back cover 220 and the middle frame 210 may also be connected by bonding, welding, snap connection, screw connection, or the like.
[0086] In other embodiments, the back cover 220 and the middle frame 210 may be integrally formed structural members. The integrally formed housing 200 will be described below through specific embodiments, and will not be described in detail here.
[0087] Figure 2 yes Figure 1 A structural schematic diagram of an implementation manner of the middle frame 210 is shown in FIG. Figure 3 yes Figure 2 FIG. 2 is a schematic structural diagram of an implementation manner of the middle frame 210 at the section line AA shown in FIG.
[0088] like Figure 2 and Figure 3 As shown, the middle frame 210 may include a main body 211, a first reinforcement 212 and a first connection layer 213 (for ease of reading and understanding, Figure 2 The main body 211, the first reinforcement 212 and the first connection layer 213 are schematically distinguished by the filling pattern. The first reinforcement 212 is located on the inner side of the main body 211, that is, the main body 211 is arranged around and connected to the first reinforcement 212. The first connection layer 213 is fixedly connected between the main body 211 and the first reinforcement 212.
[0089] Exemplarily, the main body 211 may include a first member 2111 and a second member 2112 ( Figure 2 1 and 10. The first member 2111 and the second member 2112 are schematically distinguished by dotted lines. The first member 2111 is arranged around the second member 2112. The second member 2112 is connected to the inner surface of the first member 2111. The inner surface of the first member 2111 faces the internal space of the electronic device 1000. The second member 2112 can be arranged around the first reinforcement 212, and the first reinforcement 212 can be connected to the second member 2112. It can be understood that the first member 2111 can constitute the frame body of the middle frame 210. The second member 2112 of the main body 211, the first connecting layer 213 and the first reinforcement 212 can constitute the plate body of the middle frame 210.
[0090] The outer peripheral side of the main body 211 faces away from the internal space of the electronic device 1000. In some embodiments, the outer peripheral side of the main body 211 may be a part of the appearance surface of the housing 200. Exemplarily, the outer peripheral side of the main body 211 is also the outer peripheral side of the first member 2111. The display screen 100, the frame of the middle frame 210 and the back cover 220 surround the internal space of the electronic device 1000, and the plate body of the middle frame 210 is located in the internal space of the electronic device 1000. The plate body of the middle frame 210 can be used to carry electronic devices (not shown) inside the electronic device 1000. Exemplarily, the electronic devices may include a battery, a circuit board, a processor, an internal memory, a communication module, a camera, an audio module, a speaker, a microphone, and a subscriber identification module (SIM) card. The electronic device may be arranged on the side of the plate body facing the display screen, or on the side of the plate body facing the back cover 220, or may be embedded in the plate body.
[0091] In other embodiments, the second component 2112 may also be arranged side by side with the first reinforcement component 212, that is, the first reinforcement component 212 may connect the second component 2112 and the first component 2111 at the same time.
[0092] Exemplarily, the main body 211 is made of aluminum alloy. The first connection layer 213 includes the material of the main body 211 and the material of the first reinforcement 212. The aluminum content of the main body 211 is higher than the aluminum content of the first reinforcement 212, and the hardness of the material of the first reinforcement 212 is greater than the hardness of the material of the main body 211. In this way, the frame of the middle frame 210 has a high aluminum content, and the appearance of the middle frame 210 is better. At the same time, compared with the technical solution that the middle frame 210 is an aluminum alloy as a whole, the technical solution of the present application can increase the strength of the middle frame 210 by setting the first reinforcement 212, and the overall reliability of the middle frame 210 is better. In the drop test or drum test of the electronic device 1000, the middle frame 210 is not easy to deform, and the electronic devices in the internal space of the electronic device 1000 are effectively protected. In addition, the setting of the first reinforcement 212 can also ensure the reliability of the middle frame 210 while having a small thickness.
[0093] The main body 211 can be made of a sixth series aluminum alloy or a seventh series aluminum alloy. The first reinforcement 212 can be made of a pure metal material, or a composite material of a metal material doped with a small amount of non-metallic material, and this composite material is also regarded as a metal material. For example, the material of the first reinforcement 212 can be an aluminum alloy, a particle-reinforced aluminum-based composite material, a particle-reinforced magnesium-based composite material, a titanium alloy, stainless steel, or an amorphous alloy.
[0094] In some embodiments, the hardness of the material of the main body 211 may be in the range of 80 HV to 140 HV. For example, the hardness of the material of the main body 211 may be 80 HV, 100 HV, 120 HV, or 140 HV.
[0095] In some embodiments, the hardness of the material of the first reinforcement member 212 may be in the range of 100 HV to 200 HV. For example, the hardness of the material of the first reinforcement member 212 may be 100 HV, 130 HV, 180 HV, or 200 HV.
[0096] In some embodiments, the elastic modulus of the material of the first reinforcement 212 may be greater than the elastic modulus of the material of the main body 211. In this way, the rigidity of the plate body of the shell 200 is better and the ability to resist elastic deformation is better. Exemplarily, the elastic modulus of the material of the main body 211 may be in the range of 65GPa to 75GPa, for example, the elastic modulus of the material of the main body 211 may be 65GPa, 70GPa or 75GPa. The elastic modulus of the material of the first reinforcement 212 may be greater than 69GPa, for example, the elastic modulus of the material of the first reinforcement 212 may be 69GPa, 75GPa, 90GPa or 100GPa.
[0097] In some embodiments, the yield strength of the material of the first reinforcement member 212 may be greater than the yield strength of the material of the main body member 211. In this way, the plate body of the housing 200 has better resistance to plastic deformation. Exemplarily, the yield strength of the material of the main body member 211 may be in the range of 200MPa to 450MPa, for example, the yield strength of the material of the main body member 211 may be 200MPa, 250MPa, 300MPa, 380MPa or 450MPa. The yield strength of the material of the first reinforcement member 212 may be in the range of 300MPa to 600MPa, for example, the yield strength of the material of the first reinforcement member 212 may be 300MPa, 350MPa, 400MPa, 470MPa, 550MPa or 600MPa.
[0098] Exemplarily, the material of the main body 211 can be a 6013 aluminum alloy with a yield strength of 340 MPa. For example, the matrix element of the material of the main body 211 is aluminum (Al), and the main reinforcing elements and their contents are: the mass fraction of silicon (Si) is 0.6%, the mass fraction of magnesium (Mg) is 0.9%, and the mass fraction of copper (Cu) is 0.6%. The material of the first reinforcement 212 can be a 6013 aluminum alloy with a yield strength of 450 MPa. For example, the matrix element of the material of the first reinforcement 212 is aluminum (Al), and the main reinforcing elements and their contents are: the mass fraction of silicon (Si) is 0.7%, the mass fraction of magnesium (Mg) is 1.0%, and the mass fraction of copper (Cu) is 0.9%. It can be understood that the yield strength, hardness or elastic modulus of the 6013 aluminum alloy can be increased by increasing the content of the reinforcing elements in the 6013 aluminum alloy.
