Sensor unit and sensor assembly

By designing through holes and bending structures of conductive parts and resin molding parts in the sensor unit, the problem of falling off of resin molding parts is solved, the stability and strength of the sensor are improved, the structural design is simplified, and the occurrence of leakage current is reduced.

CN119309705APending Publication Date: 2025-01-14YAZAKI CORP
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Patent Information

Application Number
CN202410777210.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-07-14
Filing Date
2024-06-17
Publication Date
2025-01-14

AI Technical Summary

Technical Problem

In the conventional sensor unit, due to the connection structure problem between the resin molded part and the conductive member, the resin molded part is prone to fall off, which affects the stability and reliability of the sensor.

Method used

A sensor unit is designed, which includes a sensor element, a conductive member extending in parallel and a resin molding part covering the conductive member. The resin molding part passes through the through holes and bent parts of the conductive member during the molding process, and strengthens the conductivity through this structure. The fixation between the components and the resin molding part is prevented from falling off.

Benefits of technology

It effectively suppresses the fall of the resin molding part, improves the stability and strength of the sensor, simplifies the structural design, reduces the occurrence of leakage current, and improves the strength and reliability of assembly.

✦ Generated by Eureka AI based on patent content.

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Abstract

This sensor unit is provided with: a sensor element; a pair of conductive members extending in parallel with each other from the sensor element; and a resin molded part covering a part of the pair of conductive members, the pair of conductive members including: a base end part connected to the sensor element; a tip section positioned on the opposite side of the base section; and an intermediate portion that is a portion between the base end portion and the tip portion, the intermediate portion having a through-hole, and the resin molded portion covering the base end portion and the intermediate portion while exposing the tip portion.
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Description

Technical Field

[0001] Embodiments of the present invention relate to a sensor unit and a sensor assembly. Background Art

[0002] There is known a technique for measuring the state of a fluid or the like in a structure by using a sensor. For example, Patent Document 1 discloses a structure in which a sensor unit is provided on a wall of a flow path of an engine to measure the temperature of a fluid such as a lubricant, a coolant, or a fuel.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: European Patent No. 2485023 Summary of the invention

[0006] Technical problem that the invention aims to solve

[0007] In the sensor unit disclosed in Patent Document 1, since a polymer body is molded on a lead conductor connected to a temperature sensor element, the polymer body may fall off from the lead conductor.

[0008] One embodiment of the present invention provides a sensor unit and a sensor module capable of suppressing a resin molded portion from falling off from a pair of conductive members of a sensor module.

[0009] Technical solutions to the problem

[0010] A sensor unit according to an embodiment of the present invention comprises: a sensor element; a pair of conductive components extending parallel to each other from the sensor element; and a resin molded portion covering a portion of the pair of conductive components. The pair of conductive components includes: a base end portion connected to the sensor element; a terminal portion located on the opposite side of the base end portion; and a middle portion between the base end portion and the terminal portion, the middle portion having a through hole. The resin molded portion covers the base end portion and the middle portion while exposing the terminal portion.

[0011] A sensor assembly according to an embodiment of the present invention comprises: a sensor element; and a pair of conductive components extending from the sensor element in parallel with each other. The pair of conductive components comprises: a base end portion connected to the sensor element; a terminal portion located on the opposite side of the base end portion; and an intermediate portion between the base end portion and the terminal portion, the intermediate portion having a through hole.

[0012] Effects of the Invention

[0013] According to the sensor unit or the sensor module of one embodiment of the present invention, it is possible to suppress the resin molded portion from coming off from the pair of conductive members of the sensor module. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a perspective view of a sensor unit according to the embodiment.

[0015] Figure 2 yes Figure 1 Sectional view along line II-II.

[0016] Figure 3 It is a perspective view of a sensor assembly according to an embodiment.

[0017] Figure 4 yes Figure 3 Enlarged view of part IV.

[0018] Figure 5 It is a plan view of a pair of conductive members and a first molded portion according to the embodiment.

[0019] Figure 6 It is a partial perspective view of a pair of conductive members and a first molded portion according to the embodiment.

