Preparation process of chip tray

Abstract

The invention relates to a preparation process of a chip tray, which comprises the following steps: S1, proportioning the raw materials of the chip tray in parts by weight: 35-60 parts of polystyrene, 5-25 parts of PPO resin, 5-10 parts of PA resin, 20-30 parts of modified reinforced fibers, 6-8 parts of a toughening agent, 0.1-0.5 part of an antistatic agent, 5-8 parts of a filling agent, 6-10 parts of a compatilizer, 0.5-1 part of a dispersing agent, 5-7 parts of pigment master batch and 4-9 parts of modified glass beads; s2, mixing the raw materials in the step S1, blending, melting and extruding, and cooling to obtain raw material master batch; and S3, preparing a sheet material from the raw material master batch obtained in the S2, heating the sheet material to soften the sheet material, and then sequentially carrying out plastic uptake molding and demolding cutting to obtain the chip tray. The chip tray plastic uptake part has excellent wear resistance and heat resistance, so that the obtained chip tray plastic uptake part can ensure that the chip is not easy to damage in the transportation process in the application process.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing, in particular to a preparation process of a chip tray. Background Art

[0002] Chip trays, also known as IC trays, are packaging trays used by semiconductor packaging and testing companies for their chip (IC) packaging and testing. This type of tray is mainly used in the production and testing process of electronic products to ensure the safe transportation and protection of chips. Chip trays are usually made of plastic, which can effectively prevent static electricity from touching, protect chips from damage, and facilitate automated testing and installation. In addition, chip trays also have anti-static and high temperature resistance functions, and can remain stable in high temperature environments to protect chips from damage.

[0003] The material selection of the chip tray is very important. If an inappropriate material is selected, the tray may not work properly in a high temperature environment or even damage the chip. Metal materials will melt at high temperatures, and non-metallic materials such as aluminum nitride ceramics have strong thermal conductivity, but their temperature resistance and wear resistance also need to be considered.

[0004] In addition, defects in the manufacturing process may lead to unstable quality of the pallet, affecting its use effect. If the surface of the pallet is not properly treated, impurities may remain, affecting its plasticity and use effect.

[0005] Therefore, it is desired to provide a chip tray preparation process that can solve the above technical problems. Summary of the invention

[0006] The object of the present invention is to provide a preparation process of a chip tray, which exhibits excellent wear resistance and heat resistance, so that the obtained chip tray blister can ensure that the chip is not easily damaged during transportation during application.

[0007] In order to achieve the above object of the invention, a process for preparing a chip tray is provided, comprising the following steps:

[0008] S1. Proportion the raw materials of the chip tray, wherein the raw materials include, by weight: 35-60 parts of polystyrene, 5-25 parts of PPO resin, 5-10 parts of PA resin, 20-30 parts of modified reinforcing fiber, 6-8 parts of toughening agent, 0.1-0.5 parts of antistatic agent, 5-8 parts of filler, 6-10 parts of compatibilizer, 0.5-1 parts of dispersant, 5-7 parts of pigment masterbatch, and 4-9 parts of modified glass microspheres;

[0009] S2, mixing the raw materials in step S1, blending and melt-extruding them, and then cooling them to obtain a raw material masterbatch;

[0010] S3, firstly make a sheet from the raw material masterbatch obtained in S2, and heat the sheet to soften it, and then successively carry out vacuum forming, demoulding and cutting to obtain a chip tray.

[0011] Specifically, in step S1, the modified reinforcing fiber is prepared by the following process:

[0012] A1. Pretreatment of reinforcing fibers;

[0013] A2. The pretreated fiber is coated and mixed with a modified adhesive solution, wherein the modified adhesive solution is composed of a compound of polyphenylene sulfide, acrylate, polyetherimide, epoxy resin and polysulfone resin.

[0014] Furthermore, the modified reinforcing fiber pretreatment specifically includes: firstly placing the glass fiber in an 8-25% by mass sodium hydroxide aqueous solution, stirring at 70-85° C., and then freeze-drying to obtain the pretreated reinforcing fiber.

[0015] Furthermore, the glass fiber and the sodium hydroxide aqueous solution are used in a weight ratio of 1:(2-3).

[0016] Specifically, in step S1, the dispersant is any one or more mixtures of stearamide, silica gel and calcium stearate.

