Packaging manufacturing method of power module and packaging mold

Abstract

The invention relates to a packaging manufacturing method of a power supply module and a packaging mold, the mold comprises a mold cavity, a glue injection channel, an exhaust channel and a first sealing member, and the first sealing member is provided with a groove. The method comprises the following steps of: placing the PCB: placing the PCB in a mold cavity, and closing the mold: closing and locking the upper-layer mold and the lower-layer mold; glue injection and shaping: vacuumizing the mold cavity, injecting a glue injection material into the mold cavity, wrapping the PCB, maintaining pressure after glue injection is completed, hardening and shaping the internal glue injection material, combining the packaging body with the PCB to form a power module, and demolding: demolding and taking out the power module. After the PCB is reasonably arranged in the mold, the PCB is wrapped with the glue injection material in a vacuum glue injection mode, the power module is integrally formed and packaged, the glue climbing problem in the traditional technology does not exist in the glue injection process, the packaging quality is good, the packaging and forming technology is simplified, the forming efficiency is high, and the production cost is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of power module packaging and glue injection, and in particular, relates to a power module packaging manufacturing method and a packaging mold. Background Art

[0002] In the traditional power module packaging process, many power modules use metal or plastic shells, which are filled with resin and other fillers to improve the overall heat dissipation performance and mechanical strength of the module. At the same time, the fillers are used for insulation. However, due to the need to set up a shell, there will be glue creeping due to the viscosity characteristics of the injection material, and the manufacturing process is relatively complicated, which is not conducive to optimizing manufacturing costs and further miniaturization. Summary of the invention

[0003] In order to solve the above problems, the present invention is implemented according to the following technical solutions:

[0004] In one embodiment, a mold for encapsulating a power module includes a PCB circuit board for encapsulating the power module, the mold is provided with a plurality of mold cavities for accommodating the main body of the PCB circuit board, the mold is also provided with a glue injection channel and an exhaust channel connected to the mold cavity, an opening is provided on one side of the mold cavity, a first sealing member is provided on the outer side of the opening, and a groove for clamping the pin is provided on the first sealing member at a position corresponding to the placement position of the pin of the PCB circuit board of the power module.

[0005] In one embodiment, the mold includes an upper mold and a lower mold, the lower mold is provided with a glue injection channel and an exhaust channel connected to the mold cavity, an opening is provided on one side of the mold cavity of the lower mold, and the lower mold is provided with a first seal on the outer side of the opening, and the first seal is provided with a groove for clamping the pin at the placement position corresponding to the pin of the power module PCB circuit board.

[0006] In one embodiment, a second seal is provided on the bottom surface of the upper mold corresponding to the first seal. Both the first seal and the second seal are strip-shaped silicone. The side of the strip-shaped silicone corresponding to the opening is a flat plane, which is used to form a flat sealing surface at the opening of the mold cavity after the strip-shaped silicone is tightened with a pin.

[0007] In one embodiment, the groove matches the size and shape of the pin, and the width of the groove is set to be able to completely wrap the protruding part of the pin from the mold cavity, wherein the pin is integrally formed by a PCB circuit board.

[0008] In one embodiment, the mold further includes a pressure strip, and a fixing portion extending away from the mold cavity is provided at the bottom of the first sealing member. After the pressure strip and the first sealing member are embedded in the lower mold, the pressure strip presses the fixing portion.

[0009] In one embodiment, the first sealing member and the second sealing member are provided with corresponding protruding forming grooves on their inner side walls. The protruding forming grooves are provided at the gaps between the grooves, and the protruding forming grooves are formed by being recessed in a direction away from the mold cavity.

[0010] In one embodiment, the injection channel and the exhaust channel are arranged at diagonal positions of the mold cavity relative to the communicating portion of the mold cavity.

[0011] In one solution, the number of the mold cavities is set according to demand, and two adjacent mold cavities are connected by setting a connecting port, and the two connected mold cavities share a glue injection channel.

