Cleaning equipment of wafer processing thinning device

Abstract

The invention relates to the technical field of semiconductor chip production, in particular to cleaning equipment of a wafer processing thinning device, which comprises a shell, a placing device for placing a wafer main body and a cleaning device for cleaning the wafer main body, and is characterized in that the front end of the left side of the shell is fixedly connected with a control main body; the device comprises a shell, a control main body, a feeding groove, a wafer main body, a placing device, a cleaning device and a mounting main body, the interior of the shell is fixedly connected with the cleaning device, the front side and the rear side of the interior of the cleaning device are each provided with a supporting plate which is transversely arranged, and the top of the cleaning device is fixedly connected with an electric telescopic main body. The thinned wafer main body can be installed through the placing device, then the thinned wafer main body is installed in the cleaning device under the action of the installation main body, and the wafer main body is cleaned through the cleaning device, so that a large number of wafer main bodies can be cleaned at a time, and the cleaning speed is higher.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chip production, and in particular to a cleaning device for a wafer processing and thinning device. Background Art

[0002] Electrical components themselves are often composed of several parts, the most important of which is the semiconductor chip responsible for control. The semiconductor chip is etched and wired on the semiconductor sheet to make a semiconductor device that can realize a certain function. When producing semiconductor chips, wafers need to be produced first. After the wafer is produced, in order to reduce the size of the chip and increase the success rate of the chip, the wafer usually needs to be thinned. After the thinning is completed, in order to facilitate the cleaning of the wafer, a cleaning device is usually set on the thinning device to facilitate the direct removal of the wafer from the thinning device and placing it into the cleaning equipment to clean the thinned wafer.

[0003] When using traditional wafer cleaning equipment, the wafer is usually placed directly into a holding device, and then the holding device and the wafer are placed into the cleaning equipment together. The surface of the wafer is cleaned by the ultrasonic cleaning body and cleaning liquid in the cleaning equipment. At this time, the holding device used to limit the wafer is usually placed directly in the ultrasonic cleaning body. At this time, the contact position between the wafer and the holding device is not easy to be cleaned, resulting in dead corners in the cleaning. Therefore, a cleaning device for a wafer processing thinning device is proposed to address the above problem. Summary of the invention

[0004] The purpose of the present application is to provide a cleaning device for a wafer processing thinning device to solve the problem that the contact position between the wafer and the holding device is not easy to be cleaned.

[0005] To achieve the above objectives, this application provides the following technical solutions: A cleaning device for a wafer processing thinning device comprises a shell, a placing device for placing a wafer body and a cleaning device for cleaning the wafer body, a control body is fixedly connected to the front end of the left side of the shell, a cleaning device is fixedly connected inside the shell, transversely arranged support plates are installed on both the front and rear sides of the cleaning device, an electric telescopic body is fixedly connected to the top of the cleaning device, the top of the electric telescopic body is fixedly connected to the shell, a feed trough is provided on the top of the left side of the shell, two placing devices arranged front and back are arranged inside the cleaning device, and a mounting body is fixedly connected to both the front and rear sides of the placing device.

[0006] Preferably, the placing device includes a limiting body, a support rod, a cross rod, a fixed shaft, a rubber ring, a top frame and a clamping plate, the limiting body is fixedly connected to four vertically arranged and evenly distributed support rods at the bottom, two of the support rods are fixedly connected to the left and right sides of the cross rod in a group, the two cross rods are respectively fixedly connected to the front and rear ends of two mutually parallel and longitudinally arranged fixed shafts, the top frame is fixedly connected to the longitudinally arranged fixed shaft, the outside of the fixed shaft is fixedly connected to rubber rings that are evenly distributed, the rubber rings are arranged in a group of three on the outside of a wafer body, the left and right sides of the bottom of the top frame are fixedly connected to clamping plates that are evenly distributed and longitudinally arranged, and the top frame is arranged on the top of the limiting body.

[0007] Preferably, the limiting body includes a fixing frame, a rubber block, a fixing plate and a fixing ball, the top of the fixing frame is provided with evenly distributed through grooves, the inner walls on the front and rear sides of the through groove provided by the fixing frame are provided with mounting grooves, a rubber block is provided in the mounting groove provided by the fixing frame, the card plate is arranged in the through groove provided by the fixing frame, two rubber blocks are grouped together and are respectively arranged on the front and rear sides of the card plate, a fixing plate is fixedly connected to a side of the rubber block close to the card plate, a first deformation groove which is transversely arranged and evenly distributed is provided in a side of the rubber block away from the card plate, two fixing balls which are arranged left and right are fixedly connected to a side of the fixing plate close to the card plate, transverse and arc-shaped card grooves are provided on the front and rear sides of the card plate, the side of the fixing ball away from the fixing plate is arranged in the card groove provided by the card plate, and the side of the card plate away from the top frame is arc-shaped.