[0099] For example, the material of the main body 211 may be 6013 aluminum alloy with a yield strength of 340 MPa. The material of the first reinforcement 212 may be 7055 aluminum alloy with a yield strength of 600 MPa.
[0100] Exemplarily, the material of the main body 211 can be a 6013 aluminum alloy with an elastic modulus of 69 GPa. The material of the first reinforcement 212 can be a 6013 aluminum-based composite material reinforced with silicon carbide (SiC) with an elastic modulus of 100 GPa, that is, a composite material of 6013 aluminum alloy doped with silicon carbide. Exemplarily, the volume fraction of the doped SiC can be 20%. It is understood that the elastic modulus, hardness or yield strength of the material can be enhanced by doping other reinforcing materials in the aluminum alloy.
[0101] For example, the material of the main body 211 may be 6013 aluminum alloy. The material of the first reinforcement 212 may be a particle-reinforced magnesium-based composite material.
[0102] In some embodiments, the main body 211 and the first reinforcement 212 are formed into an integral structural member through a sintering process. The sintering process (also known as powder metallurgy) is a process in which a powder or a powder compact is heated to a temperature below the melting point of the basic components therein, and then cooled to room temperature in a certain method and speed. The result of sintering is that the powder particles or the powder particles and the parts are bonded, and finally the powder condenses into a block to form a structural member. In some embodiments, the main body 211 can be formed by a first process, and then the material of the first reinforcement 212 is made into a metal powder, and the first reinforcement 212 is formed by a second process (sintering process), and can be fixedly connected to the main body 211 during the powder forming process, and the first reinforcement 212 finally formed is also fixedly connected to the main body 211.
[0103] It is understandable that, compared to the first reinforcement 212 being connected to the main part 211 through traditional material interface bonding processes such as forging, riveting, welding and bonding, the present application forms an integrated structural part of the main part 211 and the first reinforcement 212 through a sintering process. In this way, the interface connection strength between the main part 211 and the first reinforcement 212 is better, the overall strength of the middle frame 210 is better, and the interface connection is not easy to crack or deform or detach. In addition, no other auxiliary connection structure is required between the main part 211 and the first reinforcement 212, and the overall structure of the middle frame 210 is simpler, the volume is smaller, and the molding process is simpler.
[0104] Furthermore, the first reinforcement member 212 is formed by sintering powder. Before sintering, the structural member to be sintered can be shaped by a mold, and the shape and position of the first reinforcement member 212 are easier to adjust.
[0105] Figure 4 yes Figure 3 The schematic diagram of the variation trend of the component content in the first connection layer 213 is shown in FIG. The positive direction of the X axis in the coordinate axis represents the direction from the main body 211 to the first reinforcement 212, and the Y axis represents the component content. W is the thickness of the first connection layer 213.
[0106] like Figure 3 and Figure 4 As shown, the first connection layer 213 may include the material of the main member 211 and the material of the first reinforcement member 212. It is understandable that during the sintering process, the material of the main member 211 and the material of the first reinforcement member 212 move in the direction of low concentration due to thermal diffusion, forming the first connection layer 213. In the direction from the main member 211 to the first reinforcement member 212 (that is, the positive direction of the X axis in the figure), the content of the material of the main member 211 contained in the first connection layer 213 gradually decreases, and the content of the material of the first reinforcement member 212 gradually increases.
[0107] Exemplarily, the material of the main body 211 is 6013 aluminum alloy with a yield strength of 340 MPa. For example, the matrix element of the material of the main body 211 is aluminum (Al), and the main reinforcing elements and their contents are: the mass fraction of silicon (Si) is 0.6%, the mass fraction of magnesium (Mg) is 0.9%, and the mass fraction of copper (Cu) is 0.6%. The material of the first reinforcement 212 is 6013 aluminum alloy with a yield strength of 450 MPa. For example, the matrix element of the material of the first reinforcement 212 is aluminum (Al), and the main reinforcing elements and their contents are: the mass fraction of silicon (Si) is 0.7%, the mass fraction of magnesium (Mg) is 1.0%, and the mass fraction of copper (Cu) is 0.9%. Along the direction of the main body 211 toward the first reinforcement 212, the content of aluminum element gradually decreases. The contents of silicon element, magnesium element and copper element gradually increase.
[0108] The thickness of the first connection layer 213 may be greater than 0.1 μm in the direction from the main body 211 to the first reinforcement 212. For example, the thickness of the first connection layer 213 is in the range of 2 μm to 30 μm, for example, the thickness of the first connection layer 213 may be 2 μm, 10 μm, 20 μm or 30 μm. At this time, the interface bonding strength between the main body 211 and the first reinforcement 212 is better, and the overall strength of the middle frame 210 is better.
[0109] In some embodiments, the interface of the first connection layer 213 toward the first reinforcement 212 and the interface of the first connection layer 213 toward the main body 211 are clearly visible under a metallographic microscope. The resolution of the metallographic microscope is at the micron level. Since the first connection layer 213 is formed by atomic diffusion during the sintering process, during the sintering process, the force at various positions of the first connection layer 213 is relatively uniform, and in the extension direction of the first connection layer 213, the thickness of the first connection layer 213 is equal or approximately equal, that is, the interface of the first connection layer 213 toward the main body 211 and the interface of the first connection layer 213 toward the first reinforcement 212 are parallel or approximately parallel (slight convexity and concavity of the interface are allowed).
[0110] In some embodiments, the main body 211 may be provided with a protrusion (not shown), which is embedded in the first reinforcement 212. In other embodiments, the main body 211 may be provided with a groove (not shown), and a portion of the first reinforcement 212 is provided in the groove. It is understandable that the protrusion and the groove can be used as a limiting structure. Providing a limiting structure on the surface of the main body 211 can increase the contact area between the main body 211 and the first reinforcement 212, thereby making the connection between the main body 211 and the first reinforcement 212 more stable.
[0111] In some embodiments, the surface of the main body 211 facing the first reinforcement 212 is a rough surface, so that the connection area between the main body 211 and the first reinforcement 212 can be increased, thereby enhancing the connection strength between the main body 211 and the first reinforcement 212.
[0112] like Figure 3 As shown, the housing 200 may further include an anodized layer 219, which may be connected to the peripheral side of the frame. In this case, the anodized layer 219 and the frame may form a frame of the middle frame 210. The anodized layer 219 is the appearance surface of the middle frame 210.