[0012] In one solution, a mold is used to perform plastic packaging of a power module, wherein a lower mold of the mold is provided with a mold cavity, an opening is provided on one side of the mold cavity, and a sealing member is provided on the opening. The packaging manufacturing method comprises the following steps:

[0013] S1, placing the PCB circuit board: placing the PCB circuit board in the lower mold, so that the PCB circuit board is located in the middle of the mold cavity of the lower mold, and the pins of the PCB circuit board extend from the opening of the mold cavity;

[0014] S2, mold closing; the upper mold and the lower mold are closed and locked, wherein the pins of the PCB circuit board are sealed and clamped by the seal set in the lower mold, and the opening of the mold cavity is flat and sealed;

[0015] S3, glue injection and shaping: the mold is sent into a vacuum environment for vacuum glue injection. After the glue injection, the internal glue injection material is hardened and shaped to form a package wrapped around the outside of the PCB circuit board. The package is combined with the PCB circuit board to form a power module;

[0016] S4, demoulding: separating the upper mold and the lower mold, and demoulding the finished power module that has been plastic-sealed.

[0017] In one solution, the glue injection process of step S3 is completed in the glue injection area, which is a vacuum environment with a closed design, and the mold cavities of the molds placed in the glue injection area can be evacuated to a vacuum at the same time before the glue injection is performed.

[0018] In one solution, a low-temperature and low-pressure packaging method is used during the glue injection and shaping in step S3, and the glue injection temperature is maintained within 240 degrees.

[0019] In one embodiment, the glue injection and molding process in step S3 is performed in a vacuum environment at room temperature.

[0020] In one embodiment, the injection material is a thermosetting plastic or a resin.

[0021] In one embodiment, after the glue injection in step S3 is completed, the glue is cured by maintaining pressure at room temperature for 24 hours, or by baking at 80°C for 2 hours, or by baking at 100°C-120°C for 30-40 minutes.

[0022] In one embodiment, the vacuum glue injection in the glue injection and shaping step S3 is performed by injecting glue at room temperature and pressure and then drawing a vacuum.

[0023] Beneficial effects of the present invention:

[0024] After the PCB circuit board is reasonably arranged in the mold, the present invention wraps the PCB circuit board with the injection material by vacuum injection, and the package of the power module is integrally formed. The injection process does not have the problem of glue creeping in the traditional process, the packaging quality is good, and the packaging molding process is simplified, the molding efficiency is high, and the production cost is reduced. The specific beneficial effects can be fully understood in the specific implementation or production practice. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the following is a brief introduction to the drawings required for use in the description of the embodiment. It is obvious that the drawings described below are only one solution of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 It is a three-dimensional diagram of a mold for power module packaging of the present invention;

[0027] Figure 2 It is a three-dimensional diagram of an upper mold of a mold for power module packaging of the present invention;

[0028] Figure 3 It is a three-dimensional diagram of a lower mold of a mold for power module packaging of the present invention;

[0029] Figure 4 It is a schematic diagram of the use of a PCB circuit board arranged in a lower mold in a mold for power module packaging of the present invention;

[0030] Figure 5 It is a cross-sectional perspective view of a lower layer mold in a mold for power module packaging of the present invention;

[0031] Figure 6 It is a top view of a strip of silicone in a mold for power module packaging of the present invention;

[0032] Figure 7 It is a process flow chart of a packaging manufacturing method of a power module of the present invention;

[0033] Figure 8It is a schematic diagram of a finished power module of a power module packaging manufacturing method of the present invention;

[0034] Figure 1-8 In the figure, 1. upper mold; 2. lower mold; 3. mold cavity; 4. glue injection channel; 5. exhaust channel; 6. first sealing member; 7. second sealing member; 8. PCB circuit board; 9. pins; 10. pressure strip; 11. fixing part; 12. protrusion molding groove; 13. connecting port; 14. groove; 15. overflow cavity; 16. top block; 17. opening; 18. package body; 19. protrusion. DETAILED DESCRIPTION

[0035] The present invention is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly pointed out that the following examples are only used to illustrate the present invention, but do not limit the scope of the present invention. Similarly, the following examples are only some embodiments of the present invention rather than all embodiments, and all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0036] The reference to "embodiment" in the present invention means that a particular feature, structure or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in the present invention may be combined with other embodiments.

