Horizontal copper plating production line and control methods

Abstract

This invention relates to the field of circuit board manufacturing equipment technology, and discloses a horizontal copper plating production line and its control method. The horizontal copper plating production line includes a reaction tank, a spray assembly, and a controller. The spray assembly includes a fixed base, a drive motor, and at least two spray pipes. The fixed base is fixed on the reaction tank, and a motor bracket is provided in the middle of the fixed base. At least one rotary joint is arranged on each side of the motor bracket. The drive motor is mounted on the motor bracket, and the output shaft of the motor is connected to an eccentric rotating shaft. The eccentric rotating shaft is connected to a first connecting rod, and the other end of the first connecting rod is provided with a transmission shaft. A horizontal sliding groove is provided at the upper end of the motor bracket, and the transmission shaft passes through the sliding groove. The input end of the spray pipe is installed on the rotary joint, and the rotary joint is provided with a flow control valve. A second connecting rod is connected to the outer wall of the spray pipe, and the other end of the second connecting rod is hinged to the transmission shaft. The spray pipe is provided with two first spray nozzles. The controller drives the motor and the flow control valve, which are electrically connected to the controller.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing equipment technology, and in particular to a horizontal copper plating production line and its control method. Background Technology

[0002] Circuit boards are important electronic components, serving as the support for electronic devices and the carrier for their electrical connections. Immersion copper plating, short for chemical copper plating, involves a redox reaction in a copper plating bath after drilling, forming a copper layer that metallizes the holes. This deposits copper onto the originally insulating substrate surface, achieving electrical connectivity between layers. Immersion copper plating is widely used in the production of printed circuit boards with through-holes.

[0003] Existing copper plating equipment generally includes a frame, tank, spraying mechanism, and conveying mechanism. The circuit board is placed horizontally on rollers for transport. A spraying device above the rollers sprays the solution onto the circuit board. The solution reacts with the copper plating holes on the circuit board, and copper is deposited in the holes. However, existing copper plating equipment has the following problems: the spraying device only has a single outlet, the contact time between the circuit board and the solution on the rollers is relatively short, and the amount of solution is also relatively small, resulting in a longer reaction time for copper plating. Moreover, the copper plating in each hole is different, and it may even produce defective products. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a horizontal copper plating production line, which improves the spraying effect through structural improvements, helps to accelerate the reaction, and improves the consistency of copper plating in each hole.

[0005] This invention also proposes a control method applicable to the aforementioned horizontal copper plating production line.

[0006] According to a first aspect of the present invention, a horizontal copper plating production line includes a reaction tank, a spray assembly, and a controller. The reaction tank has an inner cavity, in which a conveying assembly is arranged to convey circuit boards. The spray assembly is connected to the reaction tank and includes a fixed base, a drive motor, and at least two spray pipes. The fixed base is fixed to the reaction tank, and a motor bracket is provided in the middle of the fixed base. At least one rotary joint is arranged on each side of the motor bracket. The drive motor is mounted on the motor bracket, and the output shaft of the motor is connected to an eccentric rotating shaft. The eccentric rotating shaft is connected to a first connecting rod, and a transmission shaft is provided at the other end of the first connecting rod. The motor bracket has a horizontal sliding groove at its upper end, the drive shaft passes through the sliding groove, the input end of the spray pipe is installed on the rotary joint, the rotary joint is equipped with a flow control valve, the outer wall of the spray pipe is connected to a second connecting rod, the other end of the second connecting rod is hinged to the drive shaft, the spray pipe has two oppositely arranged first spray nozzles, the first spray nozzles are in the shape of a straight line and extend along the axial direction of the spray pipe, when the drive shaft is located at the center of the sliding groove, the two first spray nozzles of the spray pipe are located on the same horizontal plane; the drive motor and the flow control valve are electrically connected to the controller.

[0007] The horizontal copper plating production line according to the first aspect of the present invention has at least the following beneficial effects:

[0008] The circuit board is conveyed by a conveying assembly. The liquid medicine enters the spray pipe through a rotary joint and then flows out from the two first spray ports of the spray pipe. The controller controls the drive motor of the spray assembly to run. The drive motor drives the second link through the first link, thereby driving the spray pipe to rotate. This causes the liquid medicine flowing out of the first spray port to swing. The spray assembly outputs multiple streams of liquid medicine. Moreover, the liquid medicine is in a swinging state, which increases the contact time between the liquid medicine and the circuit board and quickly covers the circuit board, accelerating the copper plating reaction. This makes the copper plating effect of each hole on the circuit board more similar and improves product quality.