[0008] Preferably, the bottom of the top frame is tightly fitted with the fixed frame, the bottom of the support rod is arranged below the bottom of the wafer body, and the two fixed frames are respectively arranged on the front and rear sides of the cleaning device.

[0009] Preferably, the cleaning device comprises an ultrasonic cleaning body, a positioning shaft, a supporting body, a push rod and a pushing body, the supporting body is fixedly connected at the central position of the bottom of the ultrasonic cleaning body, the front and rear sides of the ultrasonic cleaning body are fixedly connected to the supporting plate, the top of the supporting body is provided with a pushing body, a push rod is installed in the supporting body, the top of the push rod is rotatably connected with the electric telescopic body, the pushing body comprises a pushing plate, a connecting rod and a limiting plate, the left and right sides of the bottom of the pushing plate are fixedly connected with a vertically arranged connecting rod, one end of the connecting rod away from the pushing plate is fixedly connected with a horizontally arranged limiting plate, a through hole is opened at the central position of the pushing plate, the push rod passes through the through hole opened in the pushing plate, four evenly distributed and vertically arranged positioning shafts are fixedly connected to the top of the pushing plate, and two vertically arranged positioning shafts are fixedly connected to the left and right sides of the top of the supporting plate, and a mounting body is provided above the pushing body and the supporting plate; The mounting body includes a mounting block, an elastic tube and an elastic seat, the mounting block is fixedly connected with the elastic tube, the bottom of the elastic tube is provided with an elastic seat, the elastic seat is provided with a third deformation groove which is evenly distributed, the elastic tube is provided with a fourth deformation groove which is evenly distributed, the bottom of the elastic tube and the elastic seat are in contact with each other, the positioning shaft passes through the elastic tube and the elastic seat, and the mounting blocks are fixedly connected to the fixing frame in a group of four.

[0010] Preferably, the supporting body comprises a base, a spring sheet, an eccentric wheel, a rotating shaft and a mounting shaft, the base is provided with vertically arranged slide grooves on the left and right sides, the bottom of the slide groove provided in the base is fixedly connected with a spring sheet symmetrically arranged in the front and rear, the two spring sheets are arranged on the front and rear sides of the limiting plate, a placement groove is provided at the top at the central position of the base, two eccentric wheels which are vertically placed and divided into front and rear are arranged in the placement groove provided in the base, a mounting shaft is fixedly connected below the central axis of the two eccentric wheels, a rotating shaft is provided on the outer side above the central axis of the eccentric wheels, the end of the rotating shaft away from the eccentric wheel is installed in the base, a push rod is provided on the outer side of the mounting shaft, the rubber ring is provided with second deformation grooves which are evenly distributed, and the bottom of the rubber ring above does not fit the wafer body.

[0011] Preferably, the front and rear ends of the limit plate are arranged in an arc shape, and the arc positions at the front and rear ends of the limit plate are tightly fitted with two spring leaves respectively, the top of the eccentric wheel and the push plate are fitted with each other, and the bottom of the push plate is tightly fitted with the base, and the distance from the axis center of the rotating shaft to the axis center of the eccentric wheel is the same as the distance from the axis center of the mounting shaft to the axis center of the eccentric wheel.