[0113] Exemplarily, the main component material of the anodized layer 219 is aluminum oxide. After the material of the main body 211 and the material of the first reinforcement 212 are sintered to form an integrated structure, the outer peripheral side surface of the integrated structure (the outer peripheral side surface is the material of the main body 211 - aluminum alloy) can be anodized to form the anodized layer 219.
[0114] In some embodiments, the middle frame 210 may further include an anti-corrosion layer (not shown). The anti-corrosion layer may be fixedly connected to the surface of the first reinforcement member 212. The anti-corrosion layer may form a middle plate together with the first reinforcement member 212, the first connection layer 213 and the second member 2112 of the main body member 211.
[0115] Several embodiments of the housing 200 are described in detail above in conjunction with the relevant drawings. A method for preparing the housing 200 in one embodiment will be described in detail below in conjunction with the relevant drawings. Figure 5 yes Figure 1 FIG. 2 is a diagram showing the preparation steps of an embodiment of a housing 200 shown in FIG. Figures 6 to 8 yes Figure 5 The schematic diagram of the corresponding structure in the preparation steps of the shell 200 is shown.
[0116] like Figures 5 to 8 As shown, the steps of preparing the housing 200 may include the following steps:
[0117] Step S101: Figure 6 As shown, a frame 310 is provided. The frame 310 is made of a first metal material, which is an aluminum alloy, and has an inner cavity 311 .
[0118] Exemplarily, the forming process of the frame 310 may include but is not limited to extrusion forming, CNC (Computer numerical control, CNC) machine tool processing, stamping forming, forging forming, etc. In other embodiments, the forming process of the frame 310 may include but is not limited to precision special-shaped rolling, bending, splicing, etc.
[0119] Step S102: Figure 7 As shown, the powder 320 is filled into the inner cavity 311 of the frame 310 to form the sintered part 300. The powder 320 is made of a second metal material. The aluminum content in the first metal material is higher than the aluminum content in the second metal material. The hardness of the second metal material is greater than the hardness of the first metal material;
[0120] Exemplarily, the molding process of the powder material 320 may include powder making, batching and mixing. The second metal material may be an aluminum alloy, a particle-reinforced aluminum-based composite material or a particle-reinforced magnesium-based composite material.
[0121] Step S103: Figure 8 As shown, the sintered part 300 is sintered to form a blank 400. The blank 400 includes a first portion 410, a second portion 420 and a third portion 430, the third portion 430 connects the first portion 410 and the second portion 420, the first portion 410 is formed by the frame 310, the second portion 420 is formed by the powder 320, and the third portion 430 is formed by the mutual diffusion of the first metal material and the second metal material.
[0122] Exemplarily, a hot isostatic pressing sintering process may be used to sinter the sintered part 300. In some embodiments, the pressure P1 (unit: megapascal, MPa) of the hot isostatic pressing sintering process satisfies: P1 ≥ 100 MPa, the temperature T1 (unit: degrees Celsius, °C) of the hot isostatic pressing sintering process satisfies: 500 °C ≤ T1 ≤ 660 °C, and the time t1 (unit: hour, h) of the hot isostatic pressing sintering process satisfies: 2h ≤ t1 ≤ 5h.
[0123] It is understandable that the thickness of the third part 430 varies according to the sintering process and time. The rule is: the longer the sintering time, the greater the thickness of the third part 430. The higher the sintering temperature, the greater the thickness of the third part 430. The greater the sintering pressure, the greater the thickness of the third part 430. Exemplarily, the thickness of the third part 430 is in the range of 2μm to 30μm. At this time, while meeting the interface bonding strength, the sintering process can be accelerated and the energy consumption of the sintering process can be saved.
[0124] Step S104: Processing the blank 400 to form the shell 200. The shell 200 includes a main body 211, a first reinforcement 212, and a first connection layer 213. The main body 211 surrounds the first reinforcement 212, and the first connection layer 213 is fixedly connected between the main body 211 and the first reinforcement 212. The main body 211 is formed by a first portion 410, the first reinforcement 212 is formed by a second portion 420, and the first connection layer 213 is formed by a third portion 430.
[0125] Exemplarily, the process of processing the blank 400 may include, but is not limited to, one or more of nano injection molding, CNC (Computer numerical control, CNC) machine tool processing, mechanical polishing, anodizing, laser engraving, spot welding, etc. For example, the blank 400 is anodized to form an anodized layer. The anodized layer can be fixedly connected to the peripheral side of the frame body to form the appearance surface of the middle frame 210, and the appearance effect of the middle frame 210 is better.
[0126] Illustratively, after processing the blank 400 , the middle frame 210 is first formed, and then the middle frame 210 is connected to the back cover 220 by bonding, welding, snap connection, screw connection, etc., and finally the shell 200 is formed.
[0127] It can be understood that the shell 200 prepared by the above steps S101 to S104. The shell 200 includes a main body 211, a first reinforcement 212 and a first connection layer 213. The main body 211 surrounds the first reinforcement 212, and the first connection layer 213 is fixedly connected between the main body 211 and the first reinforcement 212. The main body 211 adopts a first metal material, the first reinforcement 212 adopts a second metal material, the first connection layer 213 includes a first metal material and a second metal material, the first metal material is an aluminum alloy, the content of aluminum in the main body 211 is higher than the content of aluminum in the first reinforcement 212, and the hardness of the first reinforcement 212 is greater than the hardness of the main body 211. In this way, the shell 200 has a better appearance and better reliability.
[0128] At the same time, compared with the traditional material interface bonding process such as riveting, welding and bonding to fix the main body 211 and the first reinforcement 212, the present application uses a sintering process to form an integrated structure of the main body 211 and the first reinforcement 212. In this way, the interface connection strength between the main body 211 and the first reinforcement 212 is better, the strength of the housing 200 is better, and the interface connection is not easy to crack, deform or detach.
[0129] It is understandable that if Figure 5 The method for preparing the housing 200 shown can be used not only for preparing Figure 1 The housing 200 shown in the figure can also be used to prepare housings 200 of other shapes. Figure 5 When the manufacturing method shown is used to manufacture a housing 200 of other shapes, it can be achieved by changing the shape of the frame 310 and the shape of the inner cavity 311 in the frame 310 during the manufacturing steps.
[0130] In some embodiments, after the step of "filling the inner cavity 311 of the frame 310 with the powder 320" and before the step of "sintering the part to be sintered 300", the preparation method further includes step S105: using a cold isostatic pressing process to perform powder compaction to form a block of the powder 320. The cold isostatic pressing process allows the powder 320 to be formed into a specific shape, thereby facilitating the placement and sintering process. Exemplarily, the pressure P4 of the cold isostatic pressing process satisfies: P4 ≥ 100 MPa, and the time t4 of the cold isostatic pressing process satisfies: 1h ≤ t4 ≤ 3h.