[0009] According to some embodiments of the first aspect of the present invention, the output shaft of the motor is fixed to a turntable, the eccentric shaft is fixed to the side of the turntable, and the eccentric shaft is offset from the output shaft.

[0010] According to some embodiments of the first aspect of the present invention, the output shaft of the motor is fixed with a turntable, the periphery of the turntable is provided with a cam groove, and the eccentric shaft passes through the cam groove.

[0011] According to some embodiments of the first aspect of the present invention, the outer wall of the spray pipe is provided with two lugs, the two lugs are distributed on opposite sides of the spray pipe, the lugs are connected to pins, and the second connecting rod is provided with a through hole that engages with the pins.

[0012] According to some embodiments of the first aspect of the present invention, the spray pipe is further provided with a second spray port, the second spray port being located between two first spray ports, and the width of the second spray port being smaller than the width of the first spray port.

[0013] According to some embodiments of the first aspect of the present invention, the reaction tank is connected to two spray assemblies, the two spray assemblies are arranged opposite each other on two opposite sidewalls of the inner cavity, and the spray pipes of the two spray assemblies are arranged in an alternating manner.

[0014] According to some embodiments of the first aspect of the present invention, the end of the spray pipe opposite to the rotary joint is open, and a plug is installed in the opening.

[0015] According to some embodiments of the first aspect of the present invention, the reaction tank is connected to a filter device, the inner cavity includes a spray chamber and an immersion chamber, the spray assembly is located in the spray chamber, the outlet of the filter device is connected to the spray assembly through a pipe, the return port of the filter device is connected to the lower end of the immersion chamber through a pipe, a plurality of guide plates are provided in the immersion chamber, the guide plates are arranged at an inclination and the end near the spray assembly is the high end, and the two sides of the guide plates are respectively fixedly connected to the opposite side walls of the immersion chamber.

[0016] According to some embodiments of the first aspect of the present invention, a partition is provided between the spray chamber and the immersion chamber, a liquid passage hole is provided at the lower end of the partition, a guide plate is arranged in the liquid passage hole, and a detachable filter screen is connected to the lower end of the guide plate, the filter screen closing the channel formed by the guide plate and the reaction tank.

[0017] According to an embodiment of the second aspect of the present invention, a control method is applied to the horizontal copper plating production line described in the first aspect embodiment, the control method comprising the following steps:

[0018] S100, The circuit board is conveyed by the conveying assembly, and the circuit board moves in the inner cavity of the reaction tank;

[0019] S200, The controller controls the flow control valve to start, and the medicine flows out from the two first spray ports of the spray pipe and falls onto the circuit board;

[0020] S300, The controller controls the start of the drive motor, and the drive motor drives the second link through the first link, thereby driving at least two of the spray pipes to rotate, causing the liquid medicine flowing out of the first spray port to swing.

[0021] According to the control method of the second aspect of the present invention, in step S200, the flow rate of the spray pipe is controlled by the flow control valve, and the flow rate of the spray pipe satisfies:

[0022]

[0023] Where Q(t) is the flow rate at time t, The base flow rate (i.e., the minimum flow rate throughout the entire cycle), K is the flow rate variation coefficient, which is set according to the number of holes on the circuit board, T is the cycle duration, which is the time it takes for the circuit board to pass through the spray assembly during the movement, and t is the current time, calculated from the start of the cycle.

[0024] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0025] Additional aspects and advantages of the invention will become apparent and readily understood in conjunction with the following description of the embodiments, in which:

[0026] Figure 1 This is a cross-sectional view of the reaction tank in the first aspect embodiment of the present invention;

[0027] Figure 2 for Figure 1 A magnified view of a portion of point A;

[0028] Figure 3 This is a front view of the spray assembly in the first aspect embodiment of the present invention;

[0029] Figure 4 This is an exploded view of the spray assembly in the first aspect embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram showing the arrangement of two spray components in the first aspect embodiment of the present invention.