[0037] In one embodiment, referring to Figure 1-Figure 3 A power module encapsulation mold is used to encapsulate the PCB circuit board of the power module. The mold is provided with a plurality of mold cavities 3 for accommodating the main body of the PCB circuit board. The mold is also provided with a glue injection channel 4 and an exhaust channel 5 connected to the mold cavity 3. The glue injection channel 4 is used to inject the glue injection material into the mold cavity 3; the exhaust channel 5 is used to exhaust air during vacuuming and glue injection. An opening 17 is provided on one side of the mold cavity 3, and a first sealing member 6 is provided on the outside of the opening 17. A groove 14 for clamping the pin 9 is provided on the first sealing member 6 at the placement position corresponding to the pin 9 of the PCB circuit board 8 of the power module. The groove 14 is used to clamp and wrap the fixed pin 9, so that the part of the pin 9 extending out of the mold cavity 3 is clamped. After the pin 9 is fixed, the first sealing member 6 can form a flat sealing surface at the opening 17 of the mold cavity 3, which can ensure the sealing performance while keeping the surface formed on the side of the opening 17 of the mold cavity 3 flat when the package body 18 of the power module is formed, thereby ensuring the packaging quality.

[0038] In one embodiment, referring to Figure 1-Figure 3, a power module packaging mold, the power module packaging mold is used to package the PCB circuit board of the power module, the power module packaging mold comprises an upper mold 1 and a lower mold 2, the lower mold 2 is correspondingly provided with a plurality of mold cavities 3 for accommodating the main part of the PCB circuit board, the lower mold 2 is provided with a glue injection channel 4 and an exhaust channel 5 connected with the mold cavity 3, the glue injection channel 4 is used to inject the glue injection material into the mold cavity 3; the exhaust channel 5 is used to exhaust air during vacuuming and glue injection, an opening 17 is provided on one side of the mold cavity 3 of the lower mold 2, and the lower mold 2 is provided with a strip-shaped first sealing member 6 on the outside of the opening to form a seal for the opening 17, and a groove 14 is provided on the first sealing member 6 at the placement position corresponding to the pin 9 of the PCB circuit board 8 of the power module, and the groove 14 is used to clamp and wrap the fixed pin 9, so that the part of the pin 9 extending out of the mold cavity 3 is clamped. During the injection of glue, the first sealant 6 can not only allow the pin 9 to extend out of the mold cavity and wrap and clamp the pin 9, but also, after the pin 9 is fixed, the first sealant 6 can form a smooth sealing surface at the opening 17 of the mold cavity 3, thereby ensuring the sealing performance and, when the encapsulation body 18 of the power module is formed, the surface formed on the side of the opening 17 of the mold cavity 3 remains smooth, thereby ensuring the packaging quality.

[0039] In one embodiment, a mold cavity can be opened in the upper mold 1, and the mold cavity on the upper mold 1 corresponds to the mold cavity on the lower mold 2. After the upper mold 1 and the lower mold 2 are combined, a mold cavity 3 is formed, which together serves as a molding cavity for injecting glue.

[0040] In one embodiment, referring to Figure 2 A second sealing member 7 is provided on the bottom surface of the upper mold 1 corresponding to the first sealing member 6. After the mold is closed, the second sealing member 7 is pressed against the first sealing member 6, which can further tightly wrap the pin 9 embedded in the groove 14 to avoid leakage during glue injection and ensure packaging quality.