[0020] Figure 7 It is a perspective view for explaining the insertion procedure of the sensor unit according to the embodiment.

[0021] Figure 8 It is a perspective view for explaining a fitting procedure of the sensor unit according to the embodiment.

[0022] Fig. 9 It is a perspective view for explaining the creeping distance according to the comparative example.

[0023] Fig.10 It is a perspective view for explaining the creepage distance involved in the embodiment.

[0024] Fig.11 It is a partial perspective view of a pair of conductive members and a first molded portion according to a first modified example of the embodiment.

[0025] Fig.12 It is a partial perspective view of a pair of conductive members and a first molded portion according to a second modification example of the embodiment.

[0026] Description of Reference Numerals

[0027] 1 Sensor components

[0028] 2 Sensor element

[0029] 3 Conductive parts

[0030] 4 Resin molding department

[0031] 5. First sealing component

[0032] 6 Second sealing component

[0033] 9 Sensor unit

[0034] 31 Base end

[0035] 32 Middle

[0036] 32H Through hole

[0037] 33 terminal part

[0038] 41 First Forming Department

[0039] 41s Joint surface

[0040] 42 Second Forming Department

[0041] 42s joint surface

[0042] 81 Structure

[0043] 82 seats

[0044] 321 Bend

[0045] 411 protrusion

[0046] 411e End Face

[0047] 411g Groove

[0048] 411r bulge

[0049] 411v sleeve

[0050] 413 First sealing groove

[0051] 421 First recess

[0052] 422 Second recess

[0053] 423 Second sealing groove

[0054] 424 Flange

[0055] 425 Extension

[0056] 426 Anti-rotation mechanism

[0057] 821 Opening

[0058] 822 First locking part

[0059] 823 Second locking part

[0060] AX axis

[0061] D1 Creepage distance

[0062] D2 Creepage distance

[0063] P1 First edge

[0064] P2 Second edge DETAILED DESCRIPTION

[0065] <Implementation Method>

[0066] The sensor unit 9 of this embodiment is provided in a flow path where the fluid flows or in a structure such as a tank storing the fluid in order to measure the temperature of the fluid such as cooling water or oil.

[0067] (Structure of sensor unit)

[0068] like Figure 1 as well as Figure 2 As shown, the sensor unit 9 of the present embodiment includes a sensor assembly 1 , a resin molded portion 4 , a first sealing member 5 , and a second sealing member 6 . The sensor assembly 1 includes a sensor element 2 and a pair of conductive members 3 .

[0069] (Structure of sensor element)

[0070] The sensor element 2 is arranged across a pair of conductive members 3. Both ends of the sensor element 2 are joined (e.g., welded) to the pair of conductive members 3. The sensor element 2 is a temperature sensor for measuring the temperature of a fluid. The sensor element 2 is, for example, a thermistor. By measuring the electrical characteristics of the sensor element 2 corresponding to the temperature of the fluid via the pair of conductive members 3, the temperature of the fluid can be measured.

[0071] (Structure of conductive parts)

[0072] A pair of conductive components 3 extends in parallel from the sensor element 2. In the present embodiment, the pair of conductive components 3 is a lead frame. Hereinafter, the direction in which the pair of conductive components 3 extends is referred to as the Z direction, and directions intersecting each other in a plane facing the Z direction are referred to as the X direction and the Y direction. For example, the X direction, the Y direction, and the Z direction may be directions orthogonal to each other.

[0073] like Figure 3As shown, each conductive component 3 extends in the Z direction. Each conductive component 3 has a plate shape with the Y direction as the plate thickness direction. Each conductive component 3 has a certain plate thickness throughout the entire conductive component 3. Each conductive component 3 has a base end 31, an intermediate portion 32 and a terminal portion 33 in sequence toward the Z direction. The base end 31 is one of the two end portions extending from each conductive component 3. The terminal portion 33 is the end on the side opposite to the base end 31 of the two end portions extending from each conductive component 3. The intermediate portion 32 is a portion between the base end 31 and the terminal portion 33. The sensor element 2 is connected to the terminal end of the base end 31. The terminal portion 33 is a portion exposed from the resin molded portion 4. The base end 31 is a portion covered by the first molded portion 41 described later. In addition, the intermediate portion 32 is a portion covered by the second molded portion 42 described later.