[0031] The attached icons are numbered as follows:

[0032] Reaction tank 100, spray chamber 101, immersion chamber 102, guide plate 110, baffle 120, liquid passage hole 121, filter screen 130;

[0033] Spray assembly 200, fixed base 210, drive motor 220, eccentric rotating shaft 221, first connecting rod 222, transmission shaft 223, turntable 224, spray pipe 230, first spray nozzle 231, support lug 232, pin 233, motor bracket 240, horizontal sliding groove 241, second connecting rod 242, rotary joint 250, plug 260. Detailed Implementation

[0034] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0035] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0036] In the description of this invention, the use of "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0037] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0038] Understandably, referring to Figures 1 to 4 The first aspect of the present invention provides a horizontal copper plating production line, which is used to perform copper plating on circuit boards. After drilling, the circuit board undergoes an oxidation-reduction reaction in the horizontal copper plating production line to form a copper layer, thereby metallizing the holes and depositing copper on the surface of the originally insulating substrate to achieve electrical communication between layers.

[0039] The core component of the horizontal copper plating production line is the reaction tank 100. The interior of the reaction tank 100 forms an inner cavity, within which a conveying assembly is arranged. This conveying assembly transports the circuit boards, allowing them to move horizontally within the inner cavity. The conveying assembly can be a series of chains, conveyor belts, rollers, or other conveying devices, ensuring that the circuit boards move smoothly and horizontally within the reaction tank 100 to contact the chemical solution inside.

[0040] Another key component of the horizontal copper plating production line is the spray assembly 200, which is connected to the reaction tank 100 and is used to spray the chemical solution onto the circuit board during the copper plating process. The spray assembly 200 includes a fixed base 210, a drive motor 220, at least two spray pipes 230, a motor bracket 240, a rotary joint 250, an eccentric rotating shaft 221, a first connecting rod 222, a transmission shaft 223, a sliding groove 241, a flow control valve, and a second connecting rod 242.

[0041] The fixed base 210 is fixed on the reaction tank 100. A motor bracket 240 is provided in the middle of the fixed base 210. At least one rotary joint 250 is arranged on each side of the motor bracket 240. The rotary joint 250 is used to connect the spray pipe 230, so that the liquid medicine can enter the spray pipe 230 and maintain a seal when the spray pipe 230 rotates. The drive motor 220 is mounted on the motor bracket 240. The output shaft of the drive motor 220 is connected to an eccentric rotating shaft 221. The eccentric rotating shaft 221 is connected to a first connecting rod 222. The other end of the first connecting rod 222 is provided with a transmission shaft 223. The transmission shaft 223 passes through the horizontal sliding groove 241 at the upper end of the motor bracket 240. The input end of the spray pipe 230 is installed on the rotary joint 250, which is equipped with a flow control valve to control the flow rate of the medicine entering the spray pipe 230. It is understood that an infusion pump is used to deliver the medicine, and the infusion pump is connected to the rotary joint 250 through a pipeline to input the medicine into the spray pipe 230. A second connecting rod 242 is connected to the outer wall of the spray pipe 230, and the other end of the second connecting rod 242 is hinged to the drive shaft 223. The spray pipe 230 is provided with two oppositely arranged first spray nozzles 231. The first spray nozzles 231 are straight and extend along the axial direction of the spray pipe 230. The medicine flowing out of the first spray nozzles 231 is in a waterfall shape. The length of the first spray nozzles 231 is set according to the width of the circuit board so that the sprayed medicine can cover the entire circuit board.

[0042] Reference Figure 3 When the drive shaft 223 is located at the center of the sliding groove 241, the two first spray nozzles 231 of the spray pipe 230 are located on the same horizontal plane, ensuring uniform spraying. When the drive motor 220 runs, it drives the first connecting rod 222 to move through the eccentric rotating shaft 221. The first connecting rod 222 drives the second connecting rod 242 through the drive shaft 223. The second connecting rod 242 drives the spray pipe 230 to rotate, so that the liquid medicine flowing out of the first spray nozzle 231 swings. The liquid medicine flowing out of the two first spray nozzles 231 contacts the circuit board during the swing, which can increase the contact time and the amount of liquid medicine.