[0041] As an example, the first seal 6 and the second seal 7 are strip-shaped silicone, and the side of the strip-shaped silicone corresponding to the opening is a flat plane, which is used to form a flat sealing surface at the opening of the mold cavity after the strip-shaped silicone tightens the pin. On the one hand, the silicone groove 14 has good deformation ability and sealing, which can make up for the manufacturing tolerance of the pin 9, tightly wrap the pin 9, and avoid the problem of excessive gap between the pin 9 and the mold and leakage of the injection material during injection. On the other hand, the silicone groove 14 can clamp the pin 9 through its material characteristics, so that the PCB circuit board 8 can be stably placed in the mold, and the position is not easy to shift, ensuring the packaging molding quality of the power module.

[0042] In some embodiments, in combination Figure 1-Figure 4, the pin 9 is integrally formed by the PCB circuit board 8, and the groove 14 matches the size and shape of the pin 9. The pressure formed after the upper mold 1 and the lower mold 2 are closed can tightly wrap the pin 9 with the groove 14, thereby improving the sealing effect. At the same time, the width of the groove 14 is set to be able to completely wrap the part of the pin 9 that extends out of the mold cavity 3. On the one hand, it can clamp the pin 9 part more stably, ensuring that the PCB circuit board 8 can be stably placed in the mold cavity 3 and is not easy to move, further ensuring the molding quality of the package. On the other hand, the preload force formed after the mold is closed and locked will not directly compress the pin 9 under the buffering effect of the strip silicone, thereby avoiding the bending, deformation and even failure of the pin 9, thereby ensuring the quality of the power module.

[0043] In some embodiments, in combination Figure 1 , Figures 3 to 6 The mold also includes a pressure strip 10. The bottom of the first seal 6 is provided with a fixing portion 11 extending away from the mold cavity 3. After the pressure strip 10 and the first seal 6 are embedded in the lower mold 2, the pressure strip 10 presses the fixing portion 11 of the first seal 6 to fix the first seal 6. The pressure strip 10 is installed by threaded fastening, etc., which is convenient for disassembly and replacement of the first seal 6. When installing and making the mold, it is necessary to ensure that the top surface of the first seal 6 and the pressure strip 10 are flush with the mold surfaces of the upper mold 1 and the lower mold 2 to avoid interference during mold closing and ensure the smooth progress of the mold closing process. At the same time, it also ensures that the first seal 6 and the second seal 7 are accurately docked, preventing the first seal 6 and the second seal 7 from protruding too much and deforming to produce gaps, thereby avoiding the problem of leakage of injection materials.

[0044] In some embodiments, Figure 2 and Figure 3 As shown, the inner side walls of the first sealing member 6 and the second sealing member 7 are correspondingly provided with a convex molding groove 12, which is arranged at the gap position between the grooves 14, and the convex molding groove 12 is formed by being recessed in a direction away from the mold cavity 3. Figure 8 As shown, during the injection of glue, a protrusion 19 can be formed on the side of the power module package 18, and the protrusion 19 is integrally formed with the package 18, and the protrusion 19 is located in the gap of the power module pin 9. When installing the power module, after the pin 9 is inserted into the pad, under the support of the protrusion 19, a gap is left between the power module and the pad for the welding air to be discharged, thereby ensuring the welding installation quality of the power module. The protrusion forming grooves 12 are preferably two and symmetrical to each other, so that two symmetrical protrusions 19 can be formed, and the supporting effect is better. The size of the protrusion forming groove 12 can be adjusted according to the size of the gap between the pins 9.

[0045] In some embodiments, Figure 1-Figure 3, the setting of the injection channel 4 and the exhaust channel 5, when injecting glue, the air entering the mold cavity 3 through the injection channel 4 along with the injection material can be quickly discharged from the exhaust channel 5, so as to avoid the residual gas affecting the molding quality of the package 18. It is worth noting that the injection channel 4 and the exhaust channel 5 are relatively arranged at the diagonal position of the mold cavity 3 at the connecting part with the mold cavity 3, so that the injection material enters the mold cavity 3 from the corner through the injection channel 4, and the injection material flows to the exhaust channel 5 at the diagonal position, so that the injection material can fill the mold cavity 3 more quickly, and ensure the molding efficiency and quality.