[0012] Compared with the prior art, the beneficial effects of this application are: 1. In the present application, by providing a housing, a control body, a feed trough, an electric telescopic body, a wafer body, a placement device, a cleaning device and an installation body, the thinned wafer body can be installed by the placement device, and then the cleaning device is loaded under the action of the installation body, and the wafer body is cleaned by the cleaning device, so that a large number of wafer bodies can be cleaned at one time, making the cleaning speed faster; 2. In the present application, a fixed frame, a rubber block, a first deformation groove, a fixed plate, a fixed ball, a through groove, an installation groove, a support rod, a cross bar, a fixed shaft, a rubber ring, a top frame, a card plate and a card groove are provided, and a frame can be formed by the fixed frame, the support rod, the cross bar and the fixed shaft, and then the wafer body is placed in the rubber ring on the outside of the fixed shaft provided below, and then the top frame is installed on the top of the fixed frame, and the top frame drives the card plate to be inserted into the through groove provided in the fixed frame. At this time, the rubber block pushes the fixed plate through its own elastic force to card the fixed ball into the card groove provided in the card plate, so as to position the card plate and the top frame. At this time, the three rubber rings are evenly distributed on the outside of the wafer body to limit the wafer body. At the same time, the volume of the outer frame can be reduced, so that the flow rate of the cleaning liquid outside the wafer body is increased, and the cleaning efficiency of the wafer body is improved. At the same time, the bottom of the support rod can be directly placed on the desktop, which is convenient for placing the wafer body; 3. In the present application, by providing the mounting block, elastic tube and elastic seat, the elastic seat can be firstly sleeved on the outside of the positioning shaft, and then the mounting block equipped with the elastic tube can be sleeved on the outside of the positioning shaft. At this time, the bottom of the mounting block is in contact with the elastic seat, and the mounting block is limited by the elastic force of the elastic tube, which is convenient for the installation of the fixed frame and the placement of the wafer body in the ultrasonic cleaning body; 4. In the present application, the ultrasonic cleaning body, positioning shaft, supporting body and pushing body are provided to support the mounting block, thereby supporting the fixing frame, so that the wafer body provided below the fixing frame can be suspended in the ultrasonic cleaning body, and then the surface of the wafer body is cleaned by the ultrasonic cleaning body and the cleaning liquid, so that the wafer body is kept clean; 5. In the present application, by means of the electric telescopic body, base, slide groove, spring sheet, placement groove, eccentric wheel, rotating shaft, mounting shaft, push rod, pushing body, push plate, connecting rod, limit plate and through hole, the electric telescopic body can drive the push rod to move up and down, the push rod drives the eccentric wheel to rotate outside the rotating shaft through the mounting shaft, and at the same time the eccentric wheel pushes the push plate to move upward, thereby driving the mounting block above the push plate to move, so that the limit body moves, and the mounting block is limited and elastic force is provided under the action of the elastic tube, the elastic seat, the third deformation groove and the fourth deformation groove. After the eccentric wheel rotates one circle, the spring The sheet pushes the limit plate to move downward, and the limit plate drives the push plate to reset downward through the connecting rod, thereby realizing the swing of the limit body. At the same time, because the rubber ring arranged on the top does not contact with the wafer body, and there is a distance between the rubber ring arranged on the top and the wafer body, the wafer body can swing between the three rubber rings, so that the wafer body can temporarily leave the rubber ring, and then the area around the wafer body can be cleaned, so that the cleaning effect is better. At the same time, the rubber ring can increase the deformation of the rubber ring through the second deformation groove, so as to prevent the wafer body from hitting the rubber ring and causing damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the overall structure of this application; Figure 2 This is a schematic diagram of the installation structure of the electric telescopic main body of this application; Figure 3 A schematic diagram of the installation structure of the device placed for this application; Figure 4 This is a schematic diagram of the assembly structure of the wafer body of this application; Figure 5 This is a schematic diagram of the position of the rubber ring and the wafer body of this application; Figure 6 This is a schematic diagram of the structure of the rubber ring of this application; Figure 7 This is a schematic diagram of the installation structure of the card board for this application; Figure 8 This is a schematic diagram of the installation structure of the fixed plate for this application; Fig. 9 This is a schematic diagram of the installation structure of the fixed ball for this application; Fig.10 This is a schematic diagram of the structure of the cleaning device of this application; Fig.11 This is a schematic diagram of the structure of the installation subject of this application; Fig.12 This is a schematic diagram of the installation structure of the reed of this application; Fig.13 This is a schematic diagram of the installation structure of the eccentric wheel of this application; Fig.14 This is a schematic diagram of the installation structure for installing the shaft for this application.

[0014] In the figure: 1, housing; 2, control body; 3, feed slot; 4, electric telescopic body; 5, wafer body; 6, placement device; 61, limit body; 611, fixed frame; 612, rubber block; 613, first deformation groove; 614, fixed plate; 615, fixed ball; 616, through groove; 617, installation groove; 62, support rod; 63, cross bar; 64, fixed shaft; 65, rubber ring; 66, top frame; 67, card plate; 68, second deformation groove; 69, card slot; 7, support plate; 8, cleaning Washing device; 81, ultrasonic cleaning body; 82, positioning shaft; 83, supporting body; 831, base; 832, slide groove; 833, reed; 834, placement groove; 835, eccentric wheel; 836, rotating shaft; 837, mounting shaft; 84, push rod; 85, pushing body; 851, push plate; 852, connecting rod; 853, limit plate; 854, through hole; 9, mounting body; 91, mounting block; 92, elastic tube; 93, elastic seat; 94, third deformation groove; 95, fourth deformation groove. DETAILED DESCRIPTION