[0043] The controller is the control center of the horizontal copper plating production line. The drive motor 220 and the flow control valve are electrically connected to the controller. The controller can be a PLC (Programmable Logic Controller) or a similar industrial control device, used to receive operating commands, control the start, stop, and speed of the drive motor 220, and the opening, closing, and regulation of the flow control valve. The controller can be connected to an operating interface (such as a touch screen or control panel), enabling operators to monitor the operating status of the production line and make necessary adjustments.

[0044] In actual production, the circuit board is first fed into the inner cavity of the reaction tank 100 by the conveying assembly. The chemical solution enters the spray pipe 230 through the rotary joint 250 and then flows out from the two first spray ports 231 of the spray pipe 230. The drive motor 220 of the spray assembly 200 is controlled by the controller. The drive motor 220 drives the second link 242 through the first link 222, thereby driving the spray pipe 230 to rotate. This causes the chemical solution flowing out from the first spray ports 231 to oscillate. The spray assembly 200 has at least two spray pipes 230 and outputs at least four streams of chemical solution. Moreover, the chemical solution is in an oscillating state, which increases the contact time between the chemical solution and the circuit board and allows the chemical solution to quickly cover the circuit board, accelerating the copper plating reaction. This makes the copper plating effect of each hole on the circuit board more uniform, improving product quality. The horizontal copper plating production line achieves automated and highly efficient copper plating processing, improving the production quality and consistency of circuit boards. In addition, the spray assembly 200 is assembled as a whole component and can be applied to existing horizontal copper plating production lines. Depending on the layout of the horizontal copper plating production line, an appropriate number of horizontal copper plating production lines can be selected and installed, making it suitable for circuit board manufacturing companies of various sizes.

[0045] Reference Figure 4 In some embodiments of the present invention, the connection method of the drive motor 220 and the first connecting rod 222 in the horizontal copper plating production line is specifically defined. A turntable 224 is fixed to the output shaft of the drive motor 220. The turntable 224 is a key component connecting the drive motor 220 and the eccentric shaft 221. The turntable 224 is typically made of a robust material, such as steel or aluminum alloy, to ensure stability and durability during high-speed rotation. The eccentric shaft 221 is fixed to the side of the turntable 224 and offset from the centerline of the output shaft of the drive motor 220. The eccentric design causes the eccentric shaft 221 to reciprocate with a fixed eccentricity when the turntable 224 rotates. This reciprocating motion is transmitted to the transmission shaft 223 via the first connecting rod 222, causing the transmission shaft 223 to reciprocate within the horizontal sliding groove 241, thereby driving the spray pipe 230 to reciprocate. The eccentricity of the eccentric shaft 221 can be adjusted as needed, for example, by replacing the turntable 224 with a different size to control the amplitude and speed of the spray pipe 230 rotation.

[0046] During the operation of the horizontal copper plating production line, after the motor starts, the output shaft drives the turntable 224 to rotate. The rotation of the turntable 224 drives the first connecting rod 222 to reciprocate through the eccentric rotating shaft 221. The first connecting rod 222 transmits the motion to the second connecting rod 242 through the transmission shaft 223, causing the spray pipe 230 to reciprocate within a certain angle range. This causes the liquid flowing out of the first spray nozzle 231 to oscillate, covering a wider area and thus spraying the circuit board more evenly and efficiently.

[0047] Understandably, in order to achieve precise spray control, the controller can adjust the speed of the drive motor 220, thereby controlling the rotation speed of the turntable 224 and the reciprocating speed of the eccentric shaft 221. Operators can adjust the spray speed and range according to the type of circuit board and the characteristics of the copper plating solution to achieve the best copper plating effect.

[0048] In other embodiments of the present invention, the turntable of the output shaft of the drive motor 220 in the horizontal copper plating production line has a different design. A cam groove is provided around the turntable. The cam groove is a through groove, and its shape and size are designed to fit the eccentric shaft 221. The eccentric shaft 221 passes through the cam groove. The center line of the eccentric shaft 221 is offset from the center line of the turntable. The eccentric design allows the eccentric shaft 221 to reciprocate along the cam groove when the turntable rotates under the drive of the motor. This reciprocating motion is transmitted to the transmission shaft 223 through the first connecting rod 222, causing the transmission shaft 223 to reciprocate within the horizontal sliding groove 241. This, in turn, drives the spray pipe 230 to reciprocate, achieving uniform spraying of the circuit board.