[0046] As an example, Figure 1-Figure 3 The inner diameter of the outer end of the injection channel 4 is larger, and the inner diameter of the inner end is smaller, and gradually decreases from the outside to the inside. The larger outer end is convenient for inserting the external funnel during injection, and is convenient for connecting with the injection equipment. In addition, after the injection is completed, the injection material remaining in the injection channel 4 will solidify and form. At this time, the injection material at the smaller inner end is relatively small even after solidification, which is convenient for disconnection and removal, and is convenient for demoulding the power module, which is conducive to improving production efficiency.

[0047] As an example, Figure 1 and Figure 3 A large overflow cavity 15 is provided in the middle of the exhaust channel 5. During the injection of glue, in order to ensure that the mold cavity 3 is completely filled with the injection material, an excessive amount of injection material will be injected into the mold cavity 3. After the mold cavity 3 is fully filled, the overflowing injection material is collected by the overflow cavity 15 to prevent the injection material from overflowing the mold, causing adhesion and difficulty in cleaning. In addition, the inner diameter of the part of the inner end of the exhaust channel 5 that is connected to the mold cavity 3 is relatively small. After the overflow injection material solidifies, a relatively slender material body is formed, which is easy to break after demoulding, so that the power module is better demoulded, which is conducive to improving production efficiency.

[0048] In some embodiments, Figure 2-Figure 4 The number of cavities 3 in the mold is set according to demand. For example, four cavities 3 are set in each mold. Two adjacent cavities 3 are connected through a connecting port 13. The two cavities 3 share a glue injection channel 4. Multiple power modules can be injected and molded at one time, which is beneficial to improving production efficiency.

[0049] The present invention aims to solve the problem that the traditional power module packaging process requires the provision of a housing, the viscosity characteristics of the injection material will cause glue creeping during the packaging process, the manufacturing process is complicated, and it is not conducive to optimizing the manufacturing cost and further miniaturization. A new power module packaging manufacturing method is proposed. The details are as follows:

[0050] In some embodiments, reference Figure 7The present invention provides a packaging manufacturing method for a power module, using a mold to perform plastic packaging processing of the power module, wherein the pin 9 of the power module is integrally formed by a PCB circuit board 8, that is, the pin 9 is a gold finger part of the PCB circuit board 8, and the lower mold 2 of the mold is provided with a mold cavity 3, and an opening 17 is provided on one side of the mold cavity 3, and a sealing member is provided on the opening. The packaging manufacturing method comprises the following steps:

[0051] S1, placing the PCB circuit board: placing the PCB circuit board in the lower mold, so that the PCB circuit board is located in the middle of the mold cavity of the lower mold, and the pins of the PCB circuit board extend from the opening of the mold cavity;

[0052] S2, mold closing; the upper mold and the lower mold are closed and locked, wherein the pins of the PCB circuit board are sealed and clamped by the seal set in the lower mold, and the opening of the mold cavity is flat and sealed;

[0053] S3, glue injection and shaping: the mold is sent into a vacuum environment for vacuum glue injection. After the glue injection, the internal glue injection material is hardened and shaped to form a package wrapped around the outside of the PCB circuit board. The package body and the PCB circuit board are combined to form a power module. This method is conducive to the use of low-temperature and low-pressure packaging methods, or carried out under normal temperature and pressure environment. The glue injection temperature requirement is low and the molding pressure requirement is small. The glue injection process is safer for internal devices.

[0054] S4, demoulding: separating the upper mold and the lower mold, and demoulding the finished power module that has been plastic-sealed.