[0131] In some embodiments, between step S103 and step S104, the method for preparing the shell 200 further includes step S106: performing a solid solution treatment on the blank 400, and then cooling the blank 400 to room temperature. Exemplarily, the cooling of the blank 400 to room temperature can be achieved by a water quenching process. It is understood that by performing a solid solution treatment on the blank 400, the yield strength and hardness of the second part 420 formed by the powder 320 can be enhanced, thereby improving the yield strength and hardness of the first reinforcement 212.
[0132] Exemplarily, when the powder 320 is an aluminum alloy or a particle-reinforced aluminum-based composite material, the solution temperature T2 of the solution treatment satisfies: 500°C ≤ T2 ≤ 550°C, and the solution time t2 satisfies: 15min ≤ t2 ≤ 60min. When the powder 320 is a particle-reinforced magnesium-based composite material, the solution temperature T2 of the solution treatment satisfies: 380°C ≤ T2 ≤ 420°C, and the solution time t2 satisfies: 0.5h ≤ t2 ≤ 12h.
[0133] In some embodiments, after step S106 and before step S104, the preparation method may further include step S107: performing aging treatment on the blank 400. It is understood that by performing aging treatment on the blank 400, the hardness of the second part 420 formed by the powder 320 can be enhanced, thereby improving the hardness of the first reinforcement 212.
[0134] For example, when the powder 320 is an aluminum alloy or a particle-reinforced aluminum-based composite material, the aging treatment temperature T3 may satisfy: 170°C ≤ T3 ≤ 200°C, and the aging time t3 may satisfy: 4h ≤ t3 ≤ 24h. When the powder 320 is a particle-reinforced magnesium-based composite material, the aging treatment temperature T3 may satisfy: 180°C ≤ T3 ≤ 220°C, and the aging time t3 may satisfy: 1h ≤ t3 ≤ 8h.
[0135] In some embodiments, the method for preparing the housing 200 in the above-described embodiment (eg Figures 5 to 8 The same technical contents as shown in FIG. 1 will not be described again. Fig. 9 yes Figure 1 FIG. 2 is a diagram showing the preparation steps of another embodiment of a housing 200 . Figures 10 to 13 yes Fig. 9 The corresponding structural schematic diagram in the preparation steps of the shell 200 is shown in FIG.
[0136] like Figures 9 to 13 As shown, the steps of preparing the housing 200 may include the following steps:
[0137] Step S201: Fig.10 As shown, a frame 310 is provided. The frame 310 is made of a first metal material, which is an aluminum alloy. The frame 310 has an inner cavity 311.
[0138] Step S202: Fig.11 As shown, the plate 330 is placed in the inner cavity 311 of the frame 310. The plate 330 is made of a third metal material. The content of aluminum in the first metal material is higher than the content of aluminum in the third metal material. The hardness of the third metal material is greater than that of the first metal material.
[0139] For example, the third metal material may be an aluminum alloy, a particle-reinforced aluminum-based composite material, a particle-reinforced magnesium-based composite material, a titanium alloy, stainless steel or an amorphous alloy.
[0140] Step S203: Fig.12 As shown, the powder material 320 is filled into the inner cavity 311 of the frame 310 , and the frame 310 and the plate 330 are connected to form the sintered part 300 , and the powder material 320 is made of the first metal material.
[0141] Step S204: Fig.13 As shown, the sintered part 300 is sintered to form a blank 400. The blank 400 includes a first part 410, a second part 420 and a third part 430. The first part 410 is formed by a frame 310 and a powder 320, the second part 420 is formed by a plate 330, and the third part 430 is formed by mutual diffusion of a first metal material and a third metal material.
[0142] Step S205 : Processing the blank 400 to form the shell 200 , wherein the shell 200 includes a main body 211 , a first reinforcement 212 and a first connection layer 213 , wherein the main body 211 is formed by a first portion 410 , the first reinforcement 212 is formed by a second portion 420 , and the first connection layer 213 is formed by a third portion 430 .
[0143] It is understandable that in Figures 9 to 13 In the step of preparing the shell 200 shown, the first reinforcement 212 is pre-prepared as a plate 330 for sintering, which can reduce the amount of powder used, thereby reducing the material cost. At the same time, the less amount of powder used can shorten the sintering time, thereby reducing the cost of the preparation process and improving production efficiency. In addition, when the melting point of the third metal material is higher than the melting point of the first metal material, that is, the melting point of the material of the first reinforcement 212 is higher than the melting point of the material of the main body 211, the third metal material is pre-prepared into a plate, and then the plate 330 and the frame 310 are connected by powder sintering to form a blank 400, so as to avoid deformation of the frame 310 due to excessive temperature during the sintering process.
[0144] In some embodiments, the method for preparing the housing 200 in the above-described embodiment (eg Figures 5 to 8 The same technical contents as shown in FIG. 1 will not be described again. Fig.14 yes Figure 1 FIG. 2 is a diagram showing the preparation steps of another embodiment of a housing 200 .
[0145] like Fig.14 As shown, the steps of preparing the housing 200 may include the following steps:
[0146] Step S301: providing a frame, wherein the frame is made of a first metal material, which is an aluminum alloy, and has an inner cavity;
[0147] Step S302: placing a plate in the inner cavity of the frame, the plate is made of a third metal material, the content of aluminum in the first metal material is higher than the content of aluminum in the third metal material, and the hardness of the third metal material is greater than the hardness of the first metal material;
[0148] Step S303: filling the inner cavity of the frame with powder, and connecting the frame and the plate to form a sintered part, wherein the powder is made of a third metal material;
[0149] For example, the third metal material may be an aluminum alloy, a particle-reinforced aluminum-based composite material, or a particle-reinforced magnesium-based composite material.
[0150] Step S304: sintering the part to be sintered to form a green body. The green body includes a first part, a second part and a third part, the first part is formed by a frame, the second part is formed by a plate and powder, and the third part is formed by mutual diffusion of the first metal material and the third metal material;
[0151] Step S305: Process the blank to form a shell 200. The shell 200 includes a main body 211, a first reinforcement 212 and a first connection layer 213. The main body 211 is formed by the first part, the first reinforcement is formed by the second part, and the first connection layer is formed by the third part.
[0152] It is understandable that in Fig.14 In the step of preparing the housing 200, the first reinforcement 212 is sintered as the plate 330, which can reduce the amount of powder used and thus reduce material costs. At the same time, the less amount of powder used can shorten the sintering time, thereby reducing the manufacturing process cost and improving production efficiency.
[0153] In some embodiments, the same technical contents as the housing 200 in the previous embodiments are not repeated. Fig.15 yes Figure 1 FIG. 2 is a schematic structural diagram of another embodiment of the middle frame 210 shown in FIG. Fig.16 yes Fig.15 The middle frame 210 shown in FIG. 1 is an assembly diagram of an embodiment of the card holder 900 at the section line BB. For ease of reading, Fig.15 and Fig.16 The main body 211, the first reinforcement 212 and the first connection layer 213 are schematically distinguished by the filling pattern.