[0015] See also Figure 1-14, this application provides a technical solution: A cleaning device for a wafer processing thinning device comprises a shell 1, a placing device 6 for placing a wafer body 5 and a cleaning device 8 for cleaning the wafer body 5. A control body 2 is fixedly connected to the front end of the left side of the shell 1, and a cleaning device 8 is fixedly connected inside the shell 1. Laterally arranged supporting plates 7 are installed on both the front and rear sides of the cleaning device 8. An electric telescopic body 4 is fixedly connected to the top of the cleaning device 8. The top of the electric telescopic body 4 is fixedly connected to the shell 1. A feeding trough 3 is provided on the top of the left side of the shell 1. Two placing devices 6 arranged front and back are arranged inside the cleaning device 8. The placing device 6 is fixedly connected to the installation body 9 on both the front and rear sides. Through this arrangement, the thinned wafer body 5 can be installed through the placing device 6, and then the cleaning device 8 is loaded under the action of the installation body 9. The wafer body 5 is cleaned through the cleaning device 8, so that a large number of wafer bodies 5 can be cleaned at one time, making the cleaning speed faster.

[0016] like Figure 1-9As shown, the placement device 6 includes a limiting body 61, a support rod 62, a cross bar 63, a fixed shaft 64, a rubber ring 65, a top frame 66 and a clamping plate 67. The bottom of the limiting body 61 is fixedly connected with four vertically arranged and evenly distributed support rods 62. Two support rods 62 are fixedly connected to the left and right sides of the cross bar 63 in a group. The two cross bars 63 are respectively fixedly connected to the front and rear ends of two mutually parallel and longitudinally arranged fixed shafts 64. The top frame 66 is fixedly connected with the longitudinally arranged fixed shaft 64. The outer side of the fixed shaft 64 is fixedly connected with the evenly distributed rubber rings 65. Three rubber rings 65 are set in a group on the outer side of a wafer body 5. The left and right sides of the bottom of the top frame 66 are fixedly connected with evenly distributed and longitudinally arranged The card plate 67 and the top frame 66 are arranged on the top of the limiting body 61. The limiting body 61 includes a fixed frame 611, a rubber block 612, a fixed plate 614 and a fixed ball 615. The top of the fixed frame 611 is provided with evenly distributed through grooves 616. The inner walls of the front and rear sides of the through grooves 616 provided in the fixed frame 611 are provided with mounting grooves 617. The mounting grooves 617 provided in the fixed frame 611 are provided with rubber blocks 612. The card plate 67 is arranged in the through groove 616 provided in the fixed frame 611. Two rubber blocks 612 are arranged in a group on the front and rear sides of the card plate 67 respectively. The side of the rubber block 612 close to the card plate 67 is fixedly connected with the fixed plate 614. The side of the rubber block 612 far from the card plate 67 is provided with a transverse arrangement and The first deformation grooves 613 are evenly distributed, and two fixed balls 615 are fixedly connected to one side of the fixing plate 614 close to the card plate 67. The card plate 67 is provided with transverse and arc-shaped card grooves 69 on both the front and rear sides. The fixed ball 615 is arranged in the card groove 69 provided on the card plate 67 on the side away from the fixing plate 614. The card plate 67 is arranged in an arc shape on the side away from the top frame 66. The bottom of the top frame 66 is tightly fitted with the fixed frame 611. The bottom of the support rod 62 is arranged below the bottom of the wafer body 5. The two fixed frames 611 are respectively arranged on the front and rear sides of the cleaning device 8. Through this arrangement, a frame can be composed of the fixed frame 611, the support rod 62, the cross bar 63 and the fixed shaft 64, and then the wafer body 5 is placed The top frame 66 is then installed on the top of the fixed frame 611. The top frame 66 drives the card plate 67 to be inserted into the through groove 616 provided in the fixed frame 611. At this time, the rubber block 612 pushes the fixed plate 614 through its own elastic force to clamp the fixed ball 615 into the card groove 69 provided in the card plate 67, so as to position the card plate 67 and the top frame 66. At this time, the three rubber rings 65 are evenly distributed on the outside of the wafer body 5 to limit the wafer body 5. At the same time, the volume of the outer frame can be reduced, so that the flow rate of the cleaning liquid outside the wafer body 5 is increased, and the cleaning efficiency of the wafer body 5 is improved. At the same time, the bottom of the support rod 62 can be directly placed on the desktop to facilitate the placement of the wafer body 5.