[0049] In practical applications, the rotation speed of the turntable and the eccentricity of the eccentric shaft 221 can be precisely controlled, thereby adjusting the rotation speed and amplitude of the spray pipe 230. Operators can adjust the operating parameters of the spray assembly 200 according to different copper plating requirements and circuit board sizes to achieve the best copper plating effect.

[0050] It is understandable that there are other possible connection structures between the second connecting rod 242 and the spray pipe 230. For example, a cable could be wound around the outer wall of the spray pipe 230, with one end fixed to the spray pipe 230 and the other end fixed to the second connecting rod 242. When the second connecting rod 242 moves with the drive shaft 223, the cable can pull the spray pipe 230 to rotate. Furthermore, a torsion spring is provided between the spray pipe 230 and the fixed base 210, using the force provided by the torsion spring to drive the spray pipe 230 to reset, thus achieving the rotation of the spray pipe 230. Alternatively, the second connecting rod 242 could be configured as a cable, wound around the spray pipe 230 once and fixed. The cable could move with the drive shaft 223, pulling the spray pipe 230 to rotate. A torsion spring is also provided between the spray pipe 230 and the fixed base 210, using the force provided by the torsion spring to drive the spray pipe 230 to reset.

[0051] Reference Figure 4 In some embodiments of this invention, the structure of the spray pipe 230 is specifically defined. The outer wall of the spray pipe 230 is provided with two lugs 232, distributed on opposite sides of the spray pipe 230. Each lug 232 is connected to a pin 233, which is connected to the second connecting rod 242. It is understood that providing two lugs 232 to the spray pipe 230 improves versatility. Whether the spray pipe 230 is installed on the left or right rotary joint 250, there is a corresponding lug 232 available, increasing assembly speed and reducing the number of specifications and production costs when manufacturing the spray pipe 230. The second connecting rod 242 is provided with a through hole for engaging the pin 233. The pin 233 passes through the through hole and is installed in the lug 232, allowing the second connecting rod 242 to rotate relative to the pin 233. The pin 233 can be a screw, one section of which is smooth and unthreaded. The smooth section is inserted into the through hole of the second link 242 to satisfy the requirement of free rotation of the second link 242. Alternatively, the pin 233 can also be a rivet, which is a smooth cylinder. When used with the through hole of the second link 242, it can also satisfy the requirement of free rotation of the second link 242.

[0052] It is understood that in some embodiments of the present invention, in addition to the two opposing first spray nozzles 231, the spray pipe 230 also has a second spray nozzle located between the two first spray nozzles 231. This arrangement helps to provide more uniform and comprehensive spray coverage. The width of the second spray nozzle is designed to be smaller than the width of the first spray nozzle 231, mainly because the second spray nozzle is located on the lower side of the spray pipe 230. Due to gravity, the second spray nozzle outputs the liquid the fastest. Therefore, setting the width of the second spray nozzle to be smaller balances the amount of liquid output, thereby optimizing the distribution of liquid output from each spray nozzle, making the liquid fall more evenly on the circuit board, thus improving the efficiency and quality of the copper plating process. By adding a second spray nozzle, the amount of liquid output can be further increased. When the spray pipe 230 reciprocates, the three streams of liquid swing and fall onto the circuit board, accelerating the contact speed between the liquid and the circuit board and increasing the contact area. Of course, the number of second spray nozzles can also be two, three, or more, depending on the size of the circuit board, the number of openings, and the operating speed of the horizontal copper plating production line. Since the spray pipe 230 is detachable, it can be achieved by replacing the spray pipe 230 with different specifications, which is simple and easy to use.

[0053] Furthermore, by adjusting the position and width of the second spray nozzle, it can be optimized according to the size and shape of different circuit boards to adapt to different production needs. The flexibility of the structure enables the horizontal copper plating production line to adapt to changing production scenarios, improving the versatility and practicality of the production line.