[0154] like Fig.15 and Fig.16 As shown, the first reinforcement 212 can be used to carry a subscriber identification module (SIM) card of a mobile phone. Exemplarily, the electronic device 1000 also includes a card holder 900, which is used to carry a subscriber identification module (SIM) card of a mobile phone. The first reinforcement 212 can be arranged relative to the card holder 900, that is, in the thickness direction of the middle frame 210, the projection of the card holder 900 on the middle frame 210 overlaps with the first reinforcement 212 at least partially. In this way, the risk of deformation of the middle frame 210 caused by repeated plugging and unplugging of the SIM card by the user can be reduced.
[0155] In some embodiments, the same technical contents as the housing 200 in the previous embodiments are not repeated. Fig.17 yes Figure 12 is a schematic diagram of another embodiment of the middle frame 210 shown in FIG. Fig.17 The main body 211, the first reinforcement 212 and the first connection layer 213 are schematically distinguished by the filling pattern.
[0156] like Fig.17 As shown, when the middle frame 210 is rectangular and the middle plate is also rectangular, the first reinforcement member 212 can be located at or near the top corners of the rectangle. In this way, the middle frame 210 has a strong anti-deformation ability at the four top corners, and when the electronic device 1000 is subjected to external impact (such as falling or collision), the probability of deformation of the middle frame 210 is low, and the electronic devices located in the internal space of the electronic device 1000 can be protected.
[0157] In some embodiments, the first reinforcement member 212 may also be used to support a battery (eg, Figure 2 As shown). It can be understood that the positions of the first reinforcement members 212 on the plate body can be set according to actual needs.
[0158] The number of the first reinforcement member 212 may be one or more. When there are more than one first reinforcement member 212, the first reinforcement members 212 are arranged at intervals. For example, the number of the first reinforcement member 212 may be Figure 6 The one shown in Figure 7 The number of the first connection layers 213 is equal to the number of the first reinforcement members 212. It is understandable that the number of the first reinforcement members 212 can be set according to actual needs and can be flexibly set at positions on the plate body that require greater strength.
[0159] In some embodiments, the same technical contents as the housing 200 in the previous embodiments are not repeated. Fig.18 yes Figure 1 FIG. 2 is a schematic diagram of another embodiment of the middle frame 210 shown in FIG. 2 . For ease of reading, Fig.18 The main body 211, the first reinforcement 212 and the first connection layer 213 are schematically distinguished by the filling pattern.
[0160] like Fig.18 As shown, the middle frame 210 may include a main body 211, a first reinforcement 212, and a first connection layer 213. At this time, the main body 211 may constitute the frame body of the middle frame 210. The first reinforcement 212 may constitute the plate body of the middle frame 210. In this way, the overall strength of the plate body of the middle frame 210 may be enhanced.
[0161] It is understandable that the first reinforcement 212 can be a part of the plate body, and together with part of the main body 211, it can also form the entire plate body. The shape of the first reinforcement 212 is not limited to the rectangle shown in the figure of this application. In other embodiments, the shape of the first reinforcement 212 can also be a circle, a triangle, a polygon or other irregular shapes. It is understandable that the number of the first reinforcement 212, the distribution position on the middle plate, and the shape and size can be set by technicians in this field according to actual conditions, and this application does not limit it.
[0162] In some embodiments, the same technical contents as the housing 200 in the previous embodiments are not repeated. Fig.19 yes Figure 1 A structural schematic diagram of another embodiment of the middle frame 210 is shown in FIG.
[0163] like Fig.19 As shown, the middle frame 210 may include a main body 211, a first reinforcement 212, a second reinforcement 214, a first connection layer 213 and a second connection layer 215 (for ease of reading, Fig.19 The main body 211, the first reinforcement 212, the second reinforcement 214, the first connection layer 213 and the second connection layer 215 are schematically distinguished by the filling pattern. The first reinforcement 212 surrounds the second reinforcement 214, and the main body 211 surrounds the first reinforcement 212. The first connection layer 213 is fixedly connected between the main body 211 and the first reinforcement 212. The second connection layer 215 is fixedly connected between the first reinforcement 212 and the second reinforcement 214.
[0164] Exemplarily, the main body 211 is made of aluminum alloy, the first connection layer 213 includes the material of the main body 211 and the material of the first reinforcement 212, and the second connection layer 215 may include the material of the first reinforcement 212 and the material of the second reinforcement 214. The content of aluminum in the material of the main body 211 is higher than the content of aluminum in the material of the first reinforcement 212, and the hardness of the material of the first reinforcement 212 is greater than the hardness of the material of the main body 211. The hardness of the material of the second reinforcement 214 is greater than the hardness of the material of the first reinforcement 212. It can be understood that by providing the second reinforcement 214, the plate strength of the middle frame 210 is further strengthened, so that the strength of the shell 200 is better and the appearance effect is better.
[0165] In some embodiments, the main body 211, the first reinforcement 212 and the second reinforcement 214 can be formed into an integral structure by a sintering process. The first connection layer 213 and the second connection layer 215 are formed by thermal diffusion of atoms in the sintering process. The first connection layer 213 is formed. In the direction from the main body 211 to the first reinforcement 212, the material content of the main body 211 contained in the first connection layer 213 gradually decreases, and the material content of the first reinforcement 212 gradually increases. In the direction from the first reinforcement 212 to the second reinforcement 214, the material content of the first reinforcement 212 in the second connection layer 215 gradually decreases, and the material content of the second reinforcement 214 gradually increases.
[0166] The thickness of the first connection layer 213 is greater than 0.1 μm. Exemplarily, the thickness of the first connection layer 213 is in the range of 2 μm to 30 μm. For example, the thickness of the first connection layer 213 may be 2 μm, 10 μm, 20 μm or 30 μm. At this time, the interface bonding strength between the main body 211 and the first reinforcement 212 is better, and the overall strength of the middle frame 210 is better.
[0167] The thickness of the second connection layer 215 is greater than 0.1 μm. Exemplarily, the thickness of the second connection layer 215 is in the range of 2 μm to 30 μm. For example, the thickness of the second connection layer 215 may be 2 μm, 10 μm, 20 μm or 30 μm. At this time, the interface bonding strength between the first reinforcement 212 and the second reinforcement 214 is better, and the overall strength of the middle frame 210 is better.