[0017] like Figure 1 , 2As shown in Figures 3 and 10, the cleaning device 8 includes an ultrasonic cleaning body 81, a positioning shaft 82, a supporting body 83, a push rod 84 and a pushing body 85. The supporting body 83 is fixedly connected to the central position of the bottom of the ultrasonic cleaning body 81, and the front and rear sides of the ultrasonic cleaning body 81 are fixedly connected to the support plate 7. A pushing body 85 is arranged on the top of the supporting body 83, and a push rod 84 is installed in the supporting body 83. The top of the push rod 84 is rotatably connected to the electric telescopic body 4. Through this arrangement, the mounting block 91 can be supported, thereby supporting the fixed frame 611, so that the wafer body 5 arranged below the fixed frame 611 can be suspended in the ultrasonic cleaning body 81, and then the surface of the wafer body 5 is cleaned by the ultrasonic cleaning body 81 and the cleaning liquid, so that the wafer body 5 is kept clean.

[0018] like Figure 10-14As shown, the pushing body 85 includes a push plate 851, a connecting rod 852 and a limit plate 853. The left and right sides of the bottom of the push plate 851 are fixedly connected with a vertically arranged connecting rod 852, and the end of the connecting rod 852 away from the push plate 851 is fixedly connected with a horizontally arranged limit plate 853. A through hole 854 is opened at the central position of the push plate 851, and the push rod 84 passes through the through hole 854 opened in the push plate 851. Four evenly distributed and vertically arranged positioning shafts 82 are fixedly connected to the top of the push plate 851, and two vertically arranged positioning shafts 82 are fixedly connected to the left and right sides of the top of the support plate 7. A mounting body 9 is provided above the pushing body 85 and the support plate 7. The mounting body 9 includes a mounting block 91, an elastic tube 92 and an elastic seat 93. The mounting block An elastic tube 92 is fixedly connected to the inner part of the elastic tube 91, an elastic seat 93 is arranged at the bottom of the elastic tube 92, a third deformation groove 94 which is evenly distributed is opened in the elastic seat 93, a fourth deformation groove 95 which is evenly distributed is opened in the elastic tube 92, the bottom of the elastic tube 92 and the elastic seat 93 fit each other, the positioning shaft 82 passes through the elastic tube 92 and the elastic seat 93, and the four mounting blocks 91 are fixedly connected to the fixed frame 611 in a group. Through this arrangement, the elastic seat 93 can be firstly sleeved on the outer side of the positioning shaft 82, and then the mounting block 91 equipped with the elastic tube 92 can be sleeved on the outer side of the positioning shaft 82. At this time, the bottom of the mounting block 91 contacts the elastic seat 93, and the mounting block 91 is limited by the elastic force of the elastic tube 92, which is convenient for the installation of the fixed frame 611 and convenient for The wafer body 5 is placed in the ultrasonic cleaning body 81. The supporting body 83 includes a base 831, a spring 833, an eccentric wheel 835, a rotating shaft 836 and a mounting shaft 837. The base 831 is provided with vertically arranged slide grooves 832 on both sides. The bottom of the slide groove 832 provided in the base 831 is fixedly connected with a spring 833 symmetrically arranged in the front and back directions. The two springs 833 are arranged on the front and back sides of the limiting plate 853. A placement groove 834 is provided at the top of the central position of the base 831. Two eccentric wheels 835 placed vertically and divided in the front and back directions are arranged in the placement groove 834 provided in the base 831. The mounting shaft 837 is fixedly connected below the central axis of the two eccentric wheels 835. A rotating shaft 836 is arranged above the central axis of the eccentric wheel 835 on the outside. The end of the rotating shaft 836 away from the eccentric wheel 835 is installed in the base 831, and a push rod 84 is arranged on the outside of the installation shaft 837. A second deformation groove 68 which is evenly distributed is opened in the rubber ring 65. The bottom of the upper rubber ring 65 does not fit with the wafer body 5. The front and rear ends of the limit plate 853 are arranged in an arc shape. The arc positions of the front and rear ends of the limit plate 853 are respectively tightly fitted with the two spring leaves 833. The top of the eccentric wheel 835 fits with the push plate 851, and the bottom of the push plate 851 fits tightly with the base 831. The distance from the axis of the rotating shaft 836 to the axis of the eccentric wheel 835 is the same as the distance from the axis of the installation shaft 837 to the axis of the eccentric wheel 835. Through this arrangement, the push rod 84 can be driven up and down by the electric telescopic body 4.The push rod 84 drives the eccentric wheel 835 to rotate outside the rotating shaft 836 through the mounting shaft 837. At the same time, the eccentric wheel 835 pushes the push plate 851 to move upward, thereby driving the mounting block 91 above the push plate 851 to move, so that the limiting body 61 moves. Under the action of the elastic tube 92, the elastic seat 93, the third deformation groove 94 and the fourth deformation groove 95, the mounting block 91 is limited and elastic force is provided. After the eccentric wheel 835 rotates one circle, the spring leaf 833 pushes the limiting plate 853 to move downward, and the limiting plate 853 drives the push plate 851 to reset downward through the connecting rod 852. Thus, the swing of the limiting body 61 is realized. At the same time, because the rubber ring 65 arranged on the top does not contact the wafer body 5, and there is a distance between the rubber ring 65 arranged on the top and the wafer body 5, the wafer body 5 can swing between the three rubber rings 65, so that the wafer body 5 can temporarily leave the rubber ring 65, so that the area around the wafer body 5 can be cleaned, so that the cleaning effect is better. At the same time, the rubber ring 65 can increase the deformation of the rubber ring 65 through the second deformation groove 68, so as to prevent the wafer body 5 from hitting the rubber ring 65 and causing damage.