[0054] Understandably, in some embodiments of the present invention, the end of the spray pipe 230 facing away from the rotary joint 250 is designed to be open. This design allows for easier maintenance and inspection of the spray pipe 230. To ensure the sealing of the spray pipe 230 during use, a plug 260 is installed in the opening. The plug 260 is typically made of corrosion-resistant materials, such as stainless steel or engineering plastics, to withstand potentially corrosive chemical environments. The plug 260 is designed to ensure a tight fit with the opening of the spray pipe 230, preventing leakage of chemicals or external contaminants from entering the spray pipe 230. When maintenance or inspection is required, the plug 260 can be easily removed using a threaded connection and a sealing ring to prevent leakage. The opening of the spray pipe 230 and the fitting of the plug 260 help reduce maintenance time and improve production line operating efficiency. When the spray pipe 230 needs inspection or cleaning, the plug 260 can be quickly removed and then reinstalled to restore the spray pipe 230 to its working state.

[0055] Reference Figure 5 Considering the acceleration and improvement of spray uniformity, in some embodiments of the present invention, two spray components 200 can be used in combination. That is, the reaction tank 100 is connected to two spray components 200, which are arranged opposite each other on two opposite side walls of the inner cavity of the reaction tank 100. Taking two spray pipes 230 as an example, the spray pipes 230 of the two spray components 200 are staggered, meaning that along the conveying direction of the circuit board, there are four spray pipes 230 spraying the circuit board. The staggered arrangement of the spray pipes 230 helps to achieve more comprehensive spray coverage, ensuring that every part of the circuit board can be quickly covered by the solution, which can reduce copper deposition defects caused by uneven spraying. Of course, the spray components 200 can also use three or more spray pipes 230 in a staggered arrangement, which also meets the usage requirements. In practical applications, the design of the spray components 200 allows the operator to adjust the position and layout of the spray pipes 230 according to the size and shape of the circuit board to achieve the best spraying effect. Moreover, each spray pipe 230 has three or more output ports. The sprayed liquid swings under the drive of the spray pipe 230, which can fully cover the circuit board and accelerate the copper deposition reaction.

[0056] Reference Figure 1 In some embodiments of the present invention, the connection method between the reaction tank 100 and the filter device is defined. The reaction tank 100 is connected to the filter device in order to recover and clean the liquid medicine, prevent impurities from entering the copper plating process, and thus ensure the product quality of the circuit board.

[0057] The reaction tank 100 is divided into two parts: a spray chamber 101 and an immersion chamber 102. The spray assembly 200 is located in the spray chamber 101, and the outlet of the filter device is connected to the spray assembly 200 via a pipe. A pump is typically installed to deliver and pressurize the solution. The filter device removes impurities from the solution, ensuring its cleanliness. The return port of the filter device is connected to the lower end of the immersion chamber 102 via a pipe, allowing the reacted liquid to flow back to the filter device for recycling. The conveying assembly is positioned low in the immersion chamber 102, allowing the circuit board to be immersed in the solution, further enhancing the copper plating effect.

[0058] Understandably, considering that the circuit board may carry some particles after the holes are machined, and that copper produced by the reaction may also detach, a certain amount of impurities exist in the solution. Therefore, multiple guide plates 110 are installed in the immersion chamber 102. These guide plates 110 are arranged at an angle, with the end of the guide plate 110 closest to the spray assembly 200 being the higher end. When impurities in the solution flow, due to differences in specific gravity, they will accumulate at the bottom. The guide plates 110 act as guides and blocks, causing the impurities to flow along the bottom surface of the immersion chamber 102 and eventually enter the filtration device, where they are filtered out. The two sides of the guide plates 110 are fixedly connected to the opposite side walls of the immersion chamber 102, preventing impurities from moving upwards and increasing structural stability.

[0059] The length, placement angle, number of sets, and immersion depth of the guide plate 110 all affect the flow guiding effect. For example, the length of the guide plate 110 can be selected from 30m to 50m, and the placement angle can be from 30° to 60°, which can be adjusted according to the flow rate of the liquid.