[0074] like Figure 4 As shown, the middle portion 32 has a bent portion 321. The bent portion 321 is bent in a direction in which a pair of conductive components 3 are separated from each other in the X direction. The middle portion 32 has a through hole 32H. The through hole 32H penetrates in the Y direction. The through hole 32H is a circular hole. The through hole 32H is formed in a portion of the bent portion 321 where the width in the X direction becomes wider. The bent portion 321 has a first edge P1 on one side in the X direction and a second edge P2 on the other side in the X direction. The first edge P1 and the second edge P2 are arranged at different positions in the Z direction across a portion where the through hole 32H is arranged. The first edge P1 is inclined in the X direction relative to the Z direction in a manner that the width in the X direction of the bent portion 321 becomes wider in the portion where the through hole 32H is formed. The second edge P2 is inclined in the X direction relative to the Z direction in a manner that the width in the X direction of the bent portion 321 becomes wider in the portion where the through hole 32H is formed. The first edge P1 and the second edge P2 are arranged in the region where the through hole 32H is located in the Z direction. With this arrangement, the remaining widths W1 and W2 of the curved portions 321 on both sides of the through hole 32H become widths capable of maintaining the mechanical strength of each conductive component 3. In the present embodiment, the diameter of the through hole 32H is larger than W1 and larger than W2. In addition, the diameter of the through hole 32H is larger than half the width W3 of the smallest portion in the X direction of the intermediate portion 32.

[0075] (Structure of resin molded part)

[0076] like Figure 1 and Figure 2As shown, the resin molded portion 4 covers the base end portion 31 and the middle portion 32 while exposing the terminal portion 33. The resin molded portion 4 includes a first molded portion 41 and a second molded portion 42. A portion of the resin molded portion 4 is disposed inside the through hole 32H. In this embodiment, after the first molded portion 41 is formed by transfer molding, the second molded portion 42 is formed by injection molding. That is, a portion of the second molded portion 42 is disposed inside the through hole 32H.

[0077] The first molded portion 41 is formed of a resin having different properties from those of the second molded portion 42. The first molded portion 41 is formed of a resin that is softer and has higher thermal conductivity than the resin forming the second molded portion 42. As such a resin, for example, when the second molded portion 42 is formed of a polyamide (PA) resin or a polyphenylene sulfide (PPS) resin, the first molded portion 41 is formed of an epoxy resin.

[0078] The first molded portion 41 covers the base end portion 31 and the sensor element 2 so as to seal the base end portion 31 and the sensor element 2. The first molded portion 41 has a joining surface 41s to be joined to the second molded portion 42.

[0079] The first molded portion 41 has a first sealing groove 413 . The first sealing groove 413 has a circular ring shape extending in the circumferential direction of the outer peripheral surface of the first molded portion 41 on the outer peripheral surface of the first molded portion 41 .

[0080] The first molded portion 41 has a protrusion 411 on the joint surface 41s. The protrusion 411 protrudes toward the second molded portion 42 in the Z direction. The pair of conductive components 3 are arranged so as to pass through the protrusion 411. Figure 5 As shown, when viewed from the Z direction, which is the joining direction of the first molded part 41 and the second molded part 42, the protrusion 411 has an elliptical shape. The long axis direction of the elliptical shape is the same as the arrangement direction of the pair of conductive components 3. In this specification, "ellipse" generally refers to a shape that does not include a straight line portion, and can be any shape as long as it is not a perfect circle and has no corners, and can also be a shape that includes a straight line portion in the middle, or asymmetric (oval) on the left and right. On the other hand, the outer peripheral shape of the first molded part 41 when viewed from the Z direction is a perfect circle.

[0081] like Figure 6 As shown, the protrusion 411 has a groove 411g. The groove 411g is recessed toward the side away from the second molded portion 42 in the Z direction. When viewed from the Z direction, the groove 411g extends between a pair of conductive components 3 in the end surface 411e of the protrusion 411 in a manner that crosses the end surface 411e. In this embodiment, the width of the groove 411g in the X direction is more than half of the width between the pair of conductive components 3 in the X direction. In a cross section parallel to the ZX plane, the groove 411g has an arc shape.