[0019] Workflow: When using this semiconductor processing wafer polishing device, first, please refer to Figure 4-9 , the polished wafer body 5 is passed through the fixing frame 611 and placed between the two rubber rings 65. At this time, the wafer body 5 is limited by the groove set by the rubber ring 65. After multiple wafer bodies 5 are placed, the clamping plate 67 set at the bottom of the top frame 66 is inserted into the through groove 616 opened in the fixing frame 611. At this time, the clamping plate 67 pushes the fixing ball 615 to move through the arc setting position at the bottom, and the fixing ball 615 pushes the fixing plate 614 to move, and the fixing plate 614 pushes the rubber ring 65. The rubber block 612 is deformed under the action of the first deformation groove 613 until the bottom of the top frame 66 fits with the fixed frame 611. At this time, the rubber block 612 restores its shape. At the same time, the rubber block 612 pushes the fixed plate 614 and the fixed ball 615 to reset. The fixed ball 615 is inserted into the slot 69 provided in the card plate 67, so as to limit the card plate 67 and the top frame 66, and realize the installation of the rubber ring 65 provided on the top. At this time, the rubber ring 65 provided on the top is as shown in FIG. Figure 5 As shown, it does not contact the wafer body 5. Then, the placement device 6 together with the wafer body 5 is placed into the ultrasonic cleaning body 81 through the feed slot 3 opened in the shell 1. At this time, the mounting blocks 91 on both sides of the fixed frame 611 drive the elastic tube 92 to be sleeved on the outside of the positioning shaft 82 until the bottom of the mounting block 91 contacts the elastic seat 93. After both placement devices 6 are placed in the ultrasonic cleaning body 81, the shell 1 is controlled by the control body 2 to add cleaning liquid into the ultrasonic cleaning body 81, and then please refer to Figure 10-14, the ultrasonic cleaning body 81 is started by the control body 2. At this time, the ultrasonic cleaning body 81 can clean the wafer body 5. During the cleaning process, because the fixed frame 611, the support rod 62, the cross bar 63 and the fixed shaft 64 occupy relatively less space, it is more convenient for the wafer body 5 to contact with the cleaning liquid, thereby improving the cleaning effect of the wafer body 5. At the same time, the electric telescopic body 4 is started by the control body 2. The electric telescopic body 4 drives the push rod 84 to move. At this time, the push rod 84 drives the installation shaft 837 to move. The installation shaft 837 drives the two eccentric wheels 835 to rotate outside the rotating shaft 836. The eccentric wheel 835 pushes the push plate 851 to move upward. The push plate 851 pushes the installation block 91 to move through the elastic seat 93. The installation block 91 drives the fixed frame 611 to move. At this time, the installation block 91 squeezes the elastic seat 93, and the positioning shaft 82 squeezes the elastic tube 92. The elastic tube 92 and the elastic seat 93 are deformed and generate elastic force under the action of the third deformation groove 94 and the fourth deformation groove 95 respectively. At the same time, the push plate 851 drives the limit plate 853 to move upward through the connecting rod 852, and the limit plate 853 pushes the spring leaf 833 to deform through the two ends of the arc setting. When the fixed frame 611 moves, the fixed frame 611 drives the rubber ring 65 to move through the support rod 62, the cross bar 63 and the fixed shaft 64, and the rubber ring 65 drives the wafer body 5 to move. The wafer body 5 briefly leaves the rubber ring 65 during the up and down movement. At this time, all positions on the outside of the wafer body 5 are exposed to the cleaning liquid, so that the position where the wafer body 5 originally contacts the rubber ring 65 can also be cleaned. During the downward movement of the push rod 84, the spring leaf 833 pushes the limit plate 853 to move downward, and the limit plate 853 drives the push plate 851 to move downward through the connecting rod 852, thereby resetting the fixed frame 611. After the cleaning of the wafer body 5 is completed, the cleaning liquid is discharged through the control body 2, the ultrasonic cleaning body 81 and the electric telescopic body 4 are turned off, and then the wafer body 5 is taken out through the feeding trough 3.