[0055] As an example, the seal may be the first seal 6 .

[0056] As an example, the glue injection process of step S3 is completed in the glue injection area. The glue injection area is a vacuum environment with a closed design, which can simultaneously evacuate the mold cavities of the molds placed in the glue injection area to a vacuum state before glue injection. Specifically, the air in the mold cavities of multiple molds in the glue injection area is evacuated to form a vacuum negative pressure state, and then glue injection is performed. This method can evacuate multiple molds in the glue injection area at the same time, thereby improving production efficiency. At the same time, the mold can be placed on a pallet and transferred to the glue injection area by a conveying device, which is easy to carry out automated and large-scale production, thereby improving production efficiency.

[0057] As an example, a low-temperature and low-pressure packaging method is used in step S3, and the injection temperature is maintained within 240 degrees. In this example, the temperature during injection is at room temperature, that is, after the mold is treated in the vacuum environment of the injection area, the mold cavity 3 forms a vacuum negative pressure state, and basically no pressure is applied during injection, so the injection work of step S3 can be achieved, which is conducive to ensuring the safety of circuit board components.

[0058] As an example, during the glue injection and shaping in step S3, the glue injection is maintained at room temperature for 24 hours after the glue injection is completed, so that the glue injection material hardens and shapes. In order to improve the efficiency of shaping, baking can also be used for shaping, such as sending the mold to an 80°C baking environment for 2 hours of baking and thermal curing, or using 100°C-120°C baking for 30-40 minutes for curing and shaping, reducing the shaping time of the glue injection material, thereby improving the packaging efficiency. The baking temperature of the thermal curing can be flexibly set within the temperature resistance range of the PCB circuit board according to the processing time requirements.

[0059] As an example, the vacuum glue injection in the glue injection and shaping step S3 can be performed by injecting glue at room temperature and pressure and then drawing a vacuum.

[0060] As an example, the injection material is a thermosetting plastic or resin, the package has a good molding effect, excellent insulation performance, and ensures that the package can withstand the temperature of wave soldering when the pins are soldered, avoiding deformation or damage to the package.

[0061] In some embodiments, Figure 2 A top block 16 that can move up and down is provided at the bottom of the mold cavity 3 of the lower mold 2. During demolding, after the upper mold 1 is separated from the lower mold 2, the top block 16 moves upward under the drive of an external device to eject the power module from the lower mold 2, completing the demolding, which is easy for automated production.

[0062] In general, the present invention first evacuates the mold cavity of the mold to a vacuum, and then injects the injection material into the mold, which is conducive to reducing the injection temperature and pressure, or the injection process can be carried out under normal temperature and pressure, and then evacuated to protect the safety of the power module components. In addition, by reasonably setting the mold structure, the mold has good sealing performance, the package molding speed is fast, and the molding quality is good. The production efficiency of the power module products is effectively improved and the quality of the products is guaranteed.

[0063] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the present invention; the dimensions of the drawings are independent of the specific objects, and the dimensions of the objects can be changed arbitrarily.

Claims

1. A power module packaging mold, used for packaging a PCB circuit board of a power module, characterized in that: The mold is provided with a plurality of mold cavities for accommodating the main body of the PCB circuit board. The mold is also provided with a glue injection channel and an exhaust channel connected to the mold cavity. An opening is provided on one side of the mold cavity, and a first sealing member is provided on the outer side of the opening. The first sealing member is provided with a groove for clamping the pin at a position corresponding to the placement position of the pin of the power module PCB circuit board.

2. The power module packaging mold according to claim 1, characterized in that: The mold includes an upper mold and a lower mold, the lower mold is provided with a glue injection channel and an exhaust channel connected to the mold cavity, an opening is provided on one side of the mold cavity of the lower mold, and the lower mold is provided with a first seal on the outer side of the opening, and the first seal is provided with a groove for clamping the pin at a placement position corresponding to the pin of the power module PCB circuit board.