[0082] The second molded portion 42 covers the middle portion 32 in a manner that seals the middle portion 32. Figure 1 and Figure 2 As shown, the second molded portion 42 has a joint surface 42s that is joined to the first molded portion 41. The second molded portion 42 has a first recess 421 on the joint surface 42s. The first recess 421 is recessed in the Z direction toward a side away from the first molded portion 41 in a shape corresponding to the protrusion 411. The second molded portion 42 is joined to the first molded portion 41 in a state where the protrusion 411 is embedded in the first recess 421 and the inner periphery of the first recess 421 is in contact with the outer periphery of the protrusion 411. Due to the shrinkage of the second molded portion 42 during molding, the second molded portion 42 clamps the protrusion 411 of the first molded portion 41 from both sides (both sides in the X direction and both sides in the Y direction).

[0083] The second molded portion 42 has a second recess 422 at one end of both ends in the Z direction, which is opposite to the end provided with the first recess 421. The second recess 422 is recessed toward the middle portion 32 in the Z direction. The respective terminal portions 33 of the pair of conductive members 3 are exposed in the second recess 422. Therefore, the respective terminal portions 33 of the pair of conductive members 3 are used as measurement terminals.

[0084] The second molded portion 42 has a second seal groove 423. The second seal groove 423 has an annular shape extending in the circumferential direction of the outer peripheral surface of the second molded portion 42. The second seal groove 423 is provided between the bent portion 321 and the joint surface 42s in the Z direction.

[0085] The second molded portion 42 includes a flange 424, a pair of extensions 425, and a rotation stopper 426 on the outer periphery of the second molded portion 42. The flange 424 extends over the entire periphery of the second molded portion 42 at a position in the Z direction including the boundary between the middle portion 32 and the terminal portion 33. The pair of extensions 425 protrude toward both sides in the X direction at a position in the Z direction between the second seal groove 423 and the flange 424. The rotation stopper 426 extends from the flange 424 along the outer periphery of the flange 424, and has a hook at the end of the extension.

[0086] (Structure of the First Sealing Member and the Second Sealing Member)

[0087] The first sealing member 5 is an O-ring embedded in the first sealing groove 413. The second sealing member 6 is an O-ring embedded in the second sealing groove 423. The first sealing member 5 and the second sealing member 6 are arranged so as to sandwich the joint surface 41s and the joint surface 42s. The first sealing member 5 and the second sealing member 6 seal the infiltration path of the fluid infiltrating between the joint surface 41s and the joint surface 42s.

[0088] (How to install the sensor unit)

[0089] The method of attaching the sensor unit will be described. To measure the temperature of a fluid such as cooling water or oil, an operator attaches the sensor unit 9 to a flow path where the fluid flows or to a structure 81 such as a tank storing the fluid.

[0090] First, if Figure 7 As shown, the operator inserts the sensor unit 9 into the seat surface 82 until the flange 424 contacts the seat surface 82 fixed to the structure 81. Here, the seat surface 82 has an opening 821 opened toward the inside of the structure 81 where the fluid flows or is stored. The seat surface 82 has: a first locking portion 822 that is a depression connected to a part of the opening 821; and a second locking portion 823 protruding from the seat surface 82. The operator inserts the sensor unit 9 into the opening 821 until the pair of extensions 425 are accommodated in the first locking portion 822.

[0091] Then, if Figure 8 As shown, the operator rotates the sensor unit 9 around the axis AX extending along the central axis of the sensor unit 9, hooks the pair of extensions 425 on the first locking portion 822, and hooks the anti-rotation mechanism 426 on the second locking portion 823. Through this operation, the operator fits the sensor unit 9 with the seat surface 82. In this way, the sensor unit 9 is fixed to the structure 81 by the pair of extensions 425 and the anti-rotation mechanism 426 in such a manner that the end of the sensor unit 9 contacts the fluid in the structure 81, and the end of the sensor unit 9 corresponds to the Z-direction position where the sensor element 2 is provided.