[0020] This article uses specific examples to illustrate the principles and implementation methods of this application. The above examples are only used to help understand the method and its core ideas of this application. The above is only the preferred implementation method of this application. It should be pointed out that due to the limitations of textual expression and the objective existence of infinite specific structures, ordinary technicians in this technical field can make several improvements, modifications or changes without departing from the principles of this application, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes or combinations, or the direct application of the inventive concept and technical solution to other occasions without improvement, should be regarded as the scope of protection of this application.

Claims

1. A cleaning device for a wafer processing thinning device, comprising a housing (1), a placement device (6) for placing a wafer body (5), and a cleaning device (8) for cleaning the wafer body (5), characterized in that: A control body (2) is fixedly connected to the front end of the left side of the shell (1), a cleaning device (8) is fixedly connected inside the shell (1), and a horizontally arranged support plate (7) is installed on both the front and rear sides of the cleaning device (8), an electric telescopic body (4) is fixedly connected to the top of the cleaning device (8), and the top of the electric telescopic body (4) is fixedly connected to the shell (1), a feed trough (3) is opened on the top of the left side of the shell (1), and two front and rear arranged placement devices (6) are arranged inside the cleaning device (8), and the front and rear sides of the placement device (6) are fixedly connected to the installation body (9).

2. The cleaning device for wafer processing and thinning device according to claim 1, characterized in that: The placing device (6) comprises a limiting body (61), a support rod (62), a cross rod (63), a fixed shaft (64), a rubber ring (65), a top frame (66) and a clamping plate (67). The bottom of the limiting body (61) is fixedly connected to four vertically arranged and evenly distributed support rods (62). Two of the support rods (62) are fixedly connected to the left and right sides of the cross rod (63) in a group. The two cross rods (63) are respectively fixedly connected to the front and rear ends of two mutually parallel and longitudinally arranged fixed shafts (64). The top frame (66) is fixedly connected to the longitudinally arranged fixed shaft (64). The outer side of the fixed shaft (64) is fixedly connected to the rubber ring (65) which is evenly distributed. The rubber ring (65) is set in a group of three on the outer side of a wafer body (5). The left and right sides of the bottom of the top frame (66) are fixedly connected to the clamping plates (67) which are evenly distributed and longitudinally arranged. The top frame (66) is arranged on the top of the limiting body (61).

3. The cleaning device for a wafer processing and thinning device according to claim 2, characterized in that: The limiting body (61) comprises a fixing frame (611), a rubber block (612), a fixing plate (614) and a fixing ball (615); the fixing frame (611) is provided with evenly distributed through grooves (616) on the top; the fixing frame (611) is provided with mounting grooves (617) on both the front and rear inner walls of the through grooves (616) provided in the fixing frame (611); the mounting grooves (617) provided in the fixing frame (611) are provided with rubber blocks (612); the clamping plate (67) is provided in the through grooves (616) provided in the fixing frame (611); two rubber blocks (612) are provided in a group on the front and rear sides of the clamping plate (67); the rubber blocks (612) are provided in a group; A fixing plate (614) is fixedly connected to one side of the rubber block (612) close to the card plate (67); a first deformation groove (613) is provided in a transverse direction and is evenly distributed on one side of the rubber block (612) away from the card plate (67); two fixing balls (615) are fixedly connected to one side of the fixing plate (614) close to the card plate (67) and are arranged in a left and right manner; a transverse and arc-shaped card groove (69) is provided on both the front and rear sides of the card plate (67); a side of the fixing ball (615) away from the fixing plate (614) is arranged in the card groove (69) provided on the card plate (67); and a side of the card plate (67) away from the top frame (66) is arranged in an arc shape.