3. A power module packaging mold according to claim 2, characterized in that: A second seal is arranged on the bottom surface of the upper mold corresponding to the first seal. Both the first seal and the second seal are strip-shaped silicone. The side of the strip-shaped silicone corresponding to the opening is a flat plane, which is used to form a flat sealing surface at the opening of the mold cavity after the strip-shaped silicone is tightened with pins.

4. A power module packaging mold according to claim 1 or 2, characterized in that: The groove matches the size and shape of the pin, and the width of the groove is set to fully wrap the protruding part of the pin from the mold cavity, wherein the pin is integrally formed by a PCB circuit board.

5. The power module packaging mold according to claim 2, characterized in that: The mold further comprises a pressure strip, and a fixing portion extending away from the mold cavity is arranged at the bottom of the first sealing member. After the pressure strip and the first sealing member are both embedded in the lower mold, the pressure strip presses the fixing portion.

6. The power module packaging mold according to claim 2, characterized in that: The inner side walls of the first sealing member and the second sealing member are correspondingly provided with raised forming grooves, the raised forming grooves are arranged at the gap positions between the grooves, and the raised forming grooves are formed by being recessed in a direction away from the mold cavity.

7. The power module packaging mold according to claim 1, characterized in that: The injection channel and the exhaust channel are arranged at diagonal positions of the mold cavity relative to the communicating parts of the mold cavity.

8. The power module packaging mold according to claim 1, characterized in that: The number of the mold cavities is set according to demand, and two adjacent mold cavities are connected by setting a connecting port, and the two connected mold cavities share a glue injection channel.

9. A method for packaging and manufacturing a power module, characterized in that: A mold is used to perform plastic packaging processing on the power module, wherein a lower mold of the mold is provided with a mold cavity, an opening is provided on one side of the mold cavity, and a sealing member is provided on the opening. The packaging manufacturing method comprises the following steps: S1, placing the PCB circuit board: placing the PCB circuit board in the lower mold, so that the PCB circuit board is located in the middle of the mold cavity of the lower mold, and the pins of the PCB circuit board extend from the opening of the mold cavity; S2, mold closing; the upper mold and the lower mold are closed and locked, wherein the pins of the PCB circuit board are sealed and clamped by the seal set in the lower mold, and the opening of the mold cavity is flat and sealed; S3, glue injection and shaping: the mold is sent into a vacuum environment for vacuum glue injection. After the glue injection, the internal glue injection material is hardened and shaped to form a package wrapped around the outside of the PCB circuit board. The package is combined with the PCB circuit board to form a power module; S4, demoulding: separating the upper mold and the lower mold, and demoulding the finished power module that has been plastic-sealed.

10. The packaging manufacturing method according to claim 9, characterized in that: The glue injection process of step S3 is completed in the glue injection area, which is a vacuum environment with a closed design. The mold cavities of the molds placed in the glue injection area can be evacuated to a vacuum at the same time before the glue injection is performed.

11. The packaging manufacturing method according to claim 9, characterized in that: During the glue injection and shaping in step S3, a low temperature and low pressure packaging method is adopted, and the glue injection temperature is maintained within 240 degrees.

12. The packaging manufacturing method according to claim 9, characterized in that: The glue injection and shaping process in step S3 is carried out in a vacuum environment at room temperature.

13. The packaging manufacturing method according to claim 9, characterized in that: The injection material is thermosetting plastic or resin.

14. The packaging manufacturing method according to claim 9, characterized in that: The glue injection and shaping in step S3, after the glue injection is completed, is cured and shaped by maintaining pressure at room temperature for 24 hours, or by baking at 80°C for 2 hours, or by baking at 100°C-120°C for 30-40 minutes.

15. The packaging manufacturing method according to claim 9, characterized in that: The vacuum glue injection in the glue injection and shaping step S3 is performed by injecting glue at room temperature and pressure and then evacuating the glue.

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