[0092] (Function and Effect)

[0093] According to the sensor unit 9, the through hole 32H is provided in the portion where the resin molded part 4 is molded. With this structure, the resin molded part 4 is molded through the through hole 32H. By molding in this way, the fixation of the resin molded part 4 to the pair of conductive components 3 can be strengthened. Therefore, in the sensor unit 9, it is possible to suppress the resin molded part 4 from falling off from the pair of conductive components 3.

[0094] According to the sensor unit 9, the bent portion 321 and the through hole 32H are provided at the portion where the resin molded portion 4 is molded. With these structures, the resin molded portion 4 can be formed in a manner hooked on the bent portion 321 at the portion where the resin molded portion 4 is molded through the through hole 32H. With such a bent portion 321, the fixation of the resin molded portion 4 to the pair of conductive members 3 can be strengthened. Therefore, the sensor unit 9 can suppress the resin molded portion 4 from falling off from the pair of conductive members 3.

[0095] According to the sensor unit 9, the through hole 32H is provided in the portion where the second molded portion 42 is molded. According to this structure, the second molded portion 42 is molded through the through hole 32H, so that the fixation of the second molded portion 42 to the pair of conductive members 3 can be strengthened. Due to this reinforcement, the sensor unit 9 can suppress the second molded portion 42 from falling off relative to the first molded portion 41 regardless of the shape of the joint between the first molded portion 41 and the second molded portion 42. Therefore, compared with a structure in which a complex structure is provided on the first molded portion 41 to suppress the second molded portion 42 from falling off from the first molded portion 41, the shape of the first molded portion 41 can be simplified, and the sensor unit 9 can be miniaturized.

[0096] According to the sensor unit 9, by providing the protrusion 411, when the resin molded part 4 is molded, the second molded part 42 shrinks so as to contact the peripheral surface of the protrusion 411. Due to such shrinkage, the gap at the interface between the first molded part 41 and the second molded part 42 is reduced.

[0097] According to the sensor unit 9, the creeping distance in the bonding surface 41s is increased by providing the protrusion 411. By increasing the creeping distance in this way, the leakage current caused by electromigration can be suppressed.

[0098] As a comparative example, Fig. 9 As shown in FIG. 1 , when the joint surface is a plane, the creepage distance D2 within the joint surface is a straight line distance. Fig.10 As shown, according to the sensor unit 9 of this embodiment, the creeping distance D1 in the joint surface 41s is a distance obtained along the undulation of the protrusion 411. Due to such undulation, the creeping distance D1 in the joint surface 41s in the sensor unit 9 of this embodiment is longer than the creeping distance D2 of such a comparative example.

[0099] According to the sensor unit 9, the protrusion 411 has an elliptical shape when viewed from the Z direction. According to this shape, when the sensor unit 9 is assembled, the stress generated by the rotation torque applied to the second molded portion 42 can be borne not only by the pair of conductive members 3 but also by the protrusion 411. Due to such a structure, the stress applied to the pair of conductive members 3 can be reduced. Therefore, the strength of the sensor unit 9 is improved with respect to the stress generated when the sensor unit 9 is assembled.

[0100] In particular, the stress generated by the rotational torque of the second molded portion 42 increases because the friction generated between the resin molded portion 4 and the first sealing member 5 and between the resin molded portion 4 and the second sealing member 6 increases. Therefore, the stress applied to the pair of conductive members 3 can be reduced, which is effective in improving the strength of the sensor unit 9.

[0101] According to the sensor unit 9, the protrusion 411 has an elliptical shape when viewed from the Z direction. Compared with an angular shape, an elliptical shape is less likely to cause stress concentration on the second molded portion 42 due to rotational torque. Therefore, if the protrusion 411 has an elliptical shape, cracks are less likely to occur in the second molded portion 42.

[0102] According to the sensor unit 9, the creeping distance in the bonding surface 41s is increased by providing the groove portion 411g. By increasing the creeping distance in this way, the leakage current caused by electromigration can be suppressed.