[0168] In some embodiments, the interface of the second connection layer 215 facing the first reinforcement 212 and the interface of the second connection layer 215 facing the second reinforcement 214 are clearly visible under a metallographic microscope. The resolution of the metallographic microscope is at the micron level. Since the second connection layer 215 is formed by atomic diffusion during the sintering process, during the sintering process, the force at each position of the second connection layer 215 is relatively uniform, and in the extension direction of the second connection layer 215, the thickness of the second connection layer 215 is equal or approximately equal, that is, the interface of the second connection layer 215 facing the first reinforcement 212 is parallel or approximately parallel to the interface of the second connection layer 215 facing the second reinforcement 214 (slight convexity and concavity of the interface is allowed).
[0169] In some embodiments, the material of the second reinforcement member 214 can be aluminum alloy, particle-reinforced aluminum-based composite material, particle-reinforced magnesium-based composite material, titanium alloy, stainless steel or amorphous alloy. Exemplarily, the material of the main body 211 is 6013 aluminum alloy, the material of the first reinforcement member 212 is 7013 aluminum alloy, and the material of the second reinforcement member 214 is stainless steel.
[0170] Fig. 20 yes Figure 1FIG. 2 is a diagram showing the preparation steps of another embodiment of the housing 200 .
[0171] like Fig. 20 As shown, the steps of preparing the housing 200 may include the following steps:
[0172] Step S401: providing a frame, wherein the frame is made of a first metal material, which is an aluminum alloy, and the frame has an inner cavity;
[0173] Step S402: placing a plate in the inner cavity of the frame, the plate adopts a third metal material, the content of aluminum in the first metal material is higher than the content of aluminum in the third metal material, and the hardness of the third metal material is greater than the hardness of the first metal material.
[0174] For example, the plate may be formed by a stamping process or an etching process.
[0175] Exemplarily, the third metal material may be aluminum alloy, particle-reinforced aluminum-based composite material, titanium alloy, stainless steel or amorphous alloy.
[0176] Step S403: Fill the inner cavity of the frame with powder, and connect the frame and the plate to form a sintered part. The powder is made of a fourth metal material, which is different from the first metal material and the third metal material.
[0177] For example, the fourth metal material may be an aluminum alloy, a particle-reinforced aluminum-based composite material, or a particle-reinforced magnesium-based composite material. The content of aluminum in the first metal material is higher than the content of aluminum in the fourth metal material, and the hardness of the fourth metal material is greater than that of the first metal material.
[0178] Step S404: Sinter the part to be sintered to form a blank. The blank includes a first part, a second part, a third part, a fourth part and a fifth part, the first part is formed by a frame, the second part is formed by powder, the third part is formed by mutual diffusion of the first metal material and the fourth metal material, the fourth part is formed by a plate, and the fifth part is formed by mutual diffusion of the third metal material and the fourth metal material.
[0179] Step S405: Processing the blank to form the shell 200. The shell 200 includes a main body 211, a first reinforcement 212, a second reinforcement 214, a first connection layer 213 and a second connection layer 215, wherein the main body 211 is formed by the first part, the first reinforcement 212 is formed by the second part, the first connection layer 213 is formed by the third part, the second reinforcement 214 is formed by the fourth part, and the second connection layer 215 is formed by the fifth part.
[0180] It can be understood that the present embodiment is different from the method for preparing the housing 200 in the above-mentioned embodiment (eg Fig. 9 and Fig.14 The difference between the first reinforcement 212 and the second reinforcement 214 is that the material of the first reinforcement 212 is prepared into powder 320 and the second reinforcement 214 is prepared into a plate 330, so that two reinforcement materials are integrated on the plate body of the shell 200 during the sintering process of the blank, and then the shell 200 with three materials of different strengths can be formed by a single sintering process. In addition, the size and position of the first reinforcement 212 and the second reinforcement 214 can be flexibly adjusted.
[0181] In addition, when the melting point of the material (third metal material) of the second reinforcement member 214 is higher than the melting point of the material (first metal material) of the main body member 211, the material (fourth metal material) of the first reinforcement member 212 with a lower melting point can be used as an intermediate connecting member to connect the second reinforcement member 214 and the main body member 211. In this way, the problem of deformation of the main body member 211 due to excessively high sintering temperature during the sintering process can be avoided.
[0182] In other embodiments, the middle frame 210 may further include a third reinforcement member (not shown), the first reinforcement member 212 may surround the third reinforcement member, and the third reinforcement member may be spaced apart from the second reinforcement member 214. The hardness of the material of the third reinforcement member may be greater than the hardness of the material of the second reinforcement member 214. When preparing the middle frame 210 with three reinforcement members of different hardness, the material of the first reinforcement member 212 may be prepared into a powder 320, and the material of the second reinforcement member 214 and the material of the third reinforcement member may be prepared into a plate 330, and the powder 320 may be formed through a sintering process, and the powder 320 may connect the second reinforcement member 214 and the third reinforcement member to the main body 211.
[0183] In some embodiments, the same technical contents as those in the previous embodiments are not repeated. Fig.21 It is a schematic diagram of an exploded view of another implementation manner of the electronic device 1000 provided in an embodiment of the present application. Fig. 22 yes Fig.21 FIG. 2 is a schematic structural diagram of an embodiment of the housing 200 at the section line CC shown in FIG.
[0184] like Fig.21 and Fig. 22As shown, the electronic device 1000 may include a display screen 100 and a shell 200. Exemplarily, the shell 200 may include a middle frame 210 and a back cover 220. The back cover 220 and the middle frame 210 are integrally formed structural parts. The middle frame 210 may include a main body 211, a first reinforcement 212 and a first connecting layer 213. The first connecting layer 213 is located between the first reinforcement 212 and the main body 211 and the back cover 220. Exemplarily, the main body 211 may include a first component 2111 and a second component 2112. The first component 2111 may constitute the frame body of the middle frame 210. The second component 2112 of the main body 211 and the first reinforcement 212 may constitute the plate body of the middle frame 210. For easy reading and understanding, Fig. 22 In the figure, the first component 2111, the second component 2112 and the back cover 220 of the main body 211 are schematically distinguished by dotted lines.
[0185] The back cover 220 is made of metal material consistent with the main body 211. The back cover 220 includes an inner surface 221 and an outer surface 222 that are arranged opposite to each other. The inner surface 221 of the back cover 220 faces the internal space of the electronic device 1000. The plate body of the middle frame 210 is connected to the inner surface 221 of the back cover 220. In some embodiments, the outer peripheral side of the main body 211 faces away from the internal space of the electronic device 1000. The outer peripheral side of the main body 211 and the outer surface 222 of the back cover 220 can constitute the appearance surface of the housing 200.
[0186] In some embodiments, compared with the steps of preparing the housing 200 in the above embodiments, in the preparation of Fig. 22 When the shell 200 is prepared, in the process of forming the frame 310, the inner cavity 311 of the frame 310 is in the form of a groove. The main body 211 and the back cover 220 of the prepared shell 200 are both formed by the frame.