[0017] Specifically, the modified glass microspheres are prepared by the following process:

[0018] B1. Mixing a silane coupling agent and an acetone solution in a mass ratio of 1:(5-9) to obtain a modified solution;

[0019] B2. Disperse the glass microbeads in the modified solution, stir and mix evenly, continue stirring at 80-90° C. for 10-15 minutes, and dry in an oven to finally obtain modified glass microbeads.

[0020] Specifically, the filler is any one or more mixtures of talc, glass fiber, carbon nanotube, nano-alumina and potassium titanate whisker.

[0021] Specifically, in step S2, the mixed raw material S1 is blended and melt-extruded by a twin-screw extruder, and then cooled to obtain a raw material masterbatch.

[0022] Specifically, in step S3, after the chip tray is prepared, an appearance inspection is performed on it.

[0023] Compared with the prior art, the preparation process of a chip tray of the present invention has the following advantages:

[0024] (1) The prepared chip tray exhibits excellent wear resistance and heat resistance, so that the obtained chip tray blister can ensure that the chip is not easily damaged during transportation during application;

[0025] (2) The chip tray in the present application has a resin raw material as a matrix and a cross-linked dispersed modified reinforcing fiber as a reinforcing skeleton, which is compatible with the two major characteristics of high strength and antistatic; while its various conditions are easy to control and achieve, the performance of the obtained product is stable and uniform, and it has excellent mechanical properties and antistatic properties, so it has high economic benefits and is suitable for industrial production;

[0026] (3) The production process is simplified and highly efficient and energy-saving. DETAILED DESCRIPTION

[0027] The present invention is further described below in conjunction with specific embodiments.

[0028] Example 1

[0029] A process for preparing a chip tray in this embodiment includes the following steps:

[0030] S1. The raw materials of the chip tray are proportioned, and the raw materials include, by weight: 35 parts of polystyrene, 5 parts of PPO resin, 10 parts of PA resin, 20 parts of modified reinforcing fiber, 8 parts of toughening agent, 0.5 parts of antistatic agent, 5 parts of filler, 6 parts of compatibilizer, 0.5 parts of dispersant, 5 parts of pigment masterbatch, and 5 parts of modified glass microbeads;

[0031] S2, mixing the raw materials in step S1, blending and melt-extruding them, and then cooling them to obtain a raw material masterbatch;

[0032] S3, firstly make a sheet from the raw material masterbatch obtained in S2, and heat the sheet to soften it, and then successively carry out vacuum forming, demoulding and cutting to obtain a chip tray.

[0033] Wherein, in this embodiment, in step S1, the modified reinforcing fiber is prepared by the following process:

[0034] A1. Pretreatment of reinforcing fibers;

[0035] A2. The pretreated fiber is coated and mixed with a modified adhesive solution, wherein the modified adhesive solution is composed of a compound of polyphenylene sulfide, acrylate, polyetherimide, epoxy resin and polysulfone resin.

[0036] The modified reinforcing fiber pretreatment specifically includes: firstly placing the glass fiber in a 25% by mass sodium hydroxide aqueous solution, stirring at 70° C., and then freeze-drying to obtain the pretreated reinforcing fiber.

[0037] In this embodiment, the weight ratio of the glass fiber to the sodium hydroxide aqueous solution is 1:2.

[0038] In this embodiment, in step S1, the dispersant is stearamide.

[0039] In this embodiment, the modified glass microspheres are prepared by the following process:

[0040] B1, mixing the silane coupling agent and the acetone solution in a mass ratio of 1:5 to obtain a modified solution;

[0041] B2. Disperse the glass microbeads in the modified solution, stir and mix evenly, continue stirring at 80° C. for 10 min, and dry in an oven to finally obtain modified glass microbeads.

[0042] Wherein, the filler is talcum powder.

[0043] In this embodiment, in step S2, the mixed raw material S1 is blended and melt-extruded by a twin-screw extruder, and then cooled to obtain a raw material masterbatch.

[0044] In this embodiment, in step S3, after the chip tray is prepared, an appearance inspection is performed on it.