[0060] Reference Figure 1 Furthermore, a partition 120 is provided between the spray chamber 101 and the immersion chamber 102. The partition 120 serves to isolate the two chambers and has a liquid passage hole 121, allowing the liquid to flow between the two chambers. A guide plate 110 is also arranged in the liquid passage hole 121, and a removable filter screen 130 is connected to the lower end of the guide plate 110. The function of the filter screen 130 is to prevent solid impurities from passing through, which helps to reduce the amount of impurities entering the immersion chamber 102. The removable design of the filter screen 130 allows for easy removal when cleaning or replacement is required, which facilitates maintenance and upkeep.

[0061] It is understandable that the guide plate 110 in the immersion chamber 102 can also be equipped with a filter screen 130 to gradually filter out impurities. Multiple filter screens 130 can be set to gradually increase the mesh size so that the liquid medicine flowing into the filtration device does not contain particulate impurities.

[0062] A second aspect of the present invention provides a control method applied to a horizontal copper plating production line according to a first aspect embodiment. The control method includes the following steps:

[0063] S100: The conveying component conveys the circuit board, which moves within the cavity of the reaction tank 100. The conveying component moves at a set speed to ensure that the circuit board moves smoothly within the cavity of the reaction tank 100. The circuit board is conveyed below the spraying component 200 to receive the spray of the liquid.

[0064] S200: The controller activates the flow control valve, allowing the chemical solution to flow from the two first spray ports 231 of the spray pipe 230 and onto the circuit board. The flow control valve regulates the flow rate of the chemical solution, ensuring it is sprayed from the spray ports at appropriate pressure and flow. The controller adjusts the opening of the flow control valve according to a preset program or operator instructions, thereby controlling the flow rate of the chemical solution. This step is crucial in the copper plating process and directly affects the distribution of the chemical solution on the circuit board.

[0065] S300: The controller starts the drive motor 220, which drives the second link 242 via the first link 222, thereby driving at least two spray pipes 230 to rotate, causing the liquid flowing from the first spray port 231 to oscillate. The reciprocating rotation of the spray pipes 230 causes the sprayed liquid to oscillate, which helps the liquid to cover the circuit board more evenly, increases the contact time between the liquid and the circuit board, and allows the liquid to quickly cover the circuit board, accelerating the copper plating reaction. This results in a more consistent copper plating effect across all holes on the circuit board, improving product quality. The horizontal copper plating production line achieves automated and highly efficient copper plating processing, improving the production quality and consistency of circuit boards.

[0066] The controller can be an advanced PLC system that automatically adjusts the operating parameters of the flow control valve and drive motor 220 based on the type, size, and required copper plating quality of the circuit board. Furthermore, the controller can monitor the production line status in real time, including the temperature of the chemical solution, the chemical concentration in the reaction tank 100, and the moving speed of the circuit board, to ensure the stability and consistency of the copper plating process.

[0067] In some embodiments of the second aspect of the present invention, in step S200, the flow rate of the spray pipe 230 is controlled by a flow control valve, and the flow rate of the spray pipe 230 satisfies:

[0068]

[0069] Where Q(t) is the flow rate at time t, Here, the base flow rate (i.e., the minimum flow rate throughout the entire cycle), K is the flow rate variation coefficient set according to the number of holes on the circuit board, T is the cycle duration, which is the time it takes for the circuit board to pass through the spray assembly 200 during its movement, and t is the current time, calculated from the start of the cycle. The flow rate of the spray pipe 230 is controlled according to the above equations, resulting in a higher flow rate of the sprayed liquid at the beginning and end of the circuit board's contact with the liquid, and a lower flow rate in the middle section. The higher flow rate in the initial section allows for rapid coverage of the circuit board, accelerating the reaction; the lower flow rate in the middle section helps conserve liquid, as the circuit board already has liquid on it; the increased flow rate in the later section is to increase copper plating at the rear holes of the circuit board, where the contact time with the liquid is relatively short, thus increasing the flow rate results in more uniform copper plating.