[0187] In some embodiments, the housing 200 may further include an anodized layer 219, which may be connected to the outer peripheral side of the middle frame 210 and the outer surface 222 of the back cover 220. In this case, the portion of the anodized layer 219 connected to the middle frame 210 may form a frame of the middle frame 210 together with the frame body. The anodized layer 219 is the appearance surface of the middle frame 210.
[0188] The present application introduces several different structures of the shell 200 and several specific embodiments of the preparation method of the shell 200 in conjunction with the drawings. The shell 200 may include a main body 211, a first reinforcement 212 and a first connection layer 213. The main body 211 surrounds the first reinforcement 212, and the first connection layer 213 is fixedly connected between the main body 211 and the first reinforcement 212. The main body 211 is made of aluminum alloy, and the first connection layer 213 includes the material of the main body 211 and the material of the first reinforcement 212. The content of aluminum in the main body 211 is higher than the content of aluminum in the first reinforcement 212, and the hardness of the material of the first reinforcement 212 is greater than the hardness of the material of the main body 211. In this way, the appearance of the shell 200 is better, and at the same time, the first reinforcement 212 can enhance the overall strength of the shell 200, and the overall reliability of the shell 200 is better.
[0189] Compared with the traditional material interface bonding process such as riveting, welding and bonding to fix the main body 211 and the first reinforcement 212, the present application uses a sintering process to form an integrated structure of the main body 211 and the first reinforcement 212. In this way, the interface connection strength between the main body 211 and the first reinforcement 212 is better, the overall strength of the housing 200 is better, and the interface connection is not easy to crack, deform or detach.
[0190] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of the present application. In other words, the multiple embodiments described above can also be arbitrarily combined according to actual needs.
[0191] It should be noted that all the above drawings are illustrative illustrations of the present application and do not represent the actual size of the product. Moreover, the size ratio relationship between the components in the drawings is not intended to limit the actual product of the present application.
[0192] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A method for preparing a housing (200), characterized in that: The preparation method comprises: Providing a frame (310), wherein the frame (310) is made of a first metal material, wherein the first metal material is an aluminum alloy, and the frame (310) has an inner cavity (311); Filling the inner cavity (311) with powder (320) to form a to-be-sintered part (300), wherein the powder (320) is made of a second metal material, the aluminum content in the first metal material is higher than the aluminum content in the second metal material, and the hardness of the second metal material is higher than the hardness of the first metal material; Sintering the to-be-sintered part (300) to form a blank (400), wherein the blank (400) comprises a first part (410), a second part (420) and a third part (430), the third part (430) connecting the first part (410) and the second part (420), the first part (410) being formed by the frame (310), the second part (420) being formed by the powder (320), and the third part (430) being formed by mutual diffusion of the first metal material and the second metal material; The blank (400) is processed to form a shell (200), wherein the shell (200) includes a main body (211), a first reinforcement (212) and a first connecting layer (213), the main body (211) is formed by the first part (410), the reinforcement is formed by the second part (420), and the first connecting layer (213) is formed by the third part (430).
2. The preparation method according to claim 1, characterized in that: The second metal material is aluminum alloy, particle reinforced aluminum-based composite material or particle reinforced magnesium-based composite material.
3. The preparation method according to claim 1 or 2, characterized in that: Sintering the to-be-sintered part (300) using a hot isostatic pressing sintering process; The pressure P1 of the hot isostatic pressing sintering process satisfies: P1 ≥ 100 MPa; The temperature T1 of the hot isostatic pressing sintering process satisfies: 500°C≤T1≤660°C; The time t1 of the hot isostatic pressing sintering process satisfies: 2h≤t1≤5h.
4. A method for preparing a housing (200), characterized in that: The preparation method comprises: Providing a frame (310), wherein the frame (310) is made of a first metal material, wherein the first metal material is an aluminum alloy, and the frame (310) has an inner cavity (311); Placing a plate (330) in the inner cavity (311), wherein the plate (330) is made of a third metal material, wherein the content of aluminum in the first metal material is higher than the content of aluminum in the third metal material, and the hardness of the third metal material is greater than the hardness of the first metal material; Filling the inner cavity (311) with powder (320), and connecting the frame (310) and the plate (330) to form a sintered part (300); Sintering the part to be sintered (300) to form a green body (400); The blank (400) is processed to form a shell (200), wherein the shell (200) includes a main body (211) and a first reinforcement (212), the main body (211) is formed by at least the frame (310), the first reinforcement (212) is formed by at least the plate (330), and the first reinforcement (212) is connected to the main body (211).
5. The preparation method according to claim 4, characterized in that: The powder (320) is made of a first metal material; The blank (400) comprises a first part (410), a second part (420) and a third part (430), wherein the first part (410) is formed by the frame (310) and the powder (320), the second part (420) is formed by the plate (330), and the third part (430) is formed by mutual diffusion of the first metal material and the third metal material; The shell (200) includes a main body (211), a first reinforcement (212) and a first connecting layer (213), wherein the main body (211) is formed by the first part (410), the first reinforcement (212) is formed by the second part (420), and the first connecting layer (213) is formed by the third part (430).
6. The preparation method according to claim 4 or 5, characterized in that: The third metal material is aluminum alloy, particle-reinforced aluminum-based composite material, particle-reinforced magnesium-based composite material, titanium alloy, stainless steel or amorphous alloy.
7. The preparation method according to claim 4, characterized in that: The powder (320) is made of a third metal material; The blank (400) comprises a first part (410), a second part (420) and a third part (430), wherein the first part (410) is formed by the frame (310), the second part (420) is formed by the plate (330) and the powder (320), and the third part (430) is formed by mutual diffusion of the first metal material and the third metal material; The shell (200) includes a main body (211), a first reinforcement (212) and a first connecting layer (213), wherein the main body (211) is formed by the first part (410), the first reinforcement (212) is formed by the second part (420), and the first connecting layer (213) is formed by the third part (430).
8. The preparation method according to claim 7, characterized in that: The third metal material is aluminum alloy, particle-reinforced aluminum-based composite material or particle-reinforced magnesium-based composite material.
9. The preparation method according to claim 4, characterized in that: The powder (320) is made of a fourth metal material, and the fourth metal material is different from the first metal material and the third metal material; The ingot comprises a first part (410), a second part (420), a third part (430), a fourth part and a fifth part, wherein the first part (410) is formed by the frame (310), the second part (420) is formed by the powder (320), the third part (430) is formed by mutual diffusion of the first metal material and the fourth metal material, the fourth part is formed by the plate (330), and the fifth part is formed by mutual diffusion of the third metal material and the fourth metal material; The shell (200) includes a main body (211), a first reinforcement (212), a first connecting layer (213), a second reinforcement (214) and a second connecting layer (215), wherein the main body (211) is formed by the first part (410), the first reinforcement (212) is formed by the second part (420), the first connecting layer (213) is formed by the third part (430), the second reinforcement (214) is formed by the fourth part, and the second connecting layer (215) is formed by the fifth part.