4. The cleaning device for wafer processing and thinning device according to claim 3, characterized in that: The bottom of the top frame (66) is tightly fitted with the fixed frame (611), the bottom of the support rod (62) is arranged below the bottom of the wafer body (5), and the two fixed frames (611) are respectively arranged on the front and rear sides of the cleaning device (8).

5. The cleaning device for wafer processing and thinning device according to claim 4, characterized in that: The cleaning device (8) comprises an ultrasonic cleaning body (81), a positioning shaft (82), a supporting body (83), a push rod (84) and a pushing body (85); the supporting body (83) is fixedly connected to the central position of the bottom of the ultrasonic cleaning body (81); the front and rear sides of the ultrasonic cleaning body (81) are fixedly connected to support plates (7); the top of the supporting body (83) is provided with a pushing body (85); the supporting body (83) is installed with a push rod (84); the top of the push rod (84) is rotatably connected to the electric telescopic body (4); the pushing body (85) comprises a push plate (851), a connecting rod (852) and a limit plate (853); The left and right sides of the bottom of the push plate (851) are fixedly connected to a vertically arranged connecting rod (852); one end of the connecting rod (852) away from the push plate (851) is fixedly connected to a horizontally arranged limiting plate (853); a through hole (854) is opened at the central position of the push plate (851); the push rod (84) passes through the through hole (854) opened on the push plate (851); the top of the push plate (851) is fixedly connected to four evenly distributed and vertically arranged positioning shafts (82); the left and right sides of the top of the support plate (7) are fixedly connected to two vertically arranged positioning shafts (82); and a mounting body (9) is provided above the pushing body (85) and the support plate (7); The mounting body (9) comprises a mounting block (91), an elastic tube (92) and an elastic seat (93); the mounting block (91) is fixedly connected with the elastic tube (92); the bottom of the elastic tube (92) is provided with the elastic seat (93); the elastic seat (93) is provided with evenly distributed third deformation grooves (94); the elastic tube (92) is provided with evenly distributed fourth deformation grooves (95); the bottom of the elastic tube (92) and the elastic seat (93) are in contact with each other; the positioning shaft (82) passes through the elastic tube (92) and the elastic seat (93); and the mounting blocks (91) are fixedly connected to the fixing frame (611) in a group of four.

6. The cleaning device for wafer processing and thinning device according to claim 5, characterized in that: The support body (83) comprises a base (831), a leaf spring (833), an eccentric wheel (835), a rotating shaft (836) and a mounting shaft (837). The base (831) is provided with vertically arranged sliding grooves (832) on both left and right sides. The bottom of the sliding groove (832) provided in the base (831) is fixedly connected with a leaf spring (833) arranged symmetrically in the front and rear directions. The two leaf springs (833) are arranged on the front and rear sides of the limiting plate (853). The base (831) is provided with a placement groove (834) at the top of the central position. The placement groove provided in the base (831) Two eccentric wheels (835) are arranged vertically and divided into front and rear parts in (834), and a mounting shaft (837) is fixedly connected below the central axis of the two eccentric wheels (835). A rotating shaft (836) is arranged on the outer side above the central axis of the eccentric wheel (835), and the end of the rotating shaft (836) away from the eccentric wheel (835) is installed in the base (831). A push rod (84) is arranged on the outer side of the mounting shaft (837), and a second deformation groove (68) is evenly distributed in the rubber ring (65). The bottom of the upper rubber ring (65) does not fit with the wafer body (5).

7. The cleaning device for wafer processing and thinning device according to claim 6, characterized in that: The front and rear ends of the limit plate (853) are arranged in an arc shape, and the arc positions of the front and rear ends of the limit plate (853) are respectively tightly fitted with the two spring leaves (833), the top of the eccentric wheel (835) and the push plate (851) are fitted with each other, and the bottom of the push plate (851) is tightly fitted with the base (831), and the distance from the axis of the rotating shaft (836) to the axis of the eccentric wheel (835) is the same as the distance from the axis of the mounting shaft (837) to the axis of the eccentric wheel (835).

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