[0045] Example 2

[0046] A process for preparing a chip tray comprises the following steps:

[0047] S1. The raw materials of the chip tray are proportioned, and the raw materials include, by weight: 40 parts of polystyrene, 5 parts of PPO resin, 5 parts of PA resin, 20 parts of modified reinforcing fiber, 6 parts of toughening agent, 0.5 parts of antistatic agent, 5 parts of filler, 9 parts of compatibilizer, 0.5 parts of dispersant, 5 parts of pigment masterbatch, and 4 parts of modified glass microbeads;

[0048] S2, mixing the raw materials in step S1, blending and melt-extruding them, and then cooling them to obtain a raw material masterbatch;

[0049] S3, firstly make a sheet from the raw material masterbatch obtained in S2, and heat the sheet to soften it, and then successively carry out vacuum forming, demoulding and cutting to obtain a chip tray.

[0050] Specifically, in step S1, the modified reinforcing fiber is prepared by the following process:

[0051] A1. Pretreatment of reinforcing fibers;

[0052] A2. The pretreated fiber is coated and mixed with a modified adhesive solution, wherein the modified adhesive solution is composed of a compound of polyphenylene sulfide, acrylate, polyetherimide, epoxy resin and polysulfone resin.

[0053] Furthermore, the modified reinforcing fiber pretreatment specifically includes: firstly placing the glass fiber in a 25% by mass sodium hydroxide aqueous solution, stirring at 75° C., and then freeze-drying to obtain the pretreated reinforcing fiber.

[0054] Furthermore, the glass fiber and the sodium hydroxide aqueous solution are used in a weight ratio of 1:3.

[0055] Specifically, in step S1, the dispersant is any one or more mixtures of stearamide, silica gel and calcium stearate.

[0056] Specifically, the modified glass microspheres are prepared by the following process:

[0057] B1, mixing the silane coupling agent and the acetone solution in a mass ratio of 1:6 to obtain a modified solution;

[0058] B2. Disperse the glass microbeads in the modified solution, stir and mix evenly, continue stirring at 85° C. for 12 minutes, and dry in an oven to finally obtain modified glass microbeads.

[0059] Specifically, the filler is any one or more mixtures of talc, glass fiber, carbon nanotube, nano-alumina and potassium titanate whisker.

[0060] Specifically, in step S2, the mixed raw material S1 is blended and melt-extruded by a twin-screw extruder, and then cooled to obtain a raw material masterbatch.

[0061] Specifically, in step S3, after the chip tray is prepared, an appearance inspection is performed on it.

[0062] Example 3

[0063] A process for preparing a chip tray comprises the following steps:

[0064] S1. Proportion the raw materials of the chip tray, and the raw materials include, by weight: 40 parts of polystyrene, 5 parts of PPO resin, 5 parts of PA resin, 20 parts of modified reinforcing fiber, 6 parts of toughening agent, 0.5 parts of antistatic agent, 5 parts of filler, 9 parts of compatibilizer, 0.5 parts of dispersant, 5 parts of pigment masterbatch, and 4 parts of modified glass microbeads;

[0065] S2, mixing the raw materials in step S1, blending and melt-extruding them, and then cooling them to obtain a raw material masterbatch;

[0066] S3, firstly make a sheet from the raw material masterbatch obtained in S2, and heat the sheet to soften it, and then successively carry out vacuum forming, demoulding and cutting to obtain a chip tray.

[0067] Specifically, in step S1, the modified reinforcing fiber is prepared by the following process:

[0068] A1. Pretreatment of reinforcing fibers;

[0069] A2. The pretreated fiber is coated and mixed with a modified adhesive solution, wherein the modified adhesive solution is composed of a compound of polyphenylene sulfide, acrylate, polyetherimide, epoxy resin and polysulfone resin.

[0070] Furthermore, the modified reinforcing fiber pretreatment specifically includes: firstly placing the glass fiber in a 25% by mass sodium hydroxide aqueous solution, stirring at 85° C., and then freeze-drying to obtain the pretreated reinforcing fiber.

[0071] Furthermore, the glass fiber and the sodium hydroxide aqueous solution are used in a weight ratio of 1:3.

[0072] Specifically, in step S1, the dispersant is any one or more mixtures of stearamide, silica gel and calcium stearate.

[0073] Specifically, the modified glass microspheres are prepared by the following process:

[0074] B1, mixing the silane coupling agent and the acetone solution in a mass ratio of 1:9 to obtain a modified solution;

[0075] B2. Disperse the glass microbeads in the modified solution, stir and mix evenly, continue stirring at 90° C. for 15 minutes, and dry in an oven to finally obtain modified glass microbeads.