10. The preparation method according to claim 9, characterized in that: The third metal material is aluminum alloy, particle-reinforced aluminum-based composite material, titanium alloy, stainless steel or amorphous alloy; and / or The fourth metal material is made of aluminum alloy, particle reinforced aluminum-based composite material or particle reinforced magnesium-based composite material.
11. The preparation method according to claim 5 or 9, characterized in that: The melting point of the third metal material is higher than the melting point of the first metal material.
12. The preparation method according to any one of claims 4 to 11, characterized in that: Sintering the to-be-sintered part (300) using a hot isostatic pressing sintering process; The pressure P1 of the hot isostatic pressing sintering process satisfies: P1 ≥ 100 MPa; The temperature T1 of the hot isostatic pressing sintering process satisfies: 500°C≤T1≤660°C; The time t1 of the hot isostatic pressing sintering process satisfies: 2h≤t1≤5h.
13. The preparation method according to any one of claims 4 to 12, characterized in that: After the step of "sintering the to-be-sintered part (300) to form a blank (400)", and before the step of "processing the blank (400) to form a shell (200)", the preparation method further comprises: Performing a solution treatment on the blank (400); Cooling the green body (400) to room temperature; The blank (400) is subjected to aging treatment.
14. The preparation method according to claim 13, characterized in that: The powder (320) is made of aluminum alloy or particle-reinforced aluminum-based composite material, the solution temperature T2 of the solution treatment satisfies: 500° C.≤T2≤550° C., and the solution time t2 satisfies: 15 min≤t2≤60 min; and / or The temperature T3 of the aging treatment satisfies: 170°C≤T3≤200°C, and the aging time t3 satisfies: 4h≤t3≤24h.
15. The preparation method according to claim 13, characterized in that: The powder (320) is made of a particle-reinforced magnesium-based composite material, the solution temperature T2 of the solution treatment satisfies: 380° C.≤T2≤420° C., and the solution time t2 satisfies: 0.5h≤t2≤12h; and / or The temperature T3 of the aging treatment satisfies: 180°C≤T3≤220°C, and the aging time t3 satisfies: 1h≤t3≤8h.
16. The preparation method according to any one of claims 4 to 15, characterized in that: After the step of "filling the inner cavity (311) of the frame (310) with the powder (320)" and before the step of "sintering the part to be sintered (300)", the preparation method further comprises: The powder is compacted using a cold isostatic pressing process to form the powder (320) into a block.
17. The preparation method according to claim 16, characterized in that: The pressure P4 of the cold isostatic pressing process satisfies: P4 ≥ 100 MPa, and the time t4 of the cold isostatic pressing process satisfies: 1 h ≤ t4 ≤ 3 h.
18. A housing (200), applied to an electronic device (1000), characterized in that: The shell (200) comprises a main body (211), a first reinforcement (212) and a first connection layer (213); the main body (211) surrounds the first reinforcement (212); and the first connection layer (213) is fixedly connected between the main body (211) and the first reinforcement (212); The main body (211) is made of aluminum alloy, the first connection layer (213) comprises the material of the main body (211) and the material of the first reinforcement (212), the aluminum content of the main body (211) is higher than the aluminum content of the first reinforcement (212), and the hardness of the material of the first reinforcement is greater than the hardness of the material of the main body (211); The main body (211) forms a frame and a part of a plate of the shell (200), and the first reinforcement (212) forms a part of a plate of the shell (200); or, the main body (211) forms a frame of the shell (200), and the first reinforcement (212) forms a plate of the shell (200).
19. The housing (200) according to claim 18, characterized in that: The thickness of the first connection layer (213) is greater than 0.1 μm; and / or The thickness of the first connection layer (213) is in the range of 2 μm to 30 μm.
20. The housing (200) according to claim 18 or 19, characterized in that: The hardness of the material of the first reinforcement (212) is in the range of 100 HV to 200 HV.
21. The housing (200) according to any one of claims 18 to 20, characterized in that: The elastic modulus of the material of the first reinforcement member (212) is greater than the elastic modulus of the material of the main body member (211); and / or The yield strength of the material of the first reinforcement member (212) is greater than the yield strength of the material of the main body member (211).
22. The housing (200) according to any one of claims 18 to 21, characterized in that: The first reinforcement (212) is made of aluminum alloy, particle-reinforced aluminum-based composite material, particle-reinforced magnesium-based composite material, titanium alloy, stainless steel or amorphous alloy.
23. The housing (200) according to claim 18, characterized in that The housing (200) further comprises a rear cover (220), wherein the rear cover (220) is made of a metal material which is consistent with the material of the main body (211), and the plate body of the housing (200) is connected to the inner surface (221) of the rear cover (220).
24. The housing (200) according to claim 18, characterized in that The shell (200) further comprises a second reinforcement member (214) and a second connection layer (215), wherein the first reinforcement member (212) surrounds the second reinforcement member (214), and the second connection layer (215) is fixedly connected between the first reinforcement member (212) and the second reinforcement member (214); The second connection layer (215) comprises the material of the main body (211) and the material of the second reinforcement (214), and the hardness of the material of the second reinforcement (214) is greater than the hardness of the material of the first reinforcement (212); The main body (211) forms a frame and a part of a plate of the shell (200), and the first reinforcement (212) and the second reinforcement (214) form another part of a plate of the shell (200); or, the main body (211) forms a frame of the shell (200), and the first reinforcement (212) and the second reinforcement (214) form a plate of the shell (200).
25. The housing (200) according to claim 24, characterized in that The thickness of the second connection layer (215) is greater than 0.1 μm; and / or The thickness of the second connection layer (215) is in the range of 2 μm to 30 μm.
26. The housing (200) according to any one of claims 24 or 25, characterized in that: The material of the second reinforcement member (214) is aluminum alloy, particle-reinforced aluminum-based composite material, particle-reinforced magnesium-based composite material, titanium alloy, stainless steel or amorphous alloy.
27. An electronic device (1000), characterized in that: It comprises a display screen (100) and a housing (200) according to any one of claims 18 to 26, wherein the display screen (100) is mounted on the housing (200).
28. The electronic device (1000) according to claim 27, characterized in that: The first reinforcement member (212) of the housing (200) and the battery of the electronic device (1000) are arranged opposite to each other; and / or The first reinforcement piece (212) of the housing (200) and the card holder (900) of the electronic device (1000) are arranged opposite to each other, and the card holder (900) is used to carry a SIM card of the electronic device (1000).