[0103] According to the sensor unit 9, the first sealing member 5 and the second sealing member 6 sandwich the joint surface 41s and the joint surface 42s. Due to this structure, the first sealing member 5 can suppress the infiltration of the fluid from the structure 81 side to the interface between the first molded part 41 and the second molded part 42. In addition, the second sealing member 6 can suppress the infiltration of the fluid from the flange 424 side to the interface between the first molded part 41 and the second molded part 42.

[0104] According to the sensor assembly 1, when the resin molded part is molded for the sensor assembly 1, the through hole 32H is provided in the portion where the resin molded part 4 is molded. With this structure, the resin molded part 4 is molded through the through hole 32H. By molding in this way, the fixation of the resin molded part 4 to the pair of conductive components 3 can be strengthened. Therefore, the sensor assembly 1 can suppress the resin molded part 4 from falling off from the pair of conductive components 3.

[0105] (First Modification)

[0106] In this embodiment, the protrusion 411 may have any structure instead of the groove 411g or may have any structure in addition to the groove 411g. Fig.11 As shown, the protrusion 411 may also have a bulging portion 411r instead of the groove portion 411g. The bulging portion 411r bulges toward the second molded portion 42 in the Z direction. When viewed from the Z direction, the bulging portion 411r extends between a pair of conductive components 3 in the end surface 411e of the protrusion 411 in a manner that crosses the end surface 411e. If the protrusion 411 has the bulging portion 411r, the creepage distance in the bonding surface 41s can be extended.

[0107] (Second Modification)

[0108] In this embodiment, the protrusion 411 has a groove 411g. On the other hand, the protrusion 411 can be configured arbitrarily. As a second modification, Fig.12As shown, the protrusion 411 may include a sleeve portion 411v. The sleeve portion 411v rises from the end surface 411e so as to surround the periphery of each conductive member 3. If the protrusion 411 includes the sleeve portion 411v, the creepage distance in the bonding surface 41s can be extended.

[0109] (Other Modifications)

[0110] In the present embodiment, the protrusion 411 has an elliptical shape when viewed from the Z direction. On the other hand, the protrusion 411 may have any shape when viewed from the Z direction. As a modification, the protrusion 411 may have a non-circular shape such as a polygonal shape, an I shape, an S shape, a U shape, an X shape, etc. when viewed from the Z direction. If the protrusion 411 has a non-circular shape, the stress generated by the rotational torque of the second molded portion 42 can be borne by the protrusion 411 when the sensor unit 9 is assembled. As another modification, when the sensor unit 9 is assembled, the protrusion 411 may have a circular shape when viewed from the Z direction, provided that the stress generated by the rotational torque of the second molded portion 42 does not affect the strength of the sensor unit 9.

[0111] In the present embodiment, the pair of conductive members 3 is a lead frame. On the other hand, the pair of conductive members 3 may be formed of any member such as a metal plate or a metal rod as long as it has conductivity.

[0112] In the present embodiment, after the first molded portion 41 is molded by transfer molding, the second molded portion 42 is molded by injection molding. On the other hand, if the resin molded portion 4 includes the first molded portion 41 and the second molded portion 42, the resin molded portion 4 can be molded arbitrarily. As a modified example, after the first molded portion 41 is molded by injection molding, the second molded portion 42 may be molded by injection molding. As another modified example, after the first molded portion 41 is molded by transfer molding, the second molded portion 42 may be molded by transfer molding.

[0113] In the present embodiment, the resin molded portion 4 seals the base end portion 31 and the sensor element 2. On the other hand, the resin molded portion 4 may be arbitrarily configured as long as it covers the base end portion 31 and the sensor element 2. As a modified example, the resin molded portion 4 may include a hollow resin molded cover, and the hollow resin molded cover may cover the portion of the base end portion 31 connected to the sensor element 2 and the sensor element 2.

[0114] In the present embodiment, the first molded portion 41 is formed of epoxy resin. On the other hand, the first molded portion 41 can be formed of any material. For example, in the case where the sensor unit 9 measures the temperature of cooling water, the first molded portion 41 can also be formed of a water-resistant material. For example, in the case where the sensor unit 9 measures the temperature of oil, the first molded portion 41 can also be formed of an oil-resistant material. In addition, in the present embodiment, the second molded portion 42 is formed of polyamide (PA) resin or polyphenylene sulfide (PPS) resin. On the other hand, the second molded portion 42 can be formed of any material.