[0076] Specifically, the filler is any one or more mixtures of talc, glass fiber, carbon nanotube, nano-alumina and potassium titanate whisker.

[0077] Specifically, in step S2, the mixed raw material S1 is blended and melt-extruded by a twin-screw extruder, and then cooled to obtain a raw material masterbatch.

[0078] Specifically, in step S3, after the chip tray is prepared, an appearance inspection is performed on it.

[0079] The raw material masterbatch sheets obtained in the above Examples 1-3 were extracted, and then their tensile strength MPa, elongation at break % and surface resistivity Ω were tested according to the above measurement steps and standards. The average values ​​of the test results were recorded in the following table:

[0080] Test items Tensile strength(Mpa) Elongation at break (%) Surface resistivity(Ω) Example 1 59.8 38 <![CDATA[6.1*10 9 ]]> Example 2 62.5 40 <![CDATA[6.3*10 9 ]]> Example 3 61.3 39 <![CDATA[6.5*10 9 ]]>

[0081] It can be seen from the above table that the antistatic high-strength chip trays prepared in Examples 1-6 all have excellent mechanical properties, with a tensile strength of up to 59.8-62.5 MPa; an elongation at break of 38-40%; and a surface resistivity of 6.1*10 9 ~6.5*10 9 Ω.

[0082] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A process for preparing a chip tray, characterized in that: The following steps are included: S1. Proportion the raw materials of the chip tray, wherein the raw materials include, by weight: 35-60 parts of polystyrene, 5-25 parts of PPO resin, 5-10 parts of PA resin, 20-30 parts of modified reinforcing fiber, 6-8 parts of toughening agent, 0.1-0.5 parts of antistatic agent, 5-8 parts of filler, 6-10 parts of compatibilizer, 0.5-1 parts of dispersant, 5-7 parts of pigment masterbatch, and 4-9 parts of modified glass microspheres; S2, mixing the raw materials in step S1, blending and melt-extruding them, and then cooling them to obtain a raw material masterbatch; S3, firstly make a sheet from the raw material masterbatch obtained in S2, and heat the sheet to soften it, and then successively carry out vacuum forming, demoulding and cutting to obtain a chip tray.

2. A process for preparing a chip tray according to claim 1, characterized in that: In step S1, the modified reinforcing fiber is prepared by the following process: A1. Pretreatment of reinforcing fibers; A2. The pretreated fiber is coated and mixed with a modified adhesive solution, wherein the modified adhesive solution is composed of a compound of polyphenylene sulfide, acrylate, polyetherimide, epoxy resin and polysulfone resin.

3. A process for preparing a chip tray according to claim 2, characterized in that: The modified reinforcing fiber pretreatment specifically includes: firstly placing the glass fiber in an 8-25 mass percent sodium hydroxide aqueous solution, stirring at 70-85° C., and then freeze-drying to obtain the pretreated reinforcing fiber.

4. A process for preparing a chip tray as claimed in claim 3, characterized in that: The amount of the glass fiber and the sodium hydroxide aqueous solution is 1: (2-3) by weight ratio.

5. The process for preparing a chip tray according to claim 1, characterized in that: In step S1, the dispersant is any one or more mixtures of stearamide, silica gel and calcium stearate.

6. The process for preparing a chip tray according to claim 1, characterized in that: The modified glass microspheres are prepared by the following process: B1. Mixing a silane coupling agent and an acetone solution in a mass ratio of 1:(5-9) to obtain a modified solution; B2. Disperse the glass microbeads in the modified solution, stir and mix evenly, continue stirring at 80-90° C. for 10-15 minutes, and dry in an oven to finally obtain modified glass microbeads.

7. A process for preparing a chip tray according to claim 6, characterized in that: The filler is any one or more mixtures of talcum powder, glass fiber, carbon nanotube, nano alumina and potassium titanate whisker.

8. The process for preparing a chip tray according to claim 1, characterized in that: In step S2, the mixed raw material S1 is blended and melt-extruded by a twin-screw extruder, and then cooled to obtain a raw material masterbatch.

9. The process for preparing a chip tray according to claim 1, characterized in that: In step S3, after the chip tray is prepared, an appearance inspection is performed on it.