[0070] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A horizontal copper plating production line, characterized in that, include: A reaction tank, wherein the reaction tank is provided with an inner cavity, and a conveying assembly is arranged in the inner cavity to convey circuit boards; A spray assembly is connected to the reaction tank. The spray assembly includes a fixed base, a drive motor, and at least two spray pipes. The fixed base is fixed to the reaction tank. A motor bracket is provided in the middle of the fixed base. At least one rotary joint is arranged on each side of the motor bracket. The drive motor is mounted on the motor bracket. The output shaft of the motor is connected to an eccentric rotating shaft. The eccentric rotating shaft is connected to a first connecting rod. A transmission shaft is provided at the other end of the first connecting rod. A horizontal sliding groove is provided at the upper end of the motor bracket. The transmission shaft passes through the sliding groove. The input end of the spray pipe is installed on the rotary joint. The rotary joint is provided with a flow control valve. A second connecting rod is connected to the outer wall of the spray pipe. The other end of the second connecting rod is hinged to the transmission shaft. The spray pipe is provided with two oppositely arranged first spray nozzles. The first spray nozzles are straight and extend along the axial direction of the spray pipe. When the transmission shaft is located at the center of the sliding groove, the two first spray nozzles of the spray pipe are located on the same horizontal plane. The spray pipe is also provided with a second spray nozzle, which is located between the two first spray nozzles, and the width of the second spray nozzle is smaller than the width of the first spray nozzle. The reaction tank is connected to two spray assemblies, which are arranged opposite each other on two side walls of the inner cavity, and the spray pipes of the two spray assemblies are arranged in an alternating manner. The controller, the drive motor and the flow control valve are electrically connected to the controller; The flow rate of the spray pipe is controlled by the flow control valve, and the flow rate of the spray pipe satisfies the following: Where Q(t) is the flow rate at time t, Q b The base flow rate is the minimum flow rate within the entire cycle; K is the flow rate variation coefficient, which is set according to the number of holes on the circuit board; T is the cycle duration, which is the time it takes for the circuit board to pass through the spray assembly during the movement; and t is the current time, calculated from the start of the cycle. The reaction tank is connected to a filter device. The inner cavity includes a spray chamber and an immersion chamber. The spray assembly is located in the spray chamber. The outlet of the filter device is connected to the spray assembly through a pipe. The return port of the filter device is connected to the lower end of the immersion chamber through a pipe. Multiple guide plates are provided in the immersion chamber. The guide plates are arranged at an angle, with the end closest to the spray assembly being the high end. The two sides of the guide plates are respectively fixedly connected to the opposite side walls of the immersion chamber. A partition is provided between the spray chamber and the immersion chamber. A liquid passage hole is provided at the lower end of the partition. A guide plate is arranged in the liquid passage hole. A detachable filter screen is connected to the lower end of the guide plate. The filter screen closes the channel formed between the guide plate and the reaction tank. A filter screen is installed on the guide plate in the immersion chamber.

2. The horizontal copper plating production line according to claim 1, characterized in that, The output shaft of the motor is fixed to a turntable, and the eccentric shaft is fixed to the side of the turntable, with the eccentric shaft offset from the output shaft.

3. The horizontal copper plating production line according to claim 1, characterized in that, The output shaft of the motor is fixed to a turntable, and a cam groove is provided around the turntable. The eccentric shaft passes through the cam groove.

4. The horizontal copper plating production line according to claim 1, characterized in that, The outer wall of the spray pipe is provided with two lugs, which are distributed on opposite sides of the spray pipe. The lugs are connected to pins, and the second connecting rod is provided with through holes that cooperate with the pins.

5. A control method, applied to a horizontal copper plating production line as described in any one of claims 1 to 4, characterized in that, The control method includes the following steps: S100, The circuit board is conveyed by the conveying assembly, and the circuit board moves in the inner cavity of the reaction tank; S200, The controller controls the flow control valve to start, and the medicine flows out from the two first spray ports of the spray pipe and falls onto the circuit board; S300, The controller controls the start of the drive motor, and the drive motor drives the second link through the first link, thereby driving at least two of the spray pipes to rotate, causing the liquid medicine flowing out of the first spray port to swing.

6. The control method according to claim 5, characterized in that, In step S200, the flow rate of the spray pipe is controlled by the flow control valve, and the flow rate of the spray pipe satisfies the following: Where Q(t) is the flow rate at time t, Q b The base flow rate is the minimum flow rate throughout the entire cycle; K is the flow rate variation coefficient, which is set according to the number of holes on the circuit board; T is the cycle duration, which is the time it takes for the circuit board to pass through the spray assembly during its movement; and t is the current time, calculated from the start of the cycle.

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