[0115] In the present embodiment, the resin molded portion 4 includes a first molded portion 41 and a second molded portion 42. On the other hand, the resin molded portion 4 may include only one molded portion. That is, the resin molded portion 4 may be single-color molded instead of two-color molded.

[0116] In this embodiment, the sensor element 2 is a temperature sensor. On the other hand, the sensor element 2 is not limited to a temperature sensor, and may be any sensor.

[0117] In the present embodiment, the through hole 32H is a circular hole. On the other hand, the through hole 32H may have any shape. The through hole 32H may be a circular hole, a perfect circle or an elliptical hole. On the other hand, as a modification, the through hole 32H may also be a polygonal hole. As another modification, the through hole 32H may also be a slit hole.

[0118] In the present embodiment, the remaining widths W1 and W2 are widths capable of maintaining the mechanical strength of each conductive member 3. As a modified example, the total of the remaining widths W1 and W2 may be greater than half of the width W3, thereby further maintaining the mechanical strength of each conductive member 3.

[0119] The embodiments of the present invention are described above, but these embodiments are shown as examples and are not intended to limit the scope of the present invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the present invention.

[0120] <Notes>

[0121] Below, several sensor units and sensor assemblies are mentioned. [1]

[0123] A sensor unit, comprising:

[0124] Sensor elements;

[0125] a pair of conductive members extending parallel to each other from the sensor element; and

[0126] a resin molded portion covering a portion of the pair of conductive members,

[0127] A pair of said conductive members comprises:

[0128] a base end portion connected to the sensor element;

[0129] a terminal end portion located on an opposite side of the base end portion; and

[0130] an intermediate portion, the intermediate portion being a portion between the base end portion and the terminal end portion, the intermediate portion having a through hole,

[0131] The resin molded portion covers the base end portion and the intermediate portion while exposing the terminal portion.

[0132] According to the structure of [1] above, a through hole is provided in the portion where the resin molded part is molded. With this structure, the resin molded part is molded through the through hole. Due to such molding, the fixation of the resin molded part relative to the pair of conductive components can be strengthened. Therefore, the sensor unit can suppress the resin molded part from falling off from the pair of conductive components. [2]

[0134] The sensor unit according to [1], wherein:

[0135] The intermediate portion has a bent portion for bending the pair of conductive members in directions away from each other.

[0136] The through hole is formed in the bent portion.

[0137] According to the structure of [2] above, a bent portion and a through hole are provided in the portion where the resin molded portion is molded. According to these structures, it is possible to configure a portion where the resin molded portion is molded through the through hole, and the resin molded portion is hooked on the bent portion. According to this structure, it is possible to strengthen the fixation of the resin molded portion relative to the pair of conductive components. Therefore, the sensor unit can suppress the resin molded portion from falling off from the pair of conductive components. [3]

[0139] The sensor unit according to [1] or [2], wherein:

[0140] The resin molding part includes:

[0141] a first molded portion covering the base end portion; and

[0142] A second molded portion covers the middle portion and is joined to the first molded portion.

[0143] According to the structure of [3] above, a through hole is provided in the portion where the second molded part is molded. According to this structure, the second molded part is molded through the through hole, so that the fixation of the second molded part relative to the pair of conductive parts can be strengthened. Due to this reinforcement, the sensor unit can suppress the second molded part from falling off relative to the first molded part regardless of the shape of the joint between the first molded part and the second molded part. Therefore, the shape of the first molded part can be simplified, and the sensor unit can be miniaturized. [4]

[0145] The sensor unit according to [3], wherein:

[0146] The first molded part has a protrusion protruding toward the second molded part on a joint surface with the second molded part,

[0147] The pair of conductive members is arranged so as to penetrate the protrusion.

[0148] According to the configuration of [4], by providing the protrusion, the second molded part shrinks in contact with the peripheral surface of the protrusion when the resin molded part is molded. Therefore, the gap at the interface between the first molded part and the second molded part is reduced.

[0149] In addition to the above effects, or in place of the above effects, according to the structure of [4], the protrusion is provided to lengthen the creeping distance within the bonding surface. By lengthening the creeping distance in this way, leakage current caused by migration can be suppressed. [5]

[0151] The sensor unit according to [4], wherein:

[0152] When viewed from a joining direction of the first molded portion and the second molded portion, the protrusion has a non-circular shape.

[0153] According to the structure of [5] above, when assembling the sensor unit, the stress generated by the rotational torque of the second molded portion can be borne not only by the pair of conductive parts but also by the protrusion. Due to such a structure, the stress applied to the pair of conductive parts can be reduced. Therefore, the strength of the sensor unit is improved with respect to the stress generated when assembling the sensor unit. [6]

[0155] The sensor unit according to [4] or [5], wherein:

[0156] When viewed from the joining direction of the first molded portion and the second molded portion, the protrusion has a groove portion or a bulging portion extending across the end surface between the pair of conductive members at the end surface of the protrusion.

[0157] According to the structure of [6] above, the creeping distance in the bonding surface is lengthened by providing the groove or the bulge. By lengthening the creeping distance in this way, leakage current caused by electromigration can be suppressed. [7]

[0159] A sensor assembly, characterized by comprising:

[0160] sensor element; and

[0161] a pair of conductive members, the pair of conductive members extending parallel to each other from the sensor element,

[0162] A pair of said conductive members comprises:

[0163] a base end portion connected to the sensor element;

[0164] a terminal end portion located on an opposite side of the base end portion; and

[0165] The middle portion is a portion between the base end portion and the terminal end portion, and has a through hole.

[0166] According to the structure of [7] above, when molding the resin molded part of the sensor assembly, a through hole is provided in the portion for molding the resin molded part. With such a structure, the resin molded part is molded through the through hole. Due to such molding, the fixation of the resin molded part relative to the pair of conductive components can be strengthened. Therefore, the sensor assembly can suppress the resin molded part from falling off from the pair of conductive components of the sensor assembly.

[0167] [Industrial Availability]

[0168] According to the sensor unit or the sensor assembly of the present invention, it is possible to suppress the resin molded portion from coming off from the pair of conductive members of the sensor assembly.

Claims

1. A sensor unit, characterized in that: have: Sensor elements; a pair of conductive members extending parallel to each other from the sensor element; as well as a resin molded portion covering a portion of the pair of conductive members, A pair of said conductive members comprises: a base end portion connected to the sensor element; a terminal end portion located on an opposite side of the base end portion; and an intermediate portion, the intermediate portion being a portion between the base end portion and the terminal end portion, the intermediate portion having a through hole, The resin molded portion covers the base end portion and the intermediate portion while exposing the terminal portion.

2. The sensor unit according to claim 1, characterized in that The intermediate portion has a bent portion for bending the pair of conductive members in directions away from each other. The through hole is formed in the bent portion.

3. The sensor unit according to claim 1 or 2, characterized in that: The resin molding part includes: a first molded portion covering the base end portion; and A second molded portion covers the middle portion and is joined to the first molded portion.

4. The sensor unit according to claim 3, characterized in that The first molded part has a protrusion protruding toward the second molded part on a joint surface with the second molded part, The pair of conductive members is arranged so as to penetrate the protrusion.

5. The sensor unit according to claim 4, characterized in that When viewed from a joining direction of the first molded portion and the second molded portion, the protrusion has a non-circular shape.

6. The sensor unit according to claim 4, characterized in that When viewed from the joining direction of the first molded portion and the second molded portion, the protrusion has a groove portion or a bulging portion extending across the end surface between the pair of conductive members at the end surface of the protrusion.

7. A sensor assembly, characterized in that: have: Sensor elements; as well as a pair of conductive members, the pair of conductive members extending parallel to each other from the sensor element, A pair of said conductive members comprises: a base end portion connected to the sensor element; a terminal end portion located on an opposite side of the base end portion; and The middle portion is a portion between the base end portion and the terminal end portion, and has a through hole.

Citation Information

Patent Citations

  • Thermally isolated temperature sensor

    EP